A gripping device for wafer transfer

Abstract

The application relates to the technical field of semiconductor processing, and provides a grabbing device for wafer transfer, which comprises oppositely arranged first and second grabbing components and a connecting component for connecting the first and second grabbing components: at least one of the first and second grabbing components can move along the connecting component to switch between a grabbing state and a releasing state; the first grabbing component comprises a first flexible fitting part, and the second grabbing component comprises a second flexible fitting part; the first and second flexible fitting parts are flexible strips; and the first and second flexible fitting parts can respectively wrap the side walls of the two opposite sides of a wafer in the grabbing state to grab the wafer. Through the technical scheme, the technical problem that the flexible self-adaptive end effector structure for wafer transfer in the related art is complex and causes high assembly and maintenance difficulty is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically, to a gripping device for wafer transfer. Background Technology

[0002] Wafer handling robots are key automation equipment in semiconductor manufacturing, used to efficiently and accurately transfer wafers in cleanroom environments, ensuring the stability and yield of the production process. Currently, the mainstream end effectors are typically mechanical grippers and vacuum chucks. Mechanical grippers rely on rigid clamping, which can easily cause stress concentration at the wafer edges. Vacuum chucks require a flat back surface on the wafer and are less adaptable to warped wafers, such as those deformed after high-temperature processing. To address these issues, flexible adaptive end effectors have emerged. These use elastic deformation structures to adapt to wafer deformation and reduce mechanical stress. However, multi-degree-of-freedom flexible hinges typically rely on distributed sensor control, leading to significant assembly and maintenance difficulties. Summary of the Invention

[0003] To overcome the above-mentioned defects, embodiments of the present invention provide a gripping device for wafer transfer, which solves the technical problem of difficult assembly and maintenance caused by the complex structure of flexible adaptive end effectors for wafer transfer in related technologies.

[0004] According to one aspect, at least one embodiment of the present invention provides a gripping device for wafer transfer, including a first gripping component and a second gripping component disposed opposite to each other, and a connecting component for connecting the first gripping component and the second gripping component:

[0005] At least one of the first gripping component and the second gripping component is movable along the connecting component to switch between a gripping state and a releasing state;

[0006] The first gripping component includes a first flexible bonding portion, and the second gripping component includes a second flexible bonding portion. Both the first flexible bonding portion and the second flexible bonding portion are flexible strip materials. In the gripping state, the first flexible bonding portion and the second flexible bonding portion can respectively cover the sidewalls of the opposite sides of the wafer to grip the wafer.

[0007] For example, in at least one embodiment of the present invention, the gripping device for wafer transfer includes a base, two first rollers and a first tensioning member corresponding to the two first rollers;

[0008] The base is fixedly connected to the connecting assembly;

[0009] The two first material rollers are parallel to each other and rotatably mounted on the base, and the two ends of the first flexible bonding portion are respectively wrapped around the two first material rollers;

[0010] The two first tensioning members are used to tension the first flexible bonding portion.

[0011] For example, in at least one embodiment of the present invention, the gripping device for wafer transfer further includes a sliding frame, which is rotatably provided with two second material rollers and a second tensioning member corresponding to the two second material rollers;

[0012] The sliding frame is movably connected to the connecting assembly;

[0013] The two second material rollers are parallel to each other and rotatably mounted on the sliding frame, and the two ends of the second flexible bonding part are respectively wrapped around the two second material rollers;

[0014] Two second tensioning members are used to tension the second flexible bonding portion.

[0015] For example, in at least one embodiment of the present invention, the gripping device for wafer transfer includes an adjustment component disposed on the sliding frame, the adjustment component being used to drive the second material roller to rotate in order to adjust the tension of the second flexible bonding portion.

[0016] For example, in at least one embodiment of the present invention, the adjusting component in the gripping device for wafer transfer includes:

[0017] The third material roller is rotatably disposed on the side of the sliding frame opposite to the second material roller. The second material roller rotates coaxially with the third material roller. A flexible adjustment strip is wound around the third material roller.

[0018] An adjusting plate is movably mounted on the sliding frame. The adjusting plate is provided with an adjusting part for contacting the flexible adjusting strip. The adjusting plate can pull the flexible adjusting strip through the adjusting part to rotate the third roller.

[0019] A linear telescopic component is disposed on the base and is used to drive the adjustment plate to slide.

[0020] For example, in the wafer transfer gripping device provided in at least one embodiment of the present invention, there are two third rollers, which are coaxially rotatable with the second rollers, and the two ends of the flexible adjustment strip are respectively wound around the two third rollers.

[0021] For example, in at least one embodiment of the present invention, the gripping device for wafer transfer is an adjustment part that is rotatably mounted on the adjustment plate, and the adjustment assembly further includes a tension roller that is rotatably mounted on the sliding frame. The tension roller is provided between the adjustment part and each of the third material rollers, and the flexible adjustment strip is sequentially wound around the third material roller, the tension roller, the adjustment part, another tension roller, and another third material roller.

[0022] For example, in at least one embodiment of the present invention, the gripping device for wafer transfer includes a chute;

[0023] The sliding frame includes a support body, the support body including a limiting slide plate that passes through the slide groove, the limiting slide plate being movable along the slide groove so that the sliding frame is movably connected to the connecting assembly.

[0024] For example, in the wafer transfer gripping device provided in at least one embodiment of the present invention, the sliding frame further includes support arms symmetrically distributed at both ends of the support body, the support body is connected to the connecting assembly, both support arms are rotatably connected to the support body, and two second material rollers are respectively rotatably disposed on the support arms.

[0025] For example, in at least one embodiment of the present invention, a gripping device for wafer transfer further includes a transmission member, which is used to drive the support arm to rotate. The transmission member includes:

[0026] A transmission gear is rotatably mounted on the bracket body and fixedly connected to the support arm.

[0027] A sliding toothed plate is movably connected to the limiting slide plate. The sliding toothed plate is located between the two transmission gears and meshes with the transmission wheel. The sliding toothed plate can drive the transmission gears to rotate by sliding.

[0028] For example, in the wafer transfer gripping device provided in at least one embodiment of the present invention, the base is provided with a limiting boss, the sliding frame is provided with an elastic connector, the two ends of the elastic connector are respectively connected to the limiting part of the limiting slide plate and the sliding tooth plate, and the elastic connector is used to elastically pull the sliding tooth plate so that the end of the sliding tooth plate abuts against the limiting boss.

[0029] For example, in at least one embodiment of the present invention, a gripping device for wafer transfer further includes a linear drive member disposed on the base, the linear drive member being used to drive the sliding frame to slide, the linear drive member comprising:

[0030] The lead screw is rotatably mounted on the base.

[0031] A sliding seat, which is slidably disposed on the base and is connected to the rotating lead screw; the sliding frame is connected to the sliding seat.

[0032] A rotation drive component is disposed on the base and is used to drive the rotation screw to rotate.

[0033] The beneficial effects of the embodiments of the present invention are as follows:

[0034] In this invention, a first gripping component and a second gripping component are respectively provided on opposite sides of the connecting component. By adjusting the distance between them, the gripping device can switch between a gripping state and a releasing state. The first gripping component includes a first flexible bonding portion, and the second gripping component includes a second flexible bonding portion. Both are flexible strips. The flexible strips grip the wafer and cover the wafer sidewalls. The elastic deformation of the flexible strips can adapt to wafer warping, avoiding stress concentration caused by rigid clamping and reducing the risk of wafer breakage. At the same time, the modular design facilitates maintenance, and the gripping with flexible strips reduces the dependence of the flexible adaptive gripping device on distributed sensors. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.

[0036] Figure 1 This is a schematic diagram of the overall structure of a gripping device for wafer transfer in one embodiment of the present invention;

[0037] Figure 2 for Figure 1 A partial structural schematic diagram of the gripping device for wafer transfer in the embodiment;

[0038] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0039] Figure 4 for Figure 1 A schematic diagram of the sliding frame in the embodiment;

[0040] Figure 5 for Figure 1 A schematic diagram of the adjusted components in the embodiment;

[0041] Figure 6for Figure 1 A schematic diagram of the transmission component in the embodiment;

[0042] Figure 7 for Figure 1 A schematic diagram of the base structure in the embodiment;

[0043] Figure 8 for Figure 7 Enlarged structural diagram at point B;

[0044] Figure 9 for Figure 1 A partial top view of the gripping device for wafer transfer in the embodiment;

[0045] Figure 10 for Figure 9 Enlarged structural diagram at point C;

[0046] Figure 11 for Figure 1 A schematic diagram of the linear drive component in the embodiment;

[0047] Figure 12 for Figure 1 Another structural schematic diagram of the linear drive in the embodiment.

[0048] In the figure: 10, First gripping component; 100, Base; 110, First material roller; 120, First flexible bonding part; 130, Limiting boss; 20, Second gripping component; 200, Sliding frame; 201, Support body; 2011, Limiting slide plate; 210, Second material roller; 220, Second flexible bonding part; 230, Support arm; 240, Elastic connector; 250, Limiting part; 300, Adjustment component; 310, Third material roller; 320, Flexible adjustment strip; 330, Adjustment plate; 331, Adjustment part; 340, Linear telescopic component; 350, Tensioning roller; 400, Transmission component; 410, Transmission gear; 420, Sliding toothed plate; 500, Linear drive component; 510, Rotating screw; 520, Sliding seat; 530, Rotation drive component; 60, Connecting component. Detailed Implementation

[0049] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.

[0050] To keep the drawings concise, each drawing only schematically shows the parts relevant to the invention; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0051] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0053] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0054] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] like Figures 1-12The diagram illustrates a gripping device for wafer transfer according to an embodiment of the present invention. The gripping device includes a first gripping component 10 and a second gripping component 20 disposed opposite to each other, and a connecting component 60 for connecting the first gripping component 10 and the second gripping component 20. At least one of the first gripping component 10 and the second gripping component 20 is movable along the connecting component 60 to switch between a gripping state and a release state. The first gripping component 10 includes a first flexible bonding portion 120, and the second gripping component 20 includes a second flexible bonding portion 220. Both the first flexible bonding portion 120 and the second flexible bonding portion 220 are flexible strips, for example, strips made of polyimide or fluoropolymer. For example, the second gripping component 20 can move along the connecting component 60 closer to the first gripping component 10, thereby putting the gripping device into a gripping state. At this time, the first flexible bonding portion 120 and the second flexible bonding portion 220 can respectively cover the sidewalls of the opposite sides of the wafer to grip the wafer. After gripping the wafer, the gripping device can be moved to a designated position by a multi-axis robotic arm or other moving device. Subsequently, the second gripping component 20 moves in the opposite direction, and the second flexible bonding portion 220 moves away from the first flexible bonding portion 120, so that the gripping device is in a released state, completing the wafer transfer. Alternatively, the first gripping component 10 can move along the connecting component 60, cooperating with the second gripping component 20 fixedly connected to the connecting component 60 to complete the wafer transfer. It is also possible for both the first gripping component 10 and the second gripping component 20 to move along the connecting component 60. This is not limited here, as long as the first gripping component 10 and the second gripping component 20 can move closer to each other to enter the gripping state or move away from each other to enter the released state.

[0056] In this embodiment, the first gripping component 10 is fixedly connected to the connecting component 60, and the second gripping component 20 is movably mounted on the connecting component 60. The first gripping component 10 further includes a base 100, two first material rollers 110, and first tensioning members corresponding to the two first material rollers 110. The base 100 is fixedly connected to the connecting component 60 and can be used to connect to a moving device such as a multi-axis robotic arm. Two parallel first material rollers 110 are rotatably mounted on the base 100, spaced apart, with a flexible strip wound between them to form a first flexible bonding portion 120. A first tensioning member is provided between each of the two first material rollers 110 and the base 100 to keep the first flexible bonding portion 120 in a tensioned state; the first tensioning member can be a torsion spring. The second gripping component 20 has a similar structure to the first gripping component 10, except that the second gripping component 20 is movably connected to the connecting component 60. Specifically, the second gripping assembly 20 further includes a sliding frame 200, which is rotatably provided with two second material rollers 210 and second tensioning members corresponding to the two second material rollers 210; wherein the sliding frame 200 is movably connected to the connecting assembly 60; the two second material rollers 210 are parallel to each other and rotatably mounted on the sliding frame 200, and the two ends of the second flexible bonding portion 220 are respectively wound around the two second material rollers 210; the two second tensioning members are used to tension the second flexible bonding portion 220, and the second tensioning members may also be torsion springs. When the gripping device enters the gripping state, the first flexible bonding portion 120 and the second flexible bonding portion 220 are bonded to the sidewall of the wafer. As the first flexible bonding portion 120 and the second flexible bonding portion 220 approach and bond to the sidewall of the wafer, the first tensioning member and the second tensioning member are compressed. At this time, the first material roller 110 and the second material roller 210 rotate and release the flexible strip, which respectively extends the length of the first flexible bonding portion 120 and the second flexible bonding portion 220 and increases the contact area between the first flexible bonding portion 120 and the second flexible bonding portion 220 and the sidewall of the wafer, so that the force on the gripping part is uniform and the gripping stability is improved.

[0057] Both the first and second tensioning components employ torsion springs. The preload of the torsion springs tensions the flexible strip, ensuring it maintains tension during operation. By controlling the elastic force of the torsion springs, the tension of the flexible strip can be kept within a suitable range, preventing excessive tension from damaging the wafer. One end of the torsion spring is fixed to a lug at the end of the feed roller via a pin, and the other end is fixed to the corresponding bracket on the base 100 or sliding frame 200. A pre-set torsion angle is used during assembly to generate preload. This structure automatically compensates for slight slack in the flexible strip due to long-term use using the elastic potential energy of the torsion springs, causing a slight rotation of the feed roller to maintain stable tension between the first flexible bonding portion 120 and the second flexible bonding portion 220. This prevents wafer clamping misalignment due to strip loosening and reduces the frequency of manual adjustments. The bushing connection between the torsion spring and the feed roller ensures that the tension is evenly distributed across both ends of the feed roller, guaranteeing consistent tension on both sides of the strip and further improving positioning stability.

[0058] An annular groove may be provided in the middle of the first roller 110 and the second roller 210. The width of the annular groove is smaller than the width of the flexible strip but larger than the thickness of the wafer. During wafer gripping, the annular groove can limit the end face of the wafer, further improving the gripping stability. It is preferable to wind one or two layers of flexible strip onto the first roller 110 and the second roller 210, so that after the flexible strip is partially embedded in the annular groove during gripping, the outline of the annular groove can be exposed, thus playing a limiting role. When the flexible strip is wound onto the first roller 110 and the second roller 210, the edge of the strip extends beyond the side walls of the groove so that the first roller 110 and the second roller 210 do not directly contact the wafer. During the wafer transfer process, the gripping device always contacts the wafer through the flexible strip, transforming the common rigid clamping contact into a flexible contact, thereby reducing the contact stress between the gripping device and the wafer during the clamping process.

[0059] During operation, the linear drive 500 drives the sliding frame 200 to slide, bringing the second flexible bonding portion 220 closer to the first flexible bonding portion 120 until the wafer sidewall is covered by the first flexible bonding portion 120 and the second flexible bonding portion 220. After the wafer sidewall contacts the first flexible bonding portion 120 and the second flexible bonding portion 220, it can overcome part of the force of the torsion spring. At this time, the first roller 110 and the second roller 210 can rotate and release part of the flexible strip, thereby extending the length of the first flexible bonding portion 120 and the second flexible bonding portion 220, increasing the contact area between the wafer sidewall and the first flexible bonding portion 120 and the second flexible bonding portion 220, and improving the stability of wafer gripping during transfer. During use, since the wafers to be transferred in each batch are of the same size, the sliding frame 200 can be moved a fixed distance by controlling the operation of the linear drive 500. When gripping the wafer, the flexible strip acts on the sidewall of the wafer and will not contact the working surface, that is, it will not interfere with the working surface of the wafer. The first flexible bonding section 120 and the second flexible bonding section 220 use flexible strip to cover the wafer sidewalls. The elastic deformation of the flexible strip adapts to wafer warping, avoiding stress concentration caused by rigid clamping and reducing the risk of wafer breakage. The width of the annular grooves of the first feed roller 110 and the second feed roller 210 is smaller than the width of the strip. After the strip is embedded, its edge extends beyond the groove and contacts the sidewall, reducing rigid contact between the first feed roller 110 and the second feed roller 210 and the wafer. The torsion spring tensioning design ensures that the flexible strip maintains stable tension at all times, improving gripping stability. After the flexible strip is embedded in the annular groove in the middle, the opening near the inside remains outwardly flared, forming an inclined limiting surface. This limiting surface can support the edge of the wafer end upwards, retaining the limiting function of the flexible strip edge, balancing flexibility and structural constraints.

[0060] Reference Figures 2-3 , Figure 5To reduce the interaction force between the wafer sidewall and the flexible strip during gripping, an adjustment assembly for adjusting the length of the second flexible bonding portion 220 is provided on the sliding frame 200. The adjustment assembly 300 includes a third roller 310, an adjustment plate 330, and a linear telescopic member 340. The third roller 310 is coaxially rotatably mounted with the second roller 210 and is fixed coaxially with the second roller 210 by a key connection, and the two rotate synchronously; the flexible adjustment strip 320 is wound around the third roller 310. The adjustment plate 330 is slidably mounted on the sliding frame 200, and the adjustment plate 330 is provided with an adjustment portion 331 for contacting the flexible adjustment strip 320. When gripping the wafer, the sliding adjustment plate 330 pulls the flexible adjustment strip 320, causing the third roller 310 to rotate. The rotation of the third roller 310 drives the second roller 210 to rotate, releasing the length of the flexible strip. The length of the second flexible bonding portion 220 increases accordingly, achieving active adaptive adjustment of the length of the second flexible bonding portion 220 during wafer gripping. This further reduces stress between the wafer and the flexible strip, improving gripping stability while minimizing the impact on wafer quality. The adjustment portion 331 can be a rotating roller that contacts the flexible adjustment strip 320. The output end of the linear telescopic component 340 is fixed to the adjustment plate 330. When the adjustment plate 330 slides, the rotating roller pulls the flexible adjustment strip 320, causing the third roller 310 to rotate, thereby adjusting the length of the second flexible bonding portion 220. A photoelectric encoder is installed on the adjustment plate 330 to provide real-time position feedback. The controller adjusts the movement of the linear telescopic component 340, achieving closed-loop control. The adjustment assembly 300 drives the adjustment plate 330 via the linear telescopic member 340, pulling the flexible adjustment strip 320 to rotate the third roller 310, adjusting the length of the second flexible bonding portion 220 to adapt to the wafer size and increase the contact area between the second flexible bonding portion 220 and the wafer sidewall. The number of third rollers 310 is the same as the number of second rollers 210, with two rollers provided. The two ends of the flexible adjustment strip 320 are respectively wound around the two third rollers 310. The adjustment plate 330 is movably mounted on the sliding frame 200, and the outer peripheral surface of the adjustment portion 331 contacts the flexible adjustment strip 320. The linear telescopic member 340 is a cylinder or a miniature hydraulic cylinder, with the cylinder body fixed to the base 100, and the piston rod end connected to the adjustment plate 330. When the linear telescopic component 340 drives the adjusting plate 330 to slide, the rotating roller of the adjusting part 331 pulls the flexible adjusting strip 320, causing the third material roller 310 and the second material roller 210 to rotate synchronously, so that the flexible strip portion of the second flexible bonding part 220 is wound or released, realizing stepless length adjustment. The limit switch on the sliding frame 200 limits the sliding range of the adjusting plate 330 to avoid excessive stretching of the strip.The adjustment assembly 300 adjusts the length of the second flexible bonding portion 220 via mechanical transmission. Combined with the sliding adjustment of the sliding frame 200, the distance between the first flexible bonding portion 120 and the second flexible bonding portion 220 is adjusted. By adjusting the length of the connecting assembly 60, it can accommodate wafers of different specifications from φ100mm to φ300mm, enhancing the equipment's versatility. To ensure that the flexible adjustment strip 320 remains taut and moves in an orderly manner during adjustment and release, a tensioning roller 350 for tensioning the flexible adjustment strip 320 is also provided on the sliding frame 200.

[0061] The connecting component 60 may be a plate-like structure, with a groove for guiding the sliding frame 200 to slide. The sliding frame 200 includes a support body 201 and support arms 230 symmetrically distributed at both ends of the support body 201. The support body 201 includes a limiting slide plate 2011 that interacts with the groove. Guided by the groove and the limiting slide plate 2011, the sliding frame 200 can move on the plate of the connecting component 60 along a preset path. (Refer to...) Figure 4 Support arms 230 are symmetrically distributed on both sides of the support body 201, and the second material roller 210 is rotatably mounted on the support arms 230. By rotating the support arms 230, the position of the second material roller 210 can be adjusted, allowing it to be closer to the wafer sidewall during gripping, thus making the second flexible bonding portion 220 more adaptable to the profile of the wafer sidewall. Further reference... Figure 6 One end of the support arm 230, rotatably connected to the sliding frame 200, is connected to the transmission component 400. The transmission component 400 drives the support arm 230 to rotate. The transmission component 400 includes a transmission gear 410 and a sliding toothed plate 420. The transmission gear 410 is rotatably mounted on the support body 201 and fixedly connected to the support arm 230. Rotation of the transmission gear 410 drives the support arm 230 to rotate. The sliding toothed plate 420 is located between the two transmission gears 410 and can move on the limiting slide plate 2011. The teeth of the sliding toothed plate 420 mesh with the transmission gears 410. After the sliding toothed plate 420 slides, the meshing connection between its teeth and the transmission gears 410 drives the transmission gears 410 to rotate. At this time, the support arm 230 rotates along with the transmission gears 410, allowing the second material roller 210 to adhere to or move away from the sidewall of the wafer. Further... Figures 6-11As shown, the sliding toothed plate 420 is connected to the limiting slide plate 2011 via the elastic connector 240. The elastic tension causes its end to abut against the limiting boss 130 of the base 100, restricting the position of the sliding toothed plate 420. When the sliding frame 200 slides closer to the base 100, the sliding toothed plate 420 cannot slide with the sliding frame 200 due to the limiting effect of the limiting boss 130. At this time, the elastic connector 240 is compressed, and relative movement occurs between the limiting slide plate 2011 and the sliding toothed plate 420. Under the meshing action of the teeth of the sliding toothed plate 420 and the transmission gear 410, the support arm 230 is driven to rotate, and the angle of the second material roller 210 is finely adjusted to ensure that the second flexible bonding part 220 is bonded to the wafer. The transmission component 400, through the meshing of the sliding toothed plate 420 and the transmission gear 410, enables fine-tuning of the angle of the support arm 230, allowing the second material roller 210 to drive the second flexible bonding part 220 to adapt to the wafer sidewall angle, improving the gripping and bonding accuracy. The cooperation between the elastic connector 240 and the limiting boss 130 provides a restoring force for the sliding toothed plate 420, ensuring transmission accuracy while avoiding mechanical impact damage to the structure. The overall structure adopts centralized mechanical transmission instead of distributed sensor control, reducing reliance on electronic components and improving the reliability of the equipment in the high-temperature, high-cleanliness environment of the cleanroom. The modular design allows each component to be independently disassembled and assembled, facilitating quick replacement of worn flexible strips or rollers, shortening maintenance downtime, and improving production efficiency.

[0062] The support arm 230 is hinged to the end of the bracket body 201 via a pivot shaft; the two support arms 230 are symmetrically distributed on both sides of the sliding frame 200 to form a symmetrical clamping structure. The transmission gear 410 is a gear, which is fixed to the end of the pivot shaft of the support arm 230 via a key connection and rotates synchronously with the support arm 230; the sliding toothed plate 420 has teeth machined on both sides of its end near the transmission gear 410, and meshes with the transmission gears 410 on both sides simultaneously. The elastic connector 240 is a spring, one end of which is installed on the sliding toothed plate 420, and the other end is fixed to the limiting part 250 of the limiting slide plate 2011. In its natural state, the elastic connector 240 pulls the sliding toothed plate 420 so that its end is tightly abutted against the limiting boss 130 of the base 100. When the sliding frame 200 moves toward the base 100, the limiting boss 130 pushes the sliding toothed plate 420 to overcome the elastic force of the elastic connector 240 and slide. The sliding toothed plate 420 drives the transmission gear 410 to rotate, causing the support arm 230 to retract inward. When the sliding frame 200 moves away from the base 100, the elastic connector 240 pulls the sliding toothed plate 420 back to its original position, and the support arm 230 opens outward. This linkage mechanism allows the second flexible bonding part 220 to adaptively adjust the clamping angle according to the wafer position, improving the bonding degree to the wafer sidewall. The cooperation between the elastic connector 240 and the limiting boss 130 makes the movement of the support arm 230 synchronized with the movement of the sliding frame 200, eliminating the need for additional driving components, simplifying the structure and avoiding mechanical interference.

[0063] Reference Figures 11-12 The linear drive 500's rotating lead screw 510 is horizontally mounted on the base 100 via bearing seats at both ends. The lead screw nut engages with the threaded hole at the bottom of the sliding seat 520, which is slidably connected to the base 100 via a guide rod. The sliding frame 200 is fixed to the sliding seat 520 by bolts. The rotating drive 530 can be a servo motor or a stepper motor, connected to one end of the rotating lead screw 510 via a coupling. An encoder on the motor's output shaft provides real-time feedback on the lead screw's rotation angle, and a controller enables closed-loop position control of the sliding frame 200. This structure achieves high-precision position control of the sliding frame 200 by driving the lead screw with the rotating drive 530, meeting the positioning requirements of wafer production. The combination of the lead screw and guide rail provides strong load-bearing capacity, stably supporting the weight of the sliding frame 200 and the gripping components, maintaining stability during movement and reducing the impact of vibration on the wafer.

[0064] The tension of the torsion spring ensures stable base tension. The adjustment component 300 expands the dimensional adaptation range and can actively adjust the length of the second flexible bonding section 220. The support arm 230 and transmission component 400 enhance flexibility adaptability, while the linear drive component 500 ensures motion accuracy. This forms a complete wafer flexible gripping and transfer solution, with active control over the length of the flexible bonding gripping or the second flexible bonding section 220. All structures are linked through mechanical transmission, reducing reliance on sensors and control systems and improving the reliability and ease of maintenance of the equipment in the harsh environment of a cleanroom.

[0065] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A gripping device for wafer transfer, characterized by, The first and second gripping components (10, 20) are oppositely arranged, and a connecting component (60) is arranged for connecting the first and second gripping components (10, 20); At least one of the first and second gripping components (10, 20) is movable along the connecting component (60) to switch between a gripping state and a releasing state; The first and second gripping components (10, 20) each comprise a flexible fitting part (120, 220), and the flexible fitting parts (120, 220) are flexible belts, and the flexible fitting parts (120, 220) can respectively wrap the sidewalls of two opposite sides of a wafer to grip the wafer in the gripping state; The second gripping component (20) further comprises a sliding frame (200) provided with two second rollers (210) and second tensioning members corresponding to the two second rollers (210); the sliding frame (200) is movably connected with the connecting component (60); the two second rollers (210) are parallel to each other and rotatably installed on the sliding frame (200), and two ends of the second flexible fitting part (220) are respectively wound around the two second rollers (210); the two second tensioning members are used for tensioning the second flexible fitting part (220); The second gripping component (20) further comprises an adjusting component (300) arranged on the sliding frame (200), and the adjusting component (300) is used for driving the second rollers (210) to rotate to adjust the tension of the second flexible fitting part (220); The adjusting component (300) comprises: A third roller (310) is rotatably arranged on a side of the sliding frame (200) opposite to the second rollers (210), the second rollers are coaxially rotatable with the third roller (310), and a flexible adjusting belt (320) is wound around the third roller (310); An adjusting plate (330) is movably arranged on the sliding frame (200), and the adjusting plate (330) is provided with an adjusting part (331) used for contacting the flexible adjusting belt (320), and the adjusting plate (330) can pull the flexible adjusting belt (320) through the adjusting part (331) to rotate the third roller (310); A linear telescopic member (340) is used for driving the adjusting plate (330) to slide.

2. The gripping device according to claim 1, characterized in that The first gripping component (10) further comprises a base (100), two first rollers (110), and first tensioning members corresponding to the two first rollers (110); The base (100) is fixedly connected with the connecting component (60); Two first material rollers (110) are parallel to each other and rotatably mounted on the base (100), and two ends of the first flexible fitting part (120) are respectively arranged around the two first material rollers (110). Two first tensioning members are used for tensioning the first flexible fitting part (120).

3. The gripping device for wafer transfer according to claim 2, wherein The linear telescopic member (340) is arranged on the base (100).

4. The gripping device for wafer transfer according to claim 2, wherein The number of the third material rollers (310) is two, and the third material rollers (310) are coaxially arranged and rotate corresponding to the second material rollers (210), and two ends of the flexible adjusting belt material (320) are respectively arranged around the two third material rollers (310).

5. The gripping device for wafer transfer according to claim 4, wherein The adjusting part (331) is a rotating roller rotatably arranged on the adjusting plate (330), and the adjusting assembly (300) further comprises a tensioning roller (350) rotatably arranged on the sliding frame (200), the tensioning roller (350) is arranged between the adjusting part (331) and each third material roller (310), and the flexible adjusting belt material (320) is sequentially arranged around the third material roller (310), the tensioning roller (350), the adjusting part (331), another tensioning roller (350) and another third material roller (310).

6. The gripping device for wafer transfer according to any one of claims 2 to 5, characterized in that, The connecting assembly (60) comprises a sliding groove; The sliding frame (200) comprises a support body (201), and the support body (201) comprises a limiting sliding plate (2011) penetrating into the sliding groove, and the limiting sliding plate (2011) is movable along the sliding groove, so that the sliding frame (200) is movably connected with the connecting assembly (60).

7. The gripping device for wafer transfer according to claim 6, wherein The sliding frame (200) further comprises support arms (230) symmetrically distributed at two ends of the support body (201), the support body (201) is connected with the connecting assembly (60), the two support arms (230) are rotatably connected with the support body (201), and the two second material rollers (210) are rotatably arranged on the support arms (230).

8. The gripping device for wafer transfer according to claim 7, wherein The transmission member (400) is used for driving the support arms (230) to rotate, and the transmission member (400) comprises: A transmission gear (410) is rotatably arranged on the support body (201) and fixedly connected with the support arms (230); A sliding tooth plate (420) is movably connected with the limiting sliding plate (2011), the sliding tooth plate (420) is located between the two transmission gears (410) and is engaged with the transmission gears (410), and the sliding tooth plate (420) can drive the transmission gears (410) to rotate.

9. The gripping device for wafer transfer according to claim 8, wherein The base (100) is provided with a limiting boss (130), the sliding frame (200) is provided with an elastic connecting piece (240), the elastic connecting piece (240) is connected with the limiting part (250) of the limiting slide plate (2011) and the sliding tooth plate (420) respectively at two ends, and the elastic connecting piece (240) is used for elastically pulling the sliding tooth plate (420) to make the end of the sliding tooth plate (420) abut against the limiting boss (130).

10. The gripping device for wafer transfer according to claim 9, wherein Further comprising a linear driving piece (500) arranged on the base (100), the linear driving piece (500) is used for driving the sliding frame (200) to slide, and the linear driving piece (500) comprises: A rotating lead screw (510) is rotatably arranged on the base (100); A sliding seat (520) is slidably arranged on the base (100) and is in transmission connection with the rotating lead screw (510), and the sliding frame (200) is connected with the sliding seat (520); A rotating driving piece (530) is arranged on the base (100), and the rotating driving piece (530) is used for driving the rotating lead screw (510) to rotate.

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