Electronic device and method for manufacturing electronic device

Abstract

An electronic device and a method for manufacturing the electronic device are disclosed. The electronic device includes a display panel and a window member disposed on the display panel. The window member may include a support film, a coated window disposed on the support film, and a light blocking pattern spaced apart from the coated window, the support film being disposed between the coated window and the light blocking pattern. The light blocking pattern may be formed from a light blocking composition including a black colorant, an ultraviolet light initiator, a near-infrared light sensitizer, a near-infrared light initiator, and a binder resin.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and all benefits arising therefrom to Korean Patent Application No. 10-2024-0060425, filed on May 8, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates herein to an electronic device, and more specifically, to an electronic device including a coated window and a method for manufacturing the electronic device. Background Technology

[0004] Various electronic devices are being developed for multimedia devices such as televisions, mobile phones, tablet computers, and game consoles. These electronic devices may include a display panel for generating images and video, a window member for protecting the display panel, and a housing therein housing the display panel. The window member and housing can be coupled to form the appearance of the electronic device, and adhesives can be used when the window member is coupled to the housing. The bonding process, which cures at high temperatures, can damage the components of the electronic device. Summary of the Invention

[0005] The present invention provides an electronic device that has reduced thickness and improved surface quality while exhibiting excellent display quality.

[0006] The present invention also provides a method (or electronic device manufacturing method) for manufacturing electronic devices that exhibits excellent processability and manufacturing efficiency.

[0007] An embodiment of the present invention provides an electronic device comprising: a display panel; and a window member disposed on the display panel and including a support film, a coated window disposed on the support film, and a light-blocking pattern spaced apart from the coated window, wherein the support film is disposed between the coated window and the light-blocking pattern, and wherein the light-blocking pattern is formed by a light-blocking composition comprising a black colorant, an ultraviolet photoinitiator, a near-infrared photosensitizer (or photosensitizer, photosensitizer), a near-infrared photoinitiator, and an adhesive resin.

[0008] In an embodiment, the first edge of the coated window, the second edge of the supporting film, and the third edge of the light-blocking pattern can be oriented to be parallel to each other in the thickness direction.

[0009] In an embodiment, the electronic device may further include a light control layer disposed between the display panel and the window member, and an optical adhesive layer disposed between the light control layer and the window member, wherein the side surface of the light blocking pattern may contact the optical adhesive layer.

[0010] In one embodiment, the optical adhesive layer may cover the stepped portion defined by the side surface of the light-blocking pattern and the lower surface of the support film.

[0011] In an embodiment, the optical adhesive layer may have a thickness of about 100 μm to about 200 μm.

[0012] In an embodiment, the light-blocking pattern may have an optical density (OD) of about 3 or greater and an adhesive force of about 5B or greater relative to the support film, as measured according to ASTM (American Society for Testing and Materials) D3359 method.

[0013] In an embodiment, the light-blocking pattern may have a thickness ranging from about 3 μm to about 50 μm.

[0014] In an embodiment, the electronic device may further include a housing that houses a display panel, wherein the upper surface of the light-blocking pattern contacts a support film and the lower surface of the light-blocking pattern contacts the housing.

[0015] In one embodiment, the support membrane may completely overlap with the coating window.

[0016] In an embodiment, the coating window may have a pencil hardness of about 9H or greater, a bright spot appearance height of about 11 cm or greater as assessed by a DuPont impact tester, and an indentation modulus (EIT) of about 800 MPa or greater as measured by a nanoindenter.

[0017] In an embodiment, the coated window may have a transmittance of about 90% or higher relative to light with a visible wavelength range and a yellow index of about 1 or less.

[0018] In the embodiments, the support film and the coating window may each have a transmittance of about 50% or higher relative to light having a wavelength range of about 700 nm to about 1000 nm.

[0019] In an embodiment, the coating window may have a thickness range of about 300 μm to about 800 μm, and the support film may have a thickness range of about 100 μm to about 200 μm.

[0020] In the embodiments, the ultraviolet photoinitiator may include iodized salt, the near-infrared photosensitizer may include heptamethine dye, the near-infrared photoinitiator may include coumarin aniline salt (CAA salt), and the adhesive resin may include at least one of silicone resin, urethane resin and acrylic resin.

[0021] In an embodiment, a method for manufacturing an electronic device includes: preparing a preliminary window component, the preliminary window component including a support film, a coated window disposed on the support film, and a preliminary light-blocking pattern spaced apart from the coated window, the support film being disposed between the preliminary light-blocking pattern and the coated window; accommodating a display panel in a housing and providing the preliminary window component on the display panel; and forming the window component by irradiating the preliminary light-blocking pattern with near-infrared light, wherein preparing the preliminary window component includes: preparing the support film; forming a preliminary light-blocking pattern by providing a light-blocking composition on one surface of the support film and irradiating the light-blocking composition with ultraviolet light; and forming the coated window by providing a coating liquid on another surface of the support film spaced apart from the one surface in the thickness direction, wherein the light-blocking composition includes a black colorant, an ultraviolet photoinitiator, a near-infrared photosensitizer, a near-infrared photoinitiator, and an adhesive resin.

[0022] In one embodiment, in forming the window component, near-infrared light can pass through the support film and the coated window to illuminate the initial light-blocking pattern.

[0023] In one embodiment, the window forming component can be performed at a temperature of about 80°C or lower.

[0024] In an embodiment, the total amount of ultraviolet light provided in forming the initial light-blocking pattern may be about 100 mJ or less.

[0025] In the embodiments, the ultraviolet photoinitiator may include iodized salt, the near-infrared photosensitizer may include heptamethine dye, the near-infrared photoinitiator may include coumarin aniline salt (CAA salt), and the adhesive resin may include at least one of silicone resin, urethane resin and acrylic resin.

[0026] In the embodiments, the light-blocking composition can be provided by an inkjet printing method or a dispensing method. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings:

[0028] Figure 1 This is a perspective view showing an electronic device according to an embodiment;

[0029] Figure 2A This is an exploded perspective view showing an electronic device according to an embodiment;

[0030] Figure 2B This is an exploded perspective view showing an electronic device according to an embodiment;

[0031] Figure 3 It is shown along the embodiment Figure 2B A cross-sectional view of a portion of the line I-I';

[0032] Figure 4 This illustrates an embodiment. Figure 3 Enlarged cross-sectional view of region AA';

[0033] Figure 5 It is shown along the embodiment Figure 2B A cross-sectional view of a portion of line II-II';

[0034] Figure 6A This is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment;

[0035] Figure 6B This is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment;

[0036] Figure 7 This is a schematic view illustrating the manufacturing steps of an electronic device according to an embodiment;

[0037] Figure 8 This is a schematic view illustrating the manufacturing steps of an electronic device according to an embodiment;

[0038] Figure 9 This is a schematic view illustrating the manufacturing steps of an electronic device according to an embodiment; and

[0039] Figure 10 This is a schematic view illustrating the manufacturing steps of an electronic device according to an embodiment. Detailed Implementation

[0040] This invention can be implemented in various modifications and has various forms, and specific embodiments are shown in the accompanying drawings and described in detail in the text. However, it should be understood that this invention is not intended to be limited to the specific forms disclosed, but rather to cover all modifications, equivalents, and substitutions falling within the spirit and scope of this invention.

[0041] In this specification, it will be understood that when an element (or region, layer, or portion, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, the element may be directly disposed on the other element, directly connected to / directly coupled to the other element, or an intermediary element may be disposed between the element and the other element.

[0042] The same reference numerals or symbols always refer to the same elements. Furthermore, in the drawings, the thickness, scale, and dimensions of elements are exaggerated for the purpose of actively depicting the technical content. The term "and / or" includes all combinations of one or more of the associated listed elements.

[0043] Although the terms first, second, etc., can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular form also includes the plural form.

[0044] Furthermore, terms such as “below,” “under,” “above,” and “above” may be used in this description to describe the relationship between one element and another(s) shown in the accompanying drawings. It will be understood that these terms are relative and are based on the orientation depicted in the accompanying drawings.

[0045] It will be understood that, when used in this specification, the terms “comprising” or “including” indicate the presence of the stated features, integrals, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0046] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, unless expressly defined herein, terms (such as those defined in general dictionaries) shall be interpreted as having meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense.

[0047] In the following description, an electronic device according to an embodiment will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing an electronic device according to an embodiment.

[0048] In the embodiments and referenced Figure 1 An electronic device EA can be activated and display an image in response to an electrical signal. For example, an electronic device EA can be a personal computer (e.g., a laptop computer), a personal digital assistant, a game console, a portable electronic device, a television, a monitor, an outdoor billboard, a car navigation unit, or a wearable device, but embodiments of the invention are not limited thereto. Figure 1 In the example, the electronic device EA is shown as a mobile phone.

[0049] In the embodiments, the electronic device EA can be rigid or flexible. The term "flexible" means having a bendable property. For example, a flexible electronic device EA can include a bendable device, a sliding device, a rollable device, or a foldable device.

[0050] An electronic device EA according to an embodiment can display an image IM via a display area DA. The display area DA may include a flat surface defined by a first direction DR1 and a second direction DR2. The display area DA may also include a curved surface bent from at least one side of the flat surface defined by the first direction DR1 and the second direction DR2. The display surface for displaying the image IM may correspond to the front surface of the electronic device EA. The image IM may include not only moving images but also static images.

[0051] In an embodiment, the non-display area NDA can be configured to be adjacent to the display area DA, wherein the non-display area NDA can surround the display area DA. Therefore, the shape of the display area DA can be substantially defined by the non-display area NDA. However, Figure 1 This is an illustrative example. The non-display area NDA may be configured to be adjacent to only one side of the display area DA, or a portion of the non-display area NDA may be omitted. The electronic device EA according to the embodiments may include a display area DA having various shapes, and is not limited to any one embodiment.

[0052] In one embodiment, the electronic device EA may have a rectangular shape on a plane, having a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1. However, the invention is not limited thereto, and the electronic device EA may have various shapes (such as circular shapes and other polygonal shapes) on a plane.

[0053] In this specification, the first direction axis DR1 and the second direction axis DR2 may be orthogonally oriented to each other, and the third direction axis DR3 may be oriented in the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device EA may be parallel to the direction oriented to the third direction axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) may be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) may be parallel to the direction oriented to the third direction axis DR3. The front surface (or upper surface) refers to the surface adjacent to the display surface in which the image IM is displayed, and the rear surface (or lower surface) refers to the surface spaced apart from the display surface in which the image IM is displayed. The upper side (or upper part, above) refers to the direction close to the display surface in which the image IM is displayed, and the lower side (or lower part, below) refers to the direction away from the display surface in which the image IM is displayed.

[0054] A cross section refers to a surface oriented parallel to the third direction (i.e., the thickness direction) DR3, and a plane refers to a surface perpendicular to the third direction (i.e., the thickness direction) DR3. A plane is a flat surface defined by the first direction axis DR1 and the second direction axis DR2.

[0055] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 shown herein are relative concepts and can therefore be changed to other directions. Furthermore, the directions indicated by the direction axes DR1, DR2, and DR3 may be referred to as the first direction DR1, the second direction DR2, and the third direction DR3, respectively, and may be represented by the same reference numerals or symbols.

[0056] In an embodiment, the electronic device EA can detect external input applied from the outside, wherein the external input can include various forms of input (such as force (e.g., pressure), temperature, and light). According to an embodiment, the electronic device EA can detect user touch input FG applied from the outside. User touch input FG includes various forms of external input (such as a part of the user's body, light, heat, or pressure). Figure 1 The illustration shows a user's touch input FG, which is the user's hand applying pressure to the front surface. However, this is an exemplary illustration, and as mentioned above, the user's touch input FG can be provided in various forms. Furthermore, the electronic device EA can detect the user's touch input FG applied to the side or rear surface of the electronic device EA, depending on its structure, and is not limited to any one embodiment.

[0057] Figure 2A and Figure 2B This is an exploded perspective view showing an electronic device according to an embodiment. Figure 2A This is a view showing the electronic device EA in an unbent state according to an embodiment, with the first circuit board FCB1 and the second circuit board FCB2, which will be described later. Figure 2B This is a view showing an electronic device EA in a bent state according to an embodiment of the first circuit board FCB1 and the second circuit board FCB2.

[0058] In the embodiments and referenced Figure 2A and Figure 2B The electronic device EA may include a display module DM, a drive control module DCM, an input control unit TCM, and a window component WP disposed on the display module DM. Additionally, the electronic device EA may also include a light control layer PP, a lower component CP, and a housing HAU.

[0059] In an embodiment, in an electronic device EA, a window component WP and a housing HAU can be coupled to form the appearance of the electronic device EA, wherein the housing HAU can be disposed below the display module DM and the lower component CP. The housing HAU can include a material with relatively high rigidity. For example, the housing HAU can include multiple frames and / or plates made of glass, plastic, or metal. The housing HAU can provide a predetermined receiving space. The display module DM can be housed within the receiving space and can be protected from external impacts.

[0060] In this embodiment, the lower component CP can be positioned below the display module DM and can protect the display panel DP from external impacts, etc. The lower component CP can be a single layer or multiple layers.

[0061] In an embodiment, the display module DM can be activated in response to an electrical signal and may include a display panel DP and an input sensing component TSP disposed on the display panel DP.

[0062] In an embodiment, the display panel DP may include a first active region DP-DA and a first peripheral region DP-NDA configured to be adjacent to the first active region DP-DA. The first peripheral region DP-NDA may surround the first active region DP-DA. However, Figure 2A and Figure 2B This is an illustrative example. In other embodiments, the first peripheral region DP-NDA may be configured to be adjacent to only one side of the first active region DP-DA, or a portion of the first peripheral region DP-NDA may be omitted. The first active region DP-DA may correspond to Figure 1 The electronic device EA shown is configured with a display area DA. The first peripheral area DP-NDA can correspond to... Figure 1 The non-display area NDA of the electronic device EA shown is illustrated. It will be understood in this specification that when an element is referred to as corresponding to / overlapping with another element, it is not limited to cases having the same shape or area, but may also include cases with different shapes and / or areas.

[0063] In an embodiment, the first active region DP-DA can be activated in response to an electrical signal and display an image (e.g., Figure 1 The first peripheral region DP-NDA may be an area in which drive circuits or drive lines for driving components disposed in the first active region DP-DA, various types of signal lines for providing electrical signals, pads, etc. are provided. The border area BZA of the window component WP, which will be described later, can prevent the components disposed in the first peripheral region DP-NDA of the display panel DP from being viewed from the outside.

[0064] In this embodiment, the drive control module (DCM) can be disposed on the terminal portion of the display panel (DP), and can also be disposed in the first peripheral area (DP-NDA) of the display panel (DP). The drive control module (DCM) may include a main circuit board (MCB), a first circuit board (FCB1), and a panel drive circuit (PDC).

[0065] In this embodiment, the panel driving circuit PDC can be disposed in the first peripheral region DP-NDA and can be configured as an integrated circuit. Although not shown, multiple passive components and multiple active components can be mounted on the main circuit board MCB. The main circuit board MCB can be a rigid circuit board or a flexible circuit board, and the first circuit board FCB1 can be a flexible circuit board. The first circuit board FCB1 can be electrically connected to the pads PD of the display panel DP (see...). Figure 3 ).

[0066] In an embodiment, the first circuit board FCB1 may be disposed in the first peripheral region DP-NDA and may be connected to the terminal portion of the display panel DP to electrically connect the main circuit board MCB and the display panel DP. The first circuit board FCB1 may be bent. In the embodiment and with reference to Figure 2B The first circuit board FCB1 can be bent such that one end of the first circuit board FCB1 is adjacent to the front surface of the display panel DP, and the other end of the first circuit board FCB1 is adjacent to the rear surface of the display panel DP. In the bent state of the first circuit board FCB1, the main circuit board MCB can be positioned below the display panel DP. In the bent state of the first circuit board FCB1, the main circuit board MCB can be positioned adjacent to the rear surface of the display panel DP. The display module DM can be housed in the housing HAU while the first circuit board FCB1 is bent. Therefore, the electronic device EA has a reduced non-display area NDA, and thus can have improved display quality.

[0067] In an embodiment, the input sensing component TSP may include a second active region TTA and a second peripheral region TSA configured to be adjacent to the second active region TTA, wherein the second peripheral region TSA may surround the second active region TTA. However, Figure 2A and Figure 2B This is an example illustration. In other embodiments, the second peripheral region TSA may be configured to be adjacent to only one side of the second active region TTA, or a portion of the second peripheral region TSA may be omitted. The second active region TTA of the input sensing component TSP may correspond to the first active region DP-DA of the display panel DP, and the second peripheral region TSA of the input sensing component TSP may correspond to the first peripheral region DP-NDA of the display panel DP.

[0068] In this embodiment, the input sensing component (TSP) can detect external input, convert the detected external input into a predetermined input signal, and provide the input signal to the display panel (DP). For example, the input sensing component (TSP) can be a touch sensing component that detects touch, wherein the input sensing component (TSP) can identify direct touch by the user, indirect touch by the user, direct touch by an object, indirect touch by an object, etc.

[0069] In this embodiment, the input sensing component TSP can detect touch input FG applied from the outside (see...). Figure 1 The location and / or intensity (pressure) of the input signal. The input sensing component (TSP) can have various structures or be composed of various materials, and is not limited to any one embodiment. For example, the input sensing component (TSP) can detect external input capacitively. The display panel (DP) can receive the input signal from the input sensing component (TSP) and generate an image corresponding to the input signal.

[0070] In one embodiment, the input control unit TCM may be disposed on the terminal portion of the input sensing component TSP. The input control unit TCM may also be disposed in the second peripheral region TSA of the input sensing component TSP. The input control unit TCM may include a second circuit board FCB2 and an input drive circuit TDC. The input drive circuit TDC may be mounted on the second circuit board FCB2 and may be configured as an integrated circuit. The second circuit board FCB2 may be disposed on the terminal portion of the input sensing component TSP to electrically connect the main circuit board MCB and the input sensing component TSP. The second circuit board FCB2 may be electrically connected to the sensing pad TPD of the input sensing component TSP (see...). Figure 3 ).

[0071] In this embodiment, similar to the first circuit board FCB1, the second circuit board FCB2 can be a flexible circuit board that can be bent. (Refer to...) Figure 2B The second circuit board FCB2 can be bent such that one end of the second circuit board FCB2 is positioned adjacent to the front surface of the input sensing component TSP, and the other end of the second circuit board FCB2 is positioned adjacent to the rear surface of the input sensing component TSP. The display module DM is housed in the housing HAU while the second circuit board FCB2 is bent. Therefore, the electronic device EA has a reduced non-display area NDA, and thus can have improved display quality.

[0072] In one embodiment, the light control layer PP may be disposed between the display module DM and the window member WP, and may be an anti-reflection layer that reduces the reflectivity of external light incident from outside the display module DM. The light control layer PP may include a polarizer or a color filter layer. For example, the light control layer PP may include at least one of a retarder, a polarizer, a polarizing film, and a polarizing filter. In another embodiment, the light control layer PP may include a plurality of color filters arranged in a predetermined configuration. In yet another embodiment, the light control layer PP may be omitted.

[0073] In an embodiment, the front surface FS of the window member WP may correspond to the front surface of the electronic device EA, and may include a border area BZA and a transmission area TA.

[0074] In an embodiment, the transmissive region TA may overlap with at least a portion of the first active region DP-DA of the display panel DP, wherein the transmissive region TA may be an optically transparent region. Image IM (see image IM) Figure 1 It can be provided to the user through the transmission area TA.

[0075] In one embodiment, the border region BZA may be a region with relatively lower light transmittance than the transmissive region TA, and may define the shape of the transmissive region TA. The border region BZA may be positioned adjacent to the transmissive region TA and may surround the transmissive region TA. The border region BZA may have a predetermined color. The border region BZA may cover the first peripheral region DP-NDA of the display panel DP and may prevent the first peripheral region DP-NDA from being viewed from the outside. However, the invention is not limited to what is shown in the accompanying drawings. In another embodiment, the border region BZA may be positioned adjacent to only one side of the transmissive region TA, or a portion of the border region BZA may be omitted.

[0076] Figure 3 It is shown along the embodiment Figure 2B A cross-sectional view of a portion taken from line I-I'. (Refer to...) Figure 3 The electronic device EA may also include an optical adhesive layer AL1 disposed between the light control layer PP and the window member WP. The electronic device EA may also include a module adhesive layer AL2 disposed between the display module DM and the light control layer PP. For example, the optical adhesive layer AL1 and the module adhesive layer AL2 may each comprise a pressure-sensitive adhesive (PSA) film, an optically transparent adhesive (OCA) film, or an optically transparent resin (OCR). However, this is shown exemplarily, and the optical adhesive layer AL1 and the module adhesive layer AL2 may each comprise conventional adhesives / bonding agents known in the art.

[0077] In an embodiment, the electronic device EA may further include a protective film PF disposed between the display panel DP and the lower component CP. Since the protective film PF is positioned adjacent to the lower surface of the display panel DP, it can protect the display panel DP from impacts. The protective film PF may comprise a flexible plastic material. For example, the protective film PF may comprise polyethylene terephthalate (PET).

[0078] In an embodiment, the lower component CP may include a support layer SP, a padding layer CSL disposed on the support layer SP, and a barrier layer BEL disposed on the padding layer CSL. The configuration of the lower component CP is not limited to... Figure 3 The contents shown can vary depending on the size, shape, or operating characteristics of the electronic device EA. For example, in another embodiment, a portion of the support layer SP, padding layer CSL, and barrier layer BEL can be omitted, or their stacking order can be changed to something different. Figure 3 Another order of the sequence shown. In yet another embodiment, additional components may be included in addition to the components shown.

[0079] In one embodiment, the support layer SP can support components (e.g., a display panel DP) disposed on top of the support layer SP. The support layer SP can include a metallic or polymeric material. For example, the support layer SP can be formed of stainless steel, aluminum, or alloys thereof. In another embodiment, the support layer SP can be formed of a polymeric material.

[0080] In an embodiment, the cushioning layer CSL can absorb impacts transmitted from beneath the display panel DP. The cushioning layer CSL may comprise an elastomer such as sponge, foam, or urethane resin. Alternatively, the cushioning layer CSL may be formed from at least one of acrylate polymers, urethane polymers, silicone polymers, and imide polymers.

[0081] In this embodiment, the barrier layer (BEL) can enhance resistance to compressive forces caused by external pressure and can be used to prevent deformation of the display panel (DP). The barrier layer (BEL) can be a colored film with low transmittance relative to light. Therefore, the barrier layer (BEL) can prevent components disposed beneath it from being viewed. The barrier layer (BEL) can include a flexible synthetic resin film. For example, the barrier layer (BEL) can include polyimide or polyethylene terephthalate. However, this is given by way of example, and the material of the barrier layer (BEL) is not limited to these.

[0082] In an embodiment, the window component WP may include a support film EOF, a coated window CW disposed on the support film EOF, and a light-blocking pattern BM spaced apart from the coated window CW and disposed between the light-blocking pattern BM and the coated window CW. The coated window CW may be made of a coating liquid CAL (see [link to documentation]). Figure 9Formed by curing a coating liquid containing organic materials (see CAL). Figure 9 To form a coated window (CW). The coated window (CW) may not include a glass substrate.

[0083] In this embodiment, the coated window CW can be optically transparent and can have a transmittance of about 90% or higher relative to light with a visible wavelength range. The coated window CW can have a yellow index of about 1 or less, and the yellow index can be measured via the ASTM E313 method. This is due to the curing of the coating liquid CAL (see...). Figure 9 The coated window CW formed exhibits high transmittance and low yellow index properties in the visible light wavelength range. Therefore, the coated window CW can replace the traditional glass substrate, and thus the electronic device EA including the coated window CW according to the embodiment can exhibit excellent display quality.

[0084] In embodiments, the coated window CW can have a pencil hardness of about 9H or greater, a bright spot occurrence height of about 11 cm or greater as assessed using a DuPont impact tester, and an indentation modulus (EIT) of about 800 MPa or greater as measured using a nano indenter. This is achieved by providing a coating liquid CAL (see...). Figure 9 The coated window CW formed satisfies the above-mentioned mechanical properties and therefore can exhibit excellent durability.

[0085] In the embodiments, the coated window CW and the supporting film EOF can each have about 50% or more transmittance relative to near-infrared (NIR) light. The coated window CW and the supporting film EOF can each have about 50% or more transmittance relative to light having a wavelength range of about 700 nm to about 1000 nm. Light having a wavelength range of about 700 nm to about 1000 nm corresponds to near-infrared light. Therefore, in the electronic device manufacturing method described later, the near-infrared light LT-2 provided during the step of forming the light-blocking pattern BM (see...) Figure 10 It can pass through the coated window CW and the support film EOF, and is provided to the initial light-blocking pattern P-BM (see...). Figure 10 ).

[0086] In an embodiment, the coating window CW can be directly disposed on the support film EOF. In this specification, the phrase "an element is referred to as being directly disposed / directly provided on another element" means that there is no intermediary element between the element and the other element. That is, the phrase "an element is directly disposed / directly provided on another element" can mean that the element is in contact with the other element.

[0087] In one embodiment, on a plane, the support film EOF can completely overlap with the coating window CW, wherein a portion of the edge region of each of the support film EOF and the coating window CW may not overlap with the display module DM, but may overlap with the housing HAU. A portion of the edge region of each of the support film EOF and the coating window CW may be disposed on the housing HAU.

[0088] In an embodiment, the support membrane EOF can be provided with a coating liquid CAL (see [link to CAL]) for forming the coating window CW. Figure 9 When used as a base layer, it is also used when the coating liquid CAL (see [reference]) is provided. Figure 9 When the coating solution is coated (see ), the EOF support film can prevent the coating solution from being coated (CAL). Figure 9 The coating liquid flows between the first circuit board FCB1 and the second circuit board FCB2, respectively. If the coating liquid flows to the first and second circuit boards and cures, cracks will occur when the first and second circuit boards are bent. Since the electronic device EA according to the embodiment includes a support film EOF, the coating liquid CAL (see...) is prevented from... Figure 9 The current flows to circuit boards FCB1 and FCB2, and therefore the aforementioned cracks can be prevented.

[0089] In the embodiments, the support film EOF may be optically transparent and may include organic materials. For example, the support film EOF may include polyimide (PI) and polyethylene terephthalate (PET). However, this is given by way of example, and the materials included in the support film EOF are not limited thereto.

[0090] In this embodiment, the light-blocking pattern BM can be disposed between the light control layer PP and the support film EOF, wherein the light-blocking pattern BM can be directly disposed on the lower surface EOF_DF of the support film EOF (see [link to embodiment]). Figure 4 The light-blocking pattern BM can have a predetermined color. The light-blocking pattern BM can correspond to the non-display area NDA (see above). Figure 1 The light-blocking pattern BM is set to correspond to the first peripheral region DP-NDA (see...). Figure 2A and Figure 2B ) and the second outer perimeter TSA (see Figure 2A and Figure 2B ), and thus prevents the first peripheral region DP-NDA from being viewed from the outside (see Figure 2A and Figure 2B ) and the second outer perimeter TSA (see Figure 2A and Figure 2B The light-blocking pattern BM can define the border area BZA of the window component WP.

[0091] The light-blocking pattern BM can be made from the light-blocking composition BC (see...) Figure 7The light-blocking composition BC comprises a black colorant, an ultraviolet photoinitiator, a near-infrared photosensitizer, a near-infrared photoinitiator, and an adhesive resin. The light-blocking pattern BM can be formed by photocuring the light-blocking composition BC (see [link to image]). Figure 7 The colorant is formed by means of pigments or dyes. In embodiments, the adhesive resin refers to a resin containing functional groups that serve as an adhesive.

[0092] For example, ultraviolet photoinitiators may include iodized salts. Near-infrared photosensitizers may include heptamethrin dye. Near-infrared photoinitiators may include coumarin acylaniline salts (CAA salts). Adhesive resins may include at least one of silicone resins, urethane resins, and acrylic resins. However, this is given by way of example, and in another embodiment, the light-blocking composition BC (see...) Figure 7 It may also include another material known in the art, as long as it does not degrade the physical properties of the light-blocking pattern BM.

[0093] The light-blocking pattern BM can have a light density (OD) of about 3 or greater. A light-blocking pattern BM with an OD of about 3 or greater prevents light leakage and thus improves the display quality of the electronic device EA. The light-blocking pattern BM can have an adhesion force of about 5B or greater relative to the support film EOF, and this adhesion force can be measured via the ASTM D3359 method. The light-blocking pattern BM can have an adhesion force of about 5B or greater relative to the housing HAU, and this adhesion force can be measured via the ASTM D3359 method. In an embodiment, when the window member WP is coupled to the housing HAU, a light-blocking composition BC comprising an adhesive resin (see...) is used. Figure 7 The light-blocking pattern BM formed can be used as an adhesive. The light-blocking pattern BM and the housing HAU can be physically / chemically coupled. The light-blocking pattern BM, which meets the above-mentioned adhesive strength, stably couples the window component WP and the housing HAU, and therefore can exhibit excellent reliability.

[0094] Figure 4 This illustrates an embodiment. Figure 3 An enlarged cross-sectional view of region AA'. In the embodiment and with reference to... Figure 4 The optical adhesive layer AL1 can have a thickness TH4 in the range of about 100 μm to about 200 μm. An optical adhesive layer AL1 meeting the above thickness range can stably couple the light control layer PP and components adjacent to the light control layer PP (e.g., the support film EOF) without increasing the electronic device EA (see [link to documentation]). Figure 3 The thickness of ).

[0095] In one embodiment, the light-blocking pattern BM can contact the optical adhesive layer AL1, wherein the side surface BM_SF of the light-blocking pattern BM can contact the optical adhesive layer AL1. The light-blocking pattern BM can be disposed between the support film EOF and the optical adhesive layer AL1. The light-blocking composition BC comprising an adhesive resin (see [link to documentation]) is used. Figure 7 The light-blocking pattern BM formed is in contact with the optical adhesive layer AL1, and thus can improve the coupling force between the support film EOF and the optical adhesive layer AL1 to exhibit excellent reliability.

[0096] In an embodiment, the light-blocking pattern BM may include an upper surface BM_UF, a lower surface BM_DF, and a side surface BM_SF. The upper surface BM_UF and the lower surface BM_DF of the light-blocking pattern BM may be spaced apart from each other in a third direction (i.e., the thickness direction) DR3. The side surface BM_SF may be disposed between the upper surface BM_UF and the lower surface BM_DF. The upper surface BM_UF, the lower surface BM_DF, and the side surface BM_SF of the light-blocking pattern BM may have an integral shape.

[0097] In this embodiment, the upper surface BM_UF of the light-blocking pattern BM can be in contact with the supporting film EOF. The light-blocking pattern BM can be achieved by directly providing the light-blocking composition BC on the lower surface EOF_DF of the supporting film EOF (see...). Figure 7 This is achieved by forming the light-blocking pattern BM. Therefore, the upper surface BM_UF of the light-blocking pattern BM can contact the lower surface EOF_DF of the supporting film EOF.

[0098] In this embodiment, one area of ​​the lower surface BM_DF of the light-blocking pattern BM can contact the optical adhesive layer AL1. Another area of ​​the lower surface BM_DF of the light-blocking pattern BM can contact the housing HAU. Because the light-blocking pattern BM can contact the housing HAU, the window member WP can be stably coupled to the housing HAU.

[0099] In an embodiment, the light-blocking pattern BM can have a thickness TH1 ranging from about 3 μm to about 50 μm. A light-blocking pattern with a thickness less than about 3 μm may not stably couple the window member and the housing, and a light-blocking pattern with a thickness greater than about 50 μm increases the thickness of the electronic device. In contrast, a light-blocking pattern BM with a thickness TH1 ranging from about 3 μm to about 50 μm can stably couple the window member WP and the housing HAU without increasing the thickness of the electronic device EA.

[0100] In an embodiment, the support film EOF may include an upper surface EOF_UF and a lower surface EOF_DF spaced apart from each other on a third-direction (i.e., thickness direction) DR3. A coating window CW may be disposed on the upper surface EOF_UF of the support film EOF, and a light-blocking pattern BM may be disposed on the lower surface EOF_DF of the support film EOF. The side surface BM_SF of the light-blocking pattern BM and the lower surface EOF_DF of the support film EOF may define a stepped portion SP-a, and an optical adhesive layer AL1 may be disposed while covering the stepped portion SP-a.

[0101] In an embodiment, the first edge CW_EG of the coated window CW, the second edge EOF_EG of the supporting film EOF, and the third edge BM_EG of the light-blocking pattern BM can be configured to be parallel to each other in a third third direction (i.e., the thickness direction) DR3. The first edge CW_EG of the coated window CW, the second edge EOF_EG of the supporting film EOF, and the third edge BM_EG of the light-blocking pattern BM can overlap. This is achieved by providing the coating liquid CAL (see [reference needed]) on the upper surface EOF_UF of the supporting film EOF. Figure 9 To form the coated window CW, and by providing the light-blocking composition BC on the lower surface EOF_DF of the support film EOF (see... Figure 7 The light-blocking pattern BM is formed by forming the first edge CW_EG of the coated window CW, the second edge EOF_EG of the support film EOF, and the third edge BM_EG of the light-blocking pattern BM, which can be oriented to be parallel to each other in the third direction (i.e., the thickness direction) DR3.

[0102] In this embodiment, the support film EOF may have a thickness TH2 ranging from about 100 μm to about 200 μm. The coating window CW may have a thickness TH3 ranging from about 300 μm to about 800 μm. The support film EOF and coating window CW meeting the above thickness ranges can exhibit good durability without increasing the thickness of the electronic device EA.

[0103] In an embodiment, in a conventional electronic device, a light-blocking pattern is provided between a support film and a coated window, wherein the light-blocking pattern is formed on one surface of the support film, and then the coated window is formed on the light-blocking pattern. When the coated window is formed, the coating quality deteriorates due to the stepped portion defined by the support film and the light-blocking pattern on one surface of the support film, and the surface quality of the coated window, which is the uppermost component of the electronic device, deteriorates. Furthermore, in conventional electronic devices, the housing is coupled to the window component by providing an additional adhesive to the housing and curing the additional adhesive. Heat is provided during the curing step of the additional adhesive, and the high temperature (approximately 130°C or higher) damages components such as display panels.

[0104] In an embodiment, the electronic device EA may include a light-blocking pattern BM spaced apart from the coating window CW and with a support film EOF disposed between the light-blocking pattern BM and the coating window CW, and the light-blocking pattern BM may be photocured by a light-blocking composition BC comprising an adhesive resin (see [link to documentation]). Figure 7 The light-blocking pattern BM is formed by forming the light-blocking pattern BM. Therefore, the housing HAU and window component WP can be coupled without additional adhesive, thus preventing damage to components such as the display panel DP. Since no additional adhesive is required, the electronic device EA according to the embodiment can have a reduced thickness and exhibit excellent processability. Because the light-blocking pattern BM is disposed below the support film EOF, light leakage is prevented, and therefore excellent display quality can be achieved. Furthermore, the light-blocking pattern BM and the coated window CW are formed on different surfaces (lower and upper surfaces) of the support film EOF, respectively, thus improving surface quality.

[0105] Figure 5 It is shown along the embodiment Figure 2B A cross-sectional view of a portion of line II-II'. Figure 5 This may be a cross-sectional view showing the display panel DP according to an embodiment. In the embodiment and with reference to... Figure 5 The display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. Figure 5 The components of the display panel DP shown are illustrated by way of example, and the components of the display panel DP are not limited thereto. For example, in one embodiment, the display panel DP may include a liquid crystal display element, and in another embodiment, the encapsulation layer TFE may be omitted.

[0106] In an embodiment, the substrate BS can provide a substrate surface on which the circuit layer DP-CL is disposed, and the substrate BS can be a flexible substrate that is bendable, foldable, rollable, etc. The substrate BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the present invention is not limited thereto, and the substrate BS can include inorganic layers, organic layers, or composite material layers.

[0107] In embodiments, the substrate BS may comprise a single layer or multiple layers. For example, the substrate BS may comprise a first synthetic resin layer, multiple or single-layer inorganic layers, and a second synthetic resin layer disposed on the multiple or single-layer inorganic layers. The first and second synthetic resin layers may each comprise a polyimide resin. Alternatively, the first and second synthetic resin layers may each comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins. In this specification, "~~" resins are considered to include the functional group "~~". For example, acrylic resins are resins that include acrylic groups.

[0108] In an embodiment, the display panel DP may include a transistor TR and a light-emitting element ED, wherein the transistor TR and the light-emitting element ED may be disposed on a substrate BS. Figure 5 A transistor TR is shown, but the display panel DP can actually include at least one capacitor and multiple transistors for driving the light-emitting elements ED.

[0109] In an embodiment, the circuit layer DP-CL can be disposed on the substrate BS and can include a shielding electrode BML, a transistor TR, a connection electrode CNE, and multiple insulating layers. The multiple insulating layers may include a buffer layer BFL and insulating layers INS1 to INS6. However, Figure 5 The stacking structure of the DP-CL circuit layer shown is given as an example, and the stacking structure of the DP-CL circuit layer can be changed according to the configuration of the display panel DP and the process used for the DP-CL circuit layer.

[0110] In an embodiment, the shielding electrode BML can be disposed on the substrate BS and can overlap with the transistor TR. The shielding electrode BML can block light incident on the transistor TR from below the display panel DP to protect the transistor TR. The shielding electrode BML can include a conductive material. When a voltage is applied to the shielding electrode BML, the threshold voltage of the transistor TR disposed on the shielding electrode BML can be maintained. However, the invention is not limited thereto, and the shielding electrode BML can be a floating electrode. Alternatively, the shielding electrode BML can be omitted.

[0111] In this embodiment, the buffer layer BFL may be disposed on the substrate BS and may cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer and may improve the coupling between the substrate BS and the semiconductor pattern or conductive pattern disposed on the buffer layer BFL.

[0112] In an embodiment, the transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1, wherein the source S1, channel C1, and drain D1 of the transistor TR may be formed by a semiconductor pattern. The semiconductor pattern of the transistor TR may include polycrystalline silicon, amorphous silicon, or metal oxide. However, any material with semiconductor properties can be used without any limitation, and is not limited to any particular embodiment.

[0113] In embodiments, the semiconductor pattern may include multiple regions divided according to conductivity levels. Regions in the semiconductor pattern that are doped with dopant or where metal oxides are reduced may have high conductivity and may essentially serve as the source and drain electrodes of the transistor TR. The highly conductive regions of the semiconductor pattern may correspond to the source S1 and drain D1 of the transistor TR. Regions in the semiconductor pattern that are undoped or lightly doped, or have low conductivity due to unreduced metal oxides, may correspond to the channel C1 (or active region) of the transistor TR.

[0114] In this embodiment, the first insulating layer INS1 may cover the semiconductor pattern of the transistor TR and may be disposed on the buffer layer BFL. The gate G1 of the transistor TR may be disposed on the first insulating layer INS1. In a planar plane, the gate G1 may overlap with the channel C1 of the transistor TR. During the doping process of the semiconductor pattern of the transistor TR, the gate G1 may act as a mask.

[0115] In one embodiment, the second insulating layer INS2 may cover the gate G1 and be disposed on the first insulating layer INS1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0116] In an embodiment, the connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 that electrically connects the transistor TR and the light-emitting element ED. However, the configuration of the connection electrode CNE that electrically connects the transistor TR to the light-emitting element ED is not limited to the configuration described above. In various embodiments, the first connection electrode CNE1 or the second connection electrode CNE2 may be omitted, or additional connection electrodes may be further included.

[0117] In one embodiment, the first connecting electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain electrode D1 via a first contact hole CH1 passing through the insulating layers INS1 to INS3. A fourth insulating layer INS4 may cover the first connecting electrode CNE1 and is disposed on the third insulating layer INS3. A fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0118] In one embodiment, the second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5 and may be connected to the first connecting electrode CNE1 via a second contact hole CH2 passing through the insulating layers INS4 and INS5. A sixth insulating layer INS6 may cover the second connecting electrode CNE2 and is disposed on the fifth insulating layer INS5.

[0119] In the embodiments, insulating layers INS1 to INS6 may each comprise an inorganic layer or an organic layer. For example, the inorganic layer may comprise at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyamide resins, and perylene resins.

[0120] In an embodiment, the display element layer DP-EL may include a pixel defining film PDL and a light-emitting element ED, wherein the light-emitting element ED may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electronic control layer TCL, and a second electrode CE.

[0121] In this embodiment, the first electrode AE ​​may be disposed on the sixth insulating layer INS6 and may be connected to the second connection electrode CNE2 via the third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR via the connection electrodes CNE1 and CNE2.

[0122] In embodiments, the first electrode AE ​​may be formed of a metallic material, a metal alloy, or a conductive compound, and may be an anode or a cathode. However, the invention is not limited thereto. Furthermore, the first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmission electrode, a semi-transmission / semi-reflection electrode, or a reflection electrode. The first electrode AE ​​may include: at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a compound selected from two or more materials selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; a mixture selected from two or more materials selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn; or oxides thereof.

[0123] In embodiments, when the first electrode AE ​​is a transmission electrode, the first electrode AE ​​may include a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. When the first electrode AE ​​is a semi-transmissive / semi-reflective electrode or a reflective electrode, the first electrode AE ​​may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or multilayer structural materials such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al), or compounds or mixtures thereof (e.g., mixtures of Ag and Mg). In another embodiment, the first electrode AE ​​may have a multilayer structure including a reflective film or a semi-transmissive / semi-reflective film formed from the above materials and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, embodiments of the present invention are not limited thereto, and the first electrode AE ​​may include the aforementioned metallic material, a combination of two or more metallic materials selected from the aforementioned metallic materials, oxides of the aforementioned metallic materials, etc.

[0124] In one embodiment, a pixel-defining film (PDL) may be disposed on a sixth insulating layer (INS6). A light-emitting opening (PX_OP) exposing a portion of the first electrode (AE) may be defined within the pixel-defining film (PDL).

[0125] The portion of the first electrode AE ​​exposed by the light-emitting opening PX_OP can be defined as the light-emitting region LA.

[0126] In this embodiment, the first active region DP-DA of the display panel DP may include a light-emitting region LA and a light-blocking region NLA. The area where the pixel defining film PDL is disposed may correspond to the light-blocking region NLA. The light-blocking region NLA may surround the light-emitting region LA within the first active region DP-DA.

[0127] In one embodiment, a hole control layer HCL can be disposed on the first electrode AE ​​and the pixel defining film PDL, wherein the hole control layer HCL can be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA. In another embodiment, the hole control layer HCL can be provided only in the region corresponding to the light-emitting opening PX_OP. The hole control layer HCL can include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL can include conventional hole injection materials and / or conventional hole transport materials.

[0128] In one embodiment, the light-emitting layer EML can be disposed on the hole control layer HCL, wherein the light-emitting layer EML can be disposed in the region corresponding to the light-emitting opening PX_OP. In another embodiment, the light-emitting layer EML can be provided as a common layer. The light-emitting layer EML can include organic light-emitting materials and / or inorganic light-emitting materials. The light-emitting layer EML can emit light having one of the colors red, green, and blue. For example, the light-emitting layer EML can emit blue light.

[0129] In one embodiment, the electron control layer (TCL) may be disposed on the light-emitting layer (EML) and may be provided as a common layer overlapping the light-emitting region (LA) and the light-blocking region (NLA). In another embodiment, the electron control layer (TCL) may be provided only in the region corresponding to the light-emitting opening (PX_OP), wherein the electron control layer (TCL) may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer (TCL) may include conventional electron injection materials and / or conventional electron transport materials.

[0130] In an embodiment, the second electrode CE may be disposed on the electronic control layer TCL and may be provided as a common layer overlapping the light-emitting region LA and the light-blocking region NLA.

[0131] The second electrode CE can be a common electrode, wherein the second electrode CE can be a cathode or an anode. However, the invention is not limited thereto. For example, in another embodiment, when the first electrode AE ​​is an anode, the second electrode CE can be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE can be an anode.

[0132] In the embodiments, the second electrode CE can be a transmission electrode, a semi-transmission / semi-reflection electrode, or a reflection electrode. When the second electrode CE is a transmission electrode, the second electrode CE can be formed of a transparent metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0133] In embodiments, when the second electrode CE is a semi-transmissive / semi-reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, or multilayer materials such as LiF / Ca or LiF / Al, or compounds or mixtures thereof (e.g., AgMg, AgYb, or MgYb). In another embodiment, the second electrode CE may have a multilayer structure including a reflective or semi-transmissive / semi-reflective film formed from the above materials and a transparent conductive film formed from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, the second electrode CE may include the above-mentioned metallic materials, combinations of two or more metallic materials selected from the above-mentioned metallic materials, oxides of the above-mentioned metallic materials, etc.

[0134] In this embodiment, the encapsulation layer TFE can be disposed on the display element layer DP-EL, wherein the encapsulation layer TFE can be disposed on the second electrode CE and can cover the light-emitting element ED. The encapsulation layer TFE can include multiple thin films. For example, the encapsulation layer TFE can include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film can protect the light-emitting element ED from moisture / oxygen, and the organic film can protect the light-emitting element ED from foreign matter such as dust particles.

[0135] In this embodiment, the electronic device can be manufactured using an electronic device manufacturing method. Figure 6A and Figure 6B This is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment. Figures 7 to 10 This is a schematic view illustrating the manufacturing steps of an electronic device according to an embodiment. In the following, regarding... Figures 6A to 10 The description will no longer be explained or referenced. Figures 1 to 5 The content described is repetitive, and the following description will focus primarily on the differences.

[0136] In the embodiments, and referring to Figure 6A The method for manufacturing an electronic device may include the steps of preparing a preliminary window component (S100), providing the preliminary window component on a display panel (S200), and forming the window component (S300). The preliminary window component P-WP (see...) Figure 10 This may include a support membrane EOF (see [link]). Figure 10 ), set in the support membrane EOF (see Figure 10 Coated window CW on ) (see Figure 10 ) and with coated window CW (see Figure 10 ) spaced apart and supported by the EOF membrane (see Figure 10 ) in the coated window CW (see Figure 10 ) and preliminary light-blocking pattern P-BM (see Figure 10 The initial light-blocking pattern P-BM between ) (see Figure 10 ). Reference Figure 6B The preparation of the preliminary window component (S100) may include the steps of preparing a support film (S110), forming a preliminary light-blocking pattern (S120), and forming a coated window (S130).

[0137] Figures 7 to 9 This schematically illustrates the preparation of a preliminary window component P-WP according to an embodiment (see [reference]). Figure 10 A view of the steps. In an embodiment, a light-blocking composition BC may be provided to form a preliminary light-blocking pattern P-BM (see...). Figure 10 ). Reference Figure 7 The light-blocking composition BC can be provided on one surface EOF_DF of the supporting EOF. The light-blocking composition BC can be directly provided on one surface EOF_DF of the supporting EOF, wherein one surface EOF_DF of the supporting EOF can be a reference... Figure 4 The lower surface EOF_DF of the support film EOF is described. On the third direction (i.e., the thickness direction) DR3, another surface EOF_UF of the support film EOF, spaced apart from one surface EOF_DF, can be a reference. Figure 4 The upper surface of the support membrane EOF is described as EOF_UF.

[0138] In the embodiments, the light-blocking composition BC may include a black colorant, an ultraviolet photoinitiator, a near-infrared photosensitizer, a near-infrared photoinitiator, and an adhesive resin. The light-blocking composition BC may be provided by inkjet printing or dot coating methods. Figure 7 The light-blocking composition BC is shown being delivered via nozzle NZ, but the apparatus for delivering the light-blocking composition BC is not limited thereto.

[0139] In the embodiments and referenced Figure 8 The light-blocking composition BC can be applied to one surface EOF_DF of the support film EOF by irradiation with ultraviolet light LT-1. The light-blocking composition BC is cured by ultraviolet light LT-1, and a preliminary light-blocking pattern P-BM can be formed (see...). Figure 9 The step of irradiation with ultraviolet LT-1 can be a temporary curing step, and the shape of the initial light-blocking pattern P-BM can be maintained through this temporary curing step. The total amount of ultraviolet LT-1 emitted into the light-blocking composition BC can be about 100 mJ or less. For example, the total amount of ultraviolet LT-1 emitted into the light-blocking composition BC can be about 5 mJ or more, about 10 mJ or more, or about 20 mJ or more.

[0140] In an embodiment, yellowing occurs in the support film when the light-blocking composition is irradiated with ultraviolet light greater than about 100 mJ. When excessive ultraviolet light (i.e., ultraviolet light greater than about 100 mJ) is provided to the support film comprising organic materials, a photo-oxidation reaction causes the support film to yellow. On the other hand, during the formation of the initial light-blocking pattern P-BM (see... Figure 9 In the step of ), the total amount of ultraviolet LT-1 provided to the light-blocking composition BC is about 100 mJ or less, and thus can prevent the yellowing of the support film EOF.

[0141] In the embodiments, and referring to Figure 9 A preliminary light-blocking pattern P-BM can be formed on one surface of the supporting EOF, EOF_DF. Subsequently, a coating liquid CAL can be provided on the other surface of the supporting EOF, EOF_UF, wherein the coating liquid CAL is provided to form a coating window CW (see...). Figure 10 ) and can be directly applied to the other surface of the supporting EOF membrane, EOF_UF. A coating window CW can be formed by curing the coating liquid CAL applied to the other surface of the supporting EOF membrane, EOF_UF (see...). Figure 10 The coating liquid CAL may include organic materials. For example, the coating liquid CAL may include a base resin such as a silicone resin, a polyurethane resin, a urethane acrylate resin, a polyurea resin, or an epoxy resin. The base resin of the coating liquid CAL may include a thermosetting resin or a photocurable resin. For example, the coating liquid CAL may include a thermosetting resin. However, this is given by way of example, and the materials included in the coating liquid CAL are not limited thereto.

[0142] In an embodiment, the coating window CW formed by providing the coating liquid CAL can have a pencil hardness of about 9H or greater, a bright spot appearance height of about 11 cm or greater as assessed by a DuPont impact tester, and an indentation modulus (EIT) of about 800 MPa or greater as measured by a nanoindenter. Figure 9 The application of coating liquid CAL is shown through nozzle NZ, but the apparatus for applying coating liquid CAL is not limited thereto.

[0143] In the embodiments and referenced Figure 10 The display module DM, including the display panel DP and the input sensing component TSP, can be housed within the housing HAU, and a preliminary window component P-WP can be provided. Furthermore, when the display module DM is housed within the housing HAU, the electronic device EA (see...) Figure 3 Other components (e.g., lower component CP, protective film PF, module adhesive layer AL2, light control layer PP, optical adhesive layer AL1, etc.) can be further housed in the housing HAU.

[0144] In an embodiment, a light-blocking pattern BM can be formed by irradiating a preliminary light-blocking pattern P-BM included in a preliminary window member P-WP with near-infrared LT-2 (see [link]). Figure 3 ) window component WP (see Figure 3 Due to illumination with near-infrared LT-2, the light-blocking pattern BM (see...) Figure 3 The HAU and the outer shell can be physically / chemically coupled. Irradiation with near-infrared LT-2 can be the main curing step.

[0145] In an embodiment, ultraviolet LT-1 (see...) is used... Figure 8 The light-blocking pattern BM formed by irradiation with near-infrared LT-2 (see) Figure 3 The light-blocking pattern BM formed in this way can have an optical density of approximately 3 or greater. Figure 3 It can have an adhesive force of about 5B or greater relative to the support membrane EOF and the housing HAU, and this adhesive force can be measured using the ASTM D3359 method.

[0146] In this embodiment, the window element WP is formed by irradiation with near-infrared LT-2 (see [reference]). Figure 3 The steps can be performed at approximately 80°C or lower. For example, the window element WP can be formed by irradiation with near-infrared LT-2 (see...). Figure 3 The steps can be performed at a temperature of about 10°C or higher, or at a temperature of about 20°C or higher.

[0147] When the window component is formed at a temperature greater than approximately 80°C, the high temperature (i.e., a temperature greater than approximately 80°C) causes damage to the display panel, etc. In an embodiment, in the electronic device manufacturing method, the window component WP (see...) is formed... Figure 3 The steps are performed at a temperature of approximately 80°C or lower to achieve excellent processability.

[0148] In this embodiment, near-infrared LT-2 can pass through the coated window (CW) and the supporting film (EOF) to be emitted onto the initial light-blocking pattern (P-BM). The coated window (CW) and the supporting film (EOF) can each have a transmittance of about 50% or higher relative to the near-infrared LT-2. The coated window (CW) and the supporting film (EOF) can each have a transmittance of about 50% or higher relative to light having a wavelength range of about 700 nm to about 1000 nm. Therefore, near-infrared LT-2 can pass through the coated window (CW) and the supporting film (EOF) and reach the initial light-blocking pattern (P-BM). The near-infrared LT-2 does not react with the organic materials included in the coated window (CW) and the supporting film (EOF) (e.g., chemical reactions such as photo-oxidation).

[0149] Unlike the electronic device manufacturing method according to the embodiment, yellowing occurs in the coating window and support film when the preliminary light-blocking pattern is irradiated with ultraviolet light to form a light-blocking pattern. Since the coating window and support film comprise organic materials, yellowing occurs when irradiated with excessive ultraviolet light. Furthermore, considering the user's operating environment, since the coating window and support film have ultraviolet-blocking properties, the emitted ultraviolet light does not penetrate the coating window and support film, or the emitted ultraviolet light cannot reach the lower side of the preliminary light-blocking pattern (i.e., the deeper portion in the third direction (i.e., the thickness direction) DR3). Therefore, when the preliminary light-blocking pattern is irradiated with ultraviolet light, the light-blocking pattern cannot be formed from the preliminary light-blocking pattern.

[0150] In the electronic device manufacturing method according to the embodiment, the light-blocking pattern BM is formed by irradiation with near-infrared LT-2, and therefore no damage (i.e., yellowing) occurs to the coated window CW and the support film EOF, and the underside of the preliminary light-blocking pattern P-BM can also be easily cured. Furthermore, the electronic device manufacturing method according to the embodiment may not include providing and curing the window member WP (see...) Figure 3 The process involves attaching an additional adhesive to the HAU housing. Therefore, the electronic device manufacturing method according to the embodiment exhibits excellent processability and manufacturing efficiency.

[0151] In an embodiment, the electronic device may include a window member disposed on a display panel. The window member may include a light-blocking pattern spaced apart from a coated window, with a support film disposed between the coated window and a light-blocking pattern. The light-blocking pattern may be formed from a light-blocking composition, and the light-blocking composition may include a black colorant, an ultraviolet photoinitiator, a near-infrared photoinitiator, a near-infrared photosensitizer, and an adhesive resin. Therefore, the light-blocking pattern can couple the housing and the window member without additional adhesive, and thus prevent light leakage. Consequently, the electronic device according to the embodiment can exhibit excellent display quality and can have reduced thickness and improved surface quality.

[0152] In this embodiment, the electronic device can be manufactured using an electronic device manufacturing method. The electronic device manufacturing method may include the steps of forming a preliminary light-blocking pattern by providing a light-blocking composition and forming a light-blocking pattern by irradiating the preliminary light-blocking pattern with near-infrared light. Therefore, a light-blocking pattern can be formed without damaging the coating window and the support film, and thus this electronic device manufacturing method exhibits excellent processability and excellent manufacturing efficiency.

[0153] In one embodiment, the electronic device includes a light-blocking pattern disposed beneath a support film, and thus can have reduced thickness and improved surface quality, exhibiting excellent display quality.

[0154] In one embodiment, the electronic device manufacturing method includes the step of forming a light-blocking pattern by irradiation with near-infrared light, and thus can exhibit excellent processability and excellent manufacturing efficiency.

[0155] Although embodiments of the invention have been described, it should be understood that the invention is not limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of the invention.

[0156] Therefore, the scope of the present invention is not limited to the details described in the specification, but should be determined by the claims. Furthermore, the embodiments disclosed herein are not intended to limit the spirit of the invention, and all technical ideas disclosed herein should be interpreted as being included within the scope of the invention. Moreover, embodiments or parts thereof may be combined, in whole or in part, without departing from the scope of the invention.

Claims

1. An electronic device, wherein, The electronic device includes: Display panel; and A window component is disposed on the display panel, and the window component includes a support film, a coated window disposed on the support film, and a light-blocking pattern spaced apart from the coated window. The support film is disposed between the coated window and the light-blocking pattern. The light-blocking pattern is formed by a light-blocking composition, which includes a black colorant, an ultraviolet light initiator, a near-infrared photosensitizer, a near-infrared light initiator, and an adhesive resin.

2. The electronic device according to claim 1, wherein, The first edge of the coated window, the second edge of the supporting film, and the third edge of the light-blocking pattern are oriented to be parallel to each other in the thickness direction.

3. The electronic device according to claim 1, wherein, The electronic device also includes: A light control layer is disposed between the display panel and the window component; and An optical adhesive layer is disposed between the light control layer and the window component. The side surface of the light-blocking pattern is in contact with the optical adhesive layer.

4. The electronic device according to claim 1, wherein, The light-blocking pattern has an optical density of 3 or greater and an adhesive force of 5B or greater relative to the support film, as measured by the American Society for Testing and Materials (ASTM) method D3359.

5. The electronic device according to claim 1, wherein, The light-blocking pattern has a thickness ranging from 3 μm to 50 μm.

6. The electronic device according to claim 1, wherein, The electronic device also includes a housing that houses the display panel. The upper surface of the light-blocking pattern is in contact with the support film, and the lower surface of the light-blocking pattern is in contact with the outer shell.

7. The electronic device according to claim 1, wherein, The supporting membrane completely overlaps with the coated window.

8. The electronic device according to claim 1, wherein, The coated window has a pencil hardness of 9H or greater, a bright spot appearance height of 11 cm or greater as assessed by a DuPont impact tester, and an indentation modulus of 800 MPa or greater as measured by a nanoindenter.

9. The electronic device according to claim 1, wherein, The support film and the coating window each have a transmittance of 50% or higher relative to light with a wavelength range of 700 nm to 1000 nm.

10. A method for manufacturing an electronic device, wherein, The method includes: A preliminary window component is prepared, the preliminary window component including a support film, a coated window disposed on the support film, and a preliminary light-blocking pattern spaced apart from the coated window, the support film being disposed between the coated window and the preliminary light-blocking pattern; The display panel is housed within a housing, and the preliminary window component is provided on the display panel; and The window component is formed by irradiating the preliminary light-blocking pattern with near-infrared light. The preparation of the preliminary window component includes: Prepare the support membrane; The initial light-blocking pattern is formed by providing a light-blocking composition on one surface of the support film and irradiating the light-blocking composition with ultraviolet light; and A coating window is formed by providing a coating liquid on another surface of the support membrane that is spaced apart from the first surface in the thickness direction. The light-blocking composition includes a black colorant, an ultraviolet light initiator, a near-infrared photosensitizer, a near-infrared light initiator, and an adhesive resin.

11. The method according to claim 10, wherein, In the formation of the window component, the near-infrared rays pass through the support film and the coated window to illuminate the initial light-blocking pattern.

12. The method according to claim 10, wherein, The formation of the window component is performed at a temperature of 80°C or lower.

13. The method according to claim 10, wherein, In forming the initial light-blocking pattern, the total amount of ultraviolet light provided is 100 mJ or less.

14. The method of claim 10, wherein, The ultraviolet photoinitiator includes iodized salt. The near-infrared photosensitizer includes heptamethrin dye. The near-infrared photoinitiator includes coumarin acyl aniline salt, and The adhesive resin includes at least one of silicone resin, urethane resin, and acrylic resin.

15. The method according to claim 10, wherein, The light-blocking composition is provided by inkjet printing or dot coating.

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