Recommendation method of equipment installation position and electronic equipment

Abstract

The invention discloses an equipment installation position recommendation method and electronic equipment, and the method comprises the steps: determining equipment installation information corresponding to a plurality of heat dissipation regions of the electronic equipment in response to an installation position recommendation request; the heat dissipation area represents an area determined by dividing a plurality of assembly mounting positions of the electronic equipment; a heat dissipation fan is mounted in each heat dissipation area; the recommendation request represents a request for recommending a position for installing first equipment; the first device characterizes a vibration sensitive device; and based on the equipment installation information, determining a target recommendation position corresponding to the recommendation request from a plurality of component installation positions in the plurality of heat dissipation areas.

Description

Technical Field

[0001] The present application relates to, but is not limited to, the field of computer technology, and in particular to a method for recommending a device installation location and an electronic device. Background Art

[0002] Hard disk drives (HDDs) have storage capacities ranging from hundreds of gigabytes (Gb) to tens of terabytes (Tb) and have the advantage of strong data recoverability, making them a commonly used large-capacity storage device in the computer field. Summary of the Invention

[0003] This application at least provides a method for recommending a device installation location and an electronic device.

[0004] The technical solution of this application is achieved as follows:

[0005] In one aspect, the present application provides a method for recommending a device installation location, the method comprising:

[0006] In response to an installation location recommendation request, device installation information corresponding to a plurality of heat dissipation zones of the electronic device is determined; the heat dissipation zones represent areas determined by dividing a plurality of component installation locations of the electronic device; a heat dissipation fan is installed in each heat dissipation zone; the recommendation request is used to request a recommendation for a component installation location for installing a first device; the first device represents a vibration-sensitive device;

[0007] Based on the device installation information, a target recommended position corresponding to the recommendation request is determined from a plurality of component installation positions in a plurality of heat dissipation zones.

[0008] In some embodiments, before determining, in response to the installation location recommendation request, device installation information corresponding to multiple heat dissipation zones of the electronic device, the method further includes at least one of the following:

[0009] In response to a user installing a first device on an electronic device, obtaining a first installation location of the first device; in response to a high-power device being installed in a first heat dissipation zone where the first installation location is located, generating a recommendation request;

[0010] A recommendation request is generated in response to user input information received through a designated application.

[0011] In some embodiments, determining a target recommended location corresponding to the recommendation request from a plurality of component installation locations in a plurality of heat dissipation zones based on the device installation information includes:

[0012] Based on the device installation information, determining at least one second heat dissipation zone from the plurality of heat dissipation zones; the second heat dissipation zone represents a heat dissipation zone where no high-power device is installed;

[0013] A target recommended position is determined from at least one second installation position in at least one second heat dissipation zone.

[0014] In some embodiments, determining at least one second heat dissipation zone from a plurality of heat dissipation areas based on the device installation information includes:

[0015] In response to the device installation information indicating that the plurality of heat dissipation zones include at least one third heat dissipation zone, the at least one third heat dissipation zone is used as the at least one second heat dissipation zone; the third heat dissipation zone indicates a heat dissipation zone where no high-power device is installed;

[0016] In response to the device installation information indicating that each of the multiple heat dissipation zones is installed with high-power devices, it is determined that the high-power devices installed in the fourth heat dissipation zone among the multiple heat dissipation zones are moved to other heat dissipation zones, and the fourth heat dissipation zone after the move is used as the second heat dissipation zone; the fourth heat dissipation zone indicates that the number of high-power devices installed in the multiple heat dissipation zones is the least and can be moved to other heat dissipation zones.

[0017] In some embodiments, the plurality of heat dissipation zones include a fifth heat dissipation zone and a sixth heat dissipation zone; the number of high-power devices installed in the fifth heat dissipation zone and the sixth heat dissipation zone is the same and the number is the least;

[0018] The method further includes at least one of the following:

[0019] In response to the fact that the high-power device installed in the fifth heat dissipation zone is a central processing unit, and that idle component installation positions capable of installing the central processing unit are provided in heat dissipation zones other than the fifth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone;

[0020] In response to the fact that the power of the high-power device installed in the fifth heat dissipation zone is greater than the power of the high-power device installed in the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone;

[0021] In response to the distance between the third installation position in the fifth heat dissipation zone and the fan being greater than the distance between the fourth installation position in the sixth heat dissipation zone and the heat dissipation fan, the fifth heat dissipation zone is designated as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle component installation positions where the first device can be installed;

[0022] In response to the third installation position in the fifth heat dissipation zone being between the air inlet and the heat dissipation fan of the fifth heat dissipation zone, and the fourth installation position in the sixth heat dissipation zone being between the air outlet and the heat dissipation fan of the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle installation positions where the first device can be installed.

[0023] In some embodiments, determining the target recommended position from at least one second installation position in at least one second heat dissipation zone includes:

[0024] determining a priority of each second installation position based on position information of each second installation position relative to a corresponding heat dissipation fan;

[0025] Based on the priority, a target recommended location is determined from the at least one second installation location.

[0026] In some embodiments, the location information includes at least one of the following:

[0027] The distance between the second installation position and the corresponding cooling fan;

[0028] The second installation position is relative to the distance between the corresponding cooling fan and the air inlet.

[0029] In some embodiments, the method further comprises:

[0030] Based on the operating power information of the cooling fans in each second cooling zone, the priority of the corresponding second installation position is determined; the equipment installation information includes the operating power information of the cooling fans installed in each cooling zone.

[0031] In some embodiments, the method further comprises:

[0032] In response to the user installing the second device on the electronic device, obtaining the installation location and attribute information of the second device; wherein the attribute information includes at least power information of the second device;

[0033] The device installation information is updated based on the installation location and attribute information of the second device.

[0034] On the other hand, the present application provides an electronic device, including a memory and a processor; wherein,

[0035] The memory stores a computer program executable on the processor;

[0036] A processor for executing a computer program for:

[0037] In response to an installation location recommendation request, device installation information corresponding to a plurality of heat dissipation zones of the electronic device is determined; the heat dissipation zones represent areas determined by dividing a plurality of component installation locations of the electronic device; a heat dissipation fan is installed in each heat dissipation zone; the recommendation request is used to request a recommendation for a component installation location for installing a first device; the first device represents a vibration-sensitive device;

[0038] Based on the device installation information, a target recommended position corresponding to the recommendation request is determined from a plurality of component installation positions in a plurality of heat dissipation areas.

[0039] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the technical solutions of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.

[0041] Figure 1 is a structural diagram of an HDD;

[0042] Figure 2 A schematic diagram of a data read and write track of an HDD;

[0043] Figure 3 A diagram showing the changes in the number of HDD input and output operations under different cooling fan loads;

[0044] Figure 4 A schematic diagram of the implementation flow of a method for recommending equipment installation locations provided in this application;

[0045] Figure 5A A top view of a server in one embodiment provided in this application;

[0046] Figure 5B for Figure 5A Rear view of the server shown in ;

[0047] Figure 6 A schematic diagram of an implementation flow of an embodiment provided in this application;

[0048] Figure 7 A schematic diagram of the structure of a recommended device for installation location provided in this application;

[0049] Figure 8 A schematic diagram of the hardware entity of an electronic device provided in this application. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions of this application are further elaborated in detail below with reference to the accompanying drawings and embodiments. The described embodiments should not be regarded as limiting this application. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0051] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0052] The terms "first / second / third" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It is understandable that "first / second / third" can be interchanged with a specific order or sequence where permitted so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing this application only and are not intended to limit this application.

[0054] In order to better understand the recommended method for device installation location provided in this application, the structure of the HDD is briefly described below.

[0055] like Figure 1 As shown, HDD 100 includes a disk platter 110, a read / write head 120, and a drive arm 130. The drive arm 130 adjusts the track position currently read / written by the read / write head 120. Simultaneously, a driver (not shown) of HDD 100 drives the disk platter 110 to rotate, thereby enabling the reading and writing of magnetic data on the disk platter 110.

[0056] Since the reading and writing of HDD are related to the operational stability of the internal mechanical components, HDD is more sensitive to vibration and noise impact, and the larger the capacity of HDD, the higher the sensitivity to vibration and noise. Ideally, the reading and writing tracks of the read / write head 120 on the disk 110 should be as follows: Figure 2 However, under the influence of vibration and noise, the actual read and write track of the HDD read / write head 120 on the disk 110 will often be as follows Figure 2 As shown in the wavy track 220 in FIG. This will cause the read and write performance of the HDD to degrade, and even cause problems in the operation of the HDD system.

[0057] Furthermore, as server component power consumption continues to increase—for example, the thermal design power (TDP) of the central processing unit (CPU) in current servers has risen to 500W—the speed of cooling fans installed in servers has also increased. Ultra-high-performance cooling fans can reach speeds of up to 28,000 rpm. This has further reduced the read and write performance of HDDs installed in servers.

[0058] like Figure 3As shown, the broken lines 310, 320 and 330 respectively represent the percentage changes of the input / output operations per second (IOPS) of the HDDs plugged into the three HDD slots on the server motherboard relative to the reference value as the cooling fan load increases. Figure 3 It can be seen that when the cooling fan load is below 80%, the IOPS percentage of the three HDDs relative to the reference value is relatively stable and high. As the cooling fan load increases from 80% to 100%, the IOPS percentage of the three HDDs relative to the reference value gradually decreases from nearly 100% to below 20%.

[0059] In the related art, the above problem is alleviated by limiting the HDD configuration on the server. However, this solution results in users being unable to configure the required large-capacity HDD on the server, which reduces the user experience.

[0060] Based on this, the present application provides a method for recommending a device installation location, which can be executed by an electronic device, which can be various types of terminals such as laptops, tablets, desktop computers, mobile devices (for example, mobile phones, personal digital assistants, dedicated messaging devices), and can also be implemented as a server. The server can be an independent physical server, or a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDNs), and big data and artificial intelligence platforms.

[0061] Below, the technical solution of this application will be clearly and completely described in conjunction with the drawings in this application.

[0062] Figure 4 This is a flowchart of a recommended method for determining the device installation location provided in this application. Figure 4 As shown, the method includes the following steps S41 to S42:

[0063] Step S41, in response to the installation location recommendation request, determining the device installation information corresponding to multiple heat dissipation zones of the electronic device; the heat dissipation zones represent areas determined after dividing the installation positions of multiple components of the electronic device; a cooling fan is installed in each of the heat dissipation zones; the recommendation request is used to request a recommended installation location for a first device; the first device represents a vibration-sensitive device.

[0064] Here, an electronic device can refer to any device capable of installing a component. In some embodiments, the electronic device can be various types of servers, or a desktop computer chassis capable of connecting to other devices. In some embodiments, the method provided in this application can be performed by the electronic device, or by a device other than the electronic device. When the method provided in this application is performed by another device, the other device is in communication with the electronic device and stores device installation information for the electronic device.

[0065] Multiple component installation locations refer to locations configured within an electronic device that can be installed with at least one type of component. A component can be any type of component. For example, a component can be a CPU, a graphics processing unit (GPU), a non-volatile memory express (NVMe) driver, a dual-inline memory module (DIMM), an open compute project network card (OCP network card), etc.

[0066] According to a preset device design, multiple component mounting locations are arranged on the motherboard of the electronic device. In some embodiments, the component mounting location can be a native slot (or integrated slot) on the motherboard of the electronic device, or an expansion slot on the motherboard of the electronic device. The expansion slot can be, for example, a Peripheral Component Interconnect Express (PCIe) expansion slot, a SATA expansion slot, etc.

[0067] After determining the mounting locations of multiple components on the electronic device, the internal space of the electronic device is divided into multiple heat dissipation zones according to the locations of the electronic device's vents. Each heat dissipation zone includes multiple component mounting locations and has an air inlet and an air outlet. In some embodiments, baffles can be used to separate the different heat dissipation zones to separate the air in the different heat dissipation zones and reduce temperature transfer between the heat dissipation zones.

[0068] Figure 5A A top view of a server in one embodiment provided in this application is shown. Figure 5B for Figure 5A Rear view of the server shown in .

[0069] like Figure 5AAs shown, the main board of the server 500 is provided with multiple component installation positions 510, and the upper end shown in the figure is the rear end of the server 500, and the lower end is the front end of the server 500. The air inlet of the server 500 is set at the rear end, and the air outlet is set at the front end. In this way, the baffle can be used to Figure 5A The multiple component installation positions shown in the figure are spaced apart to form multiple heat dissipation zones arranged along the left and right directions. A heat dissipation fan is provided in each heat dissipation zone and has corresponding air inlets and outlets.

[0070] like Figure 5B As shown, a plurality of component installation positions 521 are provided on the front face 520 of the server 500. At the same time, a plurality of component installation positions can also be provided on the rear face (not shown) of the server 500.

[0071] A heat dissipation fan is installed in each heat dissipation zone to disturb the air flow in the heat dissipation zone.

[0072] Here, the cooling fan may be any fan that can be installed in an electronic device in the art. In some embodiments, the cooling fan may be a standard fan, a high-performance fan, or an ultra-high-performance fan; wherein, the standard fan, the high-performance fan, and the ultra-high-performance fan are classifications of the cooling fans according to their maximum rotational speed, and the maximum rotational speeds of the three increase in sequence. In some embodiments, the performance of the cooling fans installed in different cooling zones of the electronic device may be the same or different. In some embodiments, when the performance of the cooling fans installed in different cooling zones of the electronic device is different, the performance of the cooling fans installed in the cooling zone may be determined according to the maximum power of the components that can be installed in each cooling zone. For example, a cooling fan with higher performance is configured for a cooling zone where higher-power components are installed; a cooling fan with lower performance is configured for a cooling zone where lower-power components are installed.

[0073] The first device may be any device that can be installed in a component installation position of an electronic device, and the first device represents a vibration-sensitive device. A vibration-sensitive device refers to a device that is sensitive to vibration, and its performance, accuracy, stability or service life are easily affected by vibration and change or decline. Here, the first device may be an HDD or a mechanical hard disk. In the following embodiment, the HDD may be connected to the electronic device via a Serial Advanced Technology Attachment (SATA) interface or a Serial Attached SCSI (SAS) interface on the motherboard of an electronic device such as a server or a personal computer.

[0074] A recommendation request is used to request a recommendation for a component installation location for the first device. In some embodiments, the recommendation request may be determined based on location recommendation request information input by a user in a designated application, or may be automatically determined based on the user's action of connecting the first device to a component installation location on an electronic device.

[0075] After obtaining an installation location recommendation request for the first device, device installation information corresponding to a plurality of heat dissipation zones of the electronic device is determined.

[0076] Here, the device installation information corresponding to the multiple cooling zones may include information about the devices installed in the multiple cooling zones and the installation locations of idle components. In some embodiments, the device installation information may include information such as the device type and device parameters of the devices installed in the corresponding cooling zones. In some embodiments, the device installation information may include information such as the type and specific location of the idle components. In some embodiments, the device installation information may include information such as the performance information of the cooling fans installed in the corresponding cooling zones and the specific locations of the cooling fans.

[0077] In some embodiments, the device installation information can be stored in any suitable location. In some embodiments, the device installation information can be stored in an electronic device or other device used to perform the methods provided herein. For example, the device installation information can be stored in a baseboard management controller (BMC) of the electronic device, a designated hard disk storage device, etc.; for another example, the device installation information can also be stored in a cloud storage device or a remote storage device.

[0078] Step S42 : determining a target recommended position corresponding to the recommendation request from a plurality of component installation positions in the plurality of heat dissipation zones based on the device installation information.

[0079] Here, after determining the device installation information of the plurality of heat dissipation zones, a target recommended location corresponding to the recommendation request, ie, a component installation location for installing the first device, is determined based on the device installation information.

[0080] In some implementations, the target recommended location corresponding to the recommendation request may be determined from a plurality of component installation locations in any suitable manner based on the device installation information.

[0081] In some implementations, a target recommended location corresponding to the recommendation request may be determined from at least one idle component installation location among a plurality of component installation locations based on the device installation information.

[0082] In some embodiments, first, based on the equipment installation information, multiple idle component installation positions can be determined from multiple component installation positions; then, an idle component installation position among the multiple idle installation positions that is farther away from the corresponding cooling fan is determined as the target recommended position.

[0083] In some embodiments, first, based on the device installation information, multiple idle component installation positions can be determined from multiple component installation positions; then, an idle component installation position among the multiple idle component installation positions, in which no high-power device is installed in the same heat dissipation area, is determined as the target recommended position.

[0084] The device installation location recommendation method provided in this application determines, after receiving a request for an installation location recommendation, device installation information corresponding to multiple heat dissipation zones of an electronic device, and based on the device installation information, determines a target recommended location corresponding to the recommendation request from multiple component installation locations within the multiple heat dissipation zones. Thus, when a user requests to install a vibration-sensitive device, a location for installing the vibration-sensitive device can be automatically recommended based on the device installation information corresponding to the multiple heat dissipation zones of the electronic device. Furthermore, when recommending a target recommended location for the vibration-sensitive device based on the device installation information, factors that may affect the performance of the vibration-sensitive device can be comprehensively considered, such as the device parameters of the installed devices in each heat dissipation zone, the specific location of the free component installation location within the corresponding heat dissipation zone, or the location of the cooling fan. This allows for intelligent recommendation of installation locations for the vibration-sensitive device while maintaining stable performance of the vibration-sensitive device, thereby satisfying the user's configuration requirements for vibration-sensitive devices, such as large-capacity HDDs.

[0085] In some embodiments, before determining the device installation information corresponding to the multiple heat dissipation zones of the electronic device in response to the installation location recommendation request, that is, before the above step S41, the method provided in this application further includes at least one of the following steps S43 and S44:

[0086] Step S43: in response to the user installing the first device on the electronic device, obtaining a first installation position of the first device; and in response to a high-power device being installed in a first heat dissipation zone where the first installation position is located, generating the recommendation request.

[0087] Here, when the user installs the first device on the electronic device, the first installation position of the first device is obtained, and it is determined whether the first installation position is suitable for installing the first device; if the first installation position is not suitable for installing the first device, a recommendation request is generated to determine the target recommended position for the first device based on the recommendation request.

[0088] In some embodiments, when the first device is a vibration-sensitive storage device, such as an HDD, the first installation position of the first device can be obtained in any suitable manner. In some embodiments, the first installation position of the first device can be obtained by a storage controller; the storage controller can be a SATA controller, an NVMe controller, etc. In some embodiments, the first installation position of the first device can be obtained by an Intelligent Platform Management Interface (IPMI).

[0089] In some embodiments, after determining the first installation position of the first device, the device installation information corresponding to the first cooling area where the first installation position is located is obtained to determine whether a high-power device is installed in the first cooling area.

[0090] A high-power device refers to a device with a maximum power greater than a specified power threshold. In some embodiments, the high-power device can be a CPU, a GPU, an OCP network card, a high-power NVMe drive, a high-power memory module, etc.

[0091] In some embodiments, the installation of a high-power device in the first cooling area can mean that there is a specific device with a maximum power greater than a specified power threshold among the at least one device installed in the first cooling area. In some embodiments, the installation of a high-power device in the first cooling area can mean that the sum of the maximum powers of the plurality of devices installed in the first cooling area is greater than a specified power threshold. For example, when a plurality of memory modules are installed in the first cooling area and the sum of the maximum powers of the plurality of memory modules is greater than a specified power threshold, it can be determined that a high-power device is installed in the first cooling area.

[0092] When a high-power device is installed in the first cooling area, the high-power device generates a high amount of heat when operating at a high power consumption, and the cooling fan in the first cooling area needs to be controlled to operate at a high speed, thereby increasing the vibration intensity in the first cooling area and significantly reducing the device performance of the first device. Therefore, when a high-power device is installed in the first cooling area where the first installation position is located, it is considered that the first installation position is not suitable for installing the first device, and thus the recommendation request is generated.

[0093] Step S44, in response to the user input information received through the specified application, the recommendation request is generated.

[0094] Here, the specified application can refer to any application capable of receiving user input information and generating a recommendation request.

[0095] In some embodiments, the designated application may be an application for implementing a device installation location recommendation function, that is, an application for executing the recommendation method provided herein. In some embodiments, when the recommendation method provided herein is executed using a baseboard management (BMC) in an electronic device, the designated application may be a webpage corresponding to the BMC.

[0096] In some implementations, when the recommendation method provided in this application is executed using a BMC in an electronic device, the user may generate the above-mentioned recommendation request through a BMC code.

[0097] In the above-mentioned embodiments provided by the present application, the above-mentioned recommendation request is generated in response to a high-power device being installed in the first heat dissipation zone where the first installation position of the first device is currently installed. Thus, when the location where the user currently installs the first device is not suitable for installing the vibration-sensitive device, the target recommended location suitable for installing the vibration-sensitive device can be actively recommended to the user, thereby improving the intelligence of the device installation position recommendation method; or, the above-mentioned recommendation request is generated in response to receiving user input information, thereby recommending the target recommended location suitable for installing the vibration-sensitive device to the user before the user installs the first device.

[0098] In some embodiments, determining the target recommended location corresponding to the recommendation request from the multiple component installation locations in the multiple heat dissipation areas based on the device installation information, that is, the above step S42, can be implemented as the following steps S421 to S422:

[0099] Step S421 : determining at least one second heat dissipation zone from the plurality of heat dissipation areas based on the device installation information; the second heat dissipation zone represents a heat dissipation zone where no high-power device is installed.

[0100] Here, after determining the device installation information corresponding to the multiple cooling zones, the installed devices and vacant component installation locations in the multiple cooling zones are analyzed based on the device installation information, thereby determining at least one second cooling zone in which no high-power devices are installed. The vacant component installation locations in each second cooling zone include at least a component installation location capable of installing the first device.

[0101] In some embodiments, the second heat dissipation zone may be a heat dissipation zone in which no device is installed, that is, all component installation locations in the second heat dissipation zone are idle. In some embodiments, the second heat dissipation zone may be a heat dissipation zone in which at least one device is installed, and none of the at least one device is a high-power device.

[0102] In this way, since the second heat dissipation area is a heat dissipation area where no high-power equipment is installed, during the operation of the electronic equipment, the equipment installed in the second heat dissipation area has lower power consumption, the corresponding cooling fan speed will also be lower, and the vibration intensity generated will be lower, thereby improving the equipment performance during the operation of the first device.

[0103] Step S422 : determining the target recommended position from at least one second installation position in the at least one second heat dissipation area.

[0104] Here, the second installation position represents an idle component installation position in the corresponding second heat dissipation zone that can be used to install the first device.

[0105] In some embodiments, a target recommended position can be determined from at least one second installation position based on information such as the position of each second installation position relative to the cooling fan and other installed devices in the same cooling zone, or the positions of the air inlet and outlet.

[0106] In the above-mentioned embodiments provided in the present application, a target recommended position for installing the first device is determined from at least one second heat dissipation zone in which no high-power device is installed, and the first device can be installed on a component installation position with lower vibration intensity, thereby improving the device performance during operation of the first device.

[0107] In some embodiments, determining at least one second heat dissipation zone from the multiple heat dissipation areas based on the device installation information, that is, the above step S421, can be implemented as the following steps S4211 to S4212:

[0108] Step S4211: in response to the device installation information indicating that the plurality of heat dissipation zones include at least one third heat dissipation zone, use the at least one third heat dissipation zone as the at least one second heat dissipation zone; the third heat dissipation zone indicates a heat dissipation zone where no high-power device is installed.

[0109] Here, when it is determined based on the device installation information that the plurality of heat dissipation zones include at least one third heat dissipation zone where no high-power device is installed, the at least one third heat dissipation zone is used as the at least one second heat dissipation zone.

[0110] Step S4212, in response to the device installation information indicating that each of the multiple heat dissipation zones is installed with high-power devices, determine to move the high-power devices installed in the fourth heat dissipation zone among the multiple heat dissipation zones to other heat dissipation zones, and use the fourth heat dissipation zone after the move as the second heat dissipation zone; the fourth heat dissipation zone indicates that the number of high-power devices installed in the multiple heat dissipation zones is the least and can be moved to other heat dissipation zones.

[0111] Here, in a case where it is determined based on the device installation information that high-power devices are installed in each of the heat dissipation zones, i.e., the third heat dissipation zone is not included in the plurality of heat dissipation zones, a fourth heat dissipation zone is determined from the plurality of heat dissipation zones, so as to convert the fourth heat dissipation zone into a heat dissipation zone without installing high-power devices by moving the high-power devices in the fourth heat dissipation zone, i.e., convert the fourth heat dissipation zone into a cold zone.

[0112] The fourth heat dissipation zone is a heat dissipation zone with the least number of installed high-power devices among the plurality of heat dissipation zones. In this way, a smaller number of devices can be moved to convert the fourth heat dissipation zone into a heat dissipation zone without installing high-power devices. At the same time, the high-power devices in the fourth heat dissipation zone can be moved to other heat dissipation zones, i.e., the heat dissipation zones other than the fourth heat dissipation zone include idle component installation positions that can be used to install the high-power devices. In this way, the high-power devices can continue to run in the electronic device, and the overall performance of the electronic device will not be affected.

[0113] For example, when the high-power device installed in the fourth heat dissipation zone is a CPU, the CPU can be moved to a component installation position in another heat dissipation zone where a CPU can be installed;

[0114] For another example, when the high-power device installed in the fourth heat dissipation zone is a GPU, an NVMe drive, or an OCP network card, the GPU, the NVMe drive, or the OCP network card can be moved to an integrated slot or an expansion slot in another heat dissipation zone where a GPU, an NVMe drive, or an OCP network card can be installed;

[0115] For another example, when the high-power device installed in the fourth heat dissipation zone is a plurality of memory modules, the plurality of memory modules can be moved to a slot in another heat dissipation zone where a plurality of memory modules can be installed. In addition, since the maximum power of a single memory module is relatively low, when the high-power device installed in the fourth heat dissipation zone is a plurality of memory modules, a part of the plurality of memory modules can also be determined from the plurality of memory modules according to the number of memory modules and the maximum power of each memory module, and the part of the memory modules can be moved to another heat dissipation zone, so that the total power of the remaining installed devices in the fourth heat dissipation zone after the movement is lower than the specified power threshold.

[0116] In this way, by moving the high-power devices in the fourth heat dissipation zone, the fourth heat dissipation zone becomes a heat dissipation zone with lower device power consumption, i.e., a cold zone, so that the fourth heat dissipation zone can be used as a second heat dissipation zone to determine the target recommendation position corresponding to the recommendation request from the second heat dissipation zone.

[0117] In some embodiments, the plurality of heat dissipation zones includes a fifth heat dissipation zone and a sixth heat dissipation zone; the fifth heat dissipation zone and the sixth heat dissipation zone have the same and least number of installed high-power devices.

[0118] Here, based on the device installation information, each heat dissipation zone of the electronic device is installed with a high-power device, and the number of high-power devices installed in the fifth and sixth heat dissipation zones is the same and the least. In this case, further analysis of the device installation information corresponding to the fifth and sixth heat dissipation zones is required to determine the heat dissipation zone that is more suitable for installing the first device, and to designate that heat dissipation zone as the fourth heat dissipation zone.

[0119] Thus, the method provided by the present application further includes at least one of the following steps S4213 to S4216:

[0120] Step S4213: In response to the fact that the high-power device installed in the fifth heat dissipation zone is a central processing unit, and that idle component installation positions capable of installing a central processing unit are provided in heat dissipation zones other than the fifth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone.

[0121] Here, when the high-power device installed in the fifth heat dissipation zone is a CPU and there are idle component installation positions that can be used to install the CPU in other heat dissipation zones, the fifth heat dissipation zone is used as the fourth heat dissipation zone, so that the fifth heat dissipation zone is converted into a cold zone without high-power devices installed by moving the installation position of the CPU, and then the target recommended position is determined in the fifth heat dissipation zone.

[0122] Compared to component mounting locations available for other devices, electronic devices have fewer component mounting locations available for CPUs. Therefore, it is possible to quickly determine whether there are vacant component mounting locations available for CPUs in other cooling zones, thereby quickly determining whether the CPU's mounting location can be moved. Therefore, in some embodiments, it is possible to prioritize determining whether the high-power device in the fifth and sixth cooling zones is a CPU and whether the CPU's mounting location can be moved, thereby quickly determining the fourth cooling zone and, in turn, increasing the speed of determining the target recommended location.

[0123] Step S4214: in response to the fact that the power of the high-power device installed in the fifth heat dissipation zone is greater than the power of the high-power device installed in the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone.

[0124] Here, when the maximum power of the high-power device installed in the fifth heat dissipation zone is greater than the maximum power of the high-power device installed in the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone, so that the fifth heat dissipation zone is converted into a cold zone where no high-power device is installed by moving the installation position of the high-power device in the fifth heat dissipation zone, and then the target recommended position is determined in the fifth heat dissipation zone.

[0125] For example, when the high-power device installed in the fifth heat dissipation zone is a GPU and the high-power device installed in the sixth heat dissipation zone is an NVMe drive, the fifth heat dissipation zone is used as the fourth heat dissipation zone because the maximum power of the GPU is usually higher than the maximum power of the NVMe drive.

[0126] Step S4215: In response to the fact that the distance between the third installation position in the fifth heat dissipation zone and the fan is greater than the distance between the fourth installation position in the sixth heat dissipation zone and the cooling fan, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle component installation positions where the first device can be installed.

[0127] Here, assuming the number of high-power devices in the fifth and sixth heat dissipation zones is the same and the number of high-power devices is the smallest relative to the other heat dissipation zones, further analysis is conducted on the distances from the corresponding cooling fans of the third and fourth mounting locations, which can be used to mount the first device, in the fifth and sixth heat dissipation zones. Because the distance from the corresponding cooling fan to the third mounting location is greater than the distance from the fourth mounting location, the vibration intensity at the third mounting location is less than that at the fourth mounting location. Therefore, if the first device is mounted in the third mounting location, the performance of the first device will be less affected by the cooling fan. Therefore, the fifth heat dissipation zone corresponding to the third mounting location is designated as the fourth heat dissipation zone.

[0128] Step S4216, in response to the third installation position in the fifth heat dissipation zone being between the air inlet and the cooling fan of the fifth heat dissipation zone, and the fourth installation position in the sixth heat dissipation zone being between the air outlet and the cooling fan of the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle installation positions where the first device can be installed.

[0129] Within the same heat dissipation zone, the gas temperature between the cooling fan and the air inlet is lower than the gas temperature between the cooling fan and the air outlet. Therefore, when the third installation position in the fifth heat dissipation zone is between the air inlet and the cooling fan of the fifth heat dissipation zone, and the fourth installation position in the sixth heat dissipation zone is between the air outlet and the cooling fan of the sixth heat dissipation zone, the temperature at the third installation position will be lower than the temperature at the fourth installation position. In this way, compared to installing the first device at the fourth installation position, installing the first device at the third installation position can lower the ambient temperature of the first device, thereby improving the stability of the first device during operation. Therefore, the fifth heat dissipation zone corresponding to the third installation position is used as the fourth heat dissipation zone.

[0130] In some embodiments, the step S422 of determining the target recommended position from the at least one second installation position in the at least one second heat dissipation zone can be implemented as the following steps S4221-S4222:

[0131] In the step S4221, the priority of each second installation position is determined based on the position information of each second installation position relative to the corresponding heat dissipation fan.

[0132] Here, after determining the at least one second heat dissipation zone, at least one second installation position for installing the first device in the at least one second heat dissipation zone is determined; and the priority of each second installation position is determined based on the position information of each second installation position relative to the corresponding heat dissipation fan.

[0133] In some embodiments, the position information of the second installation position relative to the corresponding heat dissipation fan includes the distance between the second installation position and the corresponding heat dissipation fan. The greater the distance between the second installation position and the corresponding heat dissipation fan, the smaller the corresponding vibration intensity. Therefore, the distance between the second installation position and the corresponding heat dissipation fan is inversely proportional to the priority of the second installation position, i.e., the greater the distance between the second installation position and the corresponding heat dissipation fan, the smaller the priority.

[0134] In some embodiments, the position information of the second installation position relative to the corresponding heat dissipation fan includes the distance between the second installation position and the corresponding heat dissipation fan and the air inlet. Here, when the second installation position is between the corresponding heat dissipation fan and the air inlet, the smaller the distance between the second installation position and the air inlet, the lower the corresponding ambient temperature. Therefore, when the at least one second installation position is between the corresponding heat dissipation fan and the air inlet, the distance between the second installation position and the corresponding air inlet is inversely proportional to the priority of the second installation position, i.e., the smaller the distance between the second installation position and the corresponding air inlet, the greater the priority.

[0135] In some embodiments, the method provided by the present application further includes determining the priority of the corresponding second installation position based on the operating power information of the heat dissipation fan in each second heat dissipation zone; and the device installation information includes the operating power information of the heat dissipation fan installed in each heat dissipation zone.

[0136] Here, the device installation information includes the operating power information of the heat dissipation fan installed in each heat dissipation zone. In some embodiments, the operating power information of the heat dissipation fan can include the maximum operating power of the heat dissipation fan, and can also include the average operating power of the heat dissipation fan within a specified time period.

[0137] The greater the operating power of the cooling fan, the greater the vibration intensity generated. Therefore, when determining the priority of the corresponding second installation location based on the operating power information of the cooling fans in each second cooling zone, the priority of the second installation location is inversely proportional to the operating power of the corresponding cooling fan. That is, the greater the operating power of the cooling fan corresponding to the second installation location, the lower the corresponding priority.

[0138] Step S4222: Determine the target recommended location from the at least one second installation location based on the priority.

[0139] Here, after determining the priority of each second installation location, the target recommended location corresponding to the recommendation request is determined based on the priority. In implementation, the second installation location with the highest priority is used as the target recommended location.

[0140] In the above-mentioned embodiment provided in the present application, when there are a large number of second installation positions available for installing the first device, the target recommended position is determined based on the position information of each second installation position relative to the cooling fan, so as to reduce the impact of the cooling fan on the device performance of the first device and improve the operating stability of the first device.

[0141] In some embodiments, the method provided herein further includes the following steps S45 to S46:

[0142] Step S45 : In response to the user installing a second device on the electronic device, obtaining the installation location and attribute information of the second device; wherein the attribute information at least includes power information of the second device.

[0143] Here, the second device can be any device that can be connected to the electronic device through a component installation location on the electronic device. In some embodiments, the second device can be a CPU, GPU, NVMe drive, OCP network card or memory module, etc.

[0144] The installation location information of the second device, that is, the installation location of the component corresponding to the second device.

[0145] In some embodiments, the attribute information of the second device may include maximum power information or maximum frequency information of the second device. In some embodiments, when the second device is a cooling fan, the attribute information of the second device also includes maximum speed information of the cooling fan.

[0146] In some embodiments, the installation location and attribute information of the second device can be obtained through any suitable means. In some embodiments, the installation location and attribute information of the second device can be obtained through a storage controller, which can be a SATA controller, an NVMe controller, etc. In some embodiments, the installation location and attribute information of the second device can be obtained through IPMI.

[0147] Step S46: Update the device installation information based on the installation location and attribute information of the second device.

[0148] Here, after the installation location and attribute information of the second device are obtained, the obtained information is updated to the device installation information of the electronic device, so that the device installation location can be recommended to the user based on the updated device installation information.

[0149] In the above embodiments provided in the present application, by updating the device installation information in real time, the device installation information can accurately reflect the hardware configuration of the electronic device, thereby better assisting in executing the device installation location recommendation function.

[0150] Next, combine Figure 6 , an embodiment provided by the present application is described, wherein the electronic device is a server, the component used to execute the method provided by the present application is a BMC, and the device installation information of the server is stored in the BMC.

[0151] like Figure 6 As shown, this embodiment includes the following steps S61 to S69:

[0152] Step S61: In response to the user installing the HDD in the seventh installation position, the BMC checks the device installation information of the seventh heat dissipation zone corresponding to the seventh installation position; thereafter, step S62 is executed;

[0153] Here, the HDD is a large-capacity HDD, for example, a 20T or higher capacity HDD.

[0154] Step S62, determining whether the seventh heat dissipation zone is equipped with a high-power device; if not, executing step S63; if so, executing step S64;

[0155] Here, the BMC determines whether the seventh cooling zone is installed with a high-power device based on the device installation information corresponding to the seventh cooling zone, for example, whether the seventh cooling zone is installed with a CPU, GPU, NVMe drive, OCP network card, or multiple memory modules.

[0156] Step S63, confirming that the current installation location is feasible;

[0157] In the case that no high-power device is installed in the seventh heat dissipation zone, it is confirmed that the seventh heat dissipation zone is suitable for installing a HDD.

[0158] Step S64, obtaining the device installation information corresponding to other heat dissipation zones; then, executing step S65;

[0159] Here, the BMC obtains device installation information corresponding to the heat dissipation zones other than the seventh heat dissipation zone.

[0160] Step S65, determining whether there is a heat dissipation zone where no high-power equipment is installed; if so, executing step S66; if not, executing step S67;

[0161] Step S66, suggesting that the user install the HDD in a heat dissipation area where no high-power devices are installed;

[0162] Step S67, determining whether there is an eighth heat dissipation zone for the mobile high-power device; if not, executing step S68; if so, executing step S69;

[0163] Here, the eighth heat dissipation zone refers to a zone where high-power devices can be moved to other heat dissipation zones, and includes component installation locations that can be used to install HDDs.

[0164] Step S68 , reminding the user that when the HDD workload is high, it may not be able to operate at high throughput;

[0165] If there is no eighth heat dissipation zone that meets the conditions, a prompt message is sent to the user to remind the user that the HDD may not be able to operate at a high throughput when the workload is high.

[0166] Step S69 : The user is advised to move the high-power device in the eighth heat dissipation zone and install the HDD in the eighth heat dissipation zone.

[0167] If there is an eighth heat dissipation zone that meets the conditions, a prompt message is sent to the user to prompt the user to move the designated high-power device in the eighth heat dissipation zone to the corresponding heat dissipation zone, and the user is instructed on the specific location to install the HDD.

[0168] Since the middle part of the server is greatly affected by the vibration of the cooling fan, it is generally recommended that the user install the HDD on the end face corresponding to the air inlet end of the server (for example, in the case of the server 500, the rear end is the air inlet end, it is recommended to install the HDD on the rear end face of the server 500); if there is no slot for installing the HDD on the end face corresponding to the air inlet end of the server, or the cooling area where the HDD slot is configured is plugged with other components, the HDD can be installed on the end face corresponding to the air outlet end of the server (for example, in the case of the server 500, the front end is the air outlet end, it is recommended to install the HDD in the slot on the front end face of the server 500).

[0169] Based on the foregoing embodiments, the present application provides a device installation position recommendation device, which comprises the units included therein and the modules included in the units, and can be implemented by a processor in a computer device; of course, it can also be implemented by a specific logic circuit; in the implementation process, the processor can be a CPU, a microprocessor (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA), etc.

[0170] Figure 7 The composition structure diagram of the device installation position recommendation device provided by the present application is shown in FIG. 7, which comprises a first determination module 710 and a second determination module 720. Figure 7 The device installation position recommendation device 700 comprises a first determination module 710 and a second determination module 720, wherein:

[0171] The first determination module 710 determines the device installation information corresponding to a plurality of cooling areas of an electronic device in response to an installation position recommendation request; the cooling area represents an area determined after dividing a plurality of component installation positions of the electronic device; each cooling area is installed with a cooling fan; the recommendation request is used to request to recommend a component installation position of a first device; the first device represents a vibration-sensitive device;

[0172] The second determination module 720 determines a target recommendation position corresponding to the recommendation request from a plurality of component installation positions in the plurality of cooling areas based on the device installation information.

[0173] In some embodiments, the device 700 further comprises a third determination module; the third determination module is used to perform at least one of the following:

[0174] In response to the user mounting the first device on the electronic device, a first mounting position of the first device is acquired; in response to a high-power device being mounted in a first heat dissipation area in which the first mounting position is located, the recommendation request is generated;

[0175] In response to user input information received through a specified application, the recommendation request is generated.

[0176] In some embodiments, the first determining module 710 is configured to:

[0177] Based on the device mounting information, at least one second heat dissipation area is determined from the plurality of heat dissipation areas; the second heat dissipation area represents a heat dissipation area in which no high-power device is mounted;

[0178] The target recommendation position is determined from at least one second mounting position in the at least one second heat dissipation area.

[0179] In some embodiments, the first determining module 710 is configured to:

[0180] In response to the device mounting information representing that the plurality of heat dissipation areas includes at least one third heat dissipation area, the at least one third heat dissipation area is taken as the at least one second heat dissipation area; the third heat dissipation area represents a heat dissipation area in which no high-power device is mounted;

[0181] In response to the device mounting information representing that each of the plurality of heat dissipation areas is mounted with a high-power device, it is determined that a high-power device mounted in a fourth heat dissipation area of the plurality of heat dissipation areas is moved to other heat dissipation areas, and the fourth heat dissipation area after the moving is taken as the second heat dissipation area; the fourth heat dissipation area represents a heat dissipation area in which the number of high-power devices mounted is the least and the high-power device can be moved to other heat dissipation areas.

[0182] In some embodiments, the plurality of heat dissipation areas includes a fifth heat dissipation area and a sixth heat dissipation area; the fifth heat dissipation area and the sixth heat dissipation area have the same and the least number of high-power devices mounted;

[0183] The first determining module 710 is further configured to perform at least one of the following:

[0184] In response to the high-power device mounted in the fifth heat dissipation area being a central processing unit, and an idle component mounting position capable of mounting a central processing unit being arranged in a heat dissipation area other than the fifth heat dissipation area, the fifth heat dissipation area is taken as the fourth heat dissipation area;

[0185] In response to the power of the high-power device mounted in the fifth heat dissipation area being greater than the power of the high-power device mounted in the sixth heat dissipation area, the fifth heat dissipation area is taken as the fourth heat dissipation area;

[0186] In response to the distance between the third installation position in the fifth heat dissipation zone and the fan being greater than the distance between the fourth installation position in the sixth heat dissipation zone and the heat dissipation fan, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle component installation positions where the first device can be installed;

[0187] In response to the third installation position in the fifth heat dissipation zone being between the air inlet and the heat dissipation fan of the fifth heat dissipation zone, and the fourth installation position in the sixth heat dissipation zone being between the air outlet and the heat dissipation fan of the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle installation positions where the first device can be installed.

[0188] In some implementations, the second determining module 720 is configured to:

[0189] determining a priority of each second installation position based on position information of each second installation position relative to a corresponding heat dissipation fan;

[0190] The target recommended location is determined from the at least one second installation location based on the priority.

[0191] In some embodiments, the location information includes at least one of the following:

[0192] The distance between the second installation position and the corresponding cooling fan;

[0193] The second installation position is relative to the distance between the corresponding cooling fan and the air inlet.

[0194] In some embodiments, the second determination module 720 is used to determine the priority of the corresponding second installation location based on the operating power information of the cooling fan in each second cooling zone; the device installation information includes the operating power information of the cooling fan installed in each cooling zone.

[0195] In some embodiments, the apparatus 700 further includes an update module; the update module is configured to:

[0196] In response to a user installing a second device on the electronic device, obtaining an installation location and attribute information of the second device; wherein the attribute information includes at least power information of the second device;

[0197] The device installation information is updated based on the installation location and attribute information of the second device.

[0198] On the other hand, the present application also provides an electronic device. Figure 8As shown, the electronic device 800 includes a memory 810 and a processor 820; wherein,

[0199] The memory 810 stores a computer program that can be run on the processor 820;

[0200] The processor 820 is configured to execute the computer program to:

[0201] In response to the installation location recommendation request, device installation information corresponding to multiple heat dissipation zones of the electronic device 800 is determined; the heat dissipation zones represent areas determined after dividing the installation locations of multiple components of the electronic device; a cooling fan is installed in each of the heat dissipation zones; the recommendation request represents a request to recommend a location for installing a first device; the first device represents a vibration-sensitive device;

[0202] Based on the device installation information, a target recommended position corresponding to the recommendation request is determined from a plurality of component installation positions in the plurality of heat dissipation areas.

[0203] It should be noted that the description of the above device embodiments and electronic device embodiments is similar to the description of the above method embodiments and has similar beneficial effects as the method embodiments. In some embodiments, the functions, units, or modules included in the devices and electronic devices provided in the embodiments of the present application can be used to perform the methods described in the above method embodiments. For technical details not disclosed in the device embodiments of the present application, please refer to the description of the method embodiments of the present application for understanding.

[0204] In the embodiment of the present application, if the recommended method for the above-mentioned device installation position is implemented in the form of a software function module and is sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for making a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a magnetic disk or an optical disk. In this way, the embodiment of the present application is not limited to any specific hardware, software or firmware, or any combination of hardware, software and firmware.

[0205] An embodiment of the present application provides a computer device, including a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the processor executes the program, some or all of the steps in the above method are implemented.

[0206] The present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements some or all of the steps in the above method. The computer-readable storage medium may be transient or non-transient.

[0207] An embodiment of the present application provides a computer program, including computer-readable code. When the computer-readable code is run in a computer device, a processor in the computer device executes some or all of the steps for implementing the above method.

[0208] An embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and when the computer program is read and executed by a computer, implements some or all of the steps in the above method. The computer program product can be implemented specifically by hardware, software, or a combination thereof. In some embodiments, the computer program product is embodied as a computer storage medium. In other embodiments, the computer program product is embodied as a software product, such as a software development kit (SDK), etc.

[0209] It should be noted that the descriptions of the various embodiments above tend to emphasize the differences between the various embodiments, and their similarities or similarities can be referenced to each other. The descriptions of the above device, storage medium, computer program, and computer program product embodiments are similar to the descriptions of the above method embodiments and have similar beneficial effects as the method embodiments. For technical details not disclosed in the embodiments of the device, storage medium, computer program, and computer program product of this application, please refer to the description of the method embodiments of this application for understanding.

[0210] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned steps / processes does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.

[0211] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0212] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0213] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed across multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the scheme of this embodiment.

[0214] In addition, all functional units in the embodiments of the present application can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the above-mentioned integrated units can be implemented in the form of hardware or in the form of hardware plus software functional units.

[0215] Those skilled in the art will understand that all or part of the steps of implementing the above-mentioned method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above-mentioned method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, and other media that can store program codes.

[0216] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the relevant technology, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks, or optical disks.

[0217] The above is only an implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the scope of protection of the present application.

Claims

1. A method for recommending a device installation location, comprising: In response to the installation location recommendation request, determining device installation information corresponding to a plurality of heat dissipation zones of the electronic device; The heat dissipation zone represents an area determined by dividing the installation positions of multiple components of the electronic device; a heat dissipation fan is installed in each heat dissipation zone; the recommendation request is used to request a recommendation for a component installation position for installing a first device; the first device represents a vibration-sensitive device; Based on the device installation information, a target recommended position corresponding to the recommendation request is determined from a plurality of component installation positions in the plurality of heat dissipation zones.

2. The method according to claim 1, wherein before determining the device installation information corresponding to the plurality of heat dissipation zones of the electronic device in response to the installation location recommendation request, the method further comprises at least one of the following: In response to a user installing the first device on the electronic device, obtaining a first installation location of the first device; and in response to a high-power device being installed in a first heat dissipation zone where the first installation location is located, generating the recommendation request; The recommendation request is generated in response to user input information received through a designated application.

3. The method according to claim 1 or 2, wherein determining, based on the device installation information, the target recommended location corresponding to the recommendation request from a plurality of component installation locations in the plurality of heat dissipation areas comprises: determining at least one second heat dissipation zone from the plurality of heat dissipation areas based on the device installation information; The second heat dissipation zone represents the heat dissipation zone where no high-power equipment is installed; The target recommended position is determined from at least one second installation position in the at least one second heat dissipation area.

4. The method according to claim 3, wherein determining at least one second heat dissipation zone from the plurality of heat dissipation areas based on the device installation information comprises: In response to the device installation information indicating that the plurality of heat dissipation zones include at least one third heat dissipation zone, the at least one third heat dissipation zone is used as the at least one second heat dissipation zone; wherein the third heat dissipation zone represents a heat dissipation zone where no high-power device is installed; In response to the device installation information indicating that each of the multiple heat dissipation zones is installed with high-power devices, it is determined that the high-power devices installed in the fourth heat dissipation zone among the multiple heat dissipation zones are moved to other heat dissipation zones, and the fourth heat dissipation zone after the move is used as the second heat dissipation zone; the fourth heat dissipation zone indicates that the number of high-power devices installed in the multiple heat dissipation zones is the least and that the heat dissipation zone can be moved to other heat dissipation zones.

5. The method according to claim 4, wherein the plurality of heat dissipation zones include a fifth heat dissipation zone and a sixth heat dissipation zone; the number of high-power devices installed in the fifth heat dissipation zone and the sixth heat dissipation zone is the same and the least; The method further comprises at least one of the following: In response to the high-power device installed in the fifth heat dissipation zone being a central processing unit, and idle component installation positions capable of installing the central processing unit being provided in heat dissipation zones other than the fifth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone; In response to the fact that the power of the high-power device installed in the fifth heat dissipation zone is greater than the power of the high-power device installed in the sixth heat dissipation zone, using the fifth heat dissipation zone as the fourth heat dissipation zone; In response to the distance between the third installation position in the fifth heat dissipation zone and the fan being greater than the distance between the fourth installation position in the sixth heat dissipation zone and the heat dissipation fan, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle component installation positions where the first device can be installed; In response to the third installation position in the fifth heat dissipation zone being between the air inlet and the heat dissipation fan of the fifth heat dissipation zone, and the fourth installation position in the sixth heat dissipation zone being between the air outlet and the heat dissipation fan of the sixth heat dissipation zone, the fifth heat dissipation zone is used as the fourth heat dissipation zone; the third installation position and the fourth installation position both represent idle installation positions where the first device can be installed.

6. The method according to claim 3, wherein determining the target recommended position from at least one second installation position in the at least one second heat dissipation zone comprises: determining a priority of each second installation position based on position information of each second installation position relative to a corresponding heat dissipation fan; The target recommended location is determined from the at least one second installation location based on the priority.

7. The method according to claim 6, wherein the location information comprises at least one of the following: The distance between the second installation position and the corresponding cooling fan; The second installation position is relative to the distance between the corresponding cooling fan and the air inlet.

8. The method according to claim 6, further comprising: Based on the operating power information of the cooling fans in each second cooling zone, the priority of the corresponding second installation position is determined; the equipment installation information includes the operating power information of the cooling fans installed in each cooling zone.

9. The method according to any one of claims 1, further comprising: In response to a user installing a second device on the electronic device, obtaining an installation location and attribute information of the second device; wherein the attribute information includes at least power information of the second device; The device installation information is updated based on the installation location and attribute information of the second device.

10. An electronic device comprising a memory and a processor; wherein: The memory stores a computer program executable on the processor; The processor is configured to execute the computer program to: In response to an installation location recommendation request, determining device installation information corresponding to a plurality of heat dissipation zones of an electronic device; the heat dissipation zones representing regions determined after dividing a plurality of component installation locations of the electronic device; a heat dissipation fan being installed in each of the heat dissipation zones; the recommendation request being used to request a recommendation of a component installation location for installing a first device; The first device represents a vibration-sensitive device; Based on the device installation information, a target recommended position corresponding to the recommendation request is determined from a plurality of component installation positions in the plurality of heat dissipation areas.

Images