Wafer test pattern data automatic conversion method

Abstract

The invention relates to the technical field of wafer testing, and discloses a wafer test chart data automatic conversion method, which comprises the following steps of: introducing comprehensive judgment logic for a test equipment name, a test flow and the number of probe card test points; the problem that wafer test pattern data cannot be automatically converted and integrated due to the difference of test equipment in the prior art is effectively solved. Firstly, simple scenes are quickly screened out by judging whether test equipment names are consistent or not, and data conversion is directly carried out according to a normal process; and for a complex scene, whether the test processes are the same or not is further judged, and equipment parameters with the longest test process or the maximum number of test points of the probe card are selected in a targeted manner as a conversion basis, so that the accuracy and consistency of data conversion are ensured. According to the method, the adaptability and the success rate of data conversion are improved, a reliable data basis is provided for subsequent test chart data integration, the efficiency and the accuracy of wafer test data processing are remarkably improved, and the manual intervention cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and in particular to an automatic method for converting wafer test pattern data. Background Technology

[0002] After wafer testing is completed, the test map data of wafers in the same batch (lot) needs to be integrated. This involves both integrating test map data between different wafers in the same batch and integrating test map data of different items on the same wafer.

[0003] Currently, before integrating test chart data, automatic data conversion is required. However, when the names of the test devices associated with the test chart data are different, the test chart data cannot be automatically converted, making integration impossible.

[0004] Therefore, improvements to existing technologies are necessary.

[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Summary of the Invention

[0006] This invention provides an automatic conversion method for wafer test pattern data to solve the problems existing in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] In a first aspect, the present invention provides a method for automatic conversion of wafer test pattern data, the method comprising:

[0009] S1. Determine whether the names of all test devices associated with the test pattern data of the target batch of wafers to be integrated are consistent; if yes, proceed to S2; otherwise, proceed to S3.

[0010] S2. Perform automatic conversion of test chart data according to the normal procedure;

[0011] S3. Determine whether the testing procedures for each wafer in the target batch are the same; if not, proceed to S4; if yes, proceed to S5.

[0012] S4. Obtain the system settings and parameters of the test equipment corresponding to the last test process of the wafer with the longest test process, and automatically convert the test pattern data.

[0013] S5. Obtain the system settings and parameters of the test device with the largest number of test points on the probe card, and automatically convert the test pattern data.

[0014] Furthermore, in the automatic conversion method for wafer test pattern data, before step S1, the method further includes:

[0015] S0. Determine whether the customer code associated with the test pattern data of the target batch of wafers to be integrated belongs to a special customer. The special customer is a customer that requires the use of different types of test equipment for wafer testing. Different types of test equipment have different names. If yes, then execute S1. If no, then execute S2.

[0016] Furthermore, in the automatic conversion method for wafer test pattern data, S0 specifically includes:

[0017] S0.1. Establish a special customer code database in advance to store the customer codes of all special customers;

[0018] S0.2. Compare the customer codes of the target batch with the special customer code database;

[0019] S0.3 If the comparison result is a match, the customer is determined to be a special customer, and S1 is executed; if the comparison result is a mismatch, the customer is determined to be a normal customer, and S2 is executed.

[0020] Furthermore, in the automatic conversion method for wafer test pattern data, before step S3, the method further includes:

[0021] S2.5 Determine whether the angles of the probe cards of all the test devices are consistent; if yes, then execute S3; if no, then execute S2.6.

[0022] S2.6 Error message: The test equipment's probe card angle is inconsistent, the wafer's test pattern data is abnormal, and automatic data conversion is not possible.

[0023] Furthermore, in the automatic conversion method for wafer test pattern data, after steps S4 and S5, the method further includes:

[0024] S6. Integrate the automatically converted test graph data.

[0025] Furthermore, in the automatic conversion method for wafer test pattern data, step S1 specifically includes:

[0026] S1.1 Extract the names of all test equipment associated with the test pattern data of the target batch of wafers to be integrated;

[0027] S1.2, Remove duplicate names from the extracted test equipment names;

[0028] S1.3 If the number of duplicate test device names is 1, the test device names are considered to be consistent, and S2 is executed; if the number of duplicate test device names is greater than 1, the test device names are considered to be inconsistent, and S3 is executed.

[0029] Furthermore, in the automatic conversion method for wafer test pattern data, step S4 specifically includes:

[0030] S4.1 Count the number of test steps for each wafer in the target batch;

[0031] S4.2. The wafer with the most test process steps is the target wafer with the longest test process.

[0032] S4.3 Obtain the system settings and parameters of the test equipment corresponding to the last test process of the target wafer, and automatically convert the test pattern data.

[0033] Furthermore, in the automatic conversion method for wafer test pattern data, step S5 specifically includes:

[0034] S5.1 Count the number of test points on the probe cards of all test devices in the target batch;

[0035] S5.2. The test device with the largest number of test points is the target test device;

[0036] S5.3 Obtain the system settings and parameters of the target test equipment, and automatically convert the test diagram data.

[0037] In a second aspect, the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the automatic conversion method for wafer test pattern data as provided in the first aspect above.

[0038] Thirdly, the present invention provides a computer-readable storage medium having computer-executable instructions stored thereon, the computer-executable instructions being executed by a computer processor to implement the automatic conversion method for wafer test pattern data as provided in the first aspect above.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] This invention provides an automatic wafer test pattern data conversion method. By introducing a comprehensive judgment logic based on test equipment name, test procedure, and the number of test points on the probe card, it effectively solves the problem in existing technologies where wafer test pattern data cannot be automatically converted and integrated due to differences in test equipment. First, by judging whether the test equipment names are consistent, simple scenarios are quickly filtered out, and data conversion is performed directly according to the normal procedure. For complex scenarios, the method further judges whether the test procedures are the same, and selectively selects the equipment parameters with the longest test procedure or the most test points on the probe card as the conversion basis, ensuring the accuracy and consistency of data conversion. This method not only improves the adaptability and success rate of data conversion but also provides a reliable data foundation for subsequent test pattern data integration, significantly improving the efficiency and accuracy of wafer test data processing, reducing manual intervention costs, and is applicable to various complex wafer testing scenarios.

[0041] The present invention has other features and advantages, which will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of the invention. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is one of the flowcharts illustrating an automatic conversion method for wafer test pattern data provided in Embodiment 1 of the present invention;

[0044] Figure 2 This is a second schematic flowchart of an automatic conversion method for wafer test pattern data provided in Embodiment 1 of the present invention;

[0045] Figure 3 This is the third flowchart of an automatic conversion method for wafer test pattern data provided in Embodiment 1 of the present invention;

[0046] Figure 4 This is the fourth flowchart of an automatic conversion method for wafer test pattern data provided in Embodiment 1 of the present invention;

[0047] Figure 5 This is a schematic diagram of the structure of a computer device provided in Embodiment 2 of the present invention. Detailed Implementation

[0048] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0049] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0050] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0051] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0052] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0053] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0054] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0055] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0056] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0057] Example 1

[0058] In view of the deficiencies in the existing technology, the applicant, based on years of practical experience and professional knowledge in this field, and in conjunction with theoretical application, has actively conducted research and innovation in order to create a technology that can solve the deficiencies in the existing technology. After continuous research, design, and repeated prototype production and improvement, this invention with practical value has finally been created.

[0059] Please refer to Figure 1 This is a flowchart illustrating an automatic wafer test pattern data conversion method according to Embodiment 1 of the present invention. This method is applicable to scenarios involving the integration of wafer test pattern data. The method specifically includes the following steps:

[0060] S1. Determine whether the names of all test devices associated with the test pattern data of the target batch of wafers to be integrated are consistent; if yes, proceed to S2; otherwise, proceed to S3.

[0061] It should be noted that during wafer testing, different testing equipment may generate test pattern data in different formats or structures. By determining whether the names of all testing equipment associated with the test pattern data of the target batch of wafers are consistent, the complexity of the data conversion scenario can be quickly distinguished.

[0062] Specifically, the system will extract all the testing equipment information involved in the target batch of wafers from the relevant database or file storing wafer test pattern data, and compare the names of these devices one by one.

[0063] If all test equipment names are consistent, it indicates that the test environment for this batch of wafers is relatively simple, and data conversion may not require much special processing. In this case, proceed to step S2. If there are inconsistent equipment names, it means that data conversion faces more complex challenges and requires further analysis. Therefore, proceed to step S3.

[0064] In one embodiment of this example, S1 specifically includes:

[0065] S1.1 Extract the names of all test equipment associated with the test pattern data of the target batch of wafers to be integrated.

[0066] It should be noted that names are important identifiers for distinguishing different test equipment. Extracting all test equipment names associated with the test pattern data of the target batch of wafers is a fundamental step in determining whether the test equipment names are consistent. Only by accurately obtaining this name information can the complexity of the data conversion scenario be further analyzed.

[0067] S1.2. Remove duplicate names from the extracted test equipment names.

[0068] It should be noted that the system employs specialized deduplication algorithms or data structures to process the extracted list of test device names. Common deduplication methods include using hash tables, sets, and other data structures, which offer fast lookup and deduplication capabilities. The system will compare each extracted test device name sequentially, and if duplicate names are found...

[0069] S1.3 If the number of duplicate test device names is 1, the test device names are considered to be consistent, and S2 is executed; if the number of duplicate test device names is greater than 1, the test device names are considered to be inconsistent, and S3 is executed.

[0070] It should be noted that by checking the number of duplicate test device names, it is possible to quickly determine whether the test device names associated with the test pattern data of the target batch of wafers are consistent, thereby determining the direction of the subsequent data conversion process. This is the core decision-making step in the entire S1 process, which directly affects the execution of subsequent steps.

[0071] S2. Perform automatic conversion of test chart data according to the normal procedure.

[0072] It should be noted that when the test equipment names associated with the test pattern data of the target batch of wafers are consistent, it indicates that these wafers were tested in the same or similar test equipment environment, and their test pattern data have a high degree of similarity in format and structure.

[0073] Specifically, the system automatically converts the test pattern data of the target batch of wafers according to a pre-set standard data conversion process. This process may include operations such as data format standardization, data encoding unification, and data field mapping to ensure that the converted data can meet the requirements of subsequent data integration and analysis.

[0074] Because the test equipment names are consistent, the data conversion process is relatively simple and direct, enabling the data conversion task to be completed quickly and efficiently, reducing data processing time and resource consumption.

[0075] S3. Determine whether the testing procedures for each wafer in the target batch are the same; if not, proceed to S4; if yes, proceed to S5.

[0076] It should be noted that when the test equipment names are inconsistent, the test procedures for different wafers may also differ, which will affect the structure and content of the test pattern data. By determining whether the test procedures for each wafer in the target batch are the same, the specific data conversion strategy can be further determined.

[0077] Specifically, the system will obtain the test process information for each wafer from the wafer test records, including test items, test order, test conditions, etc., and perform detailed comparison and analysis of this information.

[0078] If the testing procedures for each wafer are different, it means that the data conversion needs to be processed more precisely, and step S4 is executed in this case; if the testing procedures are the same, even though the names of the testing equipment are different, the consistency of the testing procedures provides certain simplification for the data conversion, so step S5 is executed.

[0079] S4. Obtain the system settings and parameters of the test equipment corresponding to the last test process of the wafer with the longest test process, and automatically convert the test pattern data.

[0080] It should be noted that when the testing procedures for each wafer in the target batch are different, the wafer with the longest testing procedure usually undergoes more testing items and more complex testing processes. The testing equipment corresponding to its last testing procedure may contain the most comprehensive testing information and the most stringent testing standards.

[0081] Specifically, the system first identifies the wafer with the longest testing process, and then obtains the system settings and parameters of the testing equipment corresponding to the last testing process of that wafer.

[0082] Then, based on the obtained system settings and parameters, the test pattern data of all wafers in the target batch are automatically converted. In this way, it can be ensured that the converted data contains the most comprehensive test information and matches the most stringent test standards, thereby improving the accuracy and reliability of data conversion.

[0083] Understandably, selecting the test equipment parameters corresponding to the last test process of the wafer with the longest test process as the basis for conversion can ensure to the greatest extent that the converted data can cover the test information of all wafers and avoid data loss or inaccuracy caused by differences in test processes.

[0084] In one embodiment of this example, S4 specifically includes:

[0085] S4.1 Count the number of test steps for each wafer in the target batch.

[0086] It should be noted that in wafer testing, different wafers may undergo different testing procedures, and the number of steps in the testing procedure is an important indicator of testing complexity and the extent of test items covered. Statistical analysis of the number of steps in the testing procedures for each wafer in the target batch is crucial for accurately identifying the wafer with the longest testing procedure, providing a basis for obtaining appropriate testing equipment parameters for data conversion.

[0087] Specifically, the system extracts the test process information for each wafer from the wafer test record database. This information is typically stored in a structured format, such as arranged in the order of test items. The system then counts each test step for each wafer according to predetermined rules, calculating the total number of steps in each wafer's test process. For example, this can be achieved by iterating through the test process records for each wafer, incrementing a counter for each valid test step encountered, ultimately obtaining the number of steps in each wafer's test process.

[0088] Understandably, accurate step counts are fundamental for determining the longest wafer in the testing process. Inaccurate counts could lead to selecting the wrong wafer as a reference, thus affecting the accuracy and comprehensiveness of the data conversion.

[0089] S4.2. The wafer with the most test process steps is the target wafer with the longest test process.

[0090] It should be noted that after calculating the number of steps in each wafer's testing process, it is necessary to identify the wafer with the most testing steps. This wafer has undergone the most testing projects, and its testing process can cover more comprehensive testing information. Therefore, using this wafer as the target wafer can provide richer and more accurate reference data for data conversion.

[0091] Specifically, the system sorts the number of test steps for each wafer using either ascending or descending sorting algorithms. Then, by comparing the number of steps for each wafer, it identifies the wafer with the largest number of steps. The wafer with this largest number of steps is the target wafer with the longest test process. For example, after sorting the number of steps using algorithms like bubble sort or quicksort, the wafer corresponding to the largest value in the sorted results can be directly selected.

[0092] S4.3 Obtain the system settings and parameters of the test equipment corresponding to the last test process of the target wafer, and automatically convert the test pattern data.

[0093] S5. Obtain the system settings and parameters of the test device with the largest number of test points on the probe card, and automatically convert the test pattern data.

[0094] It should be noted that when the testing procedures for all wafers in a target batch are identical, the consistency of the testing procedures provides a basis for data conversion, even if the names of the testing equipment differ. In this case, the number of test points on the probe card becomes a key factor affecting data conversion. Probe cards with the largest number of test points typically provide more detailed and comprehensive wafer testing information.

[0095] Specifically, the system will statistically analyze the probe cards used for testing all wafers in the target batch, identify the probe card with the largest number of test points, and obtain the system settings and parameters of the test equipment corresponding to that probe card.

[0096] Then, based on these system settings and parameters, the test pattern data of the target batch of wafers is automatically converted. This method ensures that the converted data contains the most detailed test information, improving data quality and usability.

[0097] Understandably, using the parameters of the test equipment with the largest number of test points on the probe card as the conversion basis can fully utilize the testing capabilities of the probe card, obtain more comprehensive wafer test data, and provide richer information support for subsequent data analysis and quality control.

[0098] In one embodiment of this example, step S5 specifically includes:

[0099] S5.1 Count the number of test points on the probe cards of all test devices in the target batch.

[0100] It's important to note that in wafer testing scenarios, probe cards are crucial components used to electrically connect to test points on the wafer for signal transmission and testing. The number of test points on a probe card directly reflects the testing scope and level of detail that the testing equipment can cover during wafer testing. Statistical analysis of the number of test points on probe cards across all testing equipment in a target batch aims to identify the testing equipment that provides the most comprehensive test information, thus providing a basis for accurate and reliable data conversion later.

[0101] Specifically, the system retrieves probe card information for each test device from wafer testing-related databases, device configuration files, or test records. This information typically includes the probe card's model and specifications, which contains crucial data such as the number of test points.

[0102] The system then extracts the number of test points for each probe card corresponding to each test device, and records and summarizes this information. This can be achieved by establishing a data structure (such as a dictionary or list) to store the correspondence between test devices and the number of test points on probe cards, and then iterating through all test devices to sequentially read and store the number of test points on their probe cards.

[0103] Understandably, accurate statistics on the number of test points are fundamental for determining the target testing equipment. If the statistics are inaccurate, it may lead to the selection of the wrong testing equipment as a reference, thus affecting the quality and accuracy of the data conversion and preventing the converted data from fully reflecting the actual testing conditions of the wafer.

[0104] S5.2. The test device with the largest number of test points is the target test device.

[0105] It should be noted that after counting the number of test points on the probe cards of all testing devices, it is necessary to identify the testing device with the largest number of test points. This testing device, because its probe card has the most test points, can provide more detailed and comprehensive wafer testing information. Therefore, using this device as the target testing device ensures that the parameters used for subsequent data conversion cover the widest range of test content, improving the accuracy and reliability of the data conversion.

[0106] Specifically, the system compares the number of test points on the probe cards of each test device obtained from the statistics. A loop structure can be used to compare the number of test points for each test device sequentially, while recording the current maximum number of test points and the corresponding test device identifier.

[0107] After comparison, the test device with the largest number of test points is determined and marked as the target test device. For example, during the comparison process, if the number of test points for a certain test device is found to be greater than the currently recorded maximum value, the maximum value and the corresponding test device identifier are updated, and the final identifier is the target test device.

[0108] S5.3 Obtain the system settings and parameters of the target test equipment, and automatically convert the test diagram data.

[0109] Please refer to Figure 2 In one embodiment of this example, before step S1, the method further includes:

[0110] S0. Determine whether the customer code associated with the test pattern data of the target batch of wafers to be integrated belongs to a special customer. The special customer is a customer that requires the use of different types of test equipment for wafer testing. Different types of test equipment have different names. If yes, then execute S1. If no, then execute S2.

[0111] It should be noted that in the wafer testing business, different customers may have different requirements and specifications for wafer testing. Some special customers, due to their own product quality control, technical confidentiality, or other special needs, may require the use of different types of testing equipment for wafer testing. Different types of testing equipment often lead to differences in the format and structure of test pattern data, which in turn affects the data integration and conversion process. Therefore, before formally determining whether the test equipment name is consistent (S1), it is necessary to first determine whether the customer code associated with the target batch of wafer test pattern data belongs to a special customer. This can help identify potential data complexity in advance, thereby selecting a more appropriate data conversion and processing path and improving the efficiency and accuracy of data processing.

[0112] In one embodiment of this example, S0 specifically includes:

[0113] S0.1. Establish a special customer code database in advance to store the customer codes of all special customers;

[0114] S0.2. Compare the customer codes of the target batch with the special customer code database;

[0115] S0.3 If the comparison result is a match, the customer is determined to be a special customer, and S1 is executed; if the comparison result is a mismatch, the customer is determined to be a normal customer, and S2 is executed.

[0116] Please refer to Figure 3 In one embodiment of this invention, before step S3, the method further includes:

[0117] S2.5 Determine whether the angles of the probe cards of all the test devices are consistent; if yes, then execute S3; if no, then execute S2.6.

[0118] It is important to note that the consistency of probe card angles is crucial during wafer testing. The probe card angle determines the contact position and method between the probes and the test points on the wafer. If the probe card angles of different testing devices are inconsistent, it may lead to inaccurate or inconsistent test data, thus affecting subsequent data integration and analysis. Therefore, before further determining whether the test procedures are the same (i.e., step S3), it is essential to first determine whether the probe card angles of all testing devices are consistent. This can effectively identify factors that may cause data anomalies and ensure the accuracy and reliability of data conversion.

[0119] S2.6 Error message: The test equipment's probe card angle is inconsistent, the wafer's test pattern data is abnormal, and automatic data conversion is not possible.

[0120] It should be noted that when inconsistent probe card angles are detected on the testing equipment, it means that the test data may contain unpredictable deviations or errors, and the accuracy and consistency of data conversion cannot be guaranteed. Therefore, the system needs to immediately report the error and provide relevant information to prevent erroneous data from entering subsequent processing flows and avoid causing greater losses or impacts.

[0121] Please refer to Figure 4 In one embodiment of this example, after steps S4 and S5, the method further includes:

[0122] S6. Integrate the automatically converted test graph data.

[0123] It should be noted that during wafer testing, after a series of steps (such as determining the test equipment name, test procedure, probe card angle checking, and data conversion for different situations), the test pattern data for each wafer in the target batch has been automatically converted. However, this converted data may be scattered across different files or datasets, which is not conducive to subsequent comprehensive analysis and processing. Integrating the automatically converted test pattern data aims to centralize the scattered data into a unified and complete dataset, enabling more efficient data mining, quality assessment, statistical analysis, and other operations.

[0124] Although this application uses terms such as wafer and test pattern data frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would contradict the spirit of the invention.

[0125] This invention provides an automatic wafer test pattern data conversion method. By introducing a comprehensive judgment logic based on the test equipment name, test procedure, and number of test points on the probe card, it effectively solves the problem in existing technologies where wafer test pattern data cannot be automatically converted and integrated due to differences in test equipment. First, by judging whether the test equipment names are consistent, simple scenarios are quickly filtered out, and data conversion is directly performed according to the normal procedure. For complex scenarios, the method further judges whether the test procedures are the same, and selectively selects the equipment parameters with the longest test procedure or the most test points on the probe card as the conversion basis, ensuring the accuracy and consistency of data conversion. This method not only improves the adaptability and success rate of data conversion but also provides a reliable data foundation for subsequent test pattern data integration, significantly improving the efficiency and accuracy of wafer test data processing, reducing manual intervention costs, and is applicable to various complex wafer testing scenarios.

[0126] Example 2

[0127] Figure 5 This is a schematic diagram of the structure of a computer device provided in Embodiment 2 of the present invention. Figure 5 A block diagram of an exemplary computer device 12 suitable for implementing embodiments of the present invention is shown. Figure 5 The computer device 12 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0128] like Figure 5 As shown, the computer device 12 is represented in the form of a general-purpose computing device. The components of the computer device 12 may include, but are not limited to: one or more processors or processing units 16, system memory 28, and bus 18 connecting different system components (including system memory 28 and processing unit 16).

[0129] Bus 18 represents one or more of several bus architectures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of the various bus architectures. For example, these architectures include, but are not limited to, the Industry Standard Architecture (ISA) bus, the Micro Channel Architecture (MAC) bus, the Enhanced ISA bus, the Video Electronics Standards Association (VESA) local bus, and the Peripheral Component Interconnect (PCI) bus.

[0130] Computer device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by computer device 12, including volatile and non-volatile media, removable and non-removable media.

[0131] System memory 28 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 30 and / or cache memory 32. Computer device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 34 may be used to read and write non-removable, non-volatile magnetic media (…). Figure 5 Not shown; usually referred to as a "hard drive"). Although Figure 5 Not shown, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk") and an optical disk drive for reading and writing to a removable non-volatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to bus 18 via one or more data media interfaces. Memory 28 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of the present invention.

[0132] A program / utility 40 having a set (at least one) of program modules 42 may be stored, for example, in memory 28. Such program modules 42 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment. Program modules 42 typically perform the functions and / or methods described in the embodiments of the present invention.

[0133] Computer device 12 can also communicate with one or more external devices 14 (e.g., keyboard, pointing device, display 24, etc.), and with one or more devices that enable a user to interact with the computer device 12, and / or with any device that enables the computer device 12 to communicate with one or more other computing devices (e.g., network card, modem, etc.). This communication can be performed via input / output (I / O) interface 22. Furthermore, computer device 12 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 20. As shown, network adapter 20 communicates with other modules of computer device 12 via bus 18. It should be understood that, although... Figure 5 As not shown, it can be used in conjunction with computer device 12 with other hardware and / or software modules, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0134] The processing unit 16 executes various functional applications and data processing by running programs stored in the system memory 28, such as implementing the automatic conversion method for wafer test pattern data provided in the embodiments of the present invention.

[0135] Example 3

[0136] Embodiment 3 of the present invention provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the automatic wafer test pattern data conversion method provided in all embodiments of the present application.

[0137] Any combination of one or more computer-readable media may be used. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in connection with an instruction execution system, apparatus, or device.

[0138] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0139] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including—but not limited to—wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0140] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0141] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A method for automatically converting wafer test pattern data, characterized in that, The method includes: S1. Determine whether the names of all test devices associated with the test pattern data of the target batch of wafers to be integrated are consistent; if yes, proceed to S2; otherwise, proceed to S3. S2. Perform automatic conversion of test chart data according to the normal procedure; S3. Determine whether the testing procedures for each wafer in the target batch are the same; if not, proceed to S4; if yes, proceed to S5. S4. Obtain the system settings and parameters of the test equipment corresponding to the last test process of the wafer with the longest test process, and automatically convert the test pattern data. S5. Obtain the system settings and parameters of the test device with the largest number of test points on the probe card, and automatically convert the test pattern data.

2. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, Prior to S1, the method further includes: S0. Determine whether the customer code associated with the test pattern data of the target batch of wafers to be integrated belongs to a special customer. The special customer is a customer that requires the use of different types of test equipment for wafer testing. Different types of test equipment have different names. If yes, then execute S1. If no, then execute S2.

3. The automatic conversion method for wafer test pattern data according to claim 2, characterized in that, Specifically, S0 includes: S0.

1. Establish a special customer code database in advance to store the customer codes of all special customers; S0.

2. Compare the customer codes of the target batch with the special customer code database; S0.3 If the comparison result is a match, the customer is determined to be a special customer, and S1 is executed; if the comparison result is a mismatch, the customer is determined to be a normal customer, and S2 is executed.

4. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, Prior to S3, the method further includes: S2.5 Determine whether the angles of the probe cards of all the test devices are consistent; if yes, then execute S3; if no, then execute S2.

6. S2.6 Error message: The test equipment's probe card angle is inconsistent, the wafer's test pattern data is abnormal, and automatic data conversion is not possible.

5. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, Following S4 and S5, the method further includes: S6. Integrate the automatically converted test graph data.

6. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, S1 specifically includes: S1.1 Extract the names of all test equipment associated with the test pattern data of the target batch of wafers to be integrated; S1.2, Remove duplicate names from the extracted test equipment names; S1.3 If the number of duplicate test device names is 1, the test device names are considered to be consistent, and S2 is executed; if the number of duplicate test device names is greater than 1, the test device names are considered to be inconsistent, and S3 is executed.

7. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, S4 specifically includes: S4.1 Count the number of test steps for each wafer in the target batch; S4.

2. The wafer with the most test process steps is the target wafer with the longest test process. S4.3 Obtain the system settings and parameters of the test equipment corresponding to the last test process of the target wafer, and automatically convert the test pattern data.

8. The automatic conversion method for wafer test pattern data according to claim 1, characterized in that, S5 specifically includes: S5.1 Count the number of test points on the probe cards of all test devices in the target batch; S5.

2. The test device with the largest number of test points is the target test device; S5.3 Obtain the system settings and parameters of the target test equipment, and automatically convert the test diagram data.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the automatic conversion method for wafer test pattern data as described in any one of claims 1-8.

10. A computer-readable storage medium having computer-executable instructions stored thereon, characterized in that, The computer-executable instructions are executed by a computer processor to implement the automatic conversion method for wafer test pattern data as described in any one of claims 1-8.

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