Controller board tin soldering device and tin soldering method thereof

Abstract

The invention discloses a controller board tin soldering method, which comprises the following steps of S1, printing solder paste on a bonding pad of a PCB (Printed Circuit Board) by using a steel mesh to form a solder paste layer; s2, arranging a solder ring on the solder paste layer, wherein the inner diameter of the solder ring can allow a product pin to pass through; s3, the product is inserted into the PCB, and then the PCB is placed on a bearing table on the through hole reflow soldering equipment; s4, detecting vacancy information of the bearing platform and information of through holes in the PCB; s5, performing hole closing operation on the vacant bearing table and the through hole according to the detection information in the step S4; and S6, carrying out welding operation on the PCB loaded with the plurality of plug-in products by the through hole reflow soldering equipment. The invention discloses a controller board tin soldering device. Compared with the prior art, the problem that tin is insufficient in the welding process of the connector can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of through-hole reflow technology, and particularly relates to a controller board soldering device and a soldering method thereof. BACKGROUND

[0002] In surface mount technology (SMT: Surface Mount Technology), for electronic components with long strip-shaped pins, such as connectors, the existing circuit board pads are generally designed as a rectangular structure. In the process of mounting, the electronic component pins for mounting are placed on the pads, and then solder is arranged on the pads to fix the electronic components. However, the connectors are prone to poor welding problems such as virtual welding and less soldering during the welding process. SUMMARY

[0003] The present application is to solve the problem of less soldering of the connector during the welding process, and provides a controller board soldering device and a soldering method thereof.

[0004] In order to achieve the above-mentioned purpose, the present application provides a controller board soldering device and a soldering method thereof, which comprises:

[0005] S1: using a steel mesh to print solder paste on the pads of the PCB board to form a solder paste layer;

[0006] S2: arranging a solder ring on the solder paste layer, and the inner diameter of the solder ring can be passed through by the product pin;

[0007] S3: inserting the product into the PCB board, and then placing the PCB board on the bearing table of the through-hole reflow soldering equipment;

[0008] S4: detecting the vacancy information of the bearing table and the information of the through-hole on the PCB;

[0009] S5: performing a closed hole operation on the vacant bearing table and the through-hole according to the detection information of step S4;

[0010] S6: the through-hole reflow soldering equipment performs a welding operation on the PCB board loaded with multiple inserted products.

[0011] Further description of the above technical solutions:

[0012] The pad comprises an upper pad, a lower pad and a column body, the upper pad and the lower pad are arranged on opposite sides of the PCB board respectively, the column body connects the upper pad and the lower pad, the column body is provided with a through-hole, and the through-hole penetrates through the upper pad and the lower pad.

[0013] Further description of the above technical solutions:

[0014] The column is a structure of thick in the middle and thin at both ends.

[0015] As a further description of the above technical solution:

[0016] The inner side wall of the column is provided with a clamping groove, and the clamping groove is provided with solder.

[0017] As a further description of the above technical solution:

[0018] The upper surface of the solder ring gradually decreases in height from outside to inside in a stepped manner.

[0019] As a further description of the above technical solution:

[0020] The soldering operation step of the step S6 includes: blowing hot air to the lower surface of the PCB, and blowing cold air to the upper surface of the PCB.

[0021] The application provides a controller board soldering device, which comprises:

[0022] The through-hole reflow soldering device is provided with a plurality of bearing tables;

[0023] The detection component is used for detecting the vacancy information of the bearing table and the information of the through hole on the PCB; and the plugging component plugs the vacancy bearing table and the through hole according to the detection component

[0024] As a further description of the above technical solution:

[0025] The through-hole reflow soldering device is provided with a heat insulation plate, which divides the cavity of the through-hole reflow soldering device into an upper furnace cavity and a lower furnace cavity.

[0026] As a further description of the above technical solution:

[0027] The plugging component comprises a cylinder and a plugging plate, and the plugging plate is connected to the cylinder.

[0028] As described above, due to the adoption of the above technical solution, the application has the following beneficial effects:

[0029] 1、In the application, the solder ring is provided, and when soldering, the solder ring and the tin paste are heated and melted together along the through-hole reflow to solder the pins. The solder ring is melted to increase the amount of solder, and then the amount of solder reflowing into the via is increased to ensure that there is enough solder in the hole during soldering, so that the problem of less tin during the welding process of the connector can be solved, and the welding quality is improved.

[0030] 2、In the present application, the maximum number of the carrying table is placed with a to-be-welded piece, the carrying table without the to-be-welded piece is used as an empty carrying table, the empty information of the carrying table and the information of the through hole on the PCB are detected, and the empty carrying table and the through hole are closed according to the detection information, so that the heat between the upper furnace chamber and the lower furnace chamber in the welding position without welding operation can be avoided, the temperature of the upper furnace chamber and the lower furnace chamber can be reliable when the welding operation is carried out subsequently, the temperature of the upper furnace chamber and the lower furnace chamber can protect the elements of the to-be-welded piece from being damaged in the welding operation, and the welding quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0032] Fig. 1 It is a flow chart of a controller board soldering device and a soldering method thereof.

[0033] Fig. 2 It is a structural schematic diagram of a solder pad.

[0034] Fig. 3 It is a structural schematic diagram of a controller board soldering device.

[0035] Legend:

[0036] 1, PCB; 2, solder paste layer; 3, solder ring; 4, carrying table; 5, upper solder pad; 6, lower solder pad; 7, column; 8, air cylinder; 9, plugging plate; 10, upper furnace chamber; 11, lower furnace chamber. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0039] It should be noted that similar reference numerals and letters refer to like items in the accompanying drawings, and once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0040] In the description of the embodiments of the present application, it should be noted that the terms "upper", "inner", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "adjacent", "connection" should be broadly understood, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be directly adjacent, or indirectly adjacent through an intermediate medium, or can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] Please refer to Figs. 1-3 The present application provides a controller board soldering device and a soldering method thereof, which comprises:

[0043] S1: using a steel mesh to print solder paste on the pads of the PCB board 1 to form a solder paste layer 2;

[0044] S2: a solder ring 3 is arranged on the solder paste layer 2, and the inner diameter of the solder ring 3 can pass through the product pin;

[0045] S3: inserting the product into the PCB board 1, and then placing the PCB board 1 on the bearing table 4 of the through-hole reflow soldering equipment;

[0046] S4: detecting the vacancy information of the bearing table 4 and the information of the through hole on the PCB;

[0047] S5: according to the detection information of step S4, the vacant bearing table 4 and the through hole are closed;

[0048] S6: the through-hole reflow soldering equipment performs soldering operation on the PCB board 1 loaded with multiple inserted products.

[0049] The soldering pad comprises an upper soldering pad 5, a lower soldering pad 6 and a column 7, the upper soldering pad 5 and the lower soldering pad 6 are arranged on opposite sides of the PCB board 1 respectively, the column 7 connects the upper soldering pad 5 and the lower soldering pad 6, the column 7 is provided with a through hole, and the through hole penetrates the upper soldering pad 5 and the lower soldering pad 6. The column 7 is in a structure of thick in the middle and thin at both ends. By arranging the column 7 in the structure of thick in the middle and thin at both ends, the tin paste after soldering is not easy to be separated from the through hole under stress, and the pin soldering is more firm.

[0050] A clamping groove is arranged on the inner side wall of the column 7, and solder is arranged in the clamping groove. The solder is specifically tin paste, so that the pin and the column 7 are connected more closely.

[0051] The upper surface of the solder ring 3 is gradually lowered from outside to inside in a stepped manner. In this way, the molten tin paste can enter the through hole, and the tin paste can be prevented from flowing out of the soldering pad.

[0052] The soldering operation step of the step S6 comprises: blowing hot air to the lower surface of the PCB board, and blowing cold air to the upper surface of the PCB board. The temperature during soldering is prevented from exceeding the temperature that the connector can withstand, and the connector is prevented from being damaged during the soldering operation.

[0053] A controller board soldering device, comprising:

[0054] The through-hole reflow soldering device is provided with a plurality of bearing tables 4;

[0055] A detection component is arranged for detecting the vacancy information of the bearing table 4 and the information of the through hole on the PCB. The detection component can be a camera.

[0056] A plugging component is arranged for plugging the vacant bearing table 4 and the through hole according to the detection component.

[0057] The through-hole reflow soldering device is provided with a heat insulation plate, which divides the cavity of the through-hole reflow soldering device into an upper furnace cavity 10 and a lower furnace cavity 11. The plugging component comprises a gas cylinder 8 and a plugging plate 9, and the plugging plate 9 is connected to the gas cylinder 8. The plugging component for plugging the vacant bearing table is arranged in the upper furnace cavity, and the plugging component for plugging the through hole on the PCB is arranged in the lower furnace cavity, so that the plugging of the through hole on the PCB and the vacant bearing table can be prevented from interfering with each other.

[0058] Working principle: through the setting of solder ring, when welding, the solder ring and the tin paste are heated and melted together along the reflow to weld the pin, the solder ring is melted to increase the amount of solder, and then the amount of solder reflowing into the via is increased, so as to ensure that there is enough solder in the hole during welding, so as to solve the problem of less tin during welding of the connector, and improve the welding quality. There is at most one to-be-welded piece on the bearing table, the bearing table without the to-be-welded piece is used as an empty bearing table, the empty information of the bearing table and the information of the through hole on the PCB are detected, and the empty bearing table and the through hole are closed according to the detection information. Hole operation, so as to avoid the heat between the upper furnace chamber and the lower furnace chamber in the welding position without welding operation, so that the temperature of the upper furnace chamber and the lower furnace chamber is reliable when the welding operation is carried out subsequently, the temperature of the upper furnace chamber and the lower furnace chamber can protect the elements of the to-be-welded piece from being damaged during the welding operation, and the welding quality is improved.

[0059] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A method of soldering a controller board, characterized by, The method comprises the following steps: S1: printing tin paste on the pads of the PCB board using a steel mesh to form a tin paste layer; S2: setting a solder ring on the tin paste layer, the inner diameter of the solder ring allowing the product pins to pass through; S3: inserting the product into the PCB board, and then placing the PCB board on the bearing table of the through-hole reflow soldering equipment; S4: detecting the vacancy information of the bearing table and the information of the through hole on the PCB; S5: performing a closed hole operation on the vacant bearing table and the through hole according to the detection information of step S4; S6: the through-hole reflow soldering equipment performs a welding operation on the PCB board loaded with multiple inserted products.

2. The method of claim 1, wherein the controller board is a printed circuit board. The pad comprises an upper pad, a lower pad, and a column, the upper pad and the lower pad are respectively arranged on opposite sides of the PCB board, the column connects the upper pad and the lower pad, and a through hole is arranged on the column, the through hole penetrates the upper pad and the lower pad.

3. The method of claim 2, wherein the controller board is a printed circuit board. The column has a structure of thick in the middle and thin at both ends.

4. The method of claim 2, wherein the controller board is a printed circuit board. A clamping groove is arranged on the inner side wall of the column, and solder is arranged in the clamping groove.

5. The method of claim 1, wherein the controller board is a printed circuit board. The upper surface of the solder ring gradually decreases in height from outside to inside in a stepped manner.

6. The method of claim 1, wherein the controller board is a printed circuit board. The welding operation step of step S6 comprises: blowing hot air to the lower surface of the PCB board, and blowing cold air to the upper surface of the PCB board.

7. A controller board soldering apparatus, characterized by comprising: It comprises: A through-hole reflow soldering equipment is provided with multiple bearing tables; A detection component is used to detect the vacancy information of the bearing table and the information of the through hole on the PCB; A plugging component plugs the vacant bearing table and the through hole according to the detection component.

8. The controller board soldering apparatus of claim 7, wherein, A heat insulation plate is arranged in the through-hole reflow soldering equipment, which divides the cavity of the through-hole reflow soldering equipment into an upper furnace cavity and a lower furnace cavity.

9. The controller board soldering apparatus of claim 7, wherein, The plugging component comprises a gas cylinder and a plugging plate, and the plugging plate is connected to the gas cylinder.

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