Modular tandem repeats of highly platelet-adhesive recombinant type III collagen and its applications

By integrating the VWF/GPVI/α2β1 binding domain into the collagen backbone through a modular tandem repeat design, the problem of insufficient platelet binding site density of recombinant type III collagen was solved, achieving efficient platelet adhesion and tissue repair.

CN120904356BActive Publication Date: 2026-05-26NORTHWEST UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NORTHWEST UNIV
Filing Date
2025-08-12
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The density of platelet-binding sites in existing recombinant type III collagen is insufficient, resulting in low platelet adhesion efficiency, which makes it difficult to meet the needs of efficient hemostasis and tissue repair.

Method used

By employing a modular tandem repeat structure, multiple receptor binding domains such as VWF/GPVI/α2β1 are integrated into the collagen backbone, increasing the density of platelet binding sites and achieving efficient adhesion through the synergistic effect of multiple receptors.

Benefits of technology

It significantly improves platelet binding and regulation efficiency, enhances hemostasis and tissue repair capabilities, possesses good biocompatibility and high expression efficiency, and is suitable for wound healing and tissue engineering.

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Abstract

This invention belongs to the field of genetic engineering technology, specifically relating to a modular tandem repeat recombinant type III collagen with high platelet adhesion and its applications. The amino acid sequence of the recombinant type III collagen includes repeating units, with ≥3 repeating units; functional modules are inserted within each repeating unit. This invention integrates multiple discrete platelet-binding sites in type III collagen, designs a tandem repeat structure of different modular sequences (≥3 repeating units), optimizes spatial synergy, optimizes the gene sequence using codon bias, efficiently expresses the gene through a Pichia pastoris expression system, and obtains a high-purity product after purification. The recombinant type III collagen prepared by this invention exhibits good biocompatibility and can significantly promote erythrocyte and platelet adhesion; it can be widely used in wound repair, hemostatic materials, and tissue engineering.
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