Automatic gallium nitride wafer cutting device

By setting a wire pay-off assembly and a wire winding assembly in the wafer cutting device, combined with a rotating and switching assembly, the problem of unstable diamond wire outlet position is solved, the durability and cutting effect of the device are improved, and a stable cutting process is achieved.

CN120792003APending Publication Date: 2025-10-17JINGANG WISDOM (BEIJING) TECH CO LTD
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Patent Information

Application Number
CN202511132070.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-13
Publication Date
2025-10-17

AI Technical Summary

Technical Problem

When using diamond wire for cutting, the existing wafer cutting device has an unstable wire release position, which causes oblique compression between the diamond wire and the guide wheel, affecting the durability of the device and making it impossible to adaptively adjust the wire release position.

Method used

An automated gallium nitride wafer cutting device was designed. By setting up a wire-paying component and a wire-winding component, the wire-out position can be automatically adjusted. The cutting effect can be enhanced by combining a rotating component and a connecting component. The wire-taking and wire-paying functions can be conveniently switched by a switching component to ensure that the tension of the diamond wire is within a certain range.

Benefits of technology

The stability of the diamond wire outlet position is achieved, oblique extrusion is avoided, the durability and cutting effect of the device are improved, and the stability and efficiency of the cutting process are ensured.

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Abstract

The invention provides an automatic gallium nitride wafer cutting device, and belongs to the technical field of wafer cutting, the automatic gallium nitride wafer cutting device comprises a first support plate, a second support plate and a third support plate, the second support plate is provided with a second electric push rod, the second electric push rod is provided with a clamping block, the first support plate is provided with a first clamping plate, and the first clamping plate is provided with a second electric push rod. A first clamping plate is installed on the clamping block, a second clamping plate is installed on the clamping block, protruding blocks are fixedly connected to the first clamping plate and the second clamping plate, a crystal column is located between the first clamping plate and the second clamping plate, a first support is arranged below the crystal column, a diamond wire is arranged on the crystal column, and the head end and the tail end of the diamond wire are guided by a guide assembly to be connected with a pay-off assembly and a winding assembly respectively. And rotating assemblies are installed on the paying-off assembly and the winding assembly correspondingly, connecting assemblies are installed on the rotating assemblies, and a fixing frame is arranged on the side face of the first support. The wafer cutting device solves the problem that oblique extrusion exists between a diamond wire and a guide wheel when an existing wafer cutting device is used for paying off.
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Description

TECHNICAL FIELD

[0001] The application relates to the field of wafer cutting technology, in particular to an automatic gallium nitride wafer cutting device. BACKGROUND

[0002] Gallium nitride is an important semiconductor material, mainly applied in the fields of high frequency, high power and high temperature. Due to its high band gap, gallium nitride can withstand higher voltage and temperature, has lower conduction loss and stronger anti-radiation ability. Therefore, gallium nitride material is widely used in high-brightness blue and white light LED, laser, radio frequency power amplifier and other fields. The manufacturing process of gallium nitride wafer is more complex than that of traditional silicon material. The gallium nitride wafer is generally obtained by epitaxial growth technology using silicon carbide as a substrate. In the processing process, a wafer cutting device needs to be used. The existing cutting device still has some defects.

[0003] For example, the patent for invention with publication number CN111267255B discloses a round wafer cutting device, which comprises a rotating table, a row groove one is fixedly installed on the upper surface of the rotating table, a step motor one is fixedly installed on one side in the interior of the row groove one, a lead screw one is movably installed in the interior of the row groove one through the step motor one, a row groove two is fixedly installed on the upper surface of the row groove one, and a step motor two is fixedly installed on one side in the interior of the row groove two. The round wafer cutting device can prevent the influence of the elasticity of the film attached to the back of the round wafer itself during the cutting process of the round wafer, can fix the stability of the cutting position on both sides, and can ensure the cutting yield of the round wafer cutting device. Although the above-mentioned device can ensure the stability of the cutting position on both sides, in use, the existing cutting method uses a diamond wire through the cooperation of a pay-off wheel and a take-up wheel. Although the cutting function can be realized, the position of the diamond wire paid out by the pay-off wheel will change with the wire roll. The existing equipment cannot ensure that the diamond wire slowly drives the pay-off wheel to move to ensure the stability of the wire position when the diamond wire is paid out. Although the existing equipment can ensure that the wire position does not change through the guide wheel, the oblique extrusion between the diamond wire and the guide wheel will affect the durability of the device, and the wire position cannot be adjusted adaptively without affecting the paying-out of the diamond wire. SUMMARY

[0004] In view of the problems existing in the existing wafer cutting, the present application is proposed.

[0005] To solve the above technical problems, the application provides the following technical scheme: an automatic gallium nitride wafer cutting device, comprising a first supporting plate, a second supporting plate and a third supporting plate, a second electric push rod is installed on the second supporting plate, a clamping block is installed on the second electric push rod, a first clamping plate is installed on the first supporting plate, a second clamping plate is installed on the clamping block, a protruding block is fixedly connected to the first clamping plate and the second clamping plate, a crystal column is located between the first clamping plate and the second clamping plate, a first support is arranged below the crystal column, a diamond wire is arranged on the crystal column, the first end and the second end of the diamond wire are connected with a pay-off assembly and a winding assembly respectively through a guide assembly, a rotating assembly is installed on the pay-off assembly and the winding assembly, a connecting assembly is installed on the rotating assembly, a fixed frame is arranged on the side surface of the first support, a second motor, a third motor and a switching assembly are installed on the fixed frame.

[0006] As a preferred scheme of the application, a first electric push rod is installed on the third supporting plate, and a push plate is fixedly connected to the first electric push rod; the first supporting plate, the second supporting plate and the third supporting plate are fixedly connected as an integral structure.

[0007] As a preferred scheme of the application, the protruding blocks are uniformly distributed in the first clamping plate and the second clamping plate; the first clamping plate and the second clamping plate are in the shape of a circular arc.

[0008] As a preferred scheme of the application, the side surface of the first support is provided with a fixed frame, the fixed frame is provided with a switching assembly, the first support is provided with a first extension plate, a second extension plate and a first motor, grooves are formed in the first extension plate and the second extension plate, the groove in the second extension plate is in the shape of an inclination, a connecting shaft is installed on the output shaft of the first motor, and the connecting shaft is connected with the first extension plate.

[0009] As a preferred scheme of the application, the pay-off assembly comprises a first key rod which is rotatably installed on the first support, a pay-off disc is keyed to the first key rod, and a first synchronous wheel is fixedly connected to the first key rod.

[0010] As a preferred scheme of the application, the winding assembly comprises a second key rod which is rotatably installed on the first support, a winding disc is keyed to the second key rod, a second synchronous wheel is fixedly connected to the winding disc, a synchronous belt is installed between the first synchronous wheel and the second synchronous wheel, a first connecting plate and a second connecting plate are rotatably installed between the winding disc and the pay-off disc, and a third electric push rod is installed in the first support; the central axes of the third electric push rod, the first connecting plate and the second connecting plate are collinear.

[0011] As a preferred scheme of the present application, the rotating assembly comprises a first rotating disc fixedly connected to the first and second synchronous wheels, the first rotating disc is fixedly connected with a fixed shaft and a first wedge block, the outer side of the fixed shaft is attached with a second rotating disc, the fixed shaft is rotatably provided with a top disc, the top disc is provided with a rotating groove, and the second rotating disc is fixedly connected with a second wedge block.

[0012] As a preferred scheme of the present application, the connecting assembly comprises a supporting spring placed between the top disc and the second rotating disc, the second rotating disc is fixedly connected with a connecting rod, the outer side of the connecting rod is slidably provided with a connecting block, and the second and third motors are connected with the connecting blocks at corresponding positions.

[0013] As a preferred scheme of the present application, the guiding assembly comprises a movable block slidably installed in the first support, the movable block is rotatably provided with a first wire pressing wheel, the movable block and the first support are fixedly connected with a second spring, the bottom of the second spring is fixedly connected with a sliding plate, the first support and the sliding plate are provided with a fourth electric push rod, the first support is rotatably provided with a second wire pressing wheel, one end of the diamond wire is connected with the wire releasing disc, and the other end of the diamond wire is connected with the wire winding disc through the first and second wire pressing wheels.

[0014] As a preferred scheme of the present application, the switching assembly comprises a fifth electric push rod fixedly installed on the fixed frame, the fifth electric push rod is fixedly provided with a sliding frame, the sliding frame is provided with a pressing block at both sides, the second and third motors are rotatably installed on the fixed frame, the second and third motors are fixedly connected with a connecting disc, and the connecting disc and the pressing block are attached to each other.

[0015] Compared with the prior art, the present application has the following advantages:

[0016] 1. The wire releasing assembly and the wire winding assembly are arranged, so that the wire releasing position can be automatically adjusted, the wire releasing position of the wire coil changes constantly as the wire releasing wheel moves outward, the wire releasing position is ensured to be unchanged by the fact that the wire releasing wheel can slide on the first key rod, and the durability of the device is ensured by avoiding the oblique extrusion between the diamond wire and the guide wheel due to the change of the wire releasing position.

[0017] 2. The rotating assembly and the connecting assembly are arranged on the device, when the second motor drives the left connecting block to rotate counterclockwise, the left connecting block drives the corresponding connecting rod and the second rotating disc to rotate counterclockwise, the plane of the second wedge block on the left second rotating disc abuts against the plane of the first wedge block, thereby driving the left first rotating disc to rotate, at this time, the diamond wire drives the wire releasing disc and the first key rod to rotate, the first key rod drives the first synchronous wheel and the right first rotating disc of the device to rotate counterclockwise, the inclined surface of the right second wedge block abuts against the inclined surface of the first wedge block at the corresponding position, so that the device has certain resistance when releasing the wire, and the cutting effect of the device is enhanced by the resistance generated by the wedge blocks on the wire releasing and winding structure.

[0018] 3、The device is provided with a second motor, a third motor and a switching assembly, so that the device can conveniently switch the functions of winding and unwinding. After one cutting is completed, the diamond wire is completely wound on the winding disc. Subsequently, the fifth electric push rod can be shortened, so that the adapter disc on the third motor is kept clamped with the first support through the pressing block. At this time, the device can ensure that the tension of the diamond wire during winding is maintained within a certain range by driving the second turntable on the right side of the device to rotate clockwise, driving the first turntable to rotate. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the present application will be described in detail below with reference to the drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor. Among them:

[0020] Figure 1 is a schematic diagram of the overall structure of the automatic gallium nitride wafer cutting device of the present application;

[0021] Figure 2 is Figure 1 is an enlarged schematic diagram of the structure at A in

[0022] Figure 3 is Figure 1 is an enlarged schematic diagram of the structure at B in

[0023] Figure 4 is a schematic diagram of the disassembled structure of the first clamping plate and the second clamping plate of the present application;

[0024] Figure 5 is a schematic diagram of the connection structure of the first support and the guide assembly of the present application;

[0025] Figure 6 is a schematic diagram of the connection structure of the winding disc and the second key rod of the present application;

[0026] Figure 7 is a schematic diagram of the connection structure of the fixed shaft and the top disc of the present application;

[0027] Figure 8 is a schematic diagram of the connection structure of the rotating assembly and the adapter assembly of the present application;

[0028] Figure 9 is a schematic diagram of the disassembled structure of the first turntable and the second turntable of the present application;

[0029] Figure 10 is a schematic diagram of the connection structure of the first turntable and the second turntable of the present application.

[0030] Label: 1, the first support plate; 2, the second support plate; 3, the third support plate; 4, the first electric push rod; 5, the push plate; 6, the second electric push rod; 7, the clamping block; 8, the first clamping plate; 9, the second clamping plate; 10, the protruding block; 11, the crystal column; 12, the first support; 13, the diamond wire; 14, the wire releasing assembly; 1401, the wire releasing disc; 1402, the first key rod; 1403, the first synchronous wheel; 15, the wire winding assembly; 1501, the wire winding disc; 1502, the second key rod; 1503, the second synchronous wheel; 16, the first link plate; 17, the second link plate; 18, the third electric push rod; 19, the synchronous belt; 20, the rotating assembly; 2001, the first rotating disc; 2002, the fixed shaft; 2003, the first wedge block; 2004, the top disc; 2005, the rotating groove; 2006, the second rotating disc; 2007, the second wedge block; 21, the link assembly; 2101, the supporting spring; 2102, the connecting rod; 2103, the connecting block; 22, the first extension plate; 23, the second extension plate; 24, the recess; 25, the first motor; 26, the connecting shaft; 27, the guide assembly; 2701, the movable block; 2702, the first wire pressing wheel; 2703, the second spring; 2704, the sliding plate; 2705, the fourth electric push rod; 2706, the second wire pressing wheel; 28, the second motor; 29, the third motor; 30, the fixed frame; 31, the switching assembly; 3101, the fifth electric push rod; 3102, the sliding frame; 3103, the pressing block; 3104, the link disc. DETAILED DESCRIPTION

[0031] In order to make the above objectives, features and advantages of the present application more obvious and understandable, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0032] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the concept of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0033] Secondly, the present application is described in detail in combination with the schematic diagram, and in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure will be partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application herein. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual manufacture.

[0034] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0035] As Figures 1-10As shown, an automatic gallium nitride wafer cutting device includes a first support plate 1, a second support plate 2, and a third support plate 3. The second support plate 2 is provided with a second electric push rod 6, and the second electric push rod 6 is provided with a clamping block 7. The clamping block 7 is fixedly arranged on one side of a crystal column 11. The first support plate 1 is provided with a first clamping plate 8. The clamping block 7 is provided with a second clamping plate 9. The first clamping plate 8 and the second clamping plate 9 are both fixedly connected with protrusions 10. The crystal column 11 is located between the first clamping plate 8 and the second clamping plate 9. A first support 12 is arranged below the crystal column 11. A diamond wire 13 is arranged on the crystal column 11. The first end and the second end of the diamond wire 13 are guided by a guide assembly 27 and connected with a pay-off assembly 14 and a take-up assembly 15, respectively. The pay-off assembly 14 and the take-up assembly 15 are both provided with a rotating assembly 20. The pay-off assembly 14 and the take-up assembly 15 can adaptively adjust the wire reel according to the wire outlet position during wire cutting, so as to ensure the wire cutting effect of the device. The rotating assembly 20 is provided with a connecting assembly 21. A fixed frame 30 is arranged on the side of the first support 12. The fixed frame 30 is provided with a second motor 28, a third motor 29, and a switching assembly 31. The second electric push rod 6 is extended to push the clamping block 7 and the second clamping plate 9, so as to fix the crystal column 11 by the protrusions 10 on the first clamping plate 8 and the second clamping plate 9, and then the wafer cutting work is carried out. The rotating assembly 20 cooperates with the connecting assembly 21 to not only enhance the cutting effect during wire pay-off, but also maintain the tension of the diamond wire 13 during wire take-up.

[0036] In the embodiment, the first electric push rod 4 is arranged on the third support plate 3, and the first electric push rod 4 is fixedly connected with a push plate 5. The first support plate 1, the second support plate 2, and the third support plate 3 are fixedly connected as a whole structure. The first electric push rod 4 is used to adjust the position of the push plate 5, so as to adjust the cutting position and the cutting thickness of the wafer by the push plate 5.

[0037] In the embodiment, the protrusions 10 are uniformly distributed in the first clamping plate 8 and the second clamping plate 9. The first clamping plate 8 and the second clamping plate 9 are in a circular arc shape. The circular arc structure of the first clamping plate 8 and the second clamping plate 9 can ensure the clamping effect of the device. The uniformly distributed protrusions 10 can ensure that the force is uniformly distributed when the device clamps the object.

[0038] In the embodiment, the side of the first support 12 is provided with a fixing frame 30, the fixing frame 30 is installed with a switching assembly 31, the first support 12 is installed with a first extension plate 22, a second extension plate 23 and a first motor 25, the first extension plate 22 and the second extension plate 23 are both provided with a groove 24, the groove 24 on the second extension plate 23 is inclined, the output shaft of the first motor 25 is installed with a connecting shaft 26, the connecting shaft 26 is connected with the first extension plate 22, the first extension plate 22 and the second extension plate 23 on the first support 12 are driven to rotate through the first motor 25, and then the initial angle of the second extension plate 23 is adjusted, the inclined groove 24 on the second extension plate 23 is used for changing the discharging direction of the wafer, and it is avoided that the discharged wafer is located directly above the diamond wire 13.

[0039] In the embodiment, the unwinding assembly 14 includes a first key rod 1402 rotatably installed on the first support 12, the first key rod 1402 is keyed with an unwinding disc 1401, the first key rod 1402 is fixedly connected with a first synchronous wheel 1403, and the unwinding disc 1401 can slide through the first key rod 1402, so that the wire discharging position is adaptively adjusted during unwinding, and it is avoided that the wire discharging in the inclined direction causes extrusion and wear to the guide structure.

[0040] In the embodiment, the winding assembly 15 includes a second key rod 1502 rotatably installed on the first support 12, the second key rod 1502 is keyed with a winding disc 1501, the winding disc 1501 is fixedly connected with a second synchronous wheel 1503, the first synchronous wheel 1403 and the second synchronous wheel 1503 are installed with a synchronous belt 19, the winding disc 1501 and the unwinding disc 1401 are rotatably installed with a first link plate 16 and a second link plate 17, the first support 12 is installed with a third electric push rod 18, the third electric push rod 18 facilitates subsequent rewinding, the central axes of the third electric push rod 18, the first link plate 16 and the second link plate 17 are collinear, the winding disc 1501 can slide through the second key rod 1502, and the first link plate 16 and the second link plate 17 can ensure that the positions of the device during unwinding and winding are the same.

[0041] In the embodiment, the rotating assembly 20 includes a first rotating disc 2001 fixedly connected to the first synchronous wheel 1403 and the second synchronous wheel 1503, the first rotating disc 2001 is fixedly connected with a fixed shaft 2002 and a first wedge block 2003, the outer side of the fixed shaft 2002 is abutted with a second rotating disc 2006, the fixed shaft 2002 is rotatably provided with a top disc 2004, the top disc 2004 is provided with a rotating groove 2005, the second rotating disc 2006 is fixedly connected with a second wedge block 2007, as Figures 7-10As shown, when the second rotating disc 2006 rotates counterclockwise, the plane of the second wedge block 2007 abuts against the plane of the first wedge block 2003, thereby driving the first rotating disc 2001 to rotate synchronously, enhancing the stability of the device during operation, and during subsequent winding, since the second rotating disc 2006 rotates clockwise, the inclined surface of the second wedge block 2007 abuts against the inclined surface of the first wedge block 2003, if the torque is too large, the second rotating disc 2006 will slide on the first rotating disc 2001, thereby ensuring the stability of the tension during winding.

[0042] In the embodiment, the adapter assembly 21 comprises a supporting spring 2101 placed between the top disc 2004 and the second rotating disc 2006, the second rotating disc 2006 is fixedly connected with a connecting rod 2102, the outer side of the connecting rod 2102 is slidingly installed with a connecting block 2103, the second motor 28 and the third motor 29 are connected with the connecting block 2103 at corresponding positions, as shown in the figure. Figure 8 As shown, when the second motor 28 or the third motor 29 drives the connecting block 2103 to rotate clockwise, if the rotating torque is too large, it will cause the second rotating disc 2006 to slide while reciprocating, the supporting spring 2101 is not connected with the second rotating disc 2006 and the top disc 2004, therefore, the supporting spring 2101 can reset the second rotating disc 2006 without being affected by the rotation of the second rotating disc 2006.

[0043] In the embodiment, the guiding assembly 27 comprises a movable block 2701 slidingly installed in the first support 12, the movable block 2701 is rotatably installed with a first wire pressing wheel 2702, the movable block 2701 and the first support 12 are fixedly connected with a second spring 2703, the bottom of the second spring 2703 is fixedly connected with a sliding plate 2704, the first support 12 and the sliding plate 2704 are installed with a fourth electric push rod 2705, the first support 12 is rotatably installed with a second wire pressing wheel 2706, one end of the diamond wire 13 is connected with the paying-out disc 1401, the other end of the diamond wire 13 is guided by the first wire pressing wheel 2702 and the second wire pressing wheel 2706 and connected with the winding disc 1501, by shortening the fourth electric push rod 2705, the fourth electric push rod 2705 pulls the sliding plate 2704 downward, the second spring 2703 pulls the movable block 2701 and the first wire pressing wheel 2702 to move downward and press the diamond wire 13 downward, thereby realizing the guiding function in cooperation with the second wire pressing wheel 2706.

[0044] In the embodiment, the switching assembly 31 comprises a fifth electric push rod 3101 fixedly installed on the fixed frame 30, the fifth electric push rod 3101 is fixedly provided with a sliding frame 3102, the sliding frame 3102 is installed with a pressing block 3103 on both sides, the second motor 28 and the third motor 29 are rotatably installed on the fixed frame 30, the second motor 28 and the third motor 29 are fixedly connected with an adapter disc 3104, the adapter disc 3104 and the pressing block 3103 are mutually attached, as shown in the figure.Figure 3 As shown, the device can adjust the position of the sliding frame 3102 by lengthening or shortening the fifth electric push rod 3101, and then the pressing block 3103 on one side of the sliding frame 3102 abuts against the recessed area of the adapter disc 3104, so as to fix the second motor 28 or the third motor 29.

[0045] It should be noted that the present application is an automatic gallium nitride wafer cutting device. Figures 1-4 As shown, the first support plate 1, the second support plate 2, the third support plate 3, the first support 12 and the fixed frame 30 are used to support the whole device. The clamping block 7 and the second clamping plate 9 are pushed to move in the direction of the first clamping plate 8 by lengthening the second electric push rod 6, so as to fix the crystal column 11 by the protrusions 10 on the first clamping plate 8 and the second clamping plate 9. The position of the push plate 5 can be adjusted by the first electric push rod 4, and the push plate 5 can push the crystal column 11, so as to adjust the cutting position and the cutting thickness of the wafer. One end of the diamond wire 13 is wound on the pay-off disc 1401, and the other end is placed on the cutting surface of the crystal column 11 and connected to the take-up disc 1501 through the first wire pressing wheel 2702 and the second wire pressing wheel 2706. The fourth electric push rod 2705 on the guide assembly 27 is shortened, the fourth electric push rod 2705 pulls down the sliding plate 2704, the second spring 2703 pulls down the movable block 2701 and the first wire pressing wheel 2702, and the diamond wire 13 is pressed down, so as to cooperate with the second wire pressing wheel 2706 to ensure the pressing effect of the diamond wire 13. During cutting, the fifth electric push rod 3101 is shortened to drive the sliding frame 3102 to move, and then the pressing block 3103 on one side of the sliding frame 3102 abuts against the recessed area of the adapter disc 3104, so as to fix the second motor 28. At this time, the connecting block 2103 on the left side of the device is driven to rotate counterclockwise by the third motor 29, the connecting rod 2102 and the second turntable 2006 in the corresponding area are driven to rotate counterclockwise by the left connecting block 2103, the plane of the second wedge block 2007 on the left second turntable 2006 abuts against the plane of the first wedge block 2003, and then the left first turntable 2001 is driven to rotate. At this time, the diamond wire 13 pulls the pay-off disc 1401 and the first key rod 1402 to rotate, the first key rod 1402 drives the first synchronous wheel 1403 and the first turntable 2001 on the right side of the device to rotate counterclockwise, the inclined surface of the right second wedge block 2007 abuts against the inclined surface of the first wedge block 2003 in the corresponding position, so that the device has a certain resistance during pay-off. The resistance generated by the circumferential motion of the right wedge block enhances the cutting effect of the device.

[0046] During pay-off, as shown, Figures 3-10As shown, the wire reel 1401 can slide through the first key rod 1402 to ensure that the wire outlet position does not change due to different winding positions of the wire reel, the synchronous belt 19 on the first synchronous wheel 1403 drives the second synchronous wheel 1503 to rotate synchronously, and the first and second connecting plates 16 and 17 can ensure that the wire reel 1501 can follow the wire reel 1401 when the device is unwinding and winding the wire, so that the wire reel 1501 slides on the second key rod 1502, ensuring that the position of the diamond wire 13 is synchronized, thereby adaptively adjusting the wire outlet position when unwinding, avoiding the extrusion and wear of the guide assembly 27 caused by the inclined direction of the wire outlet.

[0047] As shown in Figure 3 , Figure 5 , Figure 6 and Figure 8 , when the device is cutting and winding, the fifth electric push rod 3101 is extended to the state shown in Figure 1 , when the connecting block 2103 in the right region is driven to rotate clockwise by the second motor 28, if the rotation torque is too large, it will cause the second turntable 2006 to slide while rotating, and the supporting spring 2101 is not connected with the second turntable 2006 and the top disc 2004, therefore, the supporting spring 2101 can make the second turntable 2006 automatically reset under the lifting action of the first and second wedge blocks 2003 and 2007 without being affected by the rotation of the second turntable 2006. The device can drive the first and second extension plates 22 and 23 on the first support 12 to rotate by the first motor 25, thereby adjusting the initial angle of the second extension plate 23, since the grooves 24 on the second extension plate 23 are inclined, the inclined grooves 24 on the second extension plate 23 can change the discharge direction of the wafer, avoiding the wafer being discharged above the diamond wire 13 to affect normal discharge, and an external mechanical arm can be set at the notch position of the groove 24 to clamp the cut gallium nitride wafer.

[0048] Although the present application has been described with reference to the embodiments above, various modifications can be made to it without departing from the scope of the present application, and equivalent components can be substituted therefor. In particular, the features in the embodiments disclosed in the present application can be combined with each other in any manner as long as there is no structural conflict, and the combinations are not exhaustively described in the present specification only for the purpose of saving space and resources. Therefore, the present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An automated gallium nitride wafer cutting device, comprising a first support plate (1), a second support plate (2) and a third support plate (3), characterized in that: A second electric push rod (6) is installed on the second support plate (2), a clamping block (7) is installed on the second electric push rod (6), a first clamping plate (8) is installed on the first support plate (1), a second clamping plate (9) is installed on the clamping block (7), and the first clamping plate (8) and the second clamping plate (9) are both fixedly connected with a protrusion (10), the crystal column (11) is located between the first clamping plate (8) and the second clamping plate (9), and a first bracket (12) is provided below the crystal column (11). A diamond wire (13) is provided on the first bracket (12), and the first and tail ends of the diamond wire (13) are respectively connected to the wire-releasing assembly (14) and the wire-winding assembly (15) through the guidance of a guide assembly (27). The wire-releasing assembly (14) and the wire-winding assembly (15) are both installed with a rotating assembly (20), and the rotating assembly (20) is installed with a connecting assembly (21). A fixing frame (30) is provided on the side of the first bracket (12), and a second motor (28), a third motor (29) and a switching assembly (31) are installed on the fixing frame (30).

2. The automated gallium nitride wafer cutting device according to claim 1, wherein: A first electric push rod (4) is mounted on the third support plate (3), a push plate (5) is fixedly connected to the first electric push rod (4), and the first support plate (1), the second support plate (2), and the third support plate (3) are fixedly connected to form an integral structure.

3. The automated gallium nitride wafer cutting device according to claim 1, wherein: The protrusions (10) are evenly distributed inside the first clamping plate (8) and the second clamping plate (9), and both the first clamping plate (8) and the second clamping plate (9) are in an arc shape.

4. The automated gallium nitride wafer cutting device according to claim 1, wherein: A fixing frame (30) is provided on the side of the first bracket (12), and a switching assembly (31) is installed on the fixing frame (30). A first extension plate (22), a second extension plate (23) and a first motor (25) are installed on the first bracket (12). The first extension plate (22) and the second extension plate (23) are both provided with a groove (24), and the groove (24) on the second extension plate (23) is inclined. A connecting shaft (26) is installed on the output shaft of the first motor (25), and the connecting shaft (26) is connected to the first extension plate (22).

5. The automated gallium nitride wafer cutting device according to claim 1, wherein: The pay-off assembly (14) comprises a first key rod (1402) rotatably mounted on a first bracket (12), a pay-off reel (1401) being key-connected to the first key rod (1402), and a first synchronous wheel (1403) being fixedly connected to the first key rod (1402).

6. The automated gallium nitride wafer cutting device according to claim 5, characterized in that: The winding assembly (15) includes a second key rod (1502) rotatably mounted on the first bracket (12), a key on the second key rod (1502) is connected to a winding drum (1501), a second synchronous wheel (1503) is fixedly connected to the winding drum (1501), a synchronous belt (19) is installed between the first synchronous wheel (1403) and the second synchronous wheel (1503), a first connecting plate (16) and a second connecting plate (17) are rotatably mounted between the winding drum (1501) and the unwinding drum (1401), a third electric push rod (18) is installed in the first bracket (12), and the central axes of the third electric push rod (18), the first connecting plate (16) and the second connecting plate (17) are collinear.

7. The automated gallium nitride wafer cutting device according to claim 6, characterized in that: The rotating assembly (20) comprises a first rotating disc (2001) fixedly connected to a first synchronous wheel (1403) and a second synchronous wheel (1503); a fixed shaft (2002) and a first wedge (2003) are fixedly connected to the first rotating disc (2001); a second rotating disc (2006) is arranged on the outer side of the fixed shaft (2002); a top disc (2004) is rotatably arranged on the fixed shaft (2002); a rotating groove (2005) is provided on the top disc (2004); and a second wedge (2007) is fixedly connected to the second rotating disc (2006).

8. The automated gallium nitride wafer cutting device according to claim 7, characterized in that: The connection assembly (21) includes a support spring (2101) placed between the top plate (2004) and the second turntable (2006); a connecting rod (2102) is fixedly connected to the second turntable (2006); a connecting block (2103) is slidably mounted on the outer side of the connecting rod (2102); and the second motor (28) and the third motor (29) are respectively connected to the connecting blocks (2103) at corresponding positions.

9. The automated gallium nitride wafer cutting device according to claim 6, characterized in that: The guide assembly (27) comprises a movable block (2701) slidably mounted in the first bracket (12), a first pressing wheel (2702) rotatably mounted on the movable block (2701), a second spring (2703) fixedly connected between the movable block (2701) and the first bracket (12), a slide plate (2704) fixedly connected to the bottom of the second spring (2703), a fourth electric push rod (2705) mounted between the first bracket (12) and the slide plate (2704), a second pressing wheel (2706) rotatably mounted on the first bracket (12), one end of the diamond wire (13) is connected to the pay-off reel (1401), and the other end of the diamond wire (13) is connected to the winding reel (1501) via the first pressing wheel (2702) and the second pressing wheel (2706) guided by the first pressing wheel (2702) and the second pressing wheel (2706).

10. The automated gallium nitride wafer cutting device according to claim 4, characterized in that: The switching assembly (31) includes a fifth electric push rod (3101) fixedly mounted on a fixed frame (30), a sliding frame (3102) fixedly provided on the fifth electric push rod (3101), and pressure blocks (3103) installed on both sides of the sliding frame (3102). The second motor (28) and the third motor (29) are both rotatably mounted on the fixed frame (30), and the second motor (28) and the third motor (29) are both fixedly connected with a connecting plate (3104), and the connecting plate (3104) and the pressure block (3103) are in contact with each other. The first motor (25), the second motor (28) and the third motor (29) are all electromagnetic brake motors.

Citation Information

Patent Citations

  • A wafer cutting device

    CN111267255B