Circuit board assembly and processing technology thereof

Abstract

The invention relates to a circuit board assembly and a processing technology thereof. The circuit board assembly comprises one or more stacked circuit boards, and the processing technology comprises the steps that board bodies with the number equal to that of the circuit boards included in the circuit board assembly are obtained, each board body is provided with a plurality of bonding pads, and each bonding pad is conducted with an internal circuit of the board body; mounting a metal piece on a preset bonding pad in the plurality of bonding pads of the at least one target board body, and placing the metal piece in a curing oven for curing; and obtaining the circuit board assembly based on the cured target board body.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a circuit board assembly and a processing technology thereof. Background Art

[0002] Conventional circuit boards typically have internal wiring arranged on their surface. Pads are placed on the board's surface to connect to these internal wiring. These pads are soldered to the pins of electronic components, establishing electrical connectivity between the components and the circuit board's internal wiring. Some of these surface pads also serve as test contacts, which contact probes in the Z direction of the board to perform functional testing. Summary of the Invention

[0003] The present disclosure provides a circuit board assembly and a processing technology thereof to address the deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a process for processing a circuit board assembly is provided, wherein the circuit board assembly includes one or more stacked circuit boards, and the process includes:

[0005] Obtaining a number of boards equal to the number of circuit boards included in the circuit board assembly, each board being provided with a plurality of solder pads, each solder pad being electrically connected to an internal circuit of the board;

[0006] Mounting a metal part on a predetermined pad among a plurality of pads on at least one target board, and placing the metal part in a curing oven for curing;

[0007] The circuit board assembly is obtained based on the solidified target board body.

[0008] Optionally, the step of attaching the metal part to a predetermined pad among a plurality of pads on the target board and placing the metal part in a curing furnace for curing includes:

[0009] The metal component is mounted on a preset pad on the first surface of the target board, and is placed in a curing furnace for curing.

[0010] Optionally, the step of attaching the metal part to a predetermined pad among a plurality of pads on the target board and placing the metal part in a curing furnace for curing further comprises:

[0011] A metal component is mounted on the preset pad on the second surface of the solidified target board, and the board is placed in a curing oven for further curing.

[0012] Optionally, also include:

[0013] Dispensing glue between the preset pad of the solidified target board and the metal part;

[0014] Place the target board after dispensing glue in a curing oven for curing.

[0015] Optionally, the circuit board assembly includes a plurality of stacked circuit boards;

[0016] The method of obtaining the circuit board assembly based on the solidified target board body includes:

[0017] Based on the solidified target board, mounting a first board on one side of the target board, wherein a preset soldering pad of the first board is connected and conductively connected to the metal member;

[0018] The second board is mounted on the side of the first board facing away from the target board to obtain the circuit board assembly.

[0019] Optionally, mounting a second board on a side of the first board facing away from the target board to obtain the circuit board assembly includes:

[0020] Mounting a metal part on a predetermined pad among a plurality of pads on a side of the first board facing away from the target board, and placing the metal part in a curing furnace for curing;

[0021] A second board is mounted on the side of the solidified first board facing away from the target board, and a preset soldering pad of the second board is connected and conducted with the metal member to obtain the circuit board assembly.

[0022] Optionally, mounting a second board on a side of the first board facing away from the target board to obtain the circuit board assembly includes:

[0023] Prefabricating a tin dielectric on a portion of the pads on a side of the first board facing away from the target board;

[0024] The second board is mounted, and some pads of the second board are soldered to some pads of the first board in a one-to-one correspondence through a tin medium.

[0025] Optionally, the circuit board assembly includes a plurality of stacked circuit boards;

[0026] The method of obtaining the circuit board assembly based on the solidified target board body includes:

[0027] Mounting a third board on the first side of the target board, wherein the preset pads of the third board are connected and conductively connected to the metal member provided on the first side;

[0028] A fourth board is mounted on the second side of the target board, and the preset soldering pads of the fourth board are connected and conductively connected to the metal member provided on the second side to obtain the circuit board assembly. Alternatively, a fourth board is mounted on the second side of the target board, and some soldering pads of the fourth board are soldered one-to-one with some soldering pads on the second side of the target board through a tin medium.

[0029] Optionally, the target board includes a first target board and a second target board; the circuit board assembly includes a plurality of stacked circuit boards;

[0030] The method of obtaining the circuit board assembly based on the solidified target board body includes:

[0031] Mounting a fifth board on the first side of the first target board, wherein the preset pad of the fifth board is connected to the metal member provided on the first side of the first target board;

[0032] The second target board is mounted on the second side of the first target board, and the metal piece of the second target board facing the first target board is connected to the preset pad on the second side of the first target board.

[0033] Optionally, the circuit board assembly includes a plurality of stacked circuit boards;

[0034] The method of obtaining the circuit board assembly based on the solidified target board body includes:

[0035] Mounting a fifth board on the first side of the target board, wherein the preset pad of the fifth board is connected to the metal member provided on the first side of the target board;

[0036] Mounting a sixth board, the fifth board is located between the sixth board and the target board, and some pads of the sixth board are welded to some pads of the fifth board in a one-to-one correspondence through a tin medium; or, the target board is located between the fifth board and the sixth board, and some pads of the sixth board are welded to some pads of the target board in a one-to-one correspondence through a tin medium.

[0037] Optionally, the circuit board assembly includes a plurality of stacked circuit boards;

[0038] The areas of the plurality of circuit boards are the same or different.

[0039] Optionally, the processing technology further includes:

[0040] At least one board, before being mounted with other boards, also includes:

[0041] Mount electronic components on the corresponding pads of the board and place them in a curing oven for curing;

[0042] Glue is applied between the target electronic device of the cured board and the board.

[0043] According to a second aspect of an embodiment of the present disclosure, there is provided a circuit board assembly, comprising:

[0044] At least one board, each of the boards comprising a plurality of pads disposed on a surface thereof, each of the pads being electrically connected to an internal circuit of the board;

[0045] At least one metal piece, each of the metal pieces is electrically connected to at least one pad of any one board.

[0046] According to a third aspect of an embodiment of the present disclosure, there is provided a circuit board assembly, which is manufactured using the processing technology described in any one of the above embodiments.

[0047] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0048] It can be seen from the above embodiments that in the present disclosure, metal parts are mounted on the surface of the board through this processing technology. Based on the conductive properties of the metal parts, they can be used as circuit routing to replace part of the internal routing of the board, simplifying the internal routing of the board and simplifying the process; at the same time, the setting of the metal parts can make it a test point for functional testing of the circuit board, replacing the conventional test pads that are basically flat. By adjusting the height of the metal parts, it is possible to realize touch testing in the thickness direction of the circuit board and point-out testing perpendicular to the thickness direction of the circuit board, enriching the test path and test method.

[0049] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0051] Figure 1 The figure is a flowchart of a processing process of a circuit board assembly according to an exemplary embodiment.

[0052] Figure 2 The diagram is one of a partial process flow chart of a circuit board assembly according to an exemplary embodiment.

[0053] Figure 3 The figure shows a processing state of a circuit board according to an exemplary embodiment.

[0054] Figure 4 is a diagram showing a processing state of another circuit board according to an exemplary embodiment.

[0055] Figure 5 This is a second partial processing flow chart of a circuit board assembly according to an exemplary embodiment.

[0056] Figure 6The figure is one of the processing state diagrams of a circuit board assembly according to an exemplary embodiment.

[0057] Figure 7 This is a second diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0058] Figure 8 This is a third partial process flow chart of a circuit board assembly according to an exemplary embodiment.

[0059] Figure 9 This is a third diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0060] Figure 10 This is a fourth partial processing flow chart of a circuit board assembly according to an exemplary embodiment.

[0061] Figure 11 This is a fourth diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0062] Figure 12 This is a fifth partial process flow chart of a circuit board assembly according to an exemplary embodiment.

[0063] Figure 13 This is a fourth diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0064] Figure 14 The figure is a schematic structural diagram of a circuit board assembly according to an exemplary embodiment.

[0065] Figure 15 This is a fifth diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0066] Figure 16 This is the sixth diagram showing a processing state of a circuit board assembly according to an exemplary embodiment.

[0067] Figure 17 The figure is a schematic diagram of a circuit board according to an exemplary embodiment.

[0068] Figure 18 is a schematic diagram of another circuit board according to an exemplary embodiment.

[0069] Figure 19 is a schematic diagram of yet another circuit board according to an exemplary embodiment.

[0070] Figure 20 is a schematic diagram of yet another circuit board according to an exemplary embodiment.

[0071] Figure 21 The figure is a schematic structural circuit diagram of a circuit board according to an exemplary embodiment.

[0072] Figure 22 The figure is a schematic structural circuit diagram of another circuit board according to an exemplary embodiment.

[0073] Figure 23 The figure is a structural circuit diagram of another circuit board according to an exemplary embodiment.

[0074] Figure 24 is a schematic cross-sectional view of a composite circuit board according to an exemplary embodiment. DETAILED DESCRIPTION

[0075] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0076] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0077] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0078] Figure 1 The flowchart of a processing method for a circuit board assembly according to an exemplary embodiment is shown. The circuit board assembly may include one or more circuit boards. The processing method includes:

[0079] In step 101, a number of boards equal to the number of circuit boards included in the circuit board assembly is obtained, each board is provided with a plurality of pads, and each pad is connected to an internal circuit of the corresponding board.

[0080] In this embodiment, when the circuit board assembly includes a single circuit board, a single board body can be obtained, and when the circuit board assembly includes multiple circuit boards, multiple board bodies can be obtained. The formation of the internal circuit of the board body can be made according to a pre-designed circuit. For example, a substrate can be cut according to the target size of the circuit board, and then the copper surface of the substrate is cleaned and micro-etched to obtain good adhesion; further, the wiring circuit of the inner layer of the substrate is formed by exposure, development and etching. The wiring circuit can also be blackened to prevent oxidation and increase the surface roughness. After obtaining multiple substrates with wiring circuits based on the above method, they can be pressed together to obtain a circuit board.

[0081] In step 102 , a metal component is mounted on a predetermined pad among a plurality of pads of at least one target board, and the board is placed in a curing furnace for curing.

[0082] In this embodiment, when the circuit board assembly includes a single circuit board, the single board can be defined as the target board; when the circuit board assembly includes multiple circuit boards, one or more of the multiple boards can be defined as the target board. Curing in a curing oven can enhance the connection strength between the metal component and the board.

[0083] The metal part may include structures such as a metal column, a metal block, a metal sheet or a metal ring. The surface flatness requirement of the metal part is relatively high, usually not less than ±0.05mm. The height of the metal column can generally be set within the range of 20-5000um, and the cross-sectional shape of the metal column includes but is not limited to a rectangle, a circle, an ellipse, and a regular polygon; the dimensions of the metal block and the metal sheet in the three directions of length, width and height are basically within the range of 10um-5000um. Multiple metal parts mounted on the same board can be set as the same metal parts, or can also be set as different metal parts, and the present disclosure does not limit this. Surface treatment processes can also be performed on the metal parts, such as the surface treatment processes including but not limited to nickel plating, tin plating and gold plating. The spacing between the metal part and the electronic device arranged on the same side of the board is greater than or equal to 0.2mm, and the height of the metal part is greater than the height of the electronic device.

[0084] In step 103 , a circuit board assembly is obtained based on the cured target board.

[0085] In this embodiment, when the circuit board assembly includes a single circuit board, the circuit board assembly can be obtained by mounting electronic components on the target board. When the circuit board assembly includes multiple circuit boards, various assembly methods can be used based on the target board, such as sequentially assembling each circuit board from top to bottom along the thickness of the circuit board assembly to obtain the circuit board assembly, or individually processing each circuit board and then assembling them to obtain the circuit board assembly.

[0086] For circuit boards that need to assemble electronic devices, the method may also include mounting electronic devices on corresponding pads of the board before assembling with other boards, and placing the board in a curing oven for curing. In the case where the board also needs to be mounted with metal parts, the board with metal parts and electronic devices mounted can be cured in the same step. Glue is applied between the target electronic device and the board after curing to increase the connection stability between the target electronic device and the board. For example, colloid can be filled between the target electronic device and the board to improve the connection stability. Optionally, the target electronic device can be wrapped with glue to improve the connection stability while protecting the target electronic device.

[0087] In some embodiments, when the circuit board assembly includes multiple stacked circuit boards, the areas of the multiple circuit boards can be the same, or the areas of the multiple circuit boards can be different, for example, the area of ​​at least one circuit board is not equal to the areas of the other circuit boards. This is beneficial for the layout of the circuit board assembly in the electronic device and adapting to the layout structure of the electronic device.

[0088] By using this processing technology, metal parts are mounted on the surface of the board. Based on the conductive properties of the metal parts, they can be used as circuit routing to replace part of the internal routing of the board, simplifying the internal routing of the board and simplifying the process. In particular, some relatively wide and high-current routing inside the board can be replaced, thereby saving the internal routing area of ​​the board and optimizing the internal routing layout. Moreover, the metal parts are arranged on the surface of the circuit board instead of the internal routing. When the circuit needs to be changed, it can be achieved by directly removing the metal parts, reducing the design cost. At the same time, the setting of the metal parts can make it a test point for the functional test of the circuit board, replacing the conventional test pads that are basically flat. By adjusting the height of the metal parts, touch testing in the thickness direction of the circuit board and point-out testing perpendicular to the thickness direction of the circuit board can be realized, enriching the test path and test method.

[0089] In the aforementioned embodiment, attaching the metal part to a predetermined pad among a plurality of pads on the target board and placing the pads in the curing path for curing may include the following steps:

[0090] In step 201 : the metal component is mounted on a predetermined pad disposed on the first surface of the target board, and is placed in a curing furnace for curing.

[0091] In this embodiment, Figure 3 As shown in a, a target board is obtained. A plurality of pads are provided on the first surface of the target board. The positions of the plurality of pads can be determined according to the actual functions and performance of the product. Figure 3 In Figure a, only the preset pads for connecting with metal parts are shown as an example. Figure 3As shown in b, the metal part is mounted on the preset pad on the first surface of the target board. After the metal part is mounted, it is placed in a curing oven for curing, thereby improving the connection stability between the metal part and the board.

[0092] In step 202 : a metal component is mounted on the preset pad on the second surface of the solidified target board, and the board is placed in a curing furnace for further curing.

[0093] In this embodiment, Figure 3 As shown in Figure c, the cured target board is flipped over so that the second surface of the target board faces upward. The second surface is provided with a plurality of pads. The positions of the plurality of pads can be determined according to the actual functions and performance of the product. Figure 3 In Figure c, only the preset pads for connecting with metal parts are shown as an example. Figure 3 As shown in d, the metal part is mounted on the preset pad on the second surface of the target board. After the metal part is mounted, it is placed in a curing oven for curing, thereby improving the connection stability between the metal part and the board.

[0094] In step 203 : glue is dispensed between the preset soldering pads of the solidified target board and the metal component.

[0095] In step 204 : the target board after the dispensing of glue is placed in a curing oven for curing.

[0096] In this embodiment, Figure 3 As shown in Figure e, glue can be dispensed between the metal part and the preset pads of the target board, specifically between the preset pads on the first surface and the metal part, and between the preset pads on the second surface and the metal part. After the glue dispensing operation is completed, the target board is placed in a curing furnace for curing, which is beneficial to improving the connection strength of the metal part. Especially when the height requirements of the metal part are very precise, the stability of the metal part can be enhanced by glue dispensing, which is beneficial to maintaining the height of the metal part unchanged and improving accuracy.

[0097] It should be noted that, in the above embodiment, the metal parts are respectively mounted on the first surface and the second surface of the target board. In other embodiments, the metal parts may be mounted only on the first surface or the second surface of the target board. Figure 4 As shown in a, you can first prepare the target plate, such as Figure 4 As shown in b, metal parts can be mounted on the first surface or the second surface and then cured; Figure 4 As shown in c, after the curing is completed, the glue dispensing operation is performed, and then the curing is performed again. Optionally, in some other embodiments, when the connection strength between the metal part and the plate body meets the requirements, the glue dispensing operation may not be performed.

[0098] When the circuit board assembly includes a single circuit board, the operations of steps 201 to 204 are one of the molding process steps for the single circuit board. On this basis, it can also include at least one surface-mounted electronic device on the first surface and the second surface. The electronic device mounted on the first surface can be completed in the same step as the metal parts mounted on the first surface, and the electronic device mounted on the second surface can be completed in the same step as the metal parts mounted on the second surface. In addition, the curing between the electronic device and the solder pad and the curing of the metal parts located on the same surface as the electronic device can be completed in the same curing process step. When the circuit board assembly includes multiple circuit boards, the operations of steps 201 to 204 can be process steps for any one or more of the multiple circuit boards.

[0099] When the circuit board assembly includes multiple circuit boards, the circuit board assembly is obtained based on the cured target board body in the above embodiment, such as Figure 5 As shown, the following steps may be included:

[0100] In step 501 , based on the solidified target board, a first board is mounted on one side of the target board, and a preset soldering pad of the first board is connected and conducted to the metal member.

[0101] In this embodiment, the target board can have metal parts mounted on one side, or can have metal parts mounted on both sides. Figure 6 As shown in a, the target plate 101 can be obtained first, and then a metal part is mounted on one side of the target plate 101 and cured to obtain the following Figure 6 The solidified target plate 101 shown in b. Figure 6 As shown in c, the first board 102 is mounted on one side of the target board 101, and the preset pads of the first board 102 are connected to the metal parts mounted on the target board 101, so that electrical conduction can be achieved between the target board 101 and the first board 102 through the metal parts.

[0102] Among them, for the target board 101 and the first board 102, optionally, it also includes mounting electronic devices on the side of the target board 101 facing away from the metal part. Optionally, it also includes mounting electronic devices on the surface of the target board 101 and the metal part on the same side. Optionally, it also includes mounting electronic devices on the surface of the first board 102 facing the target board 101. Optionally, it also includes mounting electronic devices on the surface of the first board 102 facing away from the target board 101. In the aforementioned embodiments, after any board is mounted with electronic devices, it can also be cured in a curing furnace to improve the stability of the electronic devices. In the absence of contradiction, the oven curing of the electronic devices and the oven curing of the metal parts can be completed in the same curing furnace within the same time period.

[0103] In step 502, a second board is mounted on a side of the first board facing away from the target board to obtain the circuit board assembly.

[0104] In this embodiment, based on the assembled target board 101 and the first board 102, a second board 103 can be further mounted on the side of the first board 102 facing away from the target board 101, and the second board 103 is electrically connected to the first board 102 to obtain a circuit board assembly.

[0105] There are many ways to mount the second board 103. In some embodiments, Figure 6 As shown in FIG. d, a metal part is mounted on a preset pad among a plurality of pads on the side of the first plate 102 facing away from the target plate, and is placed in a curing furnace for curing; Figure 6 As shown in FIG. 5 , the second board 103 is mounted on the side of the first board 102 after solidification away from the target board 101, and the preset pads of the second board 103 are connected to the metal parts to obtain a circuit board assembly. Figure 6 In f, electronic components are mounted on the surface of the second board 103 away from the first board 101. Optionally, electronic components are also mounted on the surface of the second board 103 toward the first board 101. In the aforementioned embodiment, after the electronic components are mounted on the second board 103, they can be cured in a curing oven to improve the stability of the electronic components. In the case where metal parts need to be mounted on the second board 102, the oven curing of the electronic components and the oven curing of the metal parts can be completed in the same curing oven within the same time period. The electronic components may include resistors, capacitors, filters, connectors, etc.

[0106] In other embodiments, Figure 7 As shown in a, obtain the target board 101, and then apply solder paste to the pad on one side of the target board 101 to obtain the following Figure 7 The target plate 102 shown in b. Figure 7 As shown in Figure c, electronic components are mounted on one side of the target board 101. Figure 7 As shown in d, the target board 101 is turned over and a metal piece is mounted on the preset pad of the target board 101. Optionally, an electronic device can also be mounted on the target board 101. The electronic device and the metal piece are located on the same side of the target board 101. Figure 7 As shown in Figure e, the first board 102 is mounted on one side of the target board 101, and the preset pads of the first board 102 are connected to the metal parts mounted on the target board 101, so that electrical conduction between the target board 101 and the first board 102 can be achieved through the metal parts. Figure 7As shown in Figure f, a tin dielectric is pre-formed on some of the pads on the side of the first board 102 facing away from the target board 101. A second board 103 is then mounted, and some of the pads on the second board 103 are soldered to some of the pads on the first board 102 in a one-to-one correspondence via the tin dielectric. Optionally, this also includes mounting electronic components on the surface of the first board 102 facing the target board 101. Optionally, this also includes mounting electronic components on the surface of the first board 102 facing away from the target board 101. In the aforementioned embodiments, after mounting the electronic components on any board, curing can be performed in a curing oven to improve the stability of the electronic components. Where not incompatible, curing of the electronic components and curing of the metal components can be completed in the same curing oven within the same timeframe. The tin dielectric can be formed by pre-placed solder balls on the corresponding pads, or by applying the tin dielectric to the pads through a tinning process. For pre-set pads connected to the metal component, the outer dimensions of the pre-set pads are generally larger than the diameter or outer dimensions of the metal component to ensure good side tin creep. The thickness of the tin medium is generally at least 0.08mm. When the metal parts or electronic devices to be soldered are extremely precise components, the thickness of the tin medium needs to be within the range of 0.03mm-0.06mm. The printed solder paste should be at least No. 5 powder solder paste to ensure a relatively fine particle diameter for printing and molding. The tin medium can be a mixture of at least two of the solder pastes for high-temperature range, low-temperature range, and medium-temperature range, so as to be used for multiple furnace passes. The tin balls mainly play a connecting role and can pass a large current. The composition of the tin balls can include but is not limited to alloy materials such as SnAg, SnAgCu, SnCu, SnBi, and SnZn.

[0107] It should be noted that, in the aforementioned embodiment, the target plate 101 and the first plate 102 are electrically connected via metal parts, and the first plate 102 and the second plate 103 are welded via tin as an example. In other embodiments, the target plate 101 and the first plate 102 may be welded via tin as an example, and the first plate 102 and the second plate 103 may be electrically connected via metal parts.

[0108] When the circuit board assembly includes multiple circuit boards, in other embodiments, the circuit board assembly is obtained based on the cured target board in the above embodiments, such as Figure 8 As shown, the following steps may be included:

[0109] In step 801, a third board is mounted on the first side of the target board, and a preset pad of the third board is connected to the metal member disposed on the first side.

[0110] In step 802, a fourth board is mounted on the second side of the target board, and the preset pads of the fourth board are connected and conducted to the metal member provided on the second side to obtain the circuit board assembly.

[0111] In this embodiment, Figure 9 As shown in Figures a-9 and d, a third board 104, a fourth board 105, and a target board 101 with metal components mounted on both sides can be pre-assembled. The third board 104 is then mounted on the first side of the target board 101, and the predetermined solder pads on the third board are connected and electrically connected to the metal components disposed on the first side. The fourth board 105 is mounted on the second side of the target board 101, and the predetermined solder pads on the fourth board are connected and electrically connected to the metal components disposed on the second side, thereby obtaining the circuit board assembly. The second side is disposed opposite the first side.

[0112] For example, Figure 9 As shown in a-9d, the third plate 104 can be obtained first, and then solder paste is pre-made on one side of the third plate 104, and then electronic components are mounted; then solder paste is pre-made on the other side of the third plate 104, and electronic components are mounted, to obtain the following Figure 9 The third plate 104 to be assembled is shown in FIG. Figure 9 As shown in FIG. e-9 and FIG. g, first obtain the fourth plate 105, and mount components on one side or two opposite sides of the fourth plate 105 to obtain the following Figure 9 The fourth plate 105 to be assembled is shown in FIG. Figure 9 As shown in h-9 and j, a target plate 101 with metal parts mounted on both sides is obtained. This process can be achieved by Figure 2 The method of the embodiment shown is implemented, and then the electronic devices on both sides of the target plate 101 are respectively obtained. Figure 9 The target plate 101 to be assembled is shown in FIG. Figure 9 As shown in Figure k, the third board 104 to be assembled is mounted below the target board 101, and the preset pads of the third board 104 are connected and conducted with the metal parts of the target board 101. The fourth board 105 to be assembled is mounted above the target board 101, and the preset pads of the fourth board 105 are connected and conducted with the metal parts of the target board 101, and the result is as shown in Figure k. Figure 9 The circuit board assembly shown in k.

[0113] Of course, in other embodiments, the third board 104 to be assembled may be mounted on top of the target board 101 , and the fourth board 105 to be assembled may be mounted on top of the target board 101 . The specific arrangement may be as needed, and the present disclosure does not limit this.

[0114] In some other embodiments, the target board 101 can also be a single-sided pre-formed metal part, and then a third board 104 to be assembled and a fourth board 105 to be assembled are obtained. Subsequently, the third board 104 can be mounted on the first side of the target board 101, and the preset soldering pads of the third board 104 are connected and conductive with the metal part provided on the first side; then the fourth board 105 is mounted on the second side of the target board 101, and some soldering pads of the fourth board 105 are soldered one-to-one with some soldering pads on the second side of the target board 101 through a tin medium.

[0115] When the circuit board assembly includes multiple circuit boards, in other embodiments, the target board may include a first target board and a second target board. In the above embodiments, the circuit board assembly is obtained based on the cured target board, such as Figure 10 As shown, the following steps may be included:

[0116] In step 1001 , a fifth board is mounted on a first side of a first target board, and a preset pad of the fifth board is connected to a metal member disposed on the first side of the first target board.

[0117] In step 1002 , the second target board is mounted on the second side of the first target board, and the metal component of the second target board facing the first target board is connected to the preset pad on the second side of the first target board.

[0118] In this embodiment, for three of the multiple circuit boards included in the circuit board assembly, a fifth board can be mounted on the first side of the first target board, and the predetermined soldering pads of the fifth board can be connected and electrically connected to the metal member provided on the first side of the first target board. A second target board can be mounted on the second side of the first target board, and the metal member of the second target board facing the first target board can be connected to the predetermined soldering pads on the second side of the first target board.

[0119] For example, Figure 11 As shown, Figure 11 As shown in a-d in 11, a second target board is obtained, electronic components are mounted on one side of the second target board, and metal parts and electronic components are mounted on the other side of the second target board to obtain the following Figure 11 The second target plate to be assembled is shown in d. Figure 11 As shown in Figure e-11 and Figure h, a first target board is obtained, electronic components are mounted on the second side of the first target board, and metal parts and electronic components are mounted on the first side of the first target board to obtain the following Figure 11 Then, a fifth board is mounted on the side of the first target board where the metal piece is located. The preset pads of the fifth board are connected to the metal piece located on the first side of the first target board. Further, electronic components can be mounted on the fifth board to obtain the following result: Figure 11The plate composite structure shown in h. Figure 11 The second target plate to be assembled shown in d and Figure 11 The board composite structure shown in h in the figure is configured such that the second target board to be assembled is mounted on the board composite structure, and the metal part of the second target board facing the side of the first target board is connected to the preset pad on the second side of the first target board, and the first target board is located between the second target board and the fifth board.

[0120] When the circuit board assembly includes multiple circuit boards, in other embodiments, obtaining the circuit board assembly based on the cured target board in the aforementioned embodiment may include the following steps:

[0121] In step 1201 , a fifth board is mounted on the first side of the target board, and the preset pads of the fifth board are connected and conductively connected to the metal member disposed on the first side of the target board.

[0122] In step 1202 , a sixth board is mounted, the target board is located between the sixth board and the fifth board, and some pads of the sixth board are soldered to some pads of the target board in a one-to-one correspondence via a tin medium.

[0123] In this embodiment, the target board 101 and the fifth board can be pre-assembled, and then the sixth board can be mounted by spot soldering. The target board 101 is located between the fifth and sixth boards, and some pads of the sixth board and some pads of the target board are soldered one-to-one with each other through the tin medium. Figure 13 As shown, Figure 13 As shown in a-13d, first obtain the fifth plate and the target plate 101 respectively. A metal piece is provided on one side of the target plate 101. The fifth plate and the target plate 101 can be mounted with electronic devices, such as Figure 13 As shown in Figure c, the fifth board is mounted on the target board 101, and the metal parts of the target board 101 are connected to the preset pads of the fifth board. Figure 13 Zhonge- Figure 13 As shown in g, first obtain the sixth board, and then mount electronic components on the sixth board to obtain Figure 13 The sixth plate to be assembled is shown in FIG. Figure 13 As shown in FIG. 1 , the sixth board is assembled with the target board 101 , and some pads of the sixth board and some pads of the target board are soldered using a tin medium.

[0124] In other embodiments, a sixth board may be mounted so that the fifth board is located between the sixth board and the target board 101 , and some pads of the sixth board are soldered to some pads of the fifth board in a one-to-one correspondence via tin medium.

[0125] In the above embodiments, when the circuit board assembly includes multiple circuit boards, such as Figure 6 、 Figure 7 、 Figure 9 and Figure 11 In the embodiment shown, the areas of the multiple circuit boards are equal. In other embodiments, such as Figure 13 As shown, the areas of the multiple circuit boards may be unequal to form a circuit board assembly with a boss structure. Figure 13 In the embodiment shown, Figure 12 The process shown is used to illustrate the processing of a circuit board component with a boss structure. In fact, any of the above-mentioned processing techniques can process a circuit board component with a boss structure, and will not be described in detail here. Figure 14 As shown, for a circuit board assembly with a boss structure, one or more bosses can be arranged on the same circuit board, and the specific design is based on the needs.

[0126] With respect to any of the aforementioned embodiments, the processing may further include attaching electronic components to corresponding pads on at least one board before mounting it to other boards, curing the board in a curing oven, and then applying glue to connect the target electronic components to the board after curing. The glue connection may be fill glue or wrap glue, and the specific design can be customized.

[0127] For example, Figure 15 As shown, Figure 15 As shown in a-15 and e, a first target plate can be obtained first. A metal piece is provided on one side of the first target plate, and electronic devices are mounted on both sides of the first target plate. The target electronic device on the same side as the metal piece is wrapped with glue to obtain Figure 15 The structure to be assembled is shown in e; Figure 15 As shown in FIG. 15 and FIG. 15 , a second target plate is obtained, a metal part and an electrical device are provided on one side of the second target plate, and the target device on the same side as the metal part is wrapped with glue; then a circuit board is mounted on the second target plate to obtain Figure 15 The structure to be assembled is shown in the middle i; Figure 15 As shown in j, Figure 15 The structure to be assembled shown in e is Figure 15 The assembly structure shown in FIG. 1 is assembled so that the preset pad of the second target plate is connected and conducted with the metal part of the first target plate, and the second target plate is located between the first target plate and the circuit board. Figure 15 The circuit board assembly shown in FIG. Figure 16 As shown, the dispensing process can be combined with multiple embodiments of circuit boards with unequal areas. The dispensing process can be combined with any of the aforementioned processing techniques.

[0128] Based on the technical solution of the present disclosure, a circuit board assembly is also provided. The circuit board assembly can be manufactured using the processing technology described in any of the aforementioned embodiments. The circuit board assembly can include a single circuit board. Alternatively, the circuit board assembly can include multiple stacked circuit boards.

[0129] Figure 17 : is a schematic diagram of a circuit board according to an exemplary embodiment. The circuit board includes a main board body 1 and a metal part 2. The main board body 1 may include surface pads 11. Each pad 11 is connected to the internal circuit of the main board body 1. For example, Figure 17 In the embodiment, a plurality of quadrilateral pads 11 are provided on the surface of the main board body 1, and metal parts or electronic components 5 are mounted on the pads 11; Figure 17 Also shown is a circuit trace connecting the two pads 11. This circuit trace can be the internal circuit of the main board body 1, or it can be the surface circuit trace of the main board body 1. The formation of the internal circuit of the main board body 1 can be made according to a pre-designed circuit. For example, a substrate can be cut according to the target size of the circuit board, and then the copper surface of the substrate can be cleaned and micro-etched to obtain good adhesion. Further, by exposure, development and etching, the traces of the inner layer of the substrate are formed. The traces can also be blackened to prevent oxidation and increase the surface roughness. After obtaining a substrate with multiple layers of traces arranged based on the above method, it can be pressed together to obtain a circuit board.

[0130] The circuit board 1 may be provided with one or more metal parts, each of which is electrically connected to at least one pad 11 of any main board body 1. For example, Figure 17 As shown, the metal member 2 may include a fourth metal member 26, a fifth metal member 25 and a sixth metal member 26. The fourth metal member 24 and the fifth metal member 25 are arranged at the corner area of ​​the main body 1, as shown in FIG. Figure 1 As shown in FIG, the fourth metal member 24 is disposed at the upper left corner, the fifth metal member 25 is disposed at the lower left corner, and the sixth metal member 26 is disposed in the middle region of the main board body 1. Thus, when this circuit board is used as the middle board of a composite multi-layer circuit board, the fourth metal member 26, the fifth metal member 25, and the sixth metal member 26 can support other adjacent circuit boards, leaving space between adjacent layers of circuit boards and facilitating the placement of electronic components.

[0131] Moreover, the metal part 2 is arranged on the surface of the main board body 1. Based on the conductive properties of the metal part, it can be used as a circuit routing to replace part of the internal routing of the main board body 1, simplify the internal routing of the main board body 1, and simplify the process; in particular, it can replace some relatively wide and high-current routing inside the main board body 1, thereby saving the internal routing area of ​​the main board body 1 and optimizing the internal routing layout; moreover, the metal part is arranged on the surface of the circuit board instead of the internal routing, and when the circuit needs to be changed, it can be achieved by directly disassembling the metal part, thereby reducing the design cost; at the same time, the setting of the metal part 2 can make it a test point for the functional test of the circuit board, replacing the conventional test pad that is basically flat. By adjusting the height of the metal part 2, it is possible to implement a touch test in the thickness direction of the circuit board and a point test perpendicular to the thickness direction of the circuit board, enriching the test path and test method.

[0132] Among them, the metal part 2 can be a metal column, a metal block or a metal sheet. For example, the metal column can be a copper column, the metal block can be a copper block, and the metal sheet can be a copper sheet. Optionally, the metal part 2 also includes but is not limited to copper alloys, magnesium and magnesium alloys, aluminum and aluminum alloys, etc. The surface flatness requirements for the metal part 2 are relatively high, usually not less than ±0.05mm. The height of the metal column can generally be set in the range of 20-5000um, and the cross-sectional shape of the metal column includes but is not limited to rectangle, circle, ellipse, and regular polygon; the dimensions of the metal block and metal sheet in the three directions of length, width and height are basically in the range of 10um-5000um. Multiple metal parts 2 of the same circuit board can be set as the same metal parts, or can also be set as different metal parts, and the present disclosure does not limit this. Among them, the metal parts can also be subjected to surface treatment processes. For example, the surface treatment process includes but is not limited to nickel plating, tin plating and gold plating and other plating processes.

[0133] On the same side surface of the main board body 1, each electronic device 3 can be electrically connected to one or more pads respectively without causing a short circuit, and the spacing between the electronic device 3 and each metal part 2 is greater than or equal to 2 mm to avoid interference between the metal part 2 and the electronic device 3, and is conducive to avoiding accidental conduction between the metal part 2 and the electronic device 3.

[0134] For example, when the circuit board is used as one of the middle boards of a composite circuit board, since the middle board needs to be stacked with the adjacent boards, a metal piece can be used to support it. In some embodiments, when the area of ​​the circuit board is relatively small, a metal piece can be placed in each of the two corner areas of the main board 1, and a metal piece can be placed in the middle area of ​​the main board 1, such as Figure 1The arrangement of the fourth metal member 24, the fifth metal member 25 and the sixth metal member 26 in the embodiment shown; for example, in the case where the area of ​​the circuit board is medium, Figure 18 As shown, four metal parts can be provided on the main body 1 to play a supporting role, such as Figure 18 In the embodiment shown, the metal member 2 includes a fourth metal member 24, a fifth metal member 25, a sixth metal member 26 and a seventh metal member 27. The fourth metal member 24, the fifth metal member 25, the sixth metal member 26 and the seventh metal member 27 can be mounted on the four corner areas of the main board body 1 respectively; for example, when the circuit board area is larger, such as Figure 19 As shown, five metal parts can be provided on the main body 1 to play a supporting role, such as Figure 19 In the illustrated embodiment, the metal part 2 includes a fourth metal part 24, a fifth metal part 25, a sixth metal part 26, a seventh metal part 27 and an eighth metal part 28. The fourth metal part 24, the fifth metal part 25, the sixth metal part 26 and the seventh metal part 27 can be mounted on the four corner areas of the main board body 1, and the seventh metal part 27 is mounted on the middle area of ​​the main board body 1.

[0135] In other words, when the circuit board serves as the middle board, at least one metal part 2 is arranged in the corner area of ​​the main board body 1 to support the edge position of the circuit board; further, when the area is relatively large, at least one metal part 2 can also be arranged in the middle area of ​​the main board body 1 to ensure that a relatively good spacing can be maintained between adjacent circuit boards to avoid collapse or depression.

[0136] It is understood that the metal material of the metal piece can play a signal shielding role through reasonable adjustment. Therefore, in some examples, multiple metal pieces can be arranged at intervals along the same direction. Figure 19 As shown, the metal member 2 may further include a tenth metal member 210 and a ninth metal member 29. The eighth metal member 28, the tenth metal member 210 and the ninth metal member 29 are substantially along the Figure 19 The eighth metal member 28, the tenth metal member 210 and the ninth metal member 29 are arranged at intervals in the upper and lower directions, so that a shielding strip can be basically formed by the eighth metal member 28, the tenth metal member 210 and the ninth metal member 29, which can shield the signals on both sides to prevent the signal on one side from affecting the signal of the electronic device on the other side.

[0137] Optionally, in some cases where shielding scenarios require higher requirements, such as Figure 20 As shown, the metal member 2 may include a strip metal member 211, which may be connected to one or more pads, respectively. The strip metal member 211 may be used to isolate the signals on both sides of the strip metal member 211, thereby providing a shielding effect. Of course, the strip metal member 211 may also function as a conductive element to connect to other electronic devices while providing a shielding effect.

[0138] In each of the above embodiments, it is possible to simultaneously arrange electronic components 3 and metal components 2 on the same surface of the circuit board. In some embodiments, there may be no electrical connection between the metal components 2 and the electronic components 3; in other embodiments, some metal components 2 may be electrically connected to the electronic components 3, while others may not; in still other embodiments, all metal components 2 may be electrically connected to the electronic components 3. The specific design can be tailored to the needs and is not limited by the present disclosure.

[0139] There are many possible forms of electrical connection between the metal part 2 and the electronic device 3. In some embodiments, Figure 21 As shown, the metal part 2 includes a first metal part 21, and the electronic device 3 may include a chip 31 and at least one functional device. The chip 31 includes a first port 311. The first port 311 can be welded to a pad of the main board body 1, and the first port 311 and the first metal part 21 can be electrically connected through the internal circuit of the main board body 1 and the corresponding pad. The first metal part 21 is also electrically connected to one or more functional devices. Based on this, the functional device and the first port can be connected through the first metal part 21 to achieve signal interaction between the first port 311 and the functional device. In particular, when a high-current trace is required between the first port 311 and the functional device, the internal circuit of the main board body 1 can be greatly simplified. The electrical connection between the functional device and the first metal part 21 can be achieved through the internal circuit of the main board body 1 and the corresponding pad, or can be achieved through the trace on the surface of the main board body 1 and the corresponding pad, or can be achieved through a wire. This is not limited in the present disclosure.

[0140] Furthermore, the first metal member 21 is electrically connected to a single pad and a single first port 311, and the single pad is electrically connected to multiple functional devices through the internal circuit of the main board body 1. For example, Figure 21 In the illustrated embodiment, the functional device may include a memory and a transmission component, both of which are connected to the first metal part 21. The first metal part 21 is connected to the first port 311 through a single solder pad and the internal circuit of the main board body 1, so that the current output from the first port 311 can be diverted at the first metal part 21.

[0141] In other cases, such as Figure 22 As shown, the first metal part 21 is electrically connected to multiple pads, and the multiple pads, multiple functional devices and multiple first ports are electrically connected one by one, so that parallel connection between multiple functional devices can be achieved through the first metal part 21. For example, parallel connection between a memory and a transmission component can be achieved through the first metal part 21.

[0142] In some other embodiments, Figure 21 and Figure 22 As shown, the metal part 2 includes a second metal part 22, and the chip 31 includes a second port 312. The second port 312 is electrically connected to the second metal part 22 through the internal circuit of the board and the corresponding pad. The pad connected to the second metal part 22 is grounded, and the second metal part 22 can be used as a test contact of the circuit board. In this way, the second metal part 22 can be used as a common interface for grounding the chip 31 and testing the circuit board, which is conducive to simplifying the circuit and improving reliability. Of course, in other cases, a separate second metal part 22 can also be used to achieve grounding, and a separate second metal part 22 can be used as a test contact.

[0143] In other embodiments, Figure 23 As shown, the metal member 2 further includes a third metal member 23, and the chip 31 further includes input and output ports, which can be electrically connected through the internal circuit of the main board body 1 and corresponding pads. For example, the chip 31 can include multiple input and output ports, which can be electrically connected to the same third metal member 23 and then connected to other circuit boards or devices through the third metal member 23. For another example, the chip 31 can also include a single input and output port, which can be electrically connected to the third metal member 23 and then connected to other circuit boards or devices through the third metal member 23.

[0144] Furthermore, the pad connected to the third metal member 23 can be grounded, and the third metal member 23 can be used as a test contact of the circuit board, thereby realizing the common interface of testing, grounding and input and output, which is conducive to simplifying the circuit.

[0145] Based on the technical solution disclosed in this disclosure, Figure 24 A composite circuit board is also provided. The composite circuit board may include multiple layers of stacked circuit boards, with at least one of the multiple circuit boards being the circuit board described in any of the aforementioned examples. The multiple circuit boards included in the composite circuit board may have the same area, or the multiple circuit boards may have different areas, thereby facilitating compatibility with the internal layout of an electronic device equipped with the composite circuit board.

[0146] For example, Figure 24 As shown, the composite circuit board includes a stacked top plate 201, a bottom plate 202, and an intermediate plate 203, wherein the intermediate plate 203 can be arranged between the top plate 201 and the bottom plate 202; Figure 24For example, a single-layer intermediate plate 203 is provided between the top plate 201 and the bottom plate 202. In other embodiments, multiple layers of intermediate plates 203 may also be provided between the top plate 202 and the bottom plate 202, and the present disclosure is not limited thereto. At least one intermediate plate 203 is a circuit board as described in any of the aforementioned embodiments. The intermediate plate 203 may have a metal member 2 provided on one side, or may have metal members 2 provided on both sides. The metal member 2 can, on the one hand, provide electrical conduction, and on the other hand, support the circuit board adjacent to the intermediate plate 203, thereby providing support. Furthermore, the metal member 2 can form a storage space for electronic devices assembled between the intermediate plate 203 and the adjacent circuit board.

[0147] Specifically, the metal member 2 can be a metal column or a metal block, which helps to reserve more space for the electronic components on the intermediate plate 203 and adjacent circuit boards. Furthermore, the height of the metal member 2 is greater than twice the height of the electronic components installed on either of the two adjacent circuit boards. This helps to avoid interference between the electronic components and the adjacent circuit boards.

[0148] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0149] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A processing technology for a circuit board assembly, characterized in that: The circuit board assembly includes one or more stacked circuit boards, and the processing process includes: Obtaining a number of boards equal to the number of circuit boards included in the circuit board assembly, each board being provided with a plurality of solder pads, each solder pad being electrically connected to an internal circuit of the board; Mounting a metal part on a predetermined pad among a plurality of pads on at least one target board, and placing the metal part in a curing oven for curing; The circuit board assembly is obtained based on the solidified target board body.

2. The processing technology according to claim 1, characterized in that: The step of attaching the metal part to a predetermined pad among a plurality of pads on the target board and placing the metal part in a curing furnace for curing includes: The metal component is mounted on a preset pad on the first surface of the target board, and is placed in a curing furnace for curing.

3. The processing technology according to claim 2, characterized in that: The step of attaching the metal part to a preset pad among a plurality of pads on the target board and placing the metal part in a curing furnace for curing further comprises: A metal component is mounted on the preset pad on the second surface of the solidified target board, and the board is placed in a curing oven for further curing.

4. The processing technology according to claim 1, characterized in that: Also includes: Dispensing glue between the preset pad of the solidified target board and the metal part; Place the target board after dispensing glue in a curing oven for curing.

5. The processing technology according to claim 1, characterized in that: The circuit board assembly includes a plurality of stacked circuit boards; The method of obtaining the circuit board assembly based on the solidified target board body includes: Based on the solidified target board, mounting a first board on one side of the target board, wherein a preset soldering pad of the first board is connected and conductively connected to the metal member; The second board is mounted on the side of the first board facing away from the target board to obtain the circuit board assembly.

6. The processing technology according to claim 5, characterized in that: The step of mounting the second board on the side of the first board facing away from the target board to obtain the circuit board assembly comprises: Mounting a metal part on a predetermined pad among a plurality of pads on a side of the first board facing away from the target board, and placing the metal part in a curing furnace for curing; A second board is mounted on the side of the solidified first board facing away from the target board, and a preset soldering pad of the second board is connected and conducted with the metal member to obtain the circuit board assembly.

7. The processing technology according to claim 5, characterized in that: The step of mounting the second board on the side of the first board facing away from the target board to obtain the circuit board assembly comprises: Prefabricating a tin dielectric on a portion of the pads on a side of the first board facing away from the target board; The second board is mounted, and some pads of the second board are soldered to some pads of the first board in a one-to-one correspondence through a tin medium.

8. The processing technology according to claim 1, characterized in that: The circuit board assembly includes a plurality of stacked circuit boards; The method of obtaining the circuit board assembly based on the solidified target board body includes: Mounting a third board on the first side of the target board, wherein the preset pads of the third board are connected and conductively connected to the metal member provided on the first side; A fourth board is mounted on the second side of the target board, and the preset soldering pads of the fourth board are connected and conductively connected to the metal member provided on the second side to obtain the circuit board assembly. Alternatively, a fourth board is mounted on the second side of the target board, and some soldering pads of the fourth board are soldered one-to-one with some soldering pads on the second side of the target board through a tin medium.

9. The processing technology according to claim 1, characterized in that: The target board includes a first target board and a second target board; the circuit board assembly includes a plurality of stacked circuit boards; The method of obtaining the circuit board assembly based on the solidified target board body includes: Mounting a fifth board on the first side of the first target board, wherein the preset pad of the fifth board is connected to the metal member provided on the first side of the first target board; The second target board is mounted on the second side of the first target board, and the metal piece of the second target board facing the first target board is connected to the preset pad on the second side of the first target board.

10. The processing technology according to claim 1, characterized in that: The circuit board assembly includes a plurality of stacked circuit boards; The method of obtaining the circuit board assembly based on the solidified target board body includes: Mounting a fifth board on the first side of the target board, wherein the preset pad of the fifth board is connected to the metal member provided on the first side of the target board; Mounting a sixth board, the fifth board is located between the sixth board and the target board, and some pads of the sixth board are welded to some pads of the fifth board in a one-to-one correspondence through a tin medium; or, the target board is located between the fifth board and the sixth board, and some pads of the sixth board are welded to some pads of the target board in a one-to-one correspondence through a tin medium.

11. The processing technology according to claim 1, characterized in that: The circuit board assembly includes a plurality of stacked circuit boards; The areas of the plurality of circuit boards are the same or different.

12. The processing technology according to claim 1, characterized in that: The processing technology also includes: At least one board, before being mounted with other boards, also includes: Mount electronic components on the corresponding pads of the board and place them in a curing oven for curing; Glue is applied between the target electronic device of the cured board and the board.

13. A circuit board assembly, characterized in that: include: At least one board, each of the boards comprising a plurality of pads disposed on a surface thereof, each of the pads being electrically connected to an internal circuit of the board; At least one metal piece, each of the metal pieces is electrically connected to at least one pad of any one board.

14. A circuit board assembly, characterized in that: The method is made by the processing technology described in any one of claims 1 to 12.

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