An extensible phased array antenna architecture

Abstract

The application discloses an extensible phased array antenna architecture and belongs to the technical field of phased array antennas. The architecture comprises a heat dissipation channel, a plurality of two-dimensional extensible phased array subarrays are arranged on one side of the heat dissipation channel, and a heat-conducting interface material is arranged between TR chips of the two-dimensional extensible phased array subarrays and the heat dissipation channel; a main controller, a dividing / combining network, a power supply network and a plurality of subarray control boards are arranged on the other side of the heat dissipation channel, and a heat-conducting interface material is arranged between devices with heat consumption higher than a preset heat consumption value and the heat dissipation channel; an aperture size of the subarray control boards is smaller than that of the two-dimensional extensible phased array subarrays; the main controller, the dividing / combining network and the power supply network are integrated by pressing, the subarray control boards are arranged at the same height as the integrated module and do not block each other. The application can realize efficient heat dissipation, heat of TR chips of subarrays can be taken away by air cooling or cooling liquid through the shortest path, and rapid disassembly, maintenance and repair of large phased arrays can be realized.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and more particularly to a scalable phased array antenna architecture. Background Technology

[0002] With the rapid development of phased array antenna technology, especially the application and development of large-scale phased arrays, the use of scalable phased array subarray modules to expand phased array antenna systems to any size is being extensively studied. The requirements for lightweight design, efficient heat dissipation, and efficient maintenance in large-scale phased array antennas are becoming increasingly stringent. Common scalable phased array architectures include... Figure 1 As shown, this is the current mainstream subarray expansion method. The subarray antenna TR and subarray control board are expanded as a whole, and the whole is placed on one side of the heat dissipation duct or liquid cooling pipe. The remaining main controller, splitter / combiner network, and power network of the phased array are placed on the other side of the heat dissipation duct or liquid cooling pipe. All networks and subarrays are connected by cables. It has the following disadvantages: large weight, thick size, long heat dissipation path, low heat dissipation efficiency, and is not conducive to the maintenance of subarray control board. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a scalable phased array antenna architecture.

[0004] The objective of this invention is achieved through the following technical solution: a scalable phased array antenna architecture, including a heat dissipation channel. Multiple two-dimensional scalable phased array subarrays are arranged on one side of the heat dissipation channel, and a thermally conductive interface material is provided between the TR chip of each two-dimensional scalable phased array subarray and the heat dissipation channel. A main controller, a splitter / combiner network, a power network, and multiple subarray control boards are arranged on the other side of the heat dissipation channel. Thermally conductive interface material is provided between devices with heat dissipation higher than a preset heat dissipation value and the heat dissipation channel. The aperture size of the subarray control board is smaller than the aperture size of the two-dimensional scalable phased array subarray. The main controller, splitter / combiner network, and power network are integrated and press-fitted together. The subarray control boards and the integrated module are arranged at the same height and do not obstruct each other.

[0005] Preferably, the heat dissipation channel is an air duct or a liquid cooling pipe.

[0006] Preferably, the main controller, the branch / combination network, and the power network are connected to other modules nearby via cables.

[0007] Preferably, a large scalable phased array antenna is obtained by arbitrarily expanding the two-dimensional scalable phased array subarray.

[0008] The beneficial effects of this invention are:

[0009] 1) This invention can achieve efficient heat dissipation of phased arrays, and the heat of the subarray TR chip can be carried away by air cooling or coolant through the shortest path.

[0010] 2) This invention enables rapid disassembly and repair of large phased arrays, improving repair efficiency by more than 80%. The subarray TR chip can be disassembled and repaired from the antenna surface, and the subarray control board, main control + power supply + branch / circuit network can be directly disassembled and repaired after opening the back cover.

[0011] 3) This invention enables the simple and lightweight design of large phased array antennas. Attached Figure Description

[0012] Figure 1 This is a scalable phased array architecture in the existing technology;

[0013] Figure 2 This is a cross-sectional view of the phased array antenna architecture of the present invention;

[0014] Figure 3 This is a top view of the phased array antenna architecture of the present invention;

[0015] Figure 4 This is a bottom view of the phased array antenna architecture of the present invention. Detailed Implementation

[0016] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] See Figure 2 A scalable phased array antenna architecture includes a heat dissipation channel. Multiple two-dimensional scalable phased array subarrays are arranged on one side of the heat dissipation channel, with a thermally conductive interface material between the TR chip of each subarray and the heat dissipation channel. On the other side of the heat dissipation channel are a main controller, a splitter / combiner network, a power network, and multiple subarray control boards. Devices with heat dissipation exceeding a preset value are placed between themselves and the heat dissipation channel with thermally conductive interface material. The aperture size of the subarray control boards is smaller than that of the two-dimensional scalable phased array subarrays. The main controller, splitter / combiner network, and power network are integrated and press-fitted together. The subarray control boards and the integrated modules are arranged at the same height and do not obstruct each other.

[0018] In this embodiment, as Figures 2-4 As shown, taking 16 subarrays as an example, TR_1-TR_16 are the numbers of the 16 subarrays. Figure 2 The cross-sectional view shows the four subarrays and their control panels; Figure 3 The top view shows the two-dimensional scalable phased array_subarray TR_1-16; Figure 4From a bottom view, the control boards of the 16 subarrays are visible, connected to the integrated main controller, split / combiner network, and power network via RF cables, control cables, and power cables. Multiple two-dimensional scalable phased array subarrays are located on one side of the heat dissipation channel, employing a two-dimensional extended phased array architecture, allowing for arbitrary large-diameter phased array expansion. A thermally conductive interface material is placed between the TR chip of the subarray and the heat dissipation channel cavity (the thermally conductive interface material is placed...). Figure 2 The connection between the central cooling / liquid cooling pipe and the two-dimensional scalable phased array (TR subarray) enables efficient heat dissipation of the TR chip. Thermally conductive interface materials are placed between high-heat-dissipation devices and heat dissipation channels in the main controller, split / combined network, power network, and subarray control board, facilitating efficient heat dissipation of these devices through the shortest possible heat dissipation path.

[0019] The subarray control board has a smaller aperture than the two-dimensional scalable phased array subarray; the main controller, split / combiner network, and power network are integrated and laminated together, and the subarray control board and the integrated module are laid out at the same height and do not obstruct each other, which is conducive to quick disassembly and repair when each module fails; the use of high-density printed circuit board integration technology for integrated lamination and integration can reduce the size of the main controller, split / combiner network, and power network, while improving reliability.

[0020] In some embodiments, the heat dissipation channel is an air duct or a liquid cooling pipe.

[0021] In some embodiments, the main controller, the split / combination network, and the power network are connected to other modules nearby via cables.

[0022] In some embodiments, a large scalable phased array antenna is obtained by arbitrarily expanding a two-dimensional scalable phased array subarray.

[0023] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A scalable phased array antenna architecture, characterized by: The heat dissipation channel is provided with a plurality of two-dimensional scalable phased array subarrays on one side, and a heat-conducting interface material is arranged between the TR chip of the two-dimensional scalable phased array subarray and the heat dissipation channel; the other side of the heat dissipation channel is provided with a main controller, a branch / combining network, a power supply network and a plurality of subarray control boards, and a heat-conducting interface material is arranged between the device with heat consumption higher than a preset heat consumption value and the heat dissipation channel; the caliber size of the subarray control board is smaller than that of the two-dimensional scalable phased array subarray; the main controller, the branch / combining network and the power supply network are integrated and pressed together, the subarray control board and the integrated module are arranged at the same height and do not block each other; and the subarray control board of each two-dimensional scalable phased array subarray is connected with the integrated and pressed main controller, branch / combining network and power supply network through radio frequency cables, control cables and power supply cables.

2. The extensible phased array antenna architecture of claim 1, wherein: The heat dissipation channel is a wind channel or a liquid cooling pipe.

3. The extensible phased array antenna architecture of claim 1, wherein: The main controller, the branch / combining network and the power supply network are connected with other modules in proximity through cables.

4. The extensible phased array antenna architecture according to any of claims 1-3, characterized in that: The two-dimensional scalable phased array subarray is arbitrarily caliber-expanded to obtain a large scalable phased array antenna.

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