Chip pressure sintering furnace

Abstract

The invention relates to the technical field of chip processing equipment, and provides a chip pressure sintering furnace which comprises a hydraulic assembly, a lifting mechanism, a jig frame, a lower cavity assembly and an upper cavity assembly. The lower cavity assembly is arranged on a bottom plate of the hydraulic assembly, the upper cavity assembly is arranged on a middle plate of the hydraulic assembly, a vacuum cavity is formed by the upper cavity assembly and the lower cavity assembly, the lifting mechanism is arranged below the lower cavity assembly, and the lower cavity assembly is arranged below the lifting mechanism. The jig frame is arranged on the lower pressing head and arranged on the upper portion of the lifting mechanism, and the lifting mechanism lifts the jig frame.

Description

Technical Field

[0001] This invention relates to the field of chip processing equipment technology, and in particular to a chip pressure sintering furnace. Background Technology

[0002] Currently, most methods for hot-pressing nano-silver or nano-copper used in chip hot-pressing are either integral or split-type pressing (distributed on the same plane). The workpiece is placed on the lower pressing platform, and the workpiece located between the two pressing heads is pressed together by the mutual approaching and moving away of the two pressing heads. Existing pressing equipment is prone to uneven sintering or deformation due to positional misalignment. Summary of the Invention

[0004] This invention provides a chip pressure sintering furnace to solve the problem of uneven sintering or deformation caused by positional misalignment in existing pressing equipment.

[0005] A chip pressure sintering furnace includes a hydraulic assembly, a lifting mechanism, a fixture frame, a lower cavity assembly, and an upper cavity assembly. The lower cavity assembly is disposed on the base plate of the hydraulic assembly, and the upper cavity assembly is disposed on the middle plate of the hydraulic assembly. The upper cavity assembly and the lower cavity assembly form a vacuum cavity. The lifting mechanism is disposed below the lower cavity assembly, and the fixture frame is disposed on the lower pressure head and above the lifting mechanism. The lifting mechanism lifts and lowers the fixture frame.

[0006] According to the chip pressure sintering furnace of the present invention, the lifting mechanism includes a lifting drive mechanism, a lifting fixed plate, a lifting guide column, a lifting column, an elastic element, and a lifting column head; one end of the lifting column is arranged around the lifting fixed plate, the other end of the lifting column head is provided with the fixture frame, the lifting column head is provided with the elastic element, the lifting fixed plate is symmetrically arranged with the lifting guide columns, and the lifting drive mechanism drives the lifting fixed plate to move up and down.

[0007] The chip pressure sintering furnace according to the present invention further includes a cooling plate assembly, wherein the cooling plate assembly is disposed on the side of the lower cavity assembly.

[0008] According to the chip pressure sintering furnace of the present invention, the cooling plate assembly includes a cooling plate, a cooling drive mechanism, a guide rail, a drive rod, a cooling drive fixing plate, and a slider; the cooling plate is disposed inside the lower cavity assembly, the drive rod drives the cooling plate to extend and retract, the slider is disposed on the guide rail, the cooling drive fixing plate is disposed on the slider, the cooling drive mechanism is disposed on the upper part of the cooling drive fixing plate, and the drive rod is disposed on the lower part of the cooling drive fixing plate.

[0009] According to the chip pressure sintering furnace of the present invention, the upper cavity assembly includes an upper cavity frame, a bellows, positioning pins, a limiting mechanism, a connecting plate, and an upper pressure head; the connecting plate is disposed below the middle plate of the hydraulic assembly, the connecting plate is disposed above the upper cavity frame, the upper pressure head is disposed inside the upper cavity frame, the positioning pins are disposed around the lower part of the upper pressure head, the bellows is disposed below the connecting plate, and the limiting mechanism is disposed on the side of the upper cavity frame.

[0010] According to the chip pressure sintering furnace of the present invention, the hydraulic assembly further includes a hydraulic cylinder, an upper plate, a guide column, and a bottom plate; the upper plate is disposed above the middle plate of the hydraulic assembly, the bottom plate is disposed below the middle plate, the upper plate is disposed above the guide column, the bottom plate is disposed below the guide column, the middle plate is disposed in the middle of the guide column, the middle plate moves up and down along the guide column, and the hydraulic cylinder is disposed above the upper plate.

[0011] The chip pressure sintering furnace according to the present invention further includes a displacement sensor, which is disposed above the hydraulic cylinder.

[0012] The chip pressure sintering furnace according to the present invention further includes a pressure sensor, which is disposed above the middle plate.

[0013] According to the chip pressure sintering furnace of the present invention, the lower cavity assembly includes a lower cavity frame, a lower pressure head, and a vacuum pumping mechanism; the lower pressure head is disposed inside the lower cavity frame, and the vacuum pumping mechanism is disposed on the side of the lower cavity frame.

[0014] The chip pressure sintering furnace according to the present invention further includes an upper heating tube and a lower heating tube; the upper heating tube is disposed inside the upper cavity assembly, and the lower heating tube is disposed inside the lower cavity assembly.

[0015] The present invention has the following advantages: 1. The lifting mechanism keeps the workpiece in the fixture frame horizontal and stable in the furnace, and works with the pressure assembly to achieve uniform pressure and heating, avoiding uneven sintering or deformation caused by positional deviation.

[0016] 2. The telescopic cooling plate can be quickly deployed and placed close to the workpiece surface to achieve rapid and uniform cooling through contact cooling, reducing thermal stress caused by uneven cooling and improving the performance stability of the workpiece.

[0017] 3. During the sintering process, the lifting mechanism can finely adjust the position of the workpiece to ensure that it is always in the optimal stability and pressure range.

[0018] 4. The cooling plate retracts when not in use to avoid accidental contact with high-temperature surfaces.

[0019] 5. The telescopic cooling plate can adjust the cooling area as needed, flexibly adapting to multi-variety, small-batch production.

[0020] 6. The spring installed on the lifting column head can alleviate stress fluctuations caused by stable changes or material expansion during sintering, and avoid local pressure overload caused by slight deformation of the rigid lifting column.

[0021] 7. In the event of rapid lifting or accidental collision, the spring absorbs the impact through elastic deformation, avoiding damage to precision workpieces caused by rigid contact, while also reducing mechanical wear of the lifting mechanism.

[0022] 8. Multiple locating pins are installed around the perimeter to ensure that the central axes of the upper and lower pressure heads are strictly coaxial during pressurization, avoiding uneven pressure distribution caused by eccentricity. This provides lateral support to the upper pressure head, effectively resisting the tilting moment caused by load fluctuations during pressurization. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the main structure of a chip pressure sintering furnace. Figure 2 This is a three-dimensional structural diagram of a chip pressure sintering furnace; Figure 3 This is a three-dimensional structural schematic diagram of a hydraulic component; Figure 4 A three-dimensional structural diagram of the upper cavity assembly. Figure 1 ; Figure 5 A three-dimensional structural diagram of the upper cavity assembly. Figure 2 ; Figure 6 This is a three-dimensional structural diagram of the lower cavity assembly; Figure 7 This is a three-dimensional structural schematic diagram of the lifting mechanism; Figure 8 This is a structural schematic diagram of a magnified view of part A; Figure 9 This is a three-dimensional structural schematic diagram of the cooling plate assembly; Figure 10 This is a schematic diagram of the main structure of the cooling plate assembly; Reference numerals: 1. Cable chain; 2. Hydraulic assembly; 3. Lower cavity assembly; 4. Upper cavity assembly; 21. Hydraulic cylinder; 22. Upper plate; 23. Pressure sensor; 24. Middle plate; 25. Guide column; 26. Base plate; 27. Displacement sensor; 31. Lower cavity frame; 32. Lower pressure head; 33. Lifting mechanism; 34. Cooling plate assembly; 41. Bellows; 42. Upper cavity frame; 43. Limiting mechanism; 44. Connecting plate; 45. Upper pressure head; 46. Positioning pin; 331. Lifting drive mechanism; 332. Lifting fixed plate; 333. Lifting guide column; 334. Lifting column; 335. Fixture frame; 336. Spring; 337. Lifting column head; 341. Cooling plate; 342. Cooling drive mechanism; 343. Guide rail; 344. Drive rod; 345. Cooling drive fixed plate; 347. Slider. Detailed Implementation

[0025] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0026] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0028] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] The following is combined with Figure 1-10 This invention describes a chip pressure sintering furnace, comprising a lifting mechanism 33, a hydraulic assembly 2, a fixture frame 335, a lower cavity assembly 3, an upper cavity assembly 4, and a cable chain 1. The lower cavity assembly 3 is mounted on the base plate 26 of the hydraulic assembly 2, and the upper cavity assembly 4 is mounted on the middle plate 24 of the hydraulic assembly 2. One end of the cable chain 1 is mounted on a support frame, and the other end is mounted on the side of the middle plate 24 of the hydraulic assembly 2. The middle plate 24 of the hydraulic assembly 2 can move up and down. The upper cavity assembly 4 and the lower cavity assembly 3 form a vacuum cavity. The lifting mechanism 33 is located below the lower cavity assembly 3, and the fixture frame 335 is mounted on the lower pressure head 32 and above the lifting mechanism 33. The lifting mechanism 33 lifts and lowers the fixture frame 335. The lifting mechanism 33 keeps the workpiece in the fixture frame 335 horizontal and stable within the furnace, and, in conjunction with the upper pressure head 45, achieves uniform pressure and heating, avoiding uneven sintering or deformation caused by positional displacement. In the sintering process, the lifting mechanism 33 can finely adjust the position of the workpiece to ensure that it is always in the optimal stability and pressure range.

[0031] In some embodiments, the lifting mechanism 33 includes a lifting drive mechanism 331, a lifting fixed plate 332, a lifting guide column 333, a lifting column 334, an elastic element 336, and a lifting column head 337. The elastic element 336 is preferably a spring 336. One end of the lifting column 334 is disposed around the lifting fixed plate 332, and the other end of the lifting column head 337 of the lifting column 334 is disposed of a fixture frame 335. The lifting column head 337 is provided with the elastic element 336. The lifting fixed plate 332 is symmetrically provided with the lifting guide columns 333. The lifting drive mechanism 331 drives the lifting fixed plate 332 to move up and down. The spring 336 in the lifting column head 337 can alleviate stress fluctuations caused by stable changes or material expansion during sintering, and avoid local pressure overload caused by minor deformation of the rigid lifting column. During rapid lifting or accidental collisions, the spring 336 absorbs the impact through elastic deformation, preventing damage to precision workpieces caused by rigid contact, while also reducing mechanical wear of the lifting mechanism 33.

[0032] In some embodiments, a cooling plate assembly 34 is also included, which is disposed on the side of the lower cavity assembly 3.

[0033] In some embodiments, the cooling plate assembly 34 includes a cooling plate 341, a cooling drive mechanism 342, a guide rail 343, a drive rod 344, a cooling drive fixing plate 345, and a slider 347. The cooling plate 341 is disposed inside the lower cavity assembly 3. The drive rod 344 drives the cooling plate 341 to extend and retract. The slider 347 is disposed on the guide rail 343. The cooling drive fixing plate 345 is disposed on the slider 347. The cooling drive mechanism 342 is disposed on the upper part of the cooling drive fixing plate 345, and the drive rod 344 is disposed on the lower part of the cooling drive fixing plate 345. The telescopic cooling plate 341 can be quickly extended and brought close to the workpiece surface, achieving rapid and uniform cooling through contact cooling, reducing thermal stress caused by uneven cooling, and improving the performance stability of the workpiece. The cooling plate 341 retracts when not in operation to avoid accidental contact with high-temperature surfaces. The telescopic cooling plate 341 can adjust the cooling area as needed to flexibly cope with multi-variety, small-batch production.

[0034] In some embodiments, the upper cavity assembly 4 includes an upper cavity frame 42, a bellows 41, positioning pins 46, a limiting mechanism 43, a connecting plate 44, and an upper pressure head 45. The connecting plate 44 is disposed below the middle plate 24 of the hydraulic assembly 2 and above the upper cavity frame 42. The upper pressure head 45 is disposed inside the upper cavity frame 42. Positioning pins 46 are provided around the lower part of the upper pressure head 45. The bellows 41 is disposed below the connecting plate 44. The limiting mechanism 43 is provided on the side of the upper cavity frame 42. Multiple positioning pins 46 are provided around the perimeter to ensure that the central axes of the upper pressure head 45 and the lower pressure head 32 are strictly coaxial during pressurization, avoiding uneven pressure due to eccentricity. This provides lateral support to the upper pressure head 45, effectively resisting the tilting moment caused by load fluctuations during pressurization.

[0035] In some embodiments, the hydraulic assembly 2 further includes a hydraulic cylinder 21, an upper plate 22, a guide post 25, and a bottom plate 26; the upper plate 22 is disposed above the middle plate 24, the bottom plate 26 is disposed below the middle plate 24, the upper plate 22 is disposed above the guide post 25, the bottom plate 26 is disposed below the guide post 25, the middle plate 24 is disposed in the middle of the guide post 25, the middle plate 24 moves up and down along the guide post 25, and the hydraulic cylinder 21 is disposed above the upper plate 22.

[0036] In some embodiments, a displacement sensor 27 is also included, which is disposed above the hydraulic cylinder 21.

[0037] In some embodiments, a pressure sensor 23 is also included, which is disposed above the middle plate 24.

[0038] In some embodiments, the lower cavity assembly 3 includes a lower cavity frame 31, a pressing head 32, and a vacuuming mechanism 33; the pressing head 32 is disposed inside the lower cavity frame 31, and the vacuuming mechanism 33 is disposed on the side of the lower cavity frame 31.

[0039] In some embodiments, an upper heating tube and a lower heating tube are also included; the upper heating tube is disposed inside the upper cavity assembly 4, and the lower heating tube is disposed inside the lower cavity assembly 3.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip pressure sintering furnace, characterized in that, It includes a hydraulic assembly, a lifting mechanism, a fixture frame, a lower cavity assembly, and an upper cavity assembly; the lower cavity assembly is disposed on the base plate of the hydraulic assembly, the upper cavity assembly is disposed on the middle plate of the hydraulic assembly, the upper cavity assembly and the lower cavity assembly form a vacuum cavity, the lifting mechanism is disposed below the lower cavity assembly, the fixture frame is disposed on the lower pressure head and disposed above the lifting mechanism, and the lifting mechanism lifts and lowers the fixture frame.

2. The chip pressure sintering furnace according to claim 1, characterized in that, The lifting mechanism includes a lifting drive mechanism, a lifting fixed plate, a lifting guide column, a lifting column, an elastic element, and a lifting column head; one end of the lifting column is arranged around the lifting fixed plate, the other end of the lifting column head is provided with the fixture frame, the lifting column head is provided with the elastic element, the lifting fixed plate is symmetrically arranged with the lifting guide columns, and the lifting drive mechanism drives the lifting fixed plate to move up and down.

3. The chip pressure sintering furnace according to claim 1, characterized in that, It also includes a cooling plate assembly, which is disposed on the side of the lower cavity assembly.

4. The chip pressure sintering furnace according to claim 3, characterized in that, The cooling plate assembly includes a cooling plate, a cooling drive mechanism, a guide rail, a drive rod, a cooling drive fixing plate, and a slider. The cooling plate is disposed inside the lower cavity assembly. The drive rod drives the cooling plate to extend and retract. The slider is disposed on the guide rail. The cooling drive fixing plate is disposed on the slider. The cooling drive mechanism is disposed on the upper part of the cooling drive fixing plate. The drive rod is disposed on the lower part of the cooling drive fixing plate.

5. The chip pressure sintering furnace according to claim 1, characterized in that, The upper cavity assembly includes an upper cavity frame, a bellows, positioning pins, a limiting mechanism, a connecting plate, and an upper pressure head. The connecting plate is located below the middle plate of the hydraulic assembly and above the upper cavity frame. The upper pressure head is located inside the upper cavity frame. The positioning pins are arranged around the lower part of the upper pressure head. The bellows is located below the connecting plate. The limiting mechanism is arranged on the side of the upper cavity frame.

6. The chip pressure sintering furnace according to claim 1, characterized in that, The hydraulic assembly further includes a hydraulic cylinder, an upper plate, a guide column, and a bottom plate; the upper plate is disposed above the middle plate of the hydraulic assembly, the bottom plate is disposed below the middle plate, the upper plate is disposed above the guide column, the bottom plate is disposed below the guide column, the middle plate is disposed in the middle of the guide column, the middle plate moves up and down along the guide column, and the hydraulic cylinder is disposed above the upper plate.

7. The chip pressure sintering furnace according to claim 6, characterized in that, It also includes a displacement sensor, which is installed above the hydraulic cylinder.

8. The chip pressure sintering furnace according to claim 6, characterized in that, It also includes a pressure sensor, which is disposed above the middle plate.

9. The chip pressure sintering furnace according to claim 1, characterized in that, The lower cavity assembly includes a lower cavity frame, a lower pressure head, and a vacuum pumping mechanism; the lower pressure head is disposed inside the lower cavity frame, and the vacuum pumping mechanism is disposed on the side of the lower cavity frame.

10. The chip pressure sintering furnace according to claim 1, characterized in that, It also includes an upper heating tube and a lower heating tube; the upper heating tube is disposed inside the upper cavity assembly, and the lower heating tube is disposed inside the lower cavity assembly.

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