Wafer with array of diamond plates, mold and method of manufacture

Abstract

The application discloses a wafer with diamond sheet array, a mold and a preparation method. The wafer comprises a first filling layer and a second filling layer covering a plurality of diamond sheets, and the first filling layer has small hardness and large elasticity. The mold comprises a lower mold, an outer mold, a first upper mold and a second upper mold. The first upper mold, the outer mold and the lower mold form a first filling space; the second upper mold, the outer mold and the lower mold form a second filling space. The method is used for preparing the wafer with the diamond sheet array by using the mold, and the wafer is prepared by using the mold and the method. The first filling layer and the second filling layer are arranged to form the wafer with the diamond sheet array from the plurality of diamond sheet monomers, so that the plurality of diamond sheet monomers can form the wafer structure, the batch processing of the plurality of diamond sheets can be carried out in a single process flow such as photoetching, implantation and etching, the conventional semiconductor processing equipment can be compatible, the equipment utilization rate is enhanced, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diamond sheet preparation, and in particular to a wafer with a diamond sheet array, a mold and a preparation method. BACKGROUND

[0002] Diamond color centers are the most practical and reliable material system in the fields of quantum computing, quantum information, quantum measurement, etc. Diamond color center preparation process is complex and delicate, covering preprocessing, lithography, implantation, etching and post-processing. During preprocessing, single crystal diamond sheet needs to be polished and cleaned to remove surface impurities and defects, improve flatness and smoothness, and lay a solid foundation for subsequent processes. In the lithography process, after uniform coating of photoresist, the photoresist is chemically reacted in the specified area by using the microscope of the photoetching machine to accurately align the positioning mark, and then developed to form a predetermined pattern. In the implantation stage, ion sources such as nitrogen ions are selected according to the type of color center, and parameters are adjusted to allow ions to enter the interior of the diamond sheet under the acceleration of the electric field to generate defects and form color centers. If surface micro-nano processing is required, the etching step is entered, the etching mask is accurately aligned through the etching technology, and the unwanted part is removed by using the method of reactive ion etching combined with specific parameter setting to carve out the required micro-nano structure. Finally, the photoresist is removed by chemical stripping or plasma ashing, and high-temperature annealing is performed to optimize the performance of the color center and provide high-quality materials for quantum technology applications. The entire process is closely linked, and each step needs to be accurately operated to ensure that the finally prepared diamond color center has excellent performance and meets the needs of scientific research and practical application.

[0003] The size of the single crystal diamond sheet currently used in quantum technology is usually in the order of millimeters, while the design of the processing flow of ultraviolet lithography, implantation, etching, etc. in existing specific preparation process equipment is to handle large-size wafers, and only one sample is processed at a time. This contradiction makes the utilization rate of several process equipment low, the single processing efficiency low, and the unit processing cost high, which restricts the large-scale application of diamond color centers in quantum technology. SUMMARY

[0004] The purpose of the present application is to provide a wafer with a diamond sheet array, a mold and a preparation method, which overcomes the technical limitation that the existing lithography, implantation, etching and other processing flows can only process one diamond color center sample at a time, enhances the utilization rate of equipment and reduces production costs, and broadens the large-scale application of diamond color centers.

[0005] In order to achieve the above-mentioned purpose, the present application provides a wafer with a diamond sheet array, comprising:

[0006] The first filling layer is coated with a plurality of diamond pieces arranged at intervals, the surface of each diamond piece is flush with the first surface of the first filling layer, or the first surface of the first filling layer is slightly higher than the surface of each diamond piece;

[0007] The second filling layer is arranged on the second surface of the first filling layer without the diamond pieces, the hardness of the first filling layer is less than that of the second filling layer, and the elasticity of the first filling layer is greater than that of the second filling layer.

[0008] The present application forms a wafer with a diamond piece array by arranging the first filling layer and the second filling layer to form a plurality of diamond pieces, so that a plurality of diamond pieces can be processed in batches in a single process of photolithography, implantation, etching and the like, thereby enhancing the utilization rate of equipment and reducing production costs in the subsequent process of preparing diamond color centers, and widening the large-scale application of diamond color centers. At the same time, compared with the second filling layer, the first filling layer has high elasticity and low hardness, can bear the diamond pieces, and can avoid scratching the mask plate in the subsequent photolithography process. The second filling layer has high hardness and can keep the wafer structure stable. Specifically, when performing the photolithography process, when the surface of the diamond piece is flush with the first surface of the first filling layer, the mask plate contacts the diamond piece and the first surface of the first filling layer and exerts pressure on the diamond piece and the first filling layer, if the diamond piece surface has edges or corners protruding from the diamond surface, the diamond piece with edges or corners will move away from the mask plate under the action of the elastic first filling layer, so as to avoid scratching or crushing the mask plate. Further, when the first surface of the first filling layer is slightly higher than the surface of each diamond piece, the mask plate will first contact the first surface of the first filling layer, so as to avoid scratching the mask plate when the diamond piece contacts.

[0009] In an optional embodiment, the thickness of the first filling layer is greater than the thickness of the diamond piece, preferably 4-8 times the thickness of the diamond piece.

[0010] In an optional embodiment, the first filling layer is an elastic resin filling layer.

[0011] The second filling layer is a non-elastic resin filling layer.

[0012] In an optional embodiment, the first filling layer is a PDMS resin filling layer.

[0013] The second filling layer is an epoxy resin filling layer.

[0014] The present application also provides a mold for preparing a wafer with a diamond piece array, comprising:

[0015] a lower mold, a first surface of the lower mold is provided with a plurality of vacuum suction holes for vacuum suction of diamond sheets;

[0016] an outer mold, the outer mold is in a ring structure, and the outer mold is arranged on the first surface of the lower mold;

[0017] a first upper mold, the first upper mold is used to cooperate with the outer mold, a bottom surface of the first upper mold, an inner wall surface of the outer mold, and the first surface of the lower mold form a first filling space;

[0018] a second upper mold, the second upper mold is used to cooperate with the outer mold, a bottom surface of the second upper mold, an inner wall surface of the outer mold, and the first surface of the lower mold form a second filling space, and a height of the second filling space is greater than a height of the first filling space.

[0019] The first filling space and the second filling space are formed by the first upper mold and the second upper mold cooperating with the lower mold and the outer mold respectively, so that the wafer with the diamond sheet array having the first filling layer and the second filling layer is formed by using the mold.

[0020] In an optional embodiment, a positioning plate is further included, the positioning plate has a plurality of positioning through holes, the plurality of positioning through holes are arranged in one-to-one correspondence with the plurality of vacuum suction holes, a cross-sectional dimension of the positioning through hole is matched with an outer contour of the diamond sheet, and the positioning plate is used to cooperate with the first surface of the lower mold.

[0021] In an optional embodiment, the first upper mold has a first injection port, and the first injection port is in communication with the first filling space when the first upper mold cooperates with the outer mold.

[0022] The second upper mold has a second injection port, and the second injection port is in communication with the second filling space when the second upper mold cooperates with the outer mold.

[0023] In an optional embodiment, an inner wall of the outer mold has a first cooperation part and a second cooperation part arranged in a circumferential direction along the inner wall of the outer mold.

[0024] The first cooperation part is located on a side closer to the lower mold, and the first cooperation part is used to cooperate with the first upper mold to form the first filling space.

[0025] The second fitting part is farther away from the outer mold axis than the first fitting part, and is used to cooperate with the second upper mold to form the second filling space.

[0026] In an optional embodiment, the outer mold has a first clamping structure, and the lower mold has a second clamping structure, which clamps and cooperates with the first clamping structure to detachably clamp the outer mold and the lower mold.

[0027] The detachable clamping of the outer mold and the lower mold through the clamping structure can facilitate demolding to avoid scratching of the diamond sheets during demolding.

[0028] In an optional embodiment, the lower mold further has a vacuum channel, which is connected with the vacuum suction holes respectively, and a vacuum interface is formed on the wall of the lower mold, which is used to externally connect a vacuum device.

[0029] The application further provides a preparation method of a wafer with a diamond sheet array, which comprises the following steps:

[0030] A lower mold is provided, and a first surface of the lower mold is provided with a plurality of vacuum suction holes, and a plurality of diamond sheets are vacuum adsorbed on the vacuum suction holes of the lower mold.

[0031] An outer mold is provided, and the outer mold has a ring structure, and the outer mold is arranged on the first surface of the lower mold.

[0032] A first upper mold is provided, and the first upper mold cooperates with the outer mold, a bottom surface of the first upper mold, an inner wall surface of the outer mold and the first surface of the lower mold form a first filling space, and the plurality of diamond sheets are located in the first filling space.

[0033] A first filling material is filled in the first filling space to form a first filling layer, and the first filling layer covers the plurality of diamond sheets.

[0034] The first upper mold is removed, a second upper mold is provided, and the second upper mold cooperates with the outer mold, a bottom surface of the second upper mold, a part of the inner wall surface of the outer mold and a surface of the first filling layer without the diamond sheets form a third filling space.

[0035] A second filling material is filled in the third filling space to form a second filling layer, the hardness of the first filling layer is less than that of the second filling layer, and the elasticity of the first filling layer is greater than that of the second filling layer.

[0036] The second upper mold, the outer mold and the lower mold are removed to obtain a wafer with a diamond sheet array.

[0037] The several vacuum suction holes of the lower mold of the mold provided by the present application can correspond to suction of several diamond pieces. With the outer mold and the second upper mold, after filling of the filler in the filling space, the multiple diamond pieces can form a wafer structure, so that the multiple diamond pieces can be processed in batches in a single process flow of photolithography, implantation, etching, etc. In the subsequent processes of diamond color center preparation, such as photolithography, implantation, etching and post-processing, the equipment utilization can be improved and the production cost can be reduced, and the large-scale application of diamond color center can be widened.

[0038] In an optional embodiment, the pressure applied when forming the first filler layer slightly higher than the surface of each diamond piece is slightly greater than the pressure applied when forming the first filler layer flush with the surface of the diamond piece, so that after demolding, the first surface of the first filler layer with elasticity is slightly higher than the surface of each diamond piece.

[0039] In an optional embodiment, the first filler is an elastic resin: PDMS resin, and the second filler is a non-elastic resin: epoxy resin.

[0040] In an optional embodiment, the diamond pieces are vacuum-sucked onto the vacuum suction holes of the lower mold by using a positioning plate, and the positioning plate has several positioning through holes, and the several positioning through holes are arranged one-to-one corresponding to the several vacuum suction holes.

[0041] After the diamond pieces are vacuum-sucked onto the vacuum suction holes of the lower mold, the positioning plate is removed.

[0042] In actual use, the outer mold is coaxially arranged with the lower mold, and the vacuum suction holes are located inside the ring body of the outer mold.

[0043] In actual use, the upper surface of the vacuum suction hole does not exceed the upper surface of the lower mold, and is preferably flush with the upper surface of the lower mold, so as to facilitate demolding.

[0044] The beneficial effects of the present application are as follows:

[0045] The present application forms a wafer with a diamond sheet array by setting a first filling layer and a second filling layer to form a plurality of diamond sheet monomers, so that a plurality of diamond sheets can be processed in batches in a single process flow such as photolithography, implantation, etching, etc., and can be compatible with current conventional semiconductor processing equipment. In the subsequent process of preparing diamond color centers, the utilization rate of the equipment can be improved and the production cost can be reduced, and the large-scale application of diamond color centers can be widened. At the same time, compared with the second filling layer, the first filling layer has high elasticity and low hardness, which can avoid scratching the mask plate in the subsequent photolithography process. Specifically, when performing photolithography process, when the surface of the diamond sheet is flush with the first surface of the first filling layer, the mask plate is in contact with the diamond sheet and the first surface of the first filling layer and applies pressure to the diamond sheet and the first filling layer. If the diamond sheet surface has corners or edges protruding from the diamond surface, the diamond sheet with corners or edges will move away from the mask plate under the action of the elastic first filling layer, so as to avoid scratching or crushing the mask plate. Further, when the first surface of the first filling layer is slightly higher than the surface of each diamond sheet, the mask plate will first contact the first surface of the first filling layer, so as to avoid scratching the mask plate when the diamond sheet is contacted. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor. In addition, in the following drawings, the components are not necessarily drawn to scale, and components with similar related properties or characteristics can have the same or similar reference numerals.

[0047] Figure 1 Structure diagram of a mold for preparing a wafer with a diamond sheet array in an embodiment of the present application;

[0048] Figure 2 Structure diagram of the shaft side of a lower mold in an embodiment of the present application;

[0049] Figure 3 Structure diagram of the shaft side of a positioning plate in an embodiment of the present application;

[0050] Figure 4 Structure diagram of the shaft side of an outer mold in an embodiment of the present application;

[0051] Figure 5 Structure diagram of the shaft side of a first upper mold in an embodiment of the present application;

[0052] Figure 6A cross-sectional view of an outer mold for another embodiment of the application;

[0053] Figure 7 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 1 ;

[0054] Figure 8 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 2 ;

[0055] Figure 9 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 3 ;

[0056] Figure 10 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 4 ;

[0057] Figure 11 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 5 ;

[0058] Figure 12 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 6 ;

[0059] Figure 13 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 7 ;

[0060] Figure 14 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 8 ;

[0061] Figure 15 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 9 ;

[0062] Figure 16 A step in a method of making a wafer having an array of diamond plates in one embodiment of the application Figure 10 A cross-sectional view of a wafer having an array of diamond plates in one embodiment of the application;

[0063] Figure 17 A flow chart of a method of making a wafer having an array of diamond plates in one embodiment of the application;

[0064] The reference signs in the drawings refer to:

[0065] 1, lower mold; 11, vacuum suction hole; 12, vacuum channel; 13, vacuum interface; 14, ridge; 2, outer mold; 21, first matching part; 22, second matching part; 23, groove; 3, first upper mold; 31, first injection port; 32, handle; 41, first filling space; 42, three filling spaces; 5, positioning plate; 51, positioning through hole; 6, second upper mold; 61, second injection port; 7, diamond sheet; 71, first filling material; 72, second filling material; 100, wafer with diamond sheet array; 101, first filling layer; 102, second filling layer. DETAILED DESCRIPTION

[0066] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in conjunction with the drawings and embodiments.

[0067] In the description of the present application, it should be noted that the use of the words "first", "second", and the like to define objects (such as elements, components, regions, layers, doping types, and / or portions) is merely for the convenience of distinguishing different objects, and does not necessarily indicate a specific order or sequence, unless the context clearly indicates otherwise. It should be understood that such use of data can be interchanged under appropriate circumstances.

[0068] In the description of the present application, it should be understood that the singular forms "a", "an" and "the" can also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprise" and / or "include" are used in the specification, the presence of the described features, integers, steps, operations, elements, and / or components can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups is not excluded. At the same time, the term "and / or" as used herein includes any and all combinations of the related listed items.

[0069] In the description of the present application, it should also be noted that when a component is referred to as "on" another component, "connected to" another component, or "contacting" another component, it can not only mean that the component is directly on the other component, directly connected to the other component, or directly contacting the other component, but also means that a middle component can be inserted between the component and the other component. In addition, "connected" can include detachable connection or integral connection in addition to fixed connection. Similarly, when an element is referred to as "electrically connected", "electrically contacting", "electrically coupled", or "electrically coupled to" another element, the one element and the other element can be directly electrically contacted or point coupled, or electrically contacted or point coupled through an intermediate element.

[0070] In the description of the application, it also needs to be explained that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is generally based on the orientation or position relationship shown in the drawings, only for the convenience of describing the application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the scope of protection of the application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0071] And, in the description of the application, spatial relationship terms such as "under", "below", "under", "under", "on", "on the surface of", "above" and the like can be used to describe the spatial position relationship of one element or feature with other elements or features shown in the figure. It should be understood that the spatial relationship terms include different orientations of the elements or features in use and operation in addition to the orientation shown in the figure. For example, if the elements or features in the figure are turned over or inverted, the element or feature described as "under" or "under" or "under" the other element or feature will be oriented "on" the other element or feature. In addition, the elements can also include other orientations (for example, rotated at an angle or other orientations).

[0072] Please refer to Figure 16 The application provides a wafer with a diamond sheet array, comprising:

[0073] The first filling layer 101 is coated with a plurality of spaced diamond sheets 7, the surface of each diamond sheet 7 is flush with the upper surface of the first filling layer 101, or the first surface of the first filling layer 101 is slightly higher than the surface of each diamond sheet 7.

[0074] The second filling layer 102 is provided on the second surface of the first filling layer 101 without diamond sheet 7, the hardness of the first filling layer 101 is less than the hardness of the second filling layer 102, and the elasticity of the first filling layer 101 is greater than the elasticity of the second filling layer 102.

[0075] The present application forms the wafer 100 with the diamond sheet array by setting the first filling layer 101 and the second filling layer 102 to form a plurality of diamond sheet monomers, so that a plurality of diamond sheets 7 can be processed in batches in a single process flow of photolithography, implantation, etching, etc. In the subsequent process of diamond color center preparation: photolithography, implantation, etching and post-processing, the equipment utilization can be improved and the production cost can be reduced, and the large-scale application of diamond color center can be widened. At the same time, compared with the second filling layer 102, the first filling layer 101 has high elasticity and low hardness, which can avoid scratching the mask plate in the subsequent photolithography process. Specifically, when performing photolithography process, when the surface of the diamond sheet 7 is flush with the first surface of the first filling layer 101, the mask plate contacts the diamond sheet and the first surface of the first filling layer and applies pressure to the diamond sheet 7 and the first filling layer 101. If the diamond sheet 7 has an edge or corner protruding from the diamond sheet, the diamond sheet 7 with the edge or corner will move away from the mask plate under the action of the elastic first filling layer 101, so as to avoid scratching or crushing the mask plate. Further, when the first surface of the first filling layer 101 is slightly higher than the surface of each diamond sheet 7, the mask plate will first contact the first surface of the first filling layer 101, so as to avoid scratching the mask plate when the diamond sheet contacts.

[0076] In an embodiment, the thickness of the first filling layer 101 is greater than the thickness of the diamond sheet, preferably 4-8 times the thickness of the diamond sheet.

[0077] In an embodiment, the first filling layer 101 is an elastic resin filling layer.

[0078] The second filling layer 102 is a non-elastic resin filling layer.

[0079] In a specific embodiment, the first filling layer 101 is a PDMS resin filling layer.

[0080] The second filling layer 102 is an epoxy resin filling layer.

[0081] In a specific embodiment, the radial dimension of the second filling layer 102 is greater than the radial dimension of the first filling layer 101.

[0082] In actual use, the cross-sectional outer contour size of the diamond sheet can be 1-9 mm, and the size of the wafer 100 (the second filling layer 102) with the diamond sheet array can be 2 inches, 4 inches, 6 inches or 8 inches.

[0083] Please refer to Figures 1 to 6 The present application also provides a mold for preparing a wafer with a diamond sheet array, comprising:

[0084] The lower mold 1 is provided with a plurality of vacuum suction holes 11 on the first surface thereof, and the vacuum suction holes 11 are used for vacuum suction of the diamond pieces 7.

[0085] The outer mold 2 is in a ring structure, and is arranged on the first surface of the lower mold 1.

[0086] The first upper mold 3 is used for cooperation with the outer mold 2, and the bottom surface of the first upper mold 3, the inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a first filling space 41.

[0087] The second upper mold 6 is used for cooperation with the outer mold 2, and the bottom surface of the second upper mold 6, the inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a second filling space, and the height of the second filling space is greater than the height of the first filling space 41.

[0088] The first filling space 41 and the second filling space are formed by cooperation of the first upper mold 3 and the second upper mold 6 with the lower mold 1 and the outer mold 2 respectively, so that the wafer with the diamond piece array having the first filling layer 101 and the second filling layer 102 is formed by using the mold of the present application.

[0089] In an embodiment, the positioning plate 5 is further included, the positioning plate 5 is provided with a plurality of positioning through holes 51, the plurality of positioning through holes 51 are arranged in one-to-one correspondence with the plurality of vacuum suction holes 11 (one-to-one correspondence), the cross-sectional size of the positioning hole is matched with the cross-sectional outer contour of the diamond piece 7, and the positioning plate 5 is used for cooperation with the first surface of the lower mold 1; when the positioning plate 5 cooperates with the first surface, the positioning through hole 51 exposes the vacuum suction hole 11, so that the vacuum suction hole 11 can vacuum suction the diamond piece 7.

[0090] In a specific embodiment, the cross-sectional size of the positioning hole is preferably slightly larger than the outer contour size of the diamond piece 7, so that the diamond piece 7 can be accurately positioned and the positioning plate 5 can be taken out.

[0091] In an embodiment, the first upper mold 3 is provided with a first injection port 31, and when the first upper mold 3 cooperates with the outer mold 2, the first injection port 31 is in communication with the first filling space 41.

[0092] The second upper mold 6 is provided with a second injection port 61, and when the second upper mold 6 cooperates with the outer mold 2, the second injection port 61 is in communication with the second filling space.

[0093] In another embodiment, the first injection port 31 and the second injection port 61 can be arranged on the body wall of the outer mold 2 respectively.

[0094] In a specific embodiment, the first upper mold 3 and the second upper mold 6 are respectively provided with a handle 32 for facilitating demolding, and the first upper mold 3 and the second upper mold 6 can be respectively detached from the outer mold 2 by holding the handle 32.

[0095] In a specific embodiment, the bottom surface of the outer mold 2, the bottom surface of the first upper mold 3, and the bottom surface of the second upper mold 6 are all flat surfaces.

[0096] In an embodiment, the inner wall of the outer mold 2 is provided with a first matching part 21 and a second matching part 22 arranged circumferentially along the inner wall of the outer mold 2.

[0097] The first matching part 21 is located closer to the lower mold 1, and the first matching part 21 is used to cooperate with the first upper mold 3 to form a first filling space 41.

[0098] The distance from the second matching part 22 to the axis of the outer mold 2 is greater than the distance from the first matching part 21 to the axis of the outer mold 2, and the second matching part 22 is used to cooperate with the second upper mold 6 to form a second filling space.

[0099] In an embodiment, the first matching part 21 is a first ring-shaped step, and the second matching part 22 is a conical surface extending from the step surface of the first ring-shaped step to the bottom surface of the outer mold 2 and not penetrating through the bottom surface of the outer mold 2. The closer to the bottom surface of the outer mold 2, the smaller the distance from the conical surface to the axis of the outer mold 2. At this time, the first filling space 41 is a columnar filling space, and the second filling space has a columnar filling space. The first filling layer 101 generated correspondingly is a columnar filling layer, and the second filling layer 102 is a columnar filling layer.

[0100] Please refer to Figure 6 In another embodiment, the first matching part 21 is a first ring-shaped step, and the second matching part 22 is a second ring-shaped step located in the step surface of the first ring-shaped step and recessed from the bottom surface of the outer mold 2 and not penetrating through the bottom surface of the outer mold 2. At this time, the first filling space 41 and the second filling space are both columnar filling spaces, and the first filling layer 101 and the second filling layer 102 generated correspondingly are both columnar filling layers.

[0101] In actual use, the vertical surfaces above the step surface of the first ring-shaped step and the step surface of the second ring-shaped step can also be conical surfaces, and the closer to the bottom surface of the outer mold 2, the smaller the distance from the conical surface to the axis of the outer mold 2.

[0102] In actual use, the outer edge shape of the first upper mold 3 is arranged corresponding to the shape of the conical surface or the second ring-shaped step, and the outer edge shape of the second upper mold 6 is arranged corresponding to the shape of the first ring-shaped step.

[0103] In another embodiment, the inner wall of the outer mold 2 does not have the first and second matching parts 21 and 22, the thickness of the first upper mold 3 is smaller than that of the second upper mold 6, and the outer edges of the first and second upper molds 3 and 6 are matched with the upper end surface of the outer mold 2 to form the first and second filling spaces 41 and 42. At this time, the outer diameters of the first and second filling layers 101 and 102 generated correspondingly are equal.

[0104] Please refer to Figure 1 and Figure 9 In an embodiment, the outer mold 2 has a first clamping structure, the lower mold 1 has a second clamping structure, and the second clamping structure is clamped and matched with the first clamping structure so that the outer mold 2 and the lower mold 1 are detachably clamped and arranged.

[0105] The detachable clamping arrangement of the outer mold 2 and the lower mold 1 through the clamping structure can facilitate demolding to avoid scratching of the diamond sheet 7 during the demolding process.

[0106] In a specific embodiment, the first clamping structure is a continuous groove 23 arranged at the edge position of the bottom surface of the outer mold 2, and the second clamping structure is a continuous ridge 14 arranged at the edge position of the upper surface of the lower mold 1, and the ridge 14 is clamped and matched with the groove 23.

[0107] In another embodiment, the outer mold 2 and the lower mold 1 can be fixed or integrally formed. At this time, before forming the first and second filling layers 101 and 102, a demolding layer (demolding agent) needs to be arranged on the surface of the outer mold 2 and the lower mold 1.

[0108] In another embodiment, the first clamping structure is a continuous ridge arranged at the edge position of the bottom surface of the outer mold 2, and the second clamping structure is a continuous groove arranged at the edge position of the upper surface of the lower mold 1, and the ridge is clamped and matched with the groove.

[0109] In another embodiment, the first clamping structure is a recess hole arranged at the edge position of the bottom surface of the outer mold 2, the recess hole is a plurality of circumferentially spaced blind holes, the second clamping structure is a continuous protruding column arranged at the edge position of the upper surface of the lower mold 1, the protruding column has a plurality of corresponding blind holes, and the blind hole and the protruding column are inserted and matched.

[0110] In an embodiment, the lower mold 1 also has a vacuum channel 12, the vacuum channel 12 is connected with a plurality of vacuum suction holes 11 respectively, and the vacuum channel 12 is formed with a vacuum interface 13 on the body wall of the lower mold 1, and the vacuum interface 13 is used for external connection of a vacuum device.

[0111] In another embodiment, a suction disc can also be arranged in the vacuum suction hole 11 to better adsorb the diamond sheet.

[0112] Please refer to Figures 7 to 17The application also provides a preparation method of a wafer with a diamond sheet array, comprising the following steps:

[0113] S100. A lower mold 1 is provided, and a first surface of the lower mold 1 is provided with a plurality of vacuum suction holes 11. A plurality of diamond sheets 7 are vacuum-sucked onto the vacuum suction holes 11 of the lower mold 1.

[0114] S200. An outer mold 2 is provided, and the outer mold 2 has a ring structure. The outer mold 2 is arranged on the first surface of the lower mold 1.

[0115] S300. A first upper mold 3 is provided, and the first upper mold 3 is matched with the outer mold 2. A bottom surface of the first upper mold 3, an inner wall surface of the outer mold 2 and the first surface of the lower mold 1 form a first filling space 41, and the plurality of diamond sheets 7 are located in the first filling space 41.

[0116] S400. A first filling material 71 is filled in the first filling space 41 to form a first filling layer 101, and the first filling layer 101 covers the plurality of diamond sheets 7.

[0117] S500. The first upper mold 3 is removed, and a second upper mold 6 is provided. The second upper mold 6 is matched with the outer mold 2. A bottom surface of the second upper mold 6, a part of the inner wall surface of the outer mold 2 and a surface of the first filling layer 101 without the diamond sheets 7 form a third filling space 42.

[0118] S600. A second filling material 72 is filled in the third filling space 42 to form a second filling layer 102. The hardness of the first filling layer 101 is less than the hardness of the second filling layer 102, and the elasticity of the first filling layer 101 is greater than the elasticity of the second filling layer 102.

[0119] S700. The second upper mold 6, the outer mold 2 and the lower mold 1 are removed to obtain a wafer 100 with a diamond sheet array.

[0120] The plurality of vacuum suction holes 11 of the lower mold 1 of the mold can correspondingly suck the plurality of diamond sheets 7. After the filling material is filled in the filling space, the plurality of diamond sheets can form a wafer structure, so that a plurality of diamond sheets 7 can be processed in batches in a single process flow such as photolithography, implantation, etching and the like. In the subsequent processes of the diamond color center preparation, such as photolithography, implantation, etching and post-processing, the equipment utilization can be improved and the production cost can be reduced, and the large-scale application of the diamond color center can be widened.

[0121] In an embodiment, the first filling material 71 is an elastic resin, PDMS resin, and the second filling material 72 is a non-elastic resin, epoxy resin. The first filling material 71 forms the first filling layer 101 after curing, and the second filling material 72 forms the second filling layer 102 after curing.

[0122] In one embodiment, the pressure applied to form the first filling layer 101 slightly higher than the surface of each diamond sheet 7 is slightly greater than the pressure applied to form the first filling layer 101 flush with the surface of the diamond sheet 7, so that after demolding, the first surface of the first filling layer 101 with elasticity is slightly higher than the surface of each diamond sheet 7.

[0123] In one specific embodiment, the pressure applied to form the first filling layer 101 slightly higher than the surface of each diamond sheet 7 is slightly greater than the pressure applied to form the first filling layer 101 flush with the surface of the diamond sheet 7, which is 5MPa-20MPa.

[0124] In one specific embodiment, the first filling material 71 is injected through the first injection port 31, and the second filling material 72 is injected through the second injection port 61.

[0125] In fact, the second filling space in the mold includes the first filling space 41 and the third filling space 42 in the method.

[0126] In one embodiment, in step S100, the diamond sheet 7 is vacuum adsorbed on the vacuum suction hole 11 of the lower mold 1 using the positioning plate 5, and the positioning plate 5 has a plurality of positioning through holes 51, which are arranged one by one with the plurality of vacuum suction holes 11.

[0127] After the diamond sheet 7 is vacuum adsorbed on the vacuum suction hole 11 of the lower mold 1, the positioning plate 5 is also removed.

[0128] In another embodiment, the positioning plate 5 can also not be used, and a tool such as a tweezers is used to directly manually operate to align and adsorb the diamond sheet 7 on the vacuum suction hole 11.

[0129] In actual use, the outer mold 2 is coaxially arranged with the lower mold 1, and the vacuum suction hole 11 is located inside the ring body of the outer mold 2.

[0130] In actual use, the upper surface of the vacuum suction hole 11 does not exceed the upper surface of the lower mold 1, and is preferably flush with the upper surface of the lower mold 1, so as to facilitate demolding.

[0131] After the wafer with diamond sheet array is actually processed, the first filling layer 101 and the second filling layer 102 can be removed by a dissolution process.

[0132] In this application, the diamond sheet 7 refers to a diamond sheet original body or a diamond color center, and the wafer 100 with a diamond sheet array refers to a wafer containing a diamond sheet original body array or a wafer containing a diamond color center array.

[0133] It should be noted that the features of the above-described various embodiments of the present application can be combined with each other without conflict. Also, in each of the above-described embodiments, each embodiment mainly describes the difference from other embodiments, and other specific descriptions of the same / similar parts between the embodiments can be referred to (or referred to) each other. In addition, in the above description, the description of the known components and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0134] Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical solutions of the present application shall fall within the protection scope of the technical solutions of the present application.

Claims

1. A wafer having a diamond wafer array, characterized in that, include: A first filling layer is covered with a plurality of diamond sheets spaced apart, wherein the surface of each diamond sheet is flush with the first surface of the first filling layer, or the first surface of the first filling layer is higher than the surface of each diamond sheet. The second filler layer is disposed on the second surface of the first filler layer where there is no diamond sheet. The hardness of the first filler layer is less than that of the second filler layer, and the elasticity of the first filler layer is greater than that of the second filler layer.

2. A wafer with a diamond wafer array as described in claim 1, characterized in that, The first filler layer is an elastic resin filler layer; The second filler layer is a non-elastic resin filler layer.

3. A mold for fabricating a wafer with a diamond sheet array, characterized in that, include: The lower mold has a plurality of vacuum suction holes on its first surface, which are used to vacuum-adsorb diamond sheets. An outer mold, the outer mold having a ring-shaped structure, the outer mold being disposed on the first surface of the lower mold; A first upper mold is used to cooperate with the outer mold, and the bottom surface of the first upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold form a first filling space; The second upper mold is used to cooperate with the outer mold. The bottom surface of the second upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold form a second filling space. The height of the second filling space is greater than the height of the first filling space.

4. A mold for fabricating a wafer with a diamond sheet array as described in claim 3, characterized in that, It also includes a positioning plate having a plurality of positioning through holes, which are correspondingly arranged with the plurality of vacuum suction holes. The cross-sectional dimensions of the positioning through holes are adapted to the outer contour of the diamond sheet. The positioning plate is used to mate with the first surface of the lower mold. When the positioning plate mates with the first surface, the positioning through holes expose the vacuum suction holes so that the vacuum suction holes can vacuum-adsorb the diamond sheet.

5. A mold for preparing a wafer with a diamond sheet array as described in claim 3, characterized in that, The first upper mold has a first injection port, and when the first upper mold is engaged with the outer mold, the first injection port is connected to the first filling space; The second upper mold has a second injection port, which communicates with the second filling space when the second upper mold is engaged with the outer mold.

6. A mold for fabricating a wafer with a diamond sheet array as described in claim 3, characterized in that, The inner wall of the outer mold has a first mating part and a second mating part arranged circumferentially along the inner wall of the outer mold; The first mating part is located on the side closer to the lower mold, and the first mating part is used to cooperate with the first upper mold to form the first filling space; The distance from the second mating part to the axis of the outer mold is greater than the distance from the first mating part to the axis of the outer mold. The second mating part is used to cooperate with the second upper mold to form the second filling space.

7. A method for fabricating a wafer with a diamond sheet array, characterized in that, Includes the following steps: A lower mold is provided, the first surface of which is provided with a plurality of vacuum suction holes, and a plurality of diamond sheets are vacuum-adsorbed onto the vacuum suction holes of the lower mold; An outer mold is provided, the outer mold having a ring-shaped structure, and the outer mold is disposed on the first surface of the lower mold; A first upper mold is provided, which mates with an outer mold. The bottom surface of the first upper mold, the inner wall surface of the outer mold, and the first surface of the lower mold form a first filling space, and a plurality of diamond sheets are located in the first filling space. A first filler material is filled into the first filling space to form a first filling layer, and the first filling layer covers a plurality of diamond sheets; Remove the first upper mold and provide a second upper mold so that the second upper mold mates with the outer mold, and a third filling space is formed between the bottom surface of the second upper mold, a portion of the inner wall surface of the outer mold and the surface of the first filling layer that does not have diamond sheets; A second filler is filled into the third filling space to form a second filling layer. The hardness of the first filling layer is less than that of the second filling layer, and the elasticity of the first filling layer is greater than that of the second filling layer. Remove the second upper mold, outer mold, and lower mold to obtain a wafer with a diamond sheet array.

8. The method for fabricating a wafer with a diamond sheet array as described in claim 7, characterized in that, The pressure applied when forming the first filler layer that is higher than the surface of each diamond sheet is greater than the pressure applied when forming the first filler layer that is level with the surface of the diamond sheet.

9. A method for fabricating a wafer with a diamond sheet array as described in claim 7, characterized in that, The first filler is an elastic resin, and the second filler is a non-elastic resin.

10. A method for fabricating a wafer with a diamond wafer array as described in claim 9, characterized in that, The first filler is PDMS resin, and the second filler is epoxy resin.

11. The method for fabricating a wafer with a diamond wafer array as described in claim 9, characterized in that, A positioning plate is used to vacuum-adhere the diamond sheet onto the vacuum suction hole of the lower mold. The positioning plate has several positioning through holes, and the several positioning through holes are arranged one-to-one with the several vacuum suction holes. After the diamond sheet is vacuum-adsorbed onto the vacuum suction hole of the lower mold, the process also includes removing the positioning plate.

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