Energy conversion system and energy storage system

Abstract

The embodiment of the invention relates to the field of energy storage, and provides an energy conversion system and an energy storage system. The energy conversion system includes: a power circuit board; the electronic device comprises a device body and device pins, the electronic device is located on one side of the power circuit board, and the device pins are electrically connected with the power circuit board; the first cooling device comprises a device body and device pins, the first cooling device is located on the side, away from the power circuit board, of the electronic device, the device pins are electrically connected with the power circuit board, and the orthographic projection of the electronic device on the power circuit board and the orthographic projection of the first cooling device on the power circuit board are at least partially overlapped. According to the energy conversion system, the electronic device is flatly welded above the power circuit board, the first cooling device is directly installed above the electronic device element, the device space is saved, a welding process is saved, after the electronic device is heated, heat is diffused upwards, heat is directly dissipated through the first cooling device, and the heat dissipation effect is better.

Description

Technical Field

[0001] The present application relates to the field of energy storage, and in particular to an energy conversion system and an energy storage system. Background Art

[0002] An energy conversion system refers to a collection of devices or equipment that converts one form of energy into another. These systems are widely used in fields such as power generation, chemical engineering, automotive, and aerospace. Their primary function is to achieve efficient and controllable energy conversion to meet specific application requirements. Examples include inverters that convert DC to AC, rectifiers that convert AC to DC, and power conversion systems (PCSs) in energy storage systems. These systems are responsible for converting electrical energy from one state to another for storage, transmission, or utilization.

[0003] In energy conversion systems, heat dissipation management of electronic components is crucial. Electronic components such as transistors, diodes, and IGBTs (insulated-gate bipolar transistors) generate heat during operation. If this heat cannot be dissipated promptly and effectively, the component temperature will rise. Exceeding the operating temperature range can cause performance degradation or even permanent damage. However, existing methods for mounting electronic components and the first cooling device on power circuit boards suffer from complex soldering processes, low heat dissipation efficiency, and poor reliability. Summary of the Invention

[0004] The embodiments of the present application provide an energy conversion system and an energy storage system, which at least helps to improve the heat dissipation effect of electronic devices in the power circuit board, saves welding processes, saves welding resources, and improves the reliability of the energy conversion system.

[0005] According to some embodiments of the present application, on the one hand, the embodiments of the present application provide an energy conversion system, including: a power circuit board; an electronic device, including a device body and a device pin, the electronic device is located on one side of the power circuit board, and the device pin is electrically connected to the power circuit board; a first cooling device, including a device body and a device pin, the first cooling device is located on a side of the electronic device away from the power circuit board, the device pin is electrically connected to the power circuit board, and the orthographic projection of the electronic device on the power circuit board and the orthographic projection of the first cooling device on the power circuit board at least partially overlap.

[0006] In some embodiments, at least one of the electronic components and the first cooling device are connected via a first connector.

[0007] In some embodiments, the number of the first connectors is the same as the number of the electronic components connected to the first cooling device.

[0008] In some embodiments, a plurality of the electronic devices are arranged in an array, and the plurality of the electronic devices connected to the same first cooling device are located in the same row or column, and the orthographic projections of the device pins of the plurality of the electronic devices connected to the same first cooling device on the power circuit board do not overlap with the orthographic projections of the first cooling device on the power circuit board.

[0009] In some embodiments, the multiple electronic devices connected to the same first cooling device include a first part and a second part, the first part is located in the first column, the second part is located in the second column, the device pins of the electronic devices in the first part are all located on the side away from the second part, and the device pins of the electronic devices in the second part are all located on the side away from the first part.

[0010] In some embodiments, the first cooling device is a straight-line radiator.

[0011] In some embodiments, the energy conversion system further includes: a second cooling device, which is fixed to the base plate of the straight-line radiator through a second connecting member, and the wind direction of the second cooling device is the same as the direction of the fins of the straight-line radiator.

[0012] In some embodiments, the length of the fins of the in-line heat sink in a first direction is 15 mm to 16 mm, and the first direction is the thickness direction of the power circuit board.

[0013] In some embodiments, the first cooling device is a pin-type heat sink.

[0014] In some embodiments, the energy conversion system also includes: a third cooling device and a support structure, the third cooling device is fixed to the top of the support structure and close to the side of the first cooling device through a third connecting member, the support structure is connected to the first cooling device through a fourth connecting member, and the third cooling device is located on the side of the first cooling device away from the electronic device.

[0015] In some embodiments, the surface of the power circuit board close to the electronic device has multiple sunken areas, and the device pin includes a first horizontal portion, a first bent portion, a vertical portion, a second bent portion and a second horizontal portion connected in sequence, wherein the first horizontal portion and the second horizontal portion are parallel to the surface of the power circuit board close to the electronic device, the vertical portion is perpendicular to the surface of the power circuit board close to the electronic device, and the second horizontal portion is connected to the sunken areas of the power circuit board.

[0016] In some embodiments, the device body of the electronic device is in contact with the power circuit board.

[0017] In some embodiments, the energy conversion system further includes: a filling structure, wherein the filling structure is located in a gap between the device body of the electronic device and the power circuit board.

[0018] In some embodiments, the energy conversion system also includes: an insulating ceramic sheet, a side surface of the electronic device away from the power circuit board is bonded and fixed to the first surface of the insulating ceramic sheet by a first insulating thermal conductive adhesive, and the second surface of the insulating ceramic sheet is bonded and fixed to the contact heat dissipation surface of the first cooling device by a second insulating thermal conductive adhesive, and the first surface and the second surface are opposite surfaces.

[0019] According to some embodiments of the present application, another aspect of the present application provides an energy storage system, comprising: any one of the energy conversion systems described above.

[0020] The technical solution provided by the embodiment of the present application has at least the following advantages: an electronic device, including a device body and device pins, the electronic device is located on one side of a power circuit board, and the device pins are electrically connected to the power circuit board; a first cooling device, including a device body and device pins, the first cooling device is located on a side of the electronic device away from the power circuit board, and the device pins are electrically connected to the power circuit board, and the orthographic projection of the electronic device on the power circuit board and the orthographic projection of the first cooling device on the power circuit board at least partially overlap. The energy conversion system welds the electronic device flat on top of the power circuit board, and the first cooling device is directly installed above the electronic device element, which not only saves device space but also saves a welding process. Moreover, after the electronic device generates heat, the heat diffuses upward and is directly dissipated through the first cooling device, resulting in a better heat dissipation effect. This solves the problems of the prior art in which the electronic device and the first cooling device are installed on the power circuit board, such as the complex welding process, low heat dissipation efficiency, and low reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplified by the figures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. Unless otherwise stated, the figures in the drawings do not constitute a scale limitation. In order to more clearly illustrate the embodiments of the present application or the technical solutions in the traditional technology, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of the installation position of an electronic device and a power circuit board provided in the prior art;

[0023] Figure 2 A schematic structural diagram of the installation positions of electronic components and a power circuit board in an energy conversion system provided according to an embodiment of the present application;

[0024] Figure 3 A schematic diagram of the detailed structure of a power circuit board provided according to an embodiment of the present application;

[0025] Figure 4 A schematic diagram of the detailed structure of an electronic device provided according to an embodiment of the present application;

[0026] Figure 5 A schematic diagram of the detailed structure of a first cooling device provided according to an embodiment of the present application;

[0027] Figure 6 A schematic diagram of an installation structure of a first cooling device and an electronic device provided according to an embodiment of the present application;

[0028] Figure 7 A schematic diagram of the installation positions of a first cooling device and an electronic component provided according to an embodiment of the present application;

[0029] Figure 8 A schematic diagram of the installation positions of another first cooling device and an electronic component provided according to an embodiment of the present application;

[0030] Figure 9 A schematic diagram of an installation structure of a first cooling device and a second cooling device provided according to an embodiment of the present application;

[0031] Figure 10 A schematic diagram of an installation structure of a first cooling device and a third cooling device provided according to an embodiment of the present application;

[0032] Figure 11 A schematic structural diagram of the installation positions of an electronic device and a power circuit board provided according to an embodiment of the present application;

[0033] Figure 12 A schematic structural diagram of the installation positions of another electronic device and a power circuit board provided according to an embodiment of the present application;

[0034] Figure 13 A schematic structural diagram of another energy conversion system provided according to an embodiment of the present application.

[0035] The above drawings include the following reference numerals:

[0036] 10. Power circuit board; 11. Sunken area; 20. Electronic device; 21. Device body; 22. Device pin; 221. First horizontal portion; 222. First bending portion; 223. Vertical portion; 224. Second bending portion; 225. Second horizontal portion; 23. First connector; 24. Through hole; 30. First cooling device; 31. Device body; 32. Device pin; 33. Recess; 34. Substrate; 40. Second cooling device; 41. Second connector; 50. Third cooling device; 51. Third connector; 60. Support structure; 61. Fourth connector; 70. Filling structure; 80. Insulating ceramic sheet. DETAILED DESCRIPTION

[0037] As can be seen from the background art, in existing energy conversion systems, electronic devices are installed below the power circuit board and use a double-sided soldering method. That is, the pins of the electronic devices are first soldered on the top of the power circuit board, and then the electronic devices are soldered again on the bottom of the power circuit board. This results in a complex soldering process, a small contact area between the electronic devices and the power circuit board, and low reliability. Furthermore, in the prior art, electronic devices are inserted into the power circuit board from below in a vertical position, that is, in the prior art, the electronic devices are placed vertically. This results in a high space utilization rate at height. In the prior art, the heat sink is installed in the entire air duct below the electronic devices, and the heat sink is also relatively large, resulting in a high space utilization rate. Furthermore, in the power circuit board, the electronic devices are the primary heat-generating components. When the electronic devices are installed below the power circuit board, the heat generated by the electronic devices travels upward, causing a baking effect on the power circuit board itself, which can also cause significant damage to the power circuit board.

[0038] Figure 1 A schematic diagram of the structure of an energy conversion system provided in the prior art is shown in FIG. Figure 1 As shown in the figure, it can be seen that the electronic device 20 is welded under the power circuit board 10, the device body 21 of the electronic device 20 is located between the power circuit board 10 and the first cooling device 30 (i.e., the heat sink), and the device pins 22 of the electronic device 20 pass through the power circuit board 10. During the welding process, it is necessary to first weld the front side of the power circuit board 10 (i.e., Figure 1 The device pins 22 of the electronic device 20 are soldered on the side surface away from the electronic device 20, and then the reverse side of the power circuit board 10 (ie Figure 1 The device pin 22 of the electronic device 20 is soldered on the side surface close to the electronic device 20), that is, it needs to be soldered twice, which will consume soldering resources.

[0039] The embodiments of the present application provide an energy conversion system and an energy storage system.

[0040] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0041] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0042] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0043] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0044] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0045] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0046] In the accompanying drawings corresponding to the embodiments of the present application, the thickness and area of ​​the layers are exaggerated for better understanding and ease of description. When describing a component (such as a layer, film, region, or substrate) as being on another component or on the surface of another component, the component may be "directly" located on the surface of the other component, or a third component may be present between the two components. Conversely, when describing a component as being on the surface of another component or as being formed or provided on the surface of a component, it means that there is no third component between the two components. In addition, when describing a component as being "substantially" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0047] In the description of the embodiments of this application, when a component "includes" another component, unless otherwise specified, other components are not excluded, and other components may be further included. In addition, when a component such as a layer, film, region, or plate is referred to as being "on / located on" another component, it can be "directly on" the other component (i.e., located on the surface of the other component with no other components between them) or another component can be present between them. In addition, when a component such as a layer, film, region, or plate is "directly on" another component, or when a component such as a layer, film, region, or plate is located on the surface of another component, it means that no other components are located between them.

[0048] The terms used herein in the description of the various embodiments are intended only to describe the specific embodiments and are not intended to be limiting. As used in the description of the various embodiments and the appended claims, "part" is intended to include the plural form unless the context clearly indicates otherwise. A component includes a layer, film, region, or plate.

[0049] The following detailed description of the various embodiments of the present application is provided in conjunction with the accompanying drawings. However, those skilled in the art will appreciate that many technical details are provided in the various embodiments of the present application to facilitate a better understanding of the present application. However, even without these technical details and the various variations and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.

[0050] In order to solve the problem in the prior art that the installation method of electronic components and the first cooling device on the power circuit board has defects such as complex welding process, low heat dissipation efficiency and low reliability, the embodiments of the present application provide an energy conversion system and an energy storage system.

[0051] The present application provides an energy conversion system, such as Figure 2As shown, it includes: a power circuit board 10; an electronic device 20, including a device body 21 and a device pin 22, the electronic device 20 is located on one side of the power circuit board 10, and the device pin 22 is electrically connected to the power circuit board 10; a first cooling device 30, including a device body 31 and a device pin 32, the first cooling device 30 is located on a side of the electronic device 20 away from the power circuit board 10, and the device pin 32 is electrically connected to the power circuit board 10, and the orthographic projection of the electronic device 20 on the power circuit board 10 and the orthographic projection of the first cooling device 30 on the power circuit board 10 at least partially overlap.

[0052] The energy conversion system can be a power conversion system (PCS). Also known as an energy storage inverter, a PCS is a core component of an energy storage system. It includes power conversion components (e.g., MOSFETs, diodes, etc.), control components, protection components, a communication module, and a heat dissipation system (e.g., a primary cooling device, fan, or liquid cooling plate).

[0053] These power circuit boards are typically rigid printed circuit boards (PCBs). In energy conversion systems (e.g., energy storage converters), electronic devices on these boards, such as IGBTs (insulated-gate bipolar transistors) and MOSFETs (metal-oxide-semiconductor field-effect transistors), are responsible for converting direct current (DC) to alternating current (AC), and vice versa, for energy storage, conversion, and transmission. This is the most fundamental and critical function of a PCS, directly determining the energy storage system's ability to effectively integrate into the grid or an independent power supply system. By controlling the on and off times of electronic switching devices, the power circuit board can adjust the output voltage, current, and frequency to suit varying load demands and grid conditions. This regulatory capability is crucial for balancing supply and demand and optimizing energy distribution. The power circuit board also incorporates integrated overload protection circuitry that rapidly disconnects the circuit in the event of system anomalies such as short circuits, overvoltage, or overcurrent, protecting other components and ensuring the safe operation of the energy storage system.

[0054] In the above embodiment, the electronic device is welded flat on top of the power circuit board so that the pins of the electronic device are subjected to less stress and are less likely to be damaged, thereby increasing the reliability of the entire system. In addition, the first cooling device (i.e., the heat sink) is installed directly above the electronic device. After the electronic device generates heat, the heat diffuses upward and is directly dissipated through the first cooling device, resulting in a better heat dissipation effect.

[0055] That is, in the traditional upright mounting configuration, the pins of the electronic device not only bear the weight of the device itself, but also need to bear the additional vertical pressure of the first cooling device. This superimposed burden, especially when the PCS is subjected to vibration or in transportation, will cause the pins to experience significant fatigue accumulation and even cause fractures, thereby shortening the working life of the device and threatening the overall stability of the system. In contrast, when electronic devices adopt a flat welding layout, the force-bearing method of their pins undergoes a fundamental change - they mainly face horizontal contact pressure rather than the vertical downward gravity challenge. Thanks to the larger contact surface area, the actual pressure borne by each pin is greatly alleviated, significantly reducing the potential risk of mechanical damage to the pins, thereby significantly enhancing the long-term reliability of the electronic device and the robust operation of the entire system.

[0056] Furthermore, if the electronic device is installed below the power circuit board, then after the electronic device generates heat, the heat will naturally diffuse upwards, which will increase the temperature of the power circuit board. In this case, the power of the first cooling device needs to be set higher to dissipate heat for both the electronic device and the power circuit board. Moreover, since the heat generated by the electronic device diffuses upwards, and the first cooling device is installed below the electronic device, the heat dissipation effect of the first cooling device will be reduced. In order to meet the heat dissipation requirements, a larger and higher-powered first cooling device is required for heat dissipation, which not only occupies a larger space in the system, but also causes a larger power loss of the first cooling device. Figure 1 The volume and power consumption of the first cooling device in the prior art are both greater than Figure 2 In this embodiment, the heat generated by the electronic device naturally diffuses upward, directly to the first cooling device above. This heat diffusion direction conforms to the principles of natural thermodynamics, making the heat dissipation process smoother and more efficient. The first cooling device can fit more closely to the electronic device, and the design can consider a larger contact area, denser or more efficient heat sinks to meet the needs of direct heat dissipation.

[0057] That is, the technical solution provided by the embodiment of the present application has at least the following advantages: an electronic device, including a device body and device pins, the electronic device is located on one side of the power circuit board, and the device pins are electrically connected to the power circuit board; a first cooling device, including a device body and device pins, the first cooling device is located on the side of the electronic device away from the power circuit board, and the device pins are electrically connected to the power circuit board, and the orthographic projection of the electronic device on the power circuit board and the orthographic projection of the first cooling device on the power circuit board at least partially overlap. This energy conversion system welds the electronic device flat on top of the power circuit board, and the first cooling device is directly installed above the electronic device element, which not only saves device space but also saves a welding process. Moreover, after the electronic device generates heat, the heat diffuses upward and is directly dissipated through the first cooling device, resulting in a better heat dissipation effect. This solves the problems of the prior art in which the electronic device and the first cooling device are installed on the power circuit board, such as the complex welding process, low heat dissipation efficiency, and low reliability.

[0058] And, as Figure 2 As shown, the length of the device pins 32 of the first cooling device 30 is greater than the thickness of the electronic device 20. Since the first cooling device 30 is located on the side of the electronic device 20 away from the power circuit board 10 and the first cooling device 30 is connected to the power circuit board 10 via pins, the height of the pins of the first cooling device 30 must be greater than the thickness of the electronic device 20. In addition, the pins of the first cooling device 30 extend beyond the thickness of the electronic device 20, ensuring close contact between the first cooling device and the device, forming a more direct and efficient heat conduction path. This design helps accelerate the transfer of heat from the electronic device to the first cooling device, thereby improving the overall heat dissipation efficiency and keeping the device within a safe operating temperature range. The additional length of the first cooling device pins can provide stronger physical support, making the connection between the first cooling device and the power circuit board 10 more secure, reducing the possibility of loosening or displacement caused by external forces (such as vibration and impact), and improving the mechanical reliability of the system.

[0059] Generally, the pins of the first cooling device are distributed at the four corners of the first cooling device, that is, there are four pins.

[0060] Specifically, if Figure 3 、 Figure 4 and Figure 5 、 Figure 6 As shown, the electronic device 20 includes a through hole 24 and the first cooling device 30 has a recess 33. At least one of the electronic device 20 and the first cooling device 30 are connected via a first connector 23.

[0061] The first connecting member 23, such as a screw, a clamp or an elastic fixing member, can not only firmly connect the electronic device 20 and the first cooling device 30, but also effectively resist the risk of loose connection caused by vibration, temperature fluctuation or external physical impact, greatly enhancing the mechanical strength and operational reliability of the system. The moderate pressure applied by the first connecting member 23 ensures that a close contact interface is formed between the electronic device and the cooling device, which directly reduces the thermal resistance and promotes the high-speed conduction of heat energy. In this way, the heat emitted by the device during operation can be quickly captured and directed to the cooling device, effectively suppressing the surface temperature of the device, thereby significantly improving the durability and life cycle of the device.

[0062] Furthermore, compared to traditional welding or gluing methods, modular installation using the first connector 23 significantly optimizes the assembly and disassembly process of the electronic device 20 and the first cooling device 30, greatly facilitating equipment maintenance and upgrades. If either component fails and requires replacement, it can be quickly and non-destructively replaced, significantly reducing maintenance wait time and associated maintenance costs.

[0063] Crucially, the sophisticated design of the first connector 23 allows for a certain degree of elastic deformation or adjustment, thereby buffering the thermal expansion and contraction effects of the electronic device 20 and the first cooling device 30 at different operating temperatures. This feature effectively mitigates the mechanical stress caused by repeated thermal cycling, reducing the resulting material wear and structural damage, further strengthening the overall stability of the system and the safety of long-term operation.

[0064] In short, the use of the first connector 23 not only strengthens the physical connection between the electronic device and the cooling device, but also significantly improves the thermal management efficiency and simplifies the maintenance process. At the same time, through its unique elastic mechanism, it effectively alleviates the negative impact of temperature changes and comprehensively guarantees the efficient, stable and long-term operation of the energy conversion system.

[0065] The inner wall of the above-mentioned recess 33 has a thread, and the above-mentioned thread is used to lock the screw. The above-mentioned screw is used to pass through the through hole 24 of the above-mentioned power device and couple with the recess 33 and the nut of the first cooling device 30 respectively to connect the above-mentioned electronic device 20 and the above-mentioned first cooling device 30. The aperture of the above-mentioned through hole 24 is larger than the diameter of the above-mentioned screw.

[0066] In some embodiments, at least one of the electronic components and the first cooling device are connected via a first connector.

[0067] When the primary cooling device is dedicated to a single electronic device, this precise one-to-one pairing strategy ensures that the cooling device fits snugly onto the surface of the electronic device, creating an efficient heat conduction channel directly to the heat source. By eliminating the middleman, this direct contact minimizes resistance during heat transfer, accelerates the rate of heat dissipation, effectively curbs the operating temperature of the electronic device, and significantly improves the overall heat dissipation efficiency of the system. Assigning a dedicated primary cooling device to each electronic device not only greatly simplifies the thermal management layout at the circuit board level, avoiding the common spatial constraints and uneven heat flow distribution problems when multiple devices share the same cooling device, but also gives circuit board design unprecedented freedom and flexibility.

[0068] Importantly, this personalized cooling solution significantly improves system maintenance convenience and modular upgrade potential. Because each electronic component and its corresponding cooling unit independently interfere with each other, in the event of a failure or maintenance requirement, precise operation can be performed on the affected component without affecting the entire system. This significantly reduces maintenance complexity and equipment downtime. It also facilitates the upgrade of specific electronic components or cooling units, ensuring that the system can continuously adapt to changing technical and performance requirements.

[0069] Furthermore, the one-to-one first cooling device design demonstrates a deep understanding of and flexible response to the diverse characteristics of electronic devices. It allows designers to tailor the most appropriate cooling device type and specifications based on the specific thermal behavior, physical dimensions, and installation location requirements of each electronic device. This customized selection not only improves system response speed and cooling accuracy, but also optimizes overall system performance, enabling it to better adapt to complex circuit architectures and demanding operating conditions.

[0070] When the primary cooling device is dedicated to a single electronic component, this one-to-one assembly ensures that the cooling device fits seamlessly into the electronic component, establishing a core heat conduction link directly to the heat source. This unique direct contact design significantly reduces obstacles in the heat conduction path, accelerates the rate of heat dissipation, and significantly suppresses the operating temperature of the electronic component, enhancing the system's heat dissipation efficiency and thermal management effectiveness. Each electronic component is equipped with its own independent primary cooling device. This strategy not only cleverly simplifies the thermal design complexity at the circuit board level and optimizes the layout, but also avoids the space constraints and unbalanced heat distribution commonly faced when multiple devices share the same cooling device.

[0071] This specialized cooling solution also offers significant advantages in maintenance and upgrades. Because each electronic component and its corresponding cooling system are independent, when a component or its cooling system experiences a failure or requires regular inspection, localized and precise intervention can be implemented, avoiding the potential risk of a chain reaction and ensuring the continued operation of remaining components. This targeted maintenance approach not only significantly reduces repair time and effort, but also significantly enhances the modular upgrade capabilities of the overall equipment and facilitates routine maintenance, laying a solid foundation for the long-term, stable operation of the system.

[0072] Furthermore, the one-to-one primary cooling device configuration demonstrates a design philosophy that meticulously considers the thermal properties, physical form, and installation environment of individual electronic devices. It empowers designers to carefully select the optimal cooling device type and parameters based on each device's unique thermal characteristics, size, and specific location on the circuit board. This highly customized option not only promotes refined and personalized thermal management, but also effectively improves overall system performance, enabling it to easily address the diverse thermal management challenges of complex circuit architectures and achieve a perfect fusion of system performance and circuit design requirements.

[0073] In summary, this one-to-one cooling device assembly solution, with its efficient heat conduction, simple layout optimization, precise maintenance strategy, and highly personalized selection mechanism, has brought unprecedented thermal management breakthroughs to high-power electronic equipment such as energy storage inverters. It is a powerful guarantee for improving system operational stability, optimizing circuit design, and promoting the long-term development of equipment.

[0074] Furthermore, the configuration of one primary cooling device per electronic device allows for greater flexibility in the placement of electronic devices on the power circuit board. This design allows for a cooling solution tailored to each electronic device's power level and thermal characteristics. For example, a high-power IGBT might require a larger primary connector and a more efficient primary cooling device, while a lower-power device could utilize a smaller connector and cooling device, enabling flexible system configuration and optimization.

[0075] The first connector directly physically connects the electronic device (such as an IGBT, MOSFET, or other power semiconductor device) to the first cooling device (such as a heat sink, heat pipe, or liquid cooling plate), reducing thermal resistance and improving heat transfer efficiency. This means that heat generated by the electronic device can be transferred to the cooling medium more quickly, effectively reducing device temperature and improving heat dissipation. The connector not only transfers heat but also secures the electronic device and cooling device, providing additional mechanical support. On power circuit boards, especially when the devices and cooling device are large, this stable connection helps reduce vibration and displacement, prevents device damage due to mechanical stress, and enhances the overall mechanical stability of the system.

[0076] In some embodiments, the number of the first connectors is the same as the number of the electronic components connected to the first cooling device.

[0077] Among them, each electronic device has a first connector connected to the first cooling device, which can make the connection between the first cooling device and the electronic device stronger and more stable. If the first connector matches the number of electronic devices, it will be easier to identify and handle specific devices and their corresponding cooling connections during maintenance or replacement. If a device or its connector fails, only the relevant components need to be replaced without affecting the normal operation of other devices, reducing the complexity and cost of maintenance. The one-to-one connection method reduces the number of connection points and reduces the possibility of failure. At the same time, each connector carries a moderate load, avoiding mechanical or thermal interface failure caused by excessive pressure on a few connectors, thereby improving the overall reliability of the system.

[0078] In other embodiments, the number of first connectors and the number of electronic devices connected to the first cooling device may differ. For example, if four electronic devices share a first cooling device, the two central electronic devices may not be connected to the first cooling device using first connectors, while only the two peripheral electronic devices may be connected to the first cooling device using first connectors. This can reduce costs, but system reliability may not be as high as in the one-to-one installation embodiment described above.

[0079] In some embodiments, such as Figure 7 As shown, the plurality of electronic devices 20 are arranged in an array, the plurality of electronic devices 20 connected to the same first cooling device 30 are located in the same row or column, and the device pins 22 of the plurality of electronic devices 20 connected to the same first cooling device 30 on the power circuit board 10 do not overlap with the orthographic projection of the first cooling device 30 on the power circuit board 10.

[0080] The positioning of electronic components and cooling devices in an array arrangement, either in rows or columns, ensures that the device pins and the cooling device projections on the power circuit board do not overlap. This layout maximizes the use of the limited circuit board area. It prevents the cooling device from obstructing the device pins, providing more space for other circuits and components, and contributing to a compact circuit board design. By sharing a single primary cooling device for multiple electronic components in the same row or column, the cooling system's structure and assembly process are simplified. This design reduces the number of cooling devices, lowering costs, while also eliminating the need for connectors, further reducing the burden on the circuit board and improving overall reliability. This layout evenly distributes heat generated by the electronic components, preventing localized overheating, which is crucial for improving thermal management in power circuit boards. Multiple components sharing a cooling device share heat dissipation resources, ensuring adequate cooling for each component and extending its lifespan. The array arrangement and clear projection separation make it easier for maintenance personnel to access and inspect each electronic component and its pins without worrying about interference from the cooling device. This is crucial during equipment maintenance and troubleshooting, speeding up repairs and reducing downtime.

[0081] In some embodiments, such as Figure 8 As shown, the multiple electronic devices 20 connected to the same first cooling device 30 include a first part and a second part, the first part is located in the first column, the second part is located in the second column, the device pins 22 of the electronic devices 20 in the first part are all located on the side away from the second part, and the device pins 22 of the electronic devices 20 in the second part are all located on the side away from the first part.

[0082] like Figure 8 As shown, Figure 8 It is shown that two columns of electronic devices 20 share the same first cooling device 30 , wherein the left column of electronic devices 20 is the first part, and the right column of electronic devices 20 is the second part.

[0083] Placing the pins of electronic components on the side away from devices in other columns reduces lateral heat transfer between components, thus preventing cross-talk between components in different columns and improving cooling efficiency. The primary cooling device can more centrally handle the heat generated by components in each column without interference from neighboring components. This layout ensures electrical isolation between components, as component pins are not located near components in adjacent columns, reducing the risk of electrical short circuits. This electrical isolation is particularly critical in high-power and high-voltage applications. The directional design of the component pins allows for clearer wiring, reduces cable entanglement, and simplifies the circuit board wiring process. Furthermore, the assembly process is more straightforward because the pin orientation of each component is predetermined, reducing the possibility of assembly errors. By sharing a single primary cooling device between the first and second columns, cooling device space is reduced, as a separate cooling device is no longer required under each column. This results in a more compact circuit board design, contributing to the miniaturization of the overall device.

[0084] Placing the primary cooling unit above the electronic components allows for the selective sharing of a single cooling unit for a group of electronic components, while equipping other groups with separate cooling units. Alternatively, a single, comprehensive, large-area primary cooling unit can be used to uniformly handle the heat dissipation needs of all electronic components. This grouped or unified cooling strategy aims to balance cost and efficiency. By implementing shared cooling for electronic components with similar heat generation, it can, to a certain extent, control the overall investment in the primary cooling unit and achieve economic optimization through resource sharing.

[0085] While the initial investment may be higher when choosing a single, large, and comprehensive cooling system, this integrated approach not only saves valuable board space and streamlines the layout, but also offers economies of scale during production and installation. Manufacturing and deploying large cooling systems in batches is often more cost-effective than installing multiple, smaller units. This reduces material sourcing fragmentation and redundant manufacturing steps, reducing overall material and labor costs.

[0086] However, the integrated large-scale cooling device also poses new engineering challenges, mainly because its stability and structural support requirements are significantly increased. Given its considerable size and the weight it carries, the circuit board design must incorporate additional structural reinforcement elements, such as adding support points or using high-strength fixing accessories to ensure that the cooling device remains stable when subjected to its own weight and unexpected mechanical stress. To achieve this goal, the number of fixing points of the first cooling device needs to be increased to more than four to disperse the load and enhance the reliability of the structure. In addition, when choosing the first cooling device, designers can consider direct-plug or ejector-type heat sinks. Both heat sinks have their own advantages. Direct-plug heat sinks have a simple structure and are easy to install. Although the ejector-type heat sink has a slightly more complex structure, it performs better in high-power applications due to its larger heat dissipation area and better heat exchange performance.

[0087] In short, by flexibly utilizing the primary cooling device assembly strategy, whether for group sharing or full coverage, an optimal balance can be found between cost control, space management, and heat dissipation efficiency. At the same time, facing the structural stability challenges posed by large cooling devices, reasonable support design and high-quality fixing components are essential key factors, ensuring the system's reliability and durability in complex operating environments. This innovative heat dissipation solution reflects in-depth consideration of refined electronic device thermal management and overall system optimization, providing a new perspective and practical path for the thermal design of high-performance electronic equipment.

[0088] In some embodiments, the first cooling device is a straight-line radiator.

[0089] A direct-plug heat sink is a set of pin-shaped fins that are positioned perpendicular to the circuit board surface or anchored directly to heat-generating electronic components. These fins are arranged in a dense array, creating direct physical contact with the power device. Leveraging the inherent thermal conductivity of the metal material, they efficiently absorb and dissipate the heat generated by the device. The production process for direct-plug heat sinks is straightforward, making them easy to standardize and mass-produce, and the assembly process is also relatively quick.

[0090] In contrast, the construction and manufacturing process of a pin-type heat sink is more sophisticated and complex. It is characterized by a slender, high-density layout of the heat sink fins, designed to maximize the heat dissipation surface area and heat exchange efficiency. This design places higher demands on material selection and processing precision to ensure that the heat sink maintains good thermal conductivity and mechanical strength while bearing its own structural loads and thermal stresses. Given these characteristics, the pin-type heat sink is particularly suitable for applications with high power density and high heat flux density, although its manufacturing cost and complexity may be higher than that of a direct-insert heat sink.

[0091] In summary, the choice of heat sink type should be closely centered around the specific needs of the application. In-line heat sinks excel in low- to medium-power applications due to their ease of manufacturing and cost-effectiveness, while pin-type heat sinks, with their superior thermal management capabilities and material strength, offer exceptional heat dissipation efficiency and reliability in high-power, high-heat-load environments. When considering heat sink type, designers should comprehensively evaluate the system's thermal characteristics, cost budget, manufacturing feasibility, and long-term operational stability to determine the best fit for their project.

[0092] In the case where the first cooling device is a straight-line radiator, Figure 9 As shown, the energy conversion system further includes: a second cooling device 40, which is fixed to the base plate 34 of the straight-line radiator via a second connecting member 41, and the wind direction of the second cooling device 40 is the same as the direction of the fins of the straight-line radiator.

[0093] The second cooling device, specifically a low and efficient fan, has an installation height precisely controlled between 6mm and 7mm and is directly mounted on the base of the first cooling device (i.e., the radiator). This innovative layout cleverly omits the traditional fan bracket structure, thereby achieving streamlined use of space in the vertical direction, although the occupied area in the horizontal dimension is relatively increased. Fixing the fan directly to the radiator base not only simplifies the installation steps, but also ensures a seamless connection between the fan and the radiator. The generated airflow can directly and accurately impact the radiator fins, significantly improving the utilization efficiency of the airflow and cooling performance, reducing the ineffective paths during the air flow process, and thus achieving a more efficient and intensive thermal management solution.

[0094] When fans are placed on the baseplate of an inline or pin-type heat sink, with their airflow aligned with the fin arrangement, this layout ensures unimpeded airflow or cooling medium flow through both cooling systems, greatly expanding the effective surface area for heat exchange and significantly enhancing the system's heat dissipation performance. This dual cooling mechanism effectively handles the additional heat load, particularly under conditions of high power output or elevated ambient temperatures. By precisely optimizing air flow direction, it avoids turbulence or dead zones between cooling elements, enhancing cooling uniformity and effectiveness. This design not only promotes smoother convection circulation between the heat sink and fan, but also ensures unobstructed cooling channels, significantly improving the overall efficiency of the thermal management system.

[0095] Furthermore, integrating the secondary cooling device directly onto the in-line heat sink baseplate, rather than having it occupy a separate space, effectively reduces the footprint of the heat dissipation components, resulting in a more compact system design and more efficient space utilization. In applications where space constraints are particularly pronounced, this comprehensive cooling solution not only optimizes the internal layout of the device but also significantly improves space utilization, providing a solid foundation for high-density integration and high-performance operation.

[0096] In summary, installing and optimizing the secondary cooling unit directly on top of the primary cooling unit not only simplifies the installation process and improves space utilization, but also significantly enhances the system's heat dissipation performance. This design approach is particularly crucial for achieving effective thermal management in high-power and space-constrained applications. By carefully considering the heat distribution and heat dissipation requirements of electronic components and matching the most appropriate cooling solution, system designers can effectively address thermal challenges and ensure long-term stable operation and maximized performance of the equipment.

[0097] In some embodiments, the length of the fins of the in-line heat sink in a first direction is 15 mm to 16 mm, and the first direction is the thickness direction of the power circuit board.

[0098] The 15mm to 16mm fin height design of the heat sink provides ample surface area to enhance heat exchange efficiency. Taller fins can more effectively transfer heat from the power device to the heat sink, and then dissipate it to the environment through air convection. Especially when combined with forced convection from a fan, the heat dissipation efficiency is significantly improved.

[0099] Maintaining the dimensions of the heat sink and fan within a certain range along the thickness of the circuit board helps maintain system structural stability. Furthermore, controlling the dimensions of the fins and fan in the primary direction effectively utilizes space, avoiding excessive flat area on the circuit board and allowing for greater flexibility in the layout of other electronic components and circuits. This sizing design, which takes into account heat dissipation, airflow paths, structural stability, and space utilization, helps optimize overall thermal management of the electronic system. By improving heat dissipation efficiency and space utilization, the risk of performance degradation and failure due to overheating in the entire system can be reduced.

[0100] By precisely setting the heatsink fin height at 15-16 mm and the fan thickness at 6-7 mm, this innovative layout achieves a harmonious balance of efficient heat dissipation, optimized airflow paths, structural stability, and space conservation along the vertical dimension of the circuit board carrier. This not only effectively suppresses noise levels and power consumption during operation, significantly improving the effectiveness and accuracy of thermal management, but also fully considers cost control factors, providing an economical and high-performance optimization solution for electronic equipment thermal management systems.

[0101] This design is suitable for high-density electronic devices that require high heat dissipation efficiency in a compact space, such as energy storage systems, data center servers, and high-end computing equipment. In these applications, every space on the circuit board needs to be fully utilized, and efficient heat dissipation and low-noise operation are key factors in improving overall system performance and user satisfaction. By precisely designing the thickness of the heat sink fins and fan within the above range, it not only ensures that heat from electronic components can be quickly and evenly dissipated, but also maintains the structural stability and spatial compactness of the entire heat dissipation system, becoming an ideal solution for thermal management of high-performance electronic devices.

[0102] Specifically, the height of the radiator fins and the thickness of the fan together form an efficient heat exchange interface, ensuring that the airflow can contact the fins to the greatest extent possible as it passes through, accelerating the convection and diffusion of heat, reducing overall thermal resistance, and improving heat dissipation efficiency. At the same time, the fan's thin design helps reduce resistance and noise during air flow, and combined with the radiator's efficient thermal conductivity, it forms a low-noise, low-energy, and highly efficient heat dissipation system. This heat dissipation design not only achieves a technological breakthrough, but also fully demonstrates cost-effectiveness in practical applications, bringing new possibilities for thermal management of electronic equipment, especially in high-end applications where space resources are limited and heat dissipation requirements are high. Its value is particularly significant.

[0103] In some other embodiments, the first cooling device is a pin-type heat sink.

[0104] The fins of a top-pin heatsink resemble a series of slender, densely packed needles, pointing straight into the air. While the structure shares the same vertical layout as an in-line heatsink, the fins of a top-pin heatsink are thinner, longer, and arranged at a higher density. Compared to in-line heatsinks, the fins of a top-pin heatsink are not only narrower and more densely spaced, but also offer a greater surface area for heat dissipation.

[0105] While in-line heat sinks lack the thickness and density of their fins compared to ejector pin heat sinks, they offer some flexibility in space usage. In situations where circuit board layouts are restricted, in-line heat sinks, with their fins embedded vertically into the board, often offer a better fit, especially when vertical space is more limited than horizontal. However, while ejector pin heat sinks offer superior heat dissipation efficiency, they may require more horizontal space due to the high density of their fins. This characteristic is particularly pronounced when the fins are densely packed, requiring careful consideration during system design.

[0106] Therefore, when choosing the type of radiator, the specific application scenario and requirements should be closely considered, and factors such as the system's thermal load characteristics, available space layout, and cost-effectiveness should be comprehensively evaluated. For applications with high power density or the need for fast and effective heat dissipation, top-pin radiators are undoubtedly the optimal solution due to their excellent heat dissipation capabilities; and when space is limited, especially when horizontal space is scarce, plug-in radiators are a more suitable choice due to their compact footprint and flexible installation methods. When planning system thermal management, designers should flexibly utilize the advantages of the two cooling technologies, and customize the most appropriate cooling solution based on actual working conditions and design limitations, in order to achieve the best balance between heat dissipation efficiency and space savings, and ensure the stable operation and performance of electronic equipment in various complex environments.

[0107] In some embodiments, such as Figure 10 As shown, the energy conversion system further includes:

[0108] The third cooling device 50 and the supporting structure 60, the third cooling device 50 is fixed to the top of the supporting structure 60 and close to the side of the first cooling device 30 through the third connecting member 51, the supporting structure 60 is connected to the first cooling device 30 through the fourth connecting member 61, and the third cooling device 50 is located on the side of the first cooling device 30 away from the electronic device 20.

[0109] Among them, the third cooling device is a fan, and the supporting structure is a fan bracket. The fan is directly located on the side of the radiator away from the electronic device, which can immediately force air cooling to the radiator, accelerate the process of heat dissipation from the radiator to the environment, and improve the heat dissipation efficiency. This design ensures that the heat dissipation surface of the radiator can be cooled quickly, thereby effectively reducing the temperature of the electronic device. The fan bracket not only supports the fan, but also serves as an airflow guide structure to ensure that the air blown out by the fan is directly aimed at the radiator, avoiding airflow dispersion or obstruction by other devices, thereby optimizing the airflow path and improving the cooling effect.

[0110] like Figure 10 As shown, the third and fourth connecting components are used to lock the fan and its bracket, respectively. This strategy significantly enhances the structural stability of the air-cooling architecture, effectively suppressing vibration and noise during operation. It also prevents components from loosening or falling off due to long-term operation, significantly improving the overall reliability and durability of the system. The third and fourth connecting components can be screws, clips, or springs. Their use not only strengthens the air-cooling structure but also ensures a tight fit and secure fixation between components.

[0111] The fan and bracket are assembled separately from the heatsink via independent connectors, enhancing system maintenance and upgrade flexibility. This means the fan and bracket can be removed or replaced independently without affecting the heatsink, significantly simplifying maintenance. This is especially true when the fan requires repair or cleaning, eliminating the need for extensive system disassembly. Positioning the fan above the heatsink, rather than within the circuit board, cleverly utilizes the available space and effectively reduces the amount of heat dissipation required.

[0112] Furthermore, the independent design of the fan and bracket allows for customized system thermal management. Based on the cooling requirements of specific electronic components, fan performance indicators, such as speed and airflow direction, can be flexibly adjusted, while the heat sink's structural dimensions are optimized for optimal heat exchange. This design not only balances cooling efficiency and space conservation, but also ensures convenient system maintenance and replaceable cooling components.

[0113] In short, through the clever application of the third and fourth connecting components, combined with the independent design of the fan and bracket, not only is the air-cooling structure stabilized and noise reduced, but the maintenance process is also simplified, achieving optimized space utilization and improved heat dissipation efficiency.

[0114] Heat pipe technology is introduced between the electronic device and the first cooling device, and between the first cooling device and the third cooling device to improve heat energy transfer efficiency and reduce thermal resistance.

[0115] Specifically, high-thermal-conductivity heat pipes are used between each electronic component and the first cooling device (top-pin heat sink), as well as between the first cooling device and the third cooling device. One end of the heat pipe directly contacts the heat source (i.e., the electronic component), while the other end extends to the cooling device. Through the circulation of liquid within the heat pipe, heat is quickly transferred from the heat source to the cooling point, significantly improving the system's heat dissipation efficiency.

[0116] A heat pipe is a highly efficient heat transfer element, primarily composed of a tube shell, an internal liquid (working fluid), and capillary structures (such as micropores or grooves) on the tube's inner surface. In energy storage converters, heat pipes are cleverly used to transfer heat between electronic components and the primary cooling device (a pin-type heat sink), as well as between the primary cooling device and the tertiary cooling device. This improves heat exchange efficiency, reduces thermal resistance, and achieves rapid heat dissipation.

[0117] The basic structure of a heat pipe can be broken down into three parts: the shell, the internal liquid (working fluid), and the capillary structure. The shell is usually made of metal materials such as copper or aluminum, which have good thermal conductivity and mechanical strength, ensuring the stable operation of the heat pipe in various environments. The liquid filled in the heat pipe is usually water, alcohol, or Freon. These liquids have a low boiling point and a good latent heat of vaporization, which can evaporate quickly at low temperatures and quickly transfer heat. The inner wall of the tube is covered with micropores or grooves, forming a capillary effect. The liquid is forced back from the cold end to the hot end under the help of gravity or a small pressure difference, completing the cycle and ensuring the long-term stable operation of the heat pipe.

[0118] Place one end of the heat pipe in close contact with the heating surface of each electronic component, enhancing thermal contact with a metal gasket or thermal grease to ensure rapid heat absorption. The other end of the heat pipe is secured to the surface of a pin-type heat sink, increasing heat transfer efficiency through direct contact or thermally conductive materials (such as thermal grease). Depending on the system architecture and cooling requirements, the heat pipe can be routed along the path between the pin-type heat sink and a third cooling device (such as a cold plate) to ensure efficient heat transfer from the heat sink to the water cooling system.

[0119] At one end of the heat pipe (the end that contacts the heating surface of the electronic device), the liquid rapidly evaporates upon contact with the high-temperature surface, forming vapor. During this process, the liquid's phase change absorbs a significant amount of heat energy. The vapor flows within the pipe to the cold end (near the cooling device) with virtually no thermal resistance. Upon reaching the cold end, the vapor condenses back into a liquid state upon contact with the cooler surface, releasing latent heat to the cooling device. The condensed liquid then flows back through the capillary structure within the pipe to the hot end, ready for the next thermal cycle.

[0120] The high thermal conductivity of heat pipes facilitates rapid heat exchange and significantly reduces thermal resistance, allowing heat generated by electronic components to be quickly and evenly dispersed into the cooling medium. By reducing the time components overheat, heat pipes effectively reduce thermal stress, helping to extend the service life of both the electronic components and the entire energy storage inverter. This improved heat dissipation efficiency reduces system fan operating time and energy consumption, lowering the overall energy consumption of the energy storage inverter and contributing to energy conservation and emission reduction.

[0121] In a specific embodiment, for example, heat pipes are integrated into the power board of a PCS (energy storage converter). Heat pipes are installed between each IGBT (insulated gate bipolar transistor) and the pin-type heat sink, as well as between the heat sink and the water cooling plate. The evaporation end of the heat pipe is in close contact with the IGBT, while the condensation end is fixed to the surface of the heat sink, and the extended portion is connected to the water cooling plate. This design ensures efficient heat transfer from the IGBT to the water cooling system, maintaining the system temperature within a safe range even under high-power operating conditions, ensuring the continuous and stable operation of the energy storage converter in various environments and application conditions. Experimental verification has shown that compared to traditional heat dissipation designs, this heat pipe cooling solution can reduce the surface temperature of the IGBT by approximately 20%, significantly improving the overall thermal management capabilities and performance stability of the system.

[0122] Furthermore, a self-cleaning function can be incorporated into the fin design of a heat sink. By shaping the fin profile or applying a special outer layer, the fins can be automatically cleaned of attached particles under the impact of continuous fan airflow, significantly reducing the negative impact of dust accumulation on heat dissipation performance. This self-cleaning feature not only extends the heat sink's maintenance intervals and reduces maintenance costs, but more importantly, ensures that heat dissipation performance remains stable over time. This is an extremely beneficial added value for energy storage inverter systems operating in dusty environments.

[0123] To achieve self-cleaning, consider designing the fin edges into a serrated shape. This will leverage wind resistance and airflow swirl to efficiently capture and dislodge debris. This process requires detailed simulation testing based on fluid mechanics principles to determine the optimal angle and size of the serrations for optimal self-cleaning. Properly adjusting the fin tilt angle, combined with the synergistic effects of gravity and directional airflow, can further promote the natural sliding of dust along the fins, effectively preventing long-term dust accumulation. The tilt angle should be designed based on the actual deployment location of the equipment and the direction of airflow to ensure the efficient operation of the self-cleaning mechanism.

[0124] Another self-cleaning solution is to coat the surface of the fins with a super-hydrophobic material, such as fluorinated silane or silica nanoparticles, to form a protective film that is almost impervious to moisture and dust. Even if dust settles, it can be easily washed away by natural precipitation or water vapor condensation, keeping the surface of the fins fresh and clean. The application of photocatalytic materials, such as titanium dioxide TiO2, stimulates a strong oxidation reaction under light conditions, which can effectively degrade organic pollutants on the surface of the fins, reduce the risk of dust adhesion, and enhance self-cleaning performance. In addition, the introduction of a coating with electrostatic repulsion properties can weaken the electrostatic attraction between dust particles and the fins, reducing the occurrence of dust deposition. By designing a specific electric field distribution pattern, dust particles approaching the fins are actively resisted, further enhancing the self-cleaning effect.

[0125] Self-cleaning fins maintain efficient heat dissipation for extended periods in environments with high dust concentrations, preventing the additional thermal resistance and degradation caused by dust accumulation. By reducing dust adhesion and simplifying cleaning procedures, the need for regular heatsink maintenance is significantly reduced, saving valuable maintenance time and costs. Sustained and stable heat dissipation effectively prevents equipment overheating, reduces hardware failure rates, and ultimately extends the system's operating life. Enhanced self-cleaning capabilities ensure the heatsink maintains long-term, efficient operation even in extremely harsh conditions.

[0126] In some embodiments, such as Figure 2 、 Figure 3 and Figure 4 As shown, the surface of the power circuit board 10 close to the electronic device 20 has multiple sunken areas 11, and the device pin 22 includes a first horizontal portion 221, a first bent portion 222, a vertical portion 223, a second bent portion 224 and a second horizontal portion 225 connected in sequence, wherein the first horizontal portion 221 and the second horizontal portion 225 are parallel to the surface of the power circuit board 10 close to the electronic device 20, the vertical portion 223 is perpendicular to the surface of the power circuit board 10 close to the electronic device 20, and the second horizontal portion 225 is connected to the sunken area 11 of the power circuit board 10.

[0127] Figure 1 A structural diagram of the installation position of an electronic device and a power circuit board provided in the prior art, such as Figure 1 As shown, in the prior art, the electronic device 20 is mounted upright on the power circuit board 10, and the device pins of the electronic device 20 in the prior art are upright. In the prior art, the electronic device 20 is directly inserted into the power circuit board 10 through the pins, which causes pin fatigue or even breakage, reducing the service life of the device and the reliability of the entire system.

[0128] The pin bending process significantly improves the fit between the device and the circuit board. By increasing the contact interface area, it effectively disperses the stress on the pins. Especially when subjected to external dynamic loads (such as vibration and transportation bumps), the bent area can act like a shock absorber, significantly reducing the risk of pin damage or even breakage, thereby extending the service life of the device and enhancing the overall robustness of the system. Compared with upright mounting, bent pins allow the device to lie flat. This not only optimizes the device's physical positioning on the circuit board, ensuring its stability and avoiding instability and uneven stress caused by an excessively high center of gravity, but also allows the installation of a heat sink directly above the device, creating a linear heat conduction path, accelerating heat dissipation, and significantly improving heat dissipation efficiency and controlling the device's operating environment temperature.

[0129] In traditional technology, electronic devices penetrate the circuit board directly through upright pins and only have a single solder connection on the back of the board. This installation method subjects the device pins to greater mechanical and thermal stress. Especially under continuous vibration or impact, the pins are prone to fatigue cracks or even breakage, seriously affecting the reliability of the device and the stability of the system. The novel concept of a recessed area provides a stable mechanical anchor by increasing the contact area between the device pins and the circuit board. Especially when the device is subjected to external mechanical interference, this design can effectively reduce the direct impact on the pins and reduce the potential risk of damage. The recessed area on the circuit board can better adapt to the shape and size of the device pins, making the device installation more precise and tight, and improving the tolerance and stability of the system under various environmental conditions. In addition, this layout is also conducive to the horizontal distribution of device pins, which contributes to the high-density design of the circuit board and saves valuable three-dimensional space. This advantage is particularly prominent in the design of highly sensitive products.

[0130] The introduction of the sunken area, on the one hand, simplifies the assembly process of the device, serves as a guide tool for installation and positioning, and significantly improves production efficiency and assembly accuracy; on the other hand, it shortens the distance between the device pins and the circuit board, helps to reduce the parasitic effects of the pins (such as parasitic inductance and resistance), and has a significant positive impact on the signal integrity and electrical performance of high-frequency circuits. Figure 3 and Figure 4 In a demonstration, the pins of the electronic components undergo two delicate bending processes, allowing them to be placed horizontally on the circuit board, rather than the traditional upright installation. This innovative layout greatly reduces the vertical space requirements, optimizes the component layout of the circuit board, and lays the foundation for a more compact and efficient circuit board design. It is particularly beneficial for saving valuable space and reducing overall weight in high-power density applications.

[0131] The device is configured horizontally, and by welding the second horizontal portion in the sunken area, it not only shares the weight of the device and reduces the direct pressure on the pins, but also significantly expands the contact area between the device and the circuit board, reducing the pressure per unit area and improving the stability of the installation. At the same time, the first and second bends in the bending process further disperse the stress distribution under the action of gravity, reduce the probability of pin damage, and enhance the robustness and reliability of the entire system. Figure 1 Compared to the traditional upright mounting method shown, this design eliminates the additional reverse-side soldering process, avoiding the excessive material consumption, extended production cycles, and increased costs associated with double-sided soldering. Component attachment can be completed in a single soldering step, streamlining the process chain, reducing manufacturing complexity, and ensuring soldering quality and consistency. It also minimizes performance loss and device aging caused by repeated thermal cycling, provides a gentler operating environment for sensitive electronic components, and reduces the risk of thermal deformation affecting soldering quality.

[0132] In summary, the combination of pin bends and recessed areas not only improves device mounting reliability but also optimizes heat dissipation, simplifies manufacturing processes, and reduces costs, revolutionizing the design of high-performance electronic products. This innovative mounting technology is particularly suitable for applications with height constraints, high heat dissipation requirements, and demanding reliability, such as energy storage converters, server systems, and portable electronic devices, providing strong support for technological advancement in these fields.

[0133] Therefore, in this embodiment, only one welding process is used to effectively avoid the above problems.

[0134] In some embodiments, as Figure 4 As shown, the length of the first horizontal portion 221 is a preset length, which is 3.3 mm to 3.6 mm.

[0135] Among them, the first horizontal portion 221 with a length of 3.3mm~3.6mm can maintain a sufficient contact area to ensure the quality of heat conduction and electrical connection between the device and the circuit board. Pins that are too short may cause poor contact, affecting heat dissipation and electrical performance; pins that are too long may increase the mechanical stress of the pins, affecting the stability and reliability of the device. Within this preset length range, the pins can be adequately supported to reduce the risk of damage due to their own weight or external vibrations. At the same time, the junction between the pins and the circuit board is not easily subjected to excessive stress, which helps to improve the mechanical stability of the entire system. In high-density circuit board layouts, controlling the length of the first horizontal portion 221 to 3.3mm~3.6mm helps to reduce the lateral and vertical space occupied between devices and achieve a more compact circuit board design. This is crucial for the design of electronic products that pursue miniaturization and high power density.

[0136] The embodiment in which the first connection portion is set to 3.3mm to 3.6mm in length is based on multiple considerations, including thermal, electrical, mechanical, and production efficiency. It aims to achieve optimal connection performance between the power device and the circuit board, while ensuring high system reliability and efficiency. This design detail plays a crucial role in the design of electronic products, especially high-performance and high-density circuit boards.

[0137] In some embodiments, as Figure 4 As shown, the bending radius of the first bending portion 222 is 0.3 mm to 0.4 mm, the bending radius of the second bending portion 224 is 0.3 mm to 0.4 mm, and the length of the second horizontal portion 225 is 7 mm to 8 mm.

[0138] The setting of the bending radius of the first bend (0.3mm-0.4mm) can reduce stress concentration on the pin during bending, thereby reducing the potential for microcracks or damage at the bend, and improving the mechanical strength and long-term reliability of the device. A larger bending radius also helps improve the pin's toughness when subjected to external mechanical forces, reducing the risk of pin breakage due to vibration or impact. Furthermore, the setting of the bending radius of the first bend will not affect the subsequent soldering length and quality if it is too long.

[0139] During the bending process, changes in the pin's geometric shape directly affect the quality of the electrical connection. An appropriate bending radius helps form a stable electrical contact, reducing contact resistance and inductance, thereby optimizing signal transmission efficiency and minimizing signal attenuation and reflection. The length of the second horizontal portion 225 is set at 7mm to 8mm to ensure sufficient and stable electrical connection length between the pin and the circuit board pad, further improving signal integrity and electrical performance.

[0140] In summary, by carefully designing the bending radius of the first bending portion 222, the second bending portion 224 and the length of the second horizontal portion 225, the mechanical strength, electrical performance and thermal management capability of the device can be significantly improved, while simplifying the production process and optimizing space utilization.

[0141] In addition, there are two ways to fix electronic devices on the power circuit board. Figure 11 As shown, the device body 21 of the electronic device is in contact with the power circuit board 10 .

[0142] Another example Figure 12 As shown, the energy conversion system further includes: a filling structure 70 , and the filling structure 70 is located in the gap between the device body 21 of the electronic device and the power circuit board 10 .

[0143] When electronic devices are in direct contact with the power circuit board, the heat conduction path is the shortest, effectively reducing thermal resistance and improving heat dissipation efficiency. This is particularly beneficial for high-power density applications, helping to maintain the device within a safe operating temperature range and extend its service life. Direct contact ensures a stable electrical connection between the electronic device and the power circuit board, reducing electrical connection issues caused by failure of intermediate connectors and improving the overall reliability of the system.

[0144] Furthermore, the electronic device is in direct contact with the power circuit board, and can be clamped between the power circuit board 10 and the heat sink to prevent the electronic device from shifting, thereby improving system reliability.

[0145] The use of filler structures can provide additional mechanical support for electronic devices, ensuring their stability when subjected to external vibration or shock, thereby improving the device's shock resistance and long-term stability. The design of the fixings can also help distribute the force on the device pins, reducing the risk of pin damage. The filler structure can be made of insulating material to form an insulating layer between the electronic device and the power circuit board, which is essential in high-voltage or high-current applications to prevent electrical failures such as short circuits.

[0146] Furthermore, when the electronic device contacts the power circuit board, the bent edge distance is 1.5 mm lower than the main body of the electronic device. This means that the distance between the side of the second horizontal portion contacting the power circuit board and the side of the electronic device contacting the power circuit board in the thickness direction of the power circuit board is 1.5 mm (i.e., the depth of the recessed area). The dimensions of the second connecting portion of the electronic device need to be adjusted accordingly based on the thickness of the electronic device body and the depth of the recessed area. If there is a filler structure between the electronic device and the power circuit board, the dimensions of the vertical portion of the electronic device also need to take into account the thickness of the filler structure.

[0147] In some embodiments, such as Figure 13 As shown, the energy conversion system further includes: an insulating ceramic sheet 80, a side surface of the electronic device 20 away from the power circuit board 10 and a first surface of the insulating ceramic sheet 80 are bonded and fixed by a first insulating thermally conductive adhesive, and a second surface of the insulating ceramic sheet 80 and a contact heat dissipation surface of the first cooling device 30 are bonded and fixed by a second insulating thermally conductive adhesive, and the first surface and the second surface are opposite surfaces.

[0148] The configuration of the insulating ceramic sheet forms an electrical barrier between the electronic device and the first cooling device. Its key role is to avoid electrical short circuits and ensure the safe operation of the system. This function is particularly important in complex working environments with high voltage or high current. Although the primary responsibility of the insulating ceramic sheet focuses on electrical isolation, its material selection takes into account excellent thermal conductivity. Ceramic or special composite materials are usually used to ensure that while providing insulation, the heat energy from the electronic device can be effectively transferred to the first cooling device, thereby significantly improving the heat dissipation efficiency while ensuring electrical safety. As a transition layer between the electronic device and the cooling unit, the insulating ceramic sheet provides a certain mechanical buffering effect, reducing the stress impact that may be caused by direct contact, especially when the cooling unit is subjected to vibration during operation. This buffering effect can extend the life of the device.

[0149] In the design of electronic equipment, especially high-density, high-performance systems, the introduction of insulating ceramic sheets not only enhances electrical safety protection, but also optimizes the heat conduction path, improves mechanical stability and thermal management efficiency, and is an important part of achieving efficient and safe electronic equipment design.

[0150] Between the electronic components and the primary cooling unit, an insulating ceramic sheet serves as an intermediate layer, further enhanced by thermally conductive silicon material to achieve the dual goals of heat transfer and electrical isolation. Thermally conductive silicon, with its high dielectric strength and excellent thermal conductivity, ensures efficient and safe heat transfer between the insulating ceramic sheet and the cooling unit, and between the electronic components and the ceramic substrate, while maintaining the integrity of the electrical isolation.

[0151] The layout of insulating ceramic sheets is flexible and can be configured for each electronic component individually, in rows, columns, or across the entire board. The specific configuration depends on the actual application requirements and environmental conditions. For densely populated electronic components, installing individual insulating ceramic sheets for each component eliminates the fragile nature of large substrates due to their controlled size, thereby ensuring greater installation reliability and system stability.

[0152] While ceramic substrates and thermally conductive silicone are common insulating layer materials, innovative designs are not limited to these two materials. Materials with high dielectric strength and excellent thermal conductivity can be used as alternatives to insulating ceramic sheets, providing customized solutions for thermal management and electrical isolation to meet the specific needs of different applications. This design approach opens up new avenues for innovation in cooling systems and material selection for high-power electronic devices, helping to improve the reliability and performance of electronic devices under extreme conditions.

[0153] An embodiment of the present application further provides an energy storage system, comprising: any one of the above-mentioned energy conversion systems.

[0154] Through the aforementioned optimization cases, the new heat dissipation architecture and sophisticated space planning significantly facilitate the seamless integration of energy conversion modules and the energy storage system, greatly alleviating the complexity of system-level integration and reducing the system failure rate caused by excessive thermal load, thereby consolidating the safety and operational stability of the overall energy storage architecture. The system exhibits enhanced adaptability and tolerance, especially in high temperatures or extreme operating environments, ensuring efficient and reliable energy conversion performance even under harsh conditions.

[0155] The significant improvement in heat dissipation efficiency also brings the dual benefits of cost optimization to energy conversion systems. On the one hand, efficient heat dissipation means that fewer or more compact heat dissipation media and structures can be used, directly reducing material consumption, lowering manufacturing costs, and making system design more economical and affordable. On the other hand, the enhanced heat dissipation efficiency significantly reduces the startup frequency and operating time of cooling systems (such as fans), reducing the system's energy consumption. This not only contributes to energy conservation and emission reduction, but also indirectly saves operation and maintenance costs, improving the system's economic benefits and environmental friendliness.

[0156] Efficient heat dissipation not only reduces damage to electronic components caused by thermal stress, but also enhances the durability and service life of system components by reducing temperature fluctuations, ensuring the long-term stable operation of the energy storage device. By saving the space occupied by heat dissipation components, system designers can integrate more energy conversion modules within a limited volume, improving the energy density of the system. This is particularly important for portable energy storage devices or installation scenarios with limited space. The improved heat dissipation efficiency and reduced size of heat dissipation components mean that operators can more easily access key components during system maintenance and troubleshooting, simplifying the maintenance process, shortening system recovery time, and enhancing user satisfaction and system availability.

[0157] Those skilled in the art will appreciate that the above-described embodiments are specific examples for implementing the present application, and that in actual applications, various changes in form and detail may be made thereto without departing from the spirit and scope of the present application. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. An energy conversion system, characterized in that: include: Power circuit board; An electronic device, comprising a device body and device pins, wherein the electronic device is located on one side of the power circuit board, and the device pins are electrically connected to the power circuit board; A first cooling device includes a device body and device pins. The first cooling device is located on a side of the electronic device away from the power circuit board. The device pins are electrically connected to the power circuit board. The orthographic projection of the electronic device on the power circuit board and the orthographic projection of the first cooling device on the power circuit board at least partially overlap.

2. The energy conversion system according to claim 1, characterized in that At least one of the electronic components and the first cooling device are connected via a first connecting member.

3. The energy conversion system according to claim 2, characterized in that The number of the first connecting members is the same as the number of the electronic components connected to the first cooling device.

4. The energy conversion system according to claim 2, characterized in that Multiple electronic devices are arranged in an array, and multiple electronic devices connected to the same first cooling device are located in the same row or column, and the orthographic projections of the device pins of the multiple electronic devices connected to the same first cooling device on the power circuit board do not overlap with the orthographic projections of the first cooling device on the power circuit board.

5. The energy conversion system according to claim 2, characterized in that: The multiple electronic devices connected to the same first cooling device include a first part and a second part, the first part is located in the first column, the second part is located in the second column, the device pins of the electronic devices in the first part are all located on the side away from the second part, and the device pins of the electronic devices in the second part are all located on the side away from the first part.

6. The energy conversion system according to claim 1, characterized in that The first cooling device is a straight-line radiator.

7. The energy conversion system according to claim 6, characterized in that The energy conversion system further comprises: The second cooling device is fixed on the base plate of the straight-line radiator through a second connecting member, and the wind direction of the second cooling device is the same as the direction of the fins of the straight-line radiator.

8. The energy conversion system according to claim 6, characterized in that The length of the fins of the in-line heat sink in the first direction is 15 mm to 16 mm, and the first direction is the thickness direction of the power circuit board.

9. The energy conversion system according to claim 1, characterized in that The first cooling device is a pin-type radiator.

10. The energy conversion system according to claim 9, characterized in that The energy conversion system further comprises: A third cooling device and a support structure, wherein the third cooling device is fixed to the top of the support structure and close to the side of the first cooling device through a third connecting member, and the support structure is connected to the first cooling device through a fourth connecting member, and the third cooling device is located on the side of the first cooling device away from the electronic device.

11. The energy conversion system according to any one of claims 1 to 10, characterized in that: The surface of the power circuit board close to the electronic device has multiple sunken areas, and the device pin includes a first horizontal portion, a first bent portion, a vertical portion, a second bent portion and a second horizontal portion connected in sequence, wherein the first horizontal portion and the second horizontal portion are parallel to the surface of the power circuit board close to the electronic device, the vertical portion is perpendicular to the surface of the power circuit board close to the electronic device, and the second horizontal portion is connected to the sunken areas of the power circuit board.

12. The energy conversion system according to any one of claims 1 to 10, characterized in that: The device body of the electronic device is in contact with the power circuit board.

13. The energy conversion system according to any one of claims 1 to 10, characterized in that: The energy conversion system further comprises: A filling structure is located in a gap between the device body of the electronic device and the power circuit board.

14. The energy conversion system according to any one of claims 1 to 10, characterized in that: The energy conversion system further comprises: An insulating ceramic sheet, wherein a side surface of the electronic device away from the power circuit board is bonded to a first surface of the insulating ceramic sheet by a first insulating thermally conductive adhesive, and a second surface of the insulating ceramic sheet is bonded to a contact and heat dissipation surface of the first cooling device by a second insulating thermally conductive adhesive, and the first surface and the second surface are opposite surfaces.

15. An energy storage system, characterized in that: include: The energy conversion system according to any one of claims 1 to 14.

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