Wafer with diamond sheet array, mold and preparation method

Abstract

The invention discloses a wafer with a diamond sheet array, a mold and a preparation method, the wafer comprises a first filling layer and a second filling layer which are coated with a plurality of diamond sheets, and the first filling layer is small in hardness and large in elasticity. The mold comprises a lower mold, an outer mold, a first upper mold and a second upper mold. A first filling space is formed among the first upper mold, the outer mold and the lower mold; and a second filling space is formed among the second upper mold, the outer mold and the lower mold. According to the method, the die is used for preparing the wafer with the diamond sheet array, and the wafer is prepared through the die and the method. By arranging the first filling layer and the second filling layer, the plurality of diamond sheet monomers form the wafer with the diamond sheet array, the plurality of diamond sheet monomers can form the wafer structure, so that the plurality of diamond sheets can be processed in batches at a time in the processing flows of photoetching, injection, etching and the like, and the method can be compatible with conventional semiconductor processing equipment, and is suitable for large-scale production. The equipment utilization rate is increased; the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diamond sheet preparation, and in particular to a wafer with diamond sheet array, a mold and a preparation method. BACKGROUND

[0002] Diamond color centers are the most practical and reliable material system in the fields of quantum computing, quantum information, quantum measurement, etc. The preparation process of diamond color centers is complex and delicate, involving preprocessing, photolithography, implantation, etching and post-processing. During preprocessing, single crystal diamond sheets need to be polished and cleaned to remove surface impurities and defects, improve flatness and smoothness, and lay a solid foundation for subsequent processes. In the photolithography process, after uniform coating of photoresist, the photoresist is chemically reacted in the specified area by photolithography microscope precise alignment positioning mark, and then developed to form a predetermined pattern. In the implantation stage, ion sources such as nitrogen ions are selected according to the type of color center, and parameters are adjusted to allow ions to enter the interior of the diamond sheet under the acceleration of the electric field to form defects and form color centers. If surface micro-nano processing is required, the etching step is entered, the etching mask is accurately aligned through the etching technology, and the unwanted part is removed by using reactive ion etching method combined with specific parameter setting to carve out the required micro-nano structure. Finally, the photoresist is removed by chemical stripping or plasma ashing, and high-temperature annealing is performed to optimize the performance of the color center and provide high-quality materials for quantum technology applications. The entire process is closely linked, and each step needs to be accurately operated to ensure that the finally prepared diamond color center has excellent performance and meets the needs of scientific research and practical application.

[0003] The size of the single crystal diamond sheet currently used in quantum technology is usually in the order of millimeters, while the design of the processing flow of ultraviolet photolithography, implantation, etching, etc. in existing specific preparation process equipment is for processing large-size wafers, and only one sample is processed at a time. This contradiction results in low utilization rate of equipment and low efficiency of single processing, leading to high unit processing cost, which restricts the large-scale application of diamond color centers in quantum technology. SUMMARY

[0004] The purpose of the present application is to provide a wafer with diamond sheet array, a mold and a preparation method, which overcomes the technical limitation that the existing photolithography, implantation, etching and other processing flows can only process one diamond color center sample at a time, enhances the utilization rate of equipment and reduces production costs, and broadens the large-scale application of diamond color centers.

[0005] In order to achieve the above-mentioned purpose, the present application provides a wafer with diamond sheet array, comprising: A first filling layer, the first filling layer is covered with a plurality of spaced diamond sheets, the surface of each diamond sheet is flush with the first surface of the first filling layer, or the first surface of the first filling layer is slightly higher than the surface of each diamond sheet; a second filling layer, the second filling layer being arranged on a second surface of the first filling layer without the diamond sheet, the first filling layer having a hardness less than that of the second filling layer and an elasticity greater than that of the second filling layer.

[0006] The present application forms a wafer with a diamond sheet array by arranging the first filling layer and the second filling layer to form a plurality of diamond sheet monomers, so that a plurality of diamond sheets can be processed in batches in a single process flow such as photolithography, implantation, etching, etc. The device utilization rate can be improved and the production cost can be reduced in the subsequent process of diamond color center preparation, and the large-scale application of diamond color center is widened. At the same time, compared with the second filling layer, the first filling layer has high elasticity and low hardness, can bear the diamond sheet, and can avoid scratching the mask plate in the subsequent photolithography process. The second filling layer has high hardness and can keep the wafer structure stable. Specifically, when the surface of the diamond sheet is flush with the first surface of the first filling layer, the mask plate contacts the diamond sheet and the first surface of the first filling layer and applies pressure to the diamond sheet and the first filling layer. If the diamond sheet surface has an edge or corner protruding from the diamond surface, the diamond sheet with the edge or corner will move away from the mask plate under the action of the elastic first filling layer to avoid scratching or crushing the mask plate. Further, when the first surface of the first filling layer is slightly higher than the surface of each diamond sheet, the mask plate will first contact the first surface of the first filling layer, which can avoid scratching the mask plate when the diamond sheet is contacted.

[0007] In an optional embodiment, the thickness of the first filling layer is greater than the thickness of the diamond sheet, preferably 4-8 times the thickness of the diamond sheet.

[0008] In an optional embodiment, the first filling layer is an elastic resin filling layer. The second filling layer is a non-elastic resin filling layer.

[0009] In an optional embodiment, the first filling layer is a PDMS resin filling layer. The second filling layer is an epoxy resin filling layer.

[0010] The present application also provides a mold for preparing a wafer with a diamond sheet array, comprising: a lower mold, a first surface of the lower mold being provided with a plurality of vacuum suction holes for vacuum adsorbing diamond sheets; an outer mold, the outer mold being in a ring structure and arranged on the first surface of the lower mold. a first upper mold configured to cooperate with the outer mold, a bottom surface of the first upper mold, an inner wall surface of the outer mold, and the first surface of the lower mold forming a first filling space; a second upper mold configured to cooperate with the outer mold, a bottom surface of the second upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold forming a second filling space, the second filling space having a height greater than that of the first filling space.

[0011] The first filling space and the second filling space are formed by the first upper mold and the second upper mold cooperating with the lower mold and the outer mold, respectively, so that the mold of the present application is used to form a wafer with a diamond sheet array having a first filling layer and a second filling layer.

[0012] In an optional embodiment, a positioning plate is further included, the positioning plate having a plurality of positioning through holes, the plurality of positioning through holes being arranged in one-to-one correspondence with the plurality of vacuum suction holes, the positioning through holes having a cross-sectional size matched with an outer contour of the diamond sheet, the positioning plate being configured to cooperate with the first surface of the lower mold, when the positioning plate cooperates with the first surface, the positioning through holes exposing the vacuum suction holes, so that the vacuum suction holes vacuum-suck the diamond sheet.

[0013] In an optional embodiment, the first upper mold has a first injection port, when the first upper mold cooperates with the outer mold, the first injection port being in communication with the first filling space; the second upper mold has a second injection port, when the second upper mold cooperates with the outer mold, the second injection port being in communication with the second filling space.

[0014] In an optional embodiment, the inner wall of the outer mold has a first cooperating portion and a second cooperating portion arranged circumferentially along the inner wall of the outer mold; the first cooperating portion being located closer to the lower mold, the first cooperating portion being configured to cooperate with the first upper mold to form the first filling space; the second cooperating portion being located farther from the outer mold axis than the first cooperating portion, the second cooperating portion being configured to cooperate with the second upper mold to form the second filling space.

[0015] In an optional embodiment, the outer mold has a first clamping structure, the lower mold has a second clamping structure, the second clamping structure clampingly cooperating with the first clamping structure, so that the outer mold and the lower mold are detachably clamped.

[0016] The outer mold and the lower mold are detachably connected through a clamping structure, so that the diamond sheet can be easily demolded without being scratched.

[0017] In an optional embodiment, the lower mold further has a vacuum channel connected with the vacuum suction holes respectively, and the vacuum channel is formed with a vacuum interface on the body wall of the lower mold, and the vacuum interface is used for connecting with a vacuum device.

[0018] The application further provides a preparation method of a wafer with a diamond sheet array, including the following steps: A lower mold is provided, and a first surface of the lower mold is provided with a plurality of vacuum suction holes, and a plurality of diamond sheets are vacuum adsorbed on the vacuum suction holes of the lower mold; An outer mold is provided, and the outer mold is in a ring structure, and the outer mold is arranged on the first surface of the lower mold; A first upper mold is provided, and the first upper mold is matched with the outer mold, a bottom surface of the first upper mold, an inner wall surface of the outer mold and the first surface of the lower mold form a first filling space, and the plurality of diamond sheets are located in the first filling space; A first filling material is filled in the first filling space to form a first filling layer, and the first filling layer covers the plurality of diamond sheets; The first upper mold is removed, a second upper mold is provided, and the second upper mold is matched with the outer mold, a bottom surface of the second upper mold, part of the inner wall surface of the outer mold and a surface of the first filling layer without the diamond sheets form a third filling space; A second filling material is filled in the third filling space to form a second filling layer, the hardness of the first filling layer is less than the hardness of the second filling layer, and the elasticity of the first filling layer is greater than the elasticity of the second filling layer; The second upper mold, the outer mold and the lower mold are removed, and a wafer with a diamond sheet array is obtained.

[0019] The plurality of vacuum suction holes of the lower mold of the mold can correspondingly adsorb the plurality of diamond sheets, and after the filling space is filled with the filling material, the plurality of diamond sheets can form a wafer structure, so that the plurality of diamond sheets can be processed in batches in a single process flow of photolithography, implantation, etching and the like, the utilization rate of equipment can be improved and the production cost can be reduced in the subsequent processes of the diamond color center preparation, such as photolithography, implantation, etching and post-processing, and the large-scale application of the diamond color center is widened.

[0020] In an optional embodiment, the pressure applied in forming the first filling layer slightly higher than the surface of each diamond sheet is slightly greater than the pressure applied in forming the first filling layer flush with the surface of each diamond sheet, so that after demolding, the first surface of the first filling layer with elasticity is slightly higher than the surface of each diamond sheet.

[0021] In an optional embodiment, the first filling material is an elastic resin: PDMS resin, and the second filling material is a non-elastic resin: epoxy resin.

[0022] In an optional embodiment, the diamond sheet is vacuum-sucked onto the vacuum suction hole of the lower mold using a positioning plate, and the positioning plate has a plurality of positioning through holes arranged one-to-one with the plurality of vacuum suction holes. After the diamond sheet is vacuum-sucked onto the vacuum suction hole of the lower mold, the positioning plate is removed.

[0023] In actual use, the outer mold is coaxially arranged with the lower mold, and the vacuum suction hole is located inside the ring body of the outer mold.

[0024] In actual use, the upper surface of the vacuum suction hole does not exceed the upper surface of the lower mold, and is preferably flush with the upper surface of the lower mold, so as to facilitate demolding.

[0025] The beneficial effects of the present application are as follows: The present application forms a wafer with a diamond sheet array by setting a first filling layer and a second filling layer, so that multiple diamond sheets can be processed in batches in a single process such as photolithography, implantation, etching, etc., and can be compatible with current conventional semiconductor processing equipment, thereby enhancing equipment utilization and reducing production costs in subsequent processes of diamond color center preparation, and widening the large-scale application of diamond color centers. At the same time, compared with the second filling layer, the first filling layer has greater elasticity and lower hardness, which can avoid scratching the mask plate during subsequent photolithography processes. Specifically, when performing photolithography process, when the surface of the diamond sheet is flush with the first surface of the first filling layer, the mask plate contacts the diamond sheet and the first surface of the first filling layer and applies pressure to the diamond sheet and the first filling layer, if the diamond sheet surface has edges or corners protruding from the diamond surface, the diamond sheet with edges or corners will move away from the mask plate under the action of the elastic first filling layer, so as to avoid scratching or breaking the mask plate. Further, when the first surface of the first filling layer is slightly higher than the surface of each diamond sheet, the mask plate will first contact the first surface of the first filling layer, which can avoid scratching the mask plate when the diamond sheet is contacted. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings. In addition, in the following drawings, the components are not necessarily drawn to scale, and the components with similar related properties or characteristics can have the same or similar reference numerals.

[0027] Figure 1 Structure diagram of a mold for preparing a wafer with diamond sheet array in an embodiment of the present application; Figure 2 Structure diagram of the shaft side of a lower mold in an embodiment of the present application; Figure 3 Structure diagram of the shaft side of a positioning plate in an embodiment of the present application; Figure 4 Structure diagram of the shaft side of an outer mold in an embodiment of the present application; Figure 5 Structure diagram of the shaft side of a first upper mold in an embodiment of the present application; Figure 6 Structure diagram of the cross section of an outer mold in another embodiment of the present application; Figure 7 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 1 ; Figure 8 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 2 ; Figure 9 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 3 ; Figure 10 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 4 ; Figure 11 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 5 ; Figure 12 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 6 ; Figure 13 Step of the preparation method of a wafer with diamond sheet array in an embodiment of the present application Figure 7 ; Figure 14A step of a method for preparing a wafer with a diamond sheet array in an embodiment of the present application Figure 8 ; Figure 15 A step of a method for preparing a wafer with a diamond sheet array in an embodiment of the present application Figure 9 ; Figure 16 A step of a method for preparing a wafer with a diamond sheet array in an embodiment of the present application Figure 10 (and a structural diagram of a wafer with a diamond sheet array); Figure 17 A flow chart of a method for preparing a wafer with a diamond sheet array in an embodiment of the present application; Reference signs in the drawings are as follows: 1, lower mold; 11, vacuum suction hole; 12, vacuum channel; 13, vacuum interface; 14, convex rib; 2, outer mold; 21, first matching part; 22, second matching part; 23, groove; 3, first upper mold; 31, first injection port; 32, handle; 41, first filling space; 42, three filling spaces; 5, positioning plate; 51, positioning through hole; 6, second upper mold; 61, second injection port; 7, diamond sheet; 71, first filling material; 72, second filling material; 100, wafer with diamond sheet array; 101, first filling layer; 102, second filling layer. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments.

[0029] In the description of the present application, it should be noted that the use of the words "first", "second", and the like to define objects (such as elements, components, regions, layers, doping types, and / or portions) is merely for the convenience of distinguishing different objects, and does not necessarily indicate a specific order or sequence, unless the context clearly indicates otherwise. It should be understood that such data used in this way can be interchanged under appropriate circumstances.

[0030] In the description of the present application, it should be understood that the singular forms "a", "an" and "the" can also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprise" and / or "include" are used in the specification, the presence of the described features, integers, steps, operations, elements, and / or components can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups is not excluded. At the same time, the term "and / or" as used herein includes any and all combinations of the related listed items.

[0031] In the description of the application, it also needs to be explained that when one component is referred to as "on", "connected to" or "contacting" another component, it can not only mean that the one component is directly on the other component, directly connected to the other component, directly contacting the other component, but also means that there can be an intermediate component between the one component and the other component. In addition, "connection" can include detachable connection or integral connection in addition to fixed connection. Similarly, when an element is referred to as "electrically connected", "electrically contacting", "electrically coupled" or "electrically coupled to" another element, the one element and the other element can be in direct electrical contact or point coupling, or in electrical contact or point coupling through an intermediate element.

[0032] In the description of the application, it also needs to be explained that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and in the absence of the opposite description, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the scope of protection of the application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0033] Also, in the description of the application, spatial relationship terms such as "under", "below", "lower", "under", "on", "upper surface", "above" and the like can be used to describe the spatial position relationship of one element or feature with other elements or features shown in the drawings. It should be understood that the spatial relationship terms include different orientations of the elements or features in use and operation in addition to the orientation shown in the drawings. For example, if the elements or features in the drawings are turned over or inverted, the element or feature described as "under" or "below" or "under" the other element or feature will be oriented "on" the other element or feature. In addition, the elements can also include other orientations (e.g., rotated at an angle or other orientations).

[0034] Please refer to Figure 16 The application provides a wafer with a diamond sheet array, comprising: A first filling layer 101, the first filling layer 101 is covered with a plurality of spaced diamond sheets 7, the surface of each diamond sheet 7 is flush with the upper surface of the first filling layer 101, or the first surface of the first filling layer 101 is slightly higher than the surface of each diamond sheet 7; A second filling layer 102 is arranged on the second surface of the first filling layer 101 without the diamond sheet 7, the hardness of the first filling layer 101 is less than that of the second filling layer 102, and the elasticity of the first filling layer 101 is greater than that of the second filling layer 102.

[0035] The first filling layer 101 and the second filling layer 102 are arranged to form the wafer 100 with the diamond sheet array from the plurality of diamond sheet monomers, so that the plurality of diamond sheets 7 can be processed in batches in a single process such as photolithography, implantation, etching, etc. In the subsequent processes of preparing the diamond color center, such as photolithography, implantation, etching, and post-processing, the equipment utilization can be improved and the production cost can be reduced, and the large-scale application of the diamond color center can be widened. At the same time, compared with the second filling layer 102, the first filling layer 101 has high elasticity and low hardness, which can avoid scratching the mask plate in the subsequent photolithography process. Specifically, when the surface of the diamond sheet 7 is flush with the first surface of the first filling layer 101, the mask plate contacts the first surface of the first filling layer 101 and applies pressure to the diamond sheet 7 and the first filling layer 101. If the diamond sheet 7 has an edge or corner protruding from the surface of the diamond sheet, the diamond sheet 7 with the edge or corner will move away from the mask plate under the action of the elastic first filling layer 101, so as to avoid scratching or crushing the mask plate. Further, when the first surface of the first filling layer 101 is slightly higher than the surface of each diamond sheet 7, the mask plate will first contact the first surface of the first filling layer 101, so as to avoid scratching the mask plate when the diamond sheet contacts the mask plate.

[0036] In an embodiment, the thickness of the first filling layer 101 is greater than the thickness of the diamond sheet, and is preferably 4-8 times the thickness of the diamond sheet.

[0037] In an embodiment, the first filling layer 101 is an elastic resin filling layer. The second filling layer 102 is a non-elastic resin filling layer.

[0038] In a specific embodiment, the first filling layer 101 is a PDMS resin filling layer. The second filling layer 102 is an epoxy resin filling layer.

[0039] In a specific embodiment, the radial dimension of the second filling layer 102 is greater than the radial dimension of the first filling layer 101.

[0040] In actual use, the cross-sectional outer contour dimension of the diamond sheet can be 1-9 mm, and the size of the wafer 100 (the second filling layer 102) with the diamond sheet array can be 2 inches, 4 inches, 6 inches, or 8 inches.

[0041] Please refer to Figures 1 to 6The application also provides a mold for preparing a wafer with a diamond sheet array, comprising: a lower mold 1, a first surface of the lower mold 1 is provided with a plurality of vacuum suction holes 11 for vacuum suction of the diamond sheets 7; an outer mold 2, the outer mold 2 is in a ring structure, and the outer mold 2 is arranged on the first surface of the lower mold 1; a first upper mold 3, the first upper mold 3 is used in cooperation with the outer mold 2, a bottom surface of the first upper mold 3, an inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a first filling space 41; a second upper mold 6, the second upper mold 6 is used in cooperation with the outer mold 2, a bottom surface of the second upper mold 6, an inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a second filling space, and a height of the second filling space is greater than a height of the first filling space 41.

[0042] The first filling space 41 and the second filling space are formed by the first upper mold 3 and the second upper mold 6 in cooperation with the lower mold 1 and the outer mold 2 respectively, so that the mold is used to form the wafer with the diamond sheet array with the first filling layer 101 and the second filling layer 102.

[0043] In an embodiment, a positioning plate 5 is further included, the positioning plate 5 is provided with a plurality of positioning through holes 51, the plurality of positioning through holes 51 are arranged in one-to-one correspondence with the plurality of vacuum suction holes 11, a cross-sectional dimension of the positioning through hole is matched with an outer contour of the diamond sheet 7, the positioning plate 5 is used in cooperation with the first surface of the lower mold 1, when the positioning plate 5 cooperates with the first surface, the positioning through hole 51 exposes the vacuum suction hole 11, so that the vacuum suction hole 11 can vacuum suction the diamond sheet 7.

[0044] In a specific embodiment, the cross-sectional dimension of the positioning through hole is preferably slightly greater than the outer contour dimension of the diamond sheet 7, so that the diamond sheet 7 can be accurately positioned and the positioning plate 5 can be taken out.

[0045] In an embodiment, the first upper mold 3 is provided with a first injection port 31, when the first upper mold 3 cooperates with the outer mold 2, the first injection port 31 is in communication with the first filling space 41; The second upper mold 6 is provided with a second injection port 61, when the second upper mold 6 cooperates with the outer mold 2, the second injection port 61 is in communication with the second filling space.

[0046] In another embodiment, the first injection port 31 and the second injection port 61 can be arranged on the body wall of the outer mold 2 respectively.

[0047] In a specific embodiment, the first upper mold 3 and the second upper mold 6 are respectively provided with a handle 32 for facilitating demolding, and the first upper mold 3 and the second upper mold 6 can be respectively detached from the outer mold 2 by holding the handle 32.

[0048] In a specific embodiment, the bottom surface of the outer mold 2, the bottom surface of the first upper mold 3, and the bottom surface of the second upper mold 6 are all flat surfaces.

[0049] In an embodiment, the inner wall of the outer mold 2 is provided with a first matching part 21 and a second matching part 22 arranged circumferentially along the inner wall of the outer mold 2. The first matching part 21 is located closer to the lower mold 1, and the first matching part 21 is used to cooperate with the first upper mold 3 to form a first filling space 41. The distance from the second matching part 22 to the axis of the outer mold 2 is greater than the distance from the first matching part 21 to the axis of the outer mold 2, and the second matching part 22 is used to cooperate with the second upper mold 6 to form a second filling space.

[0050] In an embodiment, the first matching part 21 is a first ring-shaped step, and the second matching part 22 is a conical surface extending from the step surface of the first ring-shaped step to the bottom surface of the outer mold 2 without penetrating through the bottom surface of the outer mold 2. The closer to the bottom surface of the outer mold 2, the smaller the distance from the conical surface to the axis of the outer mold 2. At this time, the first filling space 41 is a columnar filling space, and the second filling space has a columnar filling space. The first filling layer 101 generated correspondingly is a columnar filling layer, and the second filling layer 102 is a columnar filling layer.

[0051] Please refer to Figure 6 In another embodiment, the first matching part 21 is a first ring-shaped step, and the second matching part 22 is a second ring-shaped step recessed from the step surface of the first ring-shaped step to the bottom surface of the outer mold 2 without penetrating through the bottom surface of the outer mold 2. At this time, the first filling space 41 and the second filling space are both columnar filling spaces, and the first filling layer 101 and the second filling layer 102 generated correspondingly are both columnar filling layers.

[0052] In actual use, the vertical surfaces above the step surface of the first ring-shaped step and the step surface of the second ring-shaped step can also be conical surfaces. The closer to the bottom surface of the outer mold 2, the smaller the distance from the conical surface to the axis of the outer mold 2.

[0053] In actual use, the outer edge shape of the first upper mold 3 is arranged corresponding to the shape of the conical surface or the second ring-shaped step, and the outer edge shape of the second upper mold 6 is arranged corresponding to the shape of the first ring-shaped step.

[0054] In another embodiment, the inner wall of the outer mold 2 does not have the first and second matching parts 21 and 22, the thickness of the first upper mold 3 is smaller than that of the second upper mold 6, and the outer edges of the first and second upper molds 3 and 6 are matched with the upper end surface of the outer mold 2 to form the first and second filling spaces 41 and 42. At this time, the outer diameters of the first and second filling layers 101 and 102 generated correspondingly are equal.

[0055] Please refer to Figure 1 and Figure 9 In an embodiment, the outer mold 2 has a first clamping structure, the lower mold 1 has a second clamping structure, and the second clamping structure is clamped and matched with the first clamping structure so that the outer mold 2 and the lower mold 1 are detachably clamped and arranged.

[0056] The detachable clamping arrangement of the outer mold 2 and the lower mold 1 through the clamping structure can facilitate demolding to avoid scratching of the diamond sheet 7 during the demolding process.

[0057] In a specific embodiment, the first clamping structure is a continuous groove 23 arranged at the edge position of the bottom surface of the outer mold 2, and the second clamping structure is a continuous ridge 14 arranged at the edge position of the upper surface of the lower mold 1, and the ridge 14 is clamped and matched with the groove 23.

[0058] In another embodiment, the outer mold 2 and the lower mold 1 can be fixed or integrally formed. At this time, before the first and second filling layers 101 and 102 are formed, a demolding layer (demolding agent) needs to be arranged on the surface of the outer mold 2 and the lower mold 1.

[0059] In another embodiment, the first clamping structure is a continuous ridge arranged at the edge position of the bottom surface of the outer mold 2, and the second clamping structure is a continuous groove arranged at the edge position of the upper surface of the lower mold 1, and the ridge is clamped and matched with the groove.

[0060] In another embodiment, the first clamping structure is a recess hole arranged at the edge position of the bottom surface of the outer mold 2, the recess hole is a plurality of circumferentially spaced blind holes, the second clamping structure is a continuous protruding column arranged at the edge position of the upper surface of the lower mold 1, the protruding column has a plurality of corresponding blind holes, and the blind hole and the protruding column are inserted and matched.

[0061] In an embodiment, the lower mold 1 also has a vacuum channel 12, the vacuum channel 12 is connected with a plurality of vacuum suction holes 11 respectively, and the vacuum channel 12 is formed with a vacuum interface 13 on the body wall of the lower mold 1, and the vacuum interface 13 is used for external connection of a vacuum device.

[0062] In another embodiment, a suction disc can also be arranged in the vacuum suction hole 11 to better adsorb the diamond sheet.

[0063] Please refer to Figures 7 to 17The application also provides a preparation method of a wafer with a diamond sheet array, comprising the following steps: S100. A lower mold 1 is provided, and a first surface of the lower mold 1 is provided with a plurality of vacuum suction holes 11. A plurality of diamond sheets 7 are vacuum-sucked onto the vacuum suction holes 11 of the lower mold 1. S200. An outer mold 2 is provided, and the outer mold 2 has a ring structure. The outer mold 2 is arranged on the first surface of the lower mold 1. S300. A first upper mold 3 is provided, and the first upper mold 3 is matched with the outer mold 2. A bottom surface of the first upper mold 3, an inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a first filling space 41, and the plurality of diamond sheets 7 are located in the first filling space 41. S400. A first filling material 71 is filled in the first filling space 41 to form a first filling layer 101, and the first filling layer 101 wraps the plurality of diamond sheets 7. S500. The first upper mold 3 is removed, and a second upper mold 6 is provided. The second upper mold 6 is matched with the outer mold 2. A bottom surface of the second upper mold 6, a part of the inner wall surface of the outer mold 2 and a surface of the first filling layer 101 without the diamond sheets 7 form a third filling space 42. S600. A second filling material 72 is filled in the third filling space 42 to form a second filling layer 102. The hardness of the first filling layer 101 is smaller than the hardness of the second filling layer 102, and the elasticity of the first filling layer 101 is greater than the elasticity of the second filling layer 102. S700. The second upper mold 6, the outer mold 2 and the lower mold 1 are removed to obtain a wafer 100 with a diamond sheet array.

[0064] The plurality of vacuum suction holes 11 of the lower mold 1 of the mold provided by the application can correspondingly suck the plurality of diamond sheets 7. After the filling space is filled with the filling material, the plurality of diamond sheet monomers can form a wafer structure, so that a plurality of diamond sheets 7 can be processed in batches in a single process flow of photolithography, implantation, etching and the like. In the subsequent processes of the preparation of the diamond color center, such as photolithography, implantation, etching and post-processing, the equipment utilization rate can be improved and the production cost can be reduced, and the large-scale application of the diamond color center is widened.

[0065] In an embodiment, the first filling material 71 is an elastic resin, PDMS resin, and the second filling material 72 is a non-elastic resin, epoxy resin. The first filling material 71 forms the first filling layer 101 after curing, and the second filling material 72 forms the second filling layer 102 after curing.

[0066] In an embodiment, the pressure applied to form the first filling layer 101 slightly higher than the surface of each diamond sheet 7 is slightly greater than the pressure applied to form the first filling layer 101 flush with the surface of the diamond sheet 7, so that after demolding, the first surface of the first filling layer 101 with elasticity is slightly higher than the surface of each diamond sheet 7.

[0067] In a specific embodiment, the pressure applied to form the first filling layer 101 slightly higher than the surface of each diamond sheet 7 is 5MPa-20MPa greater than the pressure applied to form the first filling layer 101 flush with the surface of the diamond sheet 7.

[0068] In a specific embodiment, the first filling material 71 is injected through the first injection port 31, and the second filling material 72 is injected through the second injection port 61.

[0069] In fact, the second filling space in the mold includes the first filling space 41 and the third filling space 42 in the method.

[0070] In an embodiment, in step S100, the diamond sheet 7 is vacuum-sucked onto the vacuum suction hole 11 of the lower mold 1 using the positioning plate 5, and the positioning plate 5 has a plurality of positioning through holes 51, which are arranged one-to-one with the plurality of vacuum suction holes 11. After the diamond sheet 7 is vacuum-sucked onto the vacuum suction hole 11 of the lower mold 1, the positioning plate 5 is removed.

[0071] In another embodiment, the positioning plate 5 can not be used, and the diamond sheet 7 can be aligned and sucked onto the vacuum suction hole 11 by directly manually operating using tweezers or other tools.

[0072] In actual use, the outer mold 2 is coaxially arranged with the lower mold 1, and the vacuum suction hole 11 is located inside the ring body of the outer mold 2.

[0073] In actual use, the upper surface of the vacuum suction hole 11 does not exceed the upper surface of the lower mold 1, and is preferably flush with the upper surface of the lower mold 1, so as to facilitate demolding.

[0074] After the wafer with a diamond sheet array is actually processed, the first filling layer 101 and the second filling layer 102 can be removed by a dissolution process.

[0075] In this application, the diamond sheet 7 refers to a diamond sheet original body or a diamond color center, and the wafer 100 with a diamond sheet array refers to a wafer containing an array of diamond sheet original bodies or a wafer containing an array of diamond color centers.

[0076] It should be noted that the features of the above-described various embodiments of the present application can be combined with each other without conflict. Also, in each of the above-described embodiments, each embodiment mainly describes the difference from other embodiments, and other specific descriptions of the same / similar parts between the embodiments can be referred to (or referred to) each other. In addition, in the above description, the description of the known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present application.

[0077] Although the present application has been disclosed with reference to the preferred embodiments, it is not intended to limit the present application thereto, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application without departing from the spirit and scope of the present application by using the disclosed methods and technical contents. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, without departing from the technical solutions of the present application, are all within the protection scope of the technical solutions of the present application.

Claims

1. A wafer having an array of diamond plates, characterized by, The first filling layer is covered with a plurality of diamond pieces arranged at intervals, the surface of each diamond piece is flush with the first surface of the first filling layer, or the first surface of the first filling layer is slightly higher than the surface of each diamond piece. The second filling layer is arranged on the second surface of the first filling layer without diamond pieces, the hardness of the first filling layer is less than that of the second filling layer, and the elasticity of the first filling layer is greater than that of the second filling layer. The first filling layer is an elastic resin filling layer.

2. A wafer having an array of diamond plates as claimed in claim 1, wherein, The second filling layer is a non-elastic resin filling layer. The first surface of the lower mold is provided with a plurality of vacuum suction holes for vacuum suction of diamond pieces.

3. A mold for making a wafer having an array of diamond plates, characterized by, The outer mold is in a ring structure and is arranged on the first surface of the lower mold. The bottom surface of the first upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold form a first filling space. The bottom surface of the second upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold form a second filling space, and the height of the second filling space is greater than that of the first filling space. The positioning plate has a plurality of positioning through holes corresponding to the plurality of vacuum suction holes, the cross-sectional dimension of the positioning hole is matched with the outer contour of the diamond piece, and the positioning plate is matched with the first surface of the lower mold. The first upper mold has a first injection port, and the first injection port communicates with the first filling space when the first upper mold is matched with the outer mold.

4. A mold for making a wafer having an array of diamond plates as recited in claim 3, wherein, The second upper mold has a second injection port, and the second injection port communicates with the second filling space when the second upper mold is matched with the outer mold.

5. A mold for making a wafer having an array of diamond plates as recited in claim 3, wherein, The inner wall of the outer mold has a first matching part and a second matching part arranged circumferentially along the inner wall of the outer mold. The first matching part is located closer to the lower mold, and the first matching part is matched with the first upper mold to form the first filling space.

6. A mold for making a wafer having an array of diamond plates as recited in claim 3, wherein, The distance from the second matching part to the axis of the outer mold is greater than the distance from the first matching part to the axis of the outer mold, and the second matching part is matched with the second upper mold to form the second filling space. The following steps are included: A lower mold is provided, the first surface of the lower mold is provided with a plurality of vacuum suction holes, and a plurality of diamond pieces are vacuum suctioned on the vacuum suction holes of the lower mold.

7. A method of producing a wafer having an array of diamond plates, characterized by, An outer mold is provided, the outer mold is in a ring structure, and the outer mold is arranged on the first surface of the lower mold. ​ ​ The first upper mold is provided, and the first upper mold is matched with the outer mold, a bottom surface of the first upper mold, an inner wall surface of the outer mold and a first surface of the lower mold form a first filling space, and a plurality of diamond pieces are located in the first filling space; A first filling layer is formed by filling the first filling space with a first filling material, and the first filling layer covers the plurality of diamond pieces; The first upper mold is removed, a second upper mold is provided, and the second upper mold is matched with the outer mold, a bottom surface of the second upper mold, part of the inner wall surface of the outer mold and a surface of the first filling layer without the diamond pieces form a third filling space; A second filling layer is formed by filling the third filling space with a second filling material, a hardness of the first filling layer is less than a hardness of the second filling layer, and an elasticity of the first filling layer is greater than an elasticity of the second filling layer; The second upper mold, the outer mold and the lower mold are removed, and a wafer with an array of diamond pieces is obtained.

8. A method of producing a wafer having an array of diamond plates as claimed in claim 7, wherein, The pressure applied when forming the first filling layer slightly higher than the surface of each diamond piece is slightly greater than the pressure applied when forming the first filling layer flush with the surface of the diamond piece.

9. A method of producing a wafer having an array of diamond plates as claimed in claim 7, wherein, The first filling material is an elastic resin, PDMS resin, and the second filling material is a non-elastic resin, epoxy resin.

10. A method of producing a wafer having an array of diamond plates as claimed in claim 9, wherein, The diamond pieces are vacuum adsorbed on the vacuum suction holes of the lower mold by using a positioning plate, and the positioning plate has a plurality of positioning through holes, and the plurality of positioning through holes are arranged one-to-one corresponding to the plurality of vacuum suction holes. After the diamond pieces are vacuum adsorbed on the vacuum suction holes of the lower mold, the positioning plate is removed.

Images