Circuit board solder paste thickness detection device

Abstract

The invention discloses a circuit board solder paste thickness detection device, relates to the field of solder paste thickness detection, and solves the problem that an existing solder paste thickness detection device is difficult to ensure solder paste level detection. The circuit board solder paste thickness detection device comprises a device shell and a moving block, an electric sliding table is installed on the inner side of the device shell, and a laser and a receiver are arranged at the bottom of the electric sliding table; a roller rod conveying frame is installed on the inner wall of the bottom of the device shell, and a control panel is installed on the outer side of the device shell. The device further comprises a plate fixing mechanism used for correcting, positioning and horizontally lifting the circuit board, the plate fixing mechanism is installed on the inner side of the device shell, and the plate fixing mechanism comprises two push plates arranged on the two sides of the roller rod conveying frame; by means of the plate fixing mechanism, the two push plates can abut against the two sides of the circuit board respectively to achieve centered positioning of the circuit board, then the bottom of the circuit board is lifted, the circuit board is located below a laser and a receiver in a horizontal state, and therefore the horizontal detection effect is achieved.

Description

Technical Field

[0001] The present invention relates to the field of solder paste thickness detection, and in particular to a device for detecting solder paste thickness of a circuit board. Background Art

[0002] Circuit board solder paste is a key material used for soldering electronic components. It is a paste-like mixture formed by mixing solder powder, flux, and other surfactants, thixotropic agents, etc. It is mainly used in the soldering process of surface mount technology and forms a strong electrical and mechanical connection after heating and melting.

[0003] Measuring solder paste thickness is a crucial and essential step in surface mount technology (SMT) production. Solder paste thickness directly determines the amount of tin in the final solder joint. Excessive or insufficient tin can lead to a series of serious soldering defects. Laser thickness gauges are commonly used to measure solder paste thickness. A laser emits a thin laser beam at a specific angle onto the circuit board. A camera then observes the thin line formed by the laser beam on the board. The solder paste's height will differ from its base, creating a certain height difference in the laser line. This height difference can be used to calculate the height difference between the solder paste and the board using trigonometric functions. Existing thickness gauges place the board beneath two lasers for measurement. However, since the pins of electronic components are inserted into the board and then soldered to it, and each pin has varying lengths, it's difficult to maintain a level surface on the top of the board when placed beneath the lasers, affecting the accuracy of the laser's solder paste thickness measurement. Summary of the Invention

[0004] The object of the present invention is to provide a device for detecting the thickness of solder paste on a circuit board to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A circuit board solder paste thickness detection device comprises: a device housing and a moving block arranged on the inner side of the device housing, an electric slide that cooperates with the moving block is fixedly installed on the inner side of the device housing, a laser for emitting laser light to the solder paste and a receiver for receiving reflected light are provided at the bottom of the electric slide, a data signal is transmitted to a computer terminal through the laser and the receiver, thereby detecting the thickness of the solder paste, a roller conveyor frame is fixedly installed on the bottom inner wall of the device housing, and a control panel is fixedly installed on the outer side of the device housing; it also comprises: a fixed plate mechanism for correcting the positioning and horizontal lifting of the circuit board, the fixed plate mechanism is installed on the inner side of the device housing, and the fixed plate mechanism includes two symmetrically arranged rollers. The push plates on both sides of the conveyor frame can correct the positioning of the circuit board to improve the accuracy of the solder paste thickness detection; the stop plate mechanism is used to block and discharge the conveyed circuit board, and the stop plate mechanism is installed on both sides of the roller conveyor frame. The stop plate mechanism includes two baffles symmetrically arranged on both sides of the roller conveyor frame, and the baffles can block the circuit board in the conveying state, so that the laser and the receiver can detect the thickness of the solder paste on the circuit board; the angle adjustment mechanism is used to synchronously adjust the laser and the receiver, and the angle adjustment mechanism is installed at the bottom of the moving block. The angle adjustment mechanism includes a turntable arranged at the bottom of the moving block, and the turntable can synchronously adjust the angles of the laser and the receiver.

[0006] The two levers have the inner wall of the two guide rails respectively fixed to the two guide rails on the two outer walls of the two guide rails, the two guide rails respectively have a first end and a second end which is fixed to the two guide rails on the two outer walls of the two guide rails.

[0007] Preferably, the stop plate mechanism also includes a positioning slide fixedly mounted on the outside of the mounting box, the two baffles are slidably mounted on the outsides of the two positioning slides, the mounting box is provided with a mounting groove on the side close to the positioning slide, and a positioning rod is rotatably mounted on the inner side of the mounting groove, a one-way gear is fixedly mounted on the outside of the positioning rod, a one-way rack matching the one-way gear is fixedly mounted on the side of the baffle close to the mounting box, two symmetrically distributed driven gears are fixedly mounted on the outside of the positioning rod, and two symmetrically distributed second racks are fixedly mounted on the side of the push plate close to the mounting box, the second racks slide and extend to the inside of the mounting box, and the two second racks are respectively on the same horizontal line with the two driven gears, and two symmetrically distributed springs are fixedly mounted between the outside of the baffle and one end of the positioning slide.

[0008] Preferably, the angle adjustment mechanism also includes a first motor fixedly mounted on the top of the moving block, the output end of the first motor is fixedly connected to the top of the turntable, two symmetrically distributed mounting seats are fixedly mounted on the bottom of the turntable, an adjusting rod is rotatably mounted on the inner side of the mounting seat, a connecting plate is fixedly mounted on the outer side of the adjusting rod, the two connecting plates are respectively fixedly connected to the outer sides of the laser and the receiver, a second motor is fixedly mounted on the bottom of the turntable, and the output end of the second motor is fixedly connected to the adjacent adjusting rod, and a synchronous belt is rotatably mounted between the two adjusting rods.

[0009] Preferably, two symmetrically distributed transparent observation windows are installed on the outer side of the device housing.

[0010] Preferably, a plurality of rubber pads distributed at equal distances are fixedly mounted on a side of the push plate away from the push rod.

[0011] Preferably, two symmetrically distributed sleeves are fixedly mounted on the inner side of the installation box, and the outer side of the installation rod is connected to the two sleeves respectively through two coil springs.

[0012] Preferably, a buffer plate is fixedly installed in the movable groove of the installation box, and the side of the rocker arm away from the top plate is in contact with the outer side of the buffer plate.

[0013] Preferably, a sliding sleeve is fixedly mounted on the outer side of the second rack, and a sliding rod for limiting the sliding of the sliding sleeve is fixedly mounted on the inner side of the installation box.

[0014] Preferably, a baffle is fixedly installed between the two mounting seats, and the synchronous belt is located on the inner side of the baffle.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention uses a fixed plate mechanism to first make the two push plates respectively press against the two sides of the circuit board to achieve the center positioning of the circuit board, and then lift the bottom of the circuit board to make the circuit board horizontal and under the laser and receiver, thereby achieving the effect of horizontal detection and ensuring the accuracy of the laser and receiver in detecting the thickness of the solder paste.

[0016] 2. The present invention uses a stop plate mechanism to enable the circuit board to contact the two baffles when the roller conveyor frame conveys the circuit board, and the circuit board can stay directly below the laser and the receiver. When the laser and the receiver complete the detection of the solder paste thickness on the circuit board and the top plate is away from the bottom of the circuit board, the two baffles can move away from the circuit board, allowing the roller conveyor frame to convey and discharge the circuit board, thereby facilitating the sequential detection and conveying of multiple circuit boards.

[0017] 3. The present invention uses an angle adjustment mechanism to enable the first motor to cooperate with the turntable to adjust the position of the laser and the receiver, thereby realizing the adjustment of the laser emission position. In conjunction with the electric slide and the moving block, it is convenient to detect the thickness of multiple solder pastes on the circuit board, and the two connecting plates drive the height adjustment of the laser and the receiver to ensure that the distance between the laser and circuit boards of greater thickness remains consistent, thereby improving the detection efficiency of solder paste on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the roller conveyor frame and push plate structure of the present invention; Figure 3 This is a schematic diagram of the laser and receiver structure of the present invention; Figure 4 Schematic diagram of the structure of the swing rod and the top plate in the present invention; Figure 5 Schematic diagram of the mounting plate and push rod structure in the present invention; Figure 6 Schematic diagram of the mounting rod and arc-shaped rack structure in the present invention; Figure 7 Schematic diagram of the positioning slide and driven gear structure of the present invention; Figure 8 It is a schematic diagram of the one-way gear and positioning rod structure in the present invention.

[0019] In the figure: 1. device housing; 2. moving block; 3. electric slide; 4. laser; 5. receiver; 6. roller conveyor frame; 7. control panel; 8. push plate; 9. baffle; 10. turntable; 11. mounting box; 12. electric telescopic rod; 13. mounting plate; 14. push rod; 15. mounting rod; 16. rocker arm; 17. arc rack; 18. first rack; 19. top plate; 20. positioning slide; 21. positioning rod; 22. one-way gear; 23. one-way rack; 24. driven gear; 25. second rack; 26. spring; 27. first motor; 28. mounting seat; 29. ​​adjusting rod; 30. connecting plate; 31. second motor; 32. synchronous belt; 33. transparent observation window; 34. rubber pad; 35. sleeve; 36. buffer pad; 37. sliding sleeve; 38. slide rod; 39. baffle frame. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-8 , a circuit board solder paste thickness detection device shown in the figure includes a device housing 1 and a moving block 2 arranged on the inner side of the device housing 1, an electric slide 3 that cooperates with the moving block 2 is fixedly installed on the inner side of the device housing 1, and a laser 4 for emitting laser light to the solder paste and a receiver 5 for receiving reflected light are provided at the bottom of the electric slide 3. The laser 4 can emit laser light to the solder paste and reflect it onto the receiver 5, and transmit the data signal to the computer end, thereby detecting the thickness of the solder paste, thereby obtaining the thickness of the solder paste, so that the electric slide 3 can drive the moving block 2 to move horizontally, realize the position adjustment of the laser 4 and the receiver 5, and facilitate the thickness detection of multiple solder pastes on the circuit board. A roller conveyor frame 6 is fixedly installed on the inner wall of the bottom of the device housing 1, and the circuit board to be detected is transported to the bottom of the laser 4 and the receiver 5 by the roller conveyor frame 6. A control panel 7 is fixedly installed on the outer side of the device housing 1 for displaying the detection data; it also includes: a fixed plate mechanism for correcting the positioning and horizontal lifting of the circuit board, and the fixed plate mechanism is installed on the inner side of the device housing 1.

[0022] The plate fixing mechanism includes two push plates 8 symmetrically arranged on both sides of the roller conveyor frame 6. The push plates 8 can correct and position the circuit board to improve the accuracy of solder paste thickness detection. The plate fixing mechanism also includes two mounting boxes 11 symmetrically fixedly mounted on the inner side of the device housing 1. The two push plates 8 are respectively located on the outside of the two mounting boxes 11. An electric telescopic rod 12 is fixedly mounted on the side of the mounting box 11 away from the push plates 8. The output end of the electric telescopic rod 12 extends to the inner side of the mounting box 11 and is fixedly mounted with a mounting plate 13. A plurality of push rods 14 distributed at equal distances are fixedly mounted between the side of the mounting plate 13 away from the electric telescopic rod 12 and the outer side of the push plate 8, and the push rod 14 slides through the mounting box 11 so that the electric telescopic rod 12 can pass through the mounting plate 1 3 drives multiple push rods 14 to move synchronously, and the push rods 14 can push the push plate 8 close to the outer side of the circuit board, so that the two push plates 8 push the outer side of the circuit board synchronously to achieve the centering of the circuit board. A mounting rod 15 is rotatably installed on the inner side of the mounting box 11, and a plurality of swing rods 16 are fixedly installed on the outer side of the mounting rod 15, which are respectively located directly below the push rods 14. The end of the swing rod 16 away from the mounting rod 15 extends to the outside of the mounting box 11, and a moving groove for the swing rod 16 to limit the sliding of the swing rod 16 is opened on the outside of the mounting box 11. An arc-shaped rack 17 is fixedly installed on the end of the swing rod 16 close to the mounting rod 15, and a first rack 18 is fixedly installed on the bottom of the push rod 14, so that when the electric telescopic rod 12 pulls the push plate 8 close to the outer side of the mounting box 11, the push rod 14 can The first rack 18 can drive the first rack 18 to contact the arc-shaped rack 17, and the first rack 18 can drive the swing rod 16 to swing through the arc-shaped rack 17, so that the swing rod 16 is upward and close to the bottom of the circuit board. A top plate 19 is fixedly installed between the multiple swing rods 16, so that when the swing rod 16 swings, the circuit board can be lifted up and away from the roller conveyor 6 through the top plate 19, so that the circuit board can be horizontally placed below the laser 4 and the receiver 5, thereby realizing the centering and horizontal lifting of the circuit board. Two symmetrically distributed transparent observation windows 33 are installed on the outside of the device housing 1 to facilitate observation of the detection of the solder paste. A plurality of equidistantly distributed rubber pads 34 are fixedly installed on the side of the push plate 8 away from the push rod 14, so that the push plate 8 can pass through the rubber pads 34 and The outer side of the circuit board is in contact with each other to prevent damage to the circuit board. Two symmetrically distributed sleeves 35 are fixedly installed on the inner side of the installation box 11. The outer side of the installation rod 15 is respectively connected to the two sleeves 35 through two coil springs, so that when the rocker arm 16 drives the installation rod 15 to rotate, the installation rod 15 can contract the coil spring. When the first rack 18 is away from the arc-shaped rack 17, the rebound force of the coil spring can be used to rotate and reset the installation rod 15, so that the rocker arm 16 is away from the circuit board. A buffer plate 36 is fixedly installed in the movable groove of the installation box 11, and the side of the rocker arm 16 away from the top plate 19 is in contact with the outer side of the buffer plate 36, so that when the rocker arm 16 swings and resets, it can contact the outer side of the buffer plate 36, providing protection for the reset of the rocker arm 16.

[0023] In this application, the push plate 8 is used to clamp and position the circuit board from the side to achieve position correction of the circuit board, and then the circuit board is lifted through the position where there are no pins on the side to achieve horizontal placement of the circuit board, thereby solving the problem of inconsistent pin heights at the bottom of the circuit board, which affects the accuracy of the laser 4 in detecting the thickness of the solder paste.

[0024] Example 2: Please refer to Figure 2-Figure 8 , this embodiment further explains Example 1. The stop mechanism in the figure includes two baffles 9 symmetrically arranged on both sides of the roller conveyor frame 6. The baffles 9 can block the circuit board in the conveying state, so that the laser 4 and the receiver 5 can detect the thickness of the solder paste on the circuit board. The stop mechanism also includes a positioning slide 20 fixedly installed on the outside of the installation box 11. The two baffles 9 are slidably installed on the outside of the two positioning slides 20 respectively. A mounting groove is provided on the side of the installation box 11 close to the positioning slide 20, and a positioning rod 21 is rotatably installed on the inner side of the mounting groove. A one-way gear 22 is fixedly installed on the outside of the positioning rod 21. A one-way rack 23 that cooperates with the one-way gear 22 is fixedly installed on the side of the baffle 9 close to the installation box 11, so that the one-way gear 22 drives the baffle 9 along the positioning The outer side of the slide 20 moves unidirectionally, and two symmetrically distributed driven gears 24 are fixedly installed on the outer side of the positioning rod 21. Two symmetrically distributed second racks 25 are fixedly installed on the side of the push plate 8 close to the mounting box 11. The second racks 25 slide and extend to the inner side of the mounting box 11, and the two second racks 25 are respectively on the same horizontal line with the two driven gears 24. Two symmetrically distributed springs 26 are fixedly installed between the outer side of the baffle 9 and one end of the positioning slide 20, so that when the push plate 8 moves away from the circuit board and approaches the outer side of the mounting box 11, it can drive the second rack 25 to contact the driven gear 24. The second rack 25 drives the positioning rod 21 to rotate through the driven gear 24, and the positioning rod 21 drives the one-way gear 22 to rotate, so that the one-way gear 22 is idling and cannot drive the one-way rack 23 to move. When the push plate 8 is away from the installation box 11, the second rack 25 drives the driven gear 24 to rotate in the opposite direction, and the driven gear 24 can drive the one-way gear 22 to rotate in the opposite direction through the positioning rod 21, so that the one-way gear 22 drives the one-way rack 23 to move, and the one-way rack 23 can drive the baffle 9 away from the circuit board and compress the spring 26. The roller conveyor frame 6 can convey the circuit board after the inspection is completed, and when the second rack 25 is disengaged from the driven gear 24, the rebound force of the spring 26 is used to move the baffle 9 to reset, so as to block the next circuit board. The outer side of the second rack 25 is fixedly installed with a sliding sleeve 37, and the inner side of the installation box 11 is fixedly installed with a sliding rod 38 for limiting the sliding of the sliding sleeve 37. When the second rack 25 moves, it can drive the sliding sleeve 37 to move along the outer side of the sliding rod 38, thereby improving the stability of the movement of the second rack 25.

[0025] Example 3: Please refer to Figure 2 and Figure 3 , this embodiment is further explained for other embodiments. The angle adjustment mechanism in the figure includes a turntable 10 arranged at the bottom of the moving block 2, and the turntable 10 can synchronously adjust the angles of the laser 4 and the receiver 5. The angle adjustment mechanism also includes a first motor 27 fixedly mounted on the top of the moving block 2, and the output end of the first motor 27 is fixedly connected to the top of the turntable 10. Two symmetrically distributed mounting seats 28 are fixedly mounted on the bottom of the turntable 10. An adjusting rod 29 is rotatably mounted on the inner side of the mounting seat 28, and a connecting plate 30 is fixedly mounted on the outer side of the adjusting rod 29. The two connecting plates 30 are respectively fixedly connected to the outer sides of the laser 4 and the receiver 5. A second motor 31 is fixedly mounted on the bottom of the turntable 10, and the output end of the second motor 31 is fixedly connected to the adjacent adjusting rod 29, so that the second motor 31 can be rotated. The two motors 31 can drive the corresponding adjusting rods 29 to rotate. A synchronous belt 32 is installed between the two adjusting rods 29 to rotate synchronously, and respectively drive the two connecting plates 30 to swing synchronously. As the connecting plates 30 swing, the heights of the laser 4 and the receiver 5 can be adjusted, so that the laser 4 and the receiver 5 can detect the thickness of the solder paste on circuit boards of thicker thicknesses, and the first motor 27 drives the turntable 10 to rotate, and cooperates with the electric slide 3 and the moving block 2 to adjust the emission position of the laser 4, so as to facilitate accurate thickness detection of multiple solder pastes on the circuit board. A baffle frame 39 is fixedly installed between the two mounting seats 28, and the synchronous belt 32 is located on the inner side of the baffle frame 39, so that the baffle frame 39 provides protection for the synchronous belt 32.

[0026] Working principle: First, the staff puts the circuit board to be tested on the front end of the roller conveyor 6, and the roller conveyor 6 drives the circuit board to be transported in the direction of the baffle 9, so that the circuit board contacts the outer sides of the two baffles 9. At this time, the two electric telescopic rods 12 push the corresponding mounting plate 13 to move in the direction of the circuit board, so that the mounting plate 13 drives multiple push rods 14 to move synchronously, and multiple push rods 14 move along the inner side of the mounting box 11 and push the push plate 8 to contact the outer side of the circuit board, so that the two push plates 8 correct the circuit board to the center. Subsequently, the electric telescopic rod 12 pulls the mounting plate 13 back, so that the mounting plate 13 drives the push plate 8 to contact the outer side of the mounting box 11 through the push rod 14. At this time, the push rod 14 drives the first rack 18 to contact the arc-shaped rack 17 on the rocker 16. The first rack 18 drives the rocker 16 to swing upward through the arc-shaped rack 17, so that the rocker 16 lifts the circuit board through the top plate 19 and away from the roller conveyor 6. The circuit board can be placed below the laser 4 and the receiver 5 in a horizontal and centered state. The laser 4 emits laser light to the solder paste on the circuit board and reflects the laser light to the receiver 5. The thickness of the solder paste is calculated by the receiver 5. In addition, the electric slide 3 drives the moving block 2 to move, so that the moving block 2 drives the two mounting seats 28 to move through the turntable 10, and the two mounting seats 28 drive the corresponding connecting plates 30 to move. The two connecting plates 30 drive the laser 4 and the receiver 5 to move respectively, and the first motor 27 drives the turntable 10 to rotate, so that the laser 4 and the receiver 5 can detect the thickness of multiple solder pastes on the circuit board. Finally, the electric telescopic rod 12 pushes the push plate 8 away from the mounting box 11 through the mounting plate 13 and the push rod 14. The first rack 18 on the push rod 14 drives the rocker 16 to swing downward and reset through the arc-shaped rack 17, so that the top plate 19 puts the circuit board back to the top of the roller conveyor 6. At the same time, the push plate 8 drives the second rack 25 to move, so that the second rack 25 drives the driven gear 24 to rotate, and the driven gear 24 drives the one-way gear 22 to rotate through the positioning rod 21, so that the one-way gear 2 2 drives the one-way rack 23 to move, and the one-way rack 23 drives the baffle 9 to move along the outer side of the positioning slide 20, so that the baffle 9 is away from the circuit board and compresses the spring 26. The roller conveyor frame 6 can then convey the circuit board that has been inspected out, and when the second rack 25 is out of meshing with the driven gear 24, the rebound force of the spring 26 is used to push the baffle 9 to move along the outer side of the positioning slide 20 and reset. The staff can then place the next circuit board to be inspected on the roller conveyor frame 6, so that the circuit board contacts the two baffles 9, which is convenient for conveying multiple circuit boards in sequence, thereby facilitating the level detection of the solder paste on the circuit boards and ensuring the accuracy of the solder paste thickness detection on the circuit boards.

[0027] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0028] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and alterations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board solder paste thickness detection device, characterized in that: include: A device housing (1) and a moving block (2) arranged on the inner side of the device housing (1); an electric slide (3) is fixedly installed on the inner side of the device housing (1); a laser (4) for emitting laser light to the solder paste and a receiver (5) for receiving reflected light are arranged at the bottom of the electric slide (3); a data signal is transmitted to a computer terminal through the laser (4) and the receiver (5), thereby detecting the thickness of the solder paste; a roller conveyor frame (6) is installed on the inner wall of the bottom of the device housing (1); and a control panel (7) is installed on the outer side of the device housing (1); Also includes: A fixed plate mechanism is used for correcting the positioning and horizontally lifting the circuit board. The fixed plate mechanism is installed on the inner side of the device housing (1). The fixed plate mechanism includes two push plates (8) arranged on both sides of the roller conveyor frame (6). The push plates (8) can correct the positioning of the circuit board and improve the accuracy of solder paste thickness detection. A stop plate mechanism is used for blocking and discharging the conveyed circuit board, and the stop plate mechanism is installed on both sides of the roller conveyor frame (6). The stop plate mechanism includes two baffles (9) arranged on both sides of the roller conveyor frame (6). The baffles (9) can block the circuit board in the conveying state, so that the laser (4) and the receiver (5) can perform thickness detection processing on the solder paste on the circuit board.

2. The circuit board solder paste thickness detection device according to claim 1, characterized in that: The fixed plate mechanism also includes two mounting boxes (11) mounted on the inner side of the device housing (1), the two push plates (8) are respectively located on the outer sides of the two mounting boxes (11), an electric telescopic rod (12) is mounted on one side of the mounting box (11), an output end of the electric telescopic rod (12) is mounted on a mounting plate (13), a plurality of push rods (14) are fixedly mounted between one side of the mounting plate (13) and the outer side of the push plate (8), a mounting rod (15) is rotatably mounted on the inner side of the mounting box (11), a plurality of rocking rods (16) are respectively mounted on the outer side of the mounting rod (15) and are located directly below the push rods (14), and a movable groove for limiting the sliding of the rocking rods (16) is opened on the outer side of the mounting box (11), an arc-shaped rack (17) is mounted on one end of the rocking rod (16), a first rack (18) is fixedly mounted on the bottom of the push rod (14), and a top plate (19) is mounted between the plurality of rocking rods (16).

3. The circuit board solder paste thickness detection device according to claim 2, characterized in that: The stop plate mechanism also includes a positioning slide (20) installed on the outside of the installation box (11), and the two baffles (9) are slidably installed on the outside of the two positioning slides (20), one side of the installation box (11) is provided with a mounting groove, and a positioning rod (21) is rotatably installed on the inner side of the mounting groove, and a one-way gear (22) is fixedly installed on the outside of the positioning rod (21), and the baffle (9) is installed with a one-way rack (23) matched with the one-way gear (22), and two driven gears (24) are installed on the outside of the positioning rod (21), and two symmetrically distributed second racks (25) are fixedly installed on one side of the push plate (8), and the second racks (25) slide and extend to the inside of the installation box (11), and two springs (26) are fixedly installed between the outside of the baffle (9) and one end of the positioning slide (20), and the bottom of the moving block (2) also includes an angle adjustment mechanism for synchronously adjusting the laser (4) and the receiver (5).

4. The circuit board solder paste thickness detection device according to claim 3, characterized in that: The angle adjustment mechanism includes a turntable (10) arranged at the bottom of the moving block (2), and the turntable (10) can synchronously adjust the angles of the laser (4) and the receiver (5). A first motor (27) is installed on the top of the moving block (2), and the output end of the first motor (27) is fixedly connected to the top of the turntable (10). Two mounting seats (28) are fixedly installed on the bottom of the turntable (10), and an adjustment rod (29) is rotatably installed on the inner side of the mounting seat (28). A connecting plate (30) is fixedly installed on the outer side of the adjustment rod (29), and the two connecting plates (30) are respectively fixedly connected to the outer sides of the laser (4) and the receiver (5). A second motor (31) is installed on the bottom of the turntable (10), and the output end of the second motor (31) is fixedly connected to the adjacent adjustment rod (29). A synchronous belt (32) is rotatably installed between the two adjustment rods (29).

5. The circuit board solder paste thickness detection device according to claim 1, characterized in that: Two transparent observation windows (33) are installed on the outside of the device housing (1).

6. The circuit board solder paste thickness detection device according to claim 1, characterized in that: A plurality of rubber pads (34) are fixedly mounted on one side of the push plate (8).

7. The circuit board solder paste thickness detection device according to claim 2, characterized in that: Two sleeves (35) are installed on the inner side of the installation box (11), and the outer side of the installation rod (15) is connected to the two sleeves (35) respectively through two coil springs.

8. The circuit board solder paste thickness detection device according to claim 2, characterized in that: A buffer plate (36) is installed in the movable groove of the installation box (11), and one side of the swing rod (16) is in contact with the outer side of the buffer plate (36).

9. The circuit board solder paste thickness detection device according to claim 4, characterized in that: A sliding sleeve (37) is installed on the outer side of the second rack (25), and a sliding rod (38) for limiting the sliding of the sliding sleeve (37) is installed on the inner side of the installation box (11).

10. The circuit board solder paste thickness detection device according to claim 4, characterized in that: A baffle (39) is installed between the two mounting seats (28), and the synchronous belt (32) is located inside the baffle (39).

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