Soldering paste grinding equipment for semiconductor packaging and processing method thereof

Abstract

The invention discloses solder paste grinding equipment for semiconductor packaging and a machining method thereof, and relates to the technical field of solder paste grinding. The solder paste grinding equipment comprises a grinding cylinder, a fixing column is fixedly mounted at the bottom end in the grinding cylinder, a mounting frame is fixedly mounted at the top end of the grinding cylinder, and a first servo motor is fixedly mounted at the bottom end of the mounting frame; the soldering paste grinding device has the beneficial effects that through the arrangement of the flow dividing box, soldering paste with large particles can be filtered out through the first filter plate and then falls into the flow dividing box, meanwhile, through work of a draught fan, the soldering paste can be filtered out through the first filter plate, the soldering paste can be filtered out through the second filter plate, and the soldering paste can be filtered out through the second filter plate and then falls into the flow dividing box; according to the device for grinding the solder paste, the solder paste with large particles can sequentially pass through the material suction pipe and the feeding pipe and finally fall into the grinding cylinder, through the arrangement of the process, the device can screen the ground solder paste, then the solder paste with the large particles is subjected to secondary grinding, and therefore the grinding quality of the device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to a soldering paste grinding device for semiconductor packaging and a processing method thereof. BACKGROUND

[0002] The soldering paste plays a key role in the semiconductor packaging process, and the quality directly affects the welding effect. As a key material of SMT (surface mounting technology), the soldering paste is used for connecting electronic components and PCB boards, and the quality directly affects the welding reliability. In the packaging process, the soldering paste needs to ensure the wettability and insulation impedance value to guarantee the performance of the chip.

[0003] The existing device does not set a screening device when the soldering paste is ground, so that the quality of the ground soldering paste is not uniform, thereby possibly affecting the work of the semiconductor packaging in the later period. Therefore, the application provides a soldering paste grinding device for semiconductor packaging and a processing method thereof. SUMMARY

[0004] In view of the defects of the prior art, the application provides a soldering paste grinding device for semiconductor packaging and a processing method thereof, which solves the problems in the background art.

[0005] To achieve the above object, the application is implemented by the following technical scheme: a soldering paste grinding device for semiconductor packaging and a processing method thereof, comprising a grinding cylinder, a fixed column is fixedly installed at the bottom of the inside of the grinding cylinder, a mounting frame is fixedly installed at the top of the grinding cylinder, a first servo motor is fixedly installed at the bottom of the mounting frame, the output end of the first servo motor extends to the inside of the grinding cylinder and is fixedly connected with a cross, four moving columns are rotatably connected with the bottom of the cross, a plurality of leakage holes are formed at the bottom of the inside of the grinding cylinder, a leakage cylinder is fixedly installed at the bottom of the grinding cylinder, a filter box is fixedly installed at the bottom of the leakage cylinder, a filter plate one is fixedly installed in the filter box, a discharge box is fixedly installed at the bottom of the filter box, a shunt box is fixedly installed on one side of the discharge box, a suction pipe is fixedly connected with the bottom of the shunt box, a fan is fixedly installed at the top of the mounting frame, the other end of the suction pipe is fixedly connected with the output end of the fan, a feeding pipe is fixedly connected with the outside of the suction pipe, the other end of the feeding pipe extends to the inside of the grinding cylinder, and a filter plate two is fixedly installed in the suction pipe. Through the setting of the shunt box, the qualified and unqualified ground soldering paste can be separated by the filter plate one, so that the unqualified soldering paste is subjected to the working of the fan and then enters the inside of the grinding cylinder through the feeding pipe and is subjected to secondary grinding. Through the setting of the process, the quality of the soldering paste grinding of the device can be guaranteed.

[0006] Preferably, the inner wall of the grinding cylinder, the outer side of the fixed column and the outer side of the four moving columns are provided with a plurality of protrusions, and the inner wall of the grinding cylinder, the outer side of the fixed column and the outer side of the four moving columns are matched respectively, through the cooperation between the protrusions on the fixed column and the moving column, the solder paste raw material can be ground.

[0007] Preferably, the outer side of the grinding cylinder is fixedly installed with a control panel, and the top end of the grinding cylinder is fixedly installed with a feeding port.

[0008] Preferably, the bottom end of the leakage cylinder is fixedly installed with two supporting legs.

[0009] Preferably, the bottom end of the discharge box is fixedly installed with a discharge pipe.

[0010] Preferably, the first servo motor and the fan are electrically connected with the control panel.

[0011] Preferably, the inside of the feeding port is placed with an upper pre-grinding box, the inside of the upper pre-grinding box is fixedly installed with an upper grinding plate, one side of the inner wall of the upper pre-grinding box is provided with a first sliding groove, a lead screw is rotatably connected in the first sliding groove through a bearing, a first sliding block is slidably connected in the first sliding groove, the lead screw penetrates through the first sliding block and is threadedly connected therewith, two T-shaped sliding blocks are fixedly installed on one side of the first sliding block, a lower sliding plate is slidably connected outside the T-shaped sliding blocks, an upper fixed plate is fixedly installed on one side of the first sliding block and located at the top of the T-shaped sliding blocks, springs are fixedly installed between the upper fixed plate and the lower sliding plate, a wave trigger block is fixedly installed on one side of the lower sliding plate, a second sliding groove and a third sliding groove are formed on the side of the upper pre-grinding box away from the first sliding groove, a third sliding block is fixedly installed on one side of the upper fixed plate, the second sliding groove is slidably connected with the third sliding block, and a wave trigger plate is fixedly installed in the third sliding groove and matched with the wave trigger block.

[0012] Preferably, a limiting column is fixedly installed on the top of the lower sliding plate, and the limiting column penetrates through the upper fixed plate and is slidably connected therewith.

[0013] Preferably, a second servo motor is fixedly installed on one side of the upper pre-grinding box, and the output end of the second servo motor penetrates into the inside of the first sliding groove and is fixedly connected with one end of the lead screw.

[0014] A processing method of a semiconductor packaging solder paste grinding equipment, comprising the following steps: S1, the device is powered on, the workers pour the solder paste raw materials into the inside of the grinding cylinder through the feed port, use the control panel to make the first servo motor work, the first servo motor drives the cross to rotate, the cross bottom end is rotatably connected with four moving columns, the protrusions on the moving columns and the protrusions on the outer side of the fixed column and the inner wall of the grinding cylinder cooperate, and the solder paste raw materials are ground; S2, the ground raw materials will fall from the leakage hole into the leakage cylinder, and the required solder paste raw materials will fall into the discharge box through the filter plate 1, S3, the workers put a box at the bottom end of the discharge pipe in advance, the ground solder paste will fall into the box, the unqualified solder paste will roll into the shunt box along the filter plate 1, and the unqualified solder paste will roll into the shunt box along the filter plate 1, and the unqualified solder paste will roll into the shunt box along the filter plate 1, S4, the unqualified solder paste falls into the grinding cylinder along the suction pipe and the feed pipe through the setting of the filter plate 2, and the unqualified solder paste is ground again, and the grinding is continued according to the above operation.

[0015] The application provides a solder paste grinding equipment for semiconductor packaging and a processing method thereof, which has the following beneficial effects: 1、The solder paste grinding equipment for semiconductor packaging is provided with a shunt box, which can filter out solder paste with relatively large particles through the filter plate 1 first, and then make the solder paste with relatively large particles fall into the shunt box, and the work of the fan can make the solder paste with relatively large particles pass through the suction pipe and the feed pipe in turn and finally fall into the grinding cylinder, so that the device can screen the ground solder paste, and then the solder paste with relatively large particles is ground again, so that the grinding quality of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural schematic view of the application; Figure 2 It is another perspective view of the application; Figure 3 It is a sectional view of the application; Figure 4 It is a schematic view of the inside of the grinding cylinder of the application; Figure 5 It is a structural schematic view of the upper pre-grinding box of the application; Figure 6 It is a sectional view of the upper pre-grinding box of the application; Figure 7 It is a structural schematic view of another state of the upper pre-grinding box of the application; Figure 8 It is a partial assembly drawing of the application; Figure 9 It is a structural schematic view of the lower sliding plate of the application; Figure 10 For the application Figure 6 Enlarged view of A in the application.

[0017] In the figure: 1, grinding cylinder; 101, protrusion; 102, leakage hole; 103, mounting frame; 2, fixed column; 3, moving column; 4, cross; 5, first servo motor; 6, leakage cylinder; 7, filter box; 8, filter plate one; 9, discharge box; 10, discharge pipe; 11, shunt box; 12, suction pipe; 13, feeding pipe; 14, filter plate two; 15, fan; 16, feeding port; 17, supporting leg; 18, control panel; 19, upper pre-grinding box; 20, first sliding groove; 21, lead screw; 22, first sliding block; 23, second servo motor; 24, upper fixed plate; 25, T-shaped sliding block; 26, lower sliding plate; 27, limiting column; 28, spring; 29, second sliding groove; 30, third sliding groove; 31, wave trigger plate; 32, wave trigger block; 33, third sliding block; 34, upper grinding plate. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, not all the embodiments.

[0019] Please refer to Figures 1 to 10 The application provides a technical solution: a solder paste grinding equipment for semiconductor packaging and a processing method thereof, which comprises a grinding cylinder 1, a fixed column 2 is fixedly installed at the bottom end inside the grinding cylinder 1, a mounting frame 103 is fixedly installed at the top end of the grinding cylinder 1, a first servo motor 5 is fixedly installed at the bottom end of the mounting frame 103, the first servo motor 5 is used to drive a cross 4 to rotate, the output end of the first servo motor 5 extends to the inside of the grinding cylinder 1 and is fixedly connected with the cross 4, the cross 4 is used to drive a moving column 3 to rotate, four moving columns 3 are rotatably connected with the bottom end of the cross 4, a plurality of leakage holes 102 are formed at the bottom end inside the grinding cylinder 1, the leakage holes 102 are used to drop the ground solder paste raw materials, a leakage cylinder 6 is fixedly installed at the bottom end of the grinding cylinder 1, the leakage cylinder 6 is fixedly installed at the bottom end of the leakage cylinder 6, a filter box 7 is fixedly installed inside the filter box 7, a filter plate one 8 is fixedly installed inside the filter box 7, the filter plate one 8 is used to screen the qualified solder paste and the unqualified solder paste, a discharge box 9 is fixedly installed at the bottom end of the filter box 7, a shunt box 11 is fixedly installed on one side of the discharge box 9, a suction pipe 12 is fixedly connected with the bottom end of the shunt box 11, a fan 15 is fixedly installed at the top end of the mounting frame 103, the fan 15 is used to suck the unqualified solder paste back into the inside of the grinding cylinder 1, the other end of the suction pipe 12 is fixedly connected with the output end of the fan 15, a feeding pipe 13 is fixedly connected with the outside of the suction pipe 12, and the other end of the feeding pipe 13 extends to the inside of the grinding cylinder 1, a filter plate two 14 is fixedly installed inside the suction pipe 12, and the filter plate two 14 is used to prevent the solder paste raw materials from entering the fan 15.

[0020] As Figure 2 shown, the inner wall of the grinding cylinder 1, the outer side of the fixed column 2 and the outer side of the four moving columns 3 are all provided with a plurality of protrusions 101, and the inner wall of the grinding cylinder 1, the outer side of the fixed column 2 and the four moving columns 3 are respectively matched.

[0021] As Figure 2 shown, the control panel 18 is fixedly installed on the outer side of the grinding cylinder 1, and the control panel 18 is used to control the device. The top end of the grinding cylinder 1 is fixedly installed with a feeding port 16, and the feeding port 16 is used to pour in the solder paste raw material.

[0022] As Figure 1 shown, the bottom end of the leakage cylinder 6 is fixedly installed with two supporting legs 17, and the supporting legs 17 are used to support the device.

[0023] As Figure 2 shown, the bottom end of the discharge box 9 is fixedly installed with a discharge pipe 10, and the discharge pipe 10 is used to discharge the ground solder paste.

[0024] As Figure 1 shown, the first servo motor 5 and the fan 15 are electrically connected with the control panel 18.

[0025] As Figure 5 , Figure 6 and Figure 7 shown, the inside of the feeding port 16 is placed with an upper pre-grinding box 19, and the inside of the upper pre-grinding box 19 is fixedly installed with an upper grinding plate 34. One side of the inner wall of the upper pre-grinding box 19 is provided with a first sliding groove 20, the inside of the first sliding groove 20 is rotatably connected with a lead screw 21 through a bearing, the inside of the first sliding groove 20 is slidably connected with a first sliding block 22, the lead screw 21 penetrates through the first sliding block 22 and is threadedly connected with the first sliding block 22, one side of the first sliding block 22 is fixedly installed with two T-shaped sliding blocks 25, the outer side of the T-shaped sliding block 25 is slidably connected with a lower sliding plate 26, one side of the first sliding block 22 and located at the top of the T-shaped sliding block 25 is fixedly installed with an upper fixed plate 24, the upper fixed plate 24 and the lower sliding plate 26 are fixedly installed with a spring 28, one side of the lower sliding plate 26 is fixedly installed with a wave trigger block 32, one side of the upper pre-grinding box 19 away from the first sliding groove 20 is provided with a second sliding groove 29 and a third sliding groove 30, one side of the upper fixed plate 24 is fixedly installed with a third sliding block 33, the second sliding groove 29 is slidably connected with the third sliding block 33, the inside of the third sliding groove 30 is fixedly installed with a wave trigger plate 31, and the wave trigger plate 31 is matched with the wave trigger block 32.

[0026] As Figure 8 shown, the top of the lower sliding plate 26 is fixedly installed with a limiting column 27, and the limiting column 27 penetrates through the upper fixed plate 24 and is slidably connected with the upper fixed plate 24.

[0027] As Figure 5As shown, one side of the pre-grinding box 19 is fixedly provided with a second servo motor 23, and the output end of the second servo motor 23 penetrates into the first sliding groove 20 and is fixedly connected with one end of the lead screw 21.

[0028] In summary, the solder paste grinding device for semiconductor packaging is used. First, the device is powered on, then the worker pours the solder paste raw material into the inside of the grinding cylinder 1 through the feeding port 16, then the first servo motor 5 is started by the control panel 18, then the first servo motor 5 drives the cross 4 to rotate, the four moving columns 3 on the cross 4 are rotatably connected with the bottom end of the cross 4, so that the protrusions 101 on the moving columns 3 cooperate with the protrusions 101 on the inner wall of the grinding cylinder 1 and the outer side of the fixed column 2, so that the solder paste raw material is ground, then the ground raw material falls from the leakage hole 102 into the leakage cylinder 6, then falls from the leakage hole 102 into the filter box 7, and the required solder paste raw material falls through the filter plate 1 into the discharge box 9, then the worker puts a box at the bottom end of the discharge pipe 10 in advance, then the ground solder paste falls into the box, then the fan 15 is turned on, then the unqualified solder paste rolls on the filter plate 1 and falls into the shunt box 11, then the unqualified solder paste falls along the suction pipe 12 and the feeding pipe 13, and the unqualified solder paste falls into the grinding cylinder 1 along the feeding pipe 13 through the filter plate 2, then the unqualified solder paste is ground again, then the above operation is continued according to the above operation, and the working principle of the present application is as follows.

[0029] In the present application, unless specifically defined otherwise or limited, the terms "mount", "connect", "connect", "fix", and the like should be broadly understood, for example, can be fixed connection, or can be detachable connection, or integrated; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] In the present application, unless specifically defined otherwise or limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0031] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0032] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. A solder paste grinding apparatus for semiconductor packaging, comprising a grinding cylinder (1), characterized in that: The bottom end of the grinding cylinder (1) is fixedly installed with a fixed column (2), the top end of the grinding cylinder (1) is fixedly installed with a mounting rack (103), the bottom end of the mounting rack (103) is fixedly installed with a first servo motor (5), the output end of the first servo motor (5) extends to the inside of the grinding cylinder (1) and is fixedly connected with a cross (4), the bottom end of the cross (4) is rotatably connected with four moving columns (3), the bottom end of the grinding cylinder (1) is provided with a plurality of leakage holes (102), the bottom end of the grinding cylinder (1) is fixedly installed with a leakage cylinder (6), the bottom end of the leakage cylinder (6) is fixedly installed with a filter box (7), the inside of the filter box (7) is fixedly installed with a filter plate one (8), the bottom end of the filter box (7) is fixedly installed with a discharge box (9), one side of the discharge box (9) is fixedly installed with a shunt box (11), the bottom end of the shunt box (11) is fixedly connected with a suction pipe (12), the top end of the mounting rack (103) is fixedly installed with a fan (15), the other end of the suction pipe (12) is fixedly connected with the output end of the fan (15), the outside of the suction pipe (12) is fixedly connected with a feeding pipe (13), and the other end of the feeding pipe (13) extends to the inside of the grinding cylinder (1), the inside of the suction pipe (12) is fixedly installed with a filter plate two (14).

2. The solder paste grinding apparatus for semiconductor packaging according to claim 1, wherein: The inside wall of the grinding cylinder (1), the outside of the fixed column (2) and the outside of the four moving columns (3) are all provided with a plurality of protrusions (101), and the inside wall of the grinding cylinder (1), the outside of the fixed column (2) and the four moving columns (3) are respectively matched.

3. The solder paste grinding apparatus for semiconductor packaging according to claim 1, wherein: The outside of the grinding cylinder (1) is fixedly installed with a control panel (18), and the top end of the grinding cylinder (1) is fixedly installed with a feeding port (16).

4. The solder paste grinding apparatus for semiconductor packaging according to claim 1, wherein: The bottom end of the leakage cylinder (6) is fixedly installed with two supporting legs (17).

5. The solder paste grinding apparatus for semiconductor packaging according to claim 1, wherein: The bottom end of the discharge box (9) is fixedly installed with a discharge pipe (10).

6. The solder paste grinding apparatus for semiconductor packaging according to claim 1, wherein: The first servo motor (5) and the fan (15) are both electrically connected with the control panel (18).

7. The solder paste grinding apparatus for semiconductor packaging according to claim 3, wherein: The inside of the feeding port (16) is internally provided with an upper pre-milling box (19), the upper pre-milling box (19) is internally fixedly installed with an upper grinding plate (34), one side of the inner wall of the upper pre-milling box (19) is provided with a first sliding groove (20), the first sliding groove (20) is internally rotatably connected with a lead screw (21) through a bearing, the first sliding groove (20) is internally slidably connected with a first sliding block (22), the lead screw (21) penetrates through and is threadedly connected with the first sliding block (22), one side of the first sliding block (22) is fixedly installed with two T-shaped sliding blocks (25), the outer side of the T-shaped sliding block (25) is slidably connected with a lower sliding plate (26), one side of the first sliding block (22) and the top of the T-shaped sliding block (25) are fixedly installed with an upper fixed plate (24), the upper fixed plate (24) and the lower sliding plate (26) are fixedly installed with a spring (28), one side of the lower sliding plate (26) is fixedly installed with a wave trigger block (32), one side of the upper pre-milling box (19) away from the first sliding groove (20) is provided with a second sliding groove (29) and a third sliding groove (30), one side of the upper fixed plate (24) is fixedly installed with a third sliding block (33), the second sliding groove (29) is slidably connected with the third sliding block (33), the third sliding groove (30) is internally fixedly installed with a wave trigger plate (31), and the wave trigger plate (31) cooperates with the wave trigger block (32).

8. The solder paste grinding apparatus for semiconductor packaging according to claim 7, wherein: The top of the lower sliding plate (26) is fixedly installed with a limiting column (27), the limiting column (27) penetrates through and is slidably connected with the upper fixed plate (24).

9. The solder paste grinding apparatus for semiconductor packaging according to claim 7, wherein: One side of the upper pre-milling box (19) is fixedly installed with a second servo motor (23), the output end of the second servo motor (23) penetrates into the inside of the first sliding groove (20) and is fixedly connected with one end of the lead screw (21).

10. The method of claim 1, wherein the solder paste grinding apparatus is used for a semiconductor package. The following steps are included: S1, power on the device, the workers pour the solder paste raw materials into the inside of the grinding cylinder 1 through the feeding port 16, use the control panel 18 to make the first servo motor 5 work, the first servo motor 5 drives the cross 4 to rotate, the cross 4 is rotatably connected with four moving columns 3 at the bottom end, the protrusions 101 on the moving columns 3 and the protrusions 101 on the inner wall of the grinding cylinder 1 and the outer side of the fixed column 2 cooperate to grind the solder paste raw materials; S2, the ground raw materials will fall from the leakage hole 102 into the leakage cylinder 6, and then fall into the filter box 7, and the required solder paste raw materials will fall through the filter plate one 8 into the discharge box 9, S3, the workers put a box at the bottom end of the discharge pipe 10 in advance, the ground solder paste will fall into the box, open the fan 15, and the unqualified solder paste will roll on the shunt box 11 along the filter plate one 8, and the unqualified solder paste will fall into the grinding cylinder 1 along the feeding pipe 13 through the filter plate two 14, S4, the unqualified solder paste will fall into the grinding cylinder 1 along the feeding pipe 13 through the filter plate two 14, and the unqualified solder paste will be ground again, and the grinding operation continues according to the above operation.

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