Method for obliquely cleaning semiconductor chip

The semiconductor chip tilting cleaning method uses tilting fixtures and fluid nozzles to clean the gap between the chip and the substrate, solving the problems of uneven cleaning and high material consumption in traditional cleaning technologies. It achieves efficient and uniform cleaning results and is suitable for various chip types.

CN120914083APending Publication Date: 2025-11-07SUZHOU XINTI SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202410548805.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-05-06
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing cleaning technologies are ineffective at removing minute contaminants from the surface of semiconductor chips and between the substrate. Furthermore, traditional methods are harmful to the environment or damage the chips, have uneven cleaning results, and are costly in terms of consumables.

Method used

A semiconductor chip tilting cleaning method is adopted, which uses a tilting fixture and a fluid nozzle to clean the gap between the chip and the substrate. By adjusting the tilting angle of the fixture and the movement of the nozzle, it is ensured that the cleaning fluid covers all cleaning areas. A detachable nozzle and appropriate pressure control are used.

Benefits of technology

It improves cleaning efficiency and effectiveness, reduces consumable usage, lowers costs, enhances cleaning uniformity and depth, is suitable for chips of different sizes and types, and reduces the risk of contaminant residue.

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Abstract

The invention provides a method for obliquely cleaning a semiconductor chip. The method comprises the following steps that 1, one side, facing the conveying direction of a conveying belt, of a jig inclines downwards; 2, at least two nozzles are aligned with gaps of the chips in the cleaning area; step 3, cleaning the gaps by a nozzle along the arrangement direction of the chips; 4, after cleaning is completed, if no adjacent cleaning area exists, cleaning is ended, and if the adjacent cleaning area exists, the spray head synchronously moves to the adjacent cleaning area and is aligned with gaps of the chips in the cleaning area; 5, repeating the step 2 and the step 3 until the gaps of all the chips are cleaned; and step 6, the jig is recovered to the horizontal state, the side, away from the conveying direction of the conveying belt, of the jig is made to incline downwards, and the step 2 to the step 5 are repeated until gaps of all the chips are cleaned again. The nozzle in each step is a fluid nozzle, the gap between the chip and the substrate is effectively cleaned, and the cleaning efficiency and effect are improved.
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