Method for obliquely cleaning semiconductor chip
The semiconductor chip tilting cleaning method uses tilting fixtures and fluid nozzles to clean the gap between the chip and the substrate, solving the problems of uneven cleaning and high material consumption in traditional cleaning technologies. It achieves efficient and uniform cleaning results and is suitable for various chip types.
Patent Information
- Application Number
- CN202410548805.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2025-11-07
AI Technical Summary
Existing cleaning technologies are ineffective at removing minute contaminants from the surface of semiconductor chips and between the substrate. Furthermore, traditional methods are harmful to the environment or damage the chips, have uneven cleaning results, and are costly in terms of consumables.
A semiconductor chip tilting cleaning method is adopted, which uses a tilting fixture and a fluid nozzle to clean the gap between the chip and the substrate. By adjusting the tilting angle of the fixture and the movement of the nozzle, it is ensured that the cleaning fluid covers all cleaning areas. A detachable nozzle and appropriate pressure control are used.
It improves cleaning efficiency and effectiveness, reduces consumable usage, lowers costs, enhances cleaning uniformity and depth, is suitable for chips of different sizes and types, and reduces the risk of contaminant residue.
Smart Images
Figure CN120914083A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductors, and in particular to a method for semiconductor chip inclined cleaning applied in a conveying device to achieve cleaning operation when a chip is transferred from one process to another. BACKGROUND
[0002] In the process of microelectronic manufacturing, the cleaning of semiconductor chips is a crucial step. With the advancement of semiconductor technology, especially the continuous reduction of feature size of integrated circuits (ICs), the requirement for chip surface cleanliness is increasingly high. Any tiny contaminants can cause performance degradation of the chip, or even product failure. Therefore, developing an effective, reliable and economical cleaning technology is an important research direction for the semiconductor manufacturing industry.
[0003] Traditional cleaning methods, such as wet cleaning, use various chemical solvents and water to clean the chip. Although it can effectively remove various impurities on the chip, the wet cleaning method usually involves a large amount of chemical solvents, which are harmful to the environment. In addition, when cleaning extremely small chip structures, wet cleaning may not be precise enough to remove all tiny particles and contaminants, resulting in easy damage or performance degradation of the chip.
[0004] Another cleaning technology is dry cleaning, such as plasma cleaning, which uses active species generated by plasma to remove surface contaminants. This method has less impact on the environment than wet cleaning, but it may cause damage to the chip surface and is not sufficient to remove all types of contaminants, especially when the contaminants are firmly attached to the chip surface, the removal effect is limited.
[0005] Another cleaning technology is spin cleaning, which uses centrifugal force to remove liquid or water on the chip. However, the cleaning effect is not uniform in different parts of the chip, especially near the center of the chip, where the centrifugal force is weakened, resulting in poor cleaning effect in this area. In addition, high-speed rotation is required to achieve effective cleaning, which increases the dissipation of the liquid, thereby prolonging the cleaning time and increasing the cost of consumables.
[0006] Therefore, the purpose of the present application is to overcome the above problems and create a semiconductor chip inclined cleaning method that tilts the jig and substrate during cleaning to effectively clean the gap between the chip and the substrate, thereby improving the cleaning efficiency and effect, and providing a more efficient and comprehensive cleaning solution for the semiconductor manufacturing industry. SUMMARY
[0007] To solve the above problems and achieve the purpose of the present application, the technical means of the present application is realized as follows: a semiconductor chip inclined cleaning method, a semiconductor chip inclined cleaning method for cleaning a to-be-cleaned object placed on a conveying belt and transported by a jig, the jig having at least one cleaning area, the to-be-cleaned object including at least one substrate and at least one chip, the to-be-cleaned object being arranged in the cleaning area, and a gap being formed between the chip and the substrate, the method comprising the following steps: step one: the jig is inclined downward toward one side of the conveying belt conveying direction; step two: at least two nozzles are arranged to be aligned with the gap of the chip in the cleaning area; step three: the nozzles are synchronously moved along the arrangement direction of the chip to clean the gap; step four: after cleaning the gap of the chip, if there is no adjacent cleaning area, the cleaning is ended, if there is an adjacent cleaning area, the nozzles are synchronously moved to the adjacent cleaning area and are aligned with the gap of the chip in the cleaning area; step five: steps two and three are repeated until all the gaps of the chips are cleaned; and step six: after the execution of step five is completed, the jig is restored to a horizontal state, and then the jig is inclined downward away from the side of the conveying belt conveying direction, and steps two to five are repeated until all the gaps of the chips are cleaned again; the nozzles in each step are fluid nozzles.
[0008] Further, in the above technical solution, the angle of inclination of the jig in steps one and six is 20 to 70 degrees.
[0009] Further, in the above technical solution, the cleaning times in step three can be one-way cleaning or multiple back-and-forth cleaning.
[0010] Further, in the above technical solution, the pressure of the nozzles is 5 to 125 kgf / cm 2 .
[0011] Further, in the above technical solution, the nozzles can be inclined to adjust the angle in the direction of the gap; the angle of the nozzles is 20 to 90 degrees.
[0012] Further, in the above technical solution, the nozzles are detachable for replacement or adjustment.
[0013] Further, in the above technical solution, the chip is positioned on the substrate with flux.
[0014] If the above technical solution of the present application is adopted, compared with the prior art, the following benefits are achieved:
[0015] The first point: by implementing steps one and six, the inclined tool can more effectively guide the cleaning liquid to the narrow gap between the chip and the substrate, ensuring that the cleaning liquid can cover all the cleaning areas that need to be cleaned, so that the gap of each chip can be uniformly and thoroughly cleaned, thereby improving the cleaning effect.
[0016] The second point: in the present application, a fluid nozzle is used for cleaning, which can more evenly distribute the cleaning liquid, especially in the narrow gap of the chip, improving the uniformity, depth and quality of cleaning, to reduce the risk of residual pollutants.
[0017] The third point: by implementing steps one and six, the inclined tool can reduce the amount of cleaning liquid and other consumables, thereby achieving the effect of reducing waste and reducing costs.
[0018] The fourth point: the semiconductor chip inclined cleaning method of the present application is suitable for chips of different sizes and types, so it has high adaptability and can be widely used in various semiconductor manufacturing processes to achieve strong adaptability. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a partial plan view of the present application.
[0020] Figure 2 is a flowchart of the present application.
[0021] Figure 3 is a schematic diagram of a single row of chips in the cleaning area of the present application.
[0022] Figure 4 and Figure 5 is a schematic diagram of the inclined tool and the implementation action of single row chip cleaning of the present application.
[0023] Figure 6 and Figure 7 is a schematic diagram of the inclined tool and the implementation action of multiple row chip cleaning of the present application.
[0024] Figure 8 is a schematic diagram of multiple rows of chips in the cleaning area of the present application.
[0025] Figure 9 is a schematic diagram of the implementation action of the nozzle angle adjustment of the present application.
[0026] The figures are marked as follows:
[0027] 1 Step one 30 to be sprayed
[0028] 2 Step two 301 substrate
[0029] 3 Step three 302 chip
[0030] 4. Step Four 303 Gap
[0031] Step 5, 40 spray nozzles
[0032] Step 6: 50g of flux
[0033] 10 conveyor belts, 60 clean areas
[0034] 20 fixture a angle Detailed Implementation
[0035] The present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0036] like Figures 1 to 7 As shown in the figure, a method for tilting and cleaning semiconductor chips is disclosed for cleaning a workpiece 30 to be cleaned, which is placed on a conveyor belt 10 and transported by a fixture 20. The fixture 20 has at least one cleaning area 60. The workpiece 30 to be cleaned includes at least one substrate 301 and at least one chip 302. The workpiece 30 is disposed within the cleaning area 60, and a gap 303 is formed between the chip 302 and the substrate 301. The method includes the following steps: Step 1: The fixture 20 is tilted downward toward the side of the conveyor belt 10 in the conveying direction; Step 2: At least two nozzles 40 are respectively aligned with the gap 303 of the chip 302 within the cleaning area 60; Step 3: The nozzles 40 are sprayed along the gap 303 of the chip 302. The arrangement direction is synchronized and the gaps 303 are cleaned; Step 4: After cleaning the gaps 303 of the aforementioned chips 302, if there is no adjacent cleaning area 60, the cleaning ends; if there is an adjacent cleaning area 60, the aforementioned nozzle 40 moves synchronously to the adjacent cleaning area 60 and is respectively aligned with the gaps 303 of the chips 302 in this cleaning area 60; Step 5: Repeat Step 2 and Step 3 until all the gaps 303 of the chips 302 are cleaned; and Step 6: After the aforementioned Step 5 is completed, let the fixture 20 return to a horizontal state, and then let the side of the fixture 20 away from the conveyor belt 10 tilt downwards, repeating Step 2 to Step 5 until all the gaps 303 of the chips 302 are cleaned again;
[0037] The nozzle 40 in the aforementioned steps is a fluid nozzle; in the aforementioned steps 1 and 6, the angle of inclination of the fixture 20 is 20 to 70 degrees.
[0038] By tilting the jig 20 in the step one 1 and the step six 6, the cleaning liquid can be more effectively guided to the narrow gap 303 between the chip 302 and the substrate 301, so as to ensure that the cleaning liquid can cover all the cleaning areas 60 that need to be cleaned, and each gap 303 of each chip 302 can be uniformly and thoroughly cleaned, thereby improving the cleaning effect; in addition, by tilting the jig 20 in the step one 1 and the step six 6, the use amount of the cleaning liquid and other consumables can be reduced, thereby achieving the effects of reducing waste and reducing cost.
[0039] Secondly, by using a fluid nozzle for cleaning through the nozzle 40, the cleaning liquid can be more uniformly distributed, especially in the narrow gap 303 of the chip 302, thereby improving the uniformity, depth and quality of cleaning, and reducing the risk of residual pollutants.
[0040] Furthermore, the semiconductor chip inclined cleaning method of the present application is suitable for chips 302 of different sizes and types, and therefore has high adaptability and can be widely applied to various semiconductor manufacturing processes, thereby achieving the effect of strong adaptability.
[0041] It should be particularly noted that the process of the semiconductor chip inclined cleaning method of the present application is as follows: first, the jig 20 is tilted towards one side of the conveying direction of the conveying belt 10; then, at least two nozzles 40 are set to accurately align the gaps 303 of the chips 302 in the cleaning area 60, so as to ensure that each gap 303 can be effectively cleaned; then, the aforementioned nozzles 40 are synchronously moved along the arrangement direction of the chips 302, and the aforementioned gaps 303 are uniformly and comprehensively cleaned to remove accumulated dust and pollutants; then, after the gaps 303 of the chips 302 in the aforementioned cleaning area 60 are cleaned, it is checked whether there is an adjacent cleaning area 60, if not, the cleaning process is ended, if yes, the nozzles 40 are synchronously moved to the adjacent cleaning area 60, and the gaps 303 of the chips 302 are aligned; then, the step two 2 and the step three 3 are repeated until the gaps 303 of the chips 302 in all the cleaning areas 60 are thoroughly cleaned; finally, after the step five 5 is completed, the jig 20 is restored to a horizontal state, and then the jig 20 is tilted away from the conveying direction of the conveying belt 10, and the steps two 2 to five 5 are repeated until all the gaps 303 of the chips 302 are cleaned again.
[0042] In the above, the pressure of the nozzle 40 is 5 to 125 kgf / cm 2 . Therefore, in this pressure range, the nozzle 40 can generate sufficient force to remove dirt and residues, and has the effect of efficiently cleaning in small gaps or hard-to-reach areas.
[0043] Secondly, the pressure of the spray head 40 can be adjusted according to the degree of contamination of the chip 302 and the type of the chip 302, that is, a lower pressure can be used for slight contamination, while the pressure can be increased for stubborn contamination, so as to achieve the effect of adapting to different degrees of contamination.
[0044] Furthermore, by controlling the pressure not to exceed 125 kgf / cm 2 Excessive damage to the chip 302 during the cleaning process can be avoided, especially when dealing with chips 302 that are more fragile or have fine structures, so as to reduce the risk of damage.
[0045] In addition, appropriate pressure can ensure that the cleaning liquid is evenly distributed in all gaps 303 of the chip 302, even in narrow or irregular spaces, so as to improve the uniformity and depth of cleaning.
[0046] In the above, the spray head 40 is detachable, so as to facilitate replacement or adjustment. In this way, the cleaning and maintenance of the spray head 40 become easier, so as to ensure the efficient operation of the spray head 40. In addition, when the spray head 40 fails, the spray head 40 can be replaced individually instead of the entire system, thereby reducing maintenance costs and downtime.
[0047] Secondly, the spray head 40 is detachable, which also allows the operator to quickly replace different types or sizes of spray heads 40 to adapt to different cleaning needs or clean different sizes, shapes or materials of chips 302, so as to achieve the effect of flexible adjustment. Since the spray head 40 can be replaced or adjusted according to needs, the cleaning process can always be carried out in the best state, thereby improving the cleaning effect.
[0048] In the above, the chip 302 is positioned on the substrate 301 with the flux 50.
[0049] Through the use of the flux 50, not only the bonding strength between the chip 302 and the substrate 301 is enhanced, but also the correct position of the chip 302 during manufacturing is ensured, so as to improve the assembly accuracy.
[0050] Secondly, the flux 50 has good thermal conductivity, which can effectively and uniformly transfer heat to each welding area when heated, helping to ensure uniform heat distribution during welding and prevent welding defects caused by uneven heat distribution. In addition, the flux 50 contains chemical components that can react and dissolve oxides on the surface of the chip 302, so as to reduce the generation of residues during welding, thereby reducing the need for subsequent cleaning, saving time and resources, helping to speed up production and improve overall production efficiency.
[0051] As Figures 4 to 7As shown, the cleaning times of the step three 3 can be: one-way cleaning (see Figure 4 and Figure 5 ) or multiple back-and-forth cleanings (see Figure 6 and Figure 7 ). In this way, one-way cleaning or multiple back-and-forth cleanings can be selected according to different types of contaminants and specific needs of the chips 302, thereby increasing the flexibility of cleaning, for example, for light or general pollution, one-way cleaning can be sufficient, and for more stubborn or severe pollution, multiple back-and-forth cleanings can provide more thorough cleaning.
[0052] In addition, selecting the most suitable cleaning times helps to reduce the risk of damage to the chips 302 during cleaning, thereby effectively reducing the possibility of damage to the chips 302.
[0053] As shown in Figure 8 , for simultaneous cleaning of multiple rows of chips 302 in the cleaning area 60 of the present application, by moving the two or more spray heads 40 along the arrangement direction of the multiple rows of chips 302, multiple chips 302 in the cleaning area 60 can be cleaned simultaneously, thereby improving cleaning efficiency.
[0054] As shown in Figure 9 , the spray head 40 can be adjusted in angle towards the gap 303; the angle a of the spray head 40 is 20 to 90 degrees.
[0055] Among them, by adjusting the inclination angle of the spray head 40, the coverage of the cleaning liquid on the surface of the chip 302 can be expanded, thereby enhancing the coverage of the cleaning, in addition, the spray angle of the spray head 40 can be accurately controlled, directly aiming at the contaminated area on the chip 302 for cleaning, thereby improving the cleaning efficiency and reducing the cleaning time, so as to achieve the effect of saving resources and saving cost.
[0056] The above is an embodiment of the present application, which is not intended to limit the scope of the present application, and any equivalent changes or modifications made in accordance with the structure, features and principles described in the patent application range of the present application shall be included in the patent application range of the present application.
Claims
1. A method for slantwise cleaning of a semiconductor chip, characterized in that A method for cleaning a plurality of substrates (301) and a plurality of chips (302) on a plurality of substrates (301) in a plurality of cleaning areas (60) of a plurality of jigs (20) on a plurality of conveyors (10), the method comprising the steps of: Step 1 (1): tilting the plurality of jigs (20) toward a side of the plurality of conveyors (10) in a conveying direction of the plurality of conveyors (10); Step 2 (2): setting a plurality of nozzles (40) to be aligned with a plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301) in the plurality of cleaning areas (60); Step 3 (3): moving the plurality of nozzles (40) along a direction of arrangement of the plurality of chips (302) to clean the plurality of gaps (303); Step 4 (4): after cleaning the plurality of gaps (303) of the plurality of chips (302), if there is no adjacent cleaning area (60), ending the cleaning, if there is an adjacent cleaning area (60), moving the plurality of nozzles (40) to the adjacent cleaning area (60) and aligning the plurality of nozzles (40) with the plurality of gaps (303) in the adjacent cleaning area (60); Step 5 (5): repeating Step 2 (2) and Step 3 (3) until all the plurality of gaps (303) of the plurality of chips (302) are cleaned; and Step 6 (6): after Step 5 (5) is completed, tilting the plurality of jigs (20) toward a side of the plurality of conveyors (10) away from the conveying direction of the plurality of conveyors (10), repeating Step 2 (2) to Step 5 (5) until all the plurality of gaps (303) of the plurality of chips (302) are cleaned again. The plurality of nozzles (40) in each of the steps are fluid nozzles.
2. The method for slantwise cleaning of a semiconductor chip as claimed in claim 1, wherein In Step 1 (1) and Step 6 (6), the plurality of jigs (20) are tilted at an angle of 20 to 70 degrees.
3. The method for slantwise cleaning of a semiconductor chip as claimed in claim 1, wherein The plurality of nozzles (40) can be tilted at an angle toward the plurality of gaps (303).
4. The method for slantwise cleaning of a semiconductor chip as claimed in claim 1, wherein The pressure of the spray head (40) is 5 to 125 kgf / cm 2 .
5. The method for slantwise cleaning of a semiconductor chip as recited in claim 4, wherein The angle (a) of the plurality of nozzles (40) is 20 to 90 degrees. The plurality of nozzles (40) are detachable for replacement or adjustment.
6. The method for slantwise cleaning of a semiconductor chip as recited in claim 5, wherein, The plurality of chips (302) are positioned on the plurality of substrates (301) with flux (50).
7. The method for slantwise cleaning of a semiconductor chip as recited in claim 1, wherein The plurality of chips (302) are positioned on the plurality of substrates (301) with flux (50).