Automatic edge sealing and glue dispensing machine for semiconductor chip

Abstract

The invention discloses an automatic edge sealing and glue dispensing machine for a semiconductor chip, and relates to the technical field of semiconductor chip packaging. The device comprises a machining table, a material carrying assembly is arranged at the top of the machining table, two electric lifting rods are fixed to each of the two sides of the top of the machining table, guide rail frames are fixed between the tops of the telescopic ends of the two electric lifting rods on one side, and a glue dispensing assembly is arranged between the two guide rail frames; and an edge blocking device is arranged below the glue dispensing assembly. Through the arrangement of the flange device, a cross beam, an elastic telescopic rod, a long groove plate, a trapezoidal block, a U-shaped plate and a square groove plate are matched to drive a rubber pad to abut against the top surface of a circuit board, so that the rubber pad shields the periphery of a semiconductor chip, and the rubber pad can effectively limit the overflow range of a glue solution; the glue solution is prevented from overflowing to a sensitive area of the semiconductor chip, such as a circuit or a bonding pad, and short circuit or chip performance damage caused by glue solution pollution is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip packaging technology, specifically to an automatic edge sealing and dispensing machine for semiconductor chips. Background Technology

[0002] Semiconductor chip edge sealing refers to the protection and treatment of the chip's edges during the chip manufacturing process using packaging technology to improve the chip's stability and durability. Edge sealing typically uses epoxy resin, plastic, or metal materials to prevent the chip from contacting the external environment, thus avoiding damage or corrosion. Edge sealing not only helps improve the chip's electrical performance but also effectively reduces physical stress, enhances thermal management and anti-interference capabilities, ensuring the chip's reliability and long lifespan in various applications.

[0003] Chinese patent CN220420538U discloses a dispensing device for semiconductor chip packaging, relating to the field of semiconductor dispensing. The patent includes a main body with an operating terminal fixedly connected to its side. A mounting bracket is fixedly connected to the upper outer wall of the main body, and a sliding rail is provided on the mounting bracket. A dispensing pen is slidably connected to the sliding rail, and an installation tube is installed at the upper end of the dispensing pen. Through the design of the mixing tank, the adhesive can be injected into the mixing tank before use, and the mixing blades perform pre-treatment by stirring. This uniform stirring by the blades removes bubbles from the adhesive, preventing voids during injection. Simultaneously, while the blades are stirring the adhesive in the mixing tank, a mixing component on the blades automatically releases a thinner to dilute the adhesive, preventing it from becoming too viscous and causing stringing during subsequent dispensing.

[0004] However, current dispensing machines have the following problems: when dispensing and sealing semiconductor chips, it is not convenient to limit the range of glue that may accidentally overflow during the edge sealing process. The overflowing glue can easily contaminate sensitive areas of the semiconductor chip, such as circuits or pads, leading to chip performance damage or even short circuits. Furthermore, the overflowing glue can easily cause uneven encapsulation layers, resulting in bubbles, cracks, or unevenness, which affects the overall packaging quality of the chip and reduces reliability. Therefore, we propose an automatic edge sealing dispensing machine for semiconductor chips. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an automatic edge sealing and dispensing machine for semiconductor chips, which solves the problems mentioned in the background section.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automatic edge sealing and dispensing machine for semiconductor chips, comprising a processing table, a material loading assembly on the top of the processing table, the material loading assembly including a through groove formed on the top of the processing table, a screw rotatably mounted inside the through groove of the processing table, the screw being driven by a motor, the external thread of the screw being threaded to a material loading platform, and the material loading platform being slidably mounted on the top of the processing table, two electric lifting rods fixed on both sides of the top of the processing table, a guide rail fixed between the top of the telescopic ends of the two electric lifting rods on one side, and the two... A dispensing assembly is installed between the guide rails. The dispensing assembly includes a second screw, which is rotatably mounted inside one side of the guide rail. A crossbeam is threaded onto the outside of the second screw. The crossbeam is slidably mounted inside the other side of the guide rail. An electric push rod is fixed to the top of the crossbeam. An L-shaped sliding plate is fixed to the telescopic end of the electric push rod and slidably mounted on the top of the crossbeam. The dispensing machine body is fixed to the outside of the L-shaped sliding plate. The crossbeam is the longitudinal moving end of the dispensing assembly, and the L-shaped sliding plate is the lateral moving end of the dispensing assembly. A baffle is provided below the dispensing assembly. The edge-blocking device includes two side frames fixed to the top sides of the processing table, and elastic telescopic rods fixed to the bottom sides of the longitudinal moving end of the dispensing assembly. A long groove plate is fixed between the bottom of the two elastic telescopic rods. U-shaped plates are slidably installed on both sides of the bottom of the long groove plate, and springs are provided between the outer walls of the U-shaped plates and the outer walls of the long groove plate. A square groove plate is fixed between the two U-shaped plates, and the top of the square groove plate has several square grooves. A rubber pad is fixed to the bottom of the square groove plate, and the top of the rubber pad has a square opening that matches the square grooves of the square groove plate. The bottom of the two U-shaped plates... Trapezoidal blocks are fixed on both sides. Each time the crossbeam moves downward, the crossbeam drives the elastic telescopic rod downward, and the elastic telescopic rod drives the long slot plate downward until the long slot plate abuts against the top of the side frame. At this point, the long slot plate is stationary. As the elastic telescopic rod continues to move downward, the telescopic end of the elastic telescopic rod is compressed. At the same time, during the downward movement of the long slot plate, the long slot plate drives the trapezoidal blocks to lock on both sides of the loading platform. The trapezoidal blocks will restrict the U-shaped plate and the square slot plate at the loading platform. Furthermore, the long slot plate, through the U-shaped plate, drives the rubber pad to abut against the top surface of the circuit board, thereby making the rubber pad form a shield around the semiconductor chip.

[0007] According to the above technical solution, the top of the rubber pad is uniformly and equidistantly fixed with U-shaped pressure plates, and the U-shaped pressure plates penetrate the square slot plate. The top two sides of the U-shaped pressure plates are fixed with semi-arc blocks. The bottom of the long slot plate is set with an arc surface. The arc surface of the semi-arc block is located on the arc surface movement trajectory of the long slot plate. Each time the crossbeam drives the long slot plate to move longitudinally through the elastic telescopic rod, and the long slot of the long slot plate is aligned with the square slot on the longitudinal direction of the square slot plate, the arc surface of the long slot plate pushes the arc surface of the semi-arc block to drive the U-shaped pressure plate to move downward. The U-shaped pressure plate squeezes the rubber pad downward, so that the bottom surface of the rubber pad is in closer contact with the top surface of the circuit board.

[0008] According to the above technical solution, LED curing lamps are embedded in the inner walls of several of the U-shaped pressure plates, and four induction switches are embedded in the top of the square slot plate. The four induction switches are respectively connected to several vertically arranged LED curing lamps through wires. The induction switches are externally powered. When the long slot of the long slot plate is aligned with the square slot on the vertical direction of the square slot plate, the long slot plate will move to the position above the induction switch. After the induction switch senses the long slot plate, it will be activated and turn on the vertically arranged LED curing lamps. Thus, when the dispensing machine body performs edge sealing operations on the vertically arranged semiconductor chips, the vertically arranged LED curing lamps can irradiate and cure the adhesive for edge sealing of the semiconductor chips.

[0009] According to the above technical solution, an anti-drip device is provided above the long groove plate. The anti-drip device includes two crossbars and two baffles. The two crossbars are respectively fixed to the outer wall of the fixed end of the two elastic telescopic rods. The two baffles are respectively slidably installed on the top two sides of the long groove plate. Both sides of the two baffles are provided with notches. The two baffles and the two crossbars are hinged together by hinge rods. After each dispensing by the dispensing machine body, the electric lifting rod will drive the crossbeam to move upward through the guide rail frame. The crossbeam drives the elastic telescopic rod to move upward. At this time, the telescopic end of the elastic telescopic rod is no longer compressed. During this process, the crossbar will pull the hinge rod to drive the baffle to slide along the top of the long groove plate towards the center of the long groove plate. The baffle forms a shield below the dispensing machine body.

[0010] According to the above technical solution, a cleaning device is provided between the two side frames. The cleaning device includes a rotating rod, a U-shaped frame, and two friction plates. The two friction plates are respectively fixed on the top two sides of the loading platform. The U-shaped frame is fixed between the outer walls of the two side frames. A rough plate is slidably installed on the top of the inner wall of the U-shaped frame. An L-shaped column is fixed on the side of the rough plate. The rotating rod is rotatably installed between the two side frames. Friction wheels are fixed on both sides of the rotating rod. A rubber roller is fixed in the middle of the rotating rod. An annular inclined groove roller is fixed on one side of the outer wall of the rotating rod. An annular inclined groove is formed on the outer wall of the annular inclined groove roller. The end of the L-shaped column away from the rough plate is slidably installed inside the annular inclined groove of the annular inclined groove roller. The rubber roller... The outer wall contacts the bottom of the frosted plate. The top of the friction plate and the outer wall of the friction wheel are both roughened. The top of the friction plate is located on the movement trajectory of the friction wheel. Each time the material carrier moves to the position below the dispensing assembly, the material carrier will drive the friction plate to move along with it. When the friction plate moves to the position of the friction wheel, under the action of friction between the friction plate and the friction wheel, the friction plate drives the friction wheel to rotate. The friction wheel drives the rotating rod to rotate, and the rotating rod drives the annular inclined groove roller to rotate. Under the restriction of the annular inclined groove of the annular inclined groove roller, the annular inclined groove of the annular inclined groove roller will drive the L-shaped column to push the frosted plate to move back and forth along the top of the inner wall of the U-shaped frame. The frosted plate rubs against the surface of the rubber roller, thereby causing static electricity to be generated on the surface of the rubber roller.

[0011] This invention provides an automatic edge sealing and dispensing machine for semiconductor chips. It has the following advantages:

[0012] (1) This invention, through the setting of the edge-blocking device, enables the crossbeam, elastic telescopic rod, long slot plate, trapezoidal block, U-shaped plate, and square slot plate to work together to drive the rubber pad to abut against the top surface of the circuit board, thereby making the rubber pad form a shield around the semiconductor chip. This allows the rubber pad to effectively limit the overflow range of the adhesive, preventing the adhesive from overflowing into sensitive areas of the semiconductor chip, such as circuits or pads, avoiding short circuits or chip performance damage caused by adhesive contamination. At the same time, the shielding effect of the rubber pad ensures that the adhesive is only distributed in the designated area, thereby improving the accuracy of dispensing, reducing unnecessary encapsulation defects caused by overflow, and improving the stability and reliability of the entire edge sealing process. Simultaneously, the crossbeam, elastic telescopic rod, long slot plate, square slot plate, and semi-circular block work together to press the rubber pad downwards, thereby making the rubber pad... The bottom surface of the adhesive pad makes closer contact with the top surface of the circuit board, thereby reducing the possibility of adhesive overflow through any gaps between the rubber pad and the circuit board. This further prevents adhesive from overflowing into sensitive areas of the chip, thus reducing the risk of chip contamination from adhesive overflow. At the same time, the long slot plate, square slot plate, and induction switch work together to turn on the vertically arranged LED curing lamps. This allows the vertically arranged LED curing lamps to irradiate and cure the adhesive applied to the semiconductor chips during edge sealing operations. The LED curing lamps can efficiently irradiate and cure the adhesive, ensuring rapid curing in a short time. This prevents the adhesive from overflowing or deforming due to prolonged sealing time, improving the stability and efficiency of the edge sealing process.

[0013] (2) By setting up an anti-drip device, after each dispensing operation of the dispensing machine body, the electric lifting rod will drive the crossbeam to move upward through the guide rail frame. The crossbeam, elastic telescopic rod, and hinge rod work together to drive the baffle to form a shield below the dispensing machine body. The shielding effect of the baffle can effectively prevent the glue from dripping below the dispensing machine body. When the baffle is below the dispensing machine body, it can prevent excess glue from dripping, avoid the dripping phenomenon, keep the dispensing area clean, and reduce the risk of contamination to other areas or chips.

[0014] (3) The present invention, through the setting of the cleaning device, enables the material carrier, friction plate, friction wheel, rotating rod, annular inclined groove roller, L-shaped column rod, rough plate and U-shaped frame to work together to drive the rough plate to rub the surface of the rubber roller, thereby generating static electricity on the surface of the rubber roller. When the material carrier carries the circuit board containing semiconductor chips through the rubber roller, the rubber roller will adsorb the dust on the semiconductor chip of the circuit board. By adsorbing the dust, the contamination on the semiconductor chip can be effectively reduced, which helps to keep the surface of the semiconductor chip and the circuit board clean, avoids dust interference with the dispensing process, and makes the sealing edge smoother and more uniform. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the entire invention;

[0016] Figure 2 This is a schematic diagram of a partial structure of the present invention;

[0017] Figure 3 This is a schematic diagram of the edge-blocking device of the present invention;

[0018] Figure 4 This is a partial structural diagram of the edge-blocking device of the present invention. Figure 1 ;

[0019] Figure 5 This is a partial structural diagram of the edge-blocking device of the present invention. Figure 2 ;

[0020] Figure 6 This is a schematic diagram of the anti-drip device of the present invention. Figure 1 ;

[0021] Figure 7 This is a schematic diagram of the anti-drip device of the present invention. Figure 2 ;

[0022] Figure 8 This is a schematic diagram of the cleaning device of the present invention.

[0023] In the diagram: 1. Processing table; 2. Screw 1; 3. Carrying platform; 4. Edge guard device; 41. Side frame; 42. Elastic telescopic rod; 43. Long groove plate; 44. U-shaped plate; 45. Square groove plate; 46. Rubber pad; 47. U-shaped pressure plate; 48. Semi-arc block; 49. LED curing lamp; 410. Induction switch; 411. Trapezoidal block; 5. Anti-drip device; 51. Crossbar; 52. Hinge rod; 53. Baffle; 6. Cleaning device; 61. Friction plate; 62. Rotating rod; 63. Friction wheel; 64. Rubber roller; 65. Fur plate; 66. U-shaped frame; 67. L-shaped column; 68. Annular inclined groove roller; 7. Dispensing assembly; 71. L-shaped slide plate; 72. Dispensing machine body; 73. Electric push rod; 74. Crossbeam; 75. Screw 2; 8. Electric lifting rod; 9. Guide rail frame. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0025] Please see Figures 1-8One embodiment of the present invention is: an automatic edge sealing and dispensing machine for semiconductor chips, including a processing table 1, a material loading assembly on the top of the processing table 1, the material loading assembly including a through groove formed on the top of the processing table 1, a screw 2 rotatably mounted inside the through groove of the processing table 1, and the screw 2 being driven by a motor, the external thread of the screw 2 being threadedly connected to a material loading platform 3, and the material loading platform 3 being slidably mounted on the top of the processing table 1, two electric lifting rods 8 fixed on both sides of the top of the processing table 1, a guide rail frame 9 fixed between the top of the telescopic ends of the two electric lifting rods 8 on one side, and a dispensing assembly 7 disposed between the two guide rail frames 9, the dispensing assembly 7 including a screw. Screw 75 is rotatably mounted inside the guide rail frame 9 on one side. A crossbeam 74 is threadedly connected to the outside of screw 75. The crossbeam 74 is slidably mounted inside the guide rail frame 9 on the other side. An electric push rod 73 is fixed to the top of the crossbeam 74. An L-shaped slide plate 71 is fixed to the telescopic end of the electric push rod 73, and the L-shaped slide plate 71 is slidably mounted on the top of the crossbeam 74. The dispensing machine body 72 is fixed to the outside of the L-shaped slide plate 71. The crossbeam 74 is the longitudinal moving end of the dispensing assembly 7, and the L-shaped slide plate 71 is the lateral moving end of the dispensing assembly 7. A baffle device 4 is provided below the dispensing assembly 7. The baffle device 4 includes components fixed to the top of the processing table 1. Two side frames 41 are fixed to the bottom of the longitudinal moving end of the dispensing assembly 7, and elastic telescopic rods 42 are fixed to both sides. A long groove plate 43 is fixed between the bottom of the two elastic telescopic rods 42. U-shaped plates 44 are slidably installed on both sides of the bottom of the long groove plate 43, and springs are provided between the outer walls of the U-shaped plates 44 and the outer walls of the long groove plate 43. A square groove plate 45 is fixed between the two U-shaped plates 44, and several square grooves are opened on the top of the square groove plate 45. A rubber pad 46 is fixed to the bottom of the square groove plate 45, and a square opening that matches the square groove of the square groove plate 45 is opened on the top of the rubber pad 46. Trapezoidal blocks 4 are fixed to both sides of the bottom of the two U-shaped plates 44. 11. With the above-described structure, the long slot plate 43, through the U-shaped plate 44, causes the rubber pad 46 to abut against the top surface of the circuit board. This allows the rubber pad 46 to form a shield around the semiconductor chip, effectively limiting the overflow range of the adhesive and preventing it from overflowing into sensitive areas of the semiconductor chip, such as circuits or pads. This avoids short circuits or chip performance damage caused by adhesive contamination. At the same time, the shielding effect of the rubber pad 46 ensures that the adhesive is distributed only in the designated area, thereby improving the accuracy of dispensing, reducing unnecessary packaging defects caused by overflow, and enhancing the stability and reliability of the entire sealing process.

[0026] A U-shaped pressure plate 47 is evenly and equidistantly fixed to the top of the rubber pad 46, and the U-shaped pressure plate 47 penetrates the square slot plate 45. A semi-circular block 48 is fixed to both sides of the top of the U-shaped pressure plate 47. The bottom of the long slot plate 43 is set with an arc surface. The arc surface of the semi-circular block 48 is located on the arc surface movement trajectory of the long slot plate 43. Through the above structure, the U-shaped pressure plate 47 presses the rubber pad 46 downward, so that the bottom surface of the rubber pad 46 is in closer contact with the top surface of the circuit board. This reduces the possibility of adhesive overflowing through the gaps between the rubber pad 46 and the circuit board, further preventing adhesive from overflowing into the sensitive area of ​​the chip, thereby reducing the risk of adhesive overflow contaminating the chip.

[0027] LED curing lamps 49 are embedded in the inner walls of several U-shaped pressure plates 47, and four induction switches 410 are embedded in the top of the square channel plate 45. The four induction switches 410 are connected to the longitudinally arranged LED curing lamps 49 by wires. The induction switches 410 are connected to an external power supply. With the above structure, the induction switches 410 turn on the longitudinally arranged LED curing lamps 49, so that when the dispensing machine body 72 performs edge sealing operation on the longitudinally arranged semiconductor chips, the longitudinally arranged LED curing lamps 49 can irradiate and cure the adhesive for edge sealing of the semiconductor chips. The LED curing lamps 49 can efficiently irradiate and cure the dispensing adhesive, ensuring that the adhesive cures quickly in a short time, avoiding overflow or deformation of the adhesive due to excessive time during the edge sealing process, and improving the stability and efficiency of the edge sealing process.

[0028] An anti-drip device 5 is installed above the long groove plate 43. The anti-drip device 5 includes two crossbars 51 and two baffles 53. The two crossbars 51 are respectively fixed to the outer wall of the fixed end of the two elastic telescopic rods 42. The two baffles 53 are respectively slidably installed on the top two sides of the long groove plate 43. Both sides of the two baffles 53 have notches. The two baffles 53 and the two crossbars 51 are hinged together by hinge rods 52. After each dispensing by the dispensing machine body 72, the above structure is used to prevent dripping. The crossbar 51 pulls the hinge rod 52, causing the baffle 53 to slide along the top of the long slot plate 43 towards the center of the long slot plate 43. The baffle 53 forms a shield below the dispensing machine body 72. The shielding effect of the baffle 53 can effectively prevent the glue from dripping below the dispensing machine body 72. When the baffle 53 is below the dispensing machine body 72, it can prevent excess glue from dripping, avoid glue dripping, keep the dispensing area clean, and reduce the risk of contamination to other areas or chips.

[0029] In use, the circuit board containing the semiconductor chip is placed on the loading platform 3. The screw 2, driven by a motor, rotates, moving the loading platform 3 above the processing table 1 until it is positioned below the dispensing assembly 7. The electric lifting rod 8 is then activated. Its telescopic end moves the crossbeam 74 downwards via the guide rail 9. The crossbeam 74, via the L-shaped sliding plate 71, moves the dispensing assembly 7 downwards. When the dispensing assembly 7 needs to perform dispensing operations, the screw 75, driven by a motor, rotates, moving the crossbeam 74 and the dispensing machine body 72 longitudinally. Simultaneously, the electric push rod 73 is activated. Its telescopic end drives the L-shaped sliding plate 71, moving the dispensing machine body 72 laterally. Through the coordinated lateral and longitudinal operation of the dispensing machine body 72, the dispensing and sealing operation of the semiconductor chip can be achieved. Each time the crossbeam 74 moves downwards, it moves the elastic telescopic rod 42 downwards, which in turn moves the long slot plate 43. The long slot plate 43 moves downward until it abuts against the top of the side frame 41. At this point, the long slot plate 43 is not stationary. As the elastic telescopic rod 42 continues to move downward, the telescopic end of the elastic telescopic rod 42 is compressed. At the same time, during the downward movement of the long slot plate 43, the long slot plate 43 drives the trapezoidal block 411 to be stuck on both sides of the material carrier 3. The trapezoidal block 411 will restrict the U-shaped plate 44 and the square slot plate 45 at the material carrier 3. The long slot plate 43, through the U-shaped plate 44, drives the rubber pad 46 to abut against the top surface of the circuit board, so that the rubber pad 46 forms a shield around the semiconductor chip. This allows the rubber pad 46 to effectively limit the overflow range of the adhesive, preventing the adhesive from overflowing into the sensitive areas of the semiconductor chip, such as circuits or pads, avoiding short circuits or chip performance damage caused by adhesive contamination. At the same time, the shielding effect of the rubber pad 46 ensures that the adhesive is only distributed in the designated area, thereby improving the accuracy of dispensing, reducing unnecessary packaging defects caused by overflow, and improving the stability and reliability of the entire edge sealing process.

[0030] It should be noted that when the crossbeam 74 moves longitudinally, the crossbeam 74 drives the long slot plate 43 to move along with it through the elastic telescopic rod 42. At this time, since the trapezoidal block 411 will restrict the U-shaped plate 44 and the square slot plate 45 at the loading platform 3, the U-shaped plate 44 and the square slot plate 45 will not be displaced. The spring on one side between the long slot plate 43 and the U-shaped plate 44 will be stretched, and the spring on the other side will be compressed.

[0031] Each time the crossbeam 74 drives the long slot plate 43 to move longitudinally via the elastic telescopic rod 42, and the long slot of the long slot plate 43 aligns with the square slot on the square slot plate 45, the arc surface of the long slot plate 43 pushes the arc surface of the semi-arc block 48 to drive the U-shaped pressure plate 47 to move downward. The U-shaped pressure plate 47 presses the rubber pad 46 downward, thereby making the bottom surface of the rubber pad 46 more tightly contact the top surface of the circuit board. This reduces the possibility of adhesive overflowing through the gaps between the rubber pad 46 and the circuit board, further preventing adhesive from overflowing into the sensitive area of ​​the chip, thus reducing the risk of adhesive overflow contaminating the chip.

[0032] Simultaneously, when the long groove of the long groove plate 43 aligns with the square groove on the longitudinal direction of the square groove plate 45, the long groove plate 43 will move to a position above the induction switch 410. After the induction switch 410 senses the long groove plate 43, it will be activated, and the induction switch 410 will turn on the longitudinally arranged LED curing lamps 49. Thus, when the dispensing machine body 72 performs edge sealing operations on the longitudinally arranged semiconductor chips, the longitudinally arranged LED curing lamps 49 can irradiate and cure the adhesive used for edge sealing of the semiconductor chips. The LED curing lamps 49 can efficiently irradiate and cure the dispensing adhesive, ensuring that the adhesive cures quickly in a short time, avoiding overflow or deformation of the adhesive due to excessive time during the edge sealing process, and improving the stability and efficiency of the edge sealing process.

[0033] During the compression of the telescopic end of the elastic telescopic rod 42, the crossbar 51 pushes the hinge rod 52 to drive the baffle 53 to slide along the top of the long groove plate 43 away from the center of the long groove plate 43. At this time, the baffle 53 no longer forms a blockage below the dispensing machine body 72, and the glue sprayed by the dispensing machine body 72 can pass over the long groove of the long groove plate 43. After each dispensing by the dispensing machine body 72, the electric lifting rod 8 drives the crossbeam 74 to move upward through the guide rail frame 9. The crossbeam 74 drives the elastic telescopic rod 42 to move upward. At this time, the elastic telescopic rod... When the telescopic end of 42 is no longer compressed, the crossbar 51 will pull the hinge rod 52 to drive the baffle 53 to slide along the top of the long slot plate 43 toward the center of the long slot plate 43. The baffle 53 forms a shield below the dispensing machine body 72. The shielding effect of the baffle 53 can effectively prevent the glue from dripping below the dispensing machine body 72. When the baffle 53 is below the dispensing machine body 72, it can prevent excess glue from dripping, avoid glue dripping, keep the dispensing area clean, and reduce the risk of contamination to other areas or chips.

[0034] Please see Figures 1-8 Based on the above embodiments, in another embodiment of the present invention,

[0035] In use, a cleaning device 6 is installed between the two side frames 41. The cleaning device 6 includes a rotating rod 62, a U-shaped frame 66, and two friction plates 61. The two friction plates 61 are fixed to the top sides of the loading platform 3, respectively. The U-shaped frame 66 is fixed between the outer walls of the two side frames 41. A rough plate 65 is slidably installed on the top of the inner wall of the U-shaped frame 66. An L-shaped column 67 is fixed on the side of the rough plate 65. The rotating rod 62 is rotatably installed between the two side frames 41. Friction wheels 63 are fixed on both sides of the rotating rod 62. A rubber roller 64 is fixed in the middle of the rotating rod 62. An annular inclined groove roller 68 is fixed on one side of the outer wall of the rotating rod 62. An annular inclined groove is opened on the outer wall of the annular inclined groove roller 68. The end of the L-shaped column 67 away from the rough plate 65 is slidably installed on the annular groove roller 68. Inside the annular inclined groove of the inclined roller 68, the outer wall of the rubber roller 64 contacts the bottom of the rough plate 65. The top of the friction plate 61 and the outer wall of the friction wheel 63 are both rough surfaces. The top of the friction plate 61 is located on the movement trajectory of the friction wheel 63. Through the above structure, the rough plate 65 rubs against the surface of the rubber roller 64, thereby generating static electricity on the surface of the rubber roller 64. When the material carrier 3 carries the circuit board containing semiconductor chips through the rubber roller 64, the rubber roller 64 will adsorb dust on the semiconductor chips of the circuit board. By adsorbing dust, the contamination on the semiconductor chips can be effectively reduced, which helps to keep the surface of the semiconductor chips and the circuit board clean, avoids dust interference with the dispensing process, and makes the sealing edge smoother and more uniform.

[0036] Each time the loading platform 3 moves to the position below the dispensing assembly 7, the loading platform 3 will drive the friction plate 61 to move along with it. When the friction plate 61 moves to the position of the friction wheel 63, under the action of friction between the friction plate 61 and the friction wheel 63, the friction plate 61 drives the friction wheel 63 to rotate. The friction wheel 63 drives the rotating rod 62 to rotate, and the rotating rod 62 drives the annular inclined groove roller 68 to rotate. Under the restriction of the annular inclined groove of the annular inclined groove roller 68, the annular inclined groove of the annular inclined groove roller 68 will drive the L-shaped column rod 67 to push the rough plate 65 to move back and forth along the top of the inner wall of the U-shaped frame 66. The rough plate 65 rubs the surface of the rubber roller 64, thereby generating static electricity on the surface of the rubber roller 64. When the loading platform 3 carries the circuit board containing the semiconductor chip past the rubber roller 64, the rubber roller 64 will adsorb the dust on the semiconductor chip of the circuit board. By adsorbing the dust, the contamination on the semiconductor chip can be effectively reduced, which helps to keep the surface of the semiconductor chip and the circuit board clean, avoids dust interference with the dispensing process, and makes the sealing edge smoother and more uniform.

[0037] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An automatic edge sealing and dispensing machine for semiconductor chips, comprising a processing table (1), characterized in that: A material-carrying assembly is provided on the top of the processing table (1). Two electric lifting rods (8) are fixed on both sides of the top of the processing table (1). A guide rail frame (9) is fixed between the top of the telescopic ends of the two electric lifting rods (8) on one side. A dispensing assembly (7) is provided between the two guide rail frames (9). A baffle device (4) is provided below the dispensing assembly (7). The baffle device (4) includes two side frames (41) fixed on both sides of the top of the processing table (1) and elastic telescopic rods (42) fixed on both sides of the bottom of the longitudinal moving end of the dispensing assembly (7). The two elastic telescopic rods (42) A long groove plate (43) is fixed between the bottoms of the two U-shaped plates (44). A U-shaped plate (44) is slidably installed on both sides of the bottom of the long groove plate (43). A spring is provided between the outer walls of the U-shaped plate (44) and the outer walls of the long groove plate (43). A square groove plate (45) is fixed between the two U-shaped plates (44). A number of square grooves are opened on the top of the square groove plate (45). A rubber pad (46) is fixed at the bottom of the square groove plate (45). A square opening that matches the square groove of the square groove plate (45) is opened on the top of the rubber pad (46). A trapezoidal block (411) is fixed on both sides of the bottom of the two U-shaped plates (44).

2. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 1, characterized in that: The material loading assembly includes a through slot opened on the top of the processing table (1), a screw (2) is rotatably installed inside the through slot of the processing table (1), and the screw (2) is driven by a motor. The external thread of the screw (2) is connected to a material loading platform (3), and the material loading platform (3) is slidably installed on the top of the processing table (1).

3. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 1, characterized in that: The dispensing assembly (7) includes a second screw (75), which is rotatably mounted inside a guide rail frame (9) on one side. A crossbeam (74) is threadedly connected to the outside of the second screw (75). The crossbeam (74) is slidably mounted inside a guide rail frame (9) on the other side. An electric push rod (73) is fixed to the top of the crossbeam (74). An L-shaped slide plate (71) is fixed to the telescopic end of the electric push rod (73), and the L-shaped slide plate (71) is slidably mounted on the top of the crossbeam (74). The dispensing machine body (72) is fixed to the outside of the L-shaped slide plate (71). The crossbeam (74) is the longitudinal moving end of the dispensing assembly (7), and the L-shaped slide plate (71) is the lateral moving end of the dispensing assembly (7).

4. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 1, characterized in that: The top of the rubber pad (46) is uniformly and equidistantly fixed with a U-shaped pressure plate (47), and the U-shaped pressure plate (47) penetrates the square groove plate (45). The top two sides of the U-shaped pressure plate (47) are fixed with semi-arc blocks (48). The bottom of the long groove plate (43) is set with an arc surface, and the arc surface of the semi-arc block (48) is located on the arc surface movement trajectory of the long groove plate (43).

5. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 4, characterized in that: LED curing lamps (49) are embedded in the inner walls of several of the U-shaped pressure plates (47), and four induction switches (410) are embedded in the top of the square channel plate (45). The four induction switches (410) are respectively connected to several LED curing lamps (49) arranged longitudinally through wires, and the induction switches (410) are connected to an external power source.

6. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 1, characterized in that: An anti-drip device (5) is provided above the long groove plate (43). The anti-drip device (5) includes two crossbars (51) and two baffles (53). The two crossbars (51) are respectively fixed to the outer wall of the fixed end of the two elastic telescopic rods (42). The two baffles (53) are respectively slidably installed on the top two sides of the long groove plate (43). The two baffles (53) have notches on both sides. The two baffles (53) and the two crossbars (51) are hinged together by hinge rods (52).

7. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 2, characterized in that: A cleaning device (6) is provided between the two side frames (41). The cleaning device (6) includes a rotating rod (62), a U-shaped frame (66), and two friction plates (61). The two friction plates (61) are respectively fixed on the top two sides of the loading platform (3). The U-shaped frame (66) is fixed between the outer walls of the two side frames (41). A rough plate (65) is slidably installed on the top of the inner wall of the U-shaped frame (66). An L-shaped column (67) is fixed on the side of the rough plate (65). The rotating rod (62) is rotatably mounted between two side frames (41). Friction wheels (63) are fixed on both sides of the rotating rod (62). A rubber roller (64) is fixed in the middle of the rotating rod (62). An annular inclined groove roller (68) is fixed on one side of the outer wall of the rotating rod (62). An annular inclined groove is opened on the outer wall of the annular inclined groove roller (68). The end of the L-shaped column rod (67) away from the fur plate (65) is slidably mounted inside the annular inclined groove of the annular inclined groove roller (68).

8. The automatic edge sealing and dispensing machine for semiconductor chips according to claim 7, characterized in that: The outer wall of the rubber roller (64) is in contact with the bottom of the fur plate (65). The top of the friction plate (61) and the outer wall of the friction wheel (63) are both rough surfaces. The top of the friction plate (61) is located on the movement trajectory of the friction wheel (63).

Images