Vibration device, VCP hole filling production line and control method

Abstract

The invention discloses a vibration device, a VCP hole filling production line and a control method. The driving assembly is installed on the supporting framework and comprises a driving air cylinder and a lifting rod, the driving air cylinder is connected with the lifting rod and drives the lifting rod to do linear reciprocating motion in the vertical direction, the hanging frame is used for installing a circuit board, the hanging frame is provided with a transmission rod, and the transmission rod can move to the position above the lifting rod; when the driving cylinder moves upwards, the lifting rod can push the transmission rod to drive the circuit board to vibrate so as to remove blind hole bubbles of the circuit board; the buffering assembly is installed on the supporting framework, located at the downward movement path of the lifting rod and used for buffering the lifting rod. A direct mechanical vibration transmission mode is adopted to transmit vibration energy to a blind hole area of the circuit board more efficiently, and the removal effect of bubbles in the blind hole is improved; the buffer assembly effectively absorbs impact force generated when the lifting rod moves downwards, and the stability and reliability of long-term operation of the device are guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board manufacturing, in particular to a vibration device, a VCP hole filling production line with the vibration device, and a control method applied to the VCP hole filling production line. BACKGROUND

[0002] In the field of printed circuit board (PCB) manufacturing, especially in the hole filling process of high-density interconnection (HDI) boards and multi-layer boards, bubble residue in blind holes and poor liquid wetting are long-standing technical problems.

[0003] Traditional PCB processing devices usually use the method of water impact in the tank to generate vibration, and the impact force of the liquid flow is applied to the board to achieve bubble removal and liquid exchange. However, this technical path has significant limitations: on the one hand, the vibration energy generated by the water impact needs to be indirectly transmitted to the PCB through the liquid, which has large energy loss and low transmission efficiency, making it difficult for the vibration to effectively act on the inside of the blind hole, especially for small blind holes with large depth-diameter ratio, and the bubble residue problem is prominent; on the other hand, the traditional vibration amplitude is limited by the liquid flow intensity, and it is difficult to directly expand the vibration range through physical means, resulting in insufficient flow speed of the liquid in the blind hole and poor wetting effect, which further affects the hole filling quality and electrical performance. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application proposes a vibration device that directly and efficiently removes bubbles in blind holes by driving the cylinder to rigidly push the hanger to vibrate the circuit board, and can accelerate the flow of liquid to wet the hole wall, which is suitable for VCP production line, significantly improves the hole filling quality and efficiency, and solves the problems of bubble residue and poor wetting in traditional process.

[0005] The present application also proposes a VCP hole filling production line with the above-mentioned vibration device and a control method applied to the VCP hole filling production line.

[0006] According to the vibration device of the present application, it comprises: a support framework; a drive assembly installed on the support framework, the drive assembly comprising a drive cylinder and a lifting rod, the drive cylinder being connected to and driving the lifting rod to perform linear reciprocating motion in the vertical direction, a hanger for mounting a circuit board, the hanger being provided with a transmission rod, the transmission rod being capable of moving above the lifting rod; when the drive cylinder moves upward, the lifting rod can push the transmission rod to drive the circuit board to vibrate to remove bubbles in the blind holes of the circuit board; A buffer assembly is mounted to the support frame and located at the downward movement path of the lifting rod and used for buffering the lifting rod.

[0007] According to the vibration device, at least the following beneficial effects are achieved: the lifting rod is connected to the driving cylinder and driven to perform linear reciprocating movement in the vertical direction, the transmission rod of the hanging rack is pushed when the lifting rod moves upward, and the circuit board mounted on the hanging rack is vibrated up and down, the direct mechanical vibration transmission mode avoids the energy loss problem of the traditional liquid impact indirect transmission, can more efficiently transmit vibration energy to the circuit board, especially the blind hole area, and significantly improves the bubble removal effect in the blind hole; in addition, the buffer assembly is mounted to the support frame and located at the downward movement path of the lifting rod, which can effectively absorb the impact force when the lifting rod moves downward, avoid structural damage of the device due to high-frequency impact vibration of the driving cylinder, ensure the stability and reliability of long-term operation of the device, and solve the technical problems of low vibration transmission efficiency, poor blind hole processing effect and easy damage of the traditional vibration device.

[0008] According to the vibration device, the hanging rack is provided with a mounting rod and a connecting ear, the mounting rod is fixedly connected with the transmission rod, and the circuit board is mounted on the connecting ear.

[0009] According to the vibration device, the connecting ear has a plurality of linearly spaced connecting ears arranged on the mounting rod, and the plurality of elastic springs are connected with the connecting ears one by one.

[0010] According to the vibration device, one end of the elastic spring is fixedly connected with the mounting rod, and the other end is fixedly connected with the connecting ear.

[0011] According to the vibration device, the circuit board is vertically mounted on the hanging rack.

[0012] According to the vibration device, the buffer assembly has two buffer assemblies symmetrically arranged on both sides of the driving cylinder, and the two buffer assemblies are respectively in abutting cooperation with the surfaces on both sides of the lifting rod.

[0013] According to the vibration device, the buffer assembly includes a mounting cylinder, a spring rod and a buffer pad, the spring rod is elastically mounted in the mounting cylinder, and the buffer pad is mounted on the top of the spring rod.

[0014] The vibration device according to some embodiments of the present application further comprises a detection sensor for detecting the in-place condition of the hanger, and the detection sensor controls the upward movement of the driving cylinder after detecting that the hanger is in place.

[0015] The VCP hole filling production line according to the present application comprises the vibration device according to the present application.

[0016] The VCP hole filling production line according to the present application has at least the following beneficial effects: by integrating the optimized vibration device into the vertical continuous electroplating production line, the circuit board can be directly subjected to efficient vibration treatment in the plating cylinder, the upward and downward vibration driven by the driving cylinder accelerates the flow and exchange of the chemical solution in the blind hole, solves the technical bottleneck of insufficient chemical solution wetting and bubble residue in the traditional VCP production line, significantly improves the hole filling yield and production efficiency, and the modular vibration device design is compatible with the existing production line, so that the technical upgrade can be realized without substantial modification of the equipment.

[0017] The control method according to the present application is applied to the VCP hole filling production line according to the present application.

[0018] The control method according to the present application has at least the following beneficial effects: the process optimization is realized through the synergistic process of 'pretreatment vibration -> accelerated flushing -> hole filling processing', the driving cylinder pushes the hanger to make the circuit board vibrate at a high frequency in the pretreatment stage, directly removes the bubbles in the blind hole and creates conditions for subsequent chemical solution exchange; the flow rate of the chemical solution after vibration is increased in the accelerated flushing stage, further strengthening the penetration and wetting effect of the chemical solution in the blind hole; the electroplating filling is carried out under the optimized hole wall state in the hole filling processing stage, which can significantly reduce the hole cavity and improve the hole filling uniformity, thereby improving the electrical performance and reliability of the PCB board as a whole, and meeting the high-standard manufacturing requirements of high-density interconnection boards.

[0019] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which: Figure 1 It is a structural schematic diagram of a vibration device according to some embodiments of the present application; Figure 2 It is a flowchart of a control method of a VCP hole filling production line applied to a vibration device according to some embodiments of the present application.

[0021] Explanation of reference numerals: Supporting framework 100; drive assembly 200; drive cylinder 210; lifting rod 220; hanger 300; transmission rod 310; mounting rod 320; connecting lug 330; extension spring 340; circuit board 400; cushion assembly 500; mounting cylinder 510; spring rod 520; cushion pad 530. DETAILED DESCRIPTION

[0022] Embodiments of the present application are described in detail below with reference to the attached drawings. The embodiments described below are examples of the present application and are not intended to limit the present application. The same or similar components are denoted by the same or similar reference numerals throughout the drawings.

[0023] In the description of the present application, if the orientation description such as up, down, front, back, left, right, etc. is described, the orientation or positional relationship based on the orientation or positional relationship shown in the drawings is described for the convenience of describing the present application and simplifying the description, and it is not intended to indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore it cannot be understood as a limitation of the present application.

[0024] In the description of the present application, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If the first, second, etc. are described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0025] In the description of the present application, unless otherwise explicitly limited, the words such as setting, mounting, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0026] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0027] In the field of printed circuit board (PCB) manufacturing, especially in the hole filling process of high-density interconnect (HDI) boards and multi-layer boards, residual bubbles in blind holes and poor wetting of chemical solutions are long-standing technical problems.

[0028] Traditional PCB processing devices typically use liquid medicine impact within a tank to generate vibrations, applying impact force to the board through the flow of the liquid medicine to remove bubbles and exchange the liquid medicine. However, this technical approach has significant limitations: First, the vibration energy generated by the liquid medicine impact must be indirectly transmitted to the PCB board through the liquid medicine, resulting in high energy loss and low transmission efficiency. This makes it difficult for the vibration to effectively act on the interior of the blind hole, especially in small blind holes with large aspect ratios, where residual bubbles are a prominent problem. Second, the amplitude of traditional vibrations is limited by the flow intensity of the liquid medicine, making it difficult to directly expand the vibration range through physical means. This results in insufficient liquid medicine flow velocity within the blind hole, poor wetting effect, and further affects the hole filling quality and electrical performance.

[0029] For this reason, Figure 1 As shown, a vibration device proposed by the present invention includes a support frame 100, a driving assembly 200 installed on the support frame 100, a buffer assembly 500 installed on the support frame 100, and a hanger 300 for mounting a circuit board 400, wherein the driving assembly 200 includes a driving cylinder 210 and a lifting rod 220, and the driving cylinder 210 is connected to and drives the lifting rod 220 to perform linear reciprocating motion in the vertical direction. Matchingly, the hanger 300 is provided with a transmission rod 310, which can move to the top of the lifting rod 220. In use, when the driving cylinder 210 moves upward, the lifting rod 220 can push the transmission rod 310, causing the circuit board 400 to vibrate, so as to remove bubbles in the blind holes of the circuit board 400. Furthermore, the buffer assembly 500 is located at the downward movement path of the lifting rod 220 and is used to buffer the lifting rod 220. It should be noted that by driving the cylinder 210 to connect the lifting rod 220 and drive it to perform linear reciprocating motion in the vertical direction, when the lifting rod 220 moves upward, it can push the transmission rod 310 of the bracket 300, so that the circuit board 400 installed on the bracket 300 vibrates up and down. This direct mechanical vibration transmission method avoids the energy loss problem of traditional liquid impact indirect transmission, and can more efficiently transmit vibration energy to the circuit board 400, especially the blind hole area, and significantly improve the effect of clearing bubbles in the blind hole; in addition, the buffer component 500 is installed on the support frame 100 and is located at the downward movement path of the lifting rod 220. It can effectively absorb the impact force of the lifting rod 220 when it moves downward, avoiding structural damage to the device due to high-frequency impact vibration of the driving cylinder 210, ensuring the long-term stability and reliability of the device, thereby solving the technical problems of low vibration transmission efficiency, poor blind hole processing effect and easy wear of the device in traditional vibration devices.

[0030] ReferenceFigure 1 In some embodiments of the present application, the hanger 300 is provided with a mounting rod 320 fixedly connected with the transmission rod 310, and connecting ears 330 on which the circuit board 400 is mounted, and the connecting ears 330 are connected with the mounting rod 320 through the elastic springs 340, so that when the transmission rod 310 is pushed by the lifting rod 220, the elastic springs 340 have a certain elastic buffering effect, on the one hand, the rigid collision between the transmission rod 310 and the lifting rod 220 can be avoided to cause stress concentration or component damage, on the other hand, the elastic deformation capacity of the elastic springs 340 can adapt to the vibration requirements of different frequencies and amplitudes, and the reliability of vibration transmission to the connecting ears 330 is improved, under a certain frequency vibration, the elastic springs 340 can amplify the vibration amplitude of the circuit board 400, and then the blind hole bubble removal effect of the circuit board 400 mounted on the connecting ears 330 is further optimized and the service life of the hanger 300 assembly is prolonged. Specifically, the connecting ears 330 are multiple, and the multiple connecting ears 330 are linearly arranged on the mounting rod 320, and the elastic springs 340 are multiple, and the elastic springs 340 are connected with the connecting ears 330 one by one. The distributed design of multiple connecting ears 330 and multiple elastic springs 340 can disperse the force generated when the transmission rod 310 is pushed by the lifting rod 220 to multiple stress points, avoid structural deformation or failure caused by excessive local stress, improve the stability of the overall structure of the hanger 300, and the uniformly distributed elastic springs 340 can ensure that the force of each part of the transmission rod 310 is balanced, so that the vibration of the circuit board 400 is more stable and consistent, thereby further improving the uniformity of bubble removal in the blind hole and the sufficiency of liquid exchange. Optionally, in some embodiments of the present application, one end of the elastic spring 340 is fixedly welded with the mounting rod 320, and the other end is fixedly welded with the connecting ear 330. It can be understood that the welding fixing mode can ensure that the connection strength between the elastic spring 340, the mounting rod 320 and the connecting ear 330 is high and not easy to loosen for long-term use, avoiding the problem of falling off or connection failure of the elastic spring 340 due to vibration, improving the reliability and durability of the structure of the hanger 300, and ensuring the stability of the vibration device in high-frequency reciprocating motion, thereby continuously and effectively realizing the functions of blind hole bubble removal and liquid wetting. Referring again to Figure 1 In some embodiments of the present application, the circuit board 400 is vertically mounted on the connecting ear 330. It should be noted that in the VCP hole filling production, the circuit board 400 is vertically immersed in the plating solution, and for some thin circuit boards 400, the vertical vibration mode can avoid the impact of water flow on the board surface, reducing the risk of bending deformation of the circuit board 400. At this time, the vertical mounting mode makes the blind hole diameter of the circuit board 400 consistent with the vibration direction, and the vibration energy can be directly transmitted along the radial direction of the blind hole, better piercing the blind hole bubble, and making the blind hole bubble better discharged, effectively improving the wetting degree of the blind hole under reducing the impact of the plating solution on the board surface.

[0031] Referring back to Figure 1 In some embodiments of the present application, two buffer assemblies 500 are symmetrically arranged on both sides of the driving cylinder 210, and each buffer assembly 500 can abut the surface on both sides of the lifting rod 220. In this regard, the symmetrically arranged buffer assemblies 500 can balance the lateral force generated when the lifting rod 220 moves downward, avoid uneven stress and device deviation caused by unilateral buffering, ensure that the lifting rod 220 always maintains a stable vertical motion trajectory during reciprocating motion, thereby improving the accuracy and reliability of vibration transmission, further optimizing the blind hole bubble removal effect and reducing device mechanical loss. Specifically, the buffer assembly 500 includes a mounting cylinder 510, a spring rod 520, and a buffer pad 530. The spring rod 520 is elastically mounted in the mounting cylinder 510, and the buffer pad 530 is mounted on the top of the spring rod 520. In application, when the lifting rod 220 moves downward, the buffer pad 530 first contacts the surface of the lifting rod 220 and absorbs impact energy through the elastic deformation of the spring rod 520. The buffer pad 530 can reduce direct collision and wear between metal parts, and the elastic properties of the spring rod 520 can adapt to the impact force absorption requirements under different vibration amplitudes, avoiding device vibration or noise problems caused by rigid impact, thereby prolonging the service life of the buffer assembly 500 and improving the smoothness of device operation.

[0032] In addition, in some embodiments of the present application, the vibration device further comprises a detection sensor for detecting the in-place condition of the hanger 300 and communicating to control the upward movement of the driving cylinder 210 after detecting that the hanger 300 is in place. Through the linkage control of the sensor and the cylinder, precise timing management of the vibration process can be achieved, avoiding vibration failure or energy waste caused by incorrect placement of the hanger 300. At the same time, the automatic control mode improves the operation convenience and consistency of the device, ensuring that each vibration treatment can be started at the best position, thereby stably achieving the blind hole bubble removal and liquid wetting effect.

[0033] The VCP hole filling production line according to the embodiment of the present application comprises a vibration device according to the embodiment of the present application. By integrating the optimized vibration device into the vertical continuous electroplating production line, the circuit board 400 can be efficiently vibrated in the plating cylinder, and the upward and downward vibration driven by the driving cylinder 210 can accelerate the flow and exchange of the liquid in the blind hole, solving the technical bottleneck of insufficient liquid wetting and bubble residue in the traditional VCP production line, significantly improving the hole filling yield and production efficiency, and the modular vibration device design can be compatible with the existing production line without the need for substantial equipment modification to realize technical upgrading.

[0034] Other configurations and operations of the VCP hole filling production line according to the embodiment of the present application are known to those skilled in the art and will not be described in detail here.

[0035] Referring back to Figure 2 , the control method according to the embodiment of the present application is applied to the VCP hole filling production line according to the embodiment of the present application, wherein the control method comprises the following steps: S100, pretreatment: conveying the hanger 300, moving the transmission rod 310 to the upper side of the lifting rod 220, and then the lifting rod 220 rigidly pushes the hanger 300 to vibrate to remove the blind hole bubbles of the circuit board 400; S110, accelerated flushing: in the pretreatment, the circuit board 400 is placed in the plating cylinder, and after the circuit board 400 is vibrated, the flow rate of the liquid medicine in the plating cylinder is accelerated; S200, hole filling treatment: after the pretreatment, the circuit board 400 is subjected to VCP hole filling processing.

[0036] To this end, the process optimization is realized through the synergistic process of "pretreatment vibration→accelerated flushing→hole filling processing". In the pretreatment stage, the driving cylinder 210 pushes the hanger 300 to make the circuit board 400 vibrate at high frequency, directly removes the bubbles in the blind hole and creates conditions for subsequent liquid exchange. In the accelerated flushing stage, the liquid flow rate after vibration is improved, further strengthening the penetration and wetting effect of the liquid medicine in the blind hole. In the hole filling treatment stage, the electroplating filling is carried out under the optimized hole wall state, which can significantly reduce the hole cavity and improve the hole filling uniformity, thereby improving the electrical performance and reliability of the PCB board as a whole, and meeting the high-standard manufacturing requirements of high-density interconnection boards.

[0037] Other configurations and operations of the VCP hole filling production line according to the embodiment of the present application are known to those skilled in the art, and will not be described in detail here.

[0038] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the present application.

Claims

1. A vibration device, characterized in that: include: Support frame; A drive assembly is mounted on the support frame, the drive assembly comprising a drive cylinder and a lifting rod, the drive cylinder is connected to and drives the lifting rod to perform linear reciprocating motion in the vertical direction, A hanger for mounting a circuit board, wherein the hanger is provided with a transmission rod capable of moving above the lifting rod; When the driving cylinder moves upward, the lifting rod can push the transmission rod, causing the circuit board to vibrate, so as to remove bubbles in the blind holes of the circuit board; A buffer assembly is installed on the support frame. The buffer assembly is located at the downward movement path of the lifting rod and is used to buffer the lifting rod.

2. A vibration device according to claim 1, characterized in that: The hanger is provided with a mounting rod and a connecting ear, the mounting rod is fixedly connected to the transmission rod, the circuit board is mounted on the connecting ear, and the connecting ear is connected to the mounting rod via a telescopic spring.

3. A vibration device according to claim 2, characterized in that: There are a plurality of connecting ears, which are linearly spaced and arranged on the mounting rod. There are a plurality of telescopic springs, which are connected to the connecting ears in a one-to-one correspondence.

4. A vibration device according to claim 2 or 3, characterized in that: One end of the telescopic spring is welded and fixed to the mounting rod, and the other end is welded and fixed to the connecting ear.

5. A vibration device according to claim 1, characterized in that: The circuit board is vertically mounted on the rack.

6. A vibration device according to claim 1, characterized in that: There are two buffer assemblies, which are symmetrically arranged on both sides of the driving cylinder. The two buffer assemblies are respectively in contact with the surfaces on both sides of the lifting rod.

7. A vibration device according to claim 6, characterized in that: The buffer assembly includes a mounting cylinder, a spring rod and a buffer pad. The spring rod is elastically mounted on the mounting cylinder, and the buffer pad is mounted on the top of the spring rod.

8. A vibration device according to claim 1, characterized in that: The vibration device further includes a detection sensor, which is used to detect the position of the hanger. After the detection sensor detects that the hanger is in position, the detection sensor communicates and controls the driving cylinder to move upward.

9. VCP hole filling production line, characterized by: The invention comprises a vibration device according to any one of claims 1 to 8.

10. A control method, characterized in that: Applicable to the VCP hole filling production line described in claim 9; The control method comprises the following steps: Pre-treatment: transporting the rack so that the transmission rod moves to the top of the lifting rod, and then the lifting rod rigidly pushes the rack to vibrate and remove bubbles in the blind holes of the circuit board; Accelerated flushing: During pre-treatment, the circuit board is placed in a plating tank. When the circuit board vibrates, the flow rate of the liquid in the plating tank is accelerated. Hole filling process: After pre-processing, the circuit board is subjected to VCP hole filling process.

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