A horizontal adjustment device compatible with adsorbing wafers of various sizes

Abstract

This invention discloses a horizontal adjustment device compatible with adsorbing wafers of various specifications, comprising a mounting base plate and three three-point leveling components mounted on the mounting base plate; a leveling base plate is mounted on top of each three-point leveling component, and a wafer vacuum carrier is fixedly mounted above the leveling base plate. The three-point leveling components are used to adjust the levelness between the leveling base plate and the wafer vacuum carrier; multiple microporous ceramics of different sizes are concentrically arranged on the top of the wafer vacuum carrier; multiple frame wafer support pillars are arranged at the bottom of the wafer vacuum carrier; a side-pushing component is arranged on the other side of the bottom of the wafer vacuum carrier, and the side-pushing component includes multiple frame wafer push pillars; a rotatable dial is horizontally arranged between the wafer vacuum carrier and the leveling base plate, and a lifting cylinder is hinged at the center of the bottom of the dial, which controls the dial to move vertically; optical calibration components are symmetrically arranged on both sides of the wafer vacuum carrier; the device can more accurately adjust the platform to a suitable plane angle with high adjustment precision.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a horizontal adjustment device compatible with adsorbing wafers of various sizes. Background Technology

[0002] Currently, in the semiconductor industry, both front-end manufacturing equipment and back-end inspection equipment require wafer stages. These stages need to hold the wafers and maintain a horizontal relationship relative to optical inspection devices or other manufacturing equipment. Wafer metrology often presents challenges where the product's plane angle on the testing platform cannot meet specific requirements. Currently, most applications utilize automated loading and unloading by robotic arms, although manual loading and unloading are still necessary in laboratory settings.

[0003] Wafer leveling platforms are a key enabling technology for ultra-high precision processing in semiconductor manufacturing equipment. Existing designs sometimes fail to accommodate wafers of various sizes or the multiple wafer sizes after dicing, and some require replacement of the wafer vacuum carrier to achieve compatibility with multiple wafer sizes, resulting in insufficient leveling precision. Other platforms are designed for use with lithography lenses, etching nozzles, thin-film deposition sources, etc., to achieve extremely high parallelism and consistency. Using these platforms in downstream inspection equipment would lead to excessive precision, soaring costs, and extremely high debugging difficulties. Summary of the Invention

[0004] To address at least one of the aforementioned technical problems, this invention proposes a horizontal adjustment device compatible with adsorbing wafers of various specifications.

[0005] The first aspect of the present invention provides a horizontal adjustment device compatible with adsorbing wafers of various specifications, comprising: a mounting base plate and three three-point leveling components disposed on the mounting base plate;

[0006] The three-point leveling assembly is equipped with a leveling base plate on top, and a wafer vacuum carrier is fixedly installed above the leveling base plate. The three-point leveling assembly is used to adjust the levelness of the leveling base plate and the wafer vacuum carrier.

[0007] The top of the wafer vacuum carrier disk is concentrically arranged with multiple microporous ceramics of different sizes, which are matched with wafers of various specifications.

[0008] Multiple frame wafer support pillars are arranged radially on one side of the bottom of the wafer vacuum carrier disk.

[0009] A side-pushing assembly is provided on the other side of the bottom of the wafer vacuum carrier disk, and the side-pushing assembly includes multiple frame wafer pushers;

[0010] A rotatable dial is horizontally arranged between the wafer vacuum carrier disk and the leveling base plate. A lifting cylinder is hinged to the center of the bottom of the dial, and the lifting cylinder controls the dial to move vertically.

[0011] The dial is provided with a first clearance groove and a second clearance groove at the position that cooperates with multiple frame wafer support pillars. The dial rotates at different angles to achieve the staggered distribution of multiple frame wafer support pillars with the first clearance groove or the second clearance groove during the lifting process, thereby controlling the extension and retraction of different frame wafer support pillars.

[0012] Optical calibration components are symmetrically arranged on both sides of the wafer vacuum carrier disk.

[0013] In a preferred embodiment of the present invention, the microporous ceramics of different sizes include 4-inch microporous ceramics, 6-inch microporous ceramics, 8-inch microporous ceramics and 12-inch microporous ceramics. Vacuum suction is provided on the microporous ceramics of different sizes, and the vacuum suction is connected to a loading suction cup. The loading suction cup is used to adsorb bare wafers or frame wafers.

[0014] In a preferred embodiment of the present invention, the plurality of frame wafer support pillars include a first frame wafer support pillar, a second frame wafer support pillar, and a third frame wafer support pillar. The first frame wafer support pillar, the second frame wafer support pillar, and the third frame wafer support pillar are respectively used to support and fix frame wafers of different sizes. A pagoda spring is provided at the bottom of the first frame wafer support pillar, the second frame wafer support pillar, and the third frame wafer support pillar.

[0015] In a preferred embodiment of the present invention, the side-pushing assembly includes a linear guide rail that is fitted to the bottom of the wafer vacuum carrier. A push rod fixing block is fitted to one side of the linear guide rail, and a buffer post is provided on the other side of the linear guide rail. The push rod fixing block is provided with a first push post mounting hole, a second push post mounting hole, and a third push post mounting hole in sequence along its length. A first push post, a second push post, and a third push post are respectively installed in the first push post mounting hole, the second push post mounting hole, and the third push post mounting hole. The first push post and the second push post penetrate the wafer vacuum carrier, and the third push post is located on the outer side of the wafer vacuum carrier.

[0016] In a preferred embodiment of the present invention, a floating connector piece is provided on one side of the push rod fixing block, a floating connector is installed on the floating connector piece, a side push cylinder is connected to one end of the floating connector, a cylinder fixing block is installed on the top of the side push cylinder, the cylinder fixing block is installed at the bottom of the wafer vacuum carrier, a positioning post is provided on one side edge of the wafer vacuum carrier, and the side push cylinder drives the first push post, the second push post and the third push post to move radially along the wafer vacuum carrier, thereby achieving the side push positioning of frame wafers of different sizes in conjunction with the positioning post.

[0017] In a preferred embodiment of the present invention, three three-point leveling components are evenly spaced along the circumference of the mounting base plate, and the angle between two adjacent three-point leveling components is 120 degrees. Each of the three-point leveling components includes a slide mounting plate, a manual precision slide is provided on the top of the slide mounting plate, a wedge is provided on the top of the manual precision slide, and a steel ball fixing bracket is provided on the top of the slide mounting plate and above the manual precision slide. The bottom of the steel ball fixing bracket is attached to the top surface of the wedge.

[0018] In a preferred embodiment of the present invention, a steel ball retainer is embedded in the top of the steel ball fixing bracket, a steel ball is disposed inside the steel ball retainer, a steel ball limiting block is disposed on the top of the steel ball, a limiting block fixing bracket is disposed on the top of the steel ball limiting block, and tension springs are disposed symmetrically on the bottom of the limiting block fixing bracket and on both sides of the steel ball, and the bottom of the tension springs is connected to the top of the steel ball fixing bracket.

[0019] In a preferred embodiment of the present invention, the outer side of the leveling base plate is engraved with four positions, namely BAKE position, 6-inch position, 8-inch position and 12-inch position. The 6-inch position cooperates with the first frame support column, the 8-inch position cooperates with the second frame support column, and the 12-inch position cooperates with the third frame support column. The dial is provided with a pointer on the outside. Rotating the dial to point to different positions controls the corresponding frame support column to rise.

[0020] The technical solution of the present invention has the following advantages compared with the prior art:

[0021] The angle is adjusted by a dial, and different frame wafer support pillars are lifted in a staggered manner with the frame wafer support pillars and the avoidance groove, so as to meet the adsorption of wafers of various sizes or wafers of various sizes after dicing. The leveling component is set to precisely adjust the level of the wafer vacuum carrier, so as to meet the level, flatness, parallelism and other accuracy requirements of the subsequent inspection, improve the stability of continuous use after leveling, and more accurately adjust the platform to the appropriate plane angle. It has high adjustment accuracy, high cost performance and good stability. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, some of the drawings in the following description are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the horizontal adjustment device compatible with adsorbing wafers of various specifications according to an embodiment of the present invention;

[0024] Figure 2 This is another schematic diagram of the horizontal adjustment device for adsorbing wafers of various specifications according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic cross-sectional view of the horizontal adjustment device according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the bottom structure of the wafer vacuum carrier disk according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the top structure of the wafer vacuum carrier disk according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the dial structure according to an embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the leveling base plate structure according to an embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the connection between the dial and the lifting cylinder in an embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of the three-point leveling component according to an embodiment of the present invention;

[0032] Figure 10 This is a schematic diagram of the three-point leveling component according to another embodiment of the present invention;

[0033] Figure 11 This is a schematic diagram of the side-push component structure according to an embodiment of the present invention;

[0034] Figure 12 This is a schematic diagram of the steel ball limiting block structure of the three three-point leveling components in an embodiment of the present invention;

[0035] Figure 13 This is a schematic diagram of 8-inch bare wafer loading according to an embodiment of the present invention;

[0036] Figure 14 This is a schematic diagram of an 8-inch wafer frame according to an embodiment of the present invention.

[0037] In the diagram: 1. Vertical plate; 2. Dial; 3. Three-point leveling assembly; 4. Leveling base plate; 5. Mounting base plate; 6. Mounting pad; 7. Side push assembly; 8. Optical calibration assembly; 9. Wafer vacuum carrier; 10. Pagoda spring; 11. First frame wafer support pillar; 12. Second frame wafer support pillar; 13. Third frame wafer support pillar; 14. Ball head set screw; 15. Bearing end cap; 16. Deep groove ball bearing; 17. Nozzle support. 18. Column, 19. Bearing mounting base, 20. Wafer disk support block, 21. Dial plate, 22. Lifting cylinder support column, 23. Lifting cylinder push head, 24. Lifting cylinder mounting base, 25. Lifting cylinder, 26. Guide column, 27. Air pipe connector, 28. First push column, 29. Second push column, 30. Feeding suction cup, 31. Mounting base plate fixing component, 32. Leveling base plate fixing component, 33. Suction nozzle support column air pipe connector, 34. First 34. Second clearance slot; 35. Bare wafer inspection sensor; 36. First frame wafer inspection sensor; 37. Second frame wafer inspection sensor; 38. Light shield; 39. Third frame wafer inspection sensor; 40. Linear bearing; 41. Positioning post; 42. First micro-via ceramic; 43. Third micro-via ceramic; 44. Second micro-via ceramic; 45. Fourth micro-via ceramic; 46. Manual precision slide; 47. Slide mount. 48. Mounting plate, 49. Wedge block, 50. Steel ball fixing bracket, 51. Limiting block fixing bracket, 52. Tension spring, 53. Steel ball limiting block, 54. Steel ball retainer, 55. Steel ball, 56. Buffer column, 57. First push column mounting hole, 58. Push rod fixing block, 59. Third push column, 60. Floating joint piece, 61. Floating joint, 62. Side push cylinder, 63. Cylinder fixing block, 64. Second push column mounting hole, 65. Linear guide rail. Detailed Implementation

[0038] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0039] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0040] Example 1

[0041] See Figures 1-14 As shown, the present invention proposes a horizontal adjustment device compatible with adsorbing wafers of various specifications, including: a mounting base plate 5 and three three-point leveling components 3 disposed on the mounting base plate 5;

[0042] The three-point leveling assembly 3 is equipped with a leveling base plate 4 on top, and a wafer vacuum carrier 9 is fixedly installed above the leveling base plate 4. The three-point leveling assembly 3 is used to adjust the levelness of the leveling base plate 4 and the wafer vacuum carrier 9. Three wafer disk support blocks are arranged circumferentially between the wafer vacuum carrier 9 and the leveling base plate 4 to fix the wafer vacuum carrier 9 and the leveling base plate 4 and ensure that the levelness between the two is consistent.

[0043] The top of the wafer vacuum carrier disk 9 is concentrically arranged with multiple microporous ceramics of different sizes, which are matched with wafers of various specifications.

[0044] Multiple frame wafer support pillars are arranged radially on one side of the bottom of the wafer vacuum carrier disk 9;

[0045] A side push assembly 7 is provided on the other side of the bottom of the wafer vacuum carrier 9. The side push assembly 7 includes multiple frame wafer pushers.

[0046] A rotatable dial 2 is horizontally arranged between the wafer vacuum carrier 9 and the leveling base plate 4. A lifting cylinder 24 is hinged at the center of the bottom of the dial 2, and the lifting cylinder 24 controls the dial 2 to move in the vertical direction.

[0047] The dial 2 is provided with a first clearance groove 33 and a second clearance groove 34 at the position that cooperates with multiple frame wafer support pillars. By rotating the dial 2 at different angles, the multiple frame wafer support pillars are staggered with the first clearance groove 33 or the second clearance groove 34 during the lifting process, thereby controlling the extension and retraction of different frame wafer support pillars.

[0048] Optical calibration components 8 are symmetrically arranged on both sides of the wafer vacuum carrier disk 9, and a support plate 1 is installed at the bottom of the optical calibration components 8 for support.

[0049] It should be noted that the wafer vacuum carrier disk 9 is made of alumina ceramic. To ensure compatibility with diced wafers, the surface of the wafer vacuum carrier disk is inlaid with microporous ceramic with a pore size of 5 micrometers. The microporous ceramic can adsorb not only diced wafers but also undicated wafers. The disk surface has high flatness and strong adsorption force. Different sizes of microporous ceramics are available, including 4-inch, 6-inch, 8-inch, and 12-inch microporous ceramics. Vacuum suction devices are installed on the microporous ceramics of different sizes, and the vacuum suction devices are connected to a loading suction cup 29, which is used to adsorb bare wafers or frame wafers.

[0050] Specifically, the optical calibration component 8 is used to calibrate the camera on the testing equipment. The wafer vacuum carrier 9 installed on this platform is made of alumina ceramic. The wafer vacuum carrier 9 is inlaid with 12-inch microporous ceramic, 8-inch microporous ceramic, 6-inch microporous ceramic and 4-inch microporous ceramic. The wafer vacuum carrier 9 can support the adsorption of 4, 6, 8 and 12-inch bare wafers and also supports the adsorption of diced wafers. For example, a 12-inch frame can be attached with diced 4, 6, 8 and 12-inch wafers, or an 8-inch frame can be attached with diced 8-inch wafers, and a 6-inch frame can be attached with diced 6-inch wafers.

[0051] During loading, the loading suction cup 29 is lifted to facilitate loading and unloading by a robotic arm or manual labor. When loading bare wafers, the wafers are first placed on the loading suction cup 29. After loading, the loading suction cup 29 descends and the wafer is placed on the wafer vacuum carrier 9. When loading 4-inch bare wafers, the wafer falls onto the wafer vacuum carrier 9 after loading. At this time, the vacuum suction cup corresponding to the 4-inch microporous ceramic needs to be opened. When loading 6-inch bare wafers, the wafer falls onto the wafer vacuum carrier 9 after loading. At this time, the vacuum suction cups corresponding to the 4-inch and 6-inch microporous ceramics need to be opened. When loading an 8-inch bare wafer, after loading, the wafer falls onto the wafer vacuum carrier 9. At this time, the vacuum suction of the corresponding 4-inch microporous ceramic (first microporous ceramic 42), 6-inch microporous ceramic (third microporous ceramic 43), and 8-inch microporous ceramic (second microporous ceramic 44) needs to be turned on. When loading a 12-inch bare wafer, after loading, the wafer falls onto the wafer vacuum carrier 9. At this time, the vacuum suction of the corresponding 4-inch microporous ceramic, 6-inch microporous ceramic, 8-inch microporous ceramic, and 12-inch microporous ceramic (fourth microporous ceramic 45) needs to be turned on.

[0052] The diced frame wafer consists of a stainless steel frame, a blue film, and the diced wafer. The blue film is attached to the stainless steel frame, and the diced wafer is attached to the blue film before dicing (the diced frame wafer structure is a standard product in the semiconductor industry). When loading the diced 12-inch frame wafer, the loading suction cup 29 and the first frame wafer support column 11 are lifted synchronously. At this time, the stainless steel frame of the 12-inch frame wafer is placed on the first frame wafer support column 11, and the wafer in the middle is placed on the loading suction cup 29. At this time, the loading suction cup 29 and the first frame wafer support column 11 fall simultaneously, and the diced 12-inch frame wafer falls on the wafer vacuum carrier 9. At this time, the side push cylinder 61 drives the third push column 58 to push the stainless steel frame of the diced 12-inch frame wafer, so that the two notches on the frame are locked on the positioning column 41 to complete the positioning. At this time, it is necessary to confirm the size of the material according to the incoming material information. If the blue film inside the 12-inch stainless steel frame contains a diced 12-inch wafer, the vacuum suction on the wafer vacuum carrier 9 needs to be activated for the corresponding 4-inch, 6-inch, 8-inch, and 12-inch microporous ceramic wafers. If the blue film inside the 12-inch stainless steel frame contains a diced 8-inch wafer, the vacuum suction on the wafer vacuum carrier 9 needs to be activated for the corresponding 4-inch, 6-inch, and 8-inch microporous ceramic wafers. If the blue film inside the 12-inch stainless steel frame contains a diced 6-inch wafer, the vacuum suction on the wafer vacuum carrier 9 needs to be activated for the corresponding 4-inch and 6-inch microporous ceramic wafers. If the blue film inside the 12-inch stainless steel frame contains a diced 4-inch wafer, the vacuum suction on the wafer vacuum carrier 9 needs to be activated for the corresponding 4-inch microporous ceramic wafer. When the material being fed is a diced 8-inch frame wafer, the feeding suction cup 29 and the second frame wafer support column 12 are simultaneously lifted. The stainless steel frame of the 8-inch frame wafer is placed on the second frame wafer support column 12, and the wafer in the middle rests on the feeding suction cup 29. Then, the feeding suction cup 29 and the second frame wafer support column 12 fall down at the same time. At this time, the diced 8-inch frame wafer falls on the wafer vacuum carrier 9. The side push cylinder 61 drives the second push column 28 to push the stainless steel frame of the diced 8-inch frame wafer. At this time, the blue film is attached to the diced 8-inch wafer. It is necessary to open the vacuum suction of the corresponding 4-inch microporous ceramic, 6-inch microporous ceramic and 8-inch microporous ceramic on the wafer vacuum carrier 9.When the material being fed is a diced 6-inch frame wafer, the feeding suction cup 29 and the third frame wafer support column 13 are simultaneously lifted. At this time, the stainless steel frame of the 6-inch frame wafer will be placed on the third frame wafer support column 13, and the wafer in the middle will rest on the feeding suction cup 29. Then, the feeding suction cup 29 and the third frame wafer support column 13 fall down at the same time. The diced 6-inch frame wafer will then fall onto the wafer vacuum carrier 9. The side push cylinder 61 drives the first push column 27 to push the stainless steel frame of the diced 6-inch frame wafer. At this time, the blue film is attached to the diced 6-inch wafer. It is necessary to open the vacuum suction of the corresponding 4-inch microporous ceramic and 6-inch microporous ceramic on the wafer vacuum carrier 9.

[0053] In a preferred embodiment of the present invention, the plurality of frame wafer support pillars include a first frame wafer support pillar 11, a second frame wafer support pillar 12, and a third frame wafer support pillar 13. The first frame wafer support pillar 11, the second frame wafer support pillar 12, and the third frame wafer support pillar 13 are respectively used to support and fix frame wafers of different sizes. A pagoda spring 10 is provided at the bottom of the first frame wafer support pillar 11, the second frame wafer support pillar 12, and the third frame wafer support pillar 13.

[0054] In a preferred embodiment of the present invention, the side-pushing assembly 7 includes a linear guide rail 64 that is connected to the bottom of the wafer vacuum carrier 9. A push rod fixing block 57 is connected to one side of the linear guide rail 64, and a buffer post 55 is provided on the other side of the linear guide rail 64. A first push post mounting hole 56, a second push post mounting hole 63 and a third push post mounting hole are sequentially provided on the push rod fixing block 57 along the length direction. A first push post 27, a second push post 28 and a third push post 58 are respectively installed in the first push post mounting hole 56, the second push post mounting hole 63 and the third push post mounting hole. The first push post 27 and the second push post 28 penetrate the wafer vacuum carrier 9, and the third push post 58 is located on the outside of the wafer vacuum carrier 9.

[0055] A floating connector piece 59 is provided on one side of the push rod fixing block 57. A floating connector is installed on the floating connector piece. One end of the floating connector is connected to a side push cylinder 61. A cylinder fixing block 62 is installed on the top of the side push cylinder 61. The cylinder fixing block 62 is installed at the bottom of the wafer vacuum carrier 9. A positioning post 41 is provided on one side edge of the wafer vacuum carrier 9. The side push cylinder 61 drives the first push post 27, the second push post 28 and the third push post 58 to move radially along the wafer vacuum carrier 9, and cooperates with the positioning post 41 to achieve the side push positioning of frame wafers of different sizes.

[0056] It should be noted that the side-push assembly 7 consists of a linear guide rail 64, a buffer post 55, a push rod fixing block 57, a wafer push post, a floating connector plate 59, a floating connector 60, a side-push cylinder 61, and a cylinder fixing block 62. During operation, the linear guide rail 64 provides guidance, and the side-push cylinder 61 provides thrust. When the platform needs to load bare wafers or 12-inch frame wafers, the 6-inch frame wafer push post needs to be removed, and the 12-inch frame wafer is pushed by the third push post. When the platform needs to load 6-inch frame wafers, the 6-inch frame wafer push post (first push post) needs to be installed into the first push post mounting hole 56. When the platform needs to load 8-inch frame wafers, the 8-inch frame wafer push post (second push post) needs to be installed into the second push post mounting hole 63. A compression spring is installed on the buffer post 55 to buffer against excessive cylinder thrust or excessive speed.

[0057] In a preferred embodiment of the present invention, the outer side of the leveling base plate 4 is engraved with four positions, namely BAKE position, 6-inch position, 8-inch position and 12-inch position. The 6-inch position cooperates with the first frame support column, the 8-inch position cooperates with the second frame support column, and the 12-inch position cooperates with the third frame support column. A pointer is provided on the outer side of the dial 2. After rotating the dial 2, the pointer points to different positions, controlling the corresponding frame support column to rise.

[0058] Specifically, this device is supported by three points. The leveling of the wafer vacuum carrier 9 is achieved by adjusting these three points. The mounting base 5 is mounted on the mounting pad 6. The core components of this device are mounted on the mounting base 5. There are three three-point leveling components 3 mounted on the mounting base 5. The leveling base 4 is mounted on the three sets of three-point leveling components 3. The lifting cylinder 24 is mounted on the bottom surface of the leveling base 4 via the lifting cylinder support column 21. A lifting cylinder pusher 22 is mounted on the piston rod of the lifting cylinder 24. A dial pad 20 is mounted on the lifting cylinder pusher 22. A guide post 25 is mounted on the dial pad 20. A linear bearing 40 is fixed on the leveling base plate 4. A deep groove ball bearing 16 is mounted on the lifting cylinder pusher 22. The bearing end cover 15 and the lifting cylinder pusher 22 press against the inner ring of the deep groove ball bearing 16. The dial 2 and the bearing fixing seat 18 are fixed on the outer ring of the deep groove ball bearing 16.

[0059] The leveling base plate 4 and the mounting base plate 5 connect the two workpieces together via mounting base plate fasteners 30 and leveling base plate fasteners 31. Three ball-head set screws 14 are mounted on the dial plate 20, resting against the dial plate 2. A recess is formed on the dial plate 2 for the ball heads of the set screws 14 to rest against the recess. A suction nozzle support column 17 is mounted on the dial plate 20. The suction nozzle support column 17 has an internal air passage and a suction nozzle is mounted at the top. The suction nozzle support column is connected to a suction nozzle support column air pipe connector 32.

[0060] When the lifting cylinder 24 performs the lifting action, it will drive the dial 2, ball head screw 14, guide post 25, suction nozzle support post 17, bearing end cover 15, deep groove ball bearing 16, lifting cylinder push head 22, bearing fixing seat 18, and dial pad 20 to move upward together.

[0061] The wafer vacuum carrier 9 is equipped with a pagoda spring 10, a first frame wafer support pillar 11, a second frame wafer support pillar 12, a third frame wafer support pillar 13, and a side-pushing assembly 7. Each of the first frame wafer support pillar 11, second frame wafer support pillar 12, and third frame wafer support pillar 13 is fitted with a pagoda spring 10. Under normal conditions, the pagoda spring 10 is extended, while the first frame wafer support pillar 11, second frame wafer support pillar 12, and third frame wafer support pillar 13 are retracted. The wafer vacuum carrier 9 is also equipped with 12-inch, 8-inch, 6-inch, and 4-inch microporous ceramic air pipe connectors 26, 8-inch, 6-inch, and 4-inch microporous ceramic air pipe connectors. During use, the corresponding vacuum circuit is opened according to the product being tested.

[0062] A bare wafer inspection sensor 35, a 6-inch frame wafer inspection sensor (first frame wafer inspection sensor 36), an 8-inch frame wafer inspection sensor (second frame wafer inspection sensor 37), and a 12-inch frame wafer inspection sensor (third frame wafer inspection sensor 39) are installed on the leveling base plate 4. A light-shielding plate 38 is installed on the bottom surface of the dial 2. The leveling base plate 4 is engraved with four positions: BAKE, 6, 8, and 12. The dial 2 has corresponding clearance slots. When a bare wafer needs to be placed, the dial 2 needs to be manually moved to the BAKE position. At the same time, the light-shielding plate 38 installed on the bottom surface of the dial 2 rotates together and blocks the bare wafer inspection sensor 35. At this time, the cylinder lifts and moves the dial 2 upward. At this time, the first frame wafer support column 11, the second frame wafer support column 12, and the third frame wafer support column 13 are in the notch position on the dial 2 and will not be lifted out.

[0063] When a 6-inch frame wafer needs to be loaded, the dial 2 needs to be manually turned to the 6-inch position. At the same time, the light shield 38 installed on the bottom of the dial 2 rotates together and blocks the 6-inch frame wafer detection sensor. At this time, the cylinder lifts up and drives the dial 2 upward. At this time, the first frame wafer support column 11 and the second frame wafer support column 12 are in the notch position on the dial 2 and will not be lifted out, while the third frame wafer support column 13 is not in the notch position of the dial 2 and will be lifted out together.

[0064] When loading 8-inch frame wafers, the dial 2 needs to be manually turned to position 8. At the same time, the light shield 38 installed on the bottom of the dial 2 and the dial 2 rotate together to block the 8-inch frame wafer detection sensor. At this time, the cylinder lifts up, driving the dial 2 upward. The first frame wafer support column 11 and the third frame wafer support column 13 are in the notch position on the dial 2 and will not be lifted out, while the second frame wafer support column 12 is not in the notch position on the dial 2 and will be lifted out together.

[0065] When a 12-inch frame wafer needs to be loaded, the dial 2 needs to be manually turned to the 12-inch position. At the same time, the light shield 38 installed on the bottom of the dial 2 and the dial 2 rotate together to block the 12-inch frame wafer detection sensor. At this time, the cylinder lifts up, driving the dial 2 upward. At this time, the second frame wafer support column 12 and the third frame wafer support column 13 are in the notch position on the dial 2 and will not be lifted out, while the first frame wafer support column 11 is not in the notch position on the dial 2 and will be pushed out together.

[0066] In a preferred embodiment of the present invention, three three-point leveling components 3 are evenly spaced along the circumference of the mounting base plate 5, with an angle of 120 degrees between adjacent three-point leveling components 3. Each three-point leveling component 3 includes a slide mounting plate 47, a manual precision slide 46 is provided on the top of the slide mounting plate 47, a wedge is provided on the top of the manual precision slide 46, and a steel ball fixing bracket 49 is provided on the top of the slide mounting plate 47 and above the manual precision slide 46. The bottom of the steel ball fixing bracket 49 is attached to the top surface of the wedge. A steel ball retainer 53 is embedded on the top of the steel ball fixing bracket 49, a steel ball 54 is provided inside the steel ball retainer 53, a steel ball limiting block 52 is provided on the top of the steel ball limiting block 52, a limiting block fixing bracket 50 is provided on the top of the limiting block fixing bracket 52, and tension springs 51 are symmetrically provided on the bottom of the limiting block fixing bracket 50 and on both sides of the steel ball. The bottom of the tension springs 51 is connected to the top of the steel ball fixing bracket 49.

[0067] When the platform needs leveling, three sets of three-point leveling components 3 need to be manually adjusted. After leveling, the leveling base plate 4 and the mounting base plate 5 are connected together by the mounting base plate fixing component 30 and the leveling base plate fixing component 31 to ensure that the position of the leveling base plate 4 remains unchanged after leveling. Since the leveling base plate 4 and the wafer vacuum carrier 9 are connected together by three wafer disk support blocks 19, when the leveling base plate 4 is adjusted to a horizontal state, that is, the wafer vacuum carrier 9 and the leveling base plate 4 are in a relatively horizontal state.

[0068] Specifically, the three-point leveling assembly 3 consists of a slide mounting plate 47, a manual precision slide 46, a wedge block 48, a steel ball fixing bracket 49, a steel ball 54, a steel ball retainer 53, a tension spring 51, a steel ball limiting block 52, and a limiting block fixing bracket 50. The manual precision slide 46 is mounted on the slide mounting plate 47, and the wedge block 48 is mounted above the manual precision slide 46. The steel ball 54 and the steel ball retainer 53 are mounted on the steel ball fixing bracket 49.

[0069] The steel ball is fixed by the steel ball retainer 53, and then the steel ball fixing bracket 49 is fixed on the slide mounting plate 47. The steel ball limiting block 52 is installed and fixed on the limiting block fixing bracket 50, and the steel ball limiting block 52 presses on the steel ball. Two tension springs 51 are also installed between the steel ball fixing bracket 49 and the limiting block fixing bracket 50 to maintain balance.

[0070] The leveling assembly consists of three groups, each with a different structure of steel ball limiting blocks 52. One of the limiting blocks ( Figure 12 The leftmost block restricts the steel ball's movement in a horizontal direction, while another limiting block ( Figure 12 The middle one does not restrict the degrees of freedom of the steel ball, while the third one shown is a limiting block. Figure 12 On the far right, there is a spherical pit that restricts the horizontal freedom of the steel ball.

[0071] The wedge block 48 has a 1.5° slope. The wedge block 48 is moved by adjusting the manual precision slide 46. The height is adjusted by changing the position of the steel ball on the wedge block 48.

[0072] The core of the three-point leveling mechanism is to use small-angle wedges to subdivide the precision of horizontal movement into a higher level of precision in the vertical direction. By changing the slope and length of the wedges, different levels of precision and range can be adjusted.

[0073] In summary, by adjusting the angle of the dial 2 and coordinating with the frame wafer support pillars and the clearance groove to offset and lift different frame wafer support pillars, the system can accommodate wafers of various sizes or wafers of various sizes after dicing. By setting the three-point leveling component 3 to precisely adjust the level of the wafer vacuum carrier 9, the system can meet the requirements for levelness, flatness, parallelism, and other precision for subsequent inspection, improve the stability of continuous use after leveling, and more accurately adjust the platform to the appropriate plane angle. The system offers high adjustment accuracy, high cost-effectiveness, and good stability.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to the above embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0076] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A horizontal adjustment device compatible with adsorbing wafers of various sizes, comprising: The mounting base plate and three three-point leveling components mounted on the mounting base plate are characterized by: The three-point leveling assembly is equipped with a leveling base plate on top, and a wafer vacuum carrier is fixedly installed above the leveling base plate. The three-point leveling assembly is used to adjust the levelness of the leveling base plate and the wafer vacuum carrier. The top of the wafer vacuum carrier disk is concentrically arranged with multiple microporous ceramics of different sizes, which are matched with wafers of various specifications. Multiple frame wafer support pillars are arranged radially on one side of the bottom of the wafer vacuum carrier disk. A side-pushing assembly is provided on the other side of the bottom of the wafer vacuum carrier disk, and the side-pushing assembly includes multiple frame wafer pushers; A rotatable dial is horizontally arranged between the wafer vacuum carrier disk and the leveling base plate. A lifting cylinder is hinged to the center of the bottom of the dial, and the lifting cylinder controls the dial to move vertically. The dial is provided with a first clearance groove and a second clearance groove at the position that cooperates with multiple frame wafer support pillars. The dial rotates at different angles to achieve the staggered distribution of multiple frame wafer support pillars with the first clearance groove or the second clearance groove during the lifting process, thereby controlling the extension and retraction of different frame wafer support pillars. Optical calibration components are symmetrically arranged on both sides of the wafer vacuum carrier disk.

2. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 1, characterized in that, The microporous ceramics of different sizes include 4-inch microporous ceramics, 6-inch microporous ceramics, 8-inch microporous ceramics and 12-inch microporous ceramics. Vacuum suction is provided on the microporous ceramics of different sizes. The vacuum suction is connected to a loading suction cup. The loading suction cup is used to adsorb bare wafers or frame wafers.

3. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 2, characterized in that, The plurality of frame wafer support pillars include a first frame wafer support pillar, a second frame wafer support pillar, and a third frame wafer support pillar. The first frame wafer support pillar, the second frame wafer support pillar, and the third frame wafer support pillar are used to support and fix frame wafers of different sizes. A pagoda spring is provided at the bottom of the first frame wafer support pillar, the second frame wafer support pillar, and the third frame wafer support pillar.

4. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 1, characterized in that, The side-pushing assembly includes a linear guide rail that is fitted to the bottom of the wafer vacuum carrier. A push rod fixing block is fitted to one side of the linear guide rail, and a buffer post is provided on the other side of the linear guide rail. The push rod fixing block is provided with a first push post mounting hole, a second push post mounting hole, and a third push post mounting hole in sequence along its length. A first push post, a second push post, and a third push post are respectively installed in the first push post mounting hole, the second push post, and the third push post. The first push post and the second push post penetrate the wafer vacuum carrier, and the third push post is located on the outside of the wafer vacuum carrier.

5. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 4, characterized in that, A floating connector piece is provided on one side of the push rod fixing block, and a floating connector is installed on the floating connector piece. One end of the floating connector is connected to a side push cylinder. A cylinder fixing block is installed on the top of the side push cylinder. The cylinder fixing block is installed at the bottom of the wafer vacuum carrier. A positioning post is provided on one side edge of the wafer vacuum carrier. The side push cylinder drives the first push post, the second push post, and the third push post to move radially along the wafer vacuum carrier, thereby achieving the side push positioning of frame wafers of different sizes in conjunction with the positioning post.

6. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 1, characterized in that, Three three-point leveling components are evenly spaced along the circumference of the mounting base plate, with an angle of 120 degrees between any two adjacent three-point leveling components. Each of the three-point leveling components includes a slide mounting plate, a manual precision slide is provided on the top of the slide mounting plate, a wedge is provided on the top of the manual precision slide, and a steel ball fixing bracket is provided on the top of the slide mounting plate and above the manual precision slide. The bottom of the steel ball fixing bracket is attached to the top surface of the wedge.

7. A horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 6, characterized in that, The top of the steel ball fixing bracket is inlaid with a steel ball retainer, the inside of the steel ball retainer is provided with a steel ball, the top of the steel ball is provided with a steel ball limiting block, the top of the steel ball limiting block is provided with a limiting block fixing bracket, the bottom of the limiting block fixing bracket is symmetrically provided with tension springs on both sides of the steel ball, and the bottom of the tension springs is connected to the top of the steel ball fixing bracket.

8. The horizontal adjustment device compatible with adsorbing wafers of various specifications according to claim 1, characterized in that, The outer side of the leveling base plate is engraved with four positions: BAKE position, 6-inch position, 8-inch position, and 12-inch position. The 6-inch position cooperates with the first frame support column, the 8-inch position cooperates with the second frame support column, and the 12-inch position cooperates with the third frame support column. A pointer is provided on the outer side of the dial. Rotating the dial to different positions controls the corresponding frame support column to rise.

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