Electronic device

Abstract

The invention relates to an electronic device. An electronic device according to an embodiment may include: a display module defining a first non-folding area, a folding area, and a second non-folding area in sequence along a first direction, and including a display panel; the window body module is arranged above the display module; and a lower plate disposed below the display module, defining at least one pattern overlapping the folding region, and being a glass substrate. The window module may include a thin film glass and a coating layer having a thickness of 50 [mu] m or more and 110 [mu] m or less. The coating layer may have an elastic modulus of 500 MPa or more and 2000 MPa or less, and the thickness at a first elastic modulus of 500 MPa or more and less than 2000 MPa is 80 [mu] m or more and 100 [mu] m or less.

Description

Technical Field

[0001] The invention relates to an electronic device with improved product reliability. Background Art

[0002] Display devices display various images on a display screen to provide information to users. Typically, display devices display information within a designated screen. Recently, flexible display devices, including foldable flexible display panels, are being developed. Unlike rigid display devices, flexible display devices can be folded, rolled, or bent. Flexible display devices with a variety of shape changes can be carried without being restricted by conventional screen size, thereby improving user convenience. Summary of the Invention

[0003] An object of the present invention is to provide an electronic device with excellent folding properties and improved product reliability.

[0004] An object of the present invention is to provide a method for manufacturing a display device with simplified process.

[0005] Alternatively, an electronic device according to an embodiment includes: a display module defining a first non-folding region, a folding region, and a second non-folding region in sequence along a first direction, and including a display panel; a window module disposed above the display module; and a lower plate disposed below the display module, defining at least one pattern overlapping with the folding region, and being a glass substrate. Alternatively, the window module includes: a thin film glass disposed above the display module; and a coating disposed above the thin film glass, having a thickness of 50 μm to 110 μm. Alternatively, the coating has an elastic modulus of 500 MPa to 2000 MPa, and the thickness is 80 μm to 100 μm at a first elastic modulus of 500 MPa to less than 2000 MPa.

[0006] The coating layer may have a thickness of 90 μm to 110 μm at a second elastic modulus of 500 MPa to 1000 MPa.

[0007] The coating layer may have a thickness of 70 μm or more and less than 90 μm at a third elastic modulus of more than 1000 MPa and less than 2000 MPa.

[0008] The coating layer may have a thickness of 80 μm or more and 100 μm or less.

[0009] Alternatively, the coating layer may be directly disposed on the film glass.

[0010] Alternatively, the window module further includes a hard coating layer disposed on the coating layer.

[0011] The display module may have a torque of less than 150 N·mm.

[0012] It may be that the thickness of the lower plate is smaller than the thickness of the coating layer.

[0013] The pattern may pass through from the lower surface of the lower plate toward the upper surface of the lower plate.

[0014] The lower plate may include: a base substrate defining the pattern; and at least one of a functional layer disposed on an upper surface of the base substrate and a protective layer disposed on a lower surface of the base substrate, wherein the base substrate comprises glass.

[0015] Alternatively, the upper surface of the lower plate may be in direct contact with the lower surface of the display panel.

[0016] Alternatively, the electronic device further includes an adhesive layer disposed between the lower plate and the display module, and the lower plate is bonded to the bottom of the display panel via the adhesive layer.

[0017] The pattern may include a plurality of holes extending along a second direction intersecting the first direction, the plurality of holes including first holes and second holes spaced apart in the first direction, and the first holes and the second holes are arranged to be staggered with each other.

[0018] Alternatively, a method for manufacturing an electronic device in one embodiment includes forming a lower plate of a glass substrate, forming a display module including a display panel and sequentially defining a first non-folding region, a folding region, and a second non-folding region along a first direction, and forming a window module including a thin film glass and a coating. Alternatively, forming the window module includes providing a coating material on the thin film glass to form the coating with a thickness of 50 μm to 110 μm, the coating having an elastic modulus of 500 MPa to 2000 MPa, and the thickness being 80 μm to 100 μm at a first elastic modulus of 500 MPa to less than 2000 MPa.

[0019] According to the above, an electronic device according to an embodiment may include a window module in which a coating having a specific modulus is directly disposed on a film glass, thereby exhibiting excellent folding characteristics and reliability such as impact resistance.

[0020] In addition, since the lower plate of the electronic device according to one embodiment is directly disposed below the display panel, a protective film, a cover film, a metal plate, etc. can be omitted between the display panel and the lower plate.

[0021] Furthermore, the electronic device manufacturing method of one embodiment allows for the coating layer protecting the thin film glass to be formed directly on the thin film glass without requiring an adhesive layer or a cohesive layer. Furthermore, the lower component protecting the display panel can be formed using the lower substrate without removing the preliminary lower substrate used to transport or support the base layer of the display panel. Therefore, utilizing the display device manufacturing method of one embodiment can simplify the process, reduce manufacturing costs, and reduce the weight of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1a FIG. 1 is a perspective view of an electronic device in an unfolded state according to an embodiment of the present invention.

[0023] Figure 1b FIG. 1 is a perspective view illustrating a folding operation of an electronic device according to an embodiment.

[0024] Figure 1c FIG. 4 is a plan view of an electronic device in a folded state according to an embodiment.

[0025] Figure 1d FIG. 1 is a perspective view illustrating a folding operation of an electronic device according to an embodiment.

[0026] Figure 2 is an exploded perspective view of an electronic device according to an embodiment.

[0027] Figure 3 is a cross-sectional view of a display device according to an embodiment of the present invention.

[0028] Figure 4 is a plan view showing a partial structure of a display device according to an embodiment.

[0029] Figure 5 is a cross-sectional view of a display panel according to an embodiment.

[0030] Figure 6 is a cross-sectional view illustrating a partial structure of a display device according to an embodiment.

[0031] Figures 7a to 7e are cross-sectional views respectively showing a portion of the structure of a display device according to an embodiment.

[0032] Figures 8a to 8e is a cross-sectional view illustrating a portion of a method for manufacturing a display device according to an embodiment.

[0033] Figures 9a to 9e is a cross-sectional view illustrating a portion of a method for manufacturing a display device according to an embodiment.

[0034] Figures 10a to 10e is a cross-sectional view illustrating a portion of a method for manufacturing a display device according to an embodiment.

[0035] (Explanation of Reference Numerals)

[0036] DD: Display device DP: Display panel

[0037] NFA1: First non-folding area NFA2: Second non-folding area

[0038] FA: Folding area UP, UP-a: Lower plate

[0039] WM: Window Module UT: Thin Film Glass

[0040] HO: Pattern CL: Coating DETAILED DESCRIPTION

[0041] In this specification, when any component (or region, layer, part, etc.) is mentioned as being "on", "connected" or "combined with" other components, it means that it can be directly configured / connected / combined with other components or a third component can be configured between them.

[0042] The same reference numerals refer to the same components. In addition, in the drawings, the thickness, proportions, and sizes of the components are exaggerated for the purpose of effectively explaining the technical content. "And / or" includes all combinations of more than one possible combination of the related structures.

[0043] Terms such as "first" and "second" may be used to describe various constituent elements, but these constituent elements are not limited by these terms. These terms are used solely to distinguish one constituent element from other constituent elements. For example, without departing from the scope of the present invention, the first constituent element may be named the second constituent element, and similarly, the second constituent element may be named the first constituent element. Unless the context clearly indicates otherwise, expressions in the singular include expressions in the plural.

[0044] In addition, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationship between components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0045] Terms such as "including" or "having" should be understood as specifying the existence of the features, numbers, steps, tasks, constituent elements, accessories or combinations thereof recorded in the specification, and do not preclude the existence or additional possibility of one or more other features or numbers, steps, tasks, constituent elements, accessories or combinations thereof.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meanings as those commonly understood by those skilled in the art to which the present invention pertains. Furthermore, terms that are the same as those defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant art, and should not be interpreted as having overly idealized or overly formalized meanings unless expressly defined herein.

[0047] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0048] Figure 1a FIG. 1 is a perspective view of an electronic device ED in an unfolded state (or unfolded state) according to an embodiment of the present invention. Figure 1b 1 is a perspective view illustrating a folding operation of the electronic device ED according to an embodiment of the present invention. Figure 1c FIG. 1 is a plan view showing a folded state of the electronic device ED according to an embodiment of the present invention. Figure 1d 1 is a perspective view illustrating a folding operation of the electronic device ED according to an embodiment of the present invention.

[0049] Reference Figure 1a The electronic device ED may be a device activated by an electrical signal. The electronic device ED may include various embodiments. For example, the electronic device ED may include a tablet computer, a notebook computer, a computer, a smart TV, etc. In this embodiment, the electronic device ED is exemplarily shown as a smart phone.

[0050] The electronic device ED may include a first display surface FS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED may display an image IM toward a third direction DR3 through the first display surface FS. The first display surface FS displaying the image IM may correspond to the front surface of the electronic device ED. The image IM may include a dynamic image as well as a static image. Figure 1a , a web search window, a clock window, and a plurality of application programs are shown as examples of the image IM.

[0051] Hereinafter, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In this specification, "on a plane" may be defined as a state viewed in the third direction DR3.

[0052] In this specification, the top (or front) and bottom (or back) of each structure are defined based on the direction in which the image IM is displayed. The front and back may be opposite each other in the third direction DR3, and the normal direction of each of the front and back may be parallel to the third direction DR3.

[0053] The distance between the front and back sides in the third direction DR3 may correspond to the thickness / height of the electronic device ED in the third direction DR3. On the other hand, the directions indicated by the first to third directions DR1, DR2, and DR3 may be relative concepts and transformed into other directions.

[0054] The electronic device ED can sense external input applied to the electronic device ED. The external input can include various forms of input provided from outside the electronic device ED. For example, the external input can include contact with a part of the user's body, such as a hand, as well as external input applied while being close to or adjacent to the electronic device ED at a predetermined distance (e.g., hovering). The external input can take various forms, such as force, pressure, temperature, and light.

[0055] Figure 1a The external input through the user's pen SS is exemplarily shown. Although not shown, the pen SS can be installed and removed inside or outside the electronic device ED, and the electronic device ED can provide and receive signals corresponding to the installation and removal of the pen SS.

[0056] The electronic device ED may include a first display surface FS and a second display surface RD. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RD may be defined as a surface opposite to at least a portion of the first display surface FS.

[0057] The first active area F-AA may be an area activated by an electrical signal, and may be an area that can display an image IM or sense input from the pen SS.

[0058] The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a predetermined color. The first peripheral area F-NAA may surround the first active area F-AA. Thus, the shape of the first active area F-AA may be substantially defined by the first peripheral area F-NAA. However, this is exemplary, and the first peripheral area F-NAA may be disposed adjacent to only one side of the first active area F-AA or may be omitted.

[0059] The electronic module area EMA can be configured with various electronic modules. For example, the electronic module may include at least one of a camera, a speaker, a light sensor, and a heat sensor. The electronic module area EMA can sense external objects received through the display surfaces FS and RD or provide sound signals such as sounds to the outside through the display surfaces FS and RD. The electronic module can also include multiple structures and is not limited to any one embodiment.

[0060] The electronic module area EMA may be surrounded by the first peripheral area F-NAA. However, this is exemplary and not limited to any one embodiment. For example, the electronic module area EMA may be surrounded by the first active area F-AA and the first peripheral area F-NAA, and the electronic module area EMA may be disposed within the first active area F-AA.

[0061] According to an embodiment, the electronic device ED may include at least one folding area FA and a plurality of non-folding areas NFA1 and NFA2 extending from the folding area FA. For example, a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 may be defined along a first direction DR1. That is, the first non-folding area NFA1 may extend from the folding area FA in a direction opposite to the first direction DR1, and the second non-folding area NFA2 may extend from the folding area FA along the first direction DR1. The folding area FA may be adjacent to the first non-folding area NFA1 and the second non-folding area NFA2, with a folding axis AX1 (refer to FIG. 1 ) and a folding axis AX2 (refer to FIG. 1 ). Figure 1b ) or folding axis AX2 (refer to Figure 1d ) is used as the reference for folding.

[0062] Reference Figure 1b According to one embodiment, the electronic device ED can be folded about a first folding axis AX1 extending in a second direction DR2. In the folded state, the folding area FA of the electronic device ED can have a predetermined curvature and radius of curvature. The electronic device ED can be folded about the first folding axis AX1 and deformed into an in-folding state, with the first non-folding area NFA1 and the second non-folding area NFA2 facing each other, and the first display surface FS not being exposed to the outside.

[0063] Figure 1c FIG. 1 is a plan view of an electronic device ED in a folded state according to an embodiment of the present invention.

[0064] Reference Figure 1c According to one embodiment, the electronic device ED can be viewed by a user through its second display surface RD when folded inward. In this case, the second display surface RD may include a second active area R-AA that displays an image. The second active area R-AA may be activated by an electrical signal. The second active area R-AA may be capable of displaying images and sensing various forms of external input.

[0065] The second peripheral area R-NAA may be adjacent to the second active area R-AA. The second peripheral area R-NAA may have a predetermined color. The second peripheral area R-NAA may surround the second active area R-AA. Furthermore, although not shown, the second display surface RD may also include an electronic module area configured with electronic modules having various structures, and is not limited to any one embodiment.

[0066] Figure 1d 1 is a perspective view illustrating a folding operation of the electronic device ED according to an embodiment of the present invention.

[0067] Reference Figure 1d According to one embodiment, the electronic device ED can be folded about a second folding axis AX2 extending in a second direction DR2. The electronic device ED can be folded about the second folding axis AX2 and deformed into an outward-folding state, with the first display surface FS exposed to the outside. In one embodiment, the electronic device ED can be configured to repeatedly fold from an unfolding state to an inward-folding state or an outward-folding state, but is not limited thereto.

[0068] exist Figures 1a to 1d Although folding is performed based on one folding axis AX1 or folding axis AX2, the number of folding axes and the number of unfolding areas based on the folding axes are not limited thereto. For example, the display device may be folded based on multiple folding axes so that a portion of each of the first display surface FS and the second display surface RD faces each other.

[0069] Figure 2 FIG is an exploded perspective view of an electronic device ED according to an embodiment. Figure 2 The electronic device ED may include a display device DD and a housing HAU. The electronic device ED may further include a structure for controlling the folding operation of the display device DD.

[0070] The display device DD includes a window module WM, a display module DM, and a lower panel UP. The window module WM provides the front of the electronic device ED. The display module DM generates an image IM (refer to Figure 1a ) and sense external input. The lower panel UP can protect the display module DM. The display device DD may further include an adhesive layer AP disposed between the display module DM and the lower panel UP.

[0071] The window module WM may include a thin film glass UT and a coating layer CL, and may also include a hard coating layer HC. The window module WM may include a folding area FA (refer to Figure 1a ) and the non-folding regions NFA1 and NFA2 (refer to Figure 1a ) respectively correspond to the folding portion FP-W and the unfolding portion NFP1-W, NFP2-W. The first unfolding portion NFP1-W and the second unfolding portion NFP2-W may be separated from each other in the first direction DR1 via the folding portion FP-W. The folding portion FP-W may correspond to a portion that is folded or bent with the first folding axis FX1 as a reference. Figure 2For convenience, the folded portion FP-W and the unfolded portions NFP1-W and NFP2-W are only shown on the film glass UT of the window module WM. In this specification, "corresponding regions / portions" means overlapping on a plane, not limited to the same area.

[0072] The window module WM may include a window adhesive layer AP-W disposed between the thin-film glass UT and the display module DM. The window adhesive layer AP-W may be an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR). Alternatively, in one embodiment, the window adhesive layer AP-W may be omitted.

[0073] The display module DM may include a first active area F-AA (refer to Figure 1a ) and the first peripheral area F-NAA (refer to Figure 1a ) respectively correspond to the display area DP-DA and the non-display area DP-NDA. The display area DP-DA can be defined as an area for outputting images provided by the display module DM.

[0074] The non-display area DP-NDA is adjacent to the display area DP-DA. For example, the non-display area DP-NDA may surround the display area DP-DA. However, this is exemplary, and the non-display area DP-NDA may be defined in various shapes and is not limited to any one embodiment.

[0075] The display module DM may include a folding display portion FP-D and non-folding display portions NFP1-D and NFP2-D. The folding display portion FP-D may be adjacent to the folding area FA (see FIG. Figure 1a ) corresponding to the non-folding display portion NFP1-D, NFP2-D is the non-folding area NFA1, NFA2 (refer to Figure 1a ) corresponding part.

[0076] The folding display portion FP-D may correspond to a portion that is folded or bent about the first folding axis FX1. The display module DM may include a first non-folding display portion NFP1-D and a second non-folding display portion NFP2-D, the first non-folding display portion NFP1-D and the second non-folding display portion NFP2-D being separated from each other by the folding display portion FP-D.

[0077] The lower plate UP may be disposed below the display module DM. The lower plate UP may include a glass substrate. The lower plate UP may include a folding portion FP-P and first and second non-folding portions NFP1-P and NFP2-P. The first non-folding portion NFP1-P and the second non-folding portion NFP2-P may be separated from each other by the folding portion FP-P. The folding portion FP-P may be adjacent to the folding area FA (see FIG. Figure 1a ) corresponding to the non-folding parts NFP1-P and NFP2-P, which are the same as the non-folding areas NFA1 and NFA2 (see Figure 1a ) corresponding part.

[0078] The adhesive layer AP may be disposed between the display module DM and the lower panel UP. The adhesive layer AP may be disposed directly on the lower panel UP. The display module DM may be disposed directly on the adhesive layer AP. However, this is merely exemplary and the embodiment is not limited thereto. In one embodiment, the adhesive layer AP may be omitted and the display panel DP may be disposed directly on the lower panel UP (see FIG. 1 ). Figure 3 ).

[0079] The adhesive layer AP may be a transparent adhesive layer including any one of a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA), and an optically clear adhesive resin (OCR) film.

[0080] The housing HAU houses the display module DM and the lower panel UP. The housing HAU protects the display module DM, the lower panel UP, and other components housed within the housing HAU. Although not shown, the electronic device ED may also include a hinge structure to facilitate folding or bending the housing HAU. The housing HAU may be coupled to the window module WM.

[0081] Figure 3 is a cross-sectional view of a display device DD according to an embodiment of the present invention. Figure 3 It is along Figure 2 A cross-sectional view of the display device DD taken along II'. Figure 3 omitted in Figure 2 The adhesive layer AP shown is shown. Figure 3 The display device DD may include a window module WM, a display module DM and a lower panel UP.

[0082] The display device DD may define a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 along the first direction DR1. The first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 defined in the display device DD may be aligned with the reference direction DR1. Figure 1a The first unfolding area NFA1 , the folding area FA, and the second unfolding area NFA2 of the electronic device ED described above are substantially the same.

[0083] The window module WM can be configured on the display module DM. The window module WM can be connected to the housing HAU (refer to Figure 2 ) are combined to define the appearance of the display device DD and protect the display module DM. The window module WM may include a thin film glass UT and a coating CL.

[0084] The thin-film glass UT can contain a material with high light transmittance. It can also be chemically strengthened glass. It can be an ultra-thin strengthened glass substrate (Ultra Thin Glass). Even with repeated folding and unfolding, the thin-film glass UT can minimize wrinkles.

[0085] The coating layer CL can be disposed on the thin-film glass UT. The coating layer CL can be disposed on the thin-film glass UT to protect the thin-film glass UT from external environmental influences. For example, the coating layer CL can protect the thin-film glass UT from external impacts and prevent or minimize scratches on the upper surface of the thin-film glass UT. The coating layer CL can be disposed directly on the thin-film glass UT. That is, the coating layer CL can be bonded to the thin-film glass UT without a separate adhesive layer. The coating layer CL can include a coating material having an elastic modulus of 500 MPa or more and 3000 MPa or less and can be provided by coating the thin-film glass UT. The coating layer CL of one embodiment can simplify the manufacturing process by being formed directly on the thin-film glass UT, thereby simplifying the assembly of the window module WM.

[0086] The window module WM may also include a hard coating layer HC. The hard coating layer HC may be disposed on the coating layer CL, forming the outermost layer of the window module WM. The hard coating layer HC can be applied on the coating layer CL as a functional layer to enhance the performance of the display device DD. For example, the hard coating layer HC can enhance the display device DD's anti-fingerprint, anti-stain, anti-reflection, and anti-scratch properties.

[0087] The display module DM can be disposed below the window module WM. The display module DM can display images based on electrical signals and send / receive information related to external input. The display module DM can include at least a display panel DP, a sensor layer IS, and an optical layer RCL.

[0088] The display panel DP may be a structure that substantially generates an image. The display panel DP may be a light-emitting display panel, without particular limitation. For example, the display panel DP may be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include an organic light-emitting substance. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots, quantum rods, and the like.

[0089] The sensor layer IS may be disposed on the display panel DP. The sensor layer IS may include a plurality of sensing electrodes. Thus, the sensor layer IS may sense external input applied from the outside. The external input may be user input. The user input may include various forms of external input, such as a part of the user's body, light, heat, a pen, or pressure.

[0090] The sensor layer IS can be directly formed on the display panel DP through a continuous process when manufacturing the display panel DP. However, the embodiment is not limited thereto, and the sensor layer IS can also be manufactured as a panel separate from the display panel DP and attached to the display panel DP through an adhesive layer.

[0091] The optical layer RCL can be disposed on the sensor layer IS. The optical layer RCL can be disposed directly on the sensor layer IS. Alternatively, if the sensor layer IS is omitted from the display module DM, the optical layer RCL can be disposed directly on the display panel DP. However, embodiments are not limited thereto, and the optical layer RCL can also be disposed on the display panel DP or the sensor layer IS using a separate adhesive member.

[0092] The optical layer RCL can be bonded to the window module WM via the window adhesive layer AP-W. The optical layer RCL can function to reduce reflections of external light. The optical layer RCL can reduce the external light reflectivity of the display panel DP for light incident on the display panel DP. Although not shown, the optical layer RCL can include at least one of an anti-reflection layer, a polarizing layer, a color filter, and a gray filter.

[0093] The lower plate UP can be arranged below the display panel DP. The lower plate UP can be formed by applying the carrier substrate used when the display panel DP is manufactured. The lower plate UP can also be provided as a single layer or include multiple layers. The upper surface of the lower plate UP can directly contact the lower surface of the display panel DP. Therefore, the adhesive layer can be omitted between the lower plate UP and the display panel DP. In this case, the lamination process for combining the display panel DP and the lower plate UP can be omitted to simplify the process. However, the embodiment is not limited thereto, and the lower plate UP can also be formed by an adhesive layer AP (refer to Figure 2 ) is combined with the display panel DP.

[0094] The lower panel UP can protect the display panel DP. For example, when the display device DD is folded, the lower panel UP can reduce the pressure applied to the display panel DP. In addition, the lower panel UP can prevent external moisture from penetrating into the display panel DP and absorb external impact.

[0095] The lower panel UP may include a first area AR1, a second area AR2, and a third area AR3. That is, the lower panel UP may define the third area AR3 between the first area AR1 and the second area AR2. The first area AR1, the third area AR3, and the second area AR2 of the lower panel UP may be defined along the first direction DR1. The first area AR1 may overlap with the first non-folding area NFA1, the second area AR2 may overlap with the second non-folding area NFA2, and the third area AR3 may overlap with the folding area FA. The first area AR1, the second area AR2, and the third area AR3 may contain the same substance. For example, the lower panel UP may include a glass substrate. In the case where the lower panel UP is provided as a single layer, the lower panel UP may be a glass substrate.

[0096] At least one pattern HO may be defined in the lower plate UP. For example, at least one pattern HO may be defined in the third area AR3 of the lower plate UP. The at least one pattern HO may pass through from the lower surface of the lower plate UP toward the upper surface of the lower plate UP. In other words, at least one hole may be provided in the third area AR3 of the lower plate UP.

[0097] Figure 4 is a plan view showing a partial structure of a display device DD according to an embodiment. Figure 4 It is enlarged to show Figure 2 Floor plan of the A1 area.

[0098] Reference Figure 4 The pattern HO defined in the lower panel UP may include a plurality of holes HO1 and HO2. The plurality of holes HO1 and HO2 may extend along a second direction DR2 crossing the first direction DR1, and the plurality of holes HO1 and HO2 may be spaced apart in the first direction DR1 and the second direction DR2.

[0099] The plurality of holes HO1 and HO2 may include a first hole HO1 and a second hole HO2. The first hole HO1 and the second hole HO2 may each extend along the second direction DR2. The first holes HO1 may be spaced apart in the second direction DR2. The first holes HO1 may be arranged in the second direction DR2 to form a first group. The second holes HO2 may be spaced apart from the first holes HO1 in the first direction DR1. The second holes HO2 may be spaced apart in the second direction DR2, and the second holes HO2 may be arranged in the second direction DR2 to form a second group. The first holes HO1 of the first group and the second holes HO2 of the second group may be arranged to be staggered.

[0100] Figure 5 FIG is a cross-sectional view of a display panel DP according to an embodiment. Figure 5 The display panel DP may include a base layer BL, a circuit layer DP-CL, a display element layer DP-OL, and an encapsulation layer TFE.

[0101] The base layer BL can provide a base surface for configuring the circuit layer DP-CL. The base layer BL can be provided as a rigid substrate, but is not limited thereto and can also be provided as a flexible substrate. The base layer BL can include a display area DP-DA and a non-display area DP-NDA. The non-display area DP-NDA can be an area where driver circuits or driver wiring for driving components configured in the display area DP-DA, various signal lines for providing electrical signals, pads, and the like are configured.

[0102] The circuit layer DP-CL may be disposed on the base layer BL. The circuit layer DP-CL may include at least one insulating layer and driving elements, signal lines, and signal pads.

[0103] The display element layer DP-OL can be configured on the circuit layer DP-CL. The display element layer DP-OL may include light-emitting elements that overlap the display area DP-DA. The light-emitting elements of the display element layer DP-OL may be electrically connected to the driving elements of the circuit layer DP-CL, providing light according to signals from the driving elements.

[0104] The encapsulation layer TFE can be configured on the display element layer DP-OL to seal the light emitting element. The encapsulation layer TFE can include multiple insulating films. The insulating films of the encapsulation layer TFE can be configured to improve the optical efficiency of the light emitting element or protect the light emitting element.

[0105] Figure 6 is a cross-sectional view illustrating a partial structure of a display device DD according to an embodiment. Figure 6 It is enlarged to show Figure 3 Cross-sectional view of the AA' region.

[0106] Reference Figure 3 as well as Figure 6 , the thickness T1 of the coating layer CL may be 110 μm or less. The thickness T1 of the coating layer CL may be 50 μm or more and 110 μm or less, 50 μm or more and 60 μm or less, 50 μm or more and 80 μm or less, 90 μm or more and 110 μm or less, 80 μm or more and 100 μm or less, or 70 μm or more and 90 μm or less, but the embodiment is not limited thereto. For example, the coating layer CL may have a thickness T1 of 80 μm or more and 100 μm or less, which can ensure both folding performance and impact resistance.

[0107] When the thickness T1 of the coating layer CL is smaller than the above range, the supporting capacity of the coating layer CL decreases and the deformation rate of the thin film glass UT may increase. When the thickness T1 of the coating layer CL exceeds the above range, the folding characteristics may decrease.

[0108] The thickness T2 of the thin film glass UT may be thin. For example, the thickness T2 of the thin film glass UT may be smaller than the thickness T1 of the coating layer CL. The thickness T2 of the thin film glass UT is not particularly limited, but may be 20 μm or more and 100 μm or less, or may be approximately 30 μm.

[0109] The elastic modulus of the coating CL may be greater than 500 MPa and less than 3000 MPa, greater than 500 MPa and less than 2000 MPa, greater than 500 MPa and less than 1000 MPa, or greater than 1000 MPa and less than 2000 MPa. When the elastic modulus of the coating CL is within the above range, the coating CL may exhibit stable folding characteristics. When the elastic modulus of the coating CL is less than 500 MPa, buckling may occur due to the compressive stress acting on the coating CL, and thus the folding characteristics of the coating CL may be significantly reduced. When the elastic modulus of the coating CL is too high, exceeding 3000 MPa, the rebound force increases and the folding characteristics of the coating CL decrease, and the possibility of cracks in the thin film glass UT may be high.

[0110] In a display device DD having a lower panel UP according to an embodiment disposed below the display module DM, the coating layer CL may have a first elastic modulus of 500 MPa to less than 2000 MPa. When the coating layer CL has the first elastic modulus, the thickness T1 may be 80 μm to 100 μm.

[0111] In the display device DD of one embodiment, the coating layer CL may have a second elastic modulus of 500 MPa or more and 1000 MPa or less. When the coating layer CL has the second elastic modulus, the thickness T1 of the coating layer CL may be 90 μm or more and 110 μm or less. The display device DD of one embodiment may include a coating layer CL having a second elastic modulus at a thickness of 90 μm or more and 110 μm or less, so that the torque (Torque) of the display module DM is 150 N·mm or less and the strain (strain) of the thin film glass UT is 1.3% or less. Thus, the display device DD of one embodiment can achieve excellent folding characteristics and impact resistance. If the elastic modulus of the coating layer CL is less than 500 MPa at a thickness of 90 μm or more and 110 μm or less, bending may occur due to the compressive stress acting on the coating layer CL, and thus the folding characteristics may be reduced. In addition, if the elastic modulus of the coating layer CL exceeds 1000 MPa at a thickness of 90 μm to 110 μm, the foldability may be reduced due to an increase in the repulsive force, and cracks may be generated in the film glass UT.

[0112] The coating CL can vary its thickness T1 based on changes in its elastic modulus. For example, the coating CL can decrease its thickness T1 based on an increase in the elastic modulus. In one embodiment, the coating CL can have an elastic modulus greater than the second elastic modulus. In this case, the coating CL's thickness T1 can be less than the thickness T1 of the coating CL at the second elastic modulus. To achieve stable folding characteristics, the coating CL can decrease its thickness T1 by approximately 20 μm compared to the thickness at the second elastic modulus for every approximately 1000 MPa increase in the elastic modulus compared to the second elastic modulus. In this case, the coating CL can achieve stable folding.

[0113] In one embodiment, the coating layer CL may have a third elastic modulus exceeding 1000 MPa and not exceeding 2000 MPa. The coating layer CL may have a thickness of 70 μm or more and less than 90 μm at the third elastic modulus. The coating layer CL may have a thickness of 70 μm or more and less than 90 μm at the third elastic modulus greater than the second elastic modulus, which is less than the thickness at the second elastic modulus (90 μm or more and 110 μm or less). For example, when the coating layer CL has a third elastic modulus of 2000 MPa, the thickness of the coating layer CL may be 80 μm. The coating layer CL may have a third elastic modulus greater than the second elastic modulus at a thickness of 70 μm or more and less than 90 μm.

[0114] In addition, the coating layer CL of one embodiment may have a fourth elastic modulus exceeding 2000 MPa and not exceeding 3000 MPa. For example, when the fourth elastic modulus of the coating layer CL is 3000 MPa, the coating layer CL may have a thickness less than that at the second elastic modulus. The coating layer CL may have a thickness of 50 μm or more and less than 70 μm, or 50 μm or more and 60 μm or less at the fourth elastic modulus. In other words, the coating layer CL may have a fourth elastic modulus greater than both the second and third elastic moduli at a thickness of 50 μm or more and 60 μm or less.

[0115] Figures 7a to 7e are cross-sectional views showing a portion of the structure of a display device DD according to an embodiment. Figure 7a FIG. 4 shows a display panel DP and a lower panel UP in a display device DD structure according to an embodiment. Figures 7b to 7e Other embodiments of the lower plate UP and UP-a of one embodiment are shown respectively. Figures 7a to 7e Each of the lower plate UP and UP-a described above can be replaced Figure 3 The lower plate UP is suitable for the display device DD.

[0116] Reference Figure 7a , an adhesive layer AP may be included between the lower panel UP and the display panel DP. The lower panel UP may be combined with the display panel DP through the adhesive layer AP.

[0117] A plurality of patterns HO may be defined on the lower plate UP. On a plane, the plurality of patterns HO may overlap with the folding area FA. The plurality of patterns HO may pass through from the lower surface of the lower plate UP toward the upper surface of the lower plate UP. In addition, a protective layer PL (see FIG. 1 ) may be provided on the lower surface of the lower plate UP to protect the display panel DP from external impacts, etc. Figure 7d , Figure 9e wait).

[0118] Reference Figures 7c to 7d In one embodiment, the lower plate UP may include multiple layers. For example, the lower plate UP may be as follows: Figure 7b as well as Figure 7c The bottom plate UP1a and the functional layer UP1b are shown. Figure 7d The lower plate UP is shown to include a base substrate UP1a and a protective layer PL. Although not shown, the lower plate UP may also include the base substrate UP1a, the functional layer UP1b and the protective layer PL.

[0119] The upper surface of the lower panel UP may be in direct contact with the lower surface of the display panel DP. Alternatively, the lower panel UP may be bonded to the lower portion of the display panel DP via an adhesive layer AP.

[0120] The base substrate UP1a may include a rigid material. The base substrate UP1a may include glass. The base substrate UP1a may be a glass substrate. The base substrate UP1a may define at least one pattern HO. For example, the base substrate UP1a may define multiple patterns HO that overlap with the folding area FA. Each of the multiple patterns HO may extend from the lower surface of the base substrate UP1a toward the upper surface of the base substrate UP1a.

[0121] The functional layer UP1b can be disposed on the upper surface of the base substrate UP1a. The functional layer UP1b can be directly disposed on the upper surface of the base substrate UP1a and serve as an etching stopper when forming the plurality of patterns HO on the base substrate UP1a. In other words, the functional layer UP1b can be an etching stopper. Furthermore, the functional layer UP1b can enhance the adhesion between the display panel DP and the lower panel UP. The functional layer UP1b can contain a substance that has low reactivity with the etching solution used when forming the plurality of patterns HO. Therefore, providing the functional layer UP1b can prevent damage to the display panel DP when forming the plurality of patterns HO and improve the shape precision of the plurality of patterns HO.

[0122] A protective layer PL may be disposed on the lower surface of the base substrate UP1a. The upper surface of the protective layer PL may be in direct contact with the lower surface of the base substrate UP1a. The protective layer PL may include an adhesive and a flexible material. The protective layer PL protects the base substrate UP1a and the display panel DP from external impacts, etc. Thus, a display device DD provided with the protective layer PL can have excellent impact resistance.

[0123] Reference Figure 7e The lower panel UP-a may include first and second lower panels UP2a and UP2b corresponding to the unfolding areas NFA1 and NFA2. For example, the lower panel UP-a may include a first lower panel UP2a corresponding to the first unfolding area NFA1 and a second lower panel UP2b corresponding to the second unfolding area NFA2. The first and second lower panels UP2a and UP2b may be made of glass. The first and second lower panels UP2a and UP2b may be glass substrates.

[0124] A pattern HO-a may be defined on the lower panel UP-a. For example, the lower panel UP-a may define a pattern HO-a that overlaps with the folding area FA. The pattern HO-a may extend from the lower surface of the lower panel UP-a toward the upper surface of the lower panel UP-a. Thus, the first lower panel UP2a and the second lower panel UP2b may be separated corresponding to the folding area FA. The first and second lower panels UP2a and UP2b may be spaced apart from each other in the first direction DR1. The first and second lower panels UP2a and UP2b may not overlap with the folding area FA, or, unlike the illustration, may overlap with a portion of the folding area FA.

[0125] The lower plate UP-a may further include a connection module for connecting the first and second lower plates UP2a and UP2b. The connection module may include a hinge module or a multi-joint module.

[0126] Figures 8a to 8e is a cross-sectional view illustrating a portion of a method for manufacturing a display device according to an embodiment. Figures 8a to 8d Each of the steps is used to explain a step of forming a lower plate of an embodiment and a step of forming a display panel DP. Figure 8e It is used to illustrate the steps of forming a window module WM on the display panel DP. Figures 8a to 8e When, for Figures 2 to 7e The same / similar structures as those described in the above description are denoted by the same / similar reference numerals, and repeated descriptions are omitted.

[0127] The method for manufacturing a display device according to an embodiment may include the steps of forming a lower plate, forming a display panel, and forming a window module. The step of forming the lower plate may include a laser irradiation step, an acid-resistant layer providing step, and an etching step. The laser irradiation step is described in detail in the following. Figure 8a as well as Figure 8b For explanation, the acid-resistant layer providing step and the etching step refer to Figure 8c as well as Figure 8d Provide explanation.

[0128] First refer to Figure 8a as well as Figure 8b , a preliminary lower plate UP1-P may be prepared, and the prepared preliminary plate may be irradiated with laser light LZ. The laser light LZ may be irradiated to one surface of the preliminary plate that overlaps with the folding area FA, and may not be irradiated to the area that overlaps with the non-folding areas NFA1 and NFA2. The area irradiated with laser light LZ may become the lower plate UP described later (refer to Figure 8e ) pattern HO (refer to Figure 8e ). Thereafter, the display panel DP may be formed on the other surface of the preliminary lower plate UP1-P opposite to the surface irradiated with the laser LZ. Hereinafter, the one surface of the preliminary lower plate UP1-P which is the surface irradiated with the laser LZ may be referred to as the lower surface of the preliminary lower plate UP1-P, and the other surface of the preliminary lower plate UP1-P may be referred to as the upper surface of the preliminary lower plate UP1-P.

[0129] In one embodiment, a functional layer UP1b may be formed on the upper surface of the preliminary lower plate UP1-P before forming the display panel DP. The functional layer UP1b may be an etching stop layer for protecting the display panel DP in the etching process described later. Unlike the figure, the process of forming the functional layer UP1b may also be omitted. In this case, a single-layer lower plate UP may be formed from the preliminary lower plate UP1-P (see FIG. 1 ). Figure 7a ).

[0130] Then, a base material is coated on the upper surface of the functional layer UP1b to form a base layer BL. In some embodiments, an adhesive layer AP (see Figure 7c ), in the adhesive layer AP (refer to Figure 7c ) is coated with a base material on the upper surface to form a base layer BL. A stacked structure ST may be formed on the base layer BL. The stacked structure ST may include a circuit layer DP-CL (refer to Figure 5 ), display element layer DP-OL (refer to Figure 5 ) and the encapsulation layer TFE (refer to Figure 5 For example, a circuit layer DP-CL may be formed on the base layer BL, a display element layer DP-OL may be formed on the circuit layer DP-CL, and an encapsulation layer TFE may be formed on the display element layer DP-OL to cover the display element layer DP-OL, thereby forming the display panel DP. The display panel DP may be formed on the functional layer UP1b.

[0131] Unlike the figure, the base layer BL can be directly formed on the upper surface of the preliminary lower plate UP1-P. Therefore, the process of forming the functional layer UP1b between the display panel DP and the preliminary lower plate UP1-P can be omitted. The base layer BL can be in direct contact with the upper surface of the preliminary lower plate UP1-P. In addition, when the adhesive layer AP (refer to FIG. 1 ) is formed on the upper surface of the preliminary lower plate UP1-P, the base layer BL can be directly formed on the upper surface of the preliminary lower plate UP1-P. Figure 7c ), the base layer BL may also be formed on the upper surface of the adhesive layer AP.

[0132] Reference Figure 8c as well as Figure 8d , an acid-resistant layer ARL covering the display panel DP may be provided above the display panel DP. The acid-resistant layer ARL may be provided on the upper surface of the display panel DP before etching the preliminary lower plate UP1-P. The acid-resistant layer ARL may contain an acid-resistant substance. The acid-resistant layer ARL is used to protect the display panel DP and the like from the etching solution ECT, and may be used without restriction if it can be easily removed after the etching step. The acid-resistant layer ARL may also be formed by attaching an acid-resistant film to the upper surface of the display panel DP, or may be provided by coating an acid-resistant substance on the upper surface of the display panel DP.

[0133] Reference Figure 8c as well as Figure 8d , an etching liquid ECT is provided to at least a portion of the preliminary lower plate UP1-P. A portion of the preliminary lower plate UP1-P can be removed by the etching liquid ECT. Therefore, the thickness TH1 of the preliminary lower plate UP1-P is thinned as a whole, and the laser LZ (refer to Figure 8a ) can form a pattern HO (refer to Figure 8e ). After the etching step, the thickness TH2 of the lower plate UP may be thinner than the thickness TH1 of the preliminary lower plate UP1-P.

[0134] During the etching step, etching liquid ECT can be applied to the entire lower surface of the preliminary lower plate UP1-P. When etching liquid ECT is applied to the entire lower surface of the preliminary lower plate UP1-P, the thickness of the preliminary lower plate UP1-P can be reduced by the etching liquid ECT. Furthermore, the portion of the preliminary lower plate UP1-P irradiated with laser light LZ can be etched at a faster rate than the portion not irradiated with laser light LZ. Therefore, the portion irradiated with laser light LZ can be removed more quickly by the etching liquid ECT than the portion not irradiated with laser light LZ, resulting in a greater amount of etching. As a result, a pattern HO is formed in the portion irradiated with laser light LZ. The pattern HO can be formed in the portion overlapping with the folding area FA and can correspond to a plurality of holes extending through the lower plate UP in the thickness direction. That is, the pattern HO can correspond to a through-hole extending from the lower surface of the lower plate UP to the upper surface of the lower plate UP.

[0135] Alternatively, the etching liquid ECT may be selectively applied only to the lower surface of the preliminary lower plate UP1-P corresponding to the folding area FA. For example, a mask may be disposed below the preliminary lower plate UP1-P, and the etching liquid ECT may be selectively applied only to the portion of the preliminary lower plate UP1-P exposed to the laser light LZ. After the etching step, a base substrate UP1a having a pattern HO defined therein can be formed from the preliminary lower plate UP1-P.

[0136] Reference Figure 8d as well as Figure 8e , in the formation of acid resistant layer ARL (refer to Figure 8c ), an etching step forms a pattern HO, after which the acid-resistant layer ARL can be removed. A sensor layer IS and an optical layer RCL can be sequentially formed on the display panel DP from which the acid-resistant layer ARL has been removed. A window module WM including a coating layer CL according to an embodiment can be formed on the optical layer RCL. An optically transparent adhesive film or an optically transparent adhesive resin layer can be provided on the display module DM to form a window adhesive layer AP-W. The window adhesive layer AP-W can bond the display module DM to the window module WM.

[0137] The steps of forming the window module WM may include forming a thin film glass UT and a coating layer CL, and may also include forming a hard coating layer HC. For example, the window module WM may form a thin film glass UT on the display module DM, form a coating layer CL on the thin film glass UT, and form a hard coating layer HC on the coating layer CL.

[0138] The coating CL of one embodiment can be formed by providing a coating substance on the upper surface of the thin film glass UT. The coating CL can be formed directly on the thin film glass UT without a separate adhesive layer, thereby simplifying the manufacturing process. The coating CL can be formed by providing a coating substance on the upper surface of the thin film glass UT with a thickness of about 50 μm or more and about 110 μm or less. The coating substance may include a substance having an elastic modulus of about 500 MPa or more and about 3000 MPa or less. Thus, the coating CL can achieve stable folding characteristics. In addition, when the thickness of the coating CL is about 50 μm or more and about 110 μm or less, especially when the thickness of the coating CL is about 80 μm or more and about 100 μm or less, it can achieve stable folding characteristics while exhibiting excellent impact resistance. The coating substance can be provided by an inkjet printing method or a dispensing method. The coating substance can be provided in a uniform amount and / or at a uniform speed.

[0139] The thickness of the coating layer CL can be varied depending on the elastic modulus. For example, the coating layer CL can have a thickness of 80 μm to 100 μm at a first elastic modulus of 500 MPa to 2000 MPa. Alternatively, the coating layer CL can have a thickness of 90 μm to 110 μm at a second elastic modulus of 500 MPa to 1000 MPa, and a thickness of 70 μm to 90 μm at a third elastic modulus of 1000 MPa to 2000 MPa.

[0140] Figures 9a to 9e FIG. 1 is a cross-sectional view showing a portion of a method for manufacturing a display device according to an embodiment. Figures 9a to 9e When, for Figures 2 to 8e The same / similar structures as those described in the above are marked with the same / similar reference numerals and repeated descriptions are omitted. Figures 9a to 9e A method for manufacturing a display device according to an embodiment of the present invention is described. Figures 8a to 8e The display device manufacturing method described in the preceding section differs in the method for forming the lower plate. For example, the step of forming the lower plate may include providing an acid-resistant layer and etching, and the laser irradiation step may be omitted. Furthermore, the step of forming the lower plate may also include forming a protective layer.

[0141] Reference Figure 9a , the display panel DP can be formed on the preliminary lower plate UP-P. For example, a base material can be coated on the upper surface of the preliminary lower plate UP-P to form a base layer BL, and a stacked structure ST can be formed on the base layer BL. However, the embodiment is not limited thereto, and an adhesive layer AP (see Figure 2 ), a display panel DP is formed on the adhesive layer AP. In addition, unlike the figure, a functional layer UP1b can be formed on the upper surface of the preliminary lower plate UP-P (refer to Figure 8b After that, a display panel DP is formed on the upper surface of the functional layer UP1b. The process of forming the display panel DP can be the same as that of the reference Figure 8b The process described is the same.

[0142] Reference Figure 9b as well as Figure 9c , an acid-resistant layer ARL covering the display panel DP may be provided above the display panel DP, and then at least a portion of the preliminary lower plate UP-P may be etched. The etching step may include a single etching step of thinning the preliminary lower plate UP-P and forming a pattern HO on the preliminary lower plate UP-P (refer to FIG. Figure 9d ) secondary etching step.

[0143] In the single etching step, the etching liquid ECT can be applied to the entire lower surface of the preliminary lower plate UP-P. This can reduce the thickness of the preliminary lower plate UP-P. Therefore, the thickness TH4 of the preliminary lower plate UP-P after the single etching process can be thinner than the thickness TH3 of the preliminary lower plate UP-P without the single etching process.

[0144] In the secondary etching step, the etching liquid ECT may be provided only on the lower surface of the preliminary lower plate UP-P corresponding to the folding area FA. For example, a mask MK having at least one hole defined in the region overlapping the folding area FA may be disposed below the preliminary lower plate UP-P. The etching liquid ECT may be provided to the preliminary lower plate UP-P through the hole defined in the mask MK, and the pattern HO may be formed from the portion provided with the etching liquid ECT. Therefore, the preliminary lower plate UP-P may be transformed into the lower plate UP after the primary and secondary etching steps (see Figure 9d The lower panel UP may overlap with the first and second unfolding areas NFA1 and NFA2 and the folding area FA.

[0145] Referring to 9d, an acid-resistant layer ARL (refer to Figure 9c ) is formed by etching the pattern HO, and then the acid-resistant layer ARL is removed. The step of forming the acid-resistant layer ARL on the display panel DP can be the same as that of reference Figure 8c as well as Figure 8d The process described is essentially the same.

[0146] The display device manufacturing method of one embodiment may further include forming a protective layer PL. The protective layer PL may be provided entirely on the lower surface of the lower panel UP. The protective layer PL forming step may be performed after the etching process and before or after the acid-resistant layer ARL is removed.

[0147] Reference Figure 9e , can be removed after the acid resistant layer ARL (refer to Figure 9c A sensor layer IS and an optical layer RCL are sequentially formed on a display panel DP. A window module WM including a coating layer CL according to an embodiment is formed on the optical layer RCL. An optically transparent adhesive film or an optically transparent adhesive resin layer can be provided on the display module DM to form a window adhesive layer AP-W. Figure 9e The process for forming the form module WM can be compared with the reference Figure 8d as well as Figure 8e The forming process of the window module WM described above is substantially the same.

[0148] Figures 10a to 10e FIG. 1 is a cross-sectional view showing a portion of a method for manufacturing a display device according to an embodiment. Figures 10a to 10e When, for Figures 2 to 9eThe same / similar structures as described in the above are marked with the same / similar reference numerals and repeated descriptions are omitted. Figures 10a to 10e A method for manufacturing a display device according to an embodiment of the present invention is described. Figures 8a to 8e The display device manufacturing method described in the embodiment differs in the method for forming the lower plate. For example, the steps for forming the lower plate may include providing an acid-resistant layer and etching, and the laser irradiation step may be omitted. Furthermore, the structure of the lower plate formed by one embodiment differs.

[0149] Reference Figure 10a , a display panel DP can be formed on the preliminary lower panel UP2-P. For example, a base material can be coated on the upper surface of the preliminary lower panel UP2-P to form a base layer BL, and a stacked structure ST can be formed on the base layer BL. However, the embodiment is not limited thereto, and an adhesive layer AP (see FIG. 1 ) can also be formed on the upper surface of the preliminary lower panel UP2-P. Figure 7c ), a display panel DP is formed on the adhesive layer AP. In addition, unlike the figure, a functional layer UP1b (see Figure 8b After that, a display panel DP is formed on the upper surface of the functional layer UP1b. The process of forming the display panel DP can be the same as that of the reference Figure 8b The process described is the same.

[0150] Reference Figure 10b as well as Figure 10c , an acid-resistant layer ARL covering the display panel DP may be provided above the display panel DP, and then at least a portion of the preliminary lower plate UP2-P may be etched. The etching step may include a single etching step of thinning the preliminary lower plate UP2-P and forming a pattern HO-a (refer to FIG. Figure 10d ) secondary etching step.

[0151] In a single etching step, the etching liquid ECT can be applied to the entire lower surface of the preliminary lower plate UP2-P. This allows the thickness of the preliminary lower plate UP2-P to be reduced. Therefore, the thickness of the preliminary lower plate UP2-P after a single etching process can be thinner than that of the preliminary lower plate UP2-P without the single etching process.

[0152] In the secondary etching step, the etching liquid ECT may be applied only to the lower surface of the preliminary lower plate UP2-P corresponding to the folding area FA. For example, a mask MK having a hole defined therein that overlaps the folding area FA may be disposed below the preliminary lower plate UP2-P. The etching liquid ECT may be applied to the preliminary lower plate UP2-P through the hole defined in the mask MK, and a pattern HO-a may be formed from the portion to which the etching liquid ECT is applied. The pattern HO-a may be formed in the portion overlapping the folding area FA, and may be formed from the portion of the lower plate UP-a (see FIG. 1 ). Figure 10d ) corresponds to a through hole on the upper surface of the lower plate UP-a. Therefore, the preliminary lower plate UP2-P can be changed into the first lower plate UP2a (refer to Figure 10d ) and the second lower plate UP2b (refer to Figure 10d ) is formed between a lower plate UP-a with a pattern HO-a.

[0153] The lower panel UP-a formed by the manufacturing method of one embodiment may include a first lower panel UP2a overlapping the first non-folding area NFA1 and a second lower panel UP2b overlapping the second non-folding area NFA2. The first lower panel UP2a and the second lower panel UP2b may be spaced apart corresponding to the folding area FA.

[0154] Reference Figure 10d as well as Figure 10e , can be formed with an acid-resistant layer ARL (refer to Figure 10c ) is formed by etching the pattern HO-a, and then the acid-resistant layer ARL is removed. The steps of forming and removing the acid-resistant layer ARL on the display panel DP may be the same as those in the reference Figure 8c as well as Figure 8d The process described is essentially the same.

[0155] A sensor layer IS and an optical layer RCL may be sequentially formed on the display panel DP from which the acid-resistant layer ARL is removed, and a window module WM including a coating layer CL according to an embodiment may be formed on the optical layer RCL. An optically transparent adhesive film or an optically transparent adhesive resin layer may be provided on the display module DM to form a window adhesive layer AP-W. Figure 10e The window module WM forming process described can be compared with the reference Figure 8d as well as Figure 8e The forming process of the window module WM described above is substantially the same.

[0156] Hereinafter, the characteristic evaluation results of a display device including a coating layer according to an embodiment of the present invention will be described with reference to Examples and Comparative Examples.

[0157] 1. Display device characteristic evaluation 1

[0158] The folding characteristics and impact resistance of the display device were evaluated and shown in Table 1. The Examples and Comparative Examples were all made identically except for the difference in the elastic modulus of the coating. Figure 3 The thickness of the coating layer in the display devices of the embodiment and the comparative example is the same as that of 100 μm.

[0159] In Table 1 below, "Module" refers to the display module. Additionally, "UT" refers to thin-film glass, TFE refers to the encapsulation layer of the display panel, and UP refers to the lower panel. Furthermore, "X" in Table 1 below indicates a defect where the display device is not foldable and the coating CL is bent.

[0160]

Table 1

[0161]

[0162] Referring to Table 1, the display devices of Examples 1 to 6, including the coating and lower plate of one embodiment, exhibited a display module torque of less than 150 N·mm and a thin-film glass strain of less than 1.3%. This indicates that the display devices of Examples 1 to 6, which include a structure with a reduced thickness of the support member (e.g., lower plate) disposed below the display module and a coating disposed directly on the thin-film glass without an adhesive layer, exhibited a rebound force that did not impair folding properties and excellent impact resistance.

[0163] On the other hand, the display devices of Comparative Examples 1 to 4 include a coating having an elastic modulus of less than 500 MPa at a thickness of 100 μm. In Comparative Examples 1 to 4, the elastic modulus of the coating is too low compared to that of the Example, resulting in bending due to compressive stress acting on the coating, resulting in the display devices being unable to fold.

[0164] Furthermore, the display devices of Comparative Examples 5 to 10 include a coating with an elastic modulus of 2000 MPa or greater at a thickness of 100 μm. This indicates that the elastic modulus of the coating in Comparative Examples 5 to 10 is excessively higher than that of the Examples, resulting in increased rebound force and decreased folding properties. Furthermore, the strain of the film glass exceeds 1.3%, and the likelihood of cracks forming in the film glass is high.

[0165] 2. Display device characteristic evaluation 2

[0166] The folding characteristics and impact resistance according to the thickness of the coating were evaluated and shown in Table 2. The Examples and Comparative Examples were all made identically except for the thickness of the coating. Figure 3 The elastic modulus of the coating layers in the display devices of the embodiment and the comparative example are all the same, 2000 MPa, and the thickness of the coating layers is shown in Table 2.

[0167] In the following Table 2, “Module” refers to the display module. In addition, in the following Table 2, “UT” refers to thin film glass, TFE refers to the encapsulation layer of the display panel, and UP refers to the lower plate.

[0168]

Table 2

[0169]

[0170] Referring to Table 2, the display devices of Examples 7 to 11, which include the coating and lower plate of one embodiment, exhibited display module torques of less than 150 N·mm and thin-film glass strains of less than 1.3%. Therefore, it can be confirmed that the display devices of these embodiments not only exhibit excellent folding characteristics but also demonstrate good impact resistance.

[0171] Furthermore, Example 7, which included a coating with an elastic modulus of 2000 MPa and a thickness of 80 μm, exhibited comparable excellent results to Example 6, which included a coating with an elastic modulus of 1000 MPa and a thickness of 100 μm. This demonstrates that when the elastic modulus of the coating increases by 1000 MPa, a decrease in the coating thickness by approximately 20 μm can achieve stable folding properties.

[0172] On the other hand, the display devices of Comparative Examples 11 and 12, which included coatings with a thickness of 90 μm or greater at an elastic modulus of 2000 MPa, exhibited a torque exceeding 150 N·mm. This indicates that the rebound force of Comparative Examples 11 and 12 increased, and the folding characteristics decreased, compared to the example.

[0173] 3. Display device characteristic evaluation 3

[0174] The impact resistance of the display device according to the thickness of the coating layer was evaluated in one embodiment and is shown in Table 3. The embodiments were all made identically except for the thickness of the coating layer. Figure 3 In the display devices of the embodiment, the elastic modulus of the coating layers is the same as 1000 MPa, and the thickness of the coating layers is shown in Table 3.

[0175] In Table 3 below, "Module" refers to the display module. Furthermore, "UT" refers to thin-film glass, TFE refers to the encapsulation layer of the display panel, and UP refers to the lower panel. Furthermore, the deformation rate was evaluated by dropping a pen from a height of 3 cm above the measurement object.

[0176]

Table 3

[0177]

[0178] Referring to Table 3, it can be confirmed that the strain rate of the thin film glass of Experimental Example 4 exceeds about 3.3% compared with Experimental Examples 1 to 3, and the strain rate is relatively large compared with the other experimental examples. This shows that when the elastic modulus of the coating is 1000 MPa, the coating thickness of about 80 μm to 100 μm has excellent impact resistance. In addition, it can be seen that when the elastic modulus of the coating is 1000 MPa, Experimental Examples 1 and 2 with a thickness of 90 μm to 100 μm show a lower strain rate than Experimental Example 3 with a thickness of 80 μm, thereby further improving the impact resistance.

[0179] While the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will appreciate that various modifications and variations may be made to the present invention without departing from the scope of the present invention and the technical field as set forth in the appended claims. Therefore, the technical scope of the present invention is not limited by the detailed description of the specification but is determined solely by the claims.

Claims

1. An electronic device comprising: A display module, which defines a first non-folding area, a folding area, and a second non-folding area in sequence along a first direction, and includes a display panel; A window module is arranged above the display module; as well as A lower plate is disposed below the display module and defines at least one pattern overlapping with the folding area and is a glass substrate. The window module includes: a thin film glass, disposed above the display module; as well as A coating layer is disposed on the film glass, wherein the thickness of the coating layer is greater than or equal to 50 μm and less than or equal to 110 μm. The coating has an elastic modulus of 500 MPa or more and 2000 MPa or less, The thickness is 80 μm or more and 100 μm or less at a first elastic modulus of 500 MPa or more and less than 2000 MPa.

2. The electronic device according to claim 1, wherein The coating layer has a thickness of 90 μm to 110 μm at a second elastic modulus of 500 MPa to 1000 MPa.

3. The electronic device according to claim 1, wherein The coating layer has a thickness of 70 μm or more and less than 90 μm at a third elastic modulus of more than 1000 MPa and 2000 MPa or less.

4. The electronic device according to claim 1, wherein The thickness of the coating layer is 80 μm or more and 100 μm or less.

5. The electronic device according to claim 1, wherein The coating is directly disposed on the film glass. The electronic device according to claim 1 , wherein: The display module has a torque of less than 150 N·mm.

7. The electronic device according to claim 1, wherein The thickness of the lower plate is smaller than the thickness of the coating layer.

8. The electronic device according to claim 1, wherein The lower plate comprises: a base substrate defining the pattern; and at least one of a functional layer and a protective layer, wherein the functional layer is disposed on the upper surface of the base substrate and the protective layer is disposed on the lower surface of the base substrate; The base substrate comprises glass.

9. The electronic device according to claim 1, wherein: An upper surface of the lower plate is in direct contact with a lower surface of the display panel.

10. The electronic device according to claim 1, wherein The pattern comprises a plurality of holes, The plurality of holes extend along a second direction intersecting the first direction. The plurality of holes include first holes and second holes spaced apart in the first direction. The first holes and the second holes are arranged to be staggered with each other.

Images