Sensor module

Abstract

The invention relates to a sensor module. The sensor module includes: a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device each having a detection axis facing the same direction; and a base including a first mounting surface on which the first inertial sensor device is disposed, a second mounting surface parallel to the first mounting surface and on which the second inertial sensor device is disposed, and a third mounting surface parallel to the first mounting surface and on which the third inertial sensor device is disposed.

Description

Technical Field

[0001] The present invention relates to a sensor module. Background Art

[0002] The sensor device described in Patent Document 1 includes a circuit board, and two X-axis angular velocity sensor devices, two Y-axis angular velocity sensor devices, and two Z-axis angular velocity sensor devices mounted on the circuit board. The X-axis angular velocity is calculated based on the average value of the output signals from the X-axis angular velocity sensor devices, the Y-axis angular velocity is calculated based on the average value of the output signals from the Y-axis angular velocity sensor devices, and the Z-axis angular velocity is calculated based on the average value of the output signals from the Z-axis angular velocity sensor devices. This reduces noise and improves the detection accuracy of angular velocity about each axis.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-163955

[0006] However, in the sensor device structure of Patent Document 1, the X-axis angular velocity sensor device is mounted on the side of a plate-shaped circuit board, making it difficult to arrange multiple X-axis angular velocity sensor devices in parallel on the circuit board. The same applies to the Y-axis angular velocity sensor device. Summary of the Invention

[0007] The sensor module of the present invention includes: a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device having detection axes oriented in the same direction; and

[0008] The base includes a first mounting surface on which the first inertial sensor device is arranged, a second mounting surface parallel to the first mounting surface on which the second inertial sensor device is arranged, and a third mounting surface parallel to the first mounting surface on which the third inertial sensor device is arranged. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a cross-sectional view showing the sensor module according to the first embodiment.

[0010] Figure 2 It shows Figure 1 A top view of the interior of the sensor module is shown.

[0011] Figure 3 This is a developed view of the sensor mounting substrate.

[0012] Figure 4It is a cross-sectional view showing a state where the sensor mounting substrate is housed in the base.

[0013] Figure 5 It is a cross-sectional view showing the orientation of the detection axis of each inertial sensor device in a state housed in a base.

[0014] Figure 6 It shows Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0015] Figure 7 It shows Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0016] Figure 8 It shows Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0017] Figure 9 It shows Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0018] Figure 10 It shows Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0019] Figure 11 It is a cross-sectional view showing a sensor module according to a second embodiment.

[0020] Figure 12 It is a cross-sectional view showing a sensor module according to a third embodiment.

[0021] Figure 13 It is a front view of the first positioning portion.

[0022] Figure 14 It is a plan view showing a sensor module according to a fourth embodiment.

[0023] Figure 15 yes Figure 14 A cross-sectional view of the sensor module is shown.

[0024] Figure 16 yes Figure 14 A cross-sectional view of the sensor module is shown.

[0025] Figure 17 This is a developed view of the sensor mounting substrate.

[0026] Figure 18 It is a plan view showing a sensor module according to a fifth embodiment.

[0027] Figure 19 A development view of the sensor mounting substrate is shown.

[0028] Description of Reference Numerals

[0029] 1: Sensor module; 2: Package; 3: Base; 31: Bottom; 32: Outer wall; 321: First outer wall; 321a: Wall; 321b: Wall; 322: Second outer wall; 322a: Wall; 322b: Wall; 323: Third outer wall; 323a: Wall; 323b: Wall; 324: Fourth outer wall; 324a: Wall; 324b: Wall; 33: Inner wall; 331: First inner wall; 331a: Wall; 331b: Wall; 332: Second inner wall; 332a: Wall; 332b: Wall Surface; 333: Third inner wall surface; 333a: Wall surface; 333b: Wall surface; 334: Fourth inner wall portion; 334a: Wall surface; 334b: Wall surface; 391: First positioning portion; 391a: Abutment surface; 391b: Abutment surface; 392: Second positioning portion; 393: Third positioning portion; 4: Cover; 41: Opening; 42: Wall portion; 5: Sensor mounting substrate; 6: Connecting portion; 61: Flexible wiring substrate; 610: Central portion; 611: First belt portion; 612: Second belt portion; 613: Third belt portion; 614: Fourth belt portion; 62: Rigidity / Flexible wiring substrate; 621: Rigid wiring substrate; 622: Flexible wiring substrate; 63: Connector wiring; 7: Circuit element; 8: Connector; 91: First inertial sensor device group; 911: Inertial sensor device; 912: Inertial sensor device; 913: Inertial sensor device; 914: Inertial sensor device; 915: Inertial sensor device; 92: Second inertial sensor device group; 921: Inertial sensor device; 922: Inertial sensor device; 923: Inertial sensor device; 93: Third inertial sensor device group; 931: Inertial sensor device; 932: inertial sensor device; 933: inertial sensor device; 94: fourth inertial sensor device group; 941: inertial sensor device; 942: inertial sensor device; 943: inertial sensor device; 95: fifth inertial sensor device group; 951: inertial sensor device; 952: inertial sensor device; 953: inertial sensor device; 96: sixth inertial sensor device group; 961: inertial sensor device; 962: inertial sensor device; 963: inertial sensor device; Q1: region; Q2: region. DETAILED DESCRIPTION

[0030] The sensor module of the present invention is described in detail below based on the embodiments shown in the accompanying drawings. It should be noted that, for ease of explanation, three axes that are orthogonal to each other are illustrated in the figures as the X-axis, Y-axis, and Z-axis. In addition, for ease of explanation, the direction parallel to the X-axis is also referred to as the "X-axis direction," the direction parallel to the Y-axis is also referred to as the "Y-axis direction," and the direction parallel to the Z-axis is also referred to as the "Z-axis direction." The side indicated by the arrow in the Z-axis direction is also referred to as "upper," and the opposite side is also referred to as "lower." In this specification, "parallel" refers not only to situations where objects are parallel to each other, but also to situations where objects deviate from parallelism within a range that can be considered equivalent to parallel based on technical common sense, taking into account dimensional errors that may occur during manufacturing, tolerances confirmed on the device, etc. Similarly, "orthogonal" refers not only to situations where objects are orthogonal to each other, but also to situations where objects deviate from orthogonality within a range that can be considered equivalent to orthogonal based on technical common sense, taking into account dimensional errors that may occur during manufacturing, tolerances confirmed on the device, etc.

[0031] First embodiment

[0032] Figure 1 It is a cross-sectional view showing the sensor module according to the first embodiment. Figure 2 It shows Figure 1 A top view of the interior of the sensor module is shown. Figure 3 This is a developed view of the sensor mounting substrate. Figure 4 It is a cross-sectional view showing a state where the sensor mounting substrate is housed in the base. Figure 5 It is a cross-sectional view showing the orientation of the detection axis of each inertial sensor device in a state housed in a base. Figures 6 to 10 They are shown respectively Figure 1 FIG. 1 is a diagram showing a modified example of the sensor module shown.

[0033] Figure 1 The illustrated sensor module 1 includes a package 2 and a sensor mounting substrate 5 housed in the package 2 .

[0034] Package 2

[0035] like Figure 1 As shown, package 2 comprises a box-shaped base 3 with an opening on its top surface, and a plate-shaped cover 4 bonded to the top surface of base 3 to seal the opening. It should be noted that base 3 and cover 4 can each be formed using a metal material such as aluminum or stainless steel, or a ceramic material such as alumina. However, the materials for base 3 and cover 4 are not particularly limited.

[0036] In addition, if Figure 1 and Figure 2As shown, the base 3 has a rectangular plate-shaped bottom 31 and a rectangular frame-shaped outer wall portion 32 erected upward from the outer edge of the bottom 31. Figure 2 As shown, the outer wall portion 32 has a first outer wall portion 321 located on the negative side of the X-axis direction and extending in the Y-axis direction, a second outer wall portion 322 located on the negative side of the Y-axis direction and extending in the X-axis direction, a third outer wall portion 323 located on the positive side of the X-axis direction and extending in the Y-axis direction, and a fourth outer wall portion 324 located on the positive side of the Y-axis direction and extending in the X-axis direction.

[0037] Furthermore, the first outer wall portion 321, serving as the first wall portion, has a pair of wall surfaces 321a and 321b in a front-to-back relationship, with one wall surface 321a (on the negative side in the X-axis direction) facing the outside of the base 3 and the other wall surface 321b (on the positive side in the X-axis direction) facing the inside of the base 3. Furthermore, the second outer wall portion 322 has a pair of wall surfaces 322a and 322b in a front-to-back relationship, with one wall surface 322a (on the negative side in the Y-axis direction) facing the outside of the base 3 and the other wall surface 322b (on the positive side in the Y-axis direction) facing the inside of the base 3.

[0038] The third outer wall portion 323 has a pair of wall surfaces 323a and 323b in a front-to-back relationship, with one wall surface 323a (on the positive side in the X-axis direction) facing the outside of the base 3 and the other wall surface 323b (on the negative side in the X-axis direction) facing the inside of the base 3. Furthermore, the fourth outer wall portion 324 has a pair of wall surfaces 324a and 324b in a front-to-back relationship, with one wall surface 324a (on the positive side in the Y-axis direction) facing the outside of the base 3 and the other wall surface 324b (on the negative side in the Y-axis direction) facing the inside of the base 3.

[0039] In addition, if Figure 1 As shown, the base 3 has an inner wall portion 33, which is erected from the bottom 31 on the upper side and is located on the inner side of the outer wall portion 32. Figure 2 As shown, the inner wall portion 33 includes a first inner wall portion 331 extending in the Y-axis direction. One end (on the negative side in the Y-axis direction) is connected to the second outer wall portion 322, and the other end (on the positive side in the Y-axis direction) is connected to the fourth outer wall portion 324. Furthermore, the first inner wall portion 331 is offset from the center of the base 3 toward the first outer wall portion 321, and is divided within the base 3 into a larger region Q1 on the positive side in the X-axis direction and a smaller region Q2 on the negative side in the X-axis direction. Furthermore, the first inner wall portion 331, serving as the second wall portion, has a pair of wall surfaces 331a and 331b in a front-to-back relationship, both facing the interior of the base 3. The wall surface 331a on the negative side in the X-axis direction faces the first outer wall portion 321, while the wall surface 331b on the positive side in the X-axis direction faces the third outer wall portion 323.

[0040] Here, the three walls 321b, 331a, and 331b arranged along the X-axis are each formed by a YZ plane perpendicular to the X-axis. That is, the walls 321b, 331a, and 331b are parallel to each other. Inertial sensor devices 911, 912, and 913 are respectively arranged on the first mounting surface 321b, the second mounting surface 331a, and the third mounting surface 331b. By configuring the base 3 with an outer wall portion 32 and an inner wall portion 33, the walls 321b, 331a, and 331b can be formed with a simple structure. In particular, since the walls 321b, 331a, and 331b are arranged along the X-axis, i.e., in the direction normal to the wall 321b, the inertial sensor devices 911, 912, and 913 can be arranged in a row and close to each other. Therefore, the inertia detection accuracy of the sensor module 1 can be improved, and the sensor module 1 can be miniaturized.

[0041] like Figure 1 As shown, the cover 4 is flat and is joined to the upper surface of the base 3. The method for joining the cover 4 to the base 3 is not particularly limited, and for example, screwing, adhesive bonding, etc. can be used. The cover 4 also has an opening 41 for exposing the connector 8 described later, and a frame-shaped wall portion 42 that protrudes from the periphery of the opening 41 toward the bottom, i.e., into the base 3, and surrounds the connector 8.

[0042] The package 2 has been described above. However, the structure of the package 2 is not particularly limited. For example, the top view shape of the base 3 is not limited to a rectangle. Furthermore, for example, at least one end of the first inner wall portion 331 may not be connected to the outer wall portion 32. Furthermore, the opening for exposing the connector 8 may be formed in the bottom 31 or outer wall portion 32 of the base 3 rather than in the cover 4.

[0043] Sensor mounting substrate 5

[0044] Figure 3 A developed view of the sensor mounting substrate 5 is shown. As shown in this figure, the sensor mounting substrate 5 includes a circuit element 7, a connector 8, a first inertial sensor device group 91, and a connection portion 6 connecting them. Furthermore, the first inertial sensor device group 91 includes three inertial sensor devices: a first inertial sensor device 911, a second inertial sensor device 912, and a third inertial sensor device 913.

[0045] The connecting portion 6 is a flexible, strip-shaped flexible wiring substrate 61 extending in the X-axis direction. A circuit element 7, a connector 8, and inertial sensor devices 911, 912, and 913 are mounted at predetermined locations on the flexible wiring substrate 61. Furthermore, these components are electrically connected via wiring (not shown) formed on the flexible wiring substrate 61. Specifically, the circuit element 7 and connector 8 are mounted on the front surface of the flexible wiring substrate 61, while the inertial sensor devices 911, 912, and 913 are mounted on the back surface. Furthermore, the inertial sensor devices 911, 912, and 913 are arranged side by side in the X-axis direction. Each inertial sensor device 911, 912, and 913 is electrically connected to the circuit element 7 via the wiring, and the circuit element 7 is electrically connected to the connector 8 via the wiring. By mounting the circuit element 7, connector 8, and each inertial sensor device 911, 912, and 913 on the flexible wiring substrate 61 in this manner, the components are not scattered, making it easier to attach them to the base 3.

[0046] Inertial sensor devices 911, 912, and 913 have the same structure. Each of these is a 6DoF (six-degrees of freedom) sensor, capable of independently detecting angular velocity around the three orthogonal axes J1, J2, and J3, as well as acceleration in the J1, J2, and J3 directions.

[0047] Although not shown in the figure, the inertial sensor devices 911, 912, and 913 respectively have: an angular velocity sensor element for detecting the angular velocity around the J1 axis; an angular velocity sensor element for detecting the angular velocity around the J2 axis; an angular velocity sensor element for detecting the angular velocity around the J3 axis; an acceleration sensor element for detecting the acceleration in the direction of the J1 axis; an acceleration sensor element for detecting the acceleration in the direction of the J2 axis; an acceleration sensor element for detecting the acceleration in the direction of the J3 axis; a control circuit such as a microcontroller that controls the drive of these sensor elements; and a package that accommodates these parts.

[0048] Each angular velocity sensor element and each acceleration sensor element may be, for example, a crystal oscillator or a silicon MEMS (Micro Electric Mechanical System). Furthermore, the control circuit includes, for example, a drive circuit to drive each sensor element; a temperature compensation circuit to temperature-compensate the detection signals output from each sensor element; a detection circuit to detect the angular velocity around each axis and the acceleration in each axial direction based on the temperature-compensated detection signals; and an interface circuit to input and output various signals.

[0049] However, the structure of inertial sensor devices 911, 912, and 913 is not particularly limited as long as they are 6DoF sensors. It should be noted that, for ease of explanation, the surface of the flexible wiring board 61 on which the inertial sensor devices 911, 912, and 913 are mounted is referred to as the "bottom surface," and the surface opposite the bottom surface is referred to as the "top surface." In this embodiment, the bottom surface and the top surface are parallel.

[0050] like Figure 4 As shown, the sensor mounting substrate 5 is housed in the base 3 with the back surface of the flexible wiring substrate 61 facing downward, with the flexible wiring substrate 61 bent in the thickness direction (Z-axis direction) so as to extend across the first inner wall portion 331 and span the regions Q1 and Q2. Using the bendable flexible wiring substrate 61 as the connection portion 6 facilitates mounting of the inertial sensor devices 911, 912, and 913 on the base 3.

[0051] Then, if Figure 1 As shown, with the sensor mounting substrate 5 housed in the base 3, the circuit element 7 and connector 8 are each located within region Q1 and bonded to the inner bottom surface (the upper surface of the bottom portion 31) of the base 3 via the flexible wiring substrate 61. Furthermore, the inertial sensor device 913, along with the circuit element 7 and connector 8, is located within region Q1, with its top surface facing the wall surface 331b of the first inner wall portion 331, which serves as the third mounting surface, and bonded to the wall surface 331b.

[0052] Meanwhile, the inertial sensor device 911 is positioned within region Q2, with its top surface facing the wall surface 321b of the first outer wall portion 321, serving as the first mounting surface, and bonded to the wall surface 321b. Furthermore, the inertial sensor device 912 is also positioned within region Q2 along with the inertial sensor device 911, with its top surface facing the wall surface 331a of the first inner wall portion 331, serving as the second mounting surface, and bonded to the wall surface 331a. While the bonding method is not particularly limited, in this embodiment, bonding is performed using an adhesive material.

[0053] According to such a configuration, since the base 3 includes the wall surfaces 321 b , 331 a , and 331 b that are parallel to each other, it is easy to arrange the inertial sensor devices 911 , 912 , and 913 in parallel with each other.

[0054] like Figure 5As shown, with the sensor mounting substrate 5 bonded to the base 3, the inertial sensor devices 911, 912, and 913 are arranged side by side along the X-axis. By arranging the inertial sensor devices 911, 912, and 913 along the X-axis, they can be arranged in a row and positioned close together. This improves the inertial detection accuracy of the sensor module 1 and enables miniaturization of the sensor module 1.

[0055] Inertial sensor devices 911, 912, and 913 are arranged with their detection axes aligned. In the illustrated configuration, inertial sensor devices 911, 912, and 913 are arranged with their J1 axes aligned along the Z-axis, their J2 axes aligned along the Y-axis, and their J3 axes aligned along the X-axis. In particular, in this embodiment, inertial sensor devices 911, 912, and 913 are arranged with their centers aligned along the same straight line along the X-axis. It should be noted that in this embodiment, inertial sensor devices 911 and 913 are arranged with their top surfaces facing the negative side of the X-axis, while inertial sensor device 912 is arranged with its top surface facing the positive side of the X-axis. In other words, inertial sensor device 912 is rotated 180° about the Y-axis relative to inertial sensor devices 911 and 913, resulting in the J1 and J3 axes facing opposite directions.

[0056] Circuit element 7 includes, for example, a drive control circuit for controlling the driving of inertial sensor devices 911, 912, and 913; a detection circuit for detecting angular velocities about each axis and accelerations in each axial direction based on detection signals output from each inertial sensor device 911, 912, and 913; and an interface circuit for inputting and outputting various signals. For example, circuit element 7 calculates the angular velocity about the J2 axis and the acceleration in the J2 axis direction by averaging the three detection signals received simultaneously from each of the inertial sensor devices 911, 912, and 913. Furthermore, the angular velocity about the J1 axis, the acceleration in the J1 axis direction, and the angular velocity about the J3 axis and the acceleration in the J3 axis direction are calculated by averaging the three detection signals received simultaneously from each of the inertial sensor devices 911, 912, and 913, with the positive and negative values ​​aligned. This configuration reduces noise and improves the accuracy of angular velocity and acceleration detection.

[0057] The above describes the sensor module 1. As described above, the sensor module 1 has the first inertia sensor device group 91 having the inertia sensor device 911 as the first inertia sensor device, the inertia sensor device 912 as the second inertia sensor device, and the inertia sensor device 913 as the third inertia sensor device each having a detection axis in the same orientation, and the housing 3 having the wall surface 321b as the first placement surface on which the inertia sensor device 911 is disposed, the wall surface 331a as the second placement surface parallel to the wall surface 321b on which the inertia sensor device 912 is disposed, and the wall surface 331b as the third placement surface parallel to the wall surface 321b on which the inertia sensor device 913 is disposed. According to such a structure, since the housing 3 has the wall surfaces 321b, 331a, 331b in parallel to each other, the inertia sensor devices 911, 912, 913 are easily arranged in parallel to each other.

[0058] Further, as described above, the wall surfaces 321b, 331a, 331b are arranged in the normal direction of the wall surface 321b, that is, the X-axis direction. Thus, the inertia sensor devices 911, 912, 913 can be arranged in a line and disposed close to each other. Therefore, the inertia detection accuracy of the sensor module 1 can be improved, and the sensor module 1 can be downsized.

[0059] Further, as described above, the wall surfaces 321b, 331a, 331b are arranged in the normal direction of the wall surface 321b, that is, the X-axis direction. Thus, the inertia sensor devices 911, 912, 913 can be arranged in a line and disposed close to each other. Therefore, the inertia detection accuracy of the sensor module 1 can be improved, and the sensor module 1 can be downsized.

[0060] Further, as described above, the housing 3 has a box shape that accommodates the first inertia sensor device group 91, and has the first outer wall portion 321 as the first wall portion, which has one of the pair of wall surfaces 321a, 321b in a surface-opposite relationship facing outward of the housing 3 and the other facing inward of the housing 3, and the first inner wall portion 331 as the second wall portion, which is disposed opposite to the first outer wall portion 321 and has the pair of wall surfaces 331a, 331b in a surface-opposite relationship each facing inward of the housing 3. Then, the wall surface 321b of the first outer wall portion 321 facing inward of the housing 3 is the first placement surface, the wall surface 331a of the first inner wall portion 331 opposite to the first outer wall portion 321 is the second placement surface, and the wall surface 331b of the first inner wall portion 331 on the side opposite to the first outer wall portion 321 is the third placement surface. According to such a structure, the first placement surface, the second placement surface, and the third placement surface can be provided on the housing 3 with a simple structure.

[0061] In addition, as described above, the sensor module 1 has the connection portion 6 that connects the inertial sensor devices 911, 912, 913. According to such a structure, the inertial sensor devices 911, 912, 913 are not scattered, and thus mounting of the inertial sensor devices 911, 912, 913 to the base 3 becomes easy.

[0062] In addition, as described above, the connection portion 6 is the flexible wiring substrate 61. According to such a structure, by bending the flexible wiring substrate 61, it is possible to easily change the positions and postures of the inertial sensor devices 911, 912, 913. Thus, mounting of the inertial sensor devices 911, 912, 913 to the base 3 becomes easy.

[0063] The above describes the sensor module 1, but the structure of the sensor module 1 is not particularly limited.

[0064] For example, the number of inertial sensor devices possessed by the first inertial sensor device group 91 is not limited to three, and can be four or more. In Figure 6 In the example shown, the first inertial sensor device group 91 has five inertial sensor devices 911, 912, 913, 914, 915. In this case, as long as the pair of first inner wall portions 331 are arranged in the X-axis direction within the base 3, the two wall surfaces of the first inner wall portion 331 on the positive side of the X-axis direction can be used as the placement surfaces for the inertial sensor devices 914, 915.

[0065] In addition, for example, as Figure 7 shown, it can also be a structure in which all of the inertial sensor devices 911, 912, 913 face the same direction. In this case, the inertial sensor device 912 can be mounted to the flexible wiring substrate 61 in a posture that is reversed with respect to the present embodiment.

[0066] In this way, the first inertial sensor devices 911, 912, 913 have detection axes that face the same direction as each other, but as Figure 7 shown, the detection axes can all face the same direction, or as Figure 5 shown, some of the detection axes can face the opposite side from the other detection axes. That is, when a certain direction is set as the positive direction and the opposite direction is set as the negative direction, the detection axes that face the same direction as each other can have only the detection axes of the positive direction, only the detection axes of the negative direction, or both the detection axes of the positive direction and the negative direction.

[0067] Furthermore, for example, each of the inertial sensor devices 911, 912, and 913 may not be a 6DoF sensor. In this case, for example, the inertial sensor devices 911, 912, and 913 may be configured as a single-axis angular velocity sensor that detects angular velocity about the J1 axis, with the J1 axis of each inertial sensor device 911, 912, and 913 oriented along any one of the X-axis, Y-axis, and Z-axis directions. Alternatively, for example, the inertial sensor devices 911, 912, and 913 may be configured as a three-axis angular velocity sensor that detects angular velocity about each of the J1, J2, and J3 axes, with the J1 axis of each inertial sensor device 911, 912, and 913 oriented along the Z-axis direction, the J2 axis along the Y-axis direction, and the J3 axis along the Z-axis direction.

[0068] Alternatively, for example, the inertial sensor devices 911, 912, and 913 may be configured as uniaxial acceleration sensors that detect acceleration in the J1-axis direction, with the J1 axis of each inertial sensor device 911, 912, and 913 oriented along any one of the X-axis, Y-axis, and Z-axis directions. Alternatively, for example, the inertial sensor devices 911, 912, and 913 may be configured as triaxial acceleration sensors that detect acceleration in the J1-axis, J2-axis, and J3-axis directions, with the J1 axis of each inertial sensor device 911, 912, and 913 oriented along the Z-axis direction, the J2 axis along the Y-axis direction, and the J3 axis along the Z-axis direction.

[0069] In addition, the structure of the connecting portion 6 is not particularly limited. Figure 8 As shown, the connecting portion 6 may also be a rigid / flexible wiring substrate 62 formed by connecting multiple flexible wiring substrates 622 to multiple rigid wiring substrates 621. It should be noted that in the illustrated example, the rigid / flexible wiring substrate 62 includes a rigid wiring substrate 621 equipped with an inertial sensor device 911, a rigid wiring substrate 621 equipped with an inertial sensor device 912, a rigid wiring substrate 621 equipped with an inertial sensor device 913, and a rigid wiring substrate 621 equipped with circuit elements 7 and connector 8, all of which are connected via the flexible wiring substrate 622. In this structure, by bending the flexible wiring substrate 622, the sensor mounting substrate 5 can be arranged within the base 3, similar to the present embodiment.

[0070] In addition, for example, Figure 9 As shown, the connection portion 6 may also be a connector wiring 63. The connector wiring 63 has connectors at both ends, and by connecting each connector to an object, two objects are electrically connected. In the example shown, the connection portion 6 includes a connector wiring 63 that connects the inertial sensor devices 911 and 912, a connector wiring 63 that connects the inertial sensor devices 912 and 913, a connector wiring 63 that connects the inertial sensor device 913 and the circuit element 7, and a connector wiring 63 that connects the circuit element 7 and the connector 8.

[0071] In addition, for example, Figure 10 As shown, the connecting portion 6 can also be omitted.

[0072] Second embodiment

[0073] Figure 11 It is a cross-sectional view showing a sensor module according to a second embodiment.

[0074] This embodiment is identical to the first embodiment described above, except for the structure of the sensor mounting substrate 5. It should be noted that the following description of this embodiment will focus on the differences from the first embodiment, and descriptions of similarities will be omitted. In the drawings of this embodiment, identical structures to those in the previous embodiment are denoted by the same reference numerals.

[0075] like Figure 11 As shown, the circuit element 7, connector 8, and inertial sensor devices 911, 912, and 913 of the sensor mounting substrate 5 of this embodiment are all mounted on the surface of the flexible wiring substrate 61. The sensor mounting substrate 5 is then housed in the base 3 with the back surface facing downward, with the flexible wiring substrate 61 bent in the thickness direction so as to cross the first inner wall portion 331 and span the region Q1 and the region Q2.

[0076] The circuit element 7 and connector 8 are each located within the region Q1 and bonded to the inner bottom surface of the base 3 via the flexible wiring substrate 61. Furthermore, the inertial sensor device 913 is also located within the region Q1 along with the circuit element 7 and connector 8, with its bottom surface facing the wall surface 331b of the first inner wall portion 331, bonded to the wall surface 331b via the flexible wiring substrate 61.

[0077] On the other hand, the inertial sensor device 911 is located within the region Q2, with its bottom surface facing the wall surface 321b of the first outer wall portion 321, and is bonded to the wall surface 321b via the flexible wiring substrate 61. Furthermore, the inertial sensor device 912 is also located within the region Q2 together with the inertial sensor device 911, and is bonded to the wall surface 331a of the first inner wall portion 331 via the flexible wiring substrate 61, with its bottom surface facing the wall surface 331a.

[0078] According to the second embodiment, the same effects as those of the first embodiment can be achieved.

[0079] Third embodiment

[0080] Figure 12 It is a cross-sectional view showing a sensor module according to a third embodiment. Figure 13 It is a front view of the first positioning portion.

[0081] This embodiment is the same as the aforementioned first embodiment except for the structure of the base 3. Note that in the following description, the points of difference from the aforementioned first embodiment are described, and the same applies to the same matters. In the drawings of this embodiment, the same reference numerals are used for the same structures as those of the aforementioned embodiment.

[0082] As Figure 12 illustrated, the base 3 of this embodiment has a first positioning portion 391 that positions the inertial sensor device 911 with respect to the wall surface 321b, a second positioning portion 392 that positions the inertial sensor device 912 with respect to the wall surface 331a, and a third positioning portion 393 that positions the inertial sensor device 913 with respect to the wall surface 331b. According to such a structure, the positional displacement and the attitude displacement of the inertial sensor devices 911, 912, 913 can be effectively suppressed.

[0083] As Figure 13 illustrated, the first positioning portion 391 protrudes from the wall surface 321b and has an abutting surface 391a that abuts against the side surface of the inertial sensor device 911 facing the negative side of the Z-axis direction and an abutting surface 391b that abuts against the side surface of the inertial sensor device 911 facing the positive side of the Y-axis direction. According to such a structure, the positional displacement and the attitude displacement of the inertial sensor device 911 can be suppressed with a simple structure. Note, however, that the structure of the first positioning portion 391 is not particularly limited. Note that the second and third positioning portions 392, 393 are the same structure as the first positioning portion 391, and thus the description thereof is omitted.

[0084] According to such a third embodiment, the same effects as those of the aforementioned first embodiment can be achieved.

[0085] Fourth Embodiment

[0086] Figure 14 is a plan view of a sensor module according to the fourth embodiment. Figure 15 and Figure 16 are cross-sectional views of the sensor module illustrated in Figure 14 . Figure 17 is an expanded view of a sensor mounting substrate.

[0087] This embodiment is the same as the aforementioned first embodiment except for the structures of the base 3 and the sensor mounting substrate 5. Note that in the following description, the points of difference from the aforementioned first embodiment are described, and the same applies to the same matters. In the drawings of this embodiment, the same reference numerals are used for the same structures as those of the aforementioned embodiment.

[0088] As Figure 14 shown in the base 3 of the present embodiment, the inner wall portion 33 is a rectangular frame shape. The inner wall portion 33 has a first inner wall portion 331 located on the negative side of the X-axis direction and extending in the Y-axis direction, a second inner wall portion 332 located on the negative side of the Y-axis direction and extending in the X-axis direction, a third inner wall portion 333 located on the positive side of the X-axis direction and extending in the Y-axis direction, and a fourth inner wall portion 334 located on the positive side of the Y-axis direction and extending in the X-axis direction. Such an inner wall portion 33 is formed in a concentric manner with the outer wall portion 32.

[0089] In addition, as Figure 15 shown, the first inner wall portion 331 has a pair of wall surfaces 331a, 331b in a surface-back relationship, both facing the inner side of the base 3. Then, the wall surface 331a on one side (negative side of the X-axis direction) opposes the first outer wall portion 321, and the wall surface 331b on the other side (positive side of the X-axis direction) opposes the third inner wall portion 333. In addition, the third inner wall portion 333 has a pair of wall surfaces 333a, 333b in a surface-back relationship, both facing the inner side of the base 3. Then, the wall surface 333a on one side (positive side of the X-axis direction) opposes the third outer wall portion 323, and the wall surface 333b on the other side (negative side of the X-axis direction) opposes the first inner wall portion 331.

[0090] In addition, as Figure 16 shown, the second inner wall portion 332 has a pair of wall surfaces 332a, 332b in a surface-back relationship, both facing the inner side of the base 3. Then, the wall surface 332a on one side (negative side of the Y-axis direction) opposes the second outer wall portion 322, and the wall surface 332b on the other side (positive side of the Y-axis direction) opposes the fourth inner wall portion 334. In addition, the fourth inner wall portion 334 has a pair of wall surfaces 334a, 334b in a surface-back relationship, both facing the inner side of the base 3. Then, the wall surface 334a on one side (positive side of the Y-axis direction) opposes the fourth outer wall portion 324, and the wall surface 334b on the other side (negative side of the Y-axis direction) opposes the second inner wall portion 332.

[0091] In addition, as Figure 15 shown, the six wall surfaces 321b, 331a, 331b, 333b, 333a, 323b arranged in the X-axis direction are each composed of a Y-Z plane orthogonal to the X-axis. That is, the wall surfaces 321b, 331a, 331b, 333b, 333a, 323b are parallel to each other. Likewise, as Figure 16 shown, the six wall surfaces 322b, 332a, 332b, 334b, 334a, 324b arranged in the Y-axis direction are each composed of an X-Z plane orthogonal to the Y-axis. That is, the wall surfaces 322b, 332a, 332b, 334b, 334a, 324b are parallel to each other.

[0092] In addition, as Figure 14 As shown, the sensor mounting substrate 5 includes, in addition to the circuit element 7, the connector 8 and the first inertial sensor device group 91, a second inertial sensor device group 92, a third inertial sensor device group 93, a fourth inertial sensor device group 94, a fifth inertial sensor device group 95 and a sixth inertial sensor device group 96.

[0093] The first inertial sensor device group 91, similar to the previous embodiment, includes inertial sensor devices 911, 912, and 913. Furthermore, the second inertial sensor device group 92 includes an inertial sensor device 921 as a fourth inertial sensor device, an inertial sensor device 922 as a fifth inertial sensor device, and an inertial sensor device 923 as a sixth inertial sensor device. Furthermore, the third inertial sensor device group 93 includes inertial sensor devices 931, 932, and 933.

[0094] These inertial sensor devices 911, 912, 913, 921, 922, 923, 931, 932, and 933 have identical structures and are uniaxial angular velocity sensors that detect angular velocity about the J1 axis. Furthermore, inertial sensor devices 911, 912, 913, inertial sensor devices 921, 922, 923, and inertial sensor devices 931, 932, and 933 are housed in base 3 in an orthogonal orientation. Specifically, inertial sensor devices 911, 912, and 913 are housed in base 3 with the J1 axis aligned with the X axis. Inertial sensor devices 921, 922, and 923 are housed in base 3 with the J1 axis aligned with the Y axis. Furthermore, inertial sensor devices 931, 932, and 933 are housed in base 3 with the J1 axis aligned with the Z axis.

[0095] The fourth inertial sensor device group 94 includes inertial sensor devices 941 , 942 , and 943 . The fifth inertial sensor device group 95 includes inertial sensor devices 951 , 952 , and 953 . The sixth inertial sensor device group 96 includes inertial sensor devices 961 , 962 , and 963 .

[0096] These inertial sensor devices 941, 942, 943, 951, 952, 953, 961, 962, and 963 have identical structures and are uniaxial acceleration sensors that detect acceleration in the J1-axis direction. Furthermore, inertial sensor devices 941, 942, 943, inertial sensor devices 951, 952, 953, and inertial sensor devices 961, 962, and 963 are housed in base 3 in an orientation perpendicular to one another. Specifically, inertial sensor devices 941, 942, and 943 are housed in base 3 with their J1 axes aligned with the X-axis. Inertial sensor devices 951, 952, and 953 are housed in base 3 with their J1 axes aligned with the Y-axis. Furthermore, inertial sensor devices 961, 962, and 963 are housed in base 3 with their J1 axes aligned with the Z-axis.

[0097] Figure 17 is a developed view of the flexible wiring substrate 61. As shown in this figure, the flexible wiring substrate 61 is cross-shaped and has a central portion 610 located in the center, a first belt portion 611 extending from the central portion 610 toward the negative side in the X-axis direction, a second belt portion 612 extending from the central portion 610 toward the negative side in the Y-axis direction, a third belt portion 613 extending from the central portion 610 toward the positive side in the X-axis direction, and a fourth belt portion 614 extending from the central portion 610 toward the positive side in the Y-axis direction.

[0098] Then, circuit elements 7 and connector 8 are mounted on the front surface of central portion 610, and inertial sensor devices 931, 932, 933, 961, 962, and 963 are mounted on the back surface of central portion 610. It should be noted that inertial sensor devices 931, 932, and 933 are arranged side by side in the X-axis direction. Similarly, inertial sensor devices 961, 962, and 963 are arranged side by side in the X-axis direction.

[0099] Inertial sensor devices 911, 912, and 913 are mounted on the back of the first belt portion 611, aligned along the X-axis. Inertial sensor devices 921, 922, and 923 are mounted on the back of the second belt portion 612, aligned along the Y-axis. Inertial sensor devices 941, 942, and 943 are mounted on the back of the third belt portion 613, aligned along the X-axis. Inertial sensor devices 951, 952, and 953 are mounted on the back of the fourth belt portion 614, aligned along the Y-axis.

[0100] This sensor mounting substrate 5 has the back side of the flexible wiring substrate 61 facing downward, and the central portion 610 is arranged in the area Q1. The first, second, third, and fourth band portions 611, 612, 613, 614 are accommodated in the base 3 in a state where the first, second, third, and fourth band portions 611, 612, 613, 614 are bent in the thickness direction so as to pass over the inner wall portion 33 and span the area Q1 and the area Q2.

[0101] Then, if Figure 15 As shown, circuit element 7 and connector 8 are each located within region Q1 and bonded to the inner bottom surface of base 3 via flexible wiring board 61. Furthermore, inertial sensor devices 931, 932, 933, 961, 962, and 963 are each located within region Q1, bonded to the inner bottom surface of base 3 with their top surfaces facing the inner bottom surface of base 3. Note that in this embodiment, deflection of central portion 610 is suppressed by raising the portion where circuit element 7 and connector 8 are located to the thickness of inertial sensor devices 931, 932, 933, 961, 962, and 963.

[0102] In addition, if Figure 15 As shown, the inertial sensor device 911 is located in region Q2, with its top surface facing the wall surface 321b of the first outer wall portion 321 and bonded to the wall surface 321b. Furthermore, the inertial sensor device 912 is located in region Q2, with its top surface facing the wall surface 331a of the first inner wall portion 331 and bonded to the wall surface 331a. Furthermore, the inertial sensor device 913 is located in region Q1, with its top surface facing the wall surface 331b of the first inner wall portion 331 and bonded to the wall surface 331b.

[0103] In addition, if Figure 16 As shown, the inertial sensor device 921 is positioned within region Q2, with its top surface facing the wall surface 322b of the second outer wall portion 322, serving as the fourth placement surface, and bonded to the wall surface 322b. Furthermore, the inertial sensor device 922 is positioned within region Q2, with its top surface facing the wall surface 332a of the second inner wall portion 332, serving as the fifth placement surface, and bonded to the wall surface 332a. Furthermore, the inertial sensor device 923 is positioned within region Q1, with its top surface facing the wall surface 332b of the second inner wall portion 332, serving as the sixth placement surface, and bonded to the wall surface 332b.

[0104] In addition, if Figure 15 As shown, the inertial sensor device 941 is located in region Q2, with its top surface facing the wall surface 323b of the third outer wall portion 323 and bonded to the wall surface 323b. Furthermore, the inertial sensor device 942 is located in region Q2, with its top surface facing the wall surface 333a of the third inner wall portion 333 and bonded to the wall surface 333a. Furthermore, the inertial sensor device 943 is located in region Q1, with its top surface facing the wall surface 333b of the third inner wall portion 333 and bonded to the wall surface 333b.

[0105] In addition, if Figure 16As shown, the inertial sensor device 951 is located in the region Q2, with its top surface facing the wall surface 324b of the fourth outer wall portion 324 and bonded to the wall surface 324b. Furthermore, the inertial sensor device 952 is located in the region Q2, with its top surface facing the wall surface 334a of the fourth inner wall portion 334 and bonded to the wall surface 334a. Furthermore, the inertial sensor device 953 is located in the region Q1, with its top surface facing the wall surface 334b ​​of the fourth inner wall portion 334 and bonded to the wall surface 334b.

[0106] It should be noted that the inertial sensor devices 911, 912, 913, 921, 922, 923, 931, 932, 933, 941, 942, 943, 951, 952, 953, 961, 962, and 963 can all be single-axis angular velocity sensors that detect the angular velocity around the J1 axis, or can all be single-axis acceleration sensors that detect the acceleration in the direction of the J1 axis. They can also be 6DoF sensors, or can be three-axis angular velocity sensors that detect the angular velocity around each axis of the J1 axis, the J2 axis, and the J3 axis, or can be three-axis acceleration sensors that detect the acceleration in the directions of each axis of the J1 axis, the J2 axis, and the J3 axis.

[0107] As described above, the sensor module 1 of this embodiment includes a second inertial sensor device group 92 comprising a fourth inertial sensor device 921, a fifth inertial sensor device 922, and a sixth inertial sensor device 923, all with detection axes oriented in the same direction. Furthermore, the base 3 includes a fourth mounting surface, on which the inertial sensor device 921 is positioned; a fifth mounting surface, parallel to the wall 322b, on which the inertial sensor device 922 is positioned; and a sixth mounting surface, parallel to the wall 332b, on which the inertial sensor device 923 is positioned. This configuration facilitates juxtaposing the inertial sensor devices 921, 922, and 923 in a parallel position, since the base 3 includes parallel walls 322b, 332a, and 332b.

[0108] According to the fourth embodiment, the same effects as those of the first embodiment can be achieved.

[0109] Fifth embodiment

[0110] Figure 18 It is a plan view showing a sensor module according to a fifth embodiment. Figure 19 A developed view of the sensor mounting substrate is shown.

[0111] This embodiment is identical to the aforementioned fourth embodiment, except for the differences in the structures of the base 3 and the sensor mounting substrate 5. It should be noted that the following description of this embodiment will focus on the differences from the aforementioned first embodiment, and descriptions of identical matters will be omitted. In the drawings of this embodiment, identical structures to those in the aforementioned embodiment are denoted by the same reference numerals.

[0112] like Figure 18 As shown, in the base 3 of this embodiment, the inner wall portion 33 is L-shaped. The inner wall portion 33 includes a first inner wall portion 331 located on the negative side in the X-axis direction and extending in the Y-axis direction, and a second inner wall portion 332 located on the negative side in the Y-axis direction and extending in the X-axis direction.

[0113] Furthermore, the sensor mounting substrate 5 includes, in addition to the circuit element 7, connector 8, and first inertial sensor device group 91, a second inertial sensor device group 92, a third inertial sensor device group 93, and a fourth inertial sensor device group 94. The first, second, and third inertial sensor device groups 91, 92, and 93 have the same structure as in the aforementioned fourth embodiment, and therefore their description will be omitted. In contrast, the three inertial sensor devices 941, 942, and 943 included in the fourth inertial sensor device group 94 are triaxial acceleration sensors that detect acceleration in the J1, J2, and J3 axes, respectively.

[0114] Figure 19 is a developed view of the sensor mounting substrate 5. As shown in this figure, the flexible wiring substrate 61 is L-shaped and has a central portion 610 located in the center, a first belt portion 611 extending from the central portion 610 toward the negative side in the X-axis direction, and a second belt portion 612 extending from the central portion 610 toward the negative side in the Y-axis direction.

[0115] Then, circuit elements 7 and connector 8 are mounted on the surface of central portion 610, and inertial sensor devices 931, 932, 933, 941, 942, and 943 are mounted on the back of central portion 610. Furthermore, inertial sensor devices 911, 912, and 913 are mounted side by side along the X-axis on the back of first belt portion 611. Furthermore, inertial sensor devices 921, 922, and 923 are mounted side by side along the Y-axis on the back of second belt portion 612.

[0116] This sensor mounting substrate 5 is positioned with the back surface of the flexible wiring substrate 61 facing downward, with the central portion 610 positioned within region Q1. The first and second belt portions 611 and 612 are then bent in the thickness direction so that they extend across the inner wall portion 33 and span regions Q1 and Q2, and are housed in the base 3. It should be noted that when the sensor mounting substrate 5 is housed in the base 3, the J1 axis of the inertial sensor devices 941, 942, and 943 coincides with the X axis, the J2 axis coincides with the Y axis, and the J3 axis coincides with the Z axis.

[0117] According to the fifth embodiment, the same effects as those of the first embodiment can be achieved.

[0118] While the sensor module of the present invention has been described above based on the illustrated embodiments, the present invention is not limited thereto. The structures of the various components can be replaced with any other structure having the same function. Furthermore, any other structure can be added to the present invention. Furthermore, the various embodiments can be appropriately combined.

Claims

1. A sensor module, characterized in that: have: a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device having detection axes oriented in the same direction; and The base includes a first mounting surface on which the first inertial sensor device is arranged, a second mounting surface parallel to the first mounting surface on which the second inertial sensor device is arranged, and a third mounting surface parallel to the first mounting surface on which the third inertial sensor device is arranged.

2. The sensor module according to claim 1, wherein: The first placement surface, the second placement surface, and the third placement surface are arranged along a normal direction of the first placement surface.

3. The sensor module according to claim 2, wherein: The first inertial sensor device, the second inertial sensor device, and the third inertial sensor device are arranged along a normal direction of the first mounting surface.

4. The sensor module according to claim 3, wherein: The base is box-shaped and accommodates the first inertial sensor device group. The sensor module comprises: a first wall portion, wherein one of a pair of wall surfaces of the first wall portion in a front-back relationship faces the outside of the base and the other faces the inside of the base; and a second wall portion, wherein the second wall portion is arranged opposite to the first wall portion, and the pair of wall surfaces of the second wall portion in a front-back relationship both face the inside of the base. The inner wall surface of the first wall portion facing the base is the first placement surface. The wall surface of the second wall portion that is opposite to the first wall portion is the second placement surface. A wall surface of the second wall portion located on the opposite side to the first wall portion serves as the third placement surface.

5. The sensor module according to claim 1, wherein: The sensor module includes a connection portion that connects the first inertial sensor device, the second inertial sensor device, and the third inertial sensor device.

6. The sensor module according to claim 5, characterized in that The connecting portion is a flexible wiring substrate.

7. The sensor module according to claim 1, wherein: The sensor module includes a second inertial sensor device group, the second inertial sensor device group including a fourth inertial sensor device, a fifth inertial sensor device, and a sixth inertial sensor device having detection axes oriented in the same direction. The base includes a fourth mounting surface on which the fourth inertial sensor device is arranged, a fifth mounting surface parallel to the fourth mounting surface on which the fifth inertial sensor device is arranged, and a sixth mounting surface parallel to the fourth mounting surface on which the sixth inertial sensor device is arranged.

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