Method for manufacturing printed circuit board

Abstract

The invention provides a method for manufacturing a printed circuit board. This method for manufacturing a wired circuit board (1) is provided with: a step for forming a first insulating layer (12) on one surface of a metal base material (M); a step for forming a circuit pattern (13) on the first insulating layer (12); a step for forming an anti-plating layer (R1) that exposes the terminal (131A); a step for forming a solder plating layer (15) on the terminal (131A); and a step in which a resist coating layer (R11) that covers the solder plating layer (15) is disposed on the resist plating layer (R1).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a wiring circuit substrate. Background Art

[0002] Conventionally, there is known a wired circuit board including a conductor layer having terminals and a conductive member disposed on the terminals (see, for example, Patent Document 1 listed below).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2023-029294 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] In the manufacturing of the wired circuit board described in Patent Document 1, after the conductive members are formed, if the wired circuit board is handled mid-manufacturing, there is a risk of deformation of the conductive members and terminals. For example, if two wired circuit boards mid-manufacturing are stacked, a portion of one wired circuit board may come into contact with the conductive member of the other wired circuit board, potentially deforming the conductive member and terminals.

[0008] The present invention provides a method for manufacturing a wired circuit board capable of suppressing deformation of the solder plating layer and the terminal after forming the solder plating layer on the terminal.

[0009] Solutions for solving problems

[0010] The present invention [1] includes a method for manufacturing a wiring circuit substrate, wherein the wiring circuit substrate comprises: a metal supporting layer; a circuit pattern having terminals; an insulating layer arranged between the metal supporting layer and the circuit pattern; and a solder plating layer arranged on the terminals, the method comprising: an insulating layer forming step, in which the insulating layer is formed on one side of a metal substrate; a pattern forming step, in which the circuit pattern is formed on the insulating layer; a resist forming step, in which a resist is formed to expose the terminals; a solder plating forming step, in which a solder plating is formed on the terminals; and a protective step, in which a protective film covering the solder plating is arranged on the resist.

[0011] According to such a method, after the solder plating layer forming step, a protective film covering the solder plating layer is arranged on the plating resist in the protecting step without peeling the plating resist.

[0012] Therefore, the wired circuit board in the process of being manufactured can be processed in a state where the solder plating layer is surrounded by the plating resist layer.

[0013] Thus, when the printed circuit board in the process of being manufactured is handled, the solder plating layer can be protected by the plating resist.

[0014] As a result, after the solder plating layer is formed on the terminal, deformation of the solder plating layer and the terminal can be suppressed.

[0015] The present invention [2] is based on the manufacturing method of the wiring circuit substrate of the above-mentioned [1], and the manufacturing method of the wiring circuit substrate also includes a contour processing step, in which, after the protection step, the substrate is etched to form the metal support layer, the protective film is an anti-corrosion coating, and in the protection step, a second anti-corrosion coating is formed on the surface of the other side of the substrate to expose a portion of the substrate.

[0016] According to such a method, after the solder plating layer forming step and before the outer shape processing step is completed, the solder plating layer can be protected by the plating resist.

[0017] The present invention [3] is based on the manufacturing method of the wiring circuit substrate of the above-mentioned [2], and further includes a stripping step, in which the anti-corrosion coating and the anti-plating layer are stripped together after the outer shape processing step.

[0018] According to such a method, in the stripping step, the etching resist used in the outer shape processing step and the plating resist used in the solder plating layer forming step can be stripped together.

[0019] Therefore, it is possible to reduce man-hours.

[0020] The present invention [4] is based on the manufacturing method of the wiring circuit substrate of any one of the above [1] to [3], wherein the insulating layer forming step, the pattern forming step, the anti-plating layer forming step, the solder plating layer forming step and the protection step are implemented in a roll-to-roll manner.

[0021] According to such a method, when the printed circuit board in the process of being manufactured is wound up, the solder plating layer can be protected by the plating resist.

[0022] Effects of the Invention

[0023] According to the method for manufacturing a wired circuit board of the present invention, deformation of the terminal can be suppressed after the solder plating layer is formed on the terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a top view of a wired circuit board as one embodiment of the present invention.

[0025] Figure 2 yes Figure 1 AA cross-sectional view of the wiring circuit board shown.

[0026] Figure 3A express Figure 2 The first insulating layer forming step of the method for manufacturing a wired circuit board is shown. Figure 3B then Figure 3A Indicates a pattern forming process. Figure 3C then Figure 3B It shows the second insulating layer forming step.

[0027] Figure 4A then Figure 3C Indicates the opening forming step. Figure 4B then Figure 4A Indicates a covering layer forming step. Figure 4C then Figure 4B Indicates a plating resist forming step.

[0028] Figure 5A then Figure 4C Indicates the solder plating layer forming process. Figure 5B then Figure 5A It shows the process of forming the corrosion-resistant coating. Figure 5C then Figure 5B Indicates the shape processing process.

[0029] Figure 6 This is an explanatory diagram for explaining protection of the solder plating layer by the plating resist.

[0030] Figure 7 It is an explanatory diagram for explaining a modified example of the wired circuit board.

[0031] Description of Reference Numerals

[0032] 1. Wiring circuit board; 11. Metal support layer; 12. First insulating layer (insulating layer); 13. Circuit pattern; 131A. Terminal; 15. Solder plating; M. Base material; R1. Anti-plating layer; R11. Anti-corrosion coating; R12. Anti-corrosion coating (second anti-corrosion coating). DETAILED DESCRIPTION

[0033] 1. Wiring circuit substrate

[0034] like Figure 1 As shown, the wired circuit board 1 extends in both the longitudinal and width directions. In this embodiment, the wired circuit board 1 has a generally rectangular shape. The shape of the wired circuit board 1 is not limited to this embodiment. The wired circuit board 1 may be a flexible wired circuit board or a suspension board with circuitry.

[0035] like Figure 2 As shown, the wired circuit board 1 includes a metal supporting layer 11 , a first insulating layer 12 , a circuit pattern 13 , a second insulating layer 14 , and a solder plating layer 15 .

[0036] (1) Metal support layer

[0037] The metal supporting layer 11 supports the first insulating layer 12, the circuit pattern 13, and the second insulating layer 14. Examples of the material of the metal supporting layer 11 include stainless steel and copper alloy. The metal supporting layer 11 has an opening 11A.

[0038] The opening 11A is arranged at one end portion in the longitudinal direction of the wired circuit board 1. The opening 11A extends in the width direction.

[0039] (2) First insulation layer

[0040] The first insulating layer 12 is arranged on one side of the metal supporting layer 11 in the thickness direction of the metal supporting layer 11. The thickness direction is orthogonal to the length direction and the width direction. The first insulating layer 12 is arranged on the surface of one side of the metal supporting layer 11 in the thickness direction. The first insulating layer 12 is arranged between the metal supporting layer 11 and the circuit pattern 13 in the thickness direction. The first insulating layer 12 insulates the metal supporting layer 11 from the circuit pattern 13. The first insulating layer 12 is formed of a resin. Examples of the resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 12 is formed of polyimide. Figure 1 As shown, the first insulating layer 12 has an opening 12A.

[0041] The opening 12A is arranged at one end in the longitudinal direction of the wired circuit board 1. The opening 12A extends in the width direction. The entire opening 12A is aligned with the opening 11A of the metal supporting layer 11 (see Figure 2 ) connected.

[0042] (3) Circuit pattern

[0043] like Figure 2 As shown, the circuit pattern 13 is arranged on one side of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is arranged on one surface of the first insulating layer 12 in the thickness direction. The circuit pattern 13 is arranged on the side of the first insulating layer 12 opposite to the metal supporting layer 11 in the thickness direction. The shape of the circuit pattern 13 is not limited.

[0044] In this embodiment, if Figure 1 As shown, the circuit pattern 13 includes a plurality of terminals 131A and 131B, a plurality of terminals 132A and 132B, and a plurality of wirings 133A and 133B. The number of terminals and the number of wirings are not limited.

[0045] (3-1)Terminals 131A, 131B

[0046] Terminals 131A and 131B are located at one end of the wired circuit board 1 in the longitudinal direction. If the wired circuit board 1 is a suspension board with circuitry, terminals 131A and 131B serve as, for example, head connection terminals electrically connected to a magnetic head. In this embodiment, terminals 131A and 131B are arranged in the width direction. Terminal 131B is spaced apart from terminal 131A in the width direction. Each terminal 131A and 131B has, for example, a square pad shape.

[0047] The width W (dimension in the width direction) of the terminal 131A is, for example, 40 μm or less, or preferably 30 μm or less. If the width W of the terminal 131A is less than the upper limit, it is difficult to form a solder layer on the terminal 131A by printing.

[0048] The width W of the terminal 131A is, for example, not less than 5 μm, or preferably not less than 10 μm.

[0049] like Figure 2 As shown, the terminal 131A is arranged on one side of the first insulating layer 12 in the thickness direction. The terminal 131A is arranged on one side of the first insulating layer 12 in the thickness direction. Specifically, one end of the terminal 131A in the longitudinal direction is arranged in the opening 12A of the first insulating layer 12 (see Figure 1 The other end portion of the terminal 131A in the longitudinal direction is arranged on one surface of the first insulating layer 12. The terminal 131A includes a conductive layer 1311 and a covering layer 1312.

[0050] Conductive layer 1311 is made of copper and is continuous with wiring 133A.

[0051] Covering layer 1312 covers the surface of conductor layer 1311. Covering layer 1312 is formed of a metal different from that of conductor layer 1311. Covering layer 1312 may be a single layer or multiple layers. Covering layer 1312 includes at least a surface layer 1312A formed of gold. Surface layer 1312A is, for example, a gold-plated layer. Covering layer 1312 preferably includes an intermediate layer 1312B. Intermediate layer 1312B is disposed between conductor layer 1311 and surface layer 1312A. Intermediate layer 1312B is formed of a metal different from that of conductor layer 1311 and surface layer 1312A. Intermediate layer 1312B is preferably formed of nickel. Intermediate layer 1312B is, for example, a nickel-plated layer.

[0052] The thickness T1 of the cover layer 1312 is, for example, greater than or equal to 0.1 μm, preferably greater than or equal to 0.2 μm, and for example, less than or equal to 5 μm, preferably less than or equal to 4 μm.

[0053] (3-2)Terminals 132A, 132B

[0054] like Figure 1 As shown, terminals 132A and 132B are arranged at the other end of the lengthwise direction of the wired circuit board 1. In this embodiment, terminals 132A and 132B are arranged in the widthwise direction. Terminal 132B is arranged in the widthwise direction away from terminal 132A. Each of terminals 132A and 132B has, for example, a square pad shape.

[0055] The terminal 132A is arranged on one side in the thickness direction of the first insulating layer 12. The terminal 132A is arranged on one surface in the thickness direction of the first insulating layer 12. Like the terminal 131A, the terminal 132A also includes a conductive layer 1311 and a covering layer 1312.

[0056] The description of the terminal 132B is the same as that of the terminal 132A, and therefore, the description of the terminal 132B is omitted.

[0057] (3-3) Wiring

[0058] One end of wiring 133A is connected to terminal 131A. The other end of wiring 133A is connected to terminal 132A. Wiring 133A electrically connects terminal 131A and terminal 132A.

[0059] One end of the wiring 133B is connected to the terminal 131B. The other end of the wiring 133B is connected to the terminal 132B. The wiring 133B electrically connects the terminal 131B and the terminal 132B.

[0060] The wirings 133A and 133B are formed of the same material as that of the conductive layer 1311 .

[0061] (4) Second insulation layer

[0062] like Figure 1 and Figure 2 As shown, second insulating layer 14 is disposed on first insulating layer 12 in the thickness direction. Second insulating layer 14 covers circuit pattern 13. Specifically, second insulating layer 14 covers wiring 133A and 133B. Second insulating layer 14 does not cover terminals 131A, 131B, 132A, and 132B. Second insulating layer 14 is formed of a resin. Examples of such resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0063] (5) Solder plating

[0064] like Figure 2 As shown, the solder plating layer 15 is arranged on the terminal 131A. In addition, the solder plating layer 15 is also arranged on the terminal 131B (see Figure 1) above. In addition, the solder plating layer 15 may also be arranged on the terminals 132A and 132B (see Figure 1 ). The solder plating 15 is arranged on one side of the terminal 131A in the thickness direction. The solder plating 15 is arranged on the surface of one side of the terminal 131A in the thickness direction. The solder plating 15 is arranged on the surface layer 1312A. The solder plating 15 is arranged separately from the conductor layer 1311 in the thickness direction. The solder plating 15 is in contact with the cover layer 1312 and is not in contact with the conductor layer 1311. At least a portion of the solder plating 15 is arranged in the opening 12A of the first insulating layer 12 (see Figure 1 )Inside.

[0065] Thickness T2 of solder plating layer 15 is thicker than thickness T1 of cover layer 1312. Thickness T2 of solder plating layer 15 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, for example, 100 μm or less, preferably 50 μm or less.

[0066] Examples of the material of the solder plating layer 15 include lead, tin, silver, copper, bismuth, indium, and zinc. The solder plating layer 15 is preferably formed of a tin-silver alloy.

[0067] 2. Manufacturing method of wiring circuit board

[0068] Next, a method for manufacturing the above-mentioned wired circuit board 1 will be described.

[0069] The method for manufacturing the wired circuit board 1 includes a first insulating layer forming step (see Figure 3A ), pattern forming process (refer to Figure 3B ), the second insulating layer forming step (refer to Figure 3C ), opening forming process (refer to Figure 4A ), covering layer forming step (refer to Figure 4B ), resist forming process (refer to Figure 4C ), solder plating layer forming process (refer to Figure 5A ), as an example of a protection process, an anti-corrosion coating forming process (refer to Figure 5B ), shape processing process (refer to Figure 5C ) and peeling process (refer to Figure 2 ).

[0070] (1) First Insulation Layer Formation Step

[0071] like Figure 3A As shown, in the first insulating layer forming step, the first insulating layer 12 is formed on one side of the metal substrate M. The substrate M is formed of the same material as the metal supporting layer 11 described above. In the first insulating layer 12 formed in the first insulating layer forming step, an opening 12A is formed (see FIG. Figure 2) is thinner than the thickness of the second portion 122 where the opening 12A is not formed.

[0072] Specifically, in the first insulating layer forming step, first, a photosensitive resin solution (varnish) is applied onto the substrate M and dried to form a photosensitive resin coating film.

[0073] Next, the photosensitive resin coating is exposed and developed. The photosensitive resin coating is exposed in grayscale using, for example, a photomask having a light-shielding portion, a fully transparent portion, and a semi-transparent portion. The light-shielding portion faces the portion of the photosensitive resin coating that does not form the first insulating layer 12. The semi-transparent portion faces the portion of the photosensitive resin coating that forms the first portion 121. The fully transparent portion faces the portion of the photosensitive resin coating that forms the second portion 122. By using grayscale exposure, the first insulating layer 12 having the first portion 121 and the second portion 122 is obtained.

[0074] Alternatively, the first portion 121 may be formed thinner than the second portion 122 by etching the first insulating layer 12 .

[0075] The first insulating layer forming step is performed in a roll-to-roll manner. That is, the first insulating layer 12 is formed on a substrate M drawn out from a roll (first roll) of the substrate M. The substrate M with the first insulating layer 12 formed thereon is wound into a second roll.

[0076] (2) Pattern Formation Process

[0077] The patterning step is performed after the first insulating layer forming step.

[0078] like Figure 3B As shown, in the patterning step, circuit pattern 13 is formed on first insulating layer 12. Specifically, in the patterning step, conductor pattern 20 is formed within circuit pattern 13. Conductor pattern 20 includes conductor layers 1311 and wirings 133A and 133B for terminals 131A, 131B, 132A, and 132B, respectively. Conductor pattern 20 is formed of copper. Conductor pattern 20 does not include cover layer 1312.

[0079] In the circuit pattern forming step, a seed layer is first formed in the thickness direction on one surface of the first insulating layer 12 and one surface of the substrate M. The seed layer is formed, for example, by sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0080] Next, a plating resist is bonded to one surface in the thickness direction of the base material M. The plating resist covers the first insulating layer 12 .

[0081] Next, the plating resist is exposed and developed. As a result, the plating resist in the portion where the conductive pattern 20 is to be formed is removed, and the seed layer is exposed in the portion where the conductive pattern 20 is to be formed. On the other hand, the plating resist in the portion where the conductive pattern 20 is not to be formed remains.

[0082] Next, the conductor pattern 20 is formed on the exposed seed layer by electroplating. After the electroplating is completed, the plating resist is stripped, and the seed layer exposed by the stripping of the plating resist is removed by etching.

[0083] The patterning process is performed in a roll-to-roll manner. Specifically, in the patterning process, the substrate M is unwound from the second roll (the roll after the first insulating layer forming process), and the conductive pattern 20 is formed on the first insulating layer 12. Then, the substrate M with the conductive pattern 20 formed thereon is wound into a third roll.

[0084] (3) Second Insulation Layer Formation Step

[0085] The second insulating layer forming step is performed after the pattern forming step.

[0086] like Figure 3C As shown, in the second insulating layer forming step, the second insulating layer 14 is formed on the first insulating layer 12 .

[0087] Specifically, in the second insulating layer forming step, first, a photosensitive resin solution (varnish) is applied onto the conductive pattern 20 , the first insulating layer 12 , and the substrate M and dried to form a photosensitive resin coating film.

[0088] Next, the photosensitive resin coating is exposed and developed, thereby forming the second insulating layer 14 on the first insulating layer 12 .

[0089] The second insulating layer formation step is performed in a roll-to-roll manner. Specifically, in the second insulating layer formation step, the substrate M is unwound from the third roll (the roll after the patterning step), and the second insulating layer 14 is formed on the first insulating layer 12. The substrate M with the second insulating layer 14 formed thereon is then wound into a fourth roll.

[0090] (4) Opening Forming Process

[0091] The opening forming step is performed after the second insulating layer forming step.

[0092] like Figure 4A As shown, in the opening forming step, an opening 11A is formed in the substrate M, and an opening 12A is formed in the first insulating layer 12 .

[0093] Specifically, in the opening forming step, a resist is bonded to the other surface of the substrate M in the thickness direction.

[0094] Next, the resist is exposed and developed. Thus, the resist in the portion where the opening 11A is formed is removed. The substrate M is exposed in the portion where the opening 11A is formed. On the other hand, the resist in the portion where the opening 11A is not formed remains.

[0095] Next, the base material M exposed from the resist coating is etched to form an opening 11A. By forming the opening 11A in the base material M, the first insulating layer 12 is exposed in the opening 11A.

[0096] Next, the first insulating layer 12 exposed in the opening 11A is etched. By etching the first insulating layer 12 exposed in the opening 11A, the opening 12A is formed in the first insulating layer 12 .

[0097] The opening forming step is performed in a roll-to-roll manner. Specifically, in the opening forming step, the substrate M is pulled out from the fourth roll (the roll after the second insulating layer forming step), and the opening 11A is formed in the substrate M. Then, the substrate M with the opening 11A formed is wound into a fifth roll.

[0098] (5) Covering layer forming process

[0099] The cover layer forming step is performed after the opening forming step.

[0100] like Figure 4B As shown, in the cover layer forming step, a cover layer 1312 is formed on the conductor layer 1311 .

[0101] Specifically, in the cover layer forming step, first, a plating resist is attached to one surface of the base material M in the thickness direction and the other surface of the base material M in the thickness direction.

[0102] Next, the plating resist is exposed and developed, thereby removing the portion of the plating resist covering the conductive layer 1311 and exposing the conductive layer 1311 .

[0103] Next, for example, electroless nickel plating and electroless gold plating are sequentially performed to form a cover layer 1312 including an intermediate layer 1312B (nickel plating layer) and a surface layer 1312A (gold plating layer) on the conductor layer 1311 .

[0104] In addition, the intermediate layer 1312B (nickel plating layer) can be formed by nickel electroplating, and the surface layer 1312A (gold plating layer) can be formed by gold electroplating.

[0105] After the cover layer forming step is completed, the plating resist is peeled off.

[0106] The covering layer formation process is carried out in a roll-to-roll manner. Specifically, in the covering layer formation process, the substrate M is drawn from the fifth roll (the roll after the opening formation process), and the covering layer 1312 is formed on the conductive layer 1311. Then, the substrate M with the covering layer 1312 formed is wound into the sixth roll.

[0107] (6) Anti-plating layer forming process

[0108] The plating resist forming step is performed after the cover layer forming step.

[0109] like Figure 4C As shown, in the plating resist forming step, a plating resist R1 is formed to expose the terminals 131A and 131B.

[0110] Specifically, in the plating resist forming step, first, the plating resist R1 is bonded to one surface of the substrate M in the thickness direction.

[0111] Next, the plating resist R1 is exposed and developed, thereby removing the portion of the plating resist R1 where the solder plating layer 15 is to be formed, and exposing one side surface of each of the terminals 131A and 131B in the thickness direction.

[0112] Furthermore, a plating resist R2 may also be applied to the other side surface in the thickness direction of the substrate M. The plating resist R2 covers the entire other side surface in the thickness direction of the substrate M. Alternatively, a removable adhesive film may be applied to the other side surface in the thickness direction of the substrate M as a protective film instead of the plating resist R2.

[0113] The plating resist forming step is carried out in a reel-to-reel process. Specifically, in the plating resist forming step, the substrate M is unwound from the sixth reel (the reel after the cover layer forming step), and the plating resist R1 and the plating resist R2 are formed. Then, the substrate M with the plating resist R1 and the plating resist R2 formed thereon is wound into the seventh reel.

[0114] (7) Solder plating layer forming process

[0115] The solder plating layer forming step is performed after the plating resist forming step.

[0116] like Figure 5A As shown, in the solder plating layer forming step, the solder plating layer 15 is formed on the terminal 131A.

[0117] Specifically, solder plating layer 15 is formed on each of terminals 131A and 131B exposed from plating resist R1 by electroplating or chemical plating.

[0118] The solder plating layer forming process is carried out in a reel-to-reel manner. Specifically, in the solder plating layer forming process, the substrate M is unwound from the seventh reel (the reel after the plating resist forming process) to form the solder plating layer 15. The substrate M with the solder plating layer 15 formed thereon is then wound into the eighth reel.

[0119] Here, the base material M having the solder plating layer 15 formed thereon is wound without peeling off the plating resist R1. That is, the base material M having the solder plating layer 15 formed thereon is wound while the solder plating layer 15 is surrounded by the plating resist R1.

[0120] Therefore, if Figure 6 As shown, the plating resist R1 can suppress contact between the base material M and the solder plating layer 15 when the base material M is wound.

[0121] As a result, deformation of the terminal 131A can be suppressed.

[0122] Furthermore, the plating resist R2 on the other side of the substrate M in the thickness direction is stripped after the solder plating layer forming step and before the etching resist forming step. When stripping the plating resist R2, the substrate M is immersed in a stripping solution while the plating resist R1 is covered with, for example, a polyethylene terephthalate film. This allows the plating resist R2 to be stripped without stripping the plating resist R1.

[0123] Furthermore, in the plating resist forming step, when an adhesive film is used instead of the plating resist R2 as a protective film on the other side of the surface in the thickness direction of the substrate M, the adhesive film is peeled off from the substrate M after the solder plating forming step and before the etching resist forming step. The adhesive film does not require the use of a stripping solution like the plating resist R2, and can be physically peeled off from the substrate M.

[0124] (8) Anti-corrosion coating formation process

[0125] The etching resist forming step is performed after the solder plating forming step.

[0126] like Figure 5B As shown, in the resist forming step, a resist R11 as an example of a protective film is disposed on the plating resist R1, and a resist R12 is formed on the other surface of the substrate M in the thickness direction.

[0127] The corrosion resist R11 covers the solder plating layer 15. The corrosion resist R11 may cover the entire plating resist R1.

[0128] The corrosion resist R12 exposes a portion of the substrate M. Specifically, the corrosion resist R12 covers a portion of the substrate M where the metal supporting layer 11 is formed, and exposes the periphery of the portion where the metal supporting layer 11 is formed.

[0129] In the corrosion resist forming step, first, the corrosion resist R11 is bonded to the plating resist R1 , and the corrosion resist R12 is bonded to the other surface of the substrate M.

[0130] Next, the etching resist R12 is exposed and developed. As a result, the etching resist R12 covering the portion forming the metal supporting layer 11 remains, while the etching resist R12 surrounding the portion forming the metal supporting layer 11 is removed. This exposes the substrate M surrounding the portion forming the metal supporting layer 11. In this embodiment, the entire etching resist R11 is exposed and remains entirely after development.

[0131] The corrosion resistant coating formation process is carried out in a reel-to-reel manner. Specifically, in the corrosion resistant coating formation process, the substrate M is unwound from the eighth reel (the reel after the solder plating process), and the corrosion resistant coatings R11 and R12 are formed. Then, the substrate M with the corrosion resistant coatings R11 and R12 formed thereon is wound into the ninth reel.

[0132] (9) Shape processing

[0133] The outer shape processing step is performed after the resist coating forming step.

[0134] like Figure 5C As shown, in the outer shape processing step, the base material M is etched to form the outer shape of the metal supporting layer 11 (that is, the outer shape of the wired circuit board 1 ).

[0135] (10) Peeling process

[0136] The peeling step is performed after the outer shape processing step.

[0137] like Figure 5C and Figure 2 As shown, in the stripping step, the corrosion resist R11 is stripped together with the plating resist R1, and the corrosion resist R12 is also stripped at the same time.

[0138] As described above, the aforementioned wired circuit board 1 is obtained.

[0139] 3. Effects

[0140] (1) According to the manufacturing method of the wiring circuit substrate 1, Figure 5A and Figure 5B As shown, in the solder plating layer forming process (refer to Figure 5A ) after which the plating resist R1 is not peeled off and the etching resist is formed in the etching resist forming step (see Figure 5B ), an anti-corrosion coating R11 covering the solder plating layer 15 is arranged on the anti-plating layer R1.

[0141] Therefore, if Figure 6As shown, the base material M (the wired circuit board 1 in the process of being manufactured) on which the solder plating layer 15 is formed can be wound up in a state where the solder plating layer 15 is surrounded by the plating resist R1 .

[0142] Thus, when the base material M on which the solder plating layer 15 is formed is wound, the solder plating layer 15 can be protected by the plating resist R1 .

[0143] As a result, after the solder plating layer 15 is formed on the terminal 131A, deformation of the solder plating layer 15 and the terminal 131A can be suppressed.

[0144] (2) According to the manufacturing method of the wiring circuit substrate 1, Figure 5C As shown, after the resist coating forming step, the outer shape processing step is performed.

[0145] Therefore, in the solder plating layer forming process (refer to Figure 5A ) and before the outer shape processing step is completed, the solder plating layer 15 can be protected by the plating resist R1.

[0146] (3) According to the manufacturing method of the wiring circuit substrate 1, Figure 5C and Figure 2 As shown, in the stripping step, the etching resist R11 used in the outer shape processing step and the plating resist R1 used in the solder plating layer forming step can be stripped at the same time.

[0147] Therefore, it is possible to reduce man-hours.

[0148] (4) According to the method for manufacturing the wired circuit board 1, starting from the first insulating layer forming step (see Figure 3A ) to the outer shape processing process (refer to Figure 5C ) are carried out in a roll-to-roll manner.

[0149] Here, as described above, in the solder plating layer forming step (see Figure 5A ) Thereafter, the wired circuit board 1 in the process of being manufactured is wound up without peeling off the plating resist R1.

[0150] Therefore, in each step after the solder plating layer forming step, the solder plating layer 15 can be protected by the plating resist R1 .

[0151] 4. Modifications

[0152] In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and their description is omitted.

[0153] (1) Figure 7 As shown, one end portion of the terminal 131A in the longitudinal direction may be arranged on an edge portion of one side in the longitudinal direction of the opening 12A. In other words, the terminal 131A may be arranged so as to straddle the opening 12A.

[0154] (2) The metal supporting layer 11 may not have the opening 11A. The first insulating layer 12 may not have the opening 12A.

[0155] (3) Each step of the method for manufacturing the wired circuit board 1 is not limited to being performed in a roll-to-roll manner. Each step may be performed on a sheet-like substrate M.

[0156] The above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be construed as limiting. Modifications of the present invention that are obvious to those skilled in the art are within the scope of the claims.

[0157] Industrial applicability

[0158] The method for manufacturing a wired circuit board of the present invention can be used for manufacturing a wired circuit board.

Claims

1. A method for manufacturing a wiring circuit substrate, wherein: The wiring circuit substrate comprises: a metal support layer; a circuit pattern having terminals; an insulating layer disposed between the metal support layer and the circuit pattern; as well as a solder plating layer disposed on the terminal, The manufacturing method of the wiring circuit substrate includes: an insulating layer forming step of forming the insulating layer on one surface of a metal substrate; a pattern forming step of forming the circuit pattern on the insulating layer; a plating resist forming step of forming a plating resist that exposes the terminals; a solder plating layer forming step of forming a solder plating layer on the terminal; and A protection step of disposing a protection film covering the solder plating layer on the plating resist layer.

2. The method for manufacturing a wired circuit board according to claim 1, wherein: The method for manufacturing a wired circuit board further includes a contour processing step, in which, after the protection step, the base material is etched to form the metal support layer. The protective film is an anti-corrosion coating, In the protection step, a second resist coating is formed on the other surface of the substrate so as to expose a portion of the substrate.

3. The method for manufacturing a wired circuit board according to claim 2, wherein: The method for manufacturing a wired circuit board further includes a stripping step of stripping the corrosion resist together with the plating resist after the outer shape processing step.

4. The method for manufacturing a wired circuit board according to any one of claims 1 to 3, wherein: The insulating layer forming step, the pattern forming step, the plating resist forming step, the solder plating layer forming step, and the protecting step are performed in a roll-to-roll manner.

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