Driving assembly and electric device

Abstract

The invention discloses a driving assembly and an electric device. The driving assembly comprises a coil and a circuit board assembly. The circuit board assembly comprises a terminal area and an electronic element area, and the terminal area is located between the edge of the circuit board assembly and the electronic element area; the driving assembly comprises at least two terminals, the coil is electrically connected with the terminals, and the terminals are fixedly and electrically connected with the terminal area. The terminal area is located between the edge of the circuit board assembly and the electronic element area, so that the space utilization rate of the circuit board assembly is higher, the size of the circuit board assembly is reduced, and then the size of the driving assembly is reduced.

Description

Technical Field

[0001] The present invention relates to the field of thermal management technology, and in particular to a drive assembly and an electric device. Background Art

[0002] In the related art, the electric device is driven by a motor, and the driving assembly of the electric device includes a circuit board assembly. If the circuit board assembly is large in size, the entire electric device will be larger, which is not conducive to the miniaturization of the electric device. Summary of the Invention

[0003] One object of the present application is to provide a drive assembly and an electric device that can reduce the volume of the drive assembly.

[0004] A technical solution of the present application provides a driving component, which includes a coil and a circuit board assembly; the circuit board assembly includes a terminal area and an electronic component area, and the terminal area is located between the edge of the circuit board assembly and the electronic component area; the driving component includes at least two terminals, the coil is electrically connected to the terminals, and the terminals are fixedly and electrically connected to the terminal area.

[0005] In the driving assembly provided by the technical solution of the present application, the circuit board assembly includes a terminal area and an electronic component area. The terminal area is located between the edge of the circuit board assembly and the electronic component area, thereby making the space utilization rate of the circuit board assembly higher, thereby reducing the size of the circuit board assembly and further reducing the size of the driving assembly.

[0006] A technical solution of the present application provides an electric device, which includes the above-mentioned drive assembly, the electric device includes a valve core and a valve seat, the valve seat has a valve port, the drive assembly can drive the valve core so that the valve core moves relative to the valve seat, thereby closing or opening the valve port; or, the electric device includes an impeller, and the drive assembly can drive the impeller.

[0007] In the electric device provided by the technical solution of the present application, the circuit board assembly includes a terminal area and an electronic component area. The terminal area is located between the edge of the circuit board assembly and the electronic component area, thereby making the space utilization rate of the circuit board assembly higher, thereby reducing the size of the circuit board assembly and further reducing the size of the drive assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of the electric device of the present application is shown;

[0009] Figure 2 Shown Figure 1 A schematic cross-sectional view of the electric device shown;

[0010] Figure 3 Shown Figure 1 A schematic exploded view of a portion of a drive assembly of the electric device;

[0011] Figure 4 Shown Figure 3 Another exploded schematic diagram of a portion of the drive assembly is shown;

[0012] Figure 5 Shown Figure 3 A schematic diagram of the three-dimensional structure of the circuit board assembly of the driving assembly shown;

[0013] Figure 6 Shown Figure 3 A schematic perspective structural diagram of a portion of the drive assembly shown;

[0014] Figure 7 A schematic diagram showing the three-dimensional structure of another embodiment of the electric device of the present application is shown;

[0015] Figure 8 Shown Figure 7 A schematic cross-sectional view of the electric device shown;

[0016] Figure 9 Shown Figure 7 A schematic exploded view of a portion of a drive assembly of the electric device;

[0017] Figure 10 Shown Figure 8 A schematic structural diagram of a portion of the drive assembly shown;

[0018] Figure 11 Shown Figure 9 A schematic diagram of the three-dimensional structure of the circuit board assembly of the driving assembly shown;

[0019] Figure 12 Shown Figure 10 A schematic cross-sectional view of a portion of the drive assembly shown;

[0020] Figure 13 A cross-sectional schematic diagram of an embodiment of the first substrate, chip, peripheral components and packaging layer of the present application;

[0021] Figure 14 A system block diagram of a circuit board assembly according to one embodiment of the present application.

[0022] Reference numerals:

[0023] 100. Electric device; 3. Drive assembly; 31. Second substrate; 32. Circuit board assembly; 33. Coil; 34. First terminal; 35. Capacitor; 36. Second terminal; 30. Terminal; 38. Claw plate; 39. Ground pin; 37. Pin; 4. Housing; 41. First cavity; 42. Second cavity; 48. Main body; 44. Cover; 45. Box body; 46. Connector; 47. Third cavity; 401. Groove; 5. Rotor; 51. Permanent magnet; 6. Valve core; 7. Valve seat; 9. Sensor; 91. Sensing part; 92. Connecting part; 21. Communication module; 22. Signal processing module; 23. Drive module; 11. First substrate; 12. Chip; 13. Peripheral devices; 14. Packaging layer. DETAILED DESCRIPTION

[0024] The embodiments are described in detail below with reference to the accompanying drawings.

[0025] In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application is described in further detail below in conjunction with the accompanying drawings and specific embodiments. In this article, relational terms such as "first" and "second" are only used to distinguish one component with the same name from another, and do not necessarily require or imply that there is any actual relationship or order between these components. It should be noted that the "limited connection" in this application includes snap-on connection, hinged connection, etc., and the "fixed connection" in this application includes threaded connection, welding, bonding, riveting, interference fit, etc.

[0026] like Figures 1 to 5 、 Figure 13 As shown, the electric device 100 includes a drive assembly 3, which includes a circuit board assembly 32. The circuit board assembly 32 includes a first substrate 11, a chip 12, peripheral components 13, and an encapsulation layer 14. The coil 33 is directly or indirectly electrically connected to the first substrate 11; the chip 12 is fixedly connected to the first substrate 11, and the peripheral components 13 are fixedly connected to the first substrate 11. The encapsulation layer 14 encapsulates the chip 12 and peripheral components 13. The encapsulation layer 14 encapsulates the chip 12 and peripheral components 13, which can reduce the size of the circuit board assembly 32 and thus the volume of the drive assembly 3. "Direct electrical connection" means that the two are connected by a conductor and can be electrically conductive, or are in direct contact and can be electrically conductive. "Indirect electrical connection" means that other components may be present between the two.

[0027] It should be noted that, in this embodiment, the chip 12 does not have a separate packaging structure. The chip 12 is a small chip (Di e) cut from a wafer through a dicing process. The circuit board assembly 32 of this application adopts SIP (system in package) technology, and uses the packaging layer 14 to package the chip 12 and peripheral devices 13 as a whole onto the first substrate 11, so that the process of manufacturing the circuit board assembly 32 is less difficult and the cost is lower, and the volume of the circuit board assembly 32 is smaller, thereby reducing the volume of the drive assembly 3, which is conducive to the miniaturization of the electric device 100.

[0028] like Figure 14 As shown, the circuit board assembly 32 includes at least a communication module 21, a signal processing module 22, and a driver module 23. The signal processing module 22 outputs a control signal to the driver module 23 based on the communication signal obtained by the communication module 21, so that the driver module 23 controls the operation of the coil 33 in response to the control signal. It should be noted that in this embodiment, the chip 12 has the functions of at least one of the communication module 21, the signal processing module 22, and the driver module 23. Optionally, in one embodiment of the present application, the signal processing module 22 is an MCU, i.e., a microprocessor, but this application is not limited to this and the specific application depends on the specific situation. The circuit board assembly 32 of the present application encapsulates the peripheral device 13 and the chip 12 (which has the functions of at least one of the three modules: the communication module 21, the signal processing module 22, and the driver module 23) together through the encapsulation layer 14. This can reduce the packaging cost of the circuit board assembly 32, allowing the chip 12 and the peripheral device 13 to be used as a whole product, reducing the development difficulty for developers during application, shortening the development cycle, and reducing development investment costs. The encapsulation layer 14 is made of an insulating material and covers one side of the first substrate 11. In addition, in the circuit board assembly 32 provided in the embodiment of the present application, the chip 12 and the peripheral device 13 are protected by the packaging layer 14 on the side away from the first substrate 11, thereby reducing the probability of the chip 12 being damaged during the application of the circuit board assembly 32.

[0029] Optionally, in one embodiment of the present application, the peripheral device 13 may be a capacitor, a resistor, or an inductor. It should be noted that in this embodiment, the number of peripheral devices 13 may be more than two, and may include at least one of the three passive devices of capacitors, resistors, and inductors, and the same passive device may include one or more. The present application does not limit this, and it depends on the specific circumstances.

[0030] like Figure 13As shown, the number of chips 12 can be two or more. In this embodiment, the number of chips 12 is at least three, one of which has the function of the communication module 21, another of which has the function of the signal processing module 22, and yet another of which has the function of the driver module 23. In other embodiments, one chip 12 can have the functions of two of the communication module 21, the signal processing module 22, and the driver module 23.

[0031] like Figures 1 to 6 As shown, the driving component 3 includes at least two coils 33, each of which is stacked, and at least part of the first substrate 11 is located radially outside the coil 33. Along the axial direction of the driving component 3, at least part of the first substrate 11 overlaps with the coil 33, or in other words, at least part of the first substrate 11 and the coil 33 are located at the same height, so that the first substrate 11 and each coil 33 are closer, thereby making the electrical connection structure between the first substrate 11 and each coil 33 simpler. Figures 2 to 5 As shown, the circuit board assembly 32 further includes a second substrate 31. The first substrate 11 is fixedly and electrically connected to the second substrate 31. The terminal 30 is fixedly and electrically connected to the second substrate 31. The terminal 30 is electrically connected to the coil 33. At least a portion of the second substrate 31 is located radially outward from the coil 33. Along the axial direction of the drive assembly 3, at least a portion of the second substrate 31 overlaps with the coil 33, or in other words, at least a portion of the second substrate 31 and the coil 33 are located at the same height. The extension direction of the second substrate 31 is parallel or approximately parallel to the stacking direction of each coil 33. The stacking direction of each coil 33 is defined as the axial direction of the drive assembly 3, and the winding direction of each coil 33 is defined as the circumferential direction of the drive assembly 3. The axial direction of the drive assembly 3 is indicated by H in the figure. Compared to solutions that place the second substrate 31 axially to one side of the coils 33, in this application, at least a portion of the second substrate 31 is located radially outward of the coils 33. This portion extends parallel or approximately parallel to the stacking direction of the coils 33, bringing the second substrate 31 closer to the coils 33 and reducing the size of the drive assembly 3. Specifically, the terminals 30 can be directly welded or snapped onto the second substrate 31, simplifying the electrical connection between the terminals 30 and the second substrate 31 and reducing the length of the terminals 30, facilitating their manufacture. Furthermore, because this portion of the second substrate 31 extends parallel or approximately parallel to the stacking direction of the coils 33, the distance between the second substrate 31 and the coils 33 can be substantially the same, allowing the structures of the terminals 30 to be identical or substantially identical, thus reducing costs. Furthermore, this solution achieves relatively higher space utilization and reduces the ineffective size of the second substrate 31. It should be noted that "approximately parallel" means that the angle between the two directions is less than 10°.

[0032] The circuit board assembly 32 includes a terminal area and an electronic component area. The terminal area is located between the edge of the circuit board assembly 32 and the electronic component area. The drive assembly 3 includes at least two terminals 30, the coil 33 is electrically connected to the terminal, and the terminal 30 is fixedly connected and electrically connected to the terminal area. The terminal area is located between the edge of the circuit board assembly 32 and the electronic component area. The electronic component area is made into a concentrated area as much as possible, so that the space utilization rate of the circuit board assembly 32 is higher, thereby reducing the size of the circuit board assembly 32, and then reducing the size of the drive assembly 3. It should be noted that the electronic components in the "electronic component area" do not include terminals, but include capacitors, inductors, resistors, chips, etc. Specifically, the first substrate 11 is located in the electronic component area, and the terminal area is located on the second substrate 31.

[0033] like Figures 3 and 4 As shown, each terminal 30 includes a first terminal 34 and a second terminal 36, which are electrically connected to the coil 33, and the first terminal 34 and the second terminal 36 are both electrically connected to the second substrate 31, and the first terminal 34 and the second terminal 36 are both fixedly connected to the second substrate 31; the number of the first terminals 34 and the number of the second terminals 36 are the same as the number of the coils 33, and the first terminals 34 and the second terminals 36 correspond to the coils 33 one by one. Along the circumference of the driving component 3, the first terminal 34 is located on one side of the packaging layer 14, and the second terminal 36 is located on the other side of the packaging layer 14, that is, the packaging layer 14 is located between the first terminal 34 and the second terminal 36, so that the first terminal 34 and the second terminal 36 are far apart, which facilitates the winding operation of the coil 33 during the manufacturing process. In addition, the fixing points of the first terminal 34, the second terminal 36 and the circuit board are relatively dispersed, so that the swing of the second substrate 31 is small, and the second substrate 31 can be fixed without screws. In other words, along the circumference of the drive assembly 3, the first terminal 34 is located on one side of the electronic component area, and the second terminal 36 is located on the other side of the electronic component area. Specifically, one end of the winding included in the coil 33 is electrically connected to the first terminal 34, and the other end of the winding included in the coil 33 is electrically connected to the second terminal 36. Figures 2 to 4As shown, the drive assembly 3 includes three coils 33 and three pairs of claw pole plates 38. The claw pole plates 38 correspond one to one with the coils 33. The three coils 33 are arranged along the axial direction of the drive assembly 3, and the three pairs of claw pole plates 38 are arranged along the axial direction of the drive assembly 3. Due to the use of three coils 33 and three pairs of claw pole plates 38, compared to a drive assembly 3 including only two layers of coils 33, while maintaining the same height of the drive assembly 3 and the required pole-to-slot ratio, the claw pole plates 38 can be designed with a greater number of pole pairs, for example, from twelve to sixteen pole pairs. This allows for a smaller step angle and more precise control of the rotor's rotation angle. The terminal 30 is located radially outside the coil 33, each first terminal 34 is arranged along the axial direction of the driving component 3, and each second terminal 36 is arranged along the axial direction of the driving component 3. The packaging layer 14 is square-shaped. Along the circumference of the driving component 3, the two sides of the packaging layer 14 are parallel or approximately parallel to the axial direction of the driving component 3, so that the first terminal 34 and the second terminal 36 can be closer to the packaging layer 14, thereby reducing the size of the second substrate 31.

[0034] like Figure 2 and Figure 8 As shown, the drive assembly 3 includes a rotor 5, which includes a permanent magnet 51 having at least two pairs of magnetic poles, and a coil 33 disposed around the periphery of the permanent magnet 51. The drive assembly 3 includes at least one sensor 9, which is electrically connected to the second substrate 31.

[0035] like Figures 7 to 13 As shown, the sensor 9 includes a sensing portion 91 and a connecting portion 92. The sensing portion 91 is electrically connected to the second substrate 31 via the connecting portion 92. The sensing portion 91 can sense the change in the magnetic pole of the permanent magnet 51. Along the radial direction of the drive assembly 3, the sensing portion 91 of one sensor 9 is located on one side of the permanent magnet 51. The sensor 9 can detect the rotation of the rotor 5, thereby detecting the stall of the rotor 5. Along the axial direction of the drive assembly 3, the sensing portion 91 is located on one side of the coil 33. In this embodiment, two sensors 9 are used, and the sensing portions 91 of the two sensors 9 are located on different sides of the permanent magnet 51. The angle between the two sensors 9 and the central axis of the coil is 70° to 130°, which can detect the rebound generated by the collision between the valve core 6 and the valve seat 7 during the operation of the drive assembly 3. The connecting portion 92 is also located between the edge of the circuit board assembly 32 and the electronic component area, making more reasonable use of the space of the circuit board assembly 32.

[0036] like Figures 8 to 12As shown, the drive assembly 3 includes a shell 4, which covers at least a portion of the coil 33. The shell 4 has a first cavity 41. Along the radial direction of the drive assembly 3, the first cavity 41 is located on one side of the coil 33. The circuit board assembly 32 is located in the first cavity 41. A portion of the terminal 30 protrudes from the wall forming the first cavity 41, and this portion can be fixedly connected or positionally connected with the second substrate 31. Specifically, the needle-shaped portion protrudes from the wall forming the first cavity 41. The shell 4 has a second cavity 42, and the second cavity 42 extends from the first cavity 41 to the permanent magnet 51. The induction part 91 is located in the second cavity 42. The wall forming the second cavity 42 can protect the induction part 91, and the induction part 91 can be installed in the second cavity 42 through the first cavity 41. Specifically, a portion of the first terminal 34 and a portion of the second terminal 36 protrude from the wall forming the first cavity 41.

[0037] The drive assembly 3 includes a cover portion 44, which is located away from the coil 33 relative to the first cavity 41. The cover portion 44 is fixedly connected to the housing 4 and seals the first cavity 41. In other words, the open side of the first cavity 41, before being sealed, is located radially outward from the housing 4. Since the second cavity 42 also extends generally radially along the drive assembly 3, this arrangement facilitates demolding of the first and second cavities 41, 42, and also facilitates the installation of the second substrate 31 into the first cavity 41. The terminal 30 includes a needle-shaped portion that extends radially along the drive assembly 3. When the second substrate 31 is radially installed into the housing 4, the needle-shaped portion can be directly inserted into the hole of the second substrate 31, simplifying assembly.

[0038] Housing 4 includes a connector 46 having a third cavity 47 with an opening on the outer surface of connector 46. Drive assembly 3 includes at least two pins 37, a portion of which is located in third cavity 47, and the other portion of which is fixedly and electrically connected to second substrate 31, for example, by welding. Connector 46 and pins 37 are used to connect to external components, and pins 37 can communicate with the vehicle bus. Communication module 21 is used to transmit communication signals, specifically LIN signals, CAN signals, and PWM signals, although this application does not limit these. Communication module 21 is capable of receiving signals from pins 37.

[0039] Terminals 30 and pins 37 are located on different sides of packaging layer 14, facilitating wiring of second substrate 31 and thereby reducing the size of second substrate 31, thereby reducing the volume of first cavity 41 and, consequently, the volume of driver assembly 3. Specifically, first terminals 34, second terminals 36, and pins 37 are all located on different sides of packaging layer 14. In other words, pins 37 are located between the edge of circuit board assembly 32 and the electronic component area. The first terminals 34, second terminals 36, and pins 37 are located on different sides of the electronic component area, facilitating wiring of circuit board assembly 32 and thus reducing the size of circuit board assembly 32.

[0040] The terminal 30 and the pin 37 are both welded and fixed to the second substrate 31. The welding point between the terminal 30 and the second substrate 31 is defined as the first welding point, and the welding point between the pin 37 and the second substrate 31 is defined as the second welding point. The distance between the center of the first welding point and the packaging layer 14 is less than 6 mm, and the distance between the center of the second welding point and the packaging layer 14 is less than 6 mm, which makes the layout of the second substrate 31 more compact, and thus the size of the second substrate 31 is smaller, thereby reducing the size of the driving component 3.

[0041] The shell 4 includes a box body portion 45, at least part of the box body portion 45 surrounds the first cavity 41, and the socket portion 46 protrudes from the outer wall of the box body portion 45. Along the axial direction of the drive assembly 3, the socket portion 46 and the sensor 9 are located on the same side of the coil 33, and the socket portion 46 and the rotor 5 are at least partially located at the same height, which can make the drive assembly 3 more compact and reduce the size of the drive assembly 3.

[0042] Housing 4 includes a main body 48, which encloses coil 33. The outer circumference of main body 48 is cylindrical. The outer wall of box body 45 abuts the outer circumference of main body 48. Main body 48 and box body 45 are integrally formed, and are formed by an integral injection molding process. The outer wall of box body 45 abuts the outer circumference of main body 48, which reduces the distance between box body 45 and coil 33, thereby reducing the radial size of drive assembly 3.

[0043] The electric device 100 can be a valve. In this embodiment, the electric device 100 is an electronic expansion valve. The electric device 100 also includes a valve core 6 and a valve seat 7. The valve seat 7 has a valve opening. The rotor 5 can drive the valve core 6 to move relative to the valve seat 7, thereby closing or opening the valve opening. Of course, in other embodiments, the electric device 100 can include an electric ball valve, an electric water valve, an electric injector, etc., and the corresponding valve core includes a valve needle, a ball core, a piston, etc. The electric device 100 can also be a pump. The electric device 100 includes an impeller, and the rotor 5 can drive the impeller to rotate. The electric device 100 is particularly suitable for the vehicle field because the drive assembly 3 provided in this application is small in size, and a more compact layout is required in vehicles.

[0044] like Figures 2 to 6As shown, the drive assembly 3 includes a capacitor 35, which is electrically connected to the second substrate 31. The capacitor 35 is located on one side of the second substrate 31, and the first substrate 11 is located on the other side of the second substrate 31. At least part of the capacitor 35 is located on the back side of the first substrate 11. The capacitor 35 extends from the second substrate 31 toward the coil 33. Along the circumference of the drive assembly 3, at least part of the capacitor 35 is located between the first terminal 34 and the second terminal 36. This can make more effective use of the space between the two terminals 30, making the drive assembly 3 more compact, thereby reducing the volume of the drive assembly 3. The distance between the capacitor 35 and the coil 33 can be less than 4 mm, or the distance between the second substrate 31 and the coil 33 can be less than 7 mm. This makes the structure of the drive assembly 3 more compact and reduces the radial size of the drive assembly 3. Specifically, the wall forming the first cavity 41 has a groove 401, which is located between the first terminal 34 and the second terminal 36. The groove 401 accommodates a portion of the capacitor 35.

[0045] It should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, it should be understood by those skilled in the art that the present invention can still be modified or replaced by equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A drive assembly (3), comprising a coil (33) and a circuit board assembly (32); The circuit board assembly (32) comprises a terminal area and an electronic component area, wherein the terminal area is located between an edge of the circuit board assembly (32) and the electronic component area; The driving component (3) comprises at least two terminals (30), the coil (33) is electrically connected to the terminals, and the terminals (30) are fixedly and electrically connected to the terminal area.

2. The drive assembly according to claim 1, characterized in that The terminal (30) includes a first terminal (34) and a second terminal (36). Along the circumference of the drive assembly (3), the first terminal (34) is located on one side of the electronic component area, and the second terminal (36) is located on the other side of the electronic component area.

3. The drive assembly according to claim 2, characterized in that The driving assembly (3) includes a pin (37), the pin (37) is electrically connected to the circuit board assembly (32), and the pin (37) is located between the edge of the circuit board assembly (32) and the electronic component area; the first terminal (34), the second terminal (36) and the pin (37) are located on different sides of the electronic component area.

4. The drive assembly according to claim 2 or 3, characterized in that: At least part of the circuit board assembly (32) is located radially outside the coil (33), the number of the first terminals (34) and the second terminals is greater than or equal to two, each of the first terminals (34) is arranged along the axial direction of the drive assembly (3), and each of the second terminals (36) is arranged along the axial direction of the drive assembly (3).

5. The drive assembly according to any one of claims 1 to 4, characterized in that: The circuit board assembly (32) comprises a first substrate (11), a chip (12), a peripheral device (13) and a packaging layer (14); the chip (12) and the peripheral device (13) are both fixedly connected to the first substrate (11); the packaging layer (14) packages the chip (12) and the peripheral device (13); and the first substrate (11) is located in the electronic component area.

6. The drive assembly according to claim 5, characterized in that The circuit board assembly (32) comprises a second substrate (31), the first substrate (11) is fixedly connected and electrically connected to the second substrate (31), and the terminal area is located on the second substrate (31).

7. The drive assembly according to claim 6, characterized in that The driving component (3) includes a capacitor (35), the capacitor (35) is electrically connected to the second substrate (31), the capacitor (35) is located on one side of the second substrate (31), the first substrate (11) is located on the other side of the second substrate (31), at least part of the capacitor (35) is located on the back side of the first substrate (11), the capacitor (35) is electrically connected to the second substrate (31), the capacitor (35) extends from the second substrate (31) toward the coil (33), the terminal (30) includes a first terminal (34) and a second terminal (36), and along the circumference of the driving component (3), at least part of the capacitor (35) is located between the first terminal (34) and the second terminal (36).

8. The drive assembly according to claim 6 or 7, characterized in that: The drive assembly (3) includes a rotor (5), the rotor (5) includes a permanent magnet (51), the permanent magnet (51) includes at least two pairs of magnetic poles, and the coil (33) is arranged around the outer periphery of the permanent magnet (51); The driving component (3) includes at least one sensor (9), and the sensor (9) includes a sensing portion (91) and a connecting portion (92). The sensing portion (91) is electrically connected to the second substrate (31) through the connecting portion (92). The sensing portion (91) can sense the change of the magnetic pole of the permanent magnet (51). Along the radial direction of the driving component (3), the sensing portion (91) of one sensor (9) is located on one side of the permanent magnet (51); and the connecting portion (92) is located between the edge of the circuit board component (32) and the electronic component area.

9. An electric device (100), comprising the drive assembly (3) according to any one of claims 1 to 8; The electric device (100) comprises a valve core (6) and a valve seat (7), wherein the valve seat (7) has a valve opening, and the drive assembly (3) is capable of driving the valve core (6) so that the valve core (6) moves relative to the valve seat (7), thereby closing or opening the valve opening; Alternatively, the electric device (100) includes an impeller, and the driving assembly (3) is capable of driving the impeller.

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