Voltage regulation module with low thermal resistance and inductance assembly with low thermal resistance

Abstract

The invention discloses a voltage regulation module with low thermal resistance. The voltage regulation module comprises a top inductor and a bottom assembly, the top inductor comprises a magnetic core and a winding, and the winding comprises a first winding and a second winding; the bottom assembly comprises a bottom substrate and an IPM unit. Each of the first winding and the second winding comprises a first pin and a second pin; the first pin and the second pin are arranged on the bottom surface of the magnetic core and are electrically connected with the bottom substrate; the inductor, the IPM unit and the bottom substrate are stacked in sequence. On one hand, the inductor and the IPM unit are stacked, and heat generated by the IPM unit is transmitted to the top face of the inductor through a magnetic material of the inductor and a winding; on the other hand, the upward thermal resistance of the voltage regulation module is reduced by optimally designing the shape structure of the inductance winding and optimizing the thermal connection between the inductance winding and the IPM unit; therefore, the voltage regulation module which is good in heat dissipation performance, large in output current, high in conversion efficiency and high in power density is obtained.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of voltage regulation module, and relates to a voltage regulation module with low thermal resistance and an inductor assembly with low thermal resistance. BACKGROUND

[0002] In recent years, with the development of technologies in the fields of data centers, artificial intelligence, supercomputers, etc., more and more powerful ASICs are applied, such as processors used in CPUs, GPUs, and machine learning accelerators, network switches, servers, etc. These processors consume a large amount of current, for example, up to thousands of amperes, and their power demand fluctuates rapidly. On the other hand, with the advancement of technology, the supply voltage of the processor is getting lower and lower, such as below 1V. The bottleneck of the voltage regulation module VRM with low voltage and large current is the heat dissipation of the voltage regulation module, because the heat dissipation limits the increase of the output current of the voltage regulation module.

[0003] The present application mainly provides a voltage regulation module with low thermal resistance, which has good heat dissipation performance, large output current, and high efficiency, to solve the bottleneck of the current processor power supply. SUMMARY

[0004] Therefore, the present application aims to provide a voltage regulation module with low thermal resistance. On the one hand, the heat generated by the IPM unit is transferred to the top surface of the inductor through the magnetic material and the winding of the inductor by stacking the inductor and the IPM unit. On the other hand, the upward thermal resistance of the voltage regulation module is reduced by optimizing the shape structure of the inductor winding and optimizing the thermal connection between the inductor winding and the IPM unit. Thus, a voltage regulation module with low thermal resistance, good heat dissipation performance, large output current, high conversion efficiency, and high power density is obtained.

[0005] To achieve the above-mentioned purpose, the present application provides an inductor assembly with low thermal resistance, which comprises a magnetic core and a winding, the winding comprising a first winding and a second winding; the magnetic core comprising opposite upper and lower surfaces, opposite first and third side surfaces, and opposite second and fourth side surfaces, the first, second, third, and fourth side surfaces being arranged between the upper and lower surfaces;

[0006] The first winding and the second winding both comprise a top horizontal part, a first vertical part, a second vertical part, a first bottom horizontal part, a first pin and a second pin; the first pin and the second pin are both arranged on the bottom surface of the magnetic core; the upper surface of the top horizontal part is exposed on the upper surface of the magnetic core; the top end of the first vertical part and the top end of the second vertical part are respectively connected to the two ends of the top horizontal part; the bottom end of the first vertical part is connected to one end of the first bottom horizontal part; the lower surface of the first bottom horizontal part is exposed on the lower surface of the magnetic core; the first vertical part is arranged adjacent to the first pin; the second vertical part is arranged adjacent to the second pin.

[0007] Preferably, one side surface of the second vertical part is exposed on the side surface of the magnetic core.

[0008] Preferably, the first bottom horizontal part extends from the first vertical part to the side surface of the magnetic core away from the second vertical part.

[0009] Preferably, the inductance assembly further comprises a third vertical part, the top end of the third vertical part is connected to the other end of the first bottom horizontal part; the first pin is arranged on the bottom end of the third vertical part.

[0010] Preferably, the first pin is arranged on the lower surface of the first bottom horizontal part.

[0011] Preferably, the first bottom horizontal part extends from the first vertical part to the second vertical part.

[0012] Preferably, the second pin is arranged on the bottom end of the second vertical part.

[0013] Preferably, the inductance assembly further comprises a second bottom horizontal part; one end of the second bottom horizontal part is connected to the bottom end of the second vertical part; the second bottom horizontal part extends from the second vertical part to the direction away from the first vertical part; the second pin is arranged on the lower surface of the second bottom horizontal part.

[0014] Preferably, the inductance assembly further comprises a second bottom horizontal part and a fourth vertical part; one end of the second bottom horizontal part is connected to the bottom end of the second vertical part; the other end of the second bottom horizontal part is connected to the top end of the fourth vertical part; the second pin is arranged on the bottom end of the fourth vertical part.

[0015] Preferably, the second vertical part of the first winding is connected to the second vertical part of the second winding, or the top horizontal part of the first winding, the second vertical part of the first winding, the top horizontal part of the second winding and the second vertical part of the second winding are connected.

[0016] Preferably, the inductor assembly further comprises a heat dissipation component, which is "C" shaped and covers part of the top surface, part of the side surface and part of the bottom surface of the magnetic core; the heat dissipation component is made of metal material.

[0017] Preferably, the first winding comprises a first notch arranged at the bottom surface of the top horizontal portion of the first winding; the second winding comprises a second notch arranged at the top surface of the top horizontal portion of the second winding; the first winding and the second winding are arranged in cross by mechanical engagement of the first notch and the second notch.

[0018] Preferably, the first winding comprises a first notch arranged at the joint between the first bottom horizontal portion and the first vertical portion of the first winding; the second winding comprises a second notch arranged at the joint between the second bottom horizontal portion and the second vertical portion of the second winding; the first winding and the second winding are arranged in cross by mechanical engagement between the first notch and the second bottom horizontal portion of the second winding, and mechanical engagement between the second notch and the first bottom horizontal portion of the first winding.

[0019] Preferably, the first pins of the two windings are arranged adjacent to the same side surface of the magnetic core; the second pins of the two windings are arranged adjacent to the other side surface of the magnetic core.

[0020] Preferably, the bottom ends of the first pins and the second pins are flush with the bottom surface of the magnetic core; or the bottom ends of the first pins and the second pins protrude from the bottom surface of the magnetic core; or the bottom end of the first pin is flush with the bottom surface of the magnetic core, and the bottom end of the second pin protrudes from the bottom surface of the magnetic core.

[0021] Preferably, the inductor assembly further comprises a first auxiliary winding and a second auxiliary winding; the first auxiliary winding is arranged adjacent to the first winding; the second auxiliary winding is arranged adjacent to the second winding; the auxiliary windings each comprise a top horizontal portion, a first vertical portion and a second vertical portion; the top horizontal portion, the first vertical portion and the second vertical portion of the auxiliary windings are identical in shape to the top horizontal portion, the first vertical portion and the second vertical portion of the first winding / second winding.

[0022] Preferably, the inductor assembly is integrally formed by pressing the magnetic powder material and the windings.

[0023] Preferably, the magnetic core comprises a first magnetic core, a second magnetic core and a third magnetic core; the third magnetic core is arranged between the first winding and the second winding; the first magnetic core and the third magnetic core are arranged at opposite sides of the first winding respectively; the second magnetic core and the third magnetic core are arranged at opposite sides of the second winding respectively.

[0024] Preferably, a column and a side column are arranged on the first winding; the first magnetic core and the second magnetic core are made of a magnetic material with high permeability; and the third magnetic core is made of a magnetic material with low permeability.

[0025] In another aspect, the application provides a voltage regulating module with low thermal resistance, comprising a bottom assembly and an inductor assembly as claimed in claim 1; the bottom assembly comprises a bottom substrate, a first IPM unit and a second IPM unit; the IPM units are arranged on the upper surface of the bottom substrate or embedded in the bottom substrate; the IPM unit comprises a high-side switch, a low-side switch and a SW pin, the high-side switch and the low-side switch are electrically connected to the SW pin.

[0026] The inductor is arranged on the upper surface of the bottom substrate and above the IPM unit; the lower surface of the bottom substrate is used to fix and electrically connect with external components; the second pin is electrically connected to the bottom substrate, the first pin of the first winding is electrically connected to the first IPM unit; and the first pin of the second winding is electrically connected to the second IPM unit.

[0027] Preferably, the top horizontal part is thermally connected to a heat dissipation device arranged on the top surface of the magnetic core.

[0028] Preferably, the input capacitor and other passive elements are arranged on the upper surface of the bottom substrate; the IPM unit comprises a first IPM unit and a second IPM unit, and the input capacitor is arranged between the first IPM unit and the second IPM unit.

[0029] Preferably, a groove is arranged on the bottom of the magnetic core, and the groove is used to accommodate the input capacitor and other passive elements.

[0030] Preferably, the bottom surface of the bottom substrate is sequentially provided with an I / O pad, a Vin+ pad, a GND pad and a Vo+ pad; and the I / O pad is arranged adjacent to the first side surface of the bottom substrate.

[0031] Preferably, the bottom surface of the magnetic core is thermally connected to the upper surface of the bottom substrate or the IPM unit.

[0032] Preferably, the inductor assembly further comprises a heat dissipation assembly, the heat dissipation assembly is "C" shaped, and covers part of the top surface, part of the side surface and part of the bottom surface of the magnetic core; the heat dissipation assembly is made of metal material; and the bottom surface of the heat dissipation assembly is thermally connected to the upper surface of the IPM unit or the upper surface of the bottom substrate.

[0033] Preferably, the lower surface of the first bottom horizontal unit is thermally connected to the upper surface of the IPM unit.

[0034] Preferably, the SW pin of the IPM unit is arranged on the top surface of the IPM unit, and the lower surface of the first bottom horizontal portion is fixed and electrically connected with the SW pin.

[0035] Preferably, a heat-conducting medium is applied between the upper surface of the IPM unit and the lower surface of the magnetic core, and between the lower surface of the first bottom horizontal portion.

[0036] Preferably, the inductor assembly further comprises a third vertical portion, a top end of the third vertical portion is connected with the other end of the first bottom horizontal portion, the first pin is arranged at a bottom end of the third vertical portion, and the SW pin of the IPM unit is electrically connected with the first pin through the bottom substrate.

[0037] Preferably, the second pin is arranged at the bottom end of the second vertical portion, and the second pin is fixed and electrically connected with the bottom substrate.

[0038] Preferably, the inductor assembly further comprises a second bottom horizontal portion, one end of the second bottom horizontal portion is connected with the bottom end of the second vertical portion, the second bottom horizontal portion extends from the second vertical portion away from the first vertical portion, the second pin is arranged on a lower surface of the second bottom horizontal portion, and the second pin is fixed, thermally connected and electrically connected with the bottom substrate.

[0039] Preferably, the inductor assembly further comprises a second bottom horizontal portion and a fourth vertical portion, one end of the second bottom horizontal portion is connected with the bottom end of the second vertical portion, the other end of the second bottom horizontal portion is connected with a top end of the fourth vertical portion, the second pin is arranged at a bottom end of the fourth vertical portion, a lower surface of the second bottom horizontal portion is thermally connected with the upper surface of the IPM unit, and the second pin is fixed and electrically connected with the bottom substrate.

[0040] Preferably, the lower surface of the second bottom horizontal portion and the upper surface of the IPM unit are thermally connected through the application of a heat-conducting medium.

[0041] Preferably, the bottom end of the second pin and / or the first pin is fixed and electrically connected with the bottom substrate through a metal block.

[0042] Preferably, the SW pin of the IPM unit is arranged adjacent to a first side of the bottom substrate, the first pin of the winding is arranged adjacent to the first side of the bottom substrate, and the SW pin and the first pin are arranged close to each other and electrically connected.

[0043] Preferably, the inductor assembly further comprises a first auxiliary winding and a second auxiliary winding; the first auxiliary winding is adjacent to the first winding; the second auxiliary winding is adjacent to the second winding; the auxiliary windings each comprise a top horizontal portion, a first vertical portion and a second vertical portion; the top horizontal portion, the first vertical portion and the second vertical portion of the auxiliary windings are identical in shape to the top horizontal portion, the first vertical portion and the second vertical portion of the first winding / second winding; the two auxiliary windings in the same voltage regulation module are connected in series by a bottom substrate, and corresponding functional expansion pins are arranged on the lower surface of the bottom substrate.

[0044] Preferably, the first winding and the second winding are each provided with a notch, and the two windings are arranged in cross by mechanical engagement of the notches.

[0045] Another aspect of the present application provides a voltage regulation module with low thermal resistance, comprising an IPM unit, an input capacitor, other passive elements and an inductor assembly as claimed in claim 1; the IPM unit, the input capacitor, the other passive elements and the inductor assembly are arranged on a bottom substrate or a system mainboard; the IPM unit and the inductor assembly are horizontally arranged on the same surface of the bottom substrate or the system mainboard.

[0046] The IPM unit is arranged on the upper surface of the bottom substrate; the IPM unit comprises a high-side switch tube, a low-side switch tube and a SW pin, and the high-side switch tube and the low-side switch tube are electrically connected to the SW pin.

[0047] The inductor is arranged on the upper surface of the bottom substrate and horizontally placed with the IPM unit; the second pin is electrically connected to the bottom substrate, the first pin of the first winding is arranged adjacent to and electrically connected to the SW pin of the first IPM unit, and the first pin of the second winding is arranged adjacent to and electrically connected to the SW pin of the second IPM unit.

[0048] Preferably, the lower surface of the bottom substrate is provided with voltage regulation module pins for fixing and electrically connecting with external components.

[0049] Preferably, the bottom substrate is a system mainboard, and the IPM unit and the inductor assembly are electrically connected through the system mainboard.

[0050] The present application has the following beneficial effects:

[0051] The application stacks the inductor and the IPM unit, transmits the heat generated by the IPM unit to the top surface of the inductor through the magnetic material and the winding of the inductor, optimizes the shape structure of the inductor winding and the thermal connection between the inductor winding and the IPM unit, and reduces the upward thermal resistance of the voltage regulation module. Thus, the voltage regulation module with low thermal resistance, good heat dissipation performance, large output current, high conversion efficiency and high power density is obtained. BRIEF DESCRIPTION OF DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0053] Figures 1A-1D The voltage regulation module structure shown in embodiment one;

[0054] Figures 2A-2C The voltage regulation module structure shown in embodiment two;

[0055] Figures 3A-3C The voltage regulation module structure shown in embodiment three;

[0056] Figures 4A-4B The voltage regulation module structure shown in embodiment four;

[0057] Figures 5A-5B The voltage regulation module structure shown in embodiment five;

[0058] Figures 6A-6B The voltage regulation module structure shown in embodiment six;

[0059] Figures 7A-7D The voltage regulation module structure shown in embodiment seven;

[0060] Figures 8A-8C The voltage regulation module structure shown in embodiment eight;

[0061] Figures 9A-9F The voltage regulation module structure shown in embodiment nine;

[0062] Figures 10A-10B The voltage regulation module structure shown in embodiment ten;

[0063] Figures 11A-11D The voltage regulation module structure shown in embodiment eleven;

[0064] Figures 12A-12F The voltage regulation module structure shown in embodiment twelve. DETAILED DESCRIPTION

[0065] The core of the present application is to provide a low thermal resistance voltage regulation module. On one hand, by stacking the inductor and the IPM unit, the heat generated by the IPM unit is transferred to the top surface of the inductor through the magnetic material and the winding of the inductor. On the other hand, by optimizing the shape structure of the inductor winding and optimizing the thermal connection between the inductor winding and the IPM unit, the upward thermal resistance of the voltage regulation module is reduced. Thus, a voltage regulation module with lower thermal resistance, good heat dissipation performance, large output current, high conversion efficiency and high power density is obtained.

[0066] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0067] Embodiment one

[0068] Figure 1A is a structural schematic diagram of a VRM module 10 described in the present application, Figure 1B is Figure 1A a structural exploded view. As shown in Figure 1A and Figure 1B , the VRM module 10 includes a top inductor 100 and a bottom assembly 200. The top inductor 100 includes a magnetic core 110, a first winding 120, and a second winding 130. The bottom assembly 200 includes a bottom substrate 210, a first IPM unit 220, a second IPM unit 230, an input capacitor 240, and other passive components 250.

[0069] The material of the magnetic core 110 can be iron powder, iron-silicon-aluminum, iron-nickel, iron-silicon-chromium, nanocrystalline, amorphous, or a mixture of several magnetic powder materials, and the magnetic core 110 and the windings 120 / 130 are integrally formed by compression molding to form the top inductor 100. The first winding 120 includes a third vertical portion 121, a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124, a second vertical portion 125, a second bottom horizontal portion 126, and a fourth vertical portion 127, and is sequentially connected. The first pin 120a and the second pin 120b of the first winding 120 are both arranged on the bottom surface of the inductor 100, and the first pin 120a and the second pin 120b both protrude from the bottom surface of the magnetic core to facilitate reliable welding with the bottom substrate 210. The second winding 130 includes a third vertical portion 131, a first bottom horizontal portion 132, a first vertical portion 133, a top horizontal portion 134, a second vertical portion 135, a second bottom horizontal portion 136, and a fourth vertical portion 137, and is sequentially connected. The first pin 130a and the second pin 130b of the second winding 130 are both arranged on the bottom surface of the inductor, and the first pin 130a and the second pin 130b both protrude from the bottom surface of the magnetic core to facilitate reliable welding with the bottom substrate 210. The third vertical portion 121, the top horizontal portion 124, and the fourth vertical portion 127 of the first winding 120 are partially exposed on the surface of the magnetic core 110, and the other portions of the first winding are arranged inside the magnetic core. The third vertical portion 131, the top horizontal portion 134, and the fourth vertical portion 137 of the second winding 130 are partially exposed on the surface of the magnetic core 110, and the other portions of the second winding are arranged inside the magnetic core.

[0070] The IPM units 220 / 230 include two semiconductor switching devices and their driving control circuits, which can be silicon (Si) / silicon carbide (SiC) field effect transistors, etc. The two semiconductor switching tubes are connected in series to form a switching bridge arm (i.e., a half-bridge topology), and the two semiconductor switching tubes are a high-side switch and a low-side switch, respectively. The drain of the high-side switch is electrically connected to the input positive terminal Vin+, and the source of the high-side switch and the drain of the low-side switch are electrically connected and lead out as the SW pin of the IPM unit. The source of the low-side switch is connected to the input ground terminal GND. The first pin 120a of the first winding 120 and the first pin 130a of the second winding 130 (i.e., the input terminal of the inductor) are respectively electrically connected to the SW pin of the corresponding IPM unit. The second pin 120b of the first winding 120 and the second pin 130b of the second winding 130 (i.e., the output terminal of the inductor) are electrically connected to the load to provide energy for the load. In the embodiment, the I / O pin 221, the Vin+ pin 222, the GND pin 223, and the SW pin 225 of the first IPM unit 220 are arranged in sequence, and the SW pin 225 is arranged adjacent to the first side of the bottom substrate. The pin arrangement of the second IPM unit 230 is the same as that of the first IPM unit 220 (not shown). The bottom substrate 210 is used for welding with the load main board, so the bottom substrate 210 has the I / O pad 211, the Vin+ pad 212, the GND pad 213, and the Vo+ pad 214 arranged in sequence at the bottom. The I / O pad is arranged adjacent to the first side of the bottom substrate 210. The input capacitor 240 is arranged between the two IPM units. The first pin 120a / 130a of each winding is arranged adjacent to the first side of the bottom substrate 210, so that the first pin 120a of the first winding is close to the SW pin of the first IPM unit 220, and the first pin 130a of the second winding is close to the SW pin of the second IPM unit 230, thereby realizing local electrical connection to reduce the connection loop and connection impedance and improve the conversion efficiency of the VRM module.

[0071] The arrangement of the pads on the bottom substrate 210 and the arrangement of the IPM unit pin and the placement of the inductor winding pin make the input power flow from the Vin+ pad 212 on the bottom substrate to the Vin+ pin 222 of the IPM unit 220. When the high-side switch of the IPM unit is turned on and the low-side switch is turned off, the input power current flows from the Vin+ pin 222 to the first pin 120a of the first winding 120 of the inductor and then to the second pin 120b of the first winding 120 of the inductor through the SW pin 225, and then flows to the load through the Vo+ pad 214 of the bottom substrate 210 to supply power to the load; at the same time, the energy is stored in the inductor and charges the output capacitor of the load. When the high-side switch is turned off and the low-side switch is turned on, the energy stored in the inductor is released to the load to maintain the power supply of the load, and the current in the inductor flows through the SW pin 225, the GND pin 223 of the IPM unit 220, and the GND pad 213 of the bottom substrate to continue to flow. Since the load is a processor, the supply voltage is low (generally lower than 1V), and the input voltage of the load mainboard is generally a DC voltage of about 12V, which is much higher than the supply voltage of the processor; therefore, the current flowing through the VIN path is small, and the current flowing through the GND path is large; this results in that the high-side switch of the IPM unit is turned on for a short time, and the low-side switch is turned on for a long time; therefore, the conduction loss of the low-side switch is high, which is the main heat source; therefore, the part of the low-side switch near the SW pin of the IPM unit 220 has the highest temperature rise.

[0072] Figure 1C is Figure 1A The magnetic core 110 is arranged according to Figure 1AAs shown in the side view after the A-A section, the IPM unit 220 as the heat source (shown as the hot spot 300), the heat conduction path of the hot spot 300 has the following three paths: the first heat conduction path 311 is a downward heat conduction path to the load mainboard through the bottom substrate 210; the second heat conduction path 312 is a heat conduction path upward to the inductor through the bottom substrate 210 and the inductor winding 120; and the third heat conduction path 313 is a heat conduction path upward to the inductor through the magnetic core. The thermal resistance of the first heat conduction path 311 is low, but because the temperature of the load mainboard itself is relatively high, the IPM unit 220 conducts away less heat through the first heat conduction path 311. The VRM module can be provided with a heat sink on the top of the inductor, or the VRM module can share a heat sink with the processor, and the heat generated by the IPM unit 220 is dissipated through the top of the inductor. Therefore, as long as the thermal resistance of the IPM unit 220 to the top of the inductor is reduced, the heat dissipation capacity of the second heat conduction path can be enhanced. In order to reduce the thermal resistance of the second heat conduction path 312, the first pin 120a of the inductor winding is as close as possible to the SW pin of the IPM unit 220, and the cross-sectional area of the first winding 120 is increased; on the other hand, the first winding 120 is exposed on the surface of the magnetic core 110 at the top of the inductor, that is, the top horizontal part 124 of the winding is exposed on the outer surface of the magnetic core 110; such arrangement makes one end 120a of the first winding 120 close to the heat source, and the top horizontal part 124 exposed on the top of the inductor close to the heat sink, thereby reducing the thermal resistance of the second heat conduction path 312 and improving the heat dissipation performance of the VRM module. In order to reduce the thermal resistance of the third heat conduction path, the present application coats a heat conduction medium 310 between the upper surface of the IPM unit 220 and the lower surface of the magnetic core. The heat conduction medium 310 is not limited to heat conduction glue, heat conduction silicone grease, heat conduction gasket and heat conduction tape, etc. Similarly, the heat dissipation path of the second IPM unit 230 is the same as that of the IPM unit 220, and will not be described here.

[0073] Figure 1D is a preferred embodiment of the present application. As shown in Figure 1D , the present application has the same technical effects as the Figure 1A embodiment, and the difference between the present application and the embodiment is that the first bottom horizontal part 122 and the second bottom horizontal part 126 of the first winding 120 are partially exposed on the bottom surface of the magnetic core 110, and the exposed surface of the first bottom horizontal part 122 and the second bottom horizontal part 126 of the first winding 120 is flush with the bottom surface of the magnetic core 110, so that the present application adds a fourth heat conduction path upward from the top surface of the IPM unit 220 through the heat conduction medium 310, the first bottom horizontal part 122 and the second bottom horizontal part 126 of the winding 120, because copper has good heat conduction performance, so as to further reduce the upward thermal resistance of the VRM module. The second IPM unit 230 and the second winding 130 also have the same arrangement and technical effects, which will not be described here.

[0074] Example 2

[0075] Figure 2A The following is another embodiment of the present invention. Figure 2B yes Figure 2A An exploded view of the structure. This embodiment has the same technical effects as Embodiment 1; the difference lies in the winding structure of the inductor and the arrangement of the windings within the magnetic core 110. (See attached diagram.) Figure 2A and Figure 2B As shown, the first winding 120 includes a third vertical portion 121, a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124, and a second vertical portion 125, which are connected sequentially. The third vertical portion 121, the first bottom horizontal portion 122, the top horizontal portion 124, and the second vertical portion 125 of the first winding 120 are all partially exposed on the surface of the magnetic core, with only the first vertical portion 123 completely enclosed by the magnetic core 110. The first bottom horizontal portion 122 is flush with the bottom surface of the magnetic core 110, and the top horizontal portion 124 is flush with the top surface of the magnetic core 110. The first pin 120a and the second pin 120b of the first winding both protrude from the bottom surface of the magnetic core 110 to facilitate reliable soldering to the bottom substrate 210. The advantage of this winding configuration is that the inductance can be flexibly adjusted, thereby expanding the application range of the VRM module. The low-end switching transistor of IPM unit 220 is located near the first side of the bottom substrate 210, and the first winding 120 with heat dissipation function is closer to the heat source IPM unit 220. In this embodiment, the horizontal length of the first bottom horizontal portion 122 of the first winding 120 is increased, allowing the winding to contact the heat source with a larger area. This helps to reduce the upward thermal resistance of the VRM module, achieve better heat dissipation, and further increase the output current of the VRM module. The second IPM unit 230 and the second winding 130 have the same arrangement and technical effects as the first IPM unit 220 and the first winding 120, and will not be described again here.

[0076] Figure 2C This is a preferred embodiment of the present invention. Figure 2A The embodiments described above achieve the same technical effects. The difference in this embodiment lies in the arrangement of the inductor winding pins. In this embodiment, the first pin 120a and the second pin 120b of the first winding 120 and the first pin 130a and the second pin 130b of the second winding 130 are flush with the bottom surface of the magnetic core. Copper pillars 261 / 262 / 271 / 272 are provided on the bottom substrate 210. The inductor pins 120a / 120b / 130a / 130b are electrically connected to the bottom substrate 210 through the copper pillars 261 / 262 / 271 / 272, respectively. This arrangement simplifies the inductor manufacturing process and provides good heat dissipation.

[0077] Embodiment Three

[0078] Figure 3A Fig. 2 shows a schematic diagram of a VRM module structure according to another embodiment of the present application, Figure 3B Fig. 1 shows a schematic diagram of a VRM module structure according to an embodiment of the present application, Figure 3A Fig. 3 shows a schematic diagram of the magnetic core 110 after being cut from the A-A position. As shown in Fig. 3, the magnetic core 110 includes a first side 111, a second side 112, a third side 113 and a fourth side 114. The first side 111 and the second side 112 are opposite to each other. The third side 113 and the fourth side 114 are opposite to each other. The first side 111 and the third side 113 are parallel to each other. The second side 112 and the fourth side 114 are parallel to each other. The first side 111 and the second side 112 are perpendicular to the third side 113 and the fourth side 114. The magnetic core 110 is made of magnetic material, such as iron powder, iron-silicon-aluminum, iron-nickel, iron-silicon-chromium, nanocrystalline, amorphous, or a mixture of several of them. Figure 3A Figure 3B As shown in Fig. 1, the VRM module includes a top inductor 100 and a bottom assembly 200. The top inductor 100 includes a magnetic core 110, a first winding 120 and a second winding 130. The magnetic material of the magnetic core 110 can be iron powder, iron-silicon-aluminum, iron-nickel, iron-silicon-chromium, nanocrystalline, amorphous, or a mixture of several of them. The magnetic core 110 and the windings are integrally compression molded. In this embodiment, the bottom of the magnetic core 110 is provided with a recess 102. The first winding 120 includes a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124 and a second vertical portion 125. The shape of the first winding 120 is an unsealed "mouth" character, and the unsealed position is between the second vertical portion 125 and the first bottom horizontal portion 122. The second vertical portion 125, the first bottom horizontal portion 122 and the top horizontal portion 124 are partially exposed on the surface of the magnetic core 110, and only the first vertical portion 123 is completely wrapped by the magnetic core 110. The exposed surface of the top horizontal portion 124 is flush with the top surface of the magnetic core 110, and the exposed surface of the first bottom horizontal portion 122 is flush with the bottom surface of the magnetic core 110. The second vertical portion 125 is adjacent to the first side of the magnetic core 110. The first pin 120a and the second pin 120b of the first winding are both arranged on the bottom surface of the magnetic core 110, and the second pin 120b of the first winding protrudes from the first pin 120a.

[0079] The bottom assembly 200 includes a bottom substrate 210, a first IPM unit 220, a second IPM unit 230 (not shown), an input capacitor 240 and other passive components 250. The input capacitor 240 is arranged in the recess 102 of the magnetic core 110. The bottom substrate 210 is sequentially provided with an I / O pad 211, a Vin+ pad 212, a GND pad 213 and a Vo+ pad 214, and the Vo+ pad 214 is arranged adjacent to the first side of the bottom substrate 210. Referring to Fig. 2, the first IPM unit 220 includes a first IPM 221 and a first diode 222. The second IPM unit 230 includes a second IPM 231 and a second diode 232. The first IPM 221 and the second IPM 231 are arranged on the bottom substrate 210. The first diode 222 and the second diode 232 are arranged on the bottom substrate 210. Figure 3C ​As shown in the side view, the IPM unit 220 includes an IPM unit substrate 220a, an I / O functional area 221A, a high-side switch tube 221B, a low-side switch tube 221C, and an RDL (re-distributed layer, not shown). The switch tubes in the IPM unit can be silicon (Si) / silicon carbide (SiC) field effect transistors, etc. The IPM unit 220 is disposed adjacent to the first side of the bottom substrate 210. The I / O functional area 221A is disposed adjacent to the third side of the bottom substrate 210 (the third side is opposite to the first side). The switch tubes in this embodiment adopt MOSFETs of vertical structure, i.e., the drain 226 of the high-side switch tube 221B is adjacent to the bottom surface of the IPM unit, and the source 227 is adjacent to the top surface of the IPM unit; the drain 228 of the low-side switch tube 221C is adjacent to the top surface of the IPM unit, and the source 229 is adjacent to the bottom surface of the IPM unit. The two semiconductor switch tubes are electrically connected in series to form a switching bridge arm (i.e., a half-bridge topology), the drain 226 of the high-side switch tube is electrically connected to the input positive terminal Vin+, the source 227 of the high-side switch tube is electrically connected to the drain 228 of the low-side switch tube, the source 227 of the high-side switch tube and the drain 228 of the low-side switch tube are electrically connected inside the IPM substrate 220a through the RDL, and are led out as SW pin positions of the IPM unit, and the SW pin positions of the IPM are led out on both the top surface and the bottom surface of the IPM substrate 220a; the source 229 of the low-side switch tube is connected to the input ground terminal GND. The first pin 120a of the first winding 120 is electrically connected to the SW pin position of the IPM unit, and the second pin is electrically connected to the load to provide energy for the load. The second IPM unit 230 and the second winding 130 are disposed in the same manner as the first IPM unit 220 and the first winding 120, and will not be described again here.

[0080] In this embodiment, the drain 226 of the high-side switch tube is arranged on the bottom surface of the high-side switch tube silicon wafer, and is led out as the Vin+ pin (not shown in the figure) of the IPM unit through RDL to the bottom surface of the IPM unit substrate 220a, so as to facilitate electrical connection with the Vin+ pad 212 of the bottom substrate. The source 227 of the high-side switch tube and the drain 228 of the low-side switch tube are both arranged on the top surface of the corresponding switch tube silicon wafer, and are led out as the SW pin (not shown in the figure) of the IPM unit 220 through RDL upward to the top surface of the IPM unit substrate 220a, so as to facilitate electrical connection with the first pin 120a of the inductor. The source 229 of the low-side switch tube is arranged on the bottom surface of the low-side switch tube silicon wafer, and is led out as the GND pin (not shown in the figure) of the IPM unit through RDL to the bottom surface of the IPM unit substrate 220a, so as to facilitate electrical connection with the GND pad 213 of the bottom substrate. The second pin 120b is electrically connected to the Vo+ pad of the bottom substrate 210 through the bottom substrate 210, and provides energy for the load. The advantage of such arrangement is that the path of the power loop is the shortest, which is beneficial to improve the conversion efficiency of the VRM module. The loop area of the input high-frequency loop is the smallest, so that the frequency of the input loop high-frequency oscillation is far away from the equivalent switching frequency, which reduces the influence of the input loop high-frequency oscillation on the working stability of the VRM module, and also reduces the additional loss caused by loop oscillation, further improving the conversion efficiency of the VRM module.

[0081] As described in Embodiment One, the conduction loss of the low-side switch tube in the IPM unit is high and dominates the IPM unit loss, so the low-side switch tube is the main heat source. In this embodiment, the first pin 120a of the first winding 120 is directly electrically connected to the SW pin of the IPM unit on the top surface of the substrate 220a of the IPM unit 220, thereby reducing the thermal resistance from the low-side switch tube to the top surface of the inductor, so that the VRM module can output greater current.

[0082] Embodiment Four

[0083] Figure 4A The above is the structure schematic diagram of another embodiment of the VRM module of the present application, Figure 4B For Figure 4A The schematic diagram of the magnetic core 110 after being cut from the A-A position. As shown in Figure 4A and Figure 4B The present embodiment has the same technical effects as the embodiment described in Figure 3A The difference between the present embodiment and the embodiment described in Figure 3A The difference between the present embodiment and the embodiment described in

[0084] The winding 120 comprises a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124 and a second vertical portion 125. The first bottom horizontal portion 122, the top horizontal portion 124 and the second vertical portion 125 are partially exposed outside the magnetic core 110, and only the first vertical portion 123 is completely surrounded by the magnetic core 110. The exposed surface of the top horizontal portion 124 of the winding is flush with the top surface of the magnetic core 110, and the exposed surface of the second vertical portion 125 is arranged close to the third side surface of the magnetic core 110. The first pin 120a and the second pin 120b of the winding are arranged on the bottom surface of the magnetic core 110, and the first pin 120a of the winding is lower than the second pin 120b.

[0085] The I / O pad 211, the Vin+ pad 212, the GND pad 213 and the Vo+ pad 214 are arranged on the bottom substrate 210 in sequence. The Vo+ pad 214 is adjacent to the third side surface of the bottom substrate 210. The first IPM unit 220 and the second IPM unit 230 are arranged on the bottom substrate 210 and close to the first side surface of the bottom substrate 210. Referring to Figure 3C , the low-end switch tube 229 of the IPM unit is arranged close to the first side surface of the IPM unit substrate 220a.

[0086] The first pin 120a of the first winding 120 is electrically connected with the SW pin (not shown) arranged on the top surface of the IPM unit substrate 220a, so as to reduce the thermal resistance from the silicon wafer to the top surface of the inductor of the low-end switch tube of the first IPM unit, improve the heat dissipation performance of the VRM module, and improve the output current of the module.

[0087] The connection arrangement of the second winding 130 and the second IPM unit 230 is the same as that of the first winding 120 and the first IPM unit 220, and has the same technical effects, which will not be described herein again.

[0088] Embodiment Five

[0089] Figure 5A The structure of the VRM module is shown in the schematic view of another embodiment of the present application, Figure 5B The structure of the VRM module is shown in the schematic view of another embodiment of the present application, Figure 5A The magnetic core 110 is cut along the A-A position in the schematic view. As shown in Figure 5A The structure of the VRM module is shown in the schematic view of another embodiment of the present application, Figure 5B The structure of the VRM module is shown in the schematic view of another embodiment of the present application, Figure 4A The structure of the VRM module is shown in the schematic view of another embodiment of the present application, Figure 4AThe difference in the embodiments lies in the shape of the windings; in this embodiment, the windings are all U-shaped. The first winding 120 includes a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124, a second vertical portion 125, and a second bottom horizontal portion 126. The first bottom horizontal portion 122, the top horizontal portion 124, and the second bottom horizontal portion 126 are all partially exposed on the surface of the magnetic core, while the first vertical portion 123 and the second vertical portion 125 are disposed inside the magnetic core and completely surrounded by the magnetic core 110. The exposed surface of the top horizontal portion 124 is flush with the top surface of the magnetic core. The first pin 120a and the second pin 120b are both disposed on the bottom surface of the magnetic core, and the first pin 120a is lower than the second pin 120b. The shape and structure of the second winding 130 are the same as those of the first winding 120 and have the same technical effects, so they will not be described again here.

[0090] Example 6

[0091] Figure 6A The diagram shown is a structural schematic of a VRM module according to another embodiment of the present invention. Figure 6B for Figure 6A The structure explodes. (See diagram below.) Figure 6A and Figure 6B As shown, this embodiment is similar to Figure 4A The embodiments described above have the same technical effects; the difference in this embodiment lies in the winding structure. In this embodiment, the first winding 120 includes a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124, and a second vertical portion 125; the second winding 130 includes a first bottom horizontal portion 132, a first vertical portion 133, a top horizontal portion 134, and a second vertical portion 135. The top horizontal portion 124 and the second vertical portion 125 of the first winding are physically connected to the top horizontal portion 134 and the second vertical portion 135 of the second winding, and are partially exposed on the surface of the magnetic core 110. The advantage of the winding structure shown in this embodiment is that it reduces the DC impedance of the winding, which is beneficial to improving power conversion efficiency; on the other hand, the increased copper cross-sectional area of ​​the winding enhances the heat dissipation effect, further increasing the output current capability of the VRM module. In other embodiments, only the top horizontal portion 124 of the first winding and the top horizontal portion 134 of the second winding may be physically connected together; or only the second vertical portion 125 of the first winding and the second vertical portion 135 of the second winding may be physically connected together.

[0092] Example 7

[0093] Figure 7A The above is a schematic diagram of the structure of VRM module 10 according to another embodiment of the present invention. Figure 7B for Figure 7A The structure explodes. (See diagram below.) Figure 7A andFigure 7B As shown, the difference between this embodiment and the previous embodiment is that the inductor and IPM unit in the previous VRM module are stacked vertically, while the inductor and IPM unit in the VRM shown in this embodiment are placed horizontally. The advantage of this arrangement is that the tops of the IPM unit and inductor can be directly thermally connected to the heat sink, allowing the heat generated by the IPM unit and inductor to dissipate directly through the heat sink, reducing the upward thermal resistance of the IPM unit and inductor, and facilitating a larger current output from the VRM module. Additionally, Figure 7A and Figure 7B The IPM unit and inductor can also be directly mounted on the system motherboard, and the windings in the IPM unit and inductor are directly electrically connected through the system motherboard.

[0094] Figure 7C The above is a structural schematic diagram of another inductor 100 that can be used in the VRM module 10 of this embodiment. Figure 7D for Figure 7C The structure explodes. (See diagram below.) Figure 7C and Figure 7D As shown in the figure, the inductor shown in this embodiment and Figure 1A The inductor described above has the same technical effect. The inductor shown in this embodiment is similar to... Figure 1A The difference in the inductor is that, in this embodiment, the first pin 120a and the second pin 120b of the first winding 120 and the first pin 130a and the second pin 130b of the second winding 130 are arranged on the same plane, or the pins of the two windings are flush with the bottom surface of the magnetic core 110, so as to improve space utilization and power density of the VRM module. Figure 1A The structure where the inductor pins protrude from the bottom surface of the magnetic core can also be used in the VRM module of this embodiment. Similarly, the inductor structure in all the aforementioned embodiments can also be used in this embodiment by arranging the winding pins on the same plane.

[0095] In another preferred embodiment, the substrate 210 of the bottom component 200 can be a load motherboard, thus saving one substrate 210, reducing the number of high-current soldering points in the power circuit, eliminating losses caused by substrate 210 transfer, reducing the cost of the VRM module, and improving production efficiency. Similarly, the bottom substrate 210 in the VRM modules described in embodiments one to six can all be replaced by a load motherboard, achieving the same technical effects as this embodiment.

[0096] Example 8

[0097] Figure 8A This is another embodiment of the inductor 100 in the VRM module described in this invention. Figure 8B yes Figure 8A The structure explodes. Figure 8A The inductance and Figure 7AThe difference of the inductance is that, Figure 8A The inductance increase is provided by a first auxiliary winding 140 and a second auxiliary winding 150. The first auxiliary winding 140 and the first winding 120 have the same structural shape and are arranged adjacently; the width of the first auxiliary winding 140 is smaller than that of the first winding 120. The second auxiliary winding 150 and the second winding 130 have the same structural shape and are arranged adjacently; the width of the second auxiliary winding 150 is smaller than that of the second winding 130. In the embodiment, the first auxiliary winding 140 is arranged adjacently with the first winding 120, and the second auxiliary winding 150 is arranged adjacently with the second winding 130, so as to increase the coupling coefficient between the auxiliary winding and the winding, to realize the TLVR (Trans-Inductor Voltage Regulators) technology; while reducing the upward thermal resistance of the VRM module and improving the heat dissipation performance, the dynamic performance of the VRM module is further improved. The two auxiliary windings in the same voltage regulation module are electrically connected in series in the bottom substrate, and two function expansion pins are arranged on the lower surface of the bottom substrate; when a plurality of voltage regulation modules are arranged on the system mainboard, the auxiliary windings in different voltage regulation modules are electrically connected through the function expansion pins.

[0098] Figure 8C For another preferred embodiment of the embodiment, Figure 8C The embodiment has the same technical effects as Figure 8A The embodiment has the same technical effects as Figure 8C The difference of the embodiment is that the structure of the auxiliary winding is different, specifically, the first bottom horizontal part 142 and the second bottom horizontal part 146 of the first auxiliary winding 140 respectively extend inwardly; the first vertical part 143, the top horizontal part 144 and the second vertical part 145 have the same shape as the corresponding parts of the first winding 120 and are arranged adjacently. The structure of the second auxiliary winding 150 is the same as that of the first auxiliary winding 140 and is arranged adjacently with the second winding 130. The structural shape of the auxiliary winding in the embodiment is to make the connection of the pins of the auxiliary winding with the substrate 210 or the load mainboard more simple and convenient.

[0099] Embodiment Nine

[0100] Figure 9A is another embodiment of the inductor 100 in the VRM module of the application, Figure 9B is Figure 9A is a structural exploded view of Figure 9A and Figure 9BThe inductor includes a magnetic core 110, a first winding 120 and a second winding 130. The magnetic core shown in this embodiment has the same technical effects as the magnetic core shown in Embodiment 1, and thus will not be described again. The first winding 120 includes a first bottom horizontal portion 122, a first vertical portion 123, a top horizontal portion 124, a second vertical portion 125 and a second bottom horizontal portion 126. The first bottom horizontal portion 122 and the second bottom horizontal portion 126 are partially exposed on the surface of the magnetic core, or the exposed surfaces of the first bottom horizontal portion 122 and the second bottom horizontal portion 126 are flush with the bottom surface of the magnetic core. The first bottom horizontal portion 122 extends to the second side surface of the magnetic core, and the second bottom horizontal portion 126 extends to the fourth side surface of the magnetic core. The second winding 130 includes a first bottom horizontal portion 132, a first vertical portion 133, a top horizontal portion 134, a second vertical portion 135 and a second bottom horizontal portion 136. The first bottom horizontal portion 132 and the second bottom horizontal portion 136 are partially exposed on the surface of the magnetic core, or the exposed surfaces of the first bottom horizontal portion 132 and the second bottom horizontal portion 136 are flush with the bottom surface of the magnetic core. The first bottom horizontal portion 132 extends to the second side surface of the magnetic core, and the second bottom horizontal portion 136 extends to the fourth side surface of the magnetic core. Figure 9C is Figure 9B An exploded view of the structure of the windings in Figure 9C As shown in FIG. 1, a first notch 128 is provided on the first winding 120, and the first notch 128 is arranged at the joint of the first bottom horizontal portion 122 and the first vertical portion 123. A second notch 138 is provided on the second winding 130, and the second notch 138 is arranged at the joint of the second vertical portion 135 and the second bottom horizontal portion 136. The first winding 120 and the second winding 130 are arranged in a cross manner through the mechanical engagement between the notch 128 and the second bottom horizontal portion 136, and the mechanical engagement between the notch 138 and the first bottom horizontal portion 122. The notches 128 and 138 are arranged to meet the requirement of electrical isolation and insulation when the two windings are arranged adjacent to each other.

[0101] The first pin 120a of the first winding 120 is arranged at the bottom of the first bottom horizontal portion 122 and is electrically connected to the SW of the first IPM unit through the bottom substrate 210 or the load main board. The first pin 130a of the second winding 130 is arranged at the bottom of the first bottom horizontal portion 132 and is electrically connected to the SW of the second IPM unit through the bottom substrate 210 or the load main board. The first pin 120a of the first winding 120 and the first pin 130a of the second winding 130 are arranged at the same side of the magnetic core 110, for example, adjacent to the second side of the magnetic core 110. The second pin 120b of the first winding 120 is arranged at the bottom of the second bottom horizontal portion 126 and is electrically connected to the load through the bottom substrate 210 or the load main board and provides energy for the load. The second pin 130b of the second winding 130 is arranged at the bottom of the second bottom horizontal portion 136 and is electrically connected to the load through the bottom substrate 210 or the load main board and provides energy for the load. The second pin 120b of the first winding 120 and the second pin 130b of the second winding 130 are arranged at the same side of the magnetic core 110, for example, adjacent to the fourth side of the magnetic core 110. That is, the two input pins of the inductor are arranged at the same side of the magnetic core 110, and the two output pins of the inductor are arranged at the other same side of the magnetic core. In this way, the distance from the output pin of the inductor to the load is the shortest, effectively reducing the direct current impedance on the current flow path, and improving the conversion efficiency of the VRM module.

[0102] The current in the VRM module flows out from the SW pin, passes through the inductor winding, and then supplies power to the load, that is, flows out from the output pin of the inductor. Therefore, in the present embodiment, the current flowing through the first winding 120 flows into the first pin 120a of the first winding 120 and flows out from the second pin 120b; the current flowing through the second winding 130 flows into the first pin 130a of the second winding 130 and flows out from the second pin 130b. Therefore, the current flowing through the first vertical portion 123, the top horizontal portion 124 and the second vertical portion 125 of the first winding is opposite in direction to the current flowing through the first vertical portion 133, the top horizontal portion 134 and the second vertical portion 135 of the second winding 130; the magnetic flux generated by the current flowing through the two windings is opposite in direction in the magnetic core 110 and cancels each other out, so that the two-phase inductor works in an anti-coupling state. On the one hand, the anti-coupling inductor has a smaller dynamic inductance, which can improve the dynamic performance of the VRM module; on the other hand, the anti-coupling has a higher steady-state inductance, and the VRM module can obtain steady-state characteristics.

[0103] Figure 9D Another embodiment of the winding is shown in Figure 9A Another embodiment of the winding is shown in Figure 9D Another embodiment of the winding is shown in Figure 9D Another embodiment of the winding is shown in Figure 9A The winding shown in the present embodiment has the same technical effects as the winding described in the foregoing embodiment. Figure 9DThe difference between the windings shown is that the position of the notch is different. The first winding 120 is provided with a notch 128 on the top horizontal portion 124; the second winding 130 is provided with a notch 138 on the top horizontal portion 134. The cross arrangement of the first winding 120 and the second winding 130 is achieved by the mechanical engagement of the notch 128 and the notch 138; the notch 128 and the notch 138 are provided to meet the requirement of electrical isolation and insulation when the two windings are arranged adjacently. Of course, the notch can also be provided at other positions, which are not listed here one by one.

[0104] Figure 9E The structure schematic diagram of another preferred embodiment of the inductor is shown in the embodiment, Figure 9F Figure 9E is shown in the exploded view. As shown in Figure 9E and Figure 9F , the inductor 100 comprises a first magnetic core 110, a second magnetic core 111, a third magnetic core 112, a first winding 120 and a second winding 130. The first magnetic core 110 and the second magnetic core 111 are composed of a magnetic material with high magnetic permeability, such as ferrite, etc., to improve the coupling coefficient between the two windings. The first magnetic core 110 is provided with a center column 110a and a side column 110b. The center column 110a can be further provided with an air gap to adjust the inductance value. The third magnetic core 112 is a magnetic material with low magnetic permeability, such as the magnetic powder core material described in the first embodiment. In this way, the saturation current value of the inductor is improved. The windings shown in the embodiment are the same as the windings in the embodiment described in Figure 9A , therefore, the two-phase windings in the embodiment are also working in the anti-coupling state, which can take into account the dynamic performance and steady-state efficiency of the VRM module.

[0105] Embodiment Ten

[0106] The embodiment shown is another embodiment of the embodiment shown in Figure 3A , as shown in Figure 10A and Figure 10B . Figure 10A is a structure schematic diagram, Figure 10B is Figure 10A the schematic diagram of the position of the section A-A shown. The difference between the VRM module shown in Figure 3A is that the embodiment adds heat dissipation components 320 and 330. The heat dissipation components 320 and 330 are both "C" shaped, arranged on the side surface of the magnetic core 110, and extend to the top surface and the bottom surface of the magnetic core.

[0107] ​In this embodiment, the heat dissipation components 320 and 330 are two independent heat dissipation components, which can be copper sheets, but are not limited thereto, and can also be aluminum or other alloy materials, and any material with good heat conduction properties. In other embodiments, the heat dissipation components 320 and 330 can also be integrally formed, that is, the heat dissipation components 320 and 330 are connected at the bottom surface, side surface and / or bottom surface to form an integral whole. Referring to the structure of the above-mentioned embodiments, the heat dissipation component 320 is thermally connected to the top surface of the first IPM unit 220 at the bottom surface of the magnetic core, or is welded to the heat dissipation pads on the top surface of the first IPM unit 220; the heat dissipation component 330 is thermally connected to the top surface of the first IPM unit 230 at the bottom surface of the magnetic core, or is welded to the heat dissipation pads on the top surface of the second IPM unit 230. The heat dissipation components 320 and 330 are thermally connected to the heat sink at the top surface of the magnetic core. Therefore, as shown in FIG. 3, the embodiment increases the heat conduction path 315 from the heat source to the top surface of the magnetic core, further reduces the vertical thermal resistance of the module, obtains better heat dissipation effect, and further improves the reliability of the VRM module. The heat dissipation components shown in the present application can be copper, aluminum or alloy, and have good heat conduction properties. Figure 10B

[0108] Embodiment Eleven

[0109] Figure 11A is another embodiment of the VRM module 10 described in the present application, which is different from the foregoing embodiments in the structure of the bottom assembly 200. Figure 11B is a perspective view of the bottom assembly 200, Figure 11A is a structural exploded view of the bottom assembly 200, Figure 11C is a perspective view of the bottom assembly 200, Figure 11D is a bottom pin diagram of the bottom assembly 200. Referring to Figures 11A-11D , the first IPM unit 220 and the second IPM unit 230 are embedded in the bottom substrate 210; in other embodiments, the first IPM unit 220 and the second IPM unit 230 can also be directly embedded in the form of a bare die.

[0110] ​SW pin 120a1 / 130a1, Vo pin 120b1 / 130b1 and heat dissipation pad 320a1 / 330a1 are arranged on the top surface of the bottom substrate 210; the SW pin 120a1 is electrically connected to the first pin 120a of the first winding 120, and the SW pin 130a1 is electrically connected to the first pin 130a of the second winding 130; the Vo pin 120b1 is electrically connected to the second pin 120b of the first winding 120, and the Vo pin 130b1 is electrically connected to the second pin 130b of the second winding 130; the heat dissipation pad 320a1 is thermally connected to the pin 320a of the heat sink 320, and the heat dissipation pad 330a1 is thermally connected to the pin 330a of the heat sink 330. The IPM unit embedded in the substrate 210 includes an I / O functional area 221A, a high-side switch tube 221B and a low-side switch tube 221C, and is arranged in the bottom substrate 210 in sequence. In this embodiment, the high-side switch tube 221B and the low-side switch tube 221C are both vertical conductive channel technology MOSFETs, the drain electrode 226 of the high-side switch tube 221B is arranged on the bottom surface of the switch tube, and the source electrode 227 is arranged on the top surface of the switch tube; the drain electrode of the low-side switch tube 221C is arranged on the top surface of the switch tube, and the source electrode is arranged on the bottom surface of the switch tube. The source electrode 227 of the high-side switch tube 221B and the drain electrode 228 of the low-side switch tube 221C are electrically connected to the SW pin 120a1 in the substrate 210 by means of through-hole electroplating or re-wiring layer.

[0111] The I / O pad 211, the VIN+ pad 212, the GND pad 213 and the Vo+ pad 214 are arranged on the bottom surface of the bottom substrate 210 in the above-mentioned order; but in other embodiments, the arrangement of the pin area is not limited to this, as long as it can meet the requirement of near connection and reduce the parasitic parameters of the wiring. The drain electrode 226 of the high-side switch tube 221B is electrically connected to the VIN pin 212 on the bottom surface of the substrate 210 by means of through-hole electroplating or re-wiring layer; the source electrode 229 of the low-side switch tube 221C is electrically connected to the GND pad 213 on the bottom surface of the substrate 210 by means of through-hole electroplating or re-wiring layer; the Vo pin 120b1 is electrically connected to the Vo+ pad 214 on the bottom surface of the substrate 210 by means of through-hole electroplating or re-wiring layer; the I / O functional area 221A of the switch tube is electrically connected to other passive elements 250 on the top surface of the substrate 210 by means of through-hole electroplating or re-wiring layer, and the other electrode of the passive element 250 is electrically connected to the I / O pad 211 on the bottom surface of the substrate 210 by means of through-hole electroplating or re-wiring layer. In this embodiment, the IPM unit or Bare Die is embedded in the substrate, so that the pads on the top surface of the substrate are in the same plane, which is conducive to the welding assembly of the inductor and the substrate, and at the same time, the downward heat dissipation performance of the IPM or Bare Die is better.

[0112] Embodiment Twelve

[0113] Figure 12A is another embodiment of the VRM module 10 disclosed in the present application, Figure 12B is Figure 12A a structural exploded view of Figure 12C is a structural schematic view of the bottom assembly 210, Figure 12D is a sectional view of the bottom assembly 210 at the position of A-A. In combination with Figures 12A-12D , the difference between this embodiment and Embodiment Eleven is that the IPM unit embedded in the bottom substrate is a MOSFET of planar conductive channel technology or a Bare Die. In this embodiment, the pins of the IPM unit are all arranged on the same face, and when the IPM unit is embedded into the bottom substrate, the pins of the IPM unit are directed towards the top face of the substrate 210.

[0114] The top face of the bottom substrate 210 is provided with SW pins 120a1 / 130a1 and Vo pins 120b1 / 130b1; the SW pin 120a1 is electrically connected to the first pin 120a of the first winding 120, and the SW pin 130a1 is electrically connected to the first pin 130a of the second winding 130; the Vo pin 120b1 is electrically connected to the second pin 120b of the first winding 120, and the Vo pin 130b1 is electrically connected to the second pin 130b of the first winding 130. The top face of the bottom substrate 210 is also provided with signal connection lines 111a1 / 112a1, VIN connection lines 121a1 / 131a1 and GND connection lines 122a1 / 132a1. The bottom face of the bottom substrate 210 is provided with I / O pads 211, VIN+ pads 212, GND pads 213 and Vo+ pads 214, and they are arranged in the above-mentioned order in sequence. The signal connection lines 111a1 / 112a1, the SW pins 120a1 / 130a1, the VIN connection lines 121a1 / 131a1 and the GND connection lines 122a1 / 132a1 on the top face of the substrate are all led out from the pins of the IPM unit on the top face of the substrate by means of punching and plating, or by means of a re-routed layer; and the signal connection lines 111a1 / 112a1, the VIN connection lines 121a1 / 131a1 and the GND connection lines 122a1 / 132a1 are further electrically connected to the I / O pads 211, the VIN+ pads 212 and the GND pads 213 on the bottom face of the substrate by means of a re-routed layer or a punching and plating pair in the substrate; and the Vo pins 120b1 / 130b1 on the top face of the substrate are electrically connected to the Vo+ pads 214 on the bottom face of the substrate by means of punching and plating or a re-routed layer. As Figure 12D mentioned above, the pin layout of the IPM unit is that the GND, the VIN and the SW are arranged alternately.

[0115] As Figure 12EIn another embodiment of this invention, the bottom component 200 includes a first substrate 210A and an encapsulant 210B. Figure 12F for Figure 12E The exploded structural diagram, and also refer to Figure 12E and Figure 12F The top surface of the first substrate 210A is provided with... Figure 12C Identical pins, IPM units and / or capacitors (not shown in the figure) are soldered or bonded to the bottom surface of the first substrate 210A, and the IPM units and / or capacitors are encapsulated by encapsulant 210B, with pins formed on the bottom surface of the encapsulant; the pin connection method is the same as... Figure 12C The effects described are the same and will not be repeated here. The layout in this embodiment is beneficial in that it facilitates upward heat dissipation from the IPM unit and eliminates losses caused by power electrical connections, which is conducive to further improving the efficiency of the VRM module.

[0116] The bottom component structures shown in Embodiments 11 and 12 of this invention can be applied to any of the embodiments from Embodiment 1 to Embodiment 10. Those skilled in the art can obtain the same technical effects through simple adjustments and combinations.

[0117] The technical features of the inductor or VRM module described in this invention can be used in any combination to achieve the corresponding technical effects. The above embodiments are merely limited examples. The copper pillar used for conduction in this invention can also be other metallic materials, not limited to copper.

[0118] The "flush" of the exposed surface of the winding with the magnetic core described in this invention refers only to the fact that they are on the same horizontal plane under visual conditions. In reality, due to manufacturing precision requirements, the exposed surface of the winding may be lower than the surface of the magnetic core, such as less than 100 μm; and due to the needs of subsequent processes, the exposed surface of the winding, especially the exposed surface with solder pads, may be higher than the outer surface of the magnetic core, with a maximum height difference of 150 μm.

[0119] The VRM module shown in this invention can also be part of an electronic device, as long as it meets the technical features and benefits disclosed in this invention.

[0120] The terms "equal," "identical," or "equal to" disclosed in this invention must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" is defined as the angle between two line segments or lines being less than or equal to 45 degrees. "Perpendicular" is defined as the angle between two line segments or lines being within the range of [60, 120] degrees. The definition of "phase misalignment" also needs to consider the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%.

[0121] The various embodiments described in this specification are intended to be illustrative only and in no way limit the scope of the application. Changes and modifications can be made by those skilled in the art, which employ the principles of the application, without departing from the scope of the application. Accordingly, the application is not limited to the embodiments described herein, but instead has scope to encompass any choice whatsoever that is dependent on, or can be substituted in, the principal, new and inventive features that are described and claimed herein.

[0122] The foregoing description of the disclosed embodiments enables a person skilled in the art to make or use the application. Numerous modifications to these embodiments can be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A low thermal resistance inductor assembly, characterized by, The inductor assembly comprises a magnetic core and windings, the windings comprising a first winding and a second winding; the magnetic core comprising opposite upper and lower surfaces, opposite first and third side surfaces, and opposite second and fourth side surfaces, the first, second, third and fourth side surfaces being disposed between the upper and lower surfaces; The first winding and the second winding each comprise a top horizontal portion, a first vertical portion, a second vertical portion, a first bottom horizontal portion, a first pin and a second pin; the first pin and the second pin are each disposed on the bottom surface of the magnetic core; the upper surface of the top horizontal portion is exposed on the upper surface of the magnetic core; the top ends of the first vertical portion and the second vertical portion are connected to the two ends of the top horizontal portion, respectively; the bottom end of the first vertical portion is connected to one end of the first bottom horizontal portion; the lower surface of the first bottom horizontal portion is exposed on the lower surface of the magnetic core; the first vertical portion is disposed adjacent to the first pin; the second vertical portion is disposed adjacent to the second pin.

2. The inductive component of claim 1, wherein, One side surface of the second vertical portion is exposed on a side surface of the magnetic core.

3. The inductive component of claim 1, wherein, The first bottom horizontal portion extends from the first vertical portion to the side surface of the magnetic core away from the second vertical portion.

4. The inductive component of claim 3, wherein, The inductor assembly further comprises a third vertical portion, the top end of the third vertical portion being connected to the other end of the first bottom horizontal portion; the first pin is disposed on the bottom end of the third vertical portion.

5. The inductive component of claim 1, wherein, The first pin is disposed on the lower surface of the first bottom horizontal portion.

6. The inductive component of claim 5, wherein, The first bottom horizontal portion extends from the first vertical portion to the second vertical portion.

7. The inductive component of claim 1, wherein, The second pin is disposed on the bottom end of the second vertical portion.

8. The inductive component of claim 1, wherein, The inductor assembly further comprises a second bottom horizontal portion; one end of the second bottom horizontal portion is connected to the bottom end of the second vertical portion; the second bottom horizontal portion extends from the second vertical portion in a direction away from the first vertical portion; the second pin is disposed on the lower surface of the second bottom horizontal portion.

9. The inductive component of claim 1, wherein, The inductor assembly further comprises a second bottom horizontal portion and a fourth vertical portion; one end of the second bottom horizontal portion is connected to the bottom end of the second vertical portion; the other end of the second bottom horizontal portion is connected to the top end of the fourth vertical portion; the second pin is disposed on the bottom end of the fourth vertical portion.

10. The inductive component of claim 2, wherein, The second vertical portion of the first winding is connected to the second vertical portion of the second winding, or the top horizontal portion of the first winding, the second vertical portion of the first winding, the top horizontal portion of the second winding and the second vertical portion of the second winding are connected.

11. The inductive component of claim 1, wherein, The inductor assembly further comprises a heat dissipation assembly, the heat dissipation assembly being "C"-shaped and covering part of the top surface, part of the side surface and part of the bottom surface of the magnetic core; the heat dissipation assembly is made of metal material.

12. The inductive component of claim 1, wherein, The first winding comprises a first notch, the first notch being disposed on the bottom surface of the top horizontal portion of the first winding; the second winding comprises a second notch, the second notch being disposed on the top surface of the top horizontal portion of the second winding; the first winding and the second winding are cross-disposed by mechanical engagement of the first notch and the second notch.

13. The inductive component of claim 8, wherein, The first winding includes a first notch arranged at the joint between the first bottom horizontal part and the first vertical part of the first winding; the second winding includes a second notch arranged at the joint between the second bottom horizontal part and the second vertical part of the second winding; the first winding and the second winding are arranged in cross through the mechanical engagement between the first notch and the second bottom horizontal part of the second winding, and the mechanical engagement between the second notch and the first bottom horizontal part of the first winding.

14. The inductive component of claim 1, wherein, The first pins of the two windings are arranged adjacent to the same side of the magnetic core; the second pins of the two windings are arranged adjacent to the other side of the magnetic core.

15. The inductive component of claim 1, wherein, The bottom ends of the first pins and the second pins are flush with the bottom surface of the magnetic core; or the bottom ends of the first pins and the second pins protrude from the bottom surface of the magnetic core; or the bottom end of the first pin is flush with the bottom surface of the magnetic core, and the bottom end of the second pin protrudes from the bottom surface of the magnetic core.

16. The inductive component of claim 1, wherein, The inductor assembly further includes a first auxiliary winding and a second auxiliary winding; the first auxiliary winding is arranged adjacent to the first winding; the second auxiliary winding is arranged adjacent to the second winding; the auxiliary windings each include a top horizontal part, a first vertical part and a second vertical part; the top horizontal part, the first vertical part and the second vertical part of the auxiliary windings are identical in shape to the top horizontal part, the first vertical part and the second vertical part of the first winding / second winding.

17. The inductive component of claim 1, wherein, The inductor assembly is integrally compression molded from a magnetic powder material and the windings.

18. The inductive component of claim 1, wherein, The magnetic core includes a first magnetic core, a second magnetic core and a third magnetic core; the third magnetic core is arranged between the first winding and the second winding; the first magnetic core and the third magnetic core are respectively arranged on opposite sides of the first winding; the second magnetic core and the third magnetic core are respectively arranged on opposite sides of the second winding.

19. The inductive component of claim 18, wherein, A middle column and a side column are arranged on the first winding; the first magnetic core and the second magnetic core are made of a magnetic material with high magnetic permeability; the third magnetic core is made of a magnetic material with low magnetic permeability.

20. A voltage regulating module having low thermal resistance, comprising: A bottom assembly and the inductor assembly of claim 1 are included; the bottom assembly includes a bottom substrate, a first IPM unit and a second IPM unit; the IPM units are arranged on the upper surface of the bottom substrate or embedded in the bottom substrate; the IPM units include a high-side switch tube, a low-side switch tube and a SW pin, the high-side switch tube and the low-side switch tube are electrically connected to the SW pin; The inductor is arranged on the upper surface of the bottom substrate and above the IPM units; the lower surface of the bottom substrate is used to be fixed and electrically connected with external components; the second pin is electrically connected with the bottom substrate, the first pin of the first winding is electrically connected with the first IPM unit, and the first pin of the second winding is electrically connected with the second IPM unit.

21. The voltage regulation module of claim 20, wherein, The top horizontal part is thermally connected with a heat dissipation device arranged on the top surface of the magnetic core.

22. The voltage regulation module of claim 20, wherein, An input capacitor and other passive elements are further included, which are arranged on the upper surface of the bottom substrate; the IPM units include a first IPM unit and a second IPM unit, and the input capacitor is arranged between the first IPM unit and the second IPM unit.

23. The voltage regulation module of claim 22, wherein, The bottom of the magnetic core is provided with a groove for accommodating an input capacitor and other passive elements.

24. The voltage regulation module of claim 20, wherein, The bottom surface of the bottom substrate is sequentially provided with an I / O pad, a Vin+ pad, a GND pad and a Vo+ pad; the I / O pad is arranged adjacent to the first side surface of the bottom substrate.

25. The voltage regulation module of claim 20, wherein, The bottom surface of the magnetic core is in thermal connection with the upper surface of the IPM unit or the bottom substrate.

26. The voltage regulation module of claim 20, wherein, The heat dissipation assembly is made of metal material; the bottom surface of the heat dissipation assembly is in thermal connection with the upper surface of the IPM unit or the upper surface of the bottom substrate.

27. The voltage regulation module of claim 20, wherein, The lower surface of the first bottom horizontal unit is in thermal connection with the upper surface of the IPM unit.

28. The voltage regulation module of claim 27, wherein, The SW pin of the IPM unit is arranged on the top surface of the IPM unit; the lower surface of the first bottom horizontal unit is fixed and electrically connected with the SW pin.

29. The voltage regulation module of claim 27, wherein, Thermal conductive medium is applied between the upper surface of the IPM unit and the lower surface of the magnetic core and between the lower surface of the first bottom horizontal unit.

30. The voltage regulation module of claim 27, wherein, The third vertical part is connected with the other end of the first bottom horizontal part at the top end; the first pin is arranged at the bottom end of the third vertical part; the SW pin of the IPM unit is electrically connected with the first pin through the bottom substrate.

31. The voltage regulation module of claim 27, wherein, The second pin is arranged at the bottom end of the second vertical part; the second pin is fixed and electrically connected with the bottom substrate.

32. The voltage regulation module of claim 27, wherein, The inductance assembly further comprises a second bottom horizontal part; one end of the second bottom horizontal part is connected with the bottom end of the second vertical part; the second bottom horizontal part extends away from the first vertical part from the second vertical part; the second pin is arranged on the lower surface of the second bottom horizontal part; the second pin is fixed, in thermal connection and electrically connected with the bottom substrate.

33. The voltage regulation module of claim 27, wherein, The inductance assembly further comprises a second bottom horizontal part and a fourth vertical part; one end of the second bottom horizontal part is connected with the bottom end of the second vertical part; the other end of the second bottom horizontal part is connected with the top end of the fourth vertical part; the second pin is arranged at the bottom end of the fourth vertical part; the lower surface of the second bottom horizontal part is in thermal connection with the upper surface of the IPM unit; the second pin is fixed and electrically connected with the bottom substrate.

34. The voltage regulation module of claim 33, wherein, The lower surface of the second bottom horizontal part and the upper surface of the IPM unit are in thermal connection through the application of thermal conductive medium.

35. The voltage regulation module of claim 20, wherein, The bottom end of the second pin and / or the first pin is fixed and electrically connected with the bottom substrate through a metal block.

36. The voltage regulation module of claim 20, wherein, The SW pin of the IPM unit is arranged adjacent to the first side surface of the bottom substrate; the first pin of the winding is arranged adjacent to the first side surface of the bottom substrate; the SW pin and the first pin are arranged close to each other and electrically connected.

37. The voltage regulation module of claim 20, wherein, The inductor assembly further comprises a first auxiliary winding and a second auxiliary winding; the first auxiliary winding is adjacent to the first winding; the second auxiliary winding is adjacent to the second winding; the auxiliary winding comprises a top horizontal part, a first vertical part and a second vertical part; the top horizontal part, the first vertical part and the second vertical part of the auxiliary winding are identical in shape to the top horizontal part, the first vertical part and the second vertical part of the first winding / second winding; the two auxiliary windings in the same voltage regulation module are connected in series through a bottom substrate, and corresponding functional expansion pins are arranged on the lower surface of the bottom substrate.

38. The voltage regulation module of claim 20, wherein, The first winding and the second winding are both provided with a notch, and the two windings are arranged in cross through mechanical engagement of the notch.

39. A voltage regulating module having low thermal resistance, comprising: The IPM unit, the input capacitor, other passive elements and the inductor assembly as claimed in claim 1; the IPM unit, the input capacitor, other passive elements and the inductor assembly are arranged on a bottom substrate or a system mainboard; the IPM unit and the inductor assembly are horizontally arranged on the same surface of the bottom substrate or the system mainboard. The IPM unit is arranged on the upper surface of the bottom substrate; the IPM unit comprises a high-side switch tube, a low-side switch tube and a SW pin, and the high-side switch tube and the low-side switch tube are electrically connected to the SW pin. The inductor is arranged on the upper surface of the bottom substrate and is horizontally placed with the IPM unit; the second pin is electrically connected to the bottom substrate; the first pin of the first winding is arranged adjacent to and electrically connected to the SW pin of the first IPM unit; the first pin of the second winding is arranged adjacent to and electrically connected to the SW pin of the second IPM unit.

40. The voltage regulation module of claim 39, wherein, The lower surface of the bottom substrate is provided with voltage regulation module pins for fixing and electrically connecting with external components.

41. The voltage regulation module of claim 40, wherein, The bottom substrate is a system mainboard, and the IPM unit and the inductor assembly are electrically connected through the system mainboard.

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