Detection and calibration method for probe card center supporting mechanism of chip wafer testing machine

Abstract

The invention relates to the technical field of wafer testing, and particularly discloses a chip wafer testing machine probe card center supporting mechanism detection and calibration method which is based on a detection mechanism, a center supporting mechanism and a calibration mechanism. The detection mechanism comprises a panel, the panel is used for replacing a probe card when the detection mechanism detects the center supporting mechanism, a plurality of sets of displacement sensors are installed on the panel, the number of the displacement sensors is the same as that of the calibration mechanisms, and the displacement sensors are used for detecting the moving distance of all areas on the surface of the top plate when the top plate moves downwards. And a processor is mounted on the panel. Before a wafer is tested, the supporting force and the supporting effect of the central supporting mechanism are detected through the detection mechanism, and the supporting surface of the central supporting mechanism is calibrated, so that the supporting force and the size precision of the central supporting mechanism on the probe card can be effectively improved, and the testing stability and the testing precision of the probe card in the testing process are improved.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and in particular to a method for testing and calibrating the center support mechanism of a probe card in a chip wafer testing machine. Background Technology

[0002] With the rapid development of semiconductor technology, the capacity and integration of memory chips are constantly increasing, placing more stringent demands on the accuracy and stability of wafer testing. Wafer testing machines are key equipment for ensuring chip performance and yield. They perform electrical tests by contacting the pads on the wafer with probe cards. Because the probe cards required for memory chip testing are typically large, their connection and fixing mechanisms with the testing machine are mostly located at the edge of the card. During testing, the central area of ​​the probe card, lacking effective constraint, is susceptible to deformation or displacement due to its own weight and testing pressure. This can lead to poor contact between the probes and the wafer, severely affecting the accuracy and consistency of the test results.

[0003] To address this issue, the industry typically incorporates an automatic ejection support mechanism in the testing equipment, specifically targeting the central area of ​​the probe card. During testing, this mechanism presses downwards against the back of the probe card to compensate for deformation caused by the central area being suspended, ensuring the probe card remains parallel to the wafer and guaranteeing uniform and stable contact. The magnitude of the ejection force of the support mechanism and the flatness accuracy of its support surface directly determine the effectiveness of the support: insufficient ejection force results in incomplete deformation correction, while excessive ejection force may introduce new stress or damage; conversely, flatness deviations in the support surface lead to uneven distribution of support force, also affecting the overall flatness of the probe card.

[0004] However, existing central support mechanisms face significant technical bottlenecks in practical applications: First, the ejection force of the support mechanism lacks precise quantitative calibration methods and relies heavily on engineers' experience for setting, making its rationality difficult to scientifically assess and guarantee; second, there is no effective method to detect the flatness accuracy of the ejection surface of the support mechanism, making it impossible to ensure sufficient and uniform surface contact with the back of the probe card; third, due to the lack of dedicated calibration and testing tools, the actual effect of the support status (such as sufficient contact and force distribution) cannot be directly observed and quantitatively evaluated. This leads to potential risks to the flatness and long-term testing stability of the wafer testing area at the center of the probe card, which may in turn cause problems such as testing deviations, misjudgments of yield, and increased equipment maintenance costs.

[0005] Therefore, there is an urgent need to develop a specialized tool and method that can accurately calibrate and quantify the ejection force and flatness of the central support mechanism, so as to fundamentally improve the accuracy and reliability of memory chip wafer testing. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of existing technologies by providing a method for detecting and calibrating the central support mechanism of a chip wafer tester probe card. This method solves the technical problem that the ejection force and flatness of the central support mechanism cannot be quantitatively calibrated and detected, making it difficult to ensure the reasonableness of its contact state and force with the probe card.

[0007] The objective of this invention can be achieved through the following technical solutions: A method for detecting and calibrating a probe card center support mechanism of a chip wafer tester is disclosed. The calibration method is based on a detection mechanism, a center support mechanism, and a calibration mechanism. The center support mechanism is installed in a connecting seat, which is mounted on the tester via a mounting bracket. The center support mechanism includes a movable plate that is movably fitted inside the connecting seat. Several sets of support members are installed on the movable plate to confirm that the center support mechanism has tightened against the probe card. The bottom of the movable plate is connected to a top plate via several sets of calibration mechanisms to calibrate the flatness of the top plate. A through hole is provided at the bottom of the connecting seat, through which the top plate passes. An outer cover is provided at the top of the movable plate. A driving component is provided on the connecting seat to drive the outer cover to move up and down. The detection mechanism includes a panel, which replaces the probe card when the detection center support mechanism is in use. Several sets of displacement sensors are installed on the panel, and the number of displacement sensors is the same as the number of calibration mechanisms. The displacement sensors are used to detect the movement distance of each area on the surface of the top plate when the top plate moves down. A processor is installed on the panel.

[0008] As a preferred embodiment of the above technical solution, the support includes a fixed cylinder, which is fixed to the top of the movable plate. A sliding cylinder is movably installed inside the fixed cylinder, and a top rod is movably installed inside the sliding cylinder. The top rod passes through the sliding cylinder, the movable plate, and the top plate. An elastic element is connected between the top rod and the sliding cylinder. A fixed rod is provided at the top of the sliding cylinder, which passes through the fixed cylinder. An elastic element is connected between the sliding cylinder and the fixed cylinder. A baffle is provided at the top of the fixed rod. A vertical plate is provided at the top of the movable plate, and a contact sensor is installed on the vertical plate. The baffle works in conjunction with the contact sensor.

[0009] As a preferred embodiment of the above technical solution, a flange is provided at the bottom of the panel, a pressure sensor is installed on the flange, a test flange is provided on the pressure sensor, the test flange is located at the top of the panel, and the test flange is in direct contact with the top rod and the top plate.

[0010] As a preferred embodiment of the above technical solution, the calibration mechanism includes: An upper fixing block and a lower fixing block, wherein the upper fixing block is fixed to the bottom of the movable plate and the lower fixing block is fixed to the top of the top plate; A telescopic component, which is installed between the upper fixed block and the lower fixed block; An air extraction pipe is connected to an external air supply unit. The air extraction pipe is connected to a telescopic component via a connecting pipe. Air is supplied to the telescopic component through the air extraction pipe and the connecting pipe to extend the telescopic component and calibrate the top plate. A flow valve is provided on the air extraction pipe. The drive unit, contact sensor, pressure sensor, displacement sensor, suction pipe, and flow valve are all connected to the processor.

[0011] As a preferred embodiment of the above technical solution, the telescopic component includes a cylinder and a piston rod. The piston rod is sleeved inside the cylinder. The cylinder is provided with an air inlet pipe and an air outlet pipe at its top and bottom, respectively. The air inlet pipe is connected to a connecting pipe. The top of the cylinder is provided with an upper slider, which is slidably installed inside an upper fixed block. The bottom of the piston rod is provided with a lower slider, which is slidably installed inside a lower fixed block. Both the upper and lower sliders are provided with locking blocks. Both the upper and lower fixed blocks are provided with corresponding locking grooves. The top of the lower fixed block is inclined, sloping downwards from the center of the top plate towards the edge.

[0012] As a preferred embodiment of the above technical solution, the calibration mechanism further includes a vertical plate, an elastic element three, and a push plate. The vertical plate is fixed to the bottom of the movable plate, the elastic element three is fixed to the vertical plate, and the other end of the elastic element three is provided with a push plate, which elastically abuts against the surface of the cylinder.

[0013] As a preferred embodiment of the above technical solution, a bracket is provided around the connecting seat, and several mounting plates are slidably arranged on the bracket. The detection mechanism and the probe card are both mounted on the mounting plates, and the detection mechanism or the probe card can be moved to the bottom of the connecting seat by sliding the mounting plates.

[0014] As a preferred embodiment of the above technical solution, the method includes the following steps: Step S1: Preparation work, first install the detection mechanism under the connector; Step S2: Push-out force detection. The driving component causes the movable plate to move several sets of support components downward. The support components contact and squeeze the pressure sensor, first making all the contact sensors sense. Then, the support components and the top plate continue to move downward, so that the pressure sensor receives a certain appropriate force F. At this time, it is considered that the top plate provides uniform and sufficient support to the back of the probe card. Step S3: Top plate flatness detection. Several sets of displacement sensors detect the displacement of each area at the bottom of the top plate in real time. When the displacement values ​​of several sets are not equal, the top plate is tilted; otherwise, it is horizontal. Step S4: Top plate flatness calibration. The displacement detected by several sets of displacement sensors is processed by the processor to calculate the displacement deviation value. By controlling the extension of the telescopic component when the air extraction pipe in the corresponding area is evacuated, the top plate is gradually calibrated to a horizontal state.

[0015] The beneficial effects of this invention are as follows: 1. In this invention, before wafer testing, the support force and support effect of the central support mechanism are tested by the testing mechanism, and the support surface of the central support mechanism is calibrated. This can effectively improve the support force and dimensional accuracy of the central support mechanism on the probe card, thereby improving the testing stability and testing accuracy of the probe card during the testing process. 2. In this invention, when the calibration mechanism calibrates the top plate, the telescopic component extends, causing the lower slider to move along the inclined lower fixed block. This allows the telescopic component to move towards the edge of the top plate during the extension process, thereby dispersing the internal stress caused by the extension and compression of the top plate. This effectively prevents the top plate from twisting and ensures that the bottom of the top plate is flush. This ensures that the top plate provides sufficient and uniform support to the back of the probe card, thereby further improving the testing stability and accuracy of the probe card during the testing process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention from another perspective; Figure 3 This is a cross-sectional structural diagram of the testing facility and the central support structure; Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 This is a schematic diagram of the testing mechanism. Figure 6 This is a schematic diagram of the testing facility from another perspective. Figure 7 This is a schematic diagram of the cross-sectional structure of the testing facility; Figure 8 This is a schematic diagram of the calibration mechanism. Figure 9 This is a schematic diagram of the cross-sectional structure of the expansion joint.

[0017] In the picture: 1. Mounting bracket; 2. Connecting seat; 21. Perforation; 3. Bracket; 4. Mounting plate; 5. Detection mechanism; 51. Panel; 52. Flange; 53. Pressure sensor; 54. Test flange; 55. Displacement sensor; 56. Processor; 6. Central support mechanism; 61. Movable plate; 62. Outer cover; 63. Drive component; 64. Support component; 641. Fixed cylinder; 642. Sliding cylinder; 643. Top rod; 644. Elastic element one; 645. Fixed rod; 646, elastic element two; 647, baffle; 648, upright plate; 649, contact sensor; 65, top plate; 7, calibration mechanism; 71, upper fixed block; 72, lower fixed block; 73, telescopic component; 731, cylinder; 7311, upper slider; 732, piston rod; 7321, lower slider; 74, locking block; 75, suction pipe; 751, flow valve; 76, connecting pipe; 77, vertical plate; 78, elastic element three; 79, push plate. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] like Figures 1-7 As shown, a method for detecting and calibrating the central support mechanism of a probe card in a chip wafer testing machine is disclosed. The calibration method is based on a detection mechanism 5, a central support mechanism 6, and a calibration mechanism 7. The central support mechanism 6 is installed in a connecting seat 2, which is mounted on the testing machine via a mounting bracket 1. The central support mechanism 6 includes a movable plate 61, which is movably fitted inside the connecting seat 2. Several sets of support members 64 are installed on the movable plate 61. The support members 64 are used to confirm that the central support mechanism 6 has tightened the probe card. The bottom of the movable plate 61 is connected to a top plate 65 via several sets of calibration mechanisms 7. The calibration mechanisms 7 are used to calibrate the flatness of the top plate 65. A through hole 21 is provided at the bottom of the connecting seat 2, through which the top plate 65 passes. An outer cover 62 is provided at the top of the movable plate 61. A driving member 63 is provided on the connecting seat 2, which drives the outer cover 62 to move up and down. The testing mechanism 5 includes a panel 51. When the testing mechanism 5 is supported by the testing center support mechanism 6, the panel 51 replaces the probe card. Several sets of displacement sensors 55 are installed on the panel 51. The number of displacement sensors 55 is the same as the number of calibration mechanisms 7. The displacement sensors 55 are used to detect the movement distance of each area on the surface of the top plate 65 when the top plate 65 moves down. A processor 56 is installed on the panel 51.

[0020] The support member 64 includes a fixed cylinder 641, which is fixed to the top of the movable plate 61. A sliding cylinder 642 is movably installed inside the fixed cylinder 641, and a top rod 643 is movably installed inside the sliding cylinder 642. The top rod 643 passes through the sliding cylinder 642, the movable plate 61, and the top plate 65. An elastic element 644 connects the top rod 643 and the sliding cylinder 642. A fixed rod 645 is provided at the top of the sliding cylinder 642, which passes through the fixed cylinder 641. An elastic element 646 connects the sliding cylinder 642 and the fixed cylinder 641. A baffle 647 is provided at the top of the fixed rod 645. A vertical plate 648 is provided at the top of the movable plate 61. A contact sensor 649 is installed on the vertical plate 648. The baffle 647 works in conjunction with the contact sensor 649.

[0021] A flange 52 is provided at the bottom of the panel 51. A pressure sensor 53 is installed on the flange 52. A test flange 54 is provided on the pressure sensor 53. The test flange 54 is located at the top of the panel 51 and is in direct contact with the top rod 643 and the top plate 65.

[0022] In one embodiment, both elastic element 1 644 and elastic element 2 646 can be springs, wherein the elastic coefficient of elastic element 1 644 is greater than the elastic coefficient of elastic element 2 646.

[0023] In practical application, this embodiment first requires the detection mechanism 5 to detect the ejection force of the central support mechanism 6 to ensure that the ejection force of the central support mechanism 6 is sufficiently uniform. After the ejection force test is qualified, the flatness of the top plate 65 is then tested. When the top plate 65 is detected to be tilted, the flatness of the top plate 65 is calibrated by the calibration mechanism 7 to ensure that the top plate 65 remains horizontal, that is, after the probe card is installed, the top plate 65 can completely abut against the back of the probe card. For the ejection force detection, the detection mechanism 5 is installed below the connecting seat 2. Then, the drive component 63 drives the outer cover 62 to move the movable plate 61 downward. At this time, the ejector rod 643 gradually contacts the test flange 54. The ejector rod 643 and the slide cylinder 642 are squeezed and slowly moved upward, causing the fixed rod 645 to move upward with the baffle 647. When several baffles 647 contact their corresponding contact sensors 649, all several contact sensors 649 are sensed. At this time, the displacement of the central support mechanism 6 ejected is s (the displacement s corresponding to different specifications of probe cards varies). At this time, it can be considered that several ejector rods 643 will... The probe card is pressed tightly against the back, but due to various errors, this does not mean that the push rods 643 are providing sufficient support to the back of the probe card. Based on the above, the central support mechanism 6 continues to push out a displacement δ until the pressure sensor 53 reaches a certain suitable force F. At this point, it is considered that the push rods 643 are providing sufficient support to the back of the probe card. At this point, the squeezed part of the push rods 643 retracts into the slide cylinder 642, that is, the bottom end of the push rod 643 is flush with the bottom surface of the top plate 65. At this point, the top plate 65 contacts the test flange 54, that is, the top plate 65 is in full contact with the back of the probe card, thereby achieving a sufficient and uniform support effect. The flatness detection and calibration of the top plate 65: During the downward movement of the top plate 65, when the test flange 54 and pressure sensor 53 are squeezed, several sets of displacement sensors 55 detect the displacement of each area of ​​the bottom surface of the top plate 65 in real time. When the pressure on the pressure sensor 53 reaches a certain suitable force F, it is considered that the back of the probe card is fully supported. However, the top plate 65 may tilt. By detecting the deviation of several sets of displacement, it is possible to detect whether the top plate 65 is tilted. When the top plate 65 tilts, the flatness of the top plate 65 is calibrated by the calibration mechanism 7 to keep the top plate 65 in a horizontal state. Before wafer testing, the central support mechanism 6 is tested and calibrated by the testing mechanism 5. This can effectively improve the support force and dimensional accuracy of the central support mechanism 6 on the probe card, thereby improving the testing stability and accuracy of the probe card during the testing process.

[0024] like Figure 8 and Figure 9 As shown, calibration mechanism 7 includes: Upper fixing block 71 and lower fixing block 72, the upper fixing block 71 is fixed to the bottom of the movable plate 61, and the lower fixing block 72 is fixed to the top of the top plate 65; Telescopic component 73 is installed between upper fixed block 71 and lower fixed block 72; The air extraction pipe 75 is connected to the external air supply unit. The air extraction pipe 75 is connected to the telescopic member 73 through the connecting pipe 76. Air is supplied to the telescopic member 73 through the air extraction pipe 75 and the connecting pipe 76, so that the telescopic member 73 extends to calibrate the top plate 65. The air extraction pipe 75 is equipped with a flow valve 751. The drive unit 63, contact sensor 649, pressure sensor 53, displacement sensor 55, suction pipe 75 and flow valve 751 are all connected to the processor 56.

[0025] In practical application, when the displacement detected by several displacement sensors 55 has a deviation value, the air extraction pipe 75 corresponding to the small displacement area is controlled to extract air, so that compressed air enters the telescopic member 73 through the connecting pipe 76, thereby extending the telescopic member 73 and gradually calibrating the inclined top plate 65 to a horizontal state. At the start of the test, the processor 56 controls the extension of the drive component 63, thereby causing the movable plate 61 to move downward. When all the contact sensors 649 are activated, the central support mechanism 6 pushes out a displacement s. At this time, the processor 56 controls the drive component 63 to drive the central support mechanism 6 to push out another displacement δ. When the pressure sensor 53 detects a pressure of F, the drive component 63 stops working. At this time, the displacement sensor 55 detects the displacement of each area on the bottom surface of the top plate 65 and transmits the data to the processor 56. The processor 56 calculates the displacement deviation value. If the displacement deviation value is 0, it means that the top plate 65 is in a horizontal state. If the displacement deviation value is not 0, it means that the top plate 65 is in a tilted state. At this time, the processor 56 will control the air extraction pipe 75 corresponding to the small displacement area to extract air, thereby causing the telescopic component 73 at this point to extend, so that the top plate 65 is gradually calibrated to a horizontal state.

[0026] Furthermore, the telescopic component 73 includes a cylinder 731 and a piston rod 732. The piston rod 732 is fitted inside the cylinder 731. The cylinder 731 is provided with an air inlet pipe and an air outlet pipe at the top and bottom, respectively. The air inlet pipe is connected to the connecting pipe 76. The top of the cylinder 731 is provided with an upper slider 7311, which is slidably installed inside the upper fixed block 71. The bottom of the piston rod 732 is provided with a lower slider 7321, which is slidably installed inside the lower fixed block 72. Both the upper slider 7311 and the lower slider 7321 are provided with locking blocks 74. Both the upper fixed block 71 and the lower fixed block 72 are provided with corresponding locking grooves. The top of the lower fixed block 72 is inclined, and it slopes downward from the center of the top plate 65 towards the edge.

[0027] It should be noted that if the top plate 65 is tilted and its lowest point is in complete contact with the test flange 54, the pressure sensor 53 will detect pressure F. In this case, the area above the lowest point of the top plate 65 needs to be adjusted and moved downwards so that the area above the lowest point is level with the lowest point. Therefore, the lowest point of the top plate 65 remains stationary during calibration. If the top and bottom of the telescopic component 73 are both fixed, with one part of the telescopic component 73 remaining stationary while the other part extends, this will cause internal stress in the top plate 65, which may cause the top plate 65 to twist. This may result in unevenness on the bottom surface of the top plate 65 and may also lead to damage to the top plate 65 under long-term internal stress.

[0028] In practical application, several displacement sensors 55 detect the displacement of each area on the bottom surface of the top plate 65. The processor 65 uses the maximum displacement as a basis to calculate the deviation of other displacements from the maximum displacement. Then, it controls the air extraction pipe 75 of the corresponding area to extract air and controls the air intake through the flow valve 751. The air intake divided by the inner cross section of the cylinder 731 equals the deviation value. This makes the extension length of the telescopic member 73 equal to the deviation value, thereby compensating for the tilt angle of the top plate 65 and gradually calibrating the top plate 65 to a horizontal state. During the extension of the telescopic component 73, the lower slider 7321 on the piston rod 732 moves along the inclined lower fixed block 72, causing the telescopic component 73 to move towards the edge of the top plate 65 during the extension process. This disperses the internal stress caused by the extension and compression of the top plate 65, effectively preventing the top plate 65 from twisting and ensuring that the bottom of the top plate 65 is flush. This ensures that the top plate 65 provides sufficient and uniform support to the back of the probe card, thereby further improving the testing stability and accuracy of the probe card during the testing process.

[0029] Furthermore, the calibration mechanism 7 also includes a vertical plate 77, an elastic element 3 78, and a push plate 79. The vertical plate 77 is fixed to the bottom of the movable plate 61, the elastic element 3 78 is fixed on the vertical plate 77, and the other end of the elastic element 3 78 is provided with a push plate 79, which elastically abuts against the surface of the cylinder 731.

[0030] In practical application, the push plate 79, through the elastic force of the elastic element 78, always tends to push the telescopic element 73. When the telescopic element 73 extends, the push plate 79 will push the telescopic element 73 to move, thereby making the process of the telescopic element 73 moving towards the edge of the top plate 65 more smooth. This effectively avoids the telescopic element 73 getting stuck when it extends, ensuring that the top plate 65 can be calibrated smoothly, thereby further improving the testing stability and testing accuracy of the probe card during the testing process.

[0031] like Figure 1 and Figure 2 As shown, a bracket 3 is provided around the connector 2, and several mounting plates 4 are slidably arranged on the bracket 3. The detection mechanism 5 and the probe card are both installed on the mounting plates 4. The detection mechanism 5 or the probe card can be moved to the bottom of the connector 2 by sliding the mounting plates 4.

[0032] In practical applications, this embodiment involves mounting the detection mechanism 5 and the probe card on the mounting plate 4. When the central support mechanism 6 needs to be tested and calibrated, the mounting plate 4 is moved to move the detection mechanism 5 below the central support mechanism 6. When the wafer is being tested, the detection mechanism 5 is moved away, and then the probe card is moved to the rear of the central support mechanism 6 below it. This eliminates the need to frequently disassemble and reassemble the detection mechanism and probe card during testing, calibration, and testing, thereby improving the efficiency of the entire testing process.

[0033] A method for testing and calibrating the center support mechanism of a probe card in a chip wafer testing machine, the method comprising the following steps: Step S1: Preparation work, first install the detection mechanism 5 below the connecting seat 2; Step S2: Push-out force detection. The driving component 63 causes the movable plate 61 to move several sets of support components 64 downward. The support components 64 contact and press with the pressure sensor 53, first making all the contact sensors 649 sense. Then, the support components 64 and the top plate 65 continue to move downward, so that the pressure sensor 53 reaches a certain appropriate force F. At this time, it is considered that the top plate 65 provides uniform and sufficient support to the back of the probe card. Step S3: Flatness detection of top plate 65. Several sets of displacement sensors 55 detect the displacement of each area at the bottom of top plate 65 in real time. When the displacement values ​​of several sets are not equal, top plate 65 is tilted; otherwise, it is horizontal. Step S4: Flatness calibration of top plate 65. The displacement detected by several sets of displacement sensors 55 is calculated by processor 56 to obtain the displacement deviation value. By controlling the air extraction pipe 75 in the corresponding area to extract air, the telescopic component 73 extends, so that the top plate 65 is gradually calibrated to a horizontal state.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A method for detecting and calibrating the center support mechanism of a probe card in a chip wafer testing machine, characterized in that, The calibration method is based on a detection mechanism (5), a central support mechanism (6), and a calibration mechanism (7). The central support mechanism (6) is installed in a connecting seat (2), which is mounted on a testing machine via a mounting bracket (1). The central support mechanism (6) includes a movable plate (61), which is movably fitted inside the connecting seat (2). Several sets of support members (64) are installed on the movable plate (61). The support members (64) are used to confirm that the central support mechanism (6) has tightened the probe card. The bottom of the movable plate (61) is connected to the top plate (65) via several sets of calibration mechanisms (7). The calibration mechanisms (7) are used to calibrate the flatness of the top plate (65). A perforation (21) is provided at the bottom of the connecting seat (2), through which the top plate (65) passes. An outer cover (62) is provided on the top of the movable plate (61). A driving member (63) is provided on the connecting seat (2), which drives the outer cover (62) to move up and down. The detection mechanism (5) includes a panel (51). The detection mechanism (5) uses the panel (51) instead of the probe card when it is in the detection center support mechanism (6). Several sets of displacement sensors (55) are installed on the panel (51). The number of displacement sensors (55) is the same as the number of calibration mechanisms (7). The displacement sensors (55) are used to detect the movement distance of each area on the surface of the top plate (65) when the top plate (65) moves down. A processor (56) is installed on the panel (51).

2. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 1, characterized in that, The support member (64) includes a fixed cylinder (641), which is fixed to the top of the movable plate (61). A sliding cylinder (642) is movably installed inside the fixed cylinder (641). A top rod (643) is movably installed inside the sliding cylinder (642). The top rod (643) passes through the sliding cylinder (642), the movable plate (61), and the top plate (65). An elastic element (644) connects the top rod (643) and the sliding cylinder (642). 42) A fixed rod (645) is provided at the top, the fixed rod (645) passes through the fixed cylinder (641), and an elastic element (646) is connected between the sliding cylinder (642) and the fixed cylinder (641). A baffle (647) is provided at the top of the fixed rod (645), and a vertical plate (648) is provided at the top of the movable plate (61). A contact sensor (649) is installed on the vertical plate (648), and the baffle (647) and the contact sensor (649) are used in conjunction.

3. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 2, characterized in that, The bottom of the panel (51) is provided with a flange (52), a pressure sensor (53) is installed on the flange (52), a test flange (54) is provided on the pressure sensor (53), the test flange (54) is located at the top of the panel (51), and the test flange (54) is in direct contact with the top rod (643) and the top plate (65).

4. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 3, characterized in that, The calibration facility (7) includes: Upper fixing block (71) and lower fixing block (72), wherein the upper fixing block (71) is fixed to the bottom of the movable plate (61) and the lower fixing block (72) is fixed to the top of the top plate (65); Telescopic component (73), which is installed between the upper fixed block (71) and the lower fixed block (72); An air extraction pipe (75) is connected to an external air supply unit. The air extraction pipe (75) is connected to a telescopic member (73) via a connecting pipe (76). Air is supplied to the telescopic member (73) through the air extraction pipe (75) and the connecting pipe (76) to extend the top plate (65) of the telescopic member (73). A flow valve (751) is provided on the air extraction pipe (75). The drive unit (63), contact sensor (649), pressure sensor (53), displacement sensor (55), air extraction pipe (75) and flow valve (751) are all connected to the processor (56).

5. The detection and calibration method for the central support mechanism of the probe card of a chip wafer testing machine according to claim 4, characterized in that, The telescopic component (73) includes a cylinder (731) and a piston rod (732). The piston rod (732) is fitted inside the cylinder (731). The cylinder (731) is provided with an air inlet pipe and an air outlet pipe at the top and bottom, respectively. The air inlet pipe is connected to the connecting pipe (76). The top of the cylinder (731) is provided with an upper slider (7311). The upper slider (7311) is slidably installed in the upper fixed block (71). The bottom of the piston rod (732) is provided with a lower slider (7321). The lower slider (7321) is slidably installed in the lower fixed block (72). Both the upper slider (7311) and the lower slider (7321) are provided with a locking block (74). Both the upper fixed block (71) and the lower fixed block (72) are provided with corresponding locking grooves. The top of the lower fixed block (72) is inclined, and it slopes downward from the center of the top plate (65) towards the edge.

6. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 5, characterized in that, The calibration mechanism (7) also includes a vertical plate (77), an elastic element three (78) and a push plate (79). The vertical plate (77) is fixed to the bottom of the movable plate (61), the elastic element three (78) is fixed on the vertical plate (77), and the other end of the elastic element three (78) is provided with a push plate (79). The push plate (79) elastically abuts against the surface of the cylinder (731).

7. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 1, characterized in that, The connecting seat (2) is provided with a bracket (3) on its periphery. Several mounting plates (4) are slidably arranged on the bracket (3). The detection mechanism (5) and the probe card are both installed on the mounting plate (4). The detection mechanism (5) or the probe card can be moved to the bottom of the connecting seat (2) by sliding the mounting plate (4).

8. The detection and calibration method for the central support mechanism of the probe card of a chip wafer testing machine according to any one of claims 1-7, characterized in that, The method includes the following steps: Step S1: Preparation work, first install the detection mechanism (5) below the connecting seat (2); Step S2: Push-out force detection. The driving component (63) causes the movable plate (61) to move several sets of support components (64) downward. The support components (64) contact and squeeze the pressure sensor (53), first making all the contact sensors (649) sense. Then, the support components (64) and the top plate (65) continue to move downward, so that the pressure sensor (53) reaches a certain appropriate force F. At this time, it is considered that the top plate (65) provides uniform and sufficient support to the back of the probe card. Step S3: Flatness detection of top plate (65). Several sets of displacement sensors (55) detect the displacement of each area at the bottom of the top plate (65) in real time. When the displacement values ​​of several sets are not equal, the top plate (65) is tilted at this time, and otherwise it is horizontal. Step S4: Flatness calibration of the top plate (65). The displacement detected by several sets of displacement sensors (55) is calculated by the processor (56) to obtain the displacement deviation value. When the air extraction pipe (75) in the corresponding area is evacuated, the telescopic component (73) is extended to make the top plate (65) gradually calibrated to a horizontal state.

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