Electromagnetic interference shield extending under memory module

Abstract

The invention relates to an electromagnetic interference shield extending below a memory module. Apparatuses and systems for shielding electromagnetic interference and methods of forming the same are disclosed herein. In one example, an electromagnetic interference (EMI) shield includes a housing for substantially enclosing a memory module. The housing is configured to extend at least partially below the memory module when the housing and the memory module are coupled to the circuit board. The housing may also be openable or at least partially removable.

Description

Background Art

[0001] Electromagnetic interference (EMI) shielding is crucial for protecting electronic components, such as memory modules, from the effects of EMI. However, as the size of electronic devices continues to shrink, designing effective EMI shields becomes challenging due to space constraints. For example, as printed circuit boards (PCBs) become smaller and components on the PCBs are spaced closer together, the PCB ground contacts and vias of the EMI shield may interfere with other components on the PCB. Therefore, a less effective EMI shield may be used to accommodate the space constraints, or alternatively, a larger PCB may be used to eliminate the space constraints and avoid sacrificing EMI shielding efficiency. In either case, a compromise is made between EMI shielding efficiency and PCB size. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Figure 1 An example of a system with a one-piece semi-rigid extended EMI shield for a memory module is illustrated.

[0003] Figure 2A-2E An example of a one-piece semi-rigid extended EMI shield for a memory module is shown.

[0004] Figure 3A-3C An example of an EMI gasket in a one-piece semi-rigid extended EMI shield is shown.

[0005] Figure 4 An example of a one-piece semi-rigid extended EMI shield is shown having a bottom edge designed for optimal placement of a ground connection.

[0006] Figures 5A-5D A perspective view of a system with a one-piece semi-rigid extended EMI shield for a memory module is shown.

[0007] Figures 6A-6E An example process flow for assembling a system having a one-piece semi-rigid extension is illustrated.

[0008] Figures 7A-7E Another example process flow for assembling a system having a one-piece semi-rigid extension is illustrated.

[0009] Figure 8 An example of a system with a two-piece extended EMI shield for a memory module is shown.

[0010] Figure 9An example of a two-piece extended EMI shield for a memory module is shown.

[0011] Figures 10A-10C An example process flow for a system for assembling an EMI shield having a two-piece extension is illustrated.

[0012] Figure 11 The figure shows a graph of the EMI shielding performance of an extended EMI shield for a memory module.

[0013] Figure 12 Illustrated is a cross-sectional side view of an integrated circuit device assembly in accordance with some embodiments.

[0014] Figure 13 A block diagram of an example electrical device is illustrated in accordance with certain embodiments. DETAILED DESCRIPTION

[0015] Electromagnetic interference (EMI) is interference caused by electromagnetic fields that can potentially disrupt the operation of electronic devices, potentially leading to degradation of performance, reliability, and / or safety. Effective EMI mitigation techniques, such as EMI shielding and grounding, are critical to preventing or minimizing the negative effects from EMI and ensuring the proper operation of electronic devices. For example, EMI shields (also known as EMI fences, cans, cages, etc.) are devices designed to block or reduce EMI between electronic components. EMI shields come in a variety of forms—including housings, cans, cages, covers, barriers, and sheets—and can be designed to fully or partially enclose electronic components or devices. In addition, EMI shields are typically made of conductive materials (e.g., metals such as aluminum and copper) that absorb or reflect electromagnetic waves, thereby preventing them from penetrating or escaping the shielded area. Therefore, EMI shields play an important role in minimizing EMI and ensuring reliable operation of electronic devices and systems.

[0016] In some cases, for example, EMI shields can be used to protect memory modules, such as dual in-line memory modules (DIMMs) or small outline dual in-line memory modules (SODIMMs), from EMI. A good EMI shield for a removable memory module typically requires a complete enclosure around the memory module to provide effective EMI shielding (e.g., a Faraday cage), as well as a mechanism for opening or removing the EMI shield to enable the end user to upgrade the memory module. To meet these requirements, removable memory modules (such as SODIMMs) typically use clip-on EMI cans for EMI shielding, which are EMI enclosures designed to snap into and out of clips attached to grounding strips / pads on a printed circuit board (PCB).

[0017] However, if the SODIMM connector / module is placed too close to the system-on-chip (SoC) and / or central processing unit (CPU), the PCB grounding bar / pad of the EMI can cannot be placed on the side of the SODIMM module adjacent to the SoC / CPU due to space constraints, as this may interfere with the memory microstrip routing near the SoC / CPU. Therefore, a three-sided EMI can is used because there is no PCB grounding bar / pad on the fourth side, which makes the EMI can open on one side, thereby trading smaller PCB size for EMI shielding efficiency.

[0018] Alternatively, the SODIMM connector / module can be positioned further away from the SoC / CPU to make room for a PCB grounding bar / pad on the fourth side of the EMI can, which allows the use of a four-sided EMI can to completely enclose the memory module. However, this requires the SODIMM connector / module, EMI shield, and PCB grounding bar / pad to be shifted a relatively significant distance (e.g., approximately 13 mm), which increases the size of the PCB and also requires longer memory traces (e.g., double data rate (DDR) memory microstrip traces).

[0019] Another option is to use EMI absorbent sheets to encapsulate the entire top and bottom of the SODIMM area. However, EMI absorbent sheets have an adhesive backing, are less effective for repeated use, and are not as environmentally friendly as rigid EMI cans. Poor-quality EMI absorbent sheets often leave adhesive residue after they are removed and replaced. EMI absorbent sheets are also generally more expensive than EMI cans.

[0020] Accordingly, the present disclosure provides an embodiment of an EMI shield that extends below the memory module, which enables the PCB ground contacts and plated through holes (PTHs) on the side of the EMI shield adjacent to the SoC / CPU to be moved away from the SoC / CPU without moving the memory connector, memory module, or EMI shield. In this way, the EMI shield supports a smaller PCB size without sacrificing EMI shielding efficiency because the PCB ground contacts and PTHs do not interfere with the memory wiring breakout area, and the EMI shield still fully encapsulates the memory module. The EMI shield also supports a mechanism for opening or removing the EMI housing, thereby enabling the memory module to be replaced or upgraded.

[0021] The embodiments described can provide various advantages. Specifically, the EMI shield design provides an encapsulated and removable EMI housing without compromising PCB size or EMI shielding efficiency. For example, the EMI shield design avoids the need for a larger PCB to accommodate grounding strips / pads on the PCB, resulting in savings in PCB size and cost, which is particularly advantageous for small form factors. The savings in PCB size can also be used for other performance benefits, such as maximizing battery area to increase battery size and capacity. In addition, the EMI shield design provides more effective EMI shielding by utilizing ground contacts / plated through holes (PTHs) placed in optimal locations below the memory modules (e.g., to avoid crowded memory breakout areas and maximize the number of grounded PTHs connected to the grounding strips / pads of the EMI shield). In addition, the extended EMI shield is cheaper and more sustainable than EMI absorbent sheets because leftover residue from the EMI absorbent sheets is avoided.

[0022] The size and cost savings, along with the potential for increased battery size and other performance enhancements, are particularly beneficial for devices with relatively small form factors (e.g., laptops and other small / portable computing devices). In some embodiments, for example, the extended EMI shield can be used with SODIMM modules (e.g., SODIMM / M.2 modules), which are commonly used in small form factor devices.

[0023] Various embodiments of EMI shields designed to extend beneath memory modules are presented throughout this disclosure. Specifically, Figure 1 - FIG. 7 shows an embodiment of a one-piece semi-rigid extended EMI enclosure with an openable top or lid, Figure 8-Figure 1 0 shows an embodiment of a two-piece extended EMI housing with a removable cover.

[0024] Figure 1 An example of a system 100 is shown having a one-piece semi-rigid extended EMI shield 114 for a memory module 110 (e.g., a SODIMM). In the illustrated embodiment, the EMI shield 114 extends or wraps under the memory module 110 adjacent to a system-on-chip (SoC) 106, which enables associated ground plated through holes (PTHs) 104 in a printed circuit board (PCB) 102 (e.g., on a side of the EMI shield 114 adjacent to the SoC 106) to be displaced away from the SoC 106 without moving the memory connector 108, the memory module 110, or the EMI shield 114. In this way, the ground PTH 104 and associated ground contacts (not shown) in the PCB 102 do not interfere with the memory routing channels 103a, 103b in the PCB 102 (e.g., near the SoC 106), and the EMI shield 114 still completely encapsulates the memory module 110, which enables the size of the PCB 102 to be reduced without sacrificing EMI shielding efficiency. The EMI shield 114 also includes a mechanism for opening the housing, which enables the memory module 110 to be replaced or upgraded. Specifically, the EMI shield 114 is a continuous, single-piece semi-rigid housing with a flexible interface 115 at the top / side edge adjacent to the SoC 106, which enables the EMI housing 114 to be opened and closed.

[0025] The components of system 100 will now be described in greater detail. In the illustrated embodiment, system 100 includes a PCB 102, an SoC 106 coupled to PCB 102 (e.g., via interconnects / bumps 105), a memory connector 108 (e.g., a SODIMM connector) coupled to PCB 102, a memory module 110 (e.g., a SODIMM module) removably coupled to memory connector 108 (and indirectly coupled to PCB 102 via memory connector 108), and an extended EMI shield 114 coupled to PCB 102 to enclose memory module 110 and associated memory connector 108.

[0026] PCB 102 includes a ground PTH 104 (e.g., a PTH coupled to ground) and memory traces 103a-b. EMI shield 114 is coupled to ground PTH 104, and ground PTH 104 couples EMI shield 114 to ground (e.g., connects EMI shield 114 to ground). Memory traces 103a-b provide memory channels between SoC 106 and corresponding memory modules 110. PCB 102 may also include various other components (not shown), such as ground contacts (e.g., ground strips / pads) on the surface of PCB 102 coupled to ground PTH 104, additional interconnect traces (e.g., conductive traces, vias, pads) for power and signal transmission and reception, and the like.

[0027] The memory connector 108 may include any suitable type of memory connector, such as a SODIMM connector. Similarly, the memory modules 110 may include any suitable type of memory modules, such as a SODIMM module. In the illustrated embodiment, the memory modules 110 are removable, and each memory module 110 includes a plurality of memory chips 112 (e.g., dynamic random access memory (DRAM)).

[0028] SoC 106 may include various components integrated on the same die, chip, or package, including, but not limited to, one or more processors (e.g., a central processing unit (CPU)), an XPU, a graphics processing unit (GPU), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a network interface controller (NIC), persistent storage devices, input / output (I / O) devices and controllers, and / or memory devices and controllers. In other embodiments, some or all of the components of SoC 106 may be implemented as independent components (e.g., separate from the SoC), which may be coupled to PCB 102 individually or separately.

[0029] System 100 may also include various other components (not shown), such as a display, input devices, sensors, thermal management solutions (eg, a heat sink on top of SoC 106 ), and the like.

[0030] EMI shield 114 may be used with any suitable type of memory module 110 or other electronic component that may require EMI shielding.EMI shield 114 is described in further detail in conjunction with Figures 2-7, which present examples of a one-piece semi-rigid extended EMI shield.

[0031] Figure 2A-2E An example of a one-piece semi-rigid extended EMI shield 200 for memory modules (e.g., SODIMMs) is illustrated. In the illustrated embodiment, the EMI shield 200 is a continuous, one-piece semi-rigid shell designed to extend or wrap under the edge of one of the memory modules, enabling corresponding ground plated through holes (PTHs) and ground contacts (e.g., ground strips / pads) on a printed circuit board (PCB) to be repositioned under the memory module (e.g., away from other nearby components, such as an SoC / CPU) without moving the memory module, memory connector, or EMI shield 200 on the PCB. In this way, the ground PTHs and associated ground contacts on the PCB do not interfere with other nearby components on the PCB (such as the memory routing of the SoC / CPU), and the EMI shield 200 still fully encapsulates the memory module, enabling the size of the PCB to be reduced without sacrificing EMI shielding effectiveness. The EMI shield 200 also includes a flexible interface 204 that enables the housing to be opened and closed, thereby allowing the memory module to be inserted / removed after the EMI shield 200 is attached to the PCB.

[0032] In the illustrated embodiment, the EMI shield 200 includes a housing designed to substantially enclose the memory module when attached to a PCB (or another substrate). Specifically, the EMI shield housing 200 includes a top 202, sidewalls 203a-203d, and a bottom 206. The top 202 is designed to extend over or cover the top of the memory module. The sidewalls 203a-203d are designed to extend around or around the sides / perimeter of the memory module. The bottom 206 is designed to extend at least partially under the memory module (e.g., to enable ground PTHs / contacts on the PCB to be relocated under the memory module).

[0033] EMI shield 200 also includes a flexible interface 204 that enables the housing to be opened and closed. In the illustrated embodiment, for example, flexible interface 204 is located at the edge between top 202 and sidewall 203d adjacent to bottom 206. In some embodiments, flexible interface 204 can be formed by preforming or bending the semi-rigid EMI shield housing 200 along the edge where flexible interface 204 is located. In this way, flexible interface 204 acts as a hinge, enabling top 202 (and three of the sidewalls 203a-203c) to be opened and closed, thereby acting as an openable cover that remains attached to the housing.

[0034] EMI shield 200 also includes corner sidewall covers 207 for covering the openings / slits at the corners of sidewalls 203b, 203c, and 203d adjacent to flexible interface 204. In the illustrated embodiment, corner sidewall covers 207 extend from each end of sidewall 203d and are preformed to bend at an angle slightly less than 90 degrees, thereby extending slightly above sidewalls 203b and 203c. In this way, when EMI housing 200 is closed, the natural resiliency of corner sidewall covers 207 ensures they make good contact with EMI housing 200, thereby maintaining a seal.

[0035] The EMI shield 200 also includes three circular mechanical feet 208 on the bottom 206 of the housing that are designed to attach to a PCB for structural support, particularly when opening and closing the EMI housing 200 .

[0036] The EMI shield 200 also includes edge feet 210 on the bottom 206 of the housing, which are conductive edges designed for electrical coupling (eg, soldering) to ground contacts (eg, strips / pads) on the PCB and associated ground PTHs.

[0037] In some embodiments, for example, edge feet 210 may be soldered to a grounding strip / pad on the PCB to permanently attach (and ground) the bottom 206 of the housing to the PCB, while top 202 and three of the side walls 203a-203c may be removably coupled to clips attached to the grounding strip / pad of the PCB, enabling the portions to be opened and closed (e.g., via flexible interface 204) by snapping the clips in and out while remaining grounded when closed.

[0038] exist Figure 2A , one-piece semi-rigid EMI housing 200 is shown prior to assembly (eg, before the edges between the respective top 202 , sides 203 a - 203 d , and bottom 206 are bent to form housing 200 into an enclosure).

[0039] exist Figure 2B , EMI housing 200 is shown in an open position (eg, with top 202 and three of the side walls 203a - 203c open).

[0040] exist Figure 2C , a cross-sectional view of the EMI housing 200 is shown in a closed position.

[0041] exist Figure 2D , an enlarged view of EMI housing 200 is shown to further detail flexible interface 204 and corner sidewall covers 207.

[0042] exist Figure 2E , another enlarged view of EMI housing 200 is shown to further detail corner sidewall covers 207, conductive edge feet 210, and mechanical feet 208.

[0043] Figure 3A-3C An example of an EMI gasket 216 within the extended EMI shield 200 is shown. Specifically, the EMI gasket 216 is inserted into (e.g., within) the corner sidewall cover 207 to completely seal the remaining open area around the corner sidewall cover 207. The EMI gasket 216 is typically used to provide EMI shielding in specific areas of an enclosure, such as between mating surfaces. The EMI gasket 216 is typically made of a conductive material, such as a metal, a conductive elastomer, and / or a metal-coated elastomer. In this manner, the EMI gasket 216 provides a conductive barrier that absorbs or reflects electromagnetic radiation, thereby preventing the passage of electromagnetic radiation.

[0044] Figure 4 An example of an integral, semi-rigid extended EMI shield 400 is shown, having a bottom edge designed for optimal placement of PCB ground connections. In the illustrated embodiment, EMI shield 400 is similar to EMI shield 200, except that the edge of bottom 206 has been reshaped to reflect the optimal placement of ground contacts (e.g., bars / pads) and plated through holes (PTHs) on the PCB. For example, by utilizing EMI shield extension 206 positioned below the memory module, ground bars / pads and PTHs can be placed anywhere within the available PCB space by customizing the shape of the bottom edge of extension 206. In this way, the design of EMI shield 400 enables flexible ground contact / PTH placement on the PCB, as there are no placement constraints tied to the external footprint of EMI shield 400. Consequently, the number of ground PTHs can be increased while reducing the spacing between them (e.g., to approximately 3 mm), thereby increasing PTH density and improving EMI shielding effectiveness.

[0045] Figures 5A-5DA perspective view of a system 500 is shown having a one-piece semi-rigid extended EMI shield 514 for a memory module 510. In some embodiments, the EMI shield 514 may be implemented using the design of the EMI shields 200, 400.

[0046] In the illustrated example, the system 500 includes a PCB 502, a memory connector 508 (e.g., a SODIMM connector) coupled to the PCB 502, a memory module 510 (e.g., a SODIMM module) removably coupled to the memory connector 508, memory chips 512 (e.g., DRAMs) on the memory module 510, an EMI shield 514 (having an extension 515 partially positioned beneath the memory module 510) covering the memory module 510, and a collection of clips 516 coupled to ground contacts (e.g., strips / pads) and associated plated through holes (PTHs) on the PCB 502.

[0047] In the illustrated embodiment, the bottom 515 of the EMI shield 514 is soldered to a grounding strip / pad on the PCB 502, thereby permanently attaching and grounding the bottom 515 of the shield 514 to the PCB 502. However, the top and three of the side walls of the EMI shield 514 are removably coupled to clips 516 that are attached to the grounding strip / pad of the PCB, which enables the EMI shield 514 to be opened and closed by snapping the clips in and out while remaining grounded when closed.

[0048] exist Figure 5A , EMI shield 514 is shown in a closed position, and an enlarged view of clip 516 is also shown.

[0049] exist Figure 5B , the EMI shield 514 is shown in an open position, and the memory connector 508, memory module 510, and memory chip 512 are also shown.

[0050] exist Figure 5C , the EMI shield 514 is shown in a closed position in a transparent manner to depict the memory connector 508, memory module 510, and memory chip 512 housed within the shield 514.

[0051] exist Figure 5D In FIG, a cross-sectional view of the EMI shield 514 in a closed position is shown in a transparent manner to depict the memory connector 508, memory module 510 and memory chip 512 housed within the shield 514, as well as the extension 515 below the memory module 510.

[0052] Figures 6A-6EAn example process flow is shown for assembling a system 600 having a one-piece semi-rigid extension 614. In some embodiments, the EMI shield 614 can be implemented using the designs of the EMI shields 200 and 400. It should be appreciated in light of this disclosure that the illustrated process flow is merely one example method for implementing the system 600 having a one-piece semi-rigid extension 614.

[0053] In the illustrated example, the process flow is optimized to reduce the number of reflow steps by pre-inserting the EMI shield 614 into the clip 616 , thereby reducing two reflow steps, one for the EMI shield 614 and the other for the clip 616 , to a single reflow step.

[0054] exist Figure 6A 6. In the embodiment of the present invention, a printed circuit board (PCB) 602, a system on a chip (SoC) 606, a memory connector 608 (e.g., a SODIMM connector), a collection of clips 616, and an electromagnetic interference (EMI) shield 614 are received. The EMI shield 614 includes a top and a bottom, wherein the bottom is designed to extend at least partially under the memory module (e.g., a SODIMM module) and the top is openable (e.g., an openable cover). In addition, the EMI shield 614 is "pre-inserted" into the clip 616. For example, the EMI shield 614 is inserted into the clip 616 (or the clip 616 is clipped onto the EMI shield 614) before the components are attached to the PCB 602, thereby enabling the EMI shield 614 and the clip 616 to be attached to the PCB 602 through a single reflow process.

[0055] exist Figure 6B In FIG. 6 , the SoC 606 , memory connector 608 , clip 616 , and EMI shield 614 (pre-inserted into the clip 616 ) are picked and placed on the PCB 602 and attached via reflow.

[0056] exist Figure 6C , the top / cover of the EMI shield 614 is open.

[0057] exist Figure 6D , a memory module 610 (eg, a SODIMM module) is inserted into the memory connector 608.

[0058] exist Figure 6E , the top / lid of the EMI shield 614 is closed.

[0059] Figures 7A-7EAnother example process flow is shown for forming a system 600 having a one-piece semi-rigid extension 614. In some embodiments, the EMI shield 614 can be implemented using the designs of the EMI shields 200 and 400. It should be appreciated in light of this disclosure that the illustrated process flow is merely one example method for implementing the system 600 having a one-piece semi-rigid extension 614.

[0060] In the illustrated example, temporary standoffs 618 are used to hold the EMI shield 614 during the reflow process (the temporary standoffs 618 are removed after the memory module 610 is inserted) to optimize the process flow to reduce the number of reflow steps.

[0061] exist Figure 7A In the embodiment, a printed circuit board (PCB) 602, a system on a chip (SoC) 606, a memory connector 608 (eg, a SODIMM connector), a collection of clips 616 and electromagnetic interference (EMI) shield 614, and temporary standoffs 618 are received.

[0062] exist Figure 7B 6, SoC 606, memory connector 608, clip 616, and EMI shield 614 are picked and placed on PCB 602, with temporary standoffs 618 inserted between PCB 602 and the openable end of EMI shield 614. The components are then attached to PCB 602 via reflow.

[0063] exist Figure 7C , the top / cover of the EMI shield 614 is open.

[0064] exist Figure 7D , the temporary standoffs 618 are removed and the memory module 610 (eg, a SODIMM module) is inserted into the memory connector 608.

[0065] exist Figure 7E , the top / lid of the EMI shield 614 is closed.

[0066] Figure 8An example of a system 800 is shown having a two-piece extended EMI shield 814 for memory modules 110. In the illustrated embodiment, system 800 is similar to system 100, except that EMI shield 814 is designed as a two-piece housing having a bottom 814a (e.g., a base) and a top 814b (e.g., a removable cover) (collectively referred to as EMI shield 814). In addition, EMI shield 814 is partially removable. For example, cover 814b can be designed to clip or snap onto base 814a or to detach or remove from base 814a. In this way, cover 814b can be removed to add and / or remove memory modules 110.

[0067] Furthermore, the EMI shield 814 extends under or wraps under the memory module 110 adjacent to the SoC 106, which enables the associated ground PTHs 104 in the PCB 102 (e.g., on the side of the EMI shield 814 adjacent to the SoC 106) to be shifted away from the SoC 106 without moving the memory connectors 108, the memory modules 110, or the EMI shield 814. In this way, the ground PTHs 104 and associated ground contacts (not shown) in the PCB 102 do not interfere with the memory routing channels 103a, 103b in the PCB 102 (e.g., near the SoC 106), and the EMI shield 114 still fully encapsulates the memory module 110, which enables the size of the PCB 102 to be reduced without sacrificing EMI shielding effectiveness.

[0068] Figure 9 An example of a two-piece extended EMI shield 900 for a memory module (e.g., a SODIMM) is illustrated. In the illustrated embodiment, the EMI shield 900 is a two-piece EMI housing having a bottom 902 (referred to as a base) and a top 904 (referred to as a lid) that together are designed to substantially enclose the memory module when attached to a printed circuit board (PCB) (or another substrate).

[0069] The base 902 includes sidewalls designed to extend around or encircle the sides / perimeter of the memory modules. The cover 904 includes a top cover designed to extend over or cover the top of the memory modules, and sidewalls designed to overlap corresponding sidewalls on the base 902. In addition, the cover 904 is removable and can be designed to be clipped or snapped onto the base 902 or detached or removed from the base 902, thereby enabling the addition or removal of memory modules after the EMI shield 900 has been assembled.

[0070] In addition, the base 902 of the EMI shield 900 includes a bottom extension 906 that is designed to extend or wrap under the edge of one of the memory modules, which enables corresponding ground contacts (e.g., bars / pads) and plated through holes (PTHs) on the PCB to be repositioned under the memory module (e.g., away from other nearby components, such as the SoC / CPU) without shifting the memory module, memory connector, or EMI shield 900 on the PCB. In this way, the ground contacts and PTHs on the PCB do not interfere with other nearby components on the PCB (such as the memory routing of the SoC / CPU), and the EMI shield 900 still fully encapsulates the memory module, which enables the size of the PCB to be reduced without sacrificing EMI shielding effectiveness.

[0071] The EMI shield 900 also includes three circular mechanical feet 908 located on the bottom extension 906 of the base 902 that are designed to be attached to a PCB to provide structural support.

[0072] The EMI shield 900 also includes edge feet 910 located on the bottom extension 906 of the base 902, which are conductive edges designed for electrical coupling (e.g., soldering) to ground contacts (e.g., strips / pads) and associated ground PTHs on the PCB.

[0073] In some embodiments, for example, edge feet 910 on the base 902 and bottom extension 906 may be soldered to grounding strips / pads on the PCB to permanently attach (and ground) the base 902 of the housing 900 to the PCB, while the removable cover 904 may be removably clipped or snapped onto or detached or removed from the base 902.

[0074] Figures 10A-10C An example process flow is illustrated for forming a system 1000 having a two-piece extension EMI shield 1014. In some embodiments, EMI shield 1014 can be implemented using the design of EMI shield 900. It should be appreciated in light of this disclosure that the illustrated process flow is merely one example method for implementing system 1000 having a two-piece extension EMI shield 1014.

[0075] exist Figure 10AIn the embodiment of the present invention, a printed circuit board (PCB) 1002, a memory connector 1008 (e.g., a SODIMM connector), and an electromagnetic interference (EMI) shield 1014 are received. The EMI shield 1014 includes a bottom (base) 1014a and a top (removable cover) 1014b (collectively referred to as the EMI shield 1014), wherein the bottom 1014a includes sidewalls and a bottom extension 1015, the bottom extension 1015 being configured to extend at least partially under the edge of one of the memory modules (e.g., a SODIMM), and the top 1014b is removable (e.g., a removable cover). The memory connector 1008 and the base 1014a of the EMI shield 1014 are picked and placed on the PCB 1002 and attached via reflow. In some embodiments, other components may also be attached to the PCB 1002 (e.g., an SoC).

[0076] exist Figure 10B In FIG. 1 , a memory module 1010 (eg, a SODIMM) having memory chips 1012 (eg, DRAM) is inserted into the memory connector 1008 .

[0077] exist Figure 10C , after the memory module 1010 is inserted into the memory connector 1008, the top 1014b of the EMI shield 1014 (e.g., a removable cover) is attached or clipped to the bottom 1014a of the EMI shield 1014 (e.g., a base).

[0078] Figure 11 A graph 1100 illustrating the EMI shielding performance of an extended EMI shield is shown. Specifically, graph 1100 shows the electromagnetic radiation detected when no shield is used (1101) relative to the electromagnetic radiation detected when the extended EMI shield is used (1102). In the illustrated performance evaluation, a SODIMM module and associated connector were implemented on a PCB, and a Wi-Fi antenna was placed approximately 1 inch from the edge of the SODIMM module. Radiation from the SODIMM was captured by simulating the coupling between a microstrip on the SODIMM module and the Wi-Fi antenna. As shown in performance graph 1100, the extended EMI shield design 1102 provides shielding effectiveness exceeding 10 decibels (dB) across all Wi-Fi frequency bands. Thus, the extended EMI shield 1102 has similar or better shielding effectiveness than a conventional EMI shield while providing other benefits, such as a smaller PCB size and optimized ground PTH placement.

[0079] Figure 121 is a cross-sectional side view of an integrated circuit device assembly 1200, which may include any of the embodiments disclosed herein. In some embodiments, for example, IC components 1220, 1224, 1226, 1232 of integrated circuit device assembly 1200 may include one or more EMI shields (e.g., EMI shield 114, EMI shield 200, EMI shield 400, EMI shield 514, EMI shield 614, EMI shield 814, EMI shield 900, EMI shield 1014) according to any of the embodiments disclosed herein, such as an EMI shield that extends partially under one or more memory modules.

[0080] In some embodiments, integrated circuit device assembly 1200 may be a microelectronic assembly. Integrated circuit device assembly 1200 includes several components disposed on a circuit board 1202 (which may be a motherboard, system board, host board, etc.). Integrated circuit device assembly 1200 includes components disposed on a first side 1240 of circuit board 1202 and an opposing second side 1242 of circuit board 1202; generally, components may be disposed on one or both of sides 1240 and 1242. Any of the integrated circuit components discussed below with reference to integrated circuit device assembly 1200 may take the form of any suitable embodiment of the microelectronic assembly embodiments disclosed herein.

[0081] In some embodiments, circuit board 1202 can be a printed circuit board (PCB) that includes multiple metal (or interconnect) layers separated from each other by layers of dielectric material and interconnected by conductive vias. Each metal layer includes conductive traces. Any one or more of the metal layers can be formed in a desired circuit pattern to route electrical signals between components coupled to circuit board 1202 (optionally, in conjunction with other metal layers). In other embodiments, circuit board 1202 can be a non-PCB substrate. Figure 12 The integrated circuit device assembly 1200 shown in FIG. 1 includes a package-on-interposer structure 1236 coupled to a first side 1240 of a circuit board 1202 via a coupling component 1216. The coupling component 1216 can electrically and mechanically couple the package-on-interposer structure 1236 to the circuit board 1202 and can include solder balls (e.g., solder balls). Figure 12), pins (e.g., as part of a pin grid array (PGA)), contacts (e.g., as part of a land grid array (LGA)), male and female portions of a socket, adhesive, underfill material, and / or any other suitable electrical and / or mechanical coupling structure. Coupling component 1216 can function as a coupling component as illustrated or described for any of the substrate assemblies or substrate assembly components described herein, as appropriate.

[0082] The package-on-interposer structure 1236 may include an integrated circuit component 1220 coupled to the interposer 1204 via a coupling component 1218. The coupling component 1218 may take any suitable form for the application, such as those discussed above with reference to the coupling component 1216. Figure 12 A single integrated circuit component 1220 is shown in FIG, but multiple integrated circuit components can be coupled to interposer 1204; in fact, additional interposers can be coupled to interposer 1204. Interposer 1204 can provide an intermediate substrate for bridging circuit board 1202 and integrated circuit components 1220.

[0083] Integrated circuit component 1220 can be a packaged or unpackaged integrated circuit product that includes one or more integrated circuit dies and / or one or more other suitable components. A packaged integrated circuit component includes one or more integrated circuit dies mounted on a packaging substrate, where the integrated circuit die and packaging substrate are encapsulated in a housing material such as metal, plastic, glass, or ceramic. In one example of an unpackaged integrated circuit component 1220, a single monolithic integrated circuit die includes solder bumps attached to contacts on the die. The solder bumps allow the die to be directly attached to interposer 1204. Integrated circuit component 1220 can include one or more computing system components, such as one or more processor units (e.g., a system on a chip (SoC), a processor core, a graphics processor unit (GPU), an accelerator, a chipset processor), an I / O controller, a memory, or a network interface controller. In some embodiments, integrated circuit component 1220 can include one or more additional active or passive devices, such as capacitors, decoupling capacitors, resistors, inductors, fuses, diodes, transformers, sensors, electrostatic discharge (ESD) devices, and memory devices.

[0084] In embodiments where integrated circuit component 1220 includes multiple integrated circuit dies, the dies may be of the same type (a homogeneous multi-die integrated circuit component) or of two or more different types (a heterogeneous multi-die integrated circuit component). A multi-die integrated circuit component may be referred to as a multi-chip package (MCP) or a multi-chip module (MCM).

[0085] In addition to including one or more processor units, the integrated circuit component 1220 may also include additional components such as embedded DRAM, stacked high bandwidth memory (HBM), shared cache memory, input / output (I / O) controller, or memory controller. Any of the additional components can be located on the same integrated circuit die as the processor unit, or on one or more integrated circuit dies separate from the integrated circuit die that includes the processor unit. These separate integrated circuit dies may be referred to as "chiplets". In embodiments where the integrated circuit component includes multiple integrated circuit dies, the interconnections between the dies may be provided by a package substrate, one or more silicon interposers, one or more silicon bridges embedded in the package substrate (such as, An embedded multi-die interconnect bridge (EMIB) or a combination of the above is provided.

[0086] In general, the interposer 1204 can stretch connections to a wider pitch or reroute connections to different connections. For example, the interposer 1204 can couple the integrated circuit component 1220 to a collection of ball grid array (BGA) conductive contacts of the coupling component 1216 to couple to the circuit board 1202. Figure 12 In the embodiment illustrated in FIG, integrated circuit component 1220 and circuit board 1202 are attached to opposite sides of interposer 1204; in other embodiments, integrated circuit component 1220 and circuit board 1202 can be attached to the same side of interposer 1204. In some embodiments, three or more components can be interconnected via interposer 1204.

[0087] In some embodiments, interposer 1204 can be formed as a PCB comprising multiple metal layers separated from one another by layers of dielectric material and interconnected by conductive vias. In some embodiments, interposer 1204 can be formed from epoxy, glass-reinforced epoxy, epoxy with inorganic fillers, ceramic materials, or polymer materials such as polyimide. In some embodiments, interposer 1204 can be formed from alternative rigid or flexible materials, including the same materials described above for use in semiconductor substrates, such as silicon, germanium, and other III-V and IV materials. The interposer 1204 may include metal interconnects 1208 and through-holes 1210, including but not limited to through hole vias 1210-1 (extending from the first side 1250 of the interposer 1204 to the second side 1254 of the interposer 1204), blind vias 1210-2 (extending from the first side 1250 or the second side 1254 of the interposer 1204 to the intermediate metal layer), and buried vias 1210-3 (connecting the intermediate metal layer).

[0088] In some embodiments, interposer 1204 may include a silicon interposer. Through silicon vias (TSVs) extending through the silicon interposer may connect connections on a first side of the silicon interposer to an opposite second side of the silicon interposer. In some embodiments, interposer 1204, including a silicon interposer, may further include one or more routing layers for routing connections on the first side of interposer 1204 to the opposite second side of interposer 1204.

[0089] Interposer 1204 may further include embedded devices 1214, which may include both passive and active devices. Such devices may include, but are not limited to, capacitors, decoupling capacitors, resistors, inductors, fuses, diodes, transformers, sensors, electrostatic discharge (ESD) devices, and memory devices. More complex devices (such as radio frequency devices, power amplifiers, power management devices, antennas, arrays, sensors, and microelectromechanical systems (MEMS) devices) may also be formed on interposer 1204. Interposer-on-package structure 1236 may take the form of any structure known in the art as an interposer-on-package structure. In an embodiment, the interposer is a non-printed circuit board.

[0090] Printed circuit device assembly 1200 may include an integrated circuit component 1224 coupled to first side 1240 of circuit board 1202 via coupling component 1222. Coupling component 1222 may take the form of any of the embodiments discussed above with reference to coupling component 1216, and integrated circuit component 1224 may take the form of any of the embodiments discussed above with reference to integrated circuit component 1220.

[0091] Figure 12 The integrated circuit device assembly 1200 illustrated in FIG. 1 includes a package-on-package structure 1234 coupled to a second side 1242 of a circuit board 1202 via a coupling component 1228. The package-on-package structure 1234 may include an integrated circuit component 1226 and an integrated circuit component 1232 coupled together via a coupling component 1230, such that the integrated circuit component 1226 is disposed between the circuit board 1202 and the integrated circuit component 1232. The coupling components 1228 and 1230 may take the form of any of the embodiments of the coupling component 1216 discussed above, and the integrated circuit components 1226 and 1232 may take the form of any of the embodiments of the integrated circuit component 1220 discussed above. The package-on-package structure 1234 may be configured according to any of the package-on-package structures known in the art.

[0092] Figure 13 1 is a block diagram of an example electrical device 1300 that may include one or more of the embodiments disclosed herein. In some embodiments, for example, electrical device 1300 may include an EMI shield for memory 1304 according to any of the embodiments disclosed herein (e.g., EMI shield 114, EMI shield 200, EMI shield 400, EMI shield 514, EMI shield 614, EMI shield 814, EMI shield 900, EMI shield 1014).

[0093] Multiple components in Figure 13 1300, but any one or more of these components may be omitted or duplicated as appropriate for the application. In some embodiments, some or all of the components included in electrical device 1300 may be attached to one or more mainboards, host boards, or system boards. In some embodiments, one or more of these components are fabricated onto a single system-on-chip (SoC) die.

[0094] Furthermore, in various embodiments, the electrical device 1300 may not include Figure 131300, but may include interface circuitry for coupling to one or more of the components illustrated in FIG. 1301. For example, electrical device 1300 may not include display device 1306, but may include display device interface circuitry (e.g., a connector and driver circuitry) to which display device 1306 may be coupled. In another set of examples, electrical device 1300 may not include audio input device 1324 or audio output device 1308, but may include audio input or output device interface circuitry (e.g., a connector and supporting circuitry) to which audio input device 1324 or audio output device 1308 may be coupled.

[0095] The electrical device 1300 may include one or more processor units 1302 (e.g., one or more processor units). As used herein, the term "processor unit," "processing unit," or "processor" may refer to any device or portion of a device that processes electronic data from registers and / or memory to convert the electronic data into other electronic data that can be stored in registers and / or memory. The processor unit 1302 may include one or more digital signal processors (DSPs), application-specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), general-purpose GPUs (GPGPUs), accelerated processing units (APUs), field-programmable gate arrays (FPGAs), neural network processing units (NPUs), data processor units (DPUs), accelerators (e.g., graphics accelerators, compression accelerators, artificial intelligence accelerators), controller cryptographic processors (specialized processors that execute cryptographic algorithms in hardware), server processors, controllers, or any other suitable type of processor unit. Thus, the processor unit may be referred to as an XPU (or xPU).

[0096] The electrical device 1300 may include a memory 1304, which may itself include one or more memory devices, such as volatile memory (e.g., dynamic random access memory (DRAM), static random access memory (SRAM)), non-volatile memory (e.g., read-only memory (ROM), flash memory, chalcogenide-based phase change non-voltage memory), solid-state memory, and / or a hard drive. In some embodiments, the memory 1304 may include memory on the same integrated circuit die as the processor unit 1302. The memory may be used as cache memory (e.g., Level 1 (L1), Level 2 (L2), Level 3 (L3), Level 4 (L4), Last Level Cache (LLC)), and may include embedded dynamic random access memory (eDRAM) or spin transfer torque magnetic random access memory (STT-MRAM).

[0097] In some embodiments, the electrical device 1300 may include one or more processor units 1302 that are heterogeneous or asymmetric with respect to another processor unit 1302 in the electrical device 1300. Various differences may exist between the processing units 1302 in the system across a range of metrics, including architectural characteristics, microarchitectural characteristics, thermal characteristics, power consumption characteristics, etc. These differences may effectively manifest themselves as asymmetry and heterogeneity between the processor units 1302 in the electrical device 1300.

[0098] In some examples, electrical device 1300 may include a communication component 1312 (e.g., one or more communication components). For example, communication component 1312 may manage wireless communications for transferring data to and from electrical device 1300. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that can transfer data through a non-solid medium using modulated electromagnetic radiation. The term "wireless" does not imply that the associated device does not contain any wires, but in some embodiments, the associated device may not contain any wires.

[0099] The communication component 1312 can implement any of a plurality of wireless standards or protocols, including but not limited to: Institute for Electrical and Electronic Engineers (IEEE) standards, including Wi-Fi (IEEE 802.11 series), IEEE 802.16 standards (e.g., IEEE 802.16-2005 revision); Long-Term Evolution (LTE) project and any modifications, updates and / or revisions (e.g., LTE-Advanced project, Ultra Mobile Broadband (UMB) project (also known as "3GPP2"), etc.). Broadband Wireless Access (BWA) networks compatible with IEEE 802.16 are generally referred to as WiMAX networks, which is an acronym standing for Worldwide Interoperability for Microwave Access and is a certification mark used for products that have passed compliance and interoperability testing for the IEEE 802.16 standard. The communication component 1312 can operate according to the Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed ​​Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE network. The communication component 1312 can operate according to Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN).The communication component 1312 can operate according to Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO), their derivatives, and any other wireless protocols designated as 3G, 4G, 5G, and higher generations. In other embodiments, the communication component 1312 can operate according to other wireless protocols. The electrical device 1300 can include an antenna 1322 to facilitate wireless communications and / or receive other wireless communications (such as AM or FM radio transmissions).

[0100] In some embodiments, the communication component 1312 can manage wired communications, such as electrical, optical, or any other suitable communication protocol (e.g., the IEEE 802.3 Ethernet standard). As described above, the communication component 1312 can include multiple communication components. For example, the first communication component 1312 can be dedicated to shorter-range wireless communications (such as Wi-Fi or Bluetooth), and the second communication component 1312 can be dedicated to longer-range wireless communications (such as global positioning system (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, or other). In some embodiments, the first communication component 1312 can be dedicated to wireless communications, and the second communication component 1312 can be dedicated to wired communications.

[0101] The electrical device 1300 may include a battery / power circuitry 1314. The battery / power circuitry 1314 may include one or more energy storage devices (e.g., batteries or capacitors) and / or circuitry for coupling components of the electrical device 1300 to an energy source separate from the electrical device 1300 (e.g., AC line power).

[0102] The electrical device 1300 may include a display device 1306 (or corresponding interface circuitry, as discussed above). The display device 1306 may include one or more embedded or wired or wirelessly connected external visual indicators, such as a heads-up display, a computer monitor, a projector, a touchscreen display, a liquid crystal display (LCD), a light-emitting diode display, or a flat-panel display.

[0103] Electrical device 1300 may include an audio output device 1308 (or corresponding interface circuitry, as discussed above). Audio output device 1308 may include any embedded, or wired or wirelessly connected external device that generates an audible indicator, such as a speaker, headphones, or earbuds.

[0104] The electrical device 1300 may include an audio input device 1324 (or corresponding interface circuitry, as discussed above). The audio input device 1324 may include any embedded, wired or wirelessly connected device that generates a signal representing sound, such as a microphone, a microphone array, or a digital instrument (e.g., an instrument with a musical instrument digital interface (MIDI) output). The electrical device 1300 may include a Global Navigation Satellite System (GNSS) device 1318 (or corresponding interface circuitry, as discussed above), such as a Global Positioning System (GPS) device. The GNSS device 1318 may communicate with a satellite-based system and may determine the geographic location of the electrical device 1300 based on information received from one or more GNSS satellites, as is known in the art.

[0105] The electrical device 1300 may include other output device(s) 1310 (or corresponding interface circuitry, as discussed above). Examples of other output device(s) 1310 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or an attached storage device.

[0106] The electrical device 1300 may include other input device(s) 1320 (or corresponding interface circuitry, as discussed above). Examples of other input device(s) 1320 may include an accelerometer, a gyroscope, a compass, an image capture device (e.g., a monoscopic or stereoscopic camera), a trackball, a trackpad, a touchpad, a keyboard, a cursor control device (such as a mouse), a stylus, a touch screen, a proximity sensor, a microphone, a barcode reader, a Quick Response (QR) code reader, an electrocardiogram (ECG) sensor, a photoplethysmogram (PPG) sensor, a galvanic skin response sensor, any other sensor, or a radio frequency identification (RFID) reader.

[0107] The electrical device 1300 may have any desired form factor, such as a handheld or mobile electrical device (e.g., a cellular phone, a smartphone, a mobile internet device, a music player, a tablet computer, a laptop computer, a 2-in-1 convertible computer, a portable all-in-one computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultra-mobile personal computer, a portable game console, etc.), a desktop electrical device, a server, a rack-level computing solution (blade, tray, or sled computing system), a workstation or other networked computing component, a printer, a scanner, a display device (e.g., a monitor, a television), a set-top box, an entertainment control unit, a video game console, a video playback device, a vehicle control unit, a digital camera, a digital video recorder, a wearable electrical device, or an embedded computing system (e.g., a computing system as part of a vehicle, a smart home appliance, a consumer electronic product or equipment, or manufacturing equipment). In some embodiments, the electrical device 1300 may be any other electronic device that processes data. In some embodiments, the electrical device 1300 may include multiple discrete physical components. Given the range of devices that electrical device 1300 may assume in various embodiments, in some embodiments, electrical device 1300 may be referred to as a computing device or computing system.

[0108] While the concepts of the present disclosure are susceptible to various modifications and alternative forms, specific embodiments of the present disclosure have been shown by way of example in the drawings and described in detail herein. However, it should be understood that there is no intention to limit the concepts of the present disclosure to the specific forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives consistent with the present disclosure and the appended claims.

[0109] In the accompanying drawings, some structural or method features may be shown in a specific arrangement and / or order. However, it should be appreciated that such specific arrangement and / or order may not be necessary. On the contrary, in some embodiments, such features may be arranged in a different manner and / or order than shown in the illustrative drawings. Additionally, the inclusion of structural or method features in a particular drawing does not imply that such features are required in all embodiments, and in some embodiments, such features may not be included, or such features may be combined with other features. Further, it should be understood that the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

[0110] In addition, for ease of understanding, the illustrations and / or descriptions of the various embodiments may be simplified or approximated, and therefore, they may not necessarily reflect the level of accuracy or variations that may exist in actual embodiments. For example, although some figures generally indicate straight lines, right angles, and smooth surfaces, given the limitations of manufacturing processes in the real world, actual implementations of the disclosed embodiments may have less than perfect straight lines and right angles, and some features may have surface topography or be otherwise rough. Similarly, for ease of understanding, the illustrations and / or descriptions of how components are arranged may be simplified or approximated, and may vary in actual embodiments due to some error margins (e.g., due to manufacturing processes, etc.).

[0111] Unless otherwise specified, the use of ordinal adjectives "first," "second," "third," etc. to describe common objects merely indicates that different instances of similar objects are mentioned and is not intended to imply that the objects so described are necessarily in a given order temporally, spatially, in ranking, or in any other manner.

[0112] The terms "substantially," "close," "approximately," "near," and "about" generally refer to being within + / - 10% of a target value (unless otherwise specified). Similarly, terms describing spatial relationships such as "perpendicular," "orthogonal," or "coplanar" can mean being substantially within the described spatial relationship (e.g., within + / - 10 degrees of orthogonal).

[0113] Certain terms may also be used in the foregoing description for reference purposes only and, therefore, are not intended to be limiting. For example, terms such as "upper," "lower," "above," "below," "bottom," and "top" refer to directions in the accompanying drawings to which reference is made. Terms such as "front," "rear," "back," and "side" describe the orientation and / or position of parts of a component within a consistent but arbitrary reference frame that becomes apparent by reference to the text and associated drawings describing the component in question. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar meaning.

[0114] As used herein, the terms "above," "below," "between," "adjacent to," and "on" refer to the relative position of one layer or component with respect to other layers or components. For example, a layer that is "above," "below," or "on," or "adjacent to," or "engaged to" another layer may be directly in contact with the other layer or may have one or more intervening layers. A layer that is "between" layers may be directly in contact with the layers or may have one or more intervening layers.

[0115] The meanings of "a", "an" and "the" include plural references. The meaning of "in" includes "in" and "on".

[0116] For the purposes of this disclosure, the phrases "A and / or B" and "A or B" mean (A), (B), or (A and B). For the purposes of this disclosure, the phrases "A, B and / or C" mean (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C).

[0117] The views labeled "Section," "Profile," and "Plan" correspond to orthogonal planes within a Cartesian coordinate system. Thus, section and profile views are taken in the xz plane, and plan views are taken in the xy plane. Typically, a profile view in the xz plane is a cross-sectional view. Where appropriate, the figures are labeled with axes to indicate the orientation of the figure.

[0118] The term "package" generally refers to a self-contained carrier of one or more dies, where the dies are attached to or embedded in a package substrate and may be encapsulated for protection, with integrated or wire-bonded interconnects between the dies, and leads, pins, or bumps on the exterior of the package substrate. A package may contain a single die or multiple dies, providing the corresponding functionality. The package may be mounted on a printed circuit board for interconnection with other packaged integrated circuits and discrete components to form a larger circuit.

[0119] The term "cored" generally refers to a substrate for an integrated circuit package built on a board, card, or wafer made of a non-flexible rigid material. Typically, a small printed circuit board serves as the core, onto which the integrated circuit devices and discrete passive components can be soldered. Typically, the core has through-holes extending from one side to the other, allowing circuitry on one side of the core to be directly coupled to circuitry on the opposite side of the core. The core can also serve as a platform for building layers of conductors and dielectric materials.

[0120] The term "coreless" generally refers to a substrate for an integrated circuit package that does not have a core. The absence of a core can allow for higher density package architectures because vias can have relatively larger sizes and pitches compared to high-density interconnects.

[0121] The term "land side" generally refers to the side of the substrate of an integrated circuit package that is closest to the plane of attachment of a printed circuit board, motherboard, or other package. This is in contrast to the term "die side," which generally refers to the side of the substrate of an integrated circuit package that is attached to one or more dies.

[0122] The terms "dielectric" and "dielectric material" generally refer to any type or amount of non-conductive material. In some cases, dielectric materials can be used to construct the structure of a package substrate. For example, dielectric materials can be incorporated into an integrated circuit package as a laminate film layer or as a resin molded onto an integrated circuit die mounted on a substrate.

[0123] The term "metallization" generally refers to a metal layer formed on, over, and / or through the dielectric material of a package substrate. The metal layer is typically patterned to form metal structures such as traces and bond pads. The metallization of a package substrate can be constrained by a single layer or multiple layers separated by dielectric layers.

[0124] The term "bond pad" generally refers to a metallization structure that terminates integrated traces and vias in integrated circuit packages and dies. The term "pad" may occasionally be substituted for "bond pad" and may carry the same or similar meaning.

[0125] The term "bump" generally refers to a conductive layer or structure formed on a bonding pad, which is usually made of solder or metal and has a rounded or curved shape, hence the name "bump."

[0126] The term "substrate" generally refers to a planar platform that includes dielectric and / or metallization structures. A substrate can mechanically support and electrically couple one or more IC dies on a single platform, wherein the one or more IC dies are encapsulated by a moldable dielectric material. The substrate can include bumps or pads on one or both sides as bonding interconnects. For example, one side of the substrate (commonly referred to as the "die side") may include bumps or pads for bonding the chip or die. The opposite side of the substrate (commonly referred to as the "pad side") may include bumps or pads for bonding the package to a printed circuit board.

[0127] The term "assembly" generally refers to the combination of parts into a single functional unit. For example, certain parts can be permanently joined together, integrated together, and / or mechanically assembled (e.g., where the parts may be removable) into a functional unit.

[0128] The terms "coupled" or "connected" mean either a direct or indirect connection, such as a direct electrical, mechanical, magnetic or fluid connection between the things that are connected, or an indirect connection through one or more passive or active intervening devices.

[0129] The term "circuit" or "module" may refer to one or more passive and / or active components arranged to cooperate with each other to provide a desired functionality. The term "signal" may refer to at least one current signal, voltage signal, magnetic signal, or data / clock signal.

[0130] Example

[0131] The following provides illustrative examples of the techniques described throughout this disclosure. Embodiments of these techniques may include any one or more of the examples described below and any combination thereof. In some embodiments, at least one of the systems or components illustrated in one or more of the foregoing figures may be configured to perform one or more operations, techniques, processes, and / or methods illustrated in the following examples.

[0132] Example 1 includes an electromagnetic interference (EMI) shield comprising: a housing for substantially enclosing a memory module, wherein the housing and the memory module are for coupling to a circuit board, wherein the housing is for extending at least partially under the memory module, and wherein the housing is openable or at least partially removable.

[0133] Example 2 includes the EMI shield of Example 1, wherein the housing comprises: a top, wherein the top is for extending over the memory module and wherein the top is openable or removable; a plurality of sidewalls; and a bottom, wherein the bottom extends at least partially under the memory module.

[0134] Example 3 includes the EMI shield of Example 2, wherein the housing further comprises a flexible interface between the top and one of the side walls, wherein the flexible interface enables the top to be opened.

[0135] Example 4 includes the EMI shield of Example 3, wherein the housing further comprises a plurality of corner side covers for covering openings at corners of the sidewalls adjacent to the flexible interface.

[0136] Example 5 includes the EMI shield of Example 4, further comprising a plurality of EMI gaskets, wherein the EMI gaskets are located inside the corner side covers.

[0137] Example 6 includes the EMI shield of any of Examples 2-5, wherein the housing is one-piece.

[0138] Example 7 includes the EMI shield of any of Examples 2-6, wherein the top portion is a removable cover.

[0139] Example 8 includes the EMI shield of Example 7, wherein the housing is multi-piece.

[0140] Example 9 includes the EMI shield of any of Examples 2-8, wherein the bottom portion includes a conductive edge, wherein the conductive edge is for electrically coupling to a ground contact on the circuit board.

[0141] Example 10 includes the EMI shield of any of Examples 2-9, wherein the bottom portion includes one or more mechanical feet, wherein the one or more mechanical feet are for coupling to a circuit board.

[0142] Example 11 includes the EMI shield of any of Examples 1-10, wherein the memory module is removable.

[0143] Example 12 includes the EMI shield of any of Examples 1-11, wherein the memory module is a dual in-line memory module.

[0144] Example 13 includes the EMI shield of any of Examples 1-12, wherein the memory module is a small outline dual in-line memory module.

[0145] Example 14 includes the EMI shield of any of Examples 1-13, wherein the memory module comprises a plurality of memory modules, wherein the housing is to substantially enclose the plurality of memory modules.

[0146] Example 15 includes a system comprising: a circuit board; one or more memory modules coupled to the circuit board; and an electromagnetic interference (EMI) shield for substantially enclosing the one or more memory modules, wherein the EMI shield is coupled to the circuit board, wherein a bottom of the EMI shield extends at least partially under the one or more memory modules, and wherein a top of the EMI shield is openable or removable.

[0147] Example 16 includes the system of Example 15, wherein the EMI shield includes a flexible interface adjacent to the top, wherein the flexible interface enables the top to be opened.

[0148] Example 17 includes the system of Example 16, further comprising a plurality of clips coupled to the circuit board, wherein the clips are used to hold a top portion of the EMI shield in place.

[0149] Example 18 includes the system of any of Examples 15-17, wherein the top is a removable cover.

[0150] Example 19 includes the system of any of Examples 15-18, wherein the circuit board includes one or more ground contacts, wherein the EMI shield is electrically coupled to the one or more ground contacts.

[0151] Example 20 includes the system of any of Examples 15-19, further comprising a processor coupled to the circuit board.

[0152] Example 21 includes the system of Example 20, further comprising a system on a chip coupled to the circuit board, wherein the system on a chip includes a processor and includes at least one of: a graphics processing unit, a network interface controller, a storage device, a memory controller, or an input / output (I / O) controller.

[0153] Example 22 includes the system of any of Examples 15-21, further comprising one or more memory connectors coupled to the circuit board, wherein the one or more memory modules are removably coupled to the one or more memory connectors.

[0154] Example 23 includes the system of any of Examples 15-22, wherein the one or more memory modules are dual in-line memory modules.

[0155] Example 24 includes the system of any of Examples 15-23, wherein the one or more memory modules are small outline dual in-line memory modules.

[0156] Example 25 includes a method comprising: receiving a circuit board, a memory connector, and an electromagnetic interference (EMI) shield, wherein the EMI shield includes a top and a bottom, wherein the bottom extends at least partially under the memory module, and wherein the top is openable or removable; attaching the memory connector to the circuit board; attaching the EMI shield to the circuit board; and inserting the memory module into the memory connector.

[0157] Example 26 includes the method of Example 25, wherein attaching the EMI shield to the circuit board comprises: inserting the EMI shield into a plurality of clips; and attaching the EMI shield and the plurality of clips to the circuit board.

[0158] Example 27 includes the method of Example 25, wherein attaching the EMI shield to the circuit board comprises: inserting temporary standoffs between the EMI shield and the circuit board; attaching a plurality of clips to the circuit board; attaching a bottom of the EMI shield to the circuit board; and removing the temporary standoffs.

[0159] Example 28 includes the method of any of Examples 25-27, wherein inserting the memory module into the memory connector comprises: opening a top of the EMI shield; inserting the memory module into the memory connector; and closing the top of the EMI shield.

[0160] Example 29 includes the method of Example 25, wherein attaching the EMI shield to the circuit board comprises attaching a bottom portion of the EMI shield to the circuit board.

[0161] Example 30 includes the method of Example 29, further comprising attaching a top portion of the EMI shield to a bottom portion of the EMI shield after inserting the memory module into the memory connector, wherein the top portion is a removable cover.

Claims

1. An electromagnetic interference (EMI) shielding component, comprising: A housing for substantially enclosing a memory module, wherein the housing and the memory module are adapted to be coupled to a circuit board, wherein the housing is adapted to extend at least partially below the memory module, and wherein the housing is openable or at least partially removable.

2. The EMI shield of claim 1, wherein: The housing comprises: a top portion, wherein the top portion is configured to extend over the memory module, and wherein the top portion is openable or removable; a plurality of sidewalls; and A base portion is provided, wherein the base portion is configured to extend at least partially below the memory module.

3. The EMI shield of claim 2, wherein the housing further comprises a flexible interface located between the top and one of the side walls, wherein the flexible interface enables the top to be opened.

4. The EMI shield of claim 3, wherein: The housing further includes a plurality of corner side covers for covering openings at corners of the side walls adjacent to the flexible interface.

5. The EMI shield of claim 4, further comprising a plurality of EMI gaskets, wherein the EMI gaskets are located inside the corner side covers.

6. The EMI shielding member according to any one of claims 2 to 5, wherein: The housing is in one piece.

7. The EMI shielding member according to any one of claims 2 to 6, wherein: The top is a removable cover.

8. The EMI shield of claim 7, wherein: The housing is multi-part.

9. The EMI shield of any one of claims 2-8, wherein the base includes a conductive edge, wherein the conductive edge is adapted to be electrically coupled to a ground contact on the circuit board.

10. The EMI shield according to any one of claims 2 to 9, wherein: The base includes one or more mechanical feet, wherein the one or more mechanical feet are configured to couple to the circuit board.

11. The EMI shield according to any one of claims 1 to 10, wherein: The memory module is removable.

12. The EMI shield according to any one of claims 1 to 11, wherein: The memory module is a dual in-line memory module.

13. The EMI shield of any one of claims 1 to 12, wherein: The memory module is a small outline dual in-line memory module.

14. The EMI shield of any one of claims 1 to 13, wherein: The memory module includes a plurality of memory modules, wherein the housing is used to substantially enclose the plurality of memory modules.

15. A system comprising: circuit boards; one or more memory modules coupled to the circuit board; as well as An electromagnetic interference (EMI) shield is provided for substantially enclosing the one or more memory modules, wherein the EMI shield is coupled to the circuit board, wherein a bottom portion of the EMI shield extends at least partially under the one or more memory modules, and wherein a top portion of the EMI shield is openable or removable.

16. The system of claim 15, wherein: The EMI shield includes a flexible interface adjacent the top, wherein the flexible interface enables the top to be opened.

17. The system of claim 16, further comprising a plurality of clips coupled to the circuit board, wherein the clips are used to hold the top portion of the EMI shield in place.

18. The system of any one of claims 15 to 17, wherein: The top is a removable cover.

19. The system of any one of claims 15 to 18, wherein: The circuit board includes one or more ground contacts, wherein the EMI shield is electrically coupled to the one or more ground contacts.

20. The system of any of claims 15-19, further comprising a processor coupled to the circuit board.

21. The system of claim 20, further comprising a system on a chip coupled to the circuit board, wherein the system on a chip comprises the processor and comprises at least one of: a graphics processing unit, a network interface controller, a storage device, a memory controller, or an input / output (I / O) controller.

22. The system of any one of claims 15-21, further comprising one or more memory connectors coupled to the circuit board, wherein the one or more memory modules are removably coupled to the one or more memory connectors.

23. The system of any one of claims 15 to 22, wherein: The one or more memory modules are small outline dual in-line memory modules.

24. A method comprising: receiving a circuit board, a memory connector, and an electromagnetic interference (EMI) shield, wherein the EMI shield includes a top portion and a bottom portion, wherein the bottom portion extends at least partially under the memory module, and wherein the top portion is openable or removable; attaching the memory connector to the circuit board; attaching the EMI shield to the circuit board; as well as Insert a memory module into the memory connector.

25. The method of claim 24, wherein attaching the EMI shield to the circuit board comprises: inserting the EMI shield into a plurality of clips; as well as The EMI shield and the plurality of clips are attached to the circuit board.

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