Aluminum alloy surface pattern manufacturing process
By performing oxidation and etching processes on the aluminum alloy surface to form a pattern with imitation leather texture, the installation complexity and maintenance difficulties of natural leather on laptop cases are solved, the cost is reduced, and the aesthetics and heat dissipation performance are improved.
Patent Information
- Application Number
- CN202510856367.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-23
- Publication Date
- 2025-10-21
AI Technical Summary
In the prior art, the use of natural leather on the notebook computer housing results in complicated installation, difficulty in maintenance, and high cost.
The aluminum alloy surface pattern production process, including pre-treatment, anodizing, masking, etching and post-treatment, is adopted to simulate the leather texture by forming an oxide film on the aluminum alloy surface and etching a pattern.
The aesthetics of the aluminum alloy surface is improved, production costs are reduced, and the heat dissipation performance and wear resistance of the laptop are improved.
Smart Images
Figure CN120818889A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of metal surface treatment, in particular to a process for producing aluminum alloy surface patterns. Background Art
[0002] The natural texture and softness of leather give the laptop a premium, refined feel, enhancing the overall aesthetics and class of the product. Leather also offers a degree of flexibility and wear resistance, protecting the laptop casing from damage such as collisions and scratches.
[0003] To attach the leather to the laptop case, first leave a defined edge size on the leather based on the laptop's dimensions. Use sharp scissors or a cutting device to cut the leather into the appropriate shape. Then, attach the leather to the laptop. If gluing the leather, use a leather-friendly glue, such as neoprene, and evenly apply it to the mating surface between the laptop case and the leather. Once the glue dries slightly, securely affix the leather to the case. If sewing the leather, first punch holes in the leather and laptop case at the corresponding locations, then sew the leather to the case using a needle and thread. Finally, use a sanding tool to smooth the edges of the leather. Alternatively, you can emboss, engrave, or add decorative elements to the leather surface as desired.
[0004] However, natural leather is relatively expensive, increasing both the production cost and the selling price of laptops. Furthermore, leather needs to be protected from direct sunlight, moisture, and scratches from sharp objects, and requires regular cleaning and maintenance, otherwise it can easily become cracked, discolored, and moldy. Furthermore, the leather cutting and sewing processes require skill and experience, and require high craftsmanship. Improper handling can easily compromise the appearance and quality.
[0005] Therefore, a new solution is needed to solve the above technical problems. Summary of the Invention
[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an aluminum alloy surface pattern production process to solve the problem in the prior art of using natural leather on laptop computer shells, which leads to complicated installation and difficult maintenance in the later stage.
[0007] To achieve the above-mentioned purpose and other related purposes, the present invention provides a process for producing a surface pattern of an aluminum alloy, which is specifically configured as follows: the process includes pretreatment, anodizing, masking, etching and post-treatment, wherein the anodizing forms an oxide film on the surface of the workpiece; the mask produces a mask pattern on the surface of the oxide film, and the mask pattern is located in the etching area of the workpiece; the etching etches the workpiece after the mask to etch a pattern consistent with the mask pattern in the etching area.
[0008] Optionally, the etching adopts a dry etching process or a wet etching process; when the wet etching process is adopted, the masked workpiece is placed in an etching solution, and the etching time and etching temperature are controlled.
[0009] Optionally, the etching time is determined by the etching rate of the etching solution and the etching depth of the workpiece, and the current density during the etching process is set to 10-30A / dm 2 .
[0010] Optionally, the etching solution includes at least fluoride and nitrate, wherein the concentration of the fluoride is 15%-20%, and the pH value of the etching solution is between 1.5-3.0.
[0011] Optionally, during the etching process, the etching temperature is controlled between 30°C and 50°C.
[0012] Optionally, the thickness of the oxide film is 5-25 μm; during the etching process, the etching depth of the etching area is the same as the thickness of the oxide film.
[0013] Optionally, the wet etching process adopts pulse etching, and the etching solution is subjected to a circulation filtration treatment.
[0014] Optionally, forming a mask pattern on the surface of the oxide film includes coating a resist on the surface of the oxide film, and using a photolithography technique or a laser direct writing technique to form the mask pattern on the surface of the oxide film.
[0015] Optionally, the pre-treatment includes cleaning, degreasing, and polishing in sequence, wherein after the polishing, the surface roughness of the workpiece is Ra≤0.2um; the post-treatment includes removing the mask plate, cleaning, neutralization, and sealing in sequence.
[0016] Optionally, the anodizing adopts a pulse anodizing process, and the pulse anodizing process adopts low-temperature thick film oxidation first, and then high-temperature micropore expansion.
[0017] As described above, the aluminum alloy surface patterning process of the present invention has the following beneficial effects:
[0018] 1) After the workpiece is surface treated, the workpiece is anodized to form an oxide film of a certain thickness on the surface of the workpiece; then, the anodized workpiece is masked to form a mask pattern on the surface of the oxide film, and the mask pattern is located in the etching area of the workpiece; then, the masked workpiece is etched to etch a pattern consistent with the mask pattern in the etching area of the workpiece, which is conducive to improving the aesthetics of the workpiece surface; finally, the etched workpiece is post-processed to complete the surface treatment of the workpiece;
[0019] 2) The present invention achieves the requirement of forming a pattern on the surface of the workpiece by first performing anodizing treatment and then etching treatment, and can also meet the requirement of metallic texture of the workpiece;
[0020] 3) When the processed part of the present invention is applied to a notebook computer housing, it is beneficial to improve the heat dissipation performance of the notebook computer. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Shown is a process flow chart of a process for producing an aluminum alloy surface pattern according to an embodiment of the present invention. DETAILED DESCRIPTION
[0022] The present invention is further illustrated below through specific examples. However, it should be noted that the specific material ratios, process conditions and results described in the embodiments of the present invention are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made based on the spirit of the present invention should be included in the scope of protection of the present invention.
[0023] The present invention is described in detail below by way of specific examples. It should also be understood that the following examples are only used to specifically illustrate the present invention and are not to be construed as limiting the scope of protection of the present invention. Some non-essential improvements and adjustments made by those skilled in the art based on the above content of the present invention all fall within the scope of protection of the present invention. The specific process parameters and the like in the following examples are only examples within a suitable range, and those skilled in the art can make selections within a suitable range through the description herein, and are not to be limited to the specific numerical values exemplified below.
[0024] See Figure 1 The present invention provides a process for producing a pattern on an aluminum alloy surface, which may include steps S110 to S150, which are described in detail as follows:
[0025] Step S110, pre-processing.
[0026] In some embodiments, the pre-treatment includes cleaning, degreasing, and polishing in sequence.
[0027] During the cleaning process, organic solvents or alkaline solutions are used to remove oil, dust, and impurities from the surface of the workpiece to ensure that the surface of the workpiece is clean after cleaning. For example, commonly used cleaning agents include trichloroethylene and sodium hydroxide solution.
[0028] In order to further remove grease from the surface of the workpiece, ultrasonic degreasing or chemical degreasing can be used to degrease the workpiece to enhance the adhesion of the surface of the workpiece in subsequent processing.
[0029] The workpiece is then mechanically, chemically, or electrolytically polished to achieve a desired surface finish, paving the way for the subsequent formation of a uniform oxide film and pattern. Polishing achieves a surface roughness of Ra ≤ 0.2 μm, preventing uneven transmittance of the oxide film formed during subsequent anodization, which can affect mask positioning.
[0030] It should be noted that the workpiece is made of aluminum alloy, such as 6 series aluminum alloy, 7 series aluminum alloy, etc.
[0031] Step S120: anodizing to form an oxide film on the surface of the workpiece.
[0032] In some embodiments, the pre-treated workpiece is first clamped on the fixture of the anodizing equipment to ensure good contact between the workpiece and the fixture. Subsequently, the workpiece and the fixture are placed in an electrolytic tank containing an electrolyte such as sulfuric acid and oxalic acid, and current and voltage are applied to the workpiece to form an oxide film on the surface of the workpiece. During the oxidation process, the thickness and performance of the oxide film are adjusted by controlling parameters such as the concentration, temperature, current density and oxidation time of the electrolyte. For example, the concentration of sulfuric acid electrolyte is 15%-20%, the temperature is 18°C-25°C, and the current density is 1-2A / dm 2 , the oxidation time is 20-60 minutes.
[0033] In one example, to improve the uniformity of the oxide film thickness on a workpiece, pulsed current anodizing can be used. Compared to direct current anodizing, the uniformity of the oxide film formed on the workpiece surface is improved. For example, during the pulsed current anodizing process, the pulse frequency is 50-200 Hz, and the duty cycle is 60%-80%.
[0034] The pulse anodizing process uses a two-step oxidation method. First, a low-temperature thick-die oxidation process forms a dense oxide film on the surface of the workpiece. Then, a high-temperature micropore expansion process is performed. At high temperatures, the crystal structure within the workpiece may change, forming new pores or expanding existing pores. This process flow increases the internal porosity or improves air permeability while maintaining the surface density of the workpiece.
[0035] In one example, the thickness of the oxide film can be 6 μm, 15 μm, 23 μm, etc., to ensure the subsequent etching depth. For example, in order to monitor the thickness of the oxide film, an eddy current thickness gauge can be used to monitor the thickness of the oxide film in real time during the oxide film formation process to ensure that the thickness of the oxide film finally formed on the workpiece surface is between 5 μm and 25 μm.
[0036] Step S130 : masking, forming a mask pattern on the surface of the oxide film, where the mask pattern is located in the etching area of the workpiece.
[0037] In some embodiments, before the workpiece is etched, a masking process is performed to ensure that the desired pattern can be etched in the etching area of the workpiece. In actual operation, a resist with a thickness of 5-10 μm is first applied to the surface of the oxide film of the workpiece. For example, the resist can be set to a photoresist (such as SU-8 model), resin ink, etc. Subsequently, a mask pattern can be formed on the surface of the oxide film of the workpiece using photolithography technology, in which case the exposure wavelength is set to 365 nm and the development time is set to 60-90 s. When photolithography technology is used, the resist can be selected from photoresist. Alternatively, a mask pattern can be formed on the surface of the oxide film of the workpiece using laser direct writing technology, in which case the laser power is set to 50-100 mW and the scanning speed is set to 10-20 mm / s. When laser direct writing technology is used, the resist can be selected from photoresist. It should be noted that after the above treatment, the non-etched area of the workpiece is protected by the resist to prevent the non-etched area of the workpiece from being etched in the subsequent etching process.
[0038] For example, the mask pattern includes but is not limited to being set as leather texture, etc. In the case where the mask pattern is leather texture, photolithography is preferred to form the leather texture on the oxide film surface of the workpiece.
[0039] Step S140 , etching, etching the masked workpiece to etch a pattern consistent with the mask pattern in the etching area.
[0040] In some embodiments, after the masking process is completed on the workpiece, the workpiece can be etched to etch a pattern consistent with the mask pattern in the etched area. Exemplarily, the etching can be done by dry etching or wet etching.
[0041] In some embodiments, when a wet etching process is employed, the masked workpiece is placed in an etching solution, and the etching time and temperature are controlled to ensure that the etching depth of the workpiece reaches a predetermined depth. For example, during the etching process, the etching depth of the workpiece can be monitored in real time using online visual inspection equipment, so that the etching time and temperature can be adjusted in a timely manner to thereby control the etching depth of the workpiece.
[0042] For example, the etching depth of the etched area of the workpiece is the same as the thickness of the oxide film, that is, the thickness of the oxide film of the workpiece is the etching depth of the workpiece. Compared with etching the aluminum alloy layer of the workpiece, such a process setting is beneficial to reducing the Al3+ content in the etching liquid wastewater, thereby improving environmental protection.
[0043] In some embodiments, the etching time is determined by the etching rate of the etching solution and the etching depth of the workpiece, which is conducive to accurately controlling the etching depth of the workpiece and improving the processing accuracy. The current density during the etching process is set to 10-30A / dm 2 , which is beneficial to optimize the etching rate and reduce the uneven etching problem caused by uneven current distribution. It should be noted that the current density setting affects the etching depth. The greater the current density, the deeper the etching depth. The greater the current density, the faster the etching speed and the higher the accuracy. For example, the current density can be set to 11A / dm during the etching process. 2 , 20A / dm 2 , 28A / dm 2 .
[0044] In one example, the etching solution includes at least fluoride and nitrate, wherein the concentration of fluoride can be set to 15%, 18%, 20%, etc., so that the fluoride can provide sufficient reactivity to ensure that the etching rate is within a preset range. The pH value of the etching solution can be set to 1.6, 2.2, 2.8, etc. to avoid excessive corrosion of the base aluminum, and is also conducive to the reaction between the fluoride and the workpiece, further ensuring that the etching rate is within a preset range. Exemplarily, fluorides include but are not limited to ammonium bifluoride, hydrofluoric acid, etc. Nitrates include but are not limited to potassium nitrate, ferric nitrate, etc.
[0045] For example, during the etching process, the etching temperature can be set to 30°C, 41°C, 50°C, etc., which is beneficial for optimizing the reaction rate between the active components in the etching solution and the workpiece material, reducing the etching time, and also helping to improve the uniformity of the workpiece etching. Furthermore, low etching temperatures (30°C-40°C) can improve texture accuracy (such as 0.1mm-level concave and convex details), while high temperatures (40°C-50°C) are suitable for rapid prototyping.
[0046] In some embodiments, the wet etching process utilizes pulsed etching to prevent debris generated during the etching process from remaining on the workpiece and affecting the etching accuracy of the workpiece. For example, the pulsed etching process may involve etching for a first preset time, followed by ultrasonic cleaning for a second preset time, and then etching again for the first preset time, and so on. For example, the first preset time may be set to 30 seconds, and the second preset time may be set to 10 seconds.
[0047] The etching liquid is then filtered and circulated to remove debris from the etching liquid, thereby improving the etching accuracy of the workpiece. For example, the filtering accuracy of the etching liquid can be set to less than or equal to 5 μm.
[0048] In one example, the surface pattern of the workpiece is produced using the data in Table 1 below. See Table 1 for details:
[0049]
[0050]
[0051] Table 1
[0052] Comparing Data 1 and Data 2 in Table 1, when the etching time is less than 5 minutes, the edge precision error of the etched pattern is large, the roughness becomes larger, and the salt spray test time becomes shorter.
[0053] Theoretically, the greater the current density, the faster the etching speed and the higher the precision. From data 5, we can see that the current density is lower than 10A / dm 2 The etching accuracy is affected, which is reflected in the fact that the error of the pattern edge precision reaches -7μm; and from Data 6, it can be seen that the current density exceeds 30A / dm 2 The protective performance of the aluminum alloy was severely damaged, affecting the functional testing of the electronic components inside the laptop, which was specifically reflected in the failure of the salt spray test. It should be noted that the salt spray test must reach 500 hours to pass.
[0054] As shown in Data 7, when the electrolyte concentration exceeds 20%, the aluminum alloy is severely corroded, affecting the functional test of the internal electronic components of the laptop computer. Specifically, the salt spray test results fail and the roughness is also affected.
[0055] From data 1 to data 3, it can be seen that by adopting appropriate etching time, current density, and electrolyte concentration, the etching depth of the workpiece can be matched with the thickness of the oxide film, the pattern edge accuracy can be achieved within ±5μm, and the error between the imitation leather texture roughness Ra value and the real leather roughness (Ra=1.8μm) is less than 10%, significantly improving the surface decoration and texture simulation.
[0056] Step S150, post-processing.
[0057] In some embodiments, the post-processing includes removing the mask, cleaning, neutralizing, and sealing.
[0058] First, the mask is removed and the mask material is removed from the surface of the workpiece.
[0059] The workpiece is then cleaned to remove the residual etching liquid on the surface of the workpiece to prevent further corrosion of the workpiece by the etching liquid; it is also beneficial to remove the residual debris on the surface of the workpiece, ensure the surface of the workpiece is clean, and provide a good foundation for subsequent processes.
[0060] Subsequently, the workpiece is neutralized to prevent the etching solution from continuously corroding the workpiece and protect the surface of the workpiece. After the neutralization treatment, the surface of the workpiece is more stable, which is conducive to the subsequent sealing treatment.
[0061] Finally, the workpiece is sealed to close the surface pores of the workpiece, thereby improving the wear resistance, weather resistance and insulation of the workpiece, which is beneficial to increasing the service life of the workpiece.
[0062] In summary, the present invention provides a process for producing a surface pattern of an aluminum alloy. After surface treatment of a workpiece, the workpiece is anodized to form an oxide film of a certain thickness on the surface of the workpiece; then, the anodized workpiece is masked to produce a mask pattern on the surface of the oxide film, and the mask pattern is located in the etching area of the workpiece; then, the masked workpiece is etched to achieve etching of a pattern consistent with the mask pattern in the etching area of the workpiece, which is beneficial to improving the aesthetics of the surface of the workpiece; finally, the etched workpiece is post-processed to complete the treatment of the surface of the workpiece; by first anodizing and then etching, the need to form a pattern on the surface of the workpiece is achieved, and the need for a metallic texture of the workpiece can also be achieved. When the workpiece is applied to a laptop computer shell, it is also beneficial to the heat dissipation of the laptop computer.
[0063] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.
Claims
1. A process for producing a pattern on an aluminum alloy surface, characterized in that: The process comprises: Pre-treatment; Anodic oxidation forms an oxide film on the surface of the workpiece; A mask is formed on the surface of the oxide film to form a mask pattern, wherein the mask pattern is located in the etching area of the workpiece; Etching, etching the masked workpiece to etch a pattern consistent with the mask pattern in the etching area; Post-processing.
2. The aluminum alloy surface patterning process according to claim 1, characterized in that: The etching adopts a dry etching process or a wet etching process; when the wet etching process is adopted, the masked workpiece is placed in an etching solution, and the etching time and etching temperature are controlled.
3. The aluminum alloy surface patterning process according to claim 2, characterized in that: The etching time is determined by the etching rate of the etching solution and the etching depth of the workpiece, and the current density during the etching process is set to 10-30A / dm 2 .
4. The aluminum alloy surface patterning process according to claim 3, characterized in that: The etching solution at least includes fluoride and nitrate, wherein the concentration of the fluoride is 15%-20%, and the pH value of the etching solution is between 1.5-3.
0.
5. The aluminum alloy surface patterning process according to claim 4, characterized in that: During the etching process, the etching temperature is controlled between 30° C. and 50° C.
6. The aluminum alloy surface patterning process according to claim 3, characterized in that: The thickness of the oxide film is 5-25 μm; During the etching process, the etching depth of the etched region is the same as the thickness of the oxide film.
7. The aluminum alloy surface patterning process according to claim 2, characterized in that: The wet etching process adopts pulse etching, and the etching solution is subjected to a circulation filtering process.
8. The aluminum alloy surface patterning process according to claim 1, characterized in that: The forming of the mask pattern on the surface of the oxide film comprises coating the surface of the oxide film with a resist, and adopting a photolithography technique or a laser direct writing technique to form the mask pattern on the surface of the oxide film.
9. The process for producing aluminum alloy surface patterns according to any one of claims 1 to 8, characterized in that: The pre-treatment includes cleaning, degreasing, and polishing in sequence, wherein after the polishing, the surface roughness of the workpiece is Ra≤0.2um; the post-treatment includes removing the mask, cleaning, neutralization, and sealing in sequence.
10. The process for producing aluminum alloy surface patterns according to any one of claims 1 to 8, characterized in that: The anodizing process adopts a pulse anodizing process, wherein the pulse anodizing process adopts low-temperature thick film oxidation first and then high-temperature micropore expansion.