Wave-soldering tooling jig

Abstract

The present application relates to the technical field of wave soldering, in particular to a wave soldering tool jig, comprising: a lower die with a frame-shaped inner ring wall, a plurality of unit arms are slidably installed on the inner wall of the lower die, the unit arms are intermittently distributed, the sliding path of the unit arm is perpendicular to the plane on which the inner wall is located, the unit arm is a single-layer stepped structure, the unit arm has a ladder surface, a plurality of ladder surfaces are in the same plane, and a plurality of ladder surfaces are sequentially connected to form a supporting stack for carrying the edge of a circuit board; the unit arm has a first ladder plate, a shielding module is detachably installed between a plurality of first ladder plates, and the shielding module is used to provide a welding window and a shielding layer, the present application can form a supporting stack with adjustable path by using a plurality of ladder surfaces to carry the circuit board, so that the jig can adapt to different circuit boards.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wave soldering, in particular to a wave soldering tool jig. BACKGROUND

[0002] Wave soldering is an important automated welding process in the electronic manufacturing industry, mainly used for batch welding of through-hole plug-in components on printed circuit boards, and can also be used for reinforcement welding of some surface-mounted components. Its core function is to complete the reliable connection of multiple solder joints at one time through molten solder waves.

[0003] Tray jigs are widely used in electronic assembly processes to complete the transfer and furnace transfer of PCBs, but there are defects in terms of universality. Traditional trays are mostly single PCB customized, and the size cannot be adjusted, especially cannot be compatible with test boards and special-shaped boards. SUMMARY

[0004] The present application provides a wave soldering tool jig, which can use multiple steps (13) to form an adjustable path support stack to carry the circuit board, so that the jig can adapt to different circuit boards.

[0005] In order to achieve the above purpose, the present application provides the following technical scheme:

[0006] A wave soldering tool jig comprises:

[0007] A lower mold with a frame-shaped inner wall, a plurality of unit arms are slidably installed on the inner wall of the lower mold, the unit arms are intermittently distributed, the sliding path of the unit arm is perpendicular to the plane where the inner wall is located, the unit arm is a single-layer stepped structure, the unit arm has steps, a plurality of steps are in the same plane, and a plurality of steps are sequentially connected to form a support stack for carrying the edge of the circuit board; the unit arm has a first step, a plurality of first steps are detachably installed with a shielding module, and the shielding module is used to provide a welding window and a shielding layer.

[0008] Optionally, the shielding module comprises an integrated plate, assembly ribs are fixedly installed on the outer wall of the integrated plate, assembly grooves are formed on the first step, an interference fit of the assembly ribs and the assembly grooves is formed, and a windowing area and a mounting position matched with the test board are formed on the top of the integrated plate.

[0009] Optionally, a slope design from bottom to top is formed on the window edge of the windowing area, the slope range is between fifteen degrees and forty-five degrees, a drainage groove is milled on the slope design, a grid patch is fixedly installed on the bottom of the integrated plate, and the bottom of the windowing area is divided into a small window design by a mesh.

[0010] Optionally, the top of the integrated plate is provided with surrounding ribs which are equidistantly and uniformly arranged around the periphery of the opening in the windowed area, the cross section of the surrounding ribs is trapezoidal structure, and the surrounding ribs are made of fluorine rubber.

[0011] Optionally, the integrated plate is a multi-layer structure, from bottom to top, the structure is sequentially provided with a substrate layer, a heat insulation shielding layer and a gas phase barrier layer, the heat insulation shielding layer is made of ceramic fiber felt and is embedded in the non-windowed area of the substrate layer, and the gas phase barrier layer is made of expanded graphite foil.

[0012] Optionally, the lower mold is provided with a limiting rod which penetrates and slides, the unit arm is limited to slide on the outer wall of the limiting rod, the lower mold is provided with a functional threaded hole, a functional screw rod is threadedly connected in the functional threaded hole, one end of the functional screw rod is rotationally connected with the outer wall of the unit arm, and the limiting rod and the functional screw rod are both vertically arranged on the plane of the inner wall of the lower mold, and the functional screw rod is rotated to control the unit arm to move away from or close to the lower mold.

[0013] Optionally, the top of the lower mold is detachably provided with an upper mold, a plurality of positioning threaded holes are arranged on the upper mold in a rectangular array mode, flexible screw rods are threadedly connected in the positioning threaded holes, sensor pressure heads are slidably connected with the outer wall of the flexible screw rods, and elastic members are fixedly connected between the end of the flexible screw rod and the inner bottom of the sensor pressure head.

[0014] Optionally, the unit arm is embedded with a magnetic layer, and a magnetic strip is magnetically attracted on the trapezoidal surface, and the magnetic strip can be connected with the bottom of the upper mold through the connecting column.

[0015] The present application provides a wave soldering tool jig, compared with the prior art, has the following beneficial effects:

[0016] I. By designing a plurality of unit arms and trapezoidal surfaces, the plurality of unit arms can be independently adjusted in position, thereby quickly outlining the wiring of the supporting stack, matching the edge of the circuit board, and enabling the supporting stack to carry different sizes or shapes of circuits, thereby improving the adaptability of the jig.

[0017] II. The assembly ribs and assembly grooves on both sides of the integrated plate are formed in a plug-in fit, and then the position-adjustable property of the unit arm is utilized to adapt the remaining assembly grooves to other parts of the assembly ribs, thereby completing the locking of the integrated plate and the assembly ribs, placing the shielding module in the correct position, and thereby completing the limiting of the shielding module.

[0018] III. By designing a slope window, the shape of the window is optimized, the air capture space is reduced, the side air is guided, and the traditional right-angle window is avoided to form a vertical cavity wall. After the air is compressed, it can only escape upward. Secondly, the slope reduces the flow resistance of the tin liquid, reduces the turbulence, and thereby improves the welding quality.

[0019] Four, with the cooperation of multiple positioning screw holes and flexible screw rod, the flexible screw rod can be installed at any position under the upper die, so as to adapt to different plug-in layouts, secondly, by rotating the flexible screw rod, the initial height of the sensor pressure head can be adjusted, and then the pressure received between different plugs can be adjusted to meet the requirements between different plugs. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an external perspective structure diagram of the application;

[0021] Figure 2 It is a structure diagram of the shielding module, the upper die and the supporting stack in the application;

[0022] Figure 3 It is a right view structure diagram of the application; Figure 2

[0023] Figure 4 It is a structure diagram of the application along the A-A section; Figure 3

[0024] Figure 5 It is a structure diagram of the bottom of the shielding module in the application;

[0025] Figure 6 It is a structure diagram of the unit arm and the assembly groove in the application;

[0026] Figure 7 It is a perspective structure diagram of the shielding module in the application;

[0027] Figure 8 It is a structure diagram of the flexible screw rod and the sensor pressure head positioning in the application;

[0028] Figure 9 It is a slope design diagram of the windowed area in the application;

[0029] Figure 10 It is an assembly diagram between the windowed area grid patches in the application.

[0030] In the figure: 1, lower die; 2, integrated plate; 3, unit arm; 4, upper die; 5, windowed area; 6, surrounding rib; 7, magnetic attraction strip; 8, base plate structure layer; 9, assembly rib; 11, functional screw rod; 12, limiting rod; 13, ladder surface; 14, assembly groove; 15, sensor pressure head; 16, flexible screw rod; 17, elastic member; 18, grid patch. DETAILED DESCRIPTION

[0031] ​​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0032] Please refer to Figures 1 to 10 The present application provides a technical solution: a wave soldering tool jig, comprising:

[0033] The lower die 1 has a frame-shaped inner ring wall, a plurality of unit arms 3 are slidingly installed on the inner wall of the lower die 1, the plurality of unit arms 3 are intermittently distributed, the sliding path of the unit arm 3 is perpendicular to the plane where the inner wall is located, the unit arm 3 has a single-layer stepped structure, the unit arm 3 has a plurality of gradient surfaces 13, the plurality of gradient surfaces 13 are all in the same plane, and the plurality of gradient surfaces 13 are sequentially connected to form a supporting stack for carrying the edge of the circuit board; the unit arm 3 has a first gradient plate, and a shielding module is detachably installed between the plurality of first gradient plates, and the shielding module is used to provide a welding window and a shielding layer.

[0034] In the prior art, the back-end factory always needs to customize the furnace tray and other jigs in advance during the wave soldering process. If temporary size changes or component pattern changes occur, the jig will be mismatched, affecting the stability of wave soldering, especially for plug-in circuit boards of electronic products. In the present application, by designing a plurality of unit arms 3 and gradient surfaces 13, the plurality of unit arms 3 can be self-adjusted in position, thereby quickly outlining the wiring of the supporting stack, matching the edge of the circuit board, placing the circuit board on the supporting stack, and then installing the shielding module matched with the circuit board below the circuit board, so as to quickly complete the adjustment and installation of the jig, so that the jig can adapt to circuit boards of various sizes, thereby avoiding re-customization and improving economic efficiency.

[0035] Compared with the customized production of the jig, the production of the shielding module is relatively rapid, and the shielding plate and other material plates can be quickly windowed and molded by laser cutting and other methods.

[0036] In a more preferred embodiment, the shielding module includes an integrated plate 2, the outer wall of the integrated plate 2 is fixedly installed with an assembly rib 9, the first gradient plate is provided with an assembly groove 14, and an interference fit of the plug-in type is formed between the assembly rib 9 and the assembly groove 14. The top of the integrated plate 2 is provided with a windowing area 5 matched with the test plate and a mounting position, and the top of the integrated plate 2 is in the same plane as the gradient surface 13. Please refer to Figures 2 to 6In this embodiment, the mounting ribs 9 on both sides of the integrated plate 2 are connected to the mounting grooves 14. Then, the position adjustable property of the unit arm 3 is used to make the remaining mounting grooves 14 and other parts of the mounting ribs 9 fit together, thereby locking the integrated plate 2 and the mounting ribs 9 and making the shielding module in the correct position. The mounting position is to provide sinking space for some components.

[0037] It should be noted that the integrated board 2 is compatible with the circuit board. When the integrated board 2 is locked, it means that each unit arm 3 has reached the correct position. At this time, the support stack formed by multiple ladder surfaces 13 connected in series is formed, and this support stack can be correctly connected with the circuit board.

[0038] Based on the shielding module embodiment, the window edge of the window area 5 has a slope design from bottom to top, with a slope range between 15 and 45 degrees. The slope design also has milled drainage grooves. A mesh patch 18 is fixedly installed at the bottom of the integrated board 2. The mesh patch 18 uses mesh openings to divide the bottom of the window area 5 into small window designs. In the prior art, window designs always face various problems and challenges. To protect the surface mount components, the fixture window is too small, hindering heat transfer and causing insufficient solder joint temperature on the circuit board, leading to cold soldering or bridging. Especially on irregularly shaped boards, "thermal dead zones" are easily formed. The circuit board covering the window forms a sealed space, and the air expands when heated, hindering the flow of molten solder, resulting in insufficient solder penetration and solder joint voids. Please refer to [link to relevant documentation]. Figure 9 and Figure 10 In this embodiment, by designing a sloping window, the shape of the window is optimized, the air capture space is reduced, and the side exhaust is guided. This avoids the formation of a vertical cavity wall in traditional right-angle windows, where the compressed air can only escape upwards. Secondly, the slope reduces the resistance to the flow of molten solder, reduces turbulence, and thus improves the soldering quality. The grid patch 18 can be used to change a large-area window into multiple small windows, such as the grid shape in this embodiment, shortening the air escape path. The grid patch 18 can be designed to be detachable, so that it can be adjusted according to needs.

[0039] Furthermore, a surrounding rib 6 is installed on the top of the integrated board 2. The surrounding rib 6 is evenly spaced around the periphery of the opening in the window area 5. The cross-section of the surrounding rib 6 is trapezoidal, and the surrounding rib 6 is made of fluororubber. In the prior art, the circuit board and the top of the integrated board 2 are in contact at the opening, but this creates an assembly gap, causing solder balls to flow in. Moreover, under high temperature conditions, thermal deformation can easily lead to the failure of the sealing element, and the intrusion of molten solder can damage ICs and other components. Please refer to [link to relevant documentation]. Figure 7In the top of the integrated board 2, a convex rib type tin bead retaining wall is formed to avoid tin liquid entering the assembly gap. Secondly, the surrounding rib 6 with a trapezoidal cross section can improve the protection capability. Since the circuit board is subjected to more vertical pressure, the stress gradient of the trapezoidal cross section is gentle, which can be gradually compressed. The fluororubber has high tensile strength and high temperature resistance, and also has an engineering level elastic modulus.

[0040] Further, the integrated board 2 is a multi-layer structure, from bottom to top, it is sequentially provided with a substrate structure layer 8, a heat insulation shielding layer and a gas phase barrier layer. The heat insulation shielding layer is made of ceramic fiber felt and is embedded in the unwindowed area of the substrate structure layer 8. The gas phase barrier layer is composed of expanded graphite foil. In the prior art, when the large specific gravity board or the heavier plug-in board is subjected to thermal deformation mismatch, the circuit board will be pulled by the carrier, and the solder joint will be subjected to shearing stress, which will cause the occurrence of micro-cracks. The component pins may also be bent due to stress, which will cause virtual welding. In the present embodiment, the substrate structure layer 8 is mainly made of SiC particle reinforced aluminum matrix composite material, which mainly improves its bending strength and reduces its thermal deformation, and provides shielding effect for the unwindowed area.

[0041] In a more preferred embodiment, the lower mold 1 is provided with a limiting rod 12 which penetrates and slides. The unit arm 3 is limited and slidably assembled on the outer wall of the limiting rod 12. The lower mold 1 is provided with a functional threaded hole. A functional screw rod 11 is threadedly assembled in the functional threaded hole. One end of the functional screw rod 11 is rotatably connected with the outer wall of the unit arm 3. The limiting rod 12 and the functional screw rod 11 are both vertically arranged on the inner wall of the lower mold 1. The rotation of the functional screw rod 11 controls the unit arm 3 to move away from or close to the lower mold 1. Please refer to Figures 2 to 4 The sliding direction of the unit arm 3 is limited and guided by the limiting rod 12 to ensure the stability of the sliding. The position of the unit arm 3 is driven by the rotation of the functional screw rod 11 to perform adaptive adjustment. The rotation adjustment of the functional screw rod 11 is simple and efficient, which can quickly form the gradient surface 13 which is adapted to the support stack of the circuit board.

[0042] In a more preferred embodiment, the top of the lower mold 1 is detachably provided with an upper mold 4. A plurality of positioning threaded holes are arranged in a rectangular array on the upper mold 4. A flexible screw rod 16 is threadedly connected in the positioning threaded hole. A sensor pressure head 15 is slidably connected with the outer wall of the flexible screw rod 16. An elastic member 17 is fixedly connected between the end of the flexible screw rod 16 and the inner bottom of the sensor pressure head 15. In the wave soldering process, the plug-in connection between the plug-in and the circuit board is not very stable, especially the connector or terminal row plug-in. Such components are prone to displacement or floating under the impact of tin waves due to long pins and heavy weight, which will cause virtual welding, offset or even bridging. Secondly, the displacement of the components or their pins will occur due to the floatation of the resist and the vibration of the conveying belt, which will cause virtual welding, floating welding or cold welding. Please refer to Figure 8In this embodiment, by utilizing the cooperation between multiple positioning threaded holes and the flexible screw 16, the flexible screw 16 can be installed at any position under the upper mold 4, thereby adapting to different plug-in layouts. Secondly, by rotating the flexible screw 16, the initial height of the sensor pressure head 15 can be adjusted, thereby allowing the pressure on different plug-ins to be adjusted to meet the requirements of different plug-ins. Some plug-ins require stable downward pressure, but cannot bear excessive pressure.

[0043] The sensor head 15 can integrate a pressure sensing system, thereby adjusting the pressure according to the requirements of the plug-in. After adjustment, no further adjustment is needed when facing the same circuit board; it can be installed directly.

[0044] Furthermore, the unit arm 3 is embedded with a magnetic layer, and a magnetic strip 7 is magnetically attracted on the step surface 13. The magnetic strip 7 can be connected to the bottom of the upper mold 4 through a connecting post. In this embodiment, when the circuit board is placed on the support walkway, the magnetic strip 7 and the magnetic layer can be used to lock the edge of the circuit board. If the circuit board with a large specific gravity is easy to shake, the connecting post can be used to form a cooperation with the magnetic strip 7, and the connecting post can be used to apply pressure to the magnetic strip 7 and the edge of the circuit board to improve the locking strength.

[0045] Assembly holes can be opened on the lower mold 1 for assembling structures such as buckles, handles and positioning elements, to match the chain conveyor system of the wave soldering equipment.

[0046] By utilizing the above-mentioned structures, the present invention can use multiple trapezoidal surfaces 13 to form an adjustable path support stack to support the circuit board, thereby enabling the fixture to adapt to different circuit boards.

[0047] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural parts described in the specification and drawings can also be processed without any doubt based on existing technical common sense. At the same time, the connection methods of each component adopt mature conventional methods in the existing technology, and the machinery, parts and equipment all adopt conventional models in the existing technology, so they will not be described in detail here.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wave soldering tooling fixture, characterized by: The utility model relates to a circuit board production device, including: The lower mould (1) with the frame type inner ring wall, the plurality of unit arms (3) are slidably installed on the inner wall of lower mould (1), the plurality of unit arms (3) are intermittently distributed, the sliding path of unit arm (3) is perpendicular to the plane where the inner wall is, unit arm (3) is single-layer ladder structure, unit arm (3) has ladder face (13), the plurality of ladder face (13) are in the same plane, and the plurality of ladder face (13) are sequentially connected and are combined to form the support stack for carrying the circuit board edge around; The limiting rod (12) is slidably assembled on the outer wall of limiting rod (12) in the lower mould (1), the lower mould (1) is provided with functional screw hole, the functional screw hole is screw assembled with function screw rod (11), one end of function screw rod (11) is rotatably connected with the outer wall of unit arm (3), and the limiting rod (12) and function screw rod (11) are vertically arranged on the plane where the inner wall of lower mould (1) is, and the function screw rod (11) is rotated to control unit arm (3) away from or close to lower mould (1); The unit arm (3) has a first ladder plate, and a shielding module is detachably mounted between the plurality of first ladder plates. The shielding module is used to provide a welding window and a shielding layer.

2. The wave soldering tooling jig of claim 1, wherein: The shielding module includes an integrated plate (2), an assembly rib (9) is fixedly installed on the outer wall of the integrated plate (2), an assembly groove (14) is formed on the first ladder plate, and an interference fit is formed between the assembly rib (9) and the assembly groove (14). An opening window area (5) and a mounting position matched with the test board are formed on the top of the integrated plate (2). The top of the integrated plate (2) is in the same plane as the ladder face (13).

3. The wave soldering tooling jig of claim 2, wherein: The window edge of the opening window area (5) is provided with a downward slope design, the slope range is between fifteen degrees and forty-five degrees, and a drainage groove is milled on the slope design. A grid patch (18) is fixedly installed on the bottom of the integrated plate (2). The bottom of the opening window area (5) is divided into a small window design by the grid patch (18).

4. The wave soldering tooling jig of claim 3, wherein: A surrounding rib (6) is installed on the top of the integrated plate (2). The surrounding rib (6) is equidistantly and uniformly arranged around the outer periphery of the opening of the opening window area (5). The cross section of the surrounding rib (6) is a trapezoidal structure, and the surrounding rib (6) is made of fluorine rubber.

5. The wave soldering tooling jig of claim 4, wherein: The integrated plate (2) is a multi-layer structure, including a substrate structure layer (8), a heat-shielding shielding layer, and a gas-phase barrier layer from bottom to top. The heat-shielding shielding layer is made of ceramic fiber felt and is embedded in the non-windowed area of the substrate structure layer (8). The gas-phase barrier layer is composed of an expanded graphite foil.

6. The wave soldering tooling jig of any one of claims 1-5, wherein: An upper mould (4) is detachably installed on the top of the lower mould (1). A plurality of positioning screw holes are formed on the upper mould (4) in a rectangular array. A flexible screw rod (16) is threadedly connected in the positioning screw hole. A sensor pressure head (15) is slidably connected to the outer wall of the flexible screw rod (16). An elastic member (17) is fixedly connected between the end of the flexible screw rod (16) and the inner bottom of the sensor pressure head (15).

7. The wave soldering tooling jig of claim 6, wherein: The unit arm (3) is embedded with a magnetic layer, the ladder surface (13) is magnetically attracted with a magnetic attraction strip (7), and the magnetic attraction strip (7) can be connected with the bottom of the upper die (4) through a connecting column.

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