Equipment measurement method and device
By applying vibration to the panel of the semiconductor testing equipment and measuring the amplitude using a non-contact displacement sensor, the problem of insufficient equipment stability was solved, thereby improving the stability of the testing equipment and the accuracy of the test results.
Patent Information
- Application Number
- CN202510980144.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-16
- Publication Date
- 2025-11-07
AI Technical Summary
Existing semiconductor testing equipment suffers from insufficient stability during testing. Poor contact or excessive compression between the probe and the wafer can easily occur, leading to inaccurate test results and easy equipment damage. There is also a lack of effective evaluation methods.
By applying vibration to the panel of a semiconductor testing device and measuring the amplitude and deformation of the panel in the first direction using a non-contact displacement sensor, the contact between the panel and the probe is evaluated, and panels with higher stability are selected.
It improves the stability of semiconductor testing equipment, reduces poor contact and excessive squeezing between probes and wafers, and ensures the accuracy of test results and the reliability of the equipment.
Smart Images
Figure CN120908640A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor device production, and in particular to a device measurement method and device. BACKGROUND
[0002] In the related art, a wafer needs to be tested using a semiconductor test device. During the testing process, the wafer is placed on a wafer stage of the semiconductor test device, and the wafer stage drives the wafer to contact probes installed on a panel by moving itself, so that the probes perform energization testing on the dies of the wafer.
[0003] In order to further improve the testing efficiency, the testing process of the semiconductor test device is further accelerated, and the wafer stage is more likely to impact other structures of the device, thereby causing the device to vibrate more easily, and the probes and the wafer are more likely to be in a poor contact or a situation where the probes excessively press the wafer, thereby affecting the testing result or causing damage to the wafer and the probes, and the stability of the semiconductor test device is insufficient. The prior art lacks a method for evaluating the semiconductor test device, so that the stability of the existing semiconductor test device cannot be guaranteed. SUMMARY
[0004] The present application aims to at least solve one of the technical problems in the prior art. To this end, the present application provides a device measurement method, which can evaluate the stability of a semiconductor test device.
[0005] The present application also provides a device measurement device.
[0006] The device measurement method according to the first aspect of the present application is used to measure a semiconductor test device, the semiconductor test device comprising a machine table, a panel, a wafer stage and probes, the wafer stage and the panel being connected to the machine table, the wafer stage being used to load a wafer, the probes being connected to the panel and being arranged towards the wafer stage, the wafer stage being capable of moving towards and away from the probes along a first direction, and the device measurement method comprising the following steps: fixing the panel; applying vibration to the fixed panel; measuring the amplitude of the panel along the first direction when the panel is subjected to vibration.
[0007] The device measurement method according to the present application has at least the following beneficial effects: By measuring the amplitude of the panel along the first direction when the panel is subjected to vibration, the deformation of the panel along the first direction when the panel is subjected to the same vibration during operation can be obtained, and the contact between the panel and the probes can be known by the operator according to the deformation of the panel along the first direction, so that a panel with higher stability can be selected.
[0008] According to some embodiments of the present application, after the panel is fixed, a non-contact displacement sensor is arranged along the first direction towards the panel; when measuring the amplitude of the panel along the first direction when the panel is vibrated, the non-contact displacement sensor is activated to measure the displacement d of the panel along the first direction, the first maximum displacement d1 and the first minimum displacement d2 measured by the non-contact displacement sensor are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel along the first direction.
[0009] According to some embodiments of the present application, before the panel that has been fixed is vibrated, the displacement d of the panel along the first direction within a preset time is measured by the non-contact displacement sensor, the second maximum displacement d3 and the second minimum displacement d4 measured by the non-contact displacement sensor are recorded; When measuring the amplitude of the panel along the first direction when the panel is vibrated, the non-contact displacement sensor is activated to measure the displacement of the panel along the first direction, and after the displacement d measured by the non-contact displacement sensor remains between d3 and d4 for a period of time, the non-contact displacement sensor is moved by a preset distance along a second direction, then the same vibration is applied to the panel that has been fixed again, and the measurement of the amplitude of the panel along the first direction when the panel is vibrated is repeated; the second direction is perpendicular to the first direction.
[0010] According to some embodiments of the present application, a plurality of non-contact displacement sensors are arranged along a second direction and towards the panel along the first direction, when measuring the amplitude of the panel along the first direction when the panel is vibrated, the plurality of non-contact displacement sensors are activated to measure the displacement of the panel along the first direction simultaneously, the first maximum displacement d1 and the first minimum displacement d2 of each non-contact displacement sensor are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel along the first direction; the second direction is perpendicular to the first direction.
[0011] According to some embodiments of the present application, before the panel that has been fixed is vibrated, the displacement d of the panel along the first direction within a preset time is measured by the non-contact displacement sensor, the second maximum displacement d3 and the second minimum displacement d4 measured by the non-contact displacement sensor are recorded; After the displacement d measured by the plurality of non-contact displacement sensors remains between d3 and d4 for a period of time, the plurality of non-contact displacement sensors are moved by a preset distance along a third direction, then the same vibration is applied to the panel that has been fixed again, and the plurality of non-contact displacement sensors are activated to measure the amplitude of the panel along the first direction again; the first direction, the second direction and the third direction are perpendicular to each other.
[0012] According to some embodiments of the present application, the device measurement method further comprises measuring the vibration frequency of the panel along the first direction when the panel is subjected to vibration.
[0013] According to some embodiments of the present application, after the panel is fixed, a non-contact displacement sensor is arranged along the first direction towards the panel; before the fixed panel is subjected to vibration, the non-contact displacement sensor is used to acquire the displacement of the panel along the first direction at preset times and obtain the average value e of the displacement of the panel along the first direction. When measuring the vibration frequency of the panel along the first direction when the panel is subjected to vibration, the time zero point is taken as the time when the fixed panel is subjected to vibration, and the non-contact displacement sensor is used to record the displacement h of the panel along the first direction at preset frequencies from the time zero point, and the displacement h at time t is used to fit a relationship curve h(t), h(t) = e, to inversely obtain the intersection time when the displacement of the panel along the first direction is e, and the first intersection time t1 and the second intersection time t2 are defined as the adjacent two intersection times, and the vibration frequency f of the panel along the first direction is set as f = 1 / (2*|t2-t1|).
[0014] According to some embodiments of the present application, when the panel is fixed, the panel, the machine table, the wafer table and the probe are assembled into the semiconductor test device; when the fixed panel is subjected to vibration, the wafer table is reciprocally moved along the first direction for a period of time, and the measurement of the amplitude of the panel along the first direction when the panel is subjected to vibration is started synchronously.
[0015] The device measurement apparatus according to the second aspect of the present application is used for measuring a semiconductor test device, the semiconductor test device comprising a machine table, a panel, a wafer table and a probe, the wafer table and the panel are both connected to the machine table, the wafer table is used for loading a wafer, the probe is connected to the panel and arranged towards the wafer table, the wafer table can move towards and away from the probe along a first direction, and the device measurement apparatus comprises: a rack having a containing space for containing the semiconductor test device; a detection assembly connected to the rack and arranged towards the containing space, and used for measuring the amplitude of the panel along the first direction.
[0016] The device measurement apparatus according to the embodiments of the present application has at least the following beneficial effects: The worker can place the panel of the semiconductor testing device into the accommodating space, and then the detection assembly facing the accommodating space measures the panel of the semiconductor testing device. The detection assembly of the device measuring apparatus of the present application measures the amplitude of the panel in the first direction when the panel is vibrated, and the deformation of the panel in the first direction when the panel is subjected to the same vibration during work can be obtained. The worker can know the contact between the panel and the probe according to the deformation of the panel in the first direction, so that the panel with higher stability can be screened out.
[0017] According to some embodiments of the present application, the detection assembly comprises a non-contact displacement sensor, which is arranged towards the accommodating space and can measure the displacement of an object in a fourth direction; the non-contact displacement sensor is connected to the rack and can move in a fifth direction and a sixth direction, and the fourth direction, the fifth direction and the sixth direction are perpendicular to each other; Alternatively, the detection assembly comprises a plurality of non-contact displacement sensors, the rack comprises a rack body and a moving piece, the moving piece is connected to the rack body and cooperates with the rack body to define the accommodating space, the moving piece can move in a sixth direction relative to the rack body, the plurality of non-contact displacement sensors are connected to the moving piece and arranged in a fifth direction, and are arranged towards the accommodating space, and each of the non-contact displacement sensors can measure the displacement of an object in a fourth direction; the fourth direction, the fifth direction and the sixth direction are perpendicular to each other.
[0018] According to some embodiments of the present application, a vibration exciter is further included, which is connected to the rack and arranged towards the accommodating space, and is used to provide vibration for the panel.
[0019] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be understood through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0020] The present application will be further described below in conjunction with the drawings and embodiments, in which: Figure 1 The step schematic diagram of the device measuring method of some embodiments of the first aspect of the present application is shown in the following figure; Figure 2 The step schematic diagram of the device measuring method of some embodiments of the second aspect of the present application is shown in the following figure; Figure 3 The step schematic diagram of the device measuring method of some embodiments of the third aspect of the present application is shown in the following figure; Figure 4 The step schematic diagram of the device measuring method of some embodiments of the fourth aspect of the present application is shown in the following figure; Figure 5Fig. 1 is a schematic diagram of a semiconductor test apparatus in the prior art; Figure 6 Fig. 2 is a schematic diagram of a semiconductor test apparatus in the prior art; Figure 5 Fig. 3 is a partial enlarged view of A in Fig. 2; Figure 7 Fig. 4 is a schematic diagram of a semiconductor test apparatus in the prior art; Figure 5 Fig. 5 is a schematic diagram of a semiconductor test apparatus in the prior art from another perspective; Figure 8 Fig. 6 is a partial enlarged view of B in Fig. 5; Figure 7 Fig. 7 is a schematic diagram of a device measurement apparatus in the prior art; Figure 9 Fig. 8 is a schematic diagram of a device measurement apparatus in the prior art; Figure 10 Fig. 9 is a schematic diagram of a device measurement apparatus in the prior art; Figure 9 Fig. 10 is a schematic diagram of a device measurement apparatus in the prior art; Figure 11 Fig. 11 is a schematic diagram of a device measurement apparatus in the prior art; Figure 12 Figure 11 Fig. 12 is a schematic diagram of a device measurement apparatus in the prior art.
[0021] Reference signs: Fig. 1 is a schematic diagram of a semiconductor test apparatus in the prior art; Fig. 2 is a schematic diagram of a semiconductor test apparatus in the prior art; Fig. 7 is a schematic diagram of a device measurement apparatus in the prior art; Fig. 8 is a schematic diagram of a device measurement apparatus in the prior art; Fig. 9 is a schematic diagram of a device measurement apparatus in the prior art; Fig. 10 is a schematic diagram of a device measurement apparatus in the prior art;
[0022] The embodiments of the present application are described below in detail with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and are not intended to limit the present application.
[0023] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation on the present application.
[0024] In the description of the present application, if several meanings are one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, within, etc. are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.
[0025] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.
[0026] In the description of the present application, the description of the reference terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0027] Please refer to Figure 1 The present application proposes a device measurement method, and the device measurement method is used for measuring a semiconductor test device 10.
[0028] Please refer to Figures 5 to 8 , Figures 5 to 8 A structure of a semiconductor test device 10 in the prior art is shown, which includes a machine table 11, a panel 12, a wafer table 13 and a probe 15. The main function of the machine table 11 is to fix other structures of the semiconductor test device 10 and provide rigid support. The wafer table 13 and the panel 12 are both connected to the machine table 11, and the wafer table 13 is used for loading a wafer 16. The probe 15 is connected to the panel 12 and is arranged towards the wafer table 13. The wafer table 13 can move towards and away from the probe 15 along a first direction (i.e. Z+ and Z- directions in Figure 5 , Figure 7 When the wafer table 13 is loaded with the wafer 16, the wafer table 13 moving towards the probe 15 along the first direction can drive the wafer 16 to contact the probe 15, and the probe 15 can perform electrical test on the dies of the wafer 16 to check the quality of the wafer 16. After one probe 15 completes the test on one die of the wafer 16, the semiconductor test device 10 controls the wafer table 13 to move away from the probe 15 along the first direction, and then controls the wafer table 13 to move perpendicular to the first direction and then moves the wafer table 13 towards the probe 15 along the first direction, so that the probe 15 continues to test different dies on the wafer 16.
[0029] The inventor found in practice that, in order to improve the test efficiency of the semiconductor test equipment 10, it is necessary to speed up the process of the wafer table 13 approaching and moving away from the probe 15 along the first direction, and to compress the stop time of the wafer table 13 after approaching the probe 15, and to advance the time when the probe 15 starts testing the wafer 16. This results in that the high-speed movement of the wafer table 13 in the test process increases the vibration of the machine table 11, and further causes the vibration of the panel 12 and the probe 15 connected to the panel 12, and the test process is more likely to cause the needle tip to extrude the core grain to cause the core grain to generate a large needle mark to affect the quality of the wafer 16, and is more likely to cause the needle tip to separate from the core grain to cause the electric shock to affect the accuracy of the measurement result, and the stability of the semiconductor test equipment 10 is reduced.
[0030] Therefore, referring to FIG. 1, Figure 1 The device measurement method of the present application includes the following steps in some embodiments: S101. Fix the panel 12; S102. Apply vibration to the fixed panel 12; S103. Measure the amplitude of the panel 12 along the first direction when the panel 12 is vibrated.
[0031] Since the probe 15 is indirectly connected to the machine table 11 through the panel 12, after the wafer table 13 indirectly causes the panel 12 to vibrate through the machine table 11, the part of the panel 12 close to the probe 15 will produce a larger amplitude of vibration than the part close to the machine table 11, and the amplitude of vibration along the first direction will also be larger, and further will cause the probe 15 connected to the panel 12 to vibrate along the first direction to be further increased. By measuring the amplitude of the panel 12 along the first direction when the panel 12 is vibrated, the deformation of the panel 12 along the first direction when the panel 12 is vibrated in the working process can be obtained, and the worker can know the contact between the panel 12 and the probe 15 according to the deformation of the panel 12 along the first direction, so as to select the panel 12 with higher stability. Specifically, when the worker implements the device measurement method of the present application, the deformation of the panel 12 along the first direction can be used to judge the deformation of the panel 12 when the panel 12 is impacted by the wafer table 13 in the actual working process, and further to judge the possibility of excessive extrusion between the probe 15 and the wafer 16 of the wafer table 13 and the possibility of separation between the probe 15 and the wafer 16 in the test process, which is beneficial to selecting the panel 12 with better performance from the batch of panels 12, and provides guidance for the optimization of the structure of the panel 12.
[0032] In the device measurement method of the present application, the panel 12 is fixed, and vibration is applied to the fixed panel 12, which can ensure the stability of the measurement process and facilitate the worker to evaluate the panel 12.
[0033] The order of applying the vibration and measuring the amplitude can also be adjusted by those skilled in the art without departing from the inventive concept of the present application. For example, in some embodiments, the device measurement method starts measuring the panel 12 before applying the vibration to the fixed panel 12, and then measures the amplitude of the panel 12 along the first direction when the panel 12 is vibrated. In other embodiments, the device measurement method starts measuring the amplitude of the panel 12 along the first direction when the panel 12 is vibrated at the same time when the vibration is applied to the fixed panel 12.
[0034] It should be noted that the present application does not limit the specific connection between the probes 15 and the panel 12 in the semiconductor testing device 10. For example, in some embodiments, the probes 15 are directly fixed to the panel 12. In other embodiments, the semiconductor testing device 10 includes a needle card 14 with a plurality of probes 15, and the needle card 14 is installed on the panel 12 when the semiconductor testing device 10 is in operation, and the plurality of probes 15 are used to test different dies on the wafer 16.
[0035] On the other hand, the present application does not limit the method of applying the vibration. In some embodiments, the vibration is applied by hammering the panel 12 when the vibration is applied to the fixed panel 12. In other embodiments, a vibration exciter is arranged on the panel 12 when the vibration is applied to the fixed panel 12, and the vibration exciter is turned on to apply a preset vibration to the panel 12.
[0036] As a preferred solution, in some embodiments, the panel 12, the machine table 11, the wafer table 13 and the probes 15 are assembled into the semiconductor testing device 10 when the panel 12 is fixed, and the wafer table 13 is moved back and forth along the first direction for a period of time when the vibration is applied to the fixed panel 12, and the measurement of the amplitude of the panel 12 along the first direction when the panel 12 is vibrated is started at the same time. Through the above solution, the back and forth movement of the wafer table 13 along the first direction can cause the vibration of the machine table 11, and thus the vibration of the panel 12. The vibration of the wafer table 13 along the first direction by the back and forth movement of the wafer table 13 is conducive to further simulating the vibration of the panel 12 in the actual working process, and is conducive to the more accurate evaluation of the working condition of the panel 12 in the actual working process by the workers.
[0037] The present application does not limit the method of measuring the amplitude of the panel 12 without departing from the inventive concept of the present application. In some embodiments, a strain gauge is arranged on the panel 12 during the measurement of the amplitude of the panel 12 along the first direction when the panel 12 is vibrated, and the amplitude of the panel 12 along the first direction is confirmed by the electrical signal generated by the strain gauge following the deformation of the panel 12.
[0038] As a preferred solution, please refer to Figure 2As shown in some embodiments, after fixing the panel 12, the non-contact displacement sensor 210 is arranged along the first direction towards the panel 12; when measuring the amplitude of the panel 12 along the first direction when the panel 12 is subjected to vibration, the non-contact displacement sensor 210 is started to measure the displacement d of the panel 12 along the first direction, the first maximum displacement d1 and the first minimum displacement d2 measured by the non-contact displacement sensor 210 are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel 12 along the first direction. By measuring the displacement of the panel 12 by the non-contact displacement sensor 210, the measurement accuracy can be improved, and the influence on the measurement result of the panel 12 during the measurement can be reduced, and the accuracy of the measurement can be improved.
[0039] Further, please refer to Figure 2 As shown in some embodiments, before the vibration is applied to the fixed panel 12, the displacement d of the panel 12 along the first direction within a preset time is measured by the non-contact displacement sensor 210, and the second maximum displacement d3 and the second minimum displacement d4 measured by the non-contact displacement sensor 210 are recorded. The above steps can record the jitter of the non-contact displacement sensor 210 during the measurement when the panel 12 is fixed, so that the worker can judge the vibration condition of the panel 12 during the subsequent measurement.
[0040] On the basis of the above scheme, please refer to Figure 2 , Figure 5 When measuring the amplitude of the panel 12 along the first direction when the panel 12 is subjected to vibration, the non-contact displacement sensor 210 is started to measure the displacement of the panel 12 along the first direction, and after the displacement d measured by the non-contact displacement sensor 210 remains between d3 and d4 for a period of time, the non-contact displacement sensor 210 is moved along the second direction (i.e. the direction perpendicular to the Z axis in Figure 5 After that, the same vibration is applied to the fixed panel 12 again, and the amplitude of the panel 12 along the first direction when the panel 12 is subjected to vibration is repeatedly measured, and the second direction is perpendicular to the first direction.
[0041] The above steps can realize the measurement of the amplitudes of different parts of the panel 12 by the single non-contact displacement sensor 210, and facilitate the staff to evaluate the deformation of different parts of the panel 12 in the second direction. Moreover, the non-contact displacement sensor 210 can be moved by a preset distance in the second direction after the measured displacement d of the non-contact displacement sensor 210 is kept between d3 and d4 for a period of time, so as to ensure that the non-contact displacement sensor 210 can continue to measure other parts of the panel 12 after the panel 12 returns to the static state, so that the non-contact displacement sensor 210 can completely record the deformation of a part of the panel 12 after the part is subjected to the externally applied vibration, and facilitate the staff to analyze the deformation of the panel 12.
[0042] It should be noted that the non-contact displacement sensor 210 of the present application can be an optical displacement sensor, such as a spectral confocal displacement sensor, a laser triangulation displacement sensor, etc. The non-contact displacement sensor 210 of the present application can also be an electrical displacement sensor, such as a capacitive displacement sensor, etc.
[0043] In order to facilitate those skilled in the art to understand the specific effect of measuring the amplitudes of different parts of the panel 12, please refer to Figure 5 As shown in the above embodiment, after the amplitudes of different parts of the panel 12 are measured by the method in the above embodiment, the staff can not only understand the deformation of the measured part of the panel 12, but also understand the overall deformation of the panel 12 through the deformations of multiple measured parts of the panel 12, and understand the deformation of the part of the panel 12 in the second direction which is not measured by interpolating the amplitudes of multiple deformed parts in the second direction. Based on the above inventive concept, those skilled in the art can further measure multiple parts of the panel 12 in the second direction by the non-contact displacement sensor 210 on the basis of the above scheme, so as to more accurately understand the overall deformation of the panel 12.
[0044] Those skilled in the art can also measure multiple parts of the panel 12 in the second direction by multiple non-contact displacement sensors 210 without departing from the inventive concept of the present application. Please refer to Figure 3As shown, in some embodiments, multiple non-contact displacement sensors 210 are arranged at intervals along a second direction and positioned facing the panel 12 along a first direction. When measuring the amplitude of the panel 12 along the first direction due to vibration, the multiple non-contact displacement sensors 210 are simultaneously activated to measure the displacement of the panel 12 along the first direction. The first maximum displacement d1 and the first minimum displacement d2 of each non-contact displacement sensor 210 are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel 12 along the first direction. The second direction is perpendicular to the first direction. The above steps can simultaneously measure different parts of the panel 12 distributed in the second direction using multiple non-contact displacement sensors 210, greatly improving measurement efficiency.
[0045] Further, please refer to Figure 3 , Figure 5 As shown, in some embodiments, before applying vibration to the fixed panel 12, a non-contact displacement sensor 210 is used to measure the displacement d of the panel 12 along a first direction within a preset time, and the second maximum displacement d3 and the second minimum displacement d4 of the non-contact displacement sensor 210 are recorded. The above steps can record the vibration of the non-contact displacement sensor 210 during measurement when the panel 12 is fixed, making it easier for operators to judge the vibration of the panel 12 during subsequent measurements.
[0046] Based on the above scheme, after the displacement d measured by the multiple non-contact displacement sensors 210 is kept between d3 and d4 for a period of time, the multiple non-contact displacement sensors 210 are moved a preset distance along the third direction, and the same vibration is applied to the fixed panel 12 again. Then, the multiple non-contact displacement sensors 210 are made to repeatedly measure the amplitude of the panel 12 along the first direction when it is vibrated. The first direction, the second direction and the third direction are perpendicular to each other (that is, when the first direction is the Z-axis direction, the second direction is the Y-axis direction and the third direction is the X-axis direction).
[0047] The above steps can realize the measurement of the amplitudes of different parts of the panel 12 by the plurality of non-contact displacement sensors 210, and facilitate the staff to evaluate the overall deformation of the panel 12. In addition, the non-contact displacement sensors 210 can be moved by a preset distance along the third direction after the displacement d measured by the non-contact displacement sensors 210 remains between d3 and d4 for a period of time, so as to ensure that the non-contact displacement sensors 210 continue to measure other parts of the panel 12 after the panel 12 returns to the static state, so that the non-contact displacement sensors 210 can completely record the deformation of a part of the panel 12 after the part is subjected to the externally applied vibration, and facilitate the staff to analyze the deformation of the panel 12.
[0048] In order to facilitate those skilled in the art to understand the specific effect of measuring the amplitudes of different parts of the panel 12, please refer to Figure 5 As shown in the above embodiment, after the amplitudes of different parts of the panel 12 are measured by the method, the staff can not only understand the deformation of the measured part of the panel 12, but also understand the overall deformation of the panel 12 through the deformations of a plurality of measured parts of the panel 12, and understand the deformation of the unmeasured part of the panel 12 by interpolating the amplitudes of a plurality of deformed parts in the second direction and interpolating the amplitudes of a plurality of deformed parts in the third direction. Based on the above inventive concept, those skilled in the art can further measure a plurality of parts of the panel 12 in the second direction by using the non-contact displacement sensors 210 on the basis of the above scheme, so as to more accurately understand the overall deformation of the panel 12.
[0049] Further, in some embodiments, the device measurement method further includes measuring the vibration frequency of the panel 12 in the first direction when the panel 12 is subjected to the vibration. Through the above steps, the staff can compare the measured vibration frequency of the panel 12 in the first direction with the vibration frequency of the semiconductor test device 10 during the operation, and further adjust the panel 12 to avoid the resonance of the panel 12 caused by the vibration of the semiconductor test device 10, which is beneficial to reduce the vibration amplitude of the panel 12 in the first direction and improve the stability of the operation of the semiconductor test device 10.
[0050] The present application does not limit the specific way of measuring the vibration frequency of the panel 12 in the first direction when the panel 12 is subjected to the vibration. In some embodiments, the staff can use the existing inherent frequency testing instrument to obtain the vibration frequency of the panel 12 in the first direction.
[0051] As a preferred scheme, please refer to Figure 4As shown, after fixing the panel 12, the non-contact displacement sensor 210 is arranged along the first direction towards the panel 12; before applying vibration to the fixed panel 12, the non-contact displacement sensor 210 is used to acquire the displacement of the panel 12 along the first direction in a preset time period multiple times and obtain the average value e of the displacement of the panel 12 along the first direction. Since the panel 12 remains static in the preset time period, the non-contact displacement sensor 210 is used to acquire the displacement of the panel 12 along the first direction in the preset time period multiple times and obtain the average value e of the displacement, which can reduce the jitter of the non-contact displacement sensor 210 in measurement. When the staff measures the vibration frequency of the panel 12 along the first direction, the value of the average value e is used as the reference in the deformation direction of the panel 12, and the deformation direction of the panel 12 is more accurately determined. For example, please refer to Figure 5 As shown, wherein Figure 5 As shown, the panel 12 is fixed to the semiconductor test equipment 10, the non-contact displacement sensor 210 measures the displacement of the panel 12 along the first direction in the Z-direction towards the panel 12, and the average value of the displacement of the panel 12 along the first direction measured by the non-contact displacement sensor 210 multiple times when no vibration is applied is e. When the non-contact displacement sensor 210 measures the displacement of the panel 12 when the panel 12 is subjected to vibration, if the displacement of the panel 12 measured by the non-contact displacement sensor 210 is less than e, it represents that the part of the panel 12 subjected to measurement is closer to the non-contact displacement sensor 210 along the first direction, and if the displacement of the panel 12 measured by the non-contact displacement sensor 210 is greater than e, it represents that the part of the panel 12 subjected to measurement is farther away from the non-contact displacement sensor 210 along the first direction. When the displacement of the panel 12 measured by the non-contact displacement sensor 210 is exactly equal to e, it represents that the part of the panel 12 subjected to measurement is exactly moved to the original position along the first direction.
[0052] Based on the above scheme, please refer to Figure 4 As shown, when measuring the vibration frequency of the panel 12 along the first direction when subjected to vibration, the time zero point is taken as the time when the vibration is applied to the fixed panel 12, and the non-contact displacement sensor 210 is used to record the displacement h of the panel 12 along the first direction multiple times at a preset frequency from the time zero point and the time t of each recording, and a relationship curve h(t) is fitted according to the displacement h at different times t, and the multiple intersection times when the displacement of the panel 12 along the first direction is e are inversely solved, and the adjacent two intersection times are defined as the first intersection time t1 and the second intersection time t2, and the vibration frequency of the panel 12 along the first direction is f, f=1 / (2*|t2-t1|). The above steps can obtain the vibration frequency of the panel 12 along the first direction by the data measured by the non-contact displacement sensor 210, which has lower detection cost.
[0053] It should be understood that the skilled in the art can fit the relationship curve by using the existing fitting method when fitting the relationship curve according to the displacement h at different time t.
[0054] Please refer to Figures 9 to 12 As shown in the figure, the device measuring apparatus 20 of the present application is used for measuring the semiconductor testing device 10, the semiconductor testing device 10 comprises a machine table 11, a panel 12, a wafer table 13 and a probe 15, the wafer table 13 and the panel 12 are both connected to the machine table 11, the wafer table 13 is used for loading a wafer 16; the probe 15 is connected to the panel 12 and is arranged towards the wafer table 13; the wafer table 13 can move towards and away from the probe 15 along a first direction.
[0055] Please refer to Figure 9 、 Figure 11 As shown in the figure, the device measuring apparatus 20 of the present application comprises a rack 100 and a detection assembly 200. The rack 100 has a containing space 110 for containing the semiconductor testing device 10. The detection assembly 200 is connected to the rack 100 and is arranged towards the containing space 110, and is used for measuring the amplitude of the panel 12 along the first direction.
[0056] Through the above scheme, the staff can place the panel 12 of the semiconductor testing device 10 into the containing space 110, so that the detection assembly 200 arranged towards the containing space 110 measures the panel 12 of the semiconductor testing device 10. By measuring the amplitude of the panel 12 along the first direction when the panel 12 is vibrated by the detection assembly 200 of the device measuring apparatus 20 of the present application, the deformation of the panel 12 along the first direction when the panel 12 is vibrated in the working process can be obtained, and the staff can know the contact condition between the panel 12 and the probe 15 according to the deformation of the panel 12 along the first direction, so as to select the panel 12 with higher stability. Specifically, when the staff uses the device measuring apparatus 20 of the present application, the staff can determine the deformation of the panel 12 when the panel 12 is impacted by the wafer table 13 in the actual working process according to the deformation of the panel 12 along the first direction, and then determine the possibility of excessive extrusion between the probe 15 and the wafer 16 of the wafer table 13 and the possibility of disengagement between the probe 15 and the wafer 16 in the testing process, which is beneficial to selecting the panel 12 with better performance from the panels 12 produced in batches, and provides guidance for the optimization of the structure of the panel 12.
[0057] The skilled in the art can select the way of measuring the amplitude of the panel 12 along the first direction by the detection assembly 200 without departing from the inventive concept of the present application.
[0058] Please refer to Figures 9 to 12As shown, in some embodiments, the detection component 200 includes a non-contact displacement sensor 210, which is disposed facing the accommodating space 110 and is capable of measuring the displacement of an object along a fourth direction. With the above solution, when the panel 12 of the semiconductor testing equipment 10 is placed into the accommodating space 110, the non-contact displacement sensor 210 can detect the displacement of the panel 12 in the fourth direction. Furthermore, when the operator uses the equipment measuring device 20 for measurement, the first direction of the panel 12 can be aligned with the fourth direction of the equipment measuring device 20, so that the displacement of the panel 12 when subjected to external vibration can be measured by the non-contact displacement sensor 210.
[0059] The device measuring apparatus 20 of the present invention can also test the panel 12 on the semiconductor testing equipment 10. For example, please refer to... Figure 10 , Figure 12 As shown, in some embodiments, the semiconductor testing equipment 10 is placed within the accommodating space 110, with the first direction and the fourth direction being the same (i.e., both the first direction and the fourth direction are...). Figure 10 , Figure 12 In the Z-axis direction, the panel 12 of the semiconductor testing equipment 10 is located on one side in the first direction. The non-contact displacement sensor 210 is a laser displacement sensor, which is set in the fourth direction close to the panel 12.
[0060] As a preferred option, please refer to Figure 11 , Figure 12 As shown, in some embodiments, the detection component 200 includes a non-contact displacement sensor 210, which is positioned towards the accommodating space 110 and capable of measuring the displacement of an object along a fourth direction. The non-contact displacement sensor 210 is connected to the frame 100 and is movable along a fifth and sixth direction, with the fourth, fifth, and sixth directions being perpendicular to each other. By moving along the fifth and sixth directions, the non-contact displacement sensor 210 can detect the displacement of different portions of the object along the fourth direction in the fifth and sixth directions. When the panel 12 is placed in the accommodating space 110, and the first and fourth directions are the same, the non-contact displacement sensor 210 can also measure different portions of the panel 12 distributed in the second and third directions by moving along the fifth and sixth directions. By measuring the vibration of different portions of the panel 12 in the first direction using the device measuring device 20 of the above embodiment, the operator can assess the overall deformation of the panel 12, thereby obtaining more accurate assessment results. This is beneficial for selecting panels 12 with better stability and provides guidance for optimizing the structure of the panel 12.
[0061] As another preferred option, please refer to Figure 9 , Figure 10As shown, where Figure 9 , Figure 10 Only one non-contact displacement sensor 210 is shown. In some embodiments, the detection assembly 200 includes multiple non-contact displacement sensors 210. The frame 100 includes a frame 120 and a moving member 130. The moving member 130 is connected to the frame 120 and together with the frame 120 defines an accommodating space 110. The moving member 130 can move relative to the frame 120 along a sixth direction. Multiple non-contact displacement sensors 210 are all connected to the moving member 130 and arranged along a fifth direction, facing the accommodating space 110. Each non-contact displacement sensor 210 can measure the displacement of an object along a fourth direction. The fourth, fifth, and sixth directions are perpendicular to each other. With the above scheme, multiple non-contact displacement sensors 210 arranged along the fifth direction can simultaneously measure the displacement of multiple parts of an object in the fifth direction in the fourth direction. Furthermore, through the movement of the moving member 130 along the sixth direction, the non-contact displacement sensors 210 can also measure the displacement of multiple parts in the sixth direction in the fourth direction. When panel 12 is placed in accommodating space 110 and the first and fourth directions are the same, multiple non-contact displacement sensors 210 can evaluate the overall deformation of panel 12 by moving in the sixth direction, thereby obtaining more accurate evaluation results, which is beneficial for screening out panels 12 with better stability, and at the same time provides guidance for optimizing the structure of panel 12.
[0062] Furthermore, in some embodiments, the device measuring apparatus 20 further includes a vibrator connected to the frame 100 and disposed towards the accommodating space 110, for providing vibration to the panel 12. The vibrator can stably provide vibrations of the same position and magnitude, which is beneficial for the detection component 200 to obtain more consistent vibrations when repeatedly measuring the amplitude of the panel 12 in the first direction, facilitating subsequent analysis of the deformation of the panel 12 and obtaining more reliable results. The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, in the absence of conflict, the embodiments of the present invention and the features thereof can be combined with each other.
Claims
1. A measurement method for measuring a semiconductor testing device, the semiconductor testing device comprising a stage, a panel, a wafer stage, and probes, wherein the wafer stage and the panel are both connected to the stage, the wafer stage is used to mount a wafer; the probes are connected to the panel and are disposed facing the wafer stage; the wafer stage is capable of approaching and moving away from the probes along a first direction, characterized in that... The device measurement method comprises the following steps: fixing the panel; applying vibration to the fixed panel; measuring the amplitude of the panel along the first direction when the panel is vibrated.
2. The apparatus measurement method of claim 1, wherein, After the panel is fixed, a non-contact displacement sensor is arranged along the first direction towards the panel; when measuring the amplitude of the panel along the first direction when the panel is vibrated, the non-contact displacement sensor is started to measure the displacement d of the panel along the first direction, the first maximum displacement d1 and the first minimum displacement d2 measured by the non-contact displacement sensor are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel along the first direction.
3. The apparatus measurement method of claim 2, wherein, Before applying vibration to the fixed panel, the displacement d of the panel along the first direction within a preset time is measured by the non-contact displacement sensor, and the second maximum displacement d3 and the second minimum displacement d4 measured by the non-contact displacement sensor are recorded; When measuring the amplitude of the panel along the first direction when the panel is vibrated, the non-contact displacement sensor is started to measure the displacement of the panel along the first direction, and after the displacement d measured by the non-contact displacement sensor remains between d3 and d4 for a period of time, the non-contact displacement sensor is moved along a second direction by a preset distance, then the same vibration is applied to the fixed panel again, and the amplitude of the panel along the first direction when the panel is vibrated is repeatedly measured, the second direction being perpendicular to the first direction.
4. The apparatus measurement method of claim 2, wherein, A plurality of non-contact displacement sensors are arranged at intervals along a second direction and arranged along the first direction towards the panel, and when measuring the amplitude of the panel along the first direction when the panel is vibrated, the plurality of non-contact displacement sensors are started to measure the displacement of the panel along the first direction simultaneously, the first maximum displacement d1 and the first minimum displacement d2 of each non-contact displacement sensor are recorded, and the difference between d1 and d2 is recorded as the amplitude of the panel along the first direction; the second direction being perpendicular to the first direction.
5. The apparatus measurement method of claim 4, wherein, Before applying vibration to the fixed panel, the displacement d of the panel along the first direction within a preset time is measured by the non-contact displacement sensor, and the second maximum displacement d3 and the second minimum displacement d4 measured by the non-contact displacement sensor are recorded; After the displacement d measured by the plurality of non-contact displacement sensors remains between d3 and d4 for a period of time, the plurality of non-contact displacement sensors are moved along a third direction by a preset distance, then the same vibration is applied to the fixed panel again, and the plurality of non-contact displacement sensors repeatedly measure the amplitude of the panel along the first direction when the panel is vibrated; the first direction, the second direction and the third direction are perpendicular to each other.
6. The apparatus measurement method of claim 1, wherein, The device measurement method further comprises measuring the vibration frequency of the panel along the first direction when the panel is vibrated.
7. The apparatus measurement method of claim 6, wherein, After fixing the panel, a non-contact displacement sensor is arranged towards the panel along the first direction; before applying vibration to the fixed panel, the non-contact displacement sensor is used to acquire the displacement of the panel along the first direction at preset time points and obtain the average displacement e of the panel along the first direction; When measuring the vibration frequency of the panel along the first direction, the time zero point is set as the time when the vibration is applied to the fixed panel, the non-contact displacement sensor is used to record the displacement h of the panel along the first direction at preset frequencies and time points t, a relationship curve h(t) is fitted according to the displacement h at different time points t, the multiple intersection time points when the displacement of the panel along the first direction is e are obtained by inversely calculating h(t)=e, the first intersection time t1 and the second intersection time t2 are defined by taking the adjacent two intersection time points, and the vibration frequency f of the panel along the first direction is set as f=1 / (2*|t2-t1|).
8. The apparatus measurement method of claim 1, wherein, When fixing the panel, the panel, the machine table, the carrier table and the probe are assembled into the semiconductor testing device; when applying vibration to the fixed panel, the carrier table is reciprocally moved along the first direction for a period of time, and the amplitude of the panel along the first direction is measured synchronously.
9. An apparatus measurement device for measuring a semiconductor test apparatus, the semiconductor test apparatus comprising a machine table, a faceplate, a wafer table and a probe, the wafer table and the faceplate are connected to the machine table, the wafer table is used for loading a wafer, the probe is connected to the faceplate and is disposed towards the wafer table, the wafer table is capable of moving towards and away from the probe along a first direction, characterized in that, The device measuring apparatus comprises: a rack having a receiving space for accommodating the semiconductor testing device; a detection assembly connected to the rack and arranged towards the receiving space, for measuring the amplitude of the panel along the first direction.
10. The apparatus measurement device of claim 9, wherein, The detection assembly comprises a non-contact displacement sensor arranged towards the receiving space and capable of measuring the displacement of an object along a fourth direction; the non-contact displacement sensor is connected to the rack and capable of moving along a fifth direction and a sixth direction, and the fourth direction, the fifth direction and the sixth direction are perpendicular to each other; Alternatively, the detection assembly comprises a plurality of non-contact displacement sensors, the rack comprises a frame body and a moving member, the moving member is connected to the frame body and cooperates with the frame body to define the receiving space, the moving member is capable of moving along a sixth direction relative to the frame body, the plurality of non-contact displacement sensors are connected to the moving member and arranged along a fifth direction, and are arranged towards the receiving space, and each of the non-contact displacement sensors is capable of measuring the displacement of an object along a fourth direction; the fourth direction, the fifth direction and the sixth direction are perpendicular to each other.
11. The apparatus measurement device of claim 9, wherein, Further comprising a vibration exciter connected to the rack and arranged towards the receiving space, for providing vibration to the panel.