Diamond-metal composite material and preparation method thereof, heat dissipation substrate, power module and vehicle

Abstract

The invention provides a diamond-metal composite material and a preparation method thereof, a heat dissipation substrate, a power module and a vehicle. The diamond-metal composite material comprises a base body and a structural layer arranged on at least part of the surface of the base body, the base body comprises diamond particles and first metal, the structural layer comprises a porous body and second metal filled in the porous body, and the first metal is connected with the second metal. And the diamond-metal composite material is good in thermal conductivity, and surface machining is facilitated.

Description

Technical Field

[0001] The present application relates to the field of material composite materials, and specifically to diamond-metal composite materials and preparation methods thereof, heat dissipation substrates, power modules, and vehicles. Background Art

[0002] Existing metal infiltration processes for producing diamond-metal composites require the creation of a diamond skeleton to restrict the movement of diamond powder in the molten metal. This process is often costly and prone to introducing impurities, which can reduce the material's thermal conductivity. Furthermore, due to the high hardness of diamond, the surface machinability of diamond-copper / aluminum composites is poor, often requiring an additional copper cladding process to ensure surface machinability. This secondary copper cladding process also creates a surface copper layer that poorly bonds to the substrate and is prone to delamination. Summary of the Invention

[0003] The present application aims to at least partially address one of the technical problems in the related art. To this end, the present application provides a diamond-metal composite material, a preparation method thereof, a heat dissipation substrate, a power module, and a vehicle. The diamond-metal composite material has excellent thermal conductivity and is amenable to surface processing.

[0004] To achieve the purpose of this application, this application provides the following technical solutions:

[0005] In a first aspect, the present application provides a diamond-metal composite material, comprising a substrate and a structural layer arranged on at least a portion of the surface of the substrate, wherein the substrate comprises a plurality of diamond particles and a first metal, the structural layer comprises a porous body and a second metal filled in the porous body, and the first metal is connected to the second metal.

[0006] Optionally, the first metal and the second metal at the interface between the substrate and the structural layer are an integrated structure.

[0007] Optionally, the first metal and the second metal are in a continuously distributed phase.

[0008] Optionally, the porous body includes at least one of porous graphite, porous ceramics, porous C / C, fiber braided body and porous metal.

[0009] Optionally, the pore size of the porous body is 20-700 μm; and / or,

[0010] The porosity of the porous body is 20-80%.

[0011] Optionally, the thickness of the structural layer is 50-1000 μm.

[0012] Optionally, in the matrix, the content of the diamond particles is 40-70 vol%, and the content of the first metal is 30-60 vol%.

[0013] Optionally, the content of the porous body is 20-80 vol%, and the content of the second metal is 20-80 vol%.

[0014] Optionally, the first metal includes copper and / or aluminum;

[0015] And / or, the second metal includes copper and / or aluminum.

[0016] Optionally, the diamond particles have a particle size of 50-900 μm; and / or,

[0017] The distance between adjacent diamond particles is 30-100 μm.

[0018] Optionally, the surface of the diamond particles has a modified layer, and the thickness of the modified layer is 50-400 nm; and / or,

[0019] The modified layer includes at least one of W, Cr, Ti, Mo, Si, B, and Zr.

[0020] In a second aspect, the present application provides a method for preparing a diamond-metal composite material, comprising the following steps:

[0021] Placing diamond powder in a mold cavity, fixing a porous body and a mold, and obtaining an assembly, wherein the mold cavity is a cavity enclosed by the porous body or a cavity of the mold;

[0022] The assembly and the metal material are heated together to allow the molten metal material to infiltrate through the porous body, thereby obtaining the aforementioned diamond-metal composite material.

[0023] Optionally, the temperature of the heating treatment is 700-1300° C.; and / or,

[0024] The heating treatment is carried out by introducing an inert body under vacuum conditions.

[0025] In a third aspect, the present application provides a heat dissipation substrate comprising the aforementioned diamond-metal composite material, or a diamond-metal composite material prepared by the aforementioned method for preparing the diamond-metal composite material.

[0026] In a fourth aspect, the present application provides a power module comprising the aforementioned diamond-metal composite material, or the diamond-metal composite material produced by the aforementioned method for producing the diamond-metal composite material, or the aforementioned heat dissipation substrate.

[0027] In a fifth aspect, the present application provides a vehicle comprising the aforementioned diamond-metal composite material, or the diamond-metal composite material produced by the aforementioned method for preparing the diamond-metal composite material, or the aforementioned heat dissipation substrate, or the aforementioned power module.

[0028] The present application sets a structural layer on the surface of the substrate, which is easy to process subsequently. The first metal in the porous body of the structural layer is connected to the second metal of the substrate and is not easy to delaminate. The diamond-metal composite material has good thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0030] Figure 1 is a schematic structural diagram of a diamond-metal composite material according to an embodiment;

[0031] Figure 2 The present invention is a schematic structural diagram of a method for preparing a diamond-metal composite material.

[0032] Figure 3 It is a schematic structural diagram of another embodiment for preparing diamond-metal composite materials.

[0033] Reference numerals:

[0034] 1: substrate; 11: diamond particles; 12: first metal

[0035] 2: structural layer; 21: porous body; 22: second metal

[0036] 3: Mold. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] First, see Figure 1 An embodiment of the present application provides a diamond-metal composite material, including a substrate 1 and a structural layer 2 arranged on at least a portion of the surface of the substrate 1, the substrate 1 includes a plurality of diamond particles 11 and a first metal 12, the structural layer 2 includes a porous body 21 and a second metal 22 filled in the porous body 21, and the first metal 12 is connected to the second metal 22.

[0039] The present application sets a structural layer 2 on the surface of the substrate 1, which is easy to process subsequently, and the first metal 12 in the porous body 21 of the structural layer 2 is connected to the second metal 22 of the substrate 1, which is not easy to delaminate, and the diamond-metal composite material has good thermal conductivity.

[0040] In some embodiments, the first metal 12 and the second metal 22 at the interface between the substrate 1 and the structural layer 2 are an integrated structure. This integrated structure makes the diamond-metal composite material less likely to delaminate and has stable performance.

[0041] In some embodiments, the first metal 12 and the second metal 22 are continuously distributed. Specifically, the diamond particles 11 in the matrix 1 are spaced apart, with the first metal 12 dispersed between the diamond particles 11, separating them. The second metal 22 in the porous body 21 fills the pores of the porous body 21, and the first metal 12 and the second metal 22 are continuously connected at the interface between the matrix 1 and the structural layer 2. This improves the thermal conductivity of the diamond-metal composite material and stabilizes its performance.

[0042] In some embodiments, the first metal 12 comprises copper and / or aluminum; and / or the second metal 22 comprises copper and / or aluminum. Preferably, the first metal 12 is copper and the second metal 22 is copper; or, the first metal 12 is aluminum and the second metal 22 is aluminum, to enhance the stability of the diamond-metal composite.

[0043] In some embodiments, the content of diamond particles 11 in the matrix 1 is 40-70 vol%, optionally 40 vol%, 45 vol%, 50 vol%, 55 vol%, 60 vol%, 65 vol%, or 70 vol%. The content of the first metal 12 is 30-60 vol%, optionally 30 vol%, 35 vol%, 40 vol%, 45 vol%, 50 vol%, 55 vol%, or 60 vol%. The diamond particles 11 within the aforementioned volume content ranges synergistically work with the first metal 12 to improve the thermal conductivity of the diamond-metal composite material and reduce the thermal expansion coefficient.

[0044] In some embodiments, in the structural layer 2, the content of the porous body 21 is 20-80 vol%. Optionally, the content of the porous body 21 can be 20 vol%, 25 vol%, 30 vol%, 35 vol%, 40 vol%, 45 vol%, 50 vol%, 55 vol%, 60 vol%, 65 vol%, 70 vol%, 75 vol%, or 80 vol%. The content of the second metal 22 is 20-80 vol%. Optionally, the content of the second metal 22 can be 20 vol%, 25 vol%, 30 vol%, 35 vol%, 40 vol%, 45 vol%, 50 vol%, 55 vol%, 60 vol%, 65 vol%, 70 vol%, 75 vol%, or 80 vol%. The porous body 21 and the second metal 22 within the aforementioned volume content ranges work synergistically, giving the diamond-metal composite material excellent processability.

[0045] In some embodiments, the porous body 21 comprises at least one of porous graphite, porous ceramic, porous carbon / carbon, a fiber braid, and porous metal. The porous body 21 ensures the machinability of the machined surface, adjusts the surface thermal expansion coefficient, and prevents cracks. Preferably, the porous body 21 comprises porous graphite and / or porous carbon / carbon to further enhance the bonding between the structural layer and the substrate.

[0046] In some embodiments, the porous body 21 has a pore size of 20-700 μm, and optionally, the pore size of the porous body 21 is 20 μm, 50 μm, 80 μm, 120 μm, 160 μm, 200 μm, 250 μm, 300 μm, 400 μm, 500 μm, 600 μm, or 700 μm; and / or the porous body 21 has a porosity of 20-80%, and optionally, the porosity of the porous body 21 can be 20%, 30%, 40%, 50%, 60%, 70%, or 80%. The porous body 21 within the aforementioned range facilitates metal filling, ensuring the performance of the diamond-metal composite material.

[0047] In some embodiments, the thickness of the structural layer 2 is 50-1000 μm. Optionally, the thickness of the structural layer 2 can be 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, or 1000 μm. The structural layer 2 within the aforementioned thickness range is conducive to surface processing.

[0048] In some embodiments, the diamond particles 11 have a particle size of 50-900 μm. Alternatively, the diamond particles 11 may have a particle size of 50 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, or 900 μm. Diamond particles 11 within the aforementioned particle size range can improve the thermal conductivity of the diamond-metal composite material.

[0049] In some embodiments, the surface of the diamond particles 11 has a modified layer having a thickness of 50-400 nm. Optionally, the thickness of the modified layer can be 50 nm, 80 nm, 120 nm, 160 nm, 200 nm, 240 nm, 280 nm, 320 nm, 360 nm, or 400 nm. Furthermore, the modified layer includes at least one of W, Cr, Ti, Mo, Si, B, and Zr to enhance the bonding strength between diamond and metal.

[0050] In a second aspect, the present application provides a method for preparing a diamond-metal composite material, comprising the following steps:

[0051] Placing diamond powder in a mold cavity, fixing a porous body and a mold, and obtaining an assembly, wherein the mold cavity is a cavity enclosed by the porous body or a cavity of the mold;

[0052] The assembly and the metal material are heated together to allow the molten metal material to infiltrate through the porous body, thereby obtaining the aforementioned diamond-metal composite material.

[0053] Specifically, see Figure 2 and Figure 3 , you can first fill the cavity with diamond powder and vibrate it; then fix the porous body and the mold. For example, you can Figure 2 As shown, the porous body 21 has a cavity, diamond powder (a mixture of multiple diamond particles forms diamond powder) is filled into the cavity, and the mold 3 and the porous body 21 are fixed to form an assembly; or as shown in FIG. Figure 3 As shown, the mold 3 has a cavity, diamond powder is filled into the cavity, and the mold 3 is fixed to the porous body 21 to form an assembly; the assembly and the metal material are then heat-treated together, so that the molten metal material is infiltrated through the porous body 21 to obtain the aforementioned diamond-metal composite material. The porous body 21 provides a channel for metal infiltration, which can constrain the shape of the diamond powder, ensure the machinability of the processing surface, and adjust the surface thermal expansion coefficient (according to actual conditions, adjust the thermal expansion coefficient to be close to that of the heat source chip / structure, so that thermal fatigue cracks are not easily generated). Compared to preparing a diamond preform and then performing metal infiltration, the present application does not require the preparation of a diamond preform, and will not introduce impurities at the diamond interface, thereby causing the thermal conductivity of the material to decrease.

[0054] In some embodiments, the porous body 21 comprises at least one of porous graphite, porous ceramic, porous carbon / carbon, a fiber braid, and porous metal. The porous body 21 ensures the machinability of the machined surface, adjusts the surface thermal expansion coefficient, and prevents cracks. Preferably, the porous body 21 comprises porous graphite and / or porous carbon / carbon to further enhance the bonding between the structural layer and the substrate.

[0055] In some embodiments, the pore size of the porous body 21 is 20-700 μm. Optionally, the pore size of the porous body 21 is 20 μm, 50 μm, 80 μm, 120 μm, 160 μm, 200 μm, 250 μm, 300 μm, 400 μm, 500 μm, 600 μm, or 700 μm. And / or, the porosity of the porous body 21 is 20-80%. Optionally, the porosity of the porous body 21 can be 20%, 30%, 40%, 50%, 60%, 70%, or 80%. The porous body 21 within the aforementioned range facilitates the infiltration of the molten metal during heating, ensuring the performance of the diamond-metal composite material. The higher the porosity, the easier it is for the molten metal to penetrate, but the metal content in the porous body will increase, resulting in an increase in the thermal expansion coefficient. The lower the porosity, the greater the resistance to molten metal infiltration.

[0056] In some embodiments, the heat treatment temperature is 700-1300°C, and / or the heat treatment is performed under vacuum conditions by introducing an inert gas. Specifically, the assembly and the metal material are placed in a pressure furnace, the furnace is evacuated, and the temperature is raised to above the melting point of the metal (if the metal material is aluminum, the heating temperature is 700-800°C; if the metal material is copper, the heating temperature is 1150-1250°C). An inert gas (e.g., nitrogen) is introduced and pressurized to a pressure of 3-8 MPa. The temperature and pressure are maintained for 10-20 minutes, followed by cooling and release of the gas.

[0057] In a third aspect, the present application provides a heat dissipation substrate comprising the aforementioned diamond-metal composite material, or a diamond-metal composite material prepared by the aforementioned method for preparing the diamond-metal composite material.

[0058] In a fourth aspect, the present application provides a power module comprising the aforementioned diamond-metal composite material, or the diamond-metal composite material produced by the aforementioned method for producing the diamond-metal composite material, or the aforementioned heat dissipation substrate.

[0059] In a fifth aspect, the present application provides a vehicle comprising the aforementioned diamond-metal composite material, or the diamond-metal composite material produced by the aforementioned method for preparing the diamond-metal composite material, or the aforementioned heat dissipation substrate, or the aforementioned power module.

[0060] The present application will be described in detail below through examples, but the present application is not limited to the following examples.

[0061] Example 1

[0062] The Ti-plated diamond particles with a size of 300 μm and a coating thickness of 150 nm were used to fill the diamond powder in the Figure 3 The mold shown is vibrated and compacted, then covered with a 500μm-thick layer of porous SiC with a porosity of 50% and pore sizes ranging from 1 to 100μm. The mold is then placed in a pressure furnace and evacuated. The temperature is then raised to 700°C to melt the aluminum material. Nitrogen gas is introduced at 4MPa and maintained at this temperature for 10 minutes. Finally, the pressure is released and the temperature is lowered to produce a diamond-metal composite material with a diamond-Al matrix and a SiC-Al surface layer.

[0063] Example 2

[0064] Cr-plated diamond particles with sizes of 100 μm and 500 μm were used. The diamond content of 100 μm was 30 vol%, and the diamond content of 500 μm was 70 vol%. The coating thickness was about 200 nm. The diamond powder was filled in Figure 3 The mold shown is vibrated and compacted. An 800μm-thick layer of porous graphite with a porosity of 30% and a pore size of 5-100μm is then applied. The mold is then placed in a pressure furnace and evacuated. The temperature is then raised to 1150°C to melt the copper material. 6MPa nitrogen gas is introduced, and the temperature and pressure are maintained for 10 minutes before the pressure is released and the temperature is lowered. The resulting diamond-metal composite material comprises a diamond-copper matrix and a graphite-copper surface layer.

[0065] Example 3

[0066] The Si-coated diamond particles with a size of 200 μm and a coating thickness of about 200 nm are used to fill the diamond powder in the Figure 3 The mold shown is vibrated and compacted. A 500μm-thick layer of carbon / carbon composite material with a porosity of 50% and a pore size of 1-100μm is then applied. The mold is then placed in a pressure furnace and evacuated. The temperature is then raised to 1200°C to melt the copper material. 6MPa nitrogen gas is introduced, and the temperature and pressure are maintained for 10 minutes. Finally, the pressure is released and the temperature is lowered to produce a diamond-metal composite material with a diamond-copper matrix and a carbon fiber-copper surface structure layer.

[0067] Example 4:

[0068] The Cr-plated diamond with a size of 200 μm and a coating thickness of about 200 nm is used to fill the powder in Figure 3The mold shown is vibrated and compacted. A 200μm-thick porous molybdenum sheet with a porosity of 80% and a pore size of 150μm is then applied. The mold is placed in a pressure furnace and evacuated. The temperature is then raised to 1200°C to melt the copper. 6MPa nitrogen gas is introduced, and the temperature and pressure are maintained for 10 minutes. Finally, the pressure is released and the temperature is lowered. The resulting diamond-metal composite material comprises a diamond-copper matrix and a molybdenum-copper surface layer.

[0069] Example 5

[0070] The Cr-plated diamond with a size of 200 μm and a coating thickness of about 200 nm was used. The powder was filled in a Figure 3 The mold shown is vibrated and compacted. A 200μm-thick porous molybdenum sheet with a porosity of 20% and a pore size of 150μm is then applied. The mold is placed in a pressure furnace and evacuated. The temperature is then raised to 1200°C to melt the copper. 6MPa nitrogen gas is introduced, and the temperature and pressure are maintained for 10 minutes before the pressure is released and the temperature is lowered. The resulting diamond-metal composite material comprises a diamond-copper matrix and a molybdenum-copper surface layer.

[0071] Example 6

[0072] The difference from Example 1 is that Figure 2 Diamond-metal composite materials were prepared in the manner shown.

[0073] Comparative Example 1

[0074] A 200μm Cr-coated diamond with a coating thickness of approximately 200nm was used. Diamond powder and deionized water were mixed in a 1:1 volume ratio. 1wt% acrylamide, 0.1wt% N,N'-methylenebisacrylamide, and 0.06wt% tetramethylammonium hydroxide were added and stirred for 30 minutes. 0.05% of the slurry's mass of ammonium persulfate and 0.02% of N,N,N',N'-tetramethylethylenediamine were then added. After stirring, the mixture was poured into a mold and dried at 80°C for 12 hours. The solidified diamond body was placed in a vacuum furnace and debinded at 800°C to obtain a diamond skeleton. Copper material was placed on the diamond skeleton and heated to 1200°C in a vacuum furnace to melt the copper. 6MPa nitrogen was then introduced, maintained at this temperature and pressure for 10 minutes, and finally released and cooled.

[0075] Comparative Example 2

[0076] A 200μm Cr-coated diamond with a coating thickness of approximately 200nm was used. Diamond powder and deionized water were mixed in a 1:1 volume ratio. 1wt% acrylamide, 0.1wt% N,N'-methylenebisacrylamide, and 0.06wt% tetramethylammonium hydroxide were added and stirred for 30 minutes. 0.05% of the slurry's mass of ammonium persulfate and 0.02% of N,N,N',N'-tetramethylethylenediamine were then added. After stirring, the mixture was poured into a mold and dried at 80°C for 12 hours. The solidified diamond body was placed in a vacuum furnace and debinded at 800°C to obtain a diamond skeleton. Copper material was placed on the diamond skeleton and heated to 1200°C in a vacuum furnace to melt the copper. 6MPa nitrogen was then introduced, maintained at this temperature and pressure for 10 minutes, and finally released and cooled to obtain the sample.

[0077] The sample surface was wrapped with copper foil, placed in a vacuum hot press, and hot pressed at 900°C and 30 MPa to obtain a copper-clad diamond-copper composite material with a surface copper layer thickness of 100 μm.

[0078] Performance Testing

[0079] (1) Thermal conductivity:

[0080] The laser flash method is used to measure the thermal diffusivity of the material and the thermal conductivity of the material is calculated according to the formula.

[0081] K=a*ρ*c

[0082] K is the thermal conductivity; a is the thermal diffusivity; ρ is the sample density; and c is the specific heat capacity.

[0083] (2) Number of thermal cycles

[0084] Test method: The sample is heated to 180°C and then immersed in cooling water. This process is repeated until delamination occurs. The number of cycles is recorded.

[0085] (3) Roughness: The roughness of the sample is measured using a white light interferometer.

[0086] Table 1

[0087]

[0088] Table 1 shows that the surface structure layer of the diamond-metal composite material of this embodiment has good machinability. Compared with Comparative Example 1, the average roughness of the sample with the surface structure layer can be reduced to below 1 μm. Compared with Comparative Example 2, the surface structure layer formed in one step is more tightly bonded to the substrate, and the number of thermal cycles is significantly improved.

[0089] The preferred embodiments of the present application are described in detail above. However, the present application is not limited to the specific details of the above embodiments. Within the technical concept of the present application, various simple modifications can be made to the technical solution of the present application, and these simple modifications all fall within the scope of protection of the present application.

[0090] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, this application will not further describe various possible combinations. In addition, the various different embodiments of this application can also be arbitrarily combined, as long as they do not violate the concept of this application, they should also be regarded as the content disclosed in this application.

Claims

1. A diamond-metal composite material, characterized in that: It includes a substrate and a structural layer arranged on at least a part of the surface of the substrate, the substrate includes a plurality of diamond particles and a first metal, the structural layer includes a porous body and a second metal filled in the porous body, and the first metal is connected to the second metal.

2. The diamond-metal composite material according to claim 1, characterized in that The first metal and the second metal at the interface between the substrate and the structural layer are an integrated structure.

3. The diamond-metal composite material according to claim 1, characterized in that The first metal and the second metal are in a continuously distributed phase.

4. The diamond-metal composite material according to claim 1, characterized in that The porous body includes at least one of porous graphite, porous ceramics, porous C / C, a fiber braid and porous metal.

5. The diamond-metal composite material according to claim 1, characterized in that The pore size of the porous body is 20-700 μm; and / or, The porosity of the porous body is 20-80%.

6. The diamond-metal composite material according to claim 1, characterized in that The thickness of the structural layer is 50-1000 μm.

7. The diamond-metal composite material according to claim 1, characterized in that In the matrix, the content of the diamond particles is 40-70 vol%, and the content of the first metal is 30-60 vol%.

8. The diamond-metal composite material according to claim 1, characterized in that In the structural layer, the content of the porous body is 20-80 vol%, and the content of the second metal is 20-80 vol%.

9. The diamond-metal composite material according to claim 1, characterized in that The first metal includes copper and / or aluminum; And / or, the second metal includes copper and / or aluminum.

10. The diamond-metal composite material according to claim 1, characterized in that The diamond particles have a particle size of 50-900 μm; and / or, The distance between adjacent diamond particles is 30-100 μm.

11. The diamond-metal composite material according to claim 10, characterized in that The surface of the diamond particles has a modified layer, and the thickness of the modified layer is 50-400 nm; and / or, The modified layer includes at least one of W, Cr, Ti, Mo, Si, B, and Zr.

12. A method for preparing a diamond-metal composite material, characterized in that: The following steps are involved: Placing diamond powder in a mold cavity, fixing a porous body and a mold, and obtaining an assembly, wherein the mold cavity is a cavity enclosed by the porous body or a cavity of the mold; The assembly and the metal material are heated together to allow the molten metal material to infiltrate through the porous body, thereby obtaining the diamond-metal composite material according to any one of claims 1 to 11.

13. The method for preparing the diamond-metal composite material according to claim 12, characterized in that: The temperature of the heating treatment is 700-1300° C.; and / or, The heating treatment is carried out by introducing an inert body under vacuum conditions.

14. A heat dissipation substrate, characterized in that: The invention comprises the diamond-metal composite material according to any one of claims 1 to 11, or a diamond-metal composite material prepared by the method for preparing the diamond-metal composite material according to any one of claims 12 to 13.

15. A power module, characterized in that: The invention comprises the diamond-metal composite material according to any one of claims 1 to 11, or the diamond-metal composite material prepared by the method for preparing the diamond-metal composite material according to any one of claims 12 to 13, or the heat dissipation substrate according to claim 14.

16. A vehicle, characterized in that: The invention comprises the diamond-metal composite material according to any one of claims 1 to 11, or the diamond-metal composite material prepared by the method for preparing the diamond-metal composite material according to any one of claims 12 to 13, or the heat dissipation substrate according to claim 14, or the power module according to claim 15.

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