Photoetching machine device and system in chip manufacturing

Abstract

The invention relates to the technical field of photoetching machines, in particular to a photoetching machine device and system in chip manufacturing, the photoetching machine device in chip manufacturing comprises a photoetching machine body, a photoetching bearing table is fixedly arranged in the photoetching machine body, a silicon wafer sealing bearing assembly is placed on the photoetching bearing table, and a silicon wafer sealing bearing assembly is arranged on the silicon wafer sealing bearing assembly. A silicon wafer sealing and bearing assembly is installed in the photoetching machine body, sealing during silicon wafer transferring is conducted through the silicon wafer sealing and bearing assembly, a bearing assembly fixing mechanism is installed in the photoetching machine body, the silicon wafer sealing and bearing assembly is fixed through the bearing assembly fixing mechanism, and the invention further relates to a control system which comprises a central processing unit module, a control module and a position detection module. The central processing unit module controls the electric telescopic rod to stretch out and draw back through the control module, the position detection module monitors the position of the movable bearing plate and then transmits data to the central processing unit module, and the central processing unit module controls the electric telescopic rod to stop stretching out and drawing back through the control module.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machines, and in particular to a photolithography machine device and system used in chip manufacturing. Background Art

[0002] A photolithography machine is a high-precision optical device that is mainly used to transfer circuit patterns from a mask to a semiconductor wafer, thereby manufacturing integrated circuits and other microelectronic devices. Its performance and precision directly determine the integration and performance of the chip. The photolithography machine is known as the "pearl" of the semiconductor industry and is an indispensable core equipment for chip manufacturing.

[0003] Existing photolithography machines need to coat a layer of photoresist on the silicon wafer when operating on it. The photoresist has a certain degree of adhesion. When the silicon wafer covered with photoresist is manually placed in and taken out of the photolithography machine, it is easily disturbed by external dust. External dust easily adheres to the photoresist, which on the one hand affects the exposure effect, and on the other hand affects the next operation of the silicon wafer. Summary of the Invention

[0004] The purpose of the present invention is to provide a lithography machine device and system for chip manufacturing to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A photolithography machine device used in chip manufacturing includes a photolithography machine body, a photolithography carrier fixedly provided in the photolithography machine body, a silicon wafer sealing carrier assembly placed on the photolithography carrier assembly, and the silicon wafer sealing carrier assembly is used to seal the silicon wafer during transfer; A carrier assembly fixing mechanism is installed inside the photolithography machine body, and the silicon wafer sealing carrier assembly is fixed by the carrier assembly fixing mechanism; A carrier assembly positioning mechanism is installed on the photolithography carrier table, and the silicon wafer sealing carrier assembly is positioned by the carrier assembly positioning mechanism; A convenient opening component is installed on the silicon wafer sealing carrier component, and the carrier component fixing mechanism cooperates with the carrier component positioning mechanism to drive the convenient opening component to move, thereby realizing the opening of the silicon wafer sealing carrier component.

[0006] Preferably, the silicon wafer sealing and carrying assembly is a photolithography carrying box, and connecting channels are symmetrically opened on both sides of the photolithography carrying box, and a supporting protrusion is fixedly provided at one of the connecting channels.

[0007] Preferably, a support hole is provided on the support protrusion, an assembly bearing is installed in the support hole, the assembly bearing is matched with a threaded rotating rod, and a matching gear is fixedly provided at the lower end of the threaded rotating rod.

[0008] Preferably, the supporting assembly fixing mechanism includes an electric telescopic rod, a movable supporting plate and a movable carrier bar, and the electric telescopic rod is fixedly mounted on the inner wall of the lithography machine body.

[0009] Preferably, the movable carrying plate is fixedly mounted on the electric telescopic rod, and the movable carrying plate is movably connected to the movable carrying bar to drive the movable carrying bar to move.

[0010] Preferably, the movable carrier is installed on the photolithography carrier table, and the photolithography carrier box is fixed by the movable carrier.

[0011] Preferably, the positioning mechanism of the carrier assembly is a driving slat, which is mounted on the photolithography carrier platform and cooperates with the convenient opening assembly.

[0012] Preferably, the convenient opening assembly includes a photolithography carrier, a covering movable plate, a driving carrier bar and a locking carrier bar. The photolithography carrier is located inside the photolithography carrier box, and the driving carrier bar is connected to the driving strip.

[0013] Preferably, the driving carrier bar drives the photolithography carrier plate to move, and the photolithography carrier plate drives the covering movable plate to move, and the locking carrier bar is installed on the driving carrier bar to lock the driving carrier bar.

[0014] A control system includes a central processing unit module, a control module, and a position detection module. The central processing unit module controls the extension and retraction of an electric telescopic rod through the control module. The position detection module monitors the position of a movable carrier plate and transmits data to the central processing unit module. The central processing unit module then controls the electric telescopic rod to stop extending and retracting through the control module.

[0015] Compared with the prior art, the present invention has the following advantages: 1. Place the silicon wafer covered with photoresist in a photolithography carrier box and transfer the silicon wafer through the photolithography carrier box to prevent it from being contaminated by external impurities, fully ensuring the cleanliness of the silicon wafer. The photolithography carrier box can be automatically opened during photolithography to ensure the smooth progress of exposure. After the operation is completed, the photolithography carrier box can be automatically closed to facilitate the removal of the silicon wafer from the photolithography machine, so that the silicon wafer can always be transferred in a sealed space.

[0016] 2. After the lithography carrier box is placed in the lithography machine, the positioning of the lithography carrier box is achieved by driving the plug-in plate and the linkage channel. The electric telescopic rod drives the mobile carrier plate to move, and then the mobile carrier strip can be driven to move under the action of the mobile carrier plate, so that the mobile plug plate can be driven to move. The movement of the mobile plug plate can form a negative pressure to fix the lithography carrier box on the lithography carrier table so that its position is accurate and it can be opened smoothly.

[0017] 3. As the electric telescopic rod is further extended, the driving strip can be pushed to move under the action of the movable carrier plate, and then the driving strip can be driven to move under the action of the driving strip, so as to realize the opening of the photolithography carrier box. As the photolithography carrier box is opened, the photolithography carrier plate will be driven to move upward, and then the silicon wafer can be driven to move upward to ensure the smooth exposure. In addition, when the silicon wafer needs to be taken and placed, the driving carrier can be manually pushed so that it can be locked under the action of the locking carrier, so that the photolithography carrier box can be in a stable open state, which is convenient for taking and placing silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the assembly of the lithography machine body.

[0019] Figure 2 This is a schematic diagram of the internal assembly of the lithography machine body.

[0020] Figure 3 Schematic diagram of the internal structure of the lithography machine body.

[0021] Figure 4 This is a schematic diagram of the assembly of the photolithography carrier and the photolithography carrier box.

[0022] Figure 5 This is a first-person perspective assembly diagram of the photolithography platform.

[0023] Figure 6 This is a second-view assembly diagram of the photolithography platform.

[0024] Figure 7 Schematic diagram of the first perspective of the photolithography carrier assembly.

[0025] Figure 8 Schematic diagram of the second perspective of the photolithography carrier assembly.

[0026] Figure 9 Exploded diagram of the assembly of the photolithography carrier box and the photolithography carrier board.

[0027] Figure 10 It is a schematic diagram of the assembly of the movable carrier plate and the movable carrier bar.

[0028] Figure 11 This is a schematic diagram of the assembly of the cover movable plate, drive carrier and lock carrier.

[0029] Figure 12 This is a schematic diagram of the assembly of the locking carrier.

[0030] Figure 13 This is the control system diagram.

[0031] In the figure: 1. Lithography machine body; 11. Lithography carrier; 12. Driving column; 13. Protruding bearing block; 14. Coordinating bearing rod; 15. Limiting plate; 16. Coordinating platform cavity; 17. Moving channel; 18. Electric telescopic rod; 2. Moving carrier plate; 21. Support beam; 22. Carrying drive bar; 23. Carrying stabilizing frame; 24. Pull-down frame; 3. Moving carrier bar; 31. Moving carrier column; 32. Moving plug plate; 33. Moving carrier block; 34. Coordinating moving block; 4. Driving strip; 41. Driving plug plate; 42. Coordinating spring; 5. Lithography carrier box; 50. Insertion hole; 51. Connecting channel; 52. Supporting protrusion; 53. Supporting hole; 54. Locking strip; 55. Locking channel; 5 6. Assemble bearing; 57. Threaded rotating rod; 58. Matching gear; 59. Load-bearing convex plate; 591. Supporting carrier rod; 592. Limiting block; 6. Photolithography carrier; 61. Blocking carrier strip; 62. Connecting support platform; 63. Connecting support groove; 64. Threaded channel; 65. Driving push rod; 7. Covering movable plate; 71. Lower support block; 72. Loading movable rod; 8. Driving carrier strip; 81. Linkage channel; 82. Insert matching hole; 821. Connecting spring; 83. Matching carrier strip; 84. Engaging teeth; 85. Slat support block; 86. Moving support rod; 9. Locking carrier strip; 91. Moving through hole; 92. Supporting insert strip; 93. Active through hole; 94. Locking plug column; 95. Operating carrier; 96. Elastic strip. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] The present invention provides a technical solution: like Figure 1 、 Figure 2 and Figure 3 As shown, a lithography machine device used in chip manufacturing includes a lithography machine body 1, in which a lithography carrier table 11 is fixedly provided, a silicon wafer sealing carrier assembly is placed on the lithography carrier table 11, and the silicon wafer is sealed during transfer by the silicon wafer sealing carrier assembly, a carrier assembly fixing mechanism is installed inside the lithography machine body 1, and the silicon wafer sealing carrier assembly is fixed by the carrier assembly fixing mechanism, a carrier assembly positioning mechanism is installed on the lithography carrier table 11, and the silicon wafer sealing carrier assembly is positioned by the carrier assembly positioning mechanism, a convenient opening component is installed on the silicon wafer sealing carrier assembly, and the carrier assembly fixing mechanism and the carrier assembly positioning mechanism cooperate to drive the convenient opening component to move, thereby realizing the opening of the silicon wafer sealing carrier assembly.

[0034] like Figure 5 and Figure 6 As shown, a hanging column 12 is fixedly provided at the lower end of the lithography carrier 11, and protruding blocks 13 are symmetrically fixedly provided on both sides of the lithography carrier 11. A matching bearing rod 14 is fixedly provided on the protruding bearing block 13, and a limiting disk 15 is fixedly provided on the end of the matching bearing rod 14 away from the protruding bearing block 13. A matching platform cavity 16 is provided on the lithography carrier 11, and the matching platform cavity 16 extends into the hanging column 12. A moving channel 17 is provided on the hanging column 12, and the moving channel 17 is communicated with the matching platform cavity 16.

[0035] like Figure 7 、 Figure 8 and Figure 9 As shown, the silicon wafer sealing carrier assembly is a photolithography carrier box 5, and connecting channels 51 are symmetrically provided on both sides of the photolithography carrier box 5. A supporting protrusion 52 is fixedly provided at one of the connecting channels 51, and a supporting hole 53 is provided on the supporting protrusion 52. An assembly bearing 56 is installed in the support hole 53, and the assembly bearing 56 is matched with a threaded rotating rod 57. The lower end of the threaded rotating rod 57 is fixedly provided with a matching gear 58. A locking strip 54 is fixedly provided at one end of the photolithography carrier box 5, and a locking channel 55 is provided on the locking strip 54. In addition, a carrying protrusion 59 is fixedly provided on one side of the photolithography carrier box 5, and a supporting carrying rod 591 is fixedly provided on the carrying protrusion 59, and a limiting block 592 is fixedly provided on the end of the supporting carrying rod 591 away from the carrying protrusion 59. In addition, a plug-in hole 50 is also provided on the photolithography carrier box 5.

[0036] like Figure 2 、 Figure 4 、 Figure 6 and Figure 10As shown, the carrier assembly fixing mechanism includes an electric telescopic rod 18, a mobile carrier plate 2 and a mobile carrier strip 3. The electric telescopic rod 18 is fixedly mounted on the inner wall of the lithography machine body 1, and the mobile carrier plate 2 is fixedly mounted on the electric telescopic rod 18. The mobile carrier plate 2 is movably connected to the mobile carrier strip 3 to drive the mobile carrier strip 3 to move. The mobile carrier strip 3 is mounted on the lithography carrier table 11, and the lithography carrier box 5 is fixed by the mobile carrier strip 3. A support beam 21 is fixedly provided on the mobile carrier plate 2, and a bearing drive strip 22 is fixedly provided on the support beam 21. A bearing stabilizing frame 23 is symmetrically fixed on the bearing drive strip 22. A pull-down frame 24 is fixedly provided on the stabilizing frame 23, and the internal heights of the supporting stabilizing frame 23 and the pull-down frame 24 are equal. A movable carrier column 31 is symmetrically fixedly provided on the movable carrier bar 3, and the movable carrier column 31 is inserted in the matching platform cavity 16. A movable plug plate 32 is fixedly provided on the upper end of the movable carrier column 31, and the movable plug plate 32 is in the matching platform cavity 16, and a movable carrier block 33 is also fixedly provided on the movable carrier column 31, and the movable carrier block 33 is inserted in the movable channel 17, and a matching movable block 34 is fixedly provided on the movable carrier block 33, and the matching movable block 34 is inserted in the pull-down frame 24, and the matching movable block 34 is in contact with the inner wall of the pull-down frame 24.

[0037] like Figure 4 and Figure 5 As shown, the positioning mechanism of the carrying component is a driving slat 4, which is installed on the photolithography carrying platform 11, and the driving slat 4 cooperates with the convenient opening component, the driving slat 4 is sleeved on the cooperating carrying rod 14, and the upper end of the driving slat 4 is fixed with a driving plug 41, and the cooperating carrying rod 14 is provided with a cooperating spring 42, and the two ends of the cooperating spring 42 are respectively fixed on the driving slat 4 and the protruding supporting block 13.

[0038] like Figure 7 、 Figure 8 、 Figure 9 、 Figure 11 and Figure 12As shown, the convenient opening component includes a photolithography carrier 6, a covering movable plate 7, a driving carrier bar 8 and a locking carrier bar 9. The photolithography carrier 6 is inside the photolithography carrier box 5. The driving carrier bar 8 is connected to the driving strip 4. The driving carrier bar 8 drives the photolithography carrier 6 to move. The photolithography carrier 6 drives the covering movable plate 7 to move. The locking carrier bar 9 is installed on the driving carrier bar 8 to lock the driving carrier bar 8. The two sides of the photolithography carrier 6 are symmetrically fixed with blocking carrier bars 61. The blocking carrier bar 61 can block the connecting channel 51 on the upper side of the photolithography carrier 6. One of the blocking carrier bars 61 is fixed A connecting support 62 is provided, a connecting support groove 63 is provided on the connecting support 62, and a threaded channel 64 is provided on the blocking carrier 61 provided with the connecting support 62, a threaded rotating rod 57 is threadedly connected in the threaded channel 64, a driving push rod 65 is symmetrically hinged on the blocking carrier 61, and a covering movable plate 7 is hinged on the upper end of the driving push rod 65, and a lower supporting block 71 is symmetrically fixed on the covering movable plate 7, and a bearing movable rod 72 is fixed on the lower supporting block 71, and the bearing movable rod 72 is inserted into the plug-in hole 50. When the covering movable plate 7 is closed to close the photolithography carrier box 5 The driving carrier bar 8 is provided with a linkage channel 81, and one end of the driving carrier bar 8 is provided with a plug-in matching hole 82, a supporting carrier rod 591 is plugged into the plug-in matching hole 82, and a connecting spring 821 is sleeved on the supporting carrier rod 591. The two ends of the connecting spring 821 are respectively fixed on the driving carrier bar 8 and the bearing convex plate 59. The other end of the driving carrier bar 8 is fixedly provided with a matching carrier bar 83, and the matching carrier bar 83 is fixedly provided with a meshing tooth 84, which meshes with the matching gear 58, and the matching carrier bar 83 is also fixedly provided with a slat support block 85, which is fixed on the slat support block 85. A movable supporting rod 86 is provided, and a locking carrier strip 9 is sleeved on the movable supporting rod 86. A movable through hole 91 is provided at one end of the locking carrier strip 9, and the movable through hole 91 cooperates with the movable supporting rod 86, and a supporting insert strip 92 is fixedly provided on one side of the locking carrier strip 9, and the supporting insert strip 92 is inserted in the connecting bearing groove 63, and a movable through hole 93 is provided at the other end of the locking carrier strip 9, and a locking column 94 is inserted in the movable through hole 93, and an operating carrier plate 95 is fixed on the locking column 94, and an elastic strip 96 is fixed on the operating carrier plate 95, and the other end of the elastic strip 96 is fixed on the locking carrier strip 9.

[0039] A control system includes a central processing unit module, a control module and a position detection module. The central processing unit module controls the electric telescopic rod 18 to extend and retract through the control module. The position detection module monitors the position of the mobile carrier plate 2 and transmits data to the central processing unit module. The central processing unit module then controls the electric telescopic rod 18 to stop extending and retracting through the control module.

[0040] When transferring the silicon wafer coated with photoresist, the driving carrier bar 8 is manually pushed to move it toward the photolithography carrier box 5. As the driving carrier bar 8 moves, it will drive the matching gear 58 to rotate. As the matching gear 58 rotates, the photolithography carrier 6 will be driven to move upward under the action of the threaded rotating rod 57. As the photolithography carrier 6 moves upward, the driving push rod 65 will drive the covering movable plate 7 to move backward, thereby making the photolithography carrier box 5 in an open state. At this time, the photolithography carrier 6 is close to the port of the photolithography carrier box 5, which is convenient for placing the silicon wafer. In addition, when the driving carrier bar 8 moves, as the photolithography carrier 6 moves upward, it will also drive the locking carrier bar 9 to move upward. As the locking carrier bar 9 moves upward, it will lock the The pin 94 contacts the lower end surface of the locking strip 54, so that under the restriction of the locking strip 54, the elastic strip 96 will be in a compressed state until the locking pin 94 is aligned with the locking channel 55. In this way, under the action of the elastic strip 96, the locking pin 94 will be inserted into the locking channel 55, thereby locking the drive carrier 8, and then the covering movable plate 7 is in a stable state, which is convenient for taking and placing the silicon wafer. After placing the silicon wafer, the operating carrier 95 is pushed downward to make the locking pin 94 exit the locking channel 55, so that the drive carrier 8 is in an unlocked state, which can be reset, and the covering movable plate 7 moves in the opposite direction to close together, sealing the silicon wafer, and then the silicon wafer can be sealed and transferred to the lithography machine body 1, and the lithography carrier box 5 is placed The photolithography carrier 11 is placed on the photolithography carrier 11, and the driving plug plate 41 is plugged into the linkage channel 81, so that the positioning of the photolithography carrier box 5 can be achieved, and the photolithography carrier box 5 at this time covers the upper port of the matching stage cavity 16 and seals it. Then the electric telescopic rod 18 drives the movable carrier plate 2 to move. As the movable carrier plate 2 moves, the matching moving block 34 will be driven to move downward under the action of the pull-down frame 24, and then the movable plug plate 32 will be driven to move downward. As the movable plug plate 32 moves downward, a negative pressure will be formed in the matching stage cavity 16, and then the photolithography carrier box 5 can be firmly fixed on the photolithography carrier 11 until the matching moving block 34 is in the carrying stabilization frame 23. At this time, the movable plug plate 32 will no longer move downward, and the movable carrier 2 at this time will be moved downward. The plate 2 is also in contact with the driving strip 4, so that as the mobile carrier plate 2 continues to move, the driving strip 4 will move with it, so that under the action of the driving strip 4, the driving carrier strip 8 will also be driven to move, and then the covering movable plate 7 can be driven to move, so that the photolithography carrier box 5 is in an open state, thereby realizing the automatic opening of the photolithography carrier box 5. In addition, the electric telescopic rod 18 drives the driving carrier strip 8 to move, so that when the photolithography carrier box 5 is opened, the locking pin 94 on the locking carrier strip 9 will not be aligned with the locking channel 55, that is, the driving carrier strip 8 will not be locked by the locking pin 94. As the photolithography carrier box 5 is opened, the photolithography carrier plate 6 also moves upward, so that the silicon wafer can be pushed to the port of the photolithography carrier box 5.This makes it easier to perform photolithography operations on silicon wafers. After the operation is completed, the electric telescopic rod 18 retracts, which drives the movable carrier plate 2 to move in the opposite direction. As the movable carrier plate 2 moves in the opposite direction, the spring 42 causes the driving strip 4 to move in the opposite direction, which in turn drives the driving carrier strip 8 to move in the opposite direction, thereby closing the covering movable plate 7 again, so that the photolithography carrier box 5 is in a closed state, and the photolithography carrier box 5 can be taken out of the photolithography machine body 1. In this way, the silicon wafer can be transferred in a sealed state, avoiding contamination of the silicon wafer by external impurities. When the silicon wafer needs to be taken out, the driving carrier strip 8 is also pushed to lock it under the action of the locking carrier strip 9, and the silicon wafer can be taken out smoothly. It is very convenient.

[0041] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A lithography machine device used in chip manufacturing, comprising a lithography machine body, characterized in that: A photolithography carrier is fixedly provided in the photolithography machine body, and a silicon wafer sealing carrier assembly is placed on the photolithography carrier, and the silicon wafer is sealed during transfer by the silicon wafer sealing carrier assembly; A carrier assembly fixing mechanism is installed inside the photolithography machine body, and the silicon wafer sealing carrier assembly is fixed by the carrier assembly fixing mechanism; A carrier assembly positioning mechanism is installed on the photolithography carrier table, and the silicon wafer sealing carrier assembly is positioned by the carrier assembly positioning mechanism; A convenient opening component is installed on the silicon wafer sealing carrier component, and the carrier component fixing mechanism cooperates with the carrier component positioning mechanism to drive the convenient opening component to move, thereby realizing the opening of the silicon wafer sealing carrier component.

2. The photolithography apparatus for chip manufacturing according to claim 1, characterized in that: The silicon wafer sealing and carrying assembly is a photolithography carrying box. Connecting channels are symmetrically provided on both sides of the photolithography carrying box. A supporting protrusion is fixedly provided at one of the connecting channels.

3. The photolithography machine assembly for chip manufacturing according to claim 2, characterized in that: A support hole is provided on the support protrusion, an assembly bearing is installed in the support hole, the assembly bearing is matched with a threaded rotating rod, and a matching gear is fixedly provided on the lower end of the threaded rotating rod.

4. The photolithography apparatus for chip manufacturing according to claim 3, characterized in that: The carrier assembly fixing mechanism includes an electric telescopic rod, a movable carrier plate and a movable carrier bar, and the electric telescopic rod is fixedly installed on the inner wall of the lithography machine body.

5. The photolithography apparatus for chip manufacturing according to claim 4, characterized in that: The movable carrying plate is fixedly mounted on the electric telescopic rod, and the movable carrying plate is movably connected to the movable carrying bar to drive the movable carrying bar to move.

6. The photolithography apparatus for chip manufacturing according to claim 5, characterized in that: The movable carrier is installed on the photolithography carrier table, and the photolithography carrier box is fixed by the movable carrier.

7. The photolithography apparatus for chip manufacturing according to claim 6, characterized in that: The positioning mechanism of the carrying component is a driving strip, which is installed on the photolithography carrying platform and cooperates with the convenient opening component.

8. The photolithography apparatus for chip manufacturing according to claim 7, characterized in that: The convenient opening assembly includes a photolithography carrier, a covering movable plate, a driving carrier bar and a locking carrier bar. The photolithography carrier is located inside the photolithography carrier box, and the driving carrier bar is connected to the driving strip.

9. The photolithography apparatus for chip manufacturing according to claim 8, characterized in that: The driving carrier bar drives the photoetching carrier plate to move, and the photoetching carrier plate drives the covering movable plate to move. The locking carrier bar is installed on the driving carrier bar to lock the driving carrier bar.

10. A control system, characterized in that: The control system is suitable for the lithography machine device described in any one of claims 1 to 9, and includes a central processing unit module, a control module and a position detection module. The central processing unit module controls the electric telescopic rod to extend and retract through the control module. The position detection module monitors the position of the mobile carrier plate and transmits data to the central processing unit module. The central processing unit module then controls the electric telescopic rod to stop extending and retracting through the control module.

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