Manufacturing method of double-sided conduction FPC (Flexible Printed Circuit) material

Abstract

The invention discloses a manufacturing method of a double-sided conducting FPC (Flexible Printed Circuit) material. The manufacturing method comprises the following steps: pasting an upper release film and a lower release film on the upper surface and the lower surface of an insulating substrate of which the double sides are coated with glue layers; positioning marks are arranged on the edge of the insulating substrate, and through holes are formed in the surfaces of the upper release film, the insulating substrate and the lower release film; tearing off the lower release film, and compounding a lower metal layer on the lower surface of the insulating substrate; the upper surface of the upper release film is coated with a conductive material, so that the through holes are filled with the conductive material, and the conductive material is fused with the lower metal layer; and tearing off the upper release film, and compounding an upper metal layer on the upper surface of the insulating substrate, so that the upper metal layer is fused with the conductive material in the through hole. The method has the advantages of no need of electroplating, energy conservation and environmental protection; the contact area between the upper metal layer and the conductive material and the contact area between the lower metal layer and the conductive material are large, the resistance is small, the heat productivity is small, the conduction performance between the upper metal layer and the lower metal layer is good, the strength of the insulation substrate is high, the flatness of the insulation substrate is good, the production efficiency is high, and only common equipment or manual painting is needed.

Description

TECHNICAL FIELD

[0001] The application relates to a double-sided conductive FPC material manufacturing method. BACKGROUND

[0002] The double-sided conductive FPC material is a material for connecting the upper and lower metal layers of the insulating substrate, and the current manufacturing methods include two kinds: the first method is to coat copper layers on the upper and lower surfaces of the insulating substrate, punch holes through the insulating substrate and the upper and lower copper layers, and then electroplate the copper layers on the inner walls of the holes to connect the upper and lower copper layers; the second method is to coat a copper layer on the upper surface of the insulating substrate, punch holes through the insulating substrate and the copper layer, coat a copper layer on the lower surface of the insulating substrate, and then fill copper paste, silver paste or tin paste in the holes to connect the upper and lower copper layers. The first method has some defects, such as small area of the electroplated copper layer, linear connection between the upper and lower copper layers, small contact area, poor conductivity, pollution caused by electroplating, large investment in electroplating equipment, complex process, low efficiency and large energy consumption; the second method has some defects, such as poor flexibility and strength of the connection between the material and the copper layer at the hole position, uneven copper layer surface after filling the copper paste, silver paste or tin paste, environmental pollution, oxidation and falling of the silver paste or tin paste, unstable connection, low efficiency and pollution of the copper paste, silver paste or tin paste. SUMMARY

[0003] The application aims to solve the problems in the prior art and provide a double-sided conductive FPC material manufacturing method.

[0004] To solve the above problems, the application adopts the following technical scheme.

[0005] A double-sided conductive FPC material manufacturing method comprises the following steps:

[0006] S1, taking an insulating substrate, coating glue on the upper and lower surfaces of the insulating substrate, and pasting an upper release film on the upper surface and a lower release film on the lower surface of the insulating substrate;

[0007] S2, setting a positioning mark on the edge of the insulating substrate with the upper and lower release films pasted thereon, and punching holes through the upper release film, the insulating substrate and the lower release film;

[0008] S3, tear off the lower release film, and composite the lower metal layer on the lower surface of the insulating base; brush the conductive material on the upper surface of the upper release film, so that the conductive material fills in the through hole, and the conductive material is fused with the lower metal layer; tear off the upper release film, and composite the upper metal layer on the upper surface of the insulating base, so that the upper metal layer is fused with the conductive material in the through hole, wherein the positioning mark exposes at least one of the lower metal layer or the upper metal layer.

[0009] A preferred solution is that in S3, the lower metal layer and the glue layer are cured, so that the lower metal layer and the glue layer are firmly bonded; the upper metal layer and the glue layer are cured, so that the upper metal layer and the glue layer are firmly bonded.

[0010] A preferred solution is that the curing temperature of the lower metal layer and the glue layer is 100-200 degrees, and the curing time is 1-2 hours; the curing temperature of the upper metal layer and the glue layer is 100-200 degrees, and the curing time is 1-2 hours.

[0011] A preferred solution is that the conductive material is tin paste, conductive powder or conductive glue.

[0012] A preferred solution is that the lower metal layer and the upper metal layer are copper foil layers respectively.

[0013] A preferred solution is that the through hole is formed by laser or rolling cutter on the surface of the upper release film, the insulating base and the lower release film.

[0014] A preferred solution is that the insulating base is a sheet or a roll.

[0015] A preferred solution is that the insulating base is made of PET or PI material.

[0016] A preferred solution is that the positioning mark is a positioning hole or a positioning line.

[0017] A preferred solution is that the aperture of the through hole on the surface of the insulating base is greater than 0.3-1.2 mm.

[0018] The beneficial effects of the present application are that the conductive material fills in the through hole by brushing the conductive material on the upper surface of the upper release film, without traditional electroplating, which is energy-saving, environment-friendly, low in production cost and high in efficiency; the through hole is filled with the conductive material, one end of the conductive material is connected with the upper metal layer, and the other end is connected with the lower metal layer, the contact area of the upper metal layer and the lower metal layer with the conductive material is large, the resistance is small, the heat generation is small, the conduction performance between the upper metal layer and the lower metal layer is good, and at the same time, since the conductive material fills in the through hole, the strength of the insulating base is high, the flatness of the insulating base is good, the production efficiency is high by brushing the conductive material on the upper surface of the upper release film, only ordinary equipment is needed for brushing, or manual brushing is needed, and the tensile strength is high.

[0019] The above description is merely an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the bonding of the upper release film, lower release film, and insulating substrate in this invention;

[0021] Figure 2 This is a schematic diagram of the through-hole penetrating the upper release film, the insulating substrate, and the lower release film in this invention. Figure 1 ;

[0022] Figure 3 This is a schematic diagram of the lower metal layer being laminated onto the lower surface of the insulating substrate in this invention;

[0023] Figure 4 This is a schematic diagram of the upper surface of the release film being coated with conductive material in this invention.

[0024] Figure 5 This is a schematic diagram of the upper metal layer being laminated onto the upper surface of the insulating substrate in this invention. Figure 1 ;

[0025] Figure 6 This is a schematic diagram of the through-hole penetrating the upper release film, the insulating substrate, and the lower release film in this invention. Figure 2 ;

[0026] Figure 7 This is a schematic diagram of the upper metal layer being laminated onto the upper surface of the insulating substrate in this invention. Figure 2 ;

[0027] Figure 8 This is a schematic diagram of the double-sided conductive circuit formed by the present invention. Detailed Implementation

[0028] To illustrate the ideas and objectives of this invention, the invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0029] The present application will now be described in more detail with reference to the accompanying drawings and embodiments.

[0030] First embodiment, such as Figures 1 to 8 As shown in the figure, this application discloses a method for fabricating a double-sided conductive FPC material, including:

[0031] S1. Take the insulating substrate 10, apply adhesive to the upper and lower surfaces of the insulating substrate 10 respectively, and attach the release film 11 to the upper surface and the lower release film 12 to the lower surface of the insulating substrate 10.

[0032] S2, positioning marks 13 are set on the edges of the insulating substrate 10 with the upper release film 11 and the lower release film 12 pasted, through holes 14 are punched on the surfaces of the upper release film 11, the insulating substrate 10 and the lower release film 12, so that the through holes 14 pass through the upper release film 11, the insulating substrate 10 and the lower release film 12;

[0033] S3, the lower release film 12 is torn off, the lower metal layer 15 is compounded on the lower surface of the insulating substrate 10; the conductive material 16 is brushed on the upper surface of the upper release film 11, so that the conductive material 16 fills in the through hole 14, and the conductive material 16 in the through hole 14 is fused with the lower metal layer 15; the upper release film 11 is torn off, the upper metal layer 17 is compounded on the upper surface of the insulating substrate 10, so that the upper metal layer 17 is fused with the conductive material 16 in the through hole 14. Among them, the positioning mark 13 exposes at least one of the lower metal layer 15 or the upper metal layer 17.

[0034] As shown in Figures 1 to 8 , the width of the lower metal layer 15 is less than the width of the insulating substrate 10, so that the positioning mark 13 exposes the lower metal layer 15; or the width of the upper metal layer 17 is less than the width of the insulating substrate 10, so that the positioning mark 13 exposes the upper metal layer 17. The positional relationship between the through hole 14 and the positioning mark 13 corresponds, and the positioning mark 13 is convenient for subsequent production of double-sided conductive lines.

[0035] Some embodiments, as shown in Figures 1 to 8 , the width of the lower metal layer 15 is less than the width of the insulating substrate 10, so that the positioning mark 13 exposes the lower metal layer 15, the width of the upper metal layer 17 is equal to the width of the insulating substrate 10, and the upper metal layer 17 covers the positioning mark 13.

[0036] Some embodiments, as shown in Figures 1 to 8 , the width of the upper metal layer 17 is less than the width of the insulating substrate 10, so that the positioning mark 13 exposes the upper metal layer 17, the width of the lower metal layer 15 is equal to the width of the insulating substrate 10, and the lower metal layer 15 covers the positioning mark 13.

[0037] As shown in Figures 1 to 8As shown, a conductive material 16 is coated on the upper surface of the release film 11, so that the conductive material 16 fills the through-hole 14. This eliminates the need for traditional electroplating, saving energy and protecting the environment, resulting in low production costs and high efficiency. The through-hole 14 is filled with the conductive material 16, one end of which is connected to the upper metal layer 17, and the other end is connected to the lower metal layer 15. The upper metal layer 17 and the lower metal layer 15 have a large contact area with the conductive material 16, resulting in low resistance and low heat generation. The conductive material 16 fills the through-holes 14, ensuring good conductivity. The insulating substrate 10 also exhibits high strength and good flatness. Applying the conductive material 16 to the upper surface of the release film 11 eliminates the need for welding or electroplating at each through-hole 14, resulting in high production efficiency. Ordinary equipment or manual application is sufficient, ensuring uniform distribution of conductive material across the entire upper surface of the release film 11. The through-holes filled with conductive material exhibit high tensile strength. The conductive material 16 within the through-holes 14 is encased between the upper metal layer 17 and the lower metal layer 15, preventing oxidation and detachment, thus increasing conductivity stability. Even when the conductive material 16 within the through-holes 14 experiences poor contact with the upper metal layer 17 or the lower metal layer 15, localized heating can fuse the conductive material 16 to the upper metal layer 17 or the lower metal layer 15.

[0038] like Figures 1 to 8 As shown, in some embodiments, in step S2, positioning marks are set on the edge of the insulating substrate to which the upper release film and the lower release film are pasted, and through holes are made on the surfaces of the upper release film, the insulating substrate and the lower release film, so that the through holes penetrate the upper release film, the insulating substrate and the lower release film.

[0039] like Figures 1 to 8 As shown, in some embodiments, in step S2, positioning marks are set on the edge of the insulating substrate to which the upper release film and the lower release film are pasted, and then through holes are made on the surfaces of the upper release film, the insulating substrate and the lower release film, so that the through holes penetrate the upper release film, the insulating substrate and the lower release film.

[0040] like Figures 1 to 8 As shown in the second embodiment, in S3, the lower metal layer and the adhesive layer are cured to ensure a strong bond between them; the upper metal layer and the adhesive layer are also cured to ensure a strong bond between them. The curing process can ensure a strong bond between the lower or upper metal layer and the adhesive layer. It can also ensure sufficient fusion between the lower or upper metal layer and the conductive material 16.

[0041] Preferred, such as Figures 1 to 8 As shown, the curing temperature of the lower metal layer and the adhesive layer is 100°C to 200°C, and the curing time is 1 hour to 2 hours; the curing temperature of the upper metal layer and the adhesive layer is 100°C to 200°C, and the curing time is 1 hour to 2 hours.

[0042] likeFigures 1 to 8 As shown in the figure, the curing temperature of the lower metal layer and the glue layer is 165 degrees, and the curing time is 1.5 hours; the curing temperature of the upper metal layer and the glue layer is 165 degrees, and the curing time is 1.5 hours.

[0043] As shown in the figure, Figures 1 to 8 As shown in the figure, the conductive material 16 is tin paste, conductive powder or conductive glue. The tin paste, conductive powder or conductive glue in the through hole 14 is respectively fused with the upper metal layer 17 and the lower metal layer 15, so that the upper metal layer 17 and the lower metal layer 15 are conductive.

[0044] As shown in the figure, Figures 1 to 8 As shown in the figure, the lower metal layer 15 and the upper metal layer 17 are respectively a copper foil layer, an aluminum foil layer or a copper-aluminum composite layer.

[0045] As shown in the figure, Figures 1 to 8 As shown in the figure, the through hole 14 is formed by punching on the surface of the upper release film 11, the insulating substrate 10 and the lower release film 12 by laser or rolling cutter, or the through hole is formed by mechanical punching on the surface of the upper release film, the insulating substrate and the lower release film. The punching efficiency is high.

[0046] As shown in the figure, Figures 1 to 8 As shown in the figure, the insulating substrate 10 is a sheet or a roll.

[0047] As shown in the figure, Figures 1 to 8 As shown in the figure, the insulating substrate 10 is made of PET, PI material or glass fiber plate.

[0048] As shown in the figure, Figures 1 to 8 As shown in the figure, the positioning mark 13 is a positioning hole or a positioning line. The positioning hole penetrates the upper release film 11, the insulating substrate 10 and the lower release film 12.

[0049] As shown in the figure, ​ As shown in the figure, the aperture of the through hole 14 on the surface of the insulating substrate 10 is greater than 0.3mm-1.2mm. In the present application, the aperture of the through hole 14 on the surface of the insulating substrate 10 is 1mm.

[0050] The above is the specific embodiment of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered to be within the scope of protection of the present application.

Claims

1. A method for manufacturing a double-sided conductive FPC material, characterized in that, include: S1, Take an insulating substrate, apply adhesive layers to the upper and lower surfaces of the insulating substrate respectively, and attach a release film to the upper surface and a lower release film to the lower surface of the insulating substrate; S2, positioning marks are set on the edge of the insulating substrate to which the upper release film and the lower release film are pasted, and through holes are made on the surfaces of the upper release film, the insulating substrate and the lower release film so that the through holes penetrate the upper release film, the insulating substrate and the lower release film; S3, peel off the lower release film, and laminate a lower metal layer onto the lower surface of the insulating substrate; apply a conductive material to the upper surface of the upper release film, so that the conductive material fills the through-hole and the conductive material is fused with the lower metal layer; peel off the upper release film, and laminate an upper metal layer onto the upper surface of the insulating substrate, so that the upper metal layer is fused with the conductive material in the through-hole, wherein the positioning mark exposes at least one of the lower metal layer or the upper metal layer.

2. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, In S3, the lower metal layer and the adhesive layer are cured to ensure a strong bond between them; the upper metal layer and the adhesive layer are also cured to ensure a strong bond between them.

3. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The curing temperature for the lower metal layer and adhesive layer is 100°C to 200°C, and the curing time is 1 hour to 2 hours; the curing temperature for the upper metal layer and adhesive layer is 100°C to 200°C, and the curing time is 1 hour to 2 hours.

4. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The conductive material is solder paste, conductive powder, or conductive adhesive.

5. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The lower metal layer and the upper metal layer are respectively a copper foil layer, an aluminum foil layer, or a copper-aluminum composite layer.

6. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, Through holes are formed by drilling holes on the surfaces of the upper release film, insulating substrate, and lower release film using laser or roller cutter, or by mechanically punching holes on the surfaces of the upper release film, insulating substrate, and lower release film.

7. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The insulating substrate is a sheet or a roll.

8. The method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The insulating substrate is made of PET, PI material or fiberglass board.

9. A method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The positioning mark is a positioning hole or a positioning line.

10. A method for manufacturing a double-sided conductive FPC material according to claim 1, characterized in that, The diameter of the through holes on the surface of the insulating substrate is greater than 0.3 mm to 1.2 mm.

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