Modular tandem repeats of highly platelet-adhesive recombinant type III collagen and its applications
By integrating the VWF/GPVI/α2β1 binding domain into the collagen backbone through a modular tandem repeat design, the problem of insufficient platelet binding site density of recombinant type III collagen was solved, achieving efficient platelet adhesion and tissue repair.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NORTHWEST UNIV
- Filing Date
- 2025-08-12
- Publication Date
- 2026-05-26
AI Technical Summary
The density of platelet-binding sites in existing recombinant type III collagen is insufficient, resulting in low platelet adhesion efficiency, which makes it difficult to meet the needs of efficient hemostasis and tissue repair.
By employing a modular tandem repeat structure, multiple receptor binding domains such as VWF/GPVI/α2β1 are integrated into the collagen backbone, increasing the density of platelet binding sites and achieving efficient adhesion through the synergistic effect of multiple receptors.
It significantly improves platelet binding and regulation efficiency, enhances hemostasis and tissue repair capabilities, possesses good biocompatibility and high expression efficiency, and is suitable for wound healing and tissue engineering.
Smart Images

Figure CN120904356B_ABST