Bonding device

Abstract

The present invention improves the reliability of joining. A bonding device (1) is provided with: a transport mechanism (20) that transports a substrate (SB); a bonding tool (43) that bonds the electronic component (CH) to the substrate (SB); and an anti-oxidation path (100) having a wall section (110) extending along the transport mechanism (20) and surrounding the transport mechanism (20), the wall section (110) having: an introduction port (115) into which the substrate (SB) is introduced; an opening part (117) capable of realizing approaching or separation between the bonding tool (43) and the substrate (SB); and a lead-out port (116) for leading out the substrate (SB) to which the electronic component (CH) is bonded, the antioxidant path (100) further comprising: a gas introduction port (130) for introducing an antioxidant gas to the inside of the wall section (110); and pores (150, 160) for generating a pressure loss in the antioxidant gas introduced from the gas introduction port (130) to the inside of the wall (110).

Description

Technical Field

[0001] This invention relates to a coupling device. Background Technology

[0002] Bonding devices, for example, in a forming gas environment, bond electronic components to a substrate via bonding members.

[0003] For example, Patent Document 1 discloses a heater track cover that covers a heating block and forms a tunnel within which a substrate is transported and heated. The heater track cover has openings for accessing the substrate. The heater track cover also includes a gas curtain formed by an antioxidant gas covering the openings.

[0004] [Existing Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent No. 3290138 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] However, in the bonding device described in Patent Document 1, it is difficult to sufficiently suppress the introduction of oxidizing gas into the heater track cover, and sometimes the substrate, electronic components and bonding members are oxidized, reducing the reliability of the bonding.

[0009] This invention was made in view of this situation, and its object is to provide a joining device that can achieve improved reliability of the joining.

[0010] [Technical means to solve the problem]

[0011] One embodiment of the bonding apparatus of this application invention includes: a conveying mechanism for conveying a substrate; a bonding tool for bonding electronic components to the substrate; and an anti-oxidation path having a wall extending along and surrounding the conveying mechanism; the wall having: an inlet for introducing the substrate; an opening for enabling the bonding tool to approach or separate from the substrate; and an outlet for exporting the substrate with the bonded electronic components. The anti-oxidation path further includes: a gas inlet for introducing an anti-oxidation gas into the inner side of the wall; and a fine orifice for causing pressure loss of the anti-oxidation gas introduced from the gas inlet into the inner side of the wall.

[0012] [The effects of the invention]

[0013] The present invention provides a joining device that can improve the reliability of the joining. Attached Figure Description

[0014] Figure 1 This is a perspective view showing the joining device according to the first embodiment of the present invention.

[0015] Figure 2 This is a plan view of the heating furnace according to the first embodiment of the present invention.

[0016] Figure 3 This is a cross-sectional view of the heating furnace according to the first embodiment of the present invention.

[0017] Figure 4 This is a flowchart illustrating the joining method of the first embodiment of the present invention.

[0018] Figure 5 This is a diagram illustrating the situation during the joining process.

[0019] Figure 6 This is a diagram illustrating the situation during the joining process.

[0020] Figure 7 This is a diagram illustrating the situation during the joining process.

[0021] Figure 8 This is a diagram illustrating the situation during the joining process.

[0022] Figure 9 This is a diagram illustrating the situation during the joining process.

[0023] Figure 10 This is a cross-sectional view of the heating furnace according to the second embodiment of the present invention.

[0024] Figure 11 This is a perspective view showing the joining device according to the third embodiment of the present invention.

[0025] Explanation of icon numbers

[0026] 1, 3: Connecting device

[0027] 20: Moving and transporting organizations

[0028] 30: Camera Unit

[0029] 31: Camera drive mechanism

[0030] 33: Camera Department

[0031] 40: Connector

[0032] 41: Engaging tool drive mechanism

[0033] 43: Joining tools

[0034] 50: Electronic Components Supply Department

[0035] 100: Antioxidant Pathway / Heating Furnace

[0036] 110: Furnace wall / wall section

[0037] 111: Top Wall

[0038] 112, 113: Side walls

[0039] 114: Bottom wall

[0040] 115: Inlet

[0041] 116: Outlet

[0042] 117, 317: Opening

[0043] 130, 131, 132, 133, 134: Gas inlet; 140, 142, 143, 144, 145, 146, 147, 148, 149: Isolation wall; 150: Fine pore section / primary mesh section

[0044] 151, 152, 153, 154: Primary mesh area

[0045] 160: Fine-pore section / Secondary mesh section

[0046] 161, 162, 163, 164: Secondary mesh

[0047] 170, 370: Gas ejection section

[0048] 171: Gas ejection outlet

[0049] 180: Heater

[0050] 200: Heating Furnace

[0051] 250: Flow path adjustment component

[0052] 251, 252, 253, 254: Plate-like members

[0053] BM: Joining component

[0054] CH: Electronic Components

[0055] S10, S20, S30, S40, S50, S60: Operation

[0056] SB: Substrate

[0057] SBa, SBb: Main face

[0058] X, Y, Z: Axes Detailed Implementation

[0059] The following describes embodiments of the present invention. In the following drawings, identical or similar constituent elements are represented by identical or similar symbols. The drawings are illustrative, and the dimensions or shapes of the parts are schematic and should not be interpreted as limiting the technical scope of the present invention to the described embodiments.

[0060] <First Implementation>

[0061] <<Connecting Device>>

[0062] First, refer to Figures 1 to 3 The structure of the joining device 1 according to one embodiment of the present invention will be described. Figure 1 This is a perspective view showing the joining device according to the first embodiment of the present invention. Figure 2 This is a plan view of the heating furnace according to the first embodiment of the present invention. Figure 3 This is a cross-sectional view of the heating furnace according to the first embodiment of the present invention.

[0063] The bonding device 1 bonds the electronic component CH to the substrate SB via the bonding member BM. The substrate SB has a pair of main surfaces SBa and SBb, where the main surface SBa is the bonding surface for bonding the electronic component CH.

[0064] The substrate SB is, for example, a copper (Cu) alloy lead frame, but is not limited to this. The substrate SB may also be, for example, an iron (Fe) alloy lead frame, a ceramic substrate, or a semiconductor substrate.

[0065] Electronic component CH can be, for example, a semiconductor chip (also called a "die"), but is not limited to this. Electronic component CH can also be, for example, various active or passive components.

[0066] The bonding component BM is, for example, a gold-tin (Au-Sn) eutectic alloy, but is not limited to this. The bonding component BM may also be, for example, a gold-silicon (Au-Si) eutectic alloy, solder, organic adhesive or inorganic adhesive.

[0067] Before the electronic component CH is bonded to the substrate SB, the bonding member BM is provided, for example, on the side of the electronic component CH, but is not limited thereto. Before the electronic component CH is bonded to the substrate SB, the bonding member BM may also be provided on the side of the substrate SB, or a portion of the bonding member BM may be provided on the side of the electronic component CH, and another portion of the bonding member BM may be provided on the side of the substrate SB. Furthermore, the substrate SB and the electronic component CH may be in a separate state before being moved into the furnace 100 (described later), but the electronic component CH may also be mounted or temporarily bonded to the substrate SB being moved into the furnace 100.

[0068] The bonding device 1 bonds the electronic component CH to the substrate SB in an antioxidant gas environment. The antioxidant gas is, for example, a forming gas made by mixing a reducing gas such as hydrogen with an inert gas such as nitrogen, but is not limited to this. The antioxidant gas may also be, for example, an inert gas or a reducing gas.

[0069] like Figure 1 As shown, the joining device 1 includes a heating furnace 100, a conveying mechanism 20, a camera unit 30, a joining head 40, and an electronic component supply unit 50. Here, for convenience, Figure 1 It includes an orthogonal axis consisting of three axes: X-axis, Y-axis, and Z-axis. The X-axis direction is the direction in which the conveying mechanism 20 conveys the substrate SB, with the substrate SB being conveyed from the negative X-axis direction towards the positive X-axis direction. The Y-axis direction, together with the X-axis direction, is defined along the surfaces of a pair of main surfaces SBa and SBb of the substrate SB conveyed by the conveying mechanism 20. Additionally, the Y-axis direction is the direction in which the heating furnace 100 and the electronic component supply unit 50 are arranged. The Z-axis direction is the direction in which the pair of main surfaces SBa and SBb of the substrate SB conveyed by the conveying mechanism 20 overlap, and it is the direction in which the bonded substrate SB and the electronic component CH are arranged. Figure 2 The same applies to the X-axis, Y-axis, and Z-axis in the figures thereafter. In the following description, the top view from the negative Z-axis direction will be simply referred to as "top view". In addition, sometimes the negative X-axis direction is expressed as "front", the positive X-axis direction as "rear", the negative Z-axis direction as "up", and the positive Z-axis direction as "down", but this does not limit the orientation of the joint device 1, etc.

[0070] The heating furnace 100 is an example of an antioxidant pathway. The heating furnace 100 heats the joining components in an antioxidant gas environment. The heating furnace 100 includes: a furnace wall 110 (as an example of a wall surrounding the conveying mechanism 20), a gas inlet 130, an isolation wall 140, a primary mesh section 150, a secondary mesh section 160, a gas ejection section 170, and a heater 180. Furthermore, in this embodiment, as an example of a fine-pore section that causes pressure loss in the antioxidant gas, a structure including a mesh section with a mesh structure (including the primary mesh section 150 and the secondary mesh section 160) is described. However, the fine-pore section is not limited to a mesh structure; for example, it can also be perforated metal. Additionally, the number of holes in the fine-pore section is not particularly limited, and the shape of the holes is not limited to rectangles; it can also be circular or polygonal.

[0071] The furnace wall 110 is an outer wall used to make the space where the joint is implemented, i.e., the inner side of the furnace wall 110, an anti-oxidizing gas environment. The furnace wall 110 is arranged in a cylindrical shape along the conveying mechanism 20. The furnace wall 110 has a top wall 111, side walls 112, side walls 113, bottom wall 114, inlet 115, outlet 116, and opening 117.

[0072] The top wall 111 is a wall portion that faces the substrate SB transported by the conveying mechanism 20 at a distance from its main surface SBa. The side wall 112 is a wall portion that connects the end of the top wall 111 in the negative Y-axis direction to the end of the bottom wall 114 in the negative Y-axis direction via a partition wall 142 (described later). The side wall 113 is a wall portion that connects the end of the top wall 111 in the positive Y-axis direction to the end of the bottom wall 114 in the positive Y-axis direction via a partition wall 143 (described later). The bottom wall 114 is a wall portion that faces the substrate SB transported by the conveying mechanism 20 at a distance from its main surface SBb. The top wall 111, side wall 112, side wall 113, and bottom wall 114 have a length direction extending along the X-axis.

[0073] Furthermore, the isolation wall 142 and the side wall 112 are combined to form the first side wall of the furnace wall 110. The isolation wall 143 and the side wall 113 are combined to form the second side wall of the furnace wall 110. The first side wall and the second side wall are a pair of side walls that connect the top wall 111 and the bottom wall 114 of the furnace wall 110. The pair of side walls extend from the end of the top wall 111 in the Y-axis direction along the Z-axis direction intersecting the main surface SBa of the substrate SB toward the bottom wall 114. In addition, the pair of side walls extend from the end of the bottom wall 114 in the Y-axis direction along the Z-axis direction toward the top wall 111. The first side wall is the side wall located on the side of the electronic component supply section 50 of the pair of side walls.

[0074] The inlet 115 and outlet 116 are a pair of open ends of the cylindrical furnace wall 110. The inlet 115 is the open end on the negative X-axis side of the furnace wall 110, and the outlet 116 is the open end on the positive X-axis side of the furnace wall 110. The substrate SB to be bonded with electronic components CH is introduced into the heating furnace 100 through the inlet 115. The substrate SB with the electronic components CH bonded to it is exited from the heating furnace 100 through the outlet 116.

[0075] The opening 117 is an opening used to bring the bonding tool 43 (described later) closer to or separate it from the substrate SB. The opening 117 is a through-hole that extends through the top wall 111 along the Z-axis direction. The opening 117 is configured to have a slit shape extending along the Y-axis direction in the longitudinal direction. The opening 117 is also used by the imaging unit 33 (described later) to photograph the substrate SB or the electronic component CH bonded to the substrate SB.

[0076] An antioxidant gas is introduced into the inner side of the furnace wall 110 through a gas inlet 130. The gas inlet 130 has four gas inlets 131, 132, 133, and 134. Gas inlet 131 corresponds to an example of the first gas inlet, gas inlet 132 corresponds to an example of the second gas inlet, gas inlet 133 corresponds to an example of the third gas inlet, and gas inlet 134 corresponds to an example of the fourth gas inlet.

[0077] Gas inlets 131 to 134 are configured to allow for independent adjustment of the amount of antioxidant gas introduced. Specifically, although the figures are omitted, flow meters or flow regulating valves are installed on the piping connected to gas inlets 131 to 134.

[0078] like Figure 2 and Figure 3 As shown, gas inlets 131 to 134 are connected to the top wall 111. Gas inlets 131 to 134 are arranged along the X-axis at the center of the top wall 111 in the Y-axis direction. Gas inlet 131 is located between inlet 115 and opening 117. Gas inlet 132 is located between gas inlet 131 and opening 117. Gas inlet 133 is located between opening 117 and outlet 116. Gas inlet 134 is located between gas inlet 133 and outlet 116. The top-view area (hereinafter referred to as "area") of each of the gas inlets 131 to 134 is, for example, approximately equal to each other.

[0079] Furthermore, the number of gas inlets is not limited to four. For example, one gas inlet may be provided on both the inlet and outlet sides relative to the opening, or three or more gas inlets may be provided. Additionally, the number of gas inlets provided on the inlet and outlet sides relative to the opening may differ. For example, when the substrate is introduced into the heating furnace, external oxidizing gases are easily carried into the inner side of the furnace wall; therefore, the number of gas inlets on the inlet side may be greater than that on the outlet side. The gas inlets are not limited to connection to the top wall. For example, the gas inlets may also be connected to the isolation wall described later, or to the side or bottom wall of the furnace.

[0080] The isolation wall 140 divides the space below the top wall 111 in the XY plane direction. The isolation wall 140 includes isolation walls 142, 143, 144, 145, 146, 147, 148, and 149. Isolation walls 142, 143, 144, and 149 are examples of outer isolation walls separating the antioxidant gas introduced from the gas inlet 130 from the outside air. Isolation walls 145, 146, 147, and 148 are examples of inner isolation walls that separate the antioxidant gas introduced from gas inlets 131 to 134 from each other within the space surrounded by isolation walls 142, 143, 144, and 149.

[0081] like Figure 2 and Figure 3As shown, the upper ends of isolation walls 142 to 149 are connected to the top wall 111. Isolation wall 142 is connected to the end of the top wall 111 on the negative Y-axis side and is provided from the end of the top wall 111 on the negative X-axis side to the end on the positive X-axis side. Isolation wall 143 is connected to the end of the top wall 111 on the positive Y-axis side and is provided from the end of the top wall 111 on the negative X-axis side to the end on the positive X-axis side. A side wall 112 is connected to the lower end of isolation wall 142, and a side wall 113 is connected to the lower end of isolation wall 143.

[0082] Isolation wall 144 is connected to the end of top wall 111 on the negative X-axis side, and is provided from the end of top wall 111 on the negative Y-axis side to the end of top wall 111 on the positive Y-axis side. Isolation wall 145 is partially connected to the gas inlet 131 and gas inlet 132 of top wall 111, and is provided from the end of top wall 111 on the negative Y-axis side to the end of top wall 111 on the positive Y-axis side. Isolation wall 146 is partially connected to the gas inlet 132 and opening 117 of top wall 111, and is provided from the end of top wall 111 on the negative Y-axis side to the end of top wall 111 on the positive Y-axis side. Isolation wall 147 is partially connected to the opening 117 and gas inlet 133 of top wall 111, and is provided from the end of top wall 111 on the negative Y-axis side to the end of top wall 111 on the positive Y-axis side. The isolation wall 148 is partially connected to the gas inlet 133 and gas inlet 134 of the top wall 111, and is provided from the end of the top wall 111 in the negative Y-axis direction to the end in the positive Y-axis direction. The isolation wall 149 is connected to the end of the top wall 111 in the positive X-axis direction, and is provided from the end of the top wall 111 in the negative Y-axis direction to the end in the positive Y-axis direction. One end of the isolation walls 144 and 149 is connected to the isolation wall 142, and the other end of the isolation walls 144 and 149 is connected to the isolation wall 143.

[0083] The first space below the gas inlet 131 is surrounded by isolation walls 142, 143, 144, and 145 in the XY plane. The second space below the gas inlet 132 is surrounded by isolation walls 142, 143, 145, and 146 in the XY plane. The opening 117 is surrounded by isolation walls 142, 143, 146, and 147 in the XY plane. The third space below the gas inlet 133 is surrounded by isolation walls 142, 143, 147, and 148 in the XY plane. The fourth space below the gas inlet 134 is surrounded by isolation walls 142, 143, 148, and 149 in the XY plane. Isolation walls 142, 143, 144, and 145 are examples of the first isolation walls that divide the first space. Isolation walls 142, 143, 145, and 146 are examples of second isolation walls that divide the second space. Isolation walls 142, 143, 147, and 148 are examples of third isolation walls that divide the third space. Isolation walls 142, 143, 148, and 149 are examples of fourth isolation walls that divide the fourth space.

[0084] The volume of the first space enclosed by isolation walls 142, 143, 144, and 145 is greater than the volume of the second space enclosed by isolation walls 142, 143, 145, and 146. The volume of the fourth space enclosed by isolation walls 142, 143, 148, and 149 is greater than the volume of the third space enclosed by isolation walls 142, 143, 147, and 148. The volumes of the first and fourth spaces are approximately equal, and the volumes of the second and third spaces are approximately equal.

[0085] Each of the first to fourth spaces has one gas inlet, but this is not a limitation. Two or more gas inlets may also be connected to each of the first to fourth spaces. Furthermore, the number of gas inlets connected to each of the first to fourth spaces may vary.

[0086] The primary mesh section 150 causes a pressure loss in the antioxidant gas introduced from the gas inlet 130 into the inner side of the furnace wall 110. Hereinafter, the pressure loss of the antioxidant gas generated by the primary mesh section 150 will be referred to as "primary pressure loss". The primary mesh section 150 is provided on the inner side of the furnace wall 110 away from the gas inlet 130. The area of ​​the primary mesh section 150 is larger than the area of ​​the gas inlet 130. The primary mesh section 150 is, for example, a metal mesh with an opening ratio of 10% or more and 60% or less, and an opening diameter (aperture) of 0.010 mm or more and 0.500 mm or less.

[0087] Furthermore, as long as the primary mesh portion 150 allows for pressure loss of the antioxidant gas, the opening ratio and opening diameter of the primary mesh portion 150 are not limited to those described above. Since the primary mesh portion 150 is heated by radiant or conductive heat from the heater 180, the material of the primary mesh portion 150 is preferably a metal with good heat resistance. However, as long as it has sufficient heat resistance, the material of the primary mesh portion 150 may also be flame-retardant fiber or ceramic, etc.

[0088] The primary mesh portion 150 includes primary mesh portions 151, 152, 153, and 154. Each primary mesh portion 151 to 154 has a main surface extending along the XY plane and a through hole extending along the Z-axis. Primary mesh portion 151 corresponds to an example of a primary mesh portion in the first mesh portion. Primary mesh portion 152 corresponds to an example of a primary mesh portion in the second mesh portion. Primary mesh portion 153 corresponds to an example of a primary mesh portion in the third mesh portion. Primary mesh portion 154 corresponds to an example of a primary mesh portion in the fourth mesh portion.

[0089] The primary mesh section 151 causes a primary pressure loss in the antioxidant gas introduced into the inner side of the furnace wall 110 through the gas inlet 131. Viewed from above, the gas inlet 131 is located in the center of the primary mesh section 151. The end of the primary mesh section 151 connects to the middle portion of the partition walls 142, 143, 144, and 145 along the Z-axis. The primary mesh section 151 vertically separates the first space defined by the partition walls 142, 143, 144, and 145. The area of ​​the primary mesh section 151 is larger than the area of ​​the gas inlet 131.

[0090] The primary mesh section 152 causes a primary pressure loss in the antioxidant gas introduced into the inner side of the furnace wall 110 through the gas inlet 132. Viewed from above, the gas inlet 132 is located in the center of the primary mesh section 152. The end of the primary mesh section 152 connects to the middle portion of the partition walls 142, 143, 145, and 146 along the Z-axis. The primary mesh section 152 vertically separates the second space defined by the partition walls 142, 143, 145, and 146. The area of ​​the primary mesh section 152 is larger than the area of ​​the gas inlet 132.

[0091] The primary mesh section 153 causes a primary pressure loss in the antioxidant gas introduced into the inner side of the furnace wall 110 through the gas inlet 133. Viewed from above, the gas inlet 133 is located in the center of the primary mesh section 153. The end of the primary mesh section 153 connects to the middle portion of the partition walls 142, 143, 147, and 148 along the Z-axis. The primary mesh section 153 vertically separates the third space defined by the partition walls 142, 143, 147, and 148. The area of ​​the primary mesh section 153 is larger than the area of ​​the gas inlet 133.

[0092] The primary mesh section 154 causes a primary pressure loss in the antioxidant gas introduced into the inner side of the furnace wall 110 through the gas inlet 134. Viewed from above, the gas inlet 134 is located in the center of the primary mesh section 154. The end of the primary mesh section 154 connects to the middle portion of the partition walls 142, 143, 148, and 149 along the Z-axis. The primary mesh section 154 vertically separates the fourth space defined by the partition walls 142, 143, 148, and 149. The area of ​​the primary mesh section 154 is larger than the area of ​​the gas inlet 134.

[0093] The antioxidant gas introduced into the inner side of the furnace wall 110 through gas inlets 131 to 134 is restricted from flowing towards the bottom wall 114 due to the pressure loss of the primary mesh sections 151 to 154, and expands along the XY plane, passing through the primary mesh sections 151 to 154. At this time, the flow rate of the antioxidant gas in the furnace is reduced by passing through the primary mesh sections 151 to 154, thereby suppressing the entrainment of oxidizing gases from the outside near the gas inlets 131 to 134. Furthermore, by suppressing the flow rate deviation of the antioxidant gas per unit area, the generation of turbulence, which is the cause of oxidizing gas entrainment, can be suppressed. Moreover, by reducing the flow rate, the pressure drop in the furnace caused by the increase in flow rate and the accompanying intake of oxidizing gases from the outside into the furnace can be suppressed. In addition, by reducing the flow rate of the antioxidant gas, the heat transfer rate can be reduced, suppressing the decrease in peripheral temperature during connection.

[0094] The secondary mesh section 160 causes a pressure loss in the antioxidant gas that has passed through the primary mesh section 150. Hereinafter, the pressure loss caused by the antioxidant gas in the secondary mesh section 160 will be referred to as "secondary pressure loss". The secondary mesh section 160 is located on the inner side of the furnace wall, away from the primary mesh section 150. In plan view, for example, the area of ​​the secondary mesh section 160 is approximately equal to the area of ​​the primary mesh section 150. The secondary mesh section 160 is, for example, a metal mesh with the same opening ratio and opening diameter as the primary mesh section 150.

[0095] Furthermore, as long as the secondary mesh portion 160 allows for pressure loss of the antioxidant gas, the opening ratio and opening diameter of the secondary mesh portion 160 are not limited to those described above. The opening ratio or opening diameter of the secondary mesh portion 160 may also be smaller than that of the primary mesh portion 150. Additionally, the material of the secondary mesh portion 160 is preferably a heat-resistant metal, similar to the material of the primary mesh portion 150. However, as long as it possesses sufficient heat resistance, the material of the secondary mesh portion 160 may also be flame-retardant fiber or ceramic, etc. Since the secondary mesh portion 160 is further away from the heat source than the primary mesh portion 150, the material of the secondary mesh portion 160 may also have lower heat resistance compared to the material of the primary mesh portion 150.

[0096] The secondary mesh portion 160 includes secondary mesh portions 161, 162, 163, and 164. Secondary mesh portions 161 to 164 have main surfaces extending along the XY plane and through holes extending along the Z-axis. Secondary mesh portion 161 corresponds to an example of a secondary mesh portion in the first mesh portion. Secondary mesh portion 162 corresponds to an example of a secondary mesh portion in the second mesh portion. Secondary mesh portion 163 corresponds to an example of a secondary mesh portion in the third mesh portion. Secondary mesh portion 164 corresponds to an example of a secondary mesh portion in the fourth mesh portion.

[0097] The secondary mesh section 161 causes a secondary pressure loss in the antioxidant gas that has passed through the primary mesh section 151. In plan view, the gas inlet 131 is located at the center of the secondary mesh section 161. The end of the secondary mesh section 161 is connected to the lower ends of the partition walls 142, 143, 144, and 145. The secondary mesh section 161 vertically separates the first space defined by the partition walls 142, 143, 144, and 145, and the space sandwiched between the side walls 112 and 113 in the XY plane. The planar shape of the secondary mesh section 161 (hereinafter referred to as the "planar shape") is approximately equal to the planar shape of the primary mesh section 151. Furthermore, in plan view, the entire secondary mesh section 161 overlaps with the entire primary mesh section 151. The area of ​​the secondary mesh section 161 is larger than the area of ​​the gas inlet 131, and is approximately equal to the area of ​​the primary mesh section 151.

[0098] The secondary mesh section 162 causes a secondary pressure loss in the antioxidant gas that has passed through the primary mesh section 152. Viewed from above, the gas inlet 132 is located in the center of the secondary mesh section 162. The ends of the secondary mesh section 162 are connected to the lower ends of the partition walls 142, 143, 145, and 146. The secondary mesh section 162 vertically separates the second space defined by the partition walls 142, 143, 145, and 146, and the space sandwiched between the side walls 112 and 113 in the XY plane. The planar shape of the secondary mesh section 162 is approximately equal to that of the primary mesh section 152. Furthermore, viewed from above, the entire secondary mesh section 162 overlaps with the entire primary mesh section 152. The area of ​​the secondary mesh section 162 is larger than the area of ​​the gas inlet 132, and approximately equal to the area of ​​the primary mesh section 152.

[0099] The secondary mesh section 163 causes a secondary pressure loss in the antioxidant gas that has passed through the primary mesh section 153. Viewed from above, the gas inlet 133 is located in the center of the secondary mesh section 163. The end of the secondary mesh section 163 connects to the lower ends of the partition walls 142, 143, 147, and 148. The secondary mesh section 163 vertically separates the third space defined by the partition walls 142, 143, 147, and 148, and the space sandwiched between the side walls 112 and 113 in the XY plane. The planar shape of the secondary mesh section 163 is approximately equal to that of the primary mesh section 153. Furthermore, viewed from above, the entire secondary mesh section 163 overlaps with the entire primary mesh section 153. The area of ​​the secondary mesh section 163 is larger than the area of ​​the gas inlet 133, and approximately equal to the area of ​​the primary mesh section 153.

[0100] The secondary mesh section 164 causes a secondary pressure loss in the antioxidant gas that has passed through the primary mesh section 154. Viewed from above, the gas inlet 134 is located in the center of the secondary mesh section 164. The end of the secondary mesh section 164 is connected to the lower ends of the partition walls 142, 143, 148, and 149. The secondary mesh section 164 vertically separates the fourth space defined by the partition walls 142, 143, 148, and 149, and the space sandwiched between the side walls 112 and 113 in the XY plane. The planar shape of the secondary mesh section 164 is approximately equal to that of the primary mesh section 154. Furthermore, viewed from above, the entire secondary mesh section 164 overlaps with the entire primary mesh section 154. The area of ​​the secondary mesh section 164 is larger than the area of ​​the gas inlet 134, and approximately equal to the area of ​​the primary mesh section 154.

[0101] The antioxidant gas, after passing through the primary mesh sections 151 to 154, is restricted from flowing towards the bottom wall 114 due to the pressure loss in the secondary mesh sections 161 to 164, and expands along the XY plane through the secondary mesh sections 161 to 164. The antioxidant gas diffuses in stages along the XY plane through the primary mesh sections 151 to 154 and the secondary mesh sections 161 to 164. Thus, by passing through the secondary mesh sections 161 to 164, the velocity deviation of the antioxidant gas per unit area, which is a cause of turbulence, can be suppressed.

[0102] The antioxidant gas, having passed through secondary mesh sections 161 to 164, fills the space held by sidewalls 112 and 113 in the XY plane. The remaining antioxidant gas, along with the oxidizing gas remaining inside the furnace wall 110, is released from the inlet 115, outlet 116, and opening 117. Even when increasing the total flow rate of the antioxidant gas to efficiently discharge the oxidizing gas remaining inside the furnace wall 110, the velocity deviation of the antioxidant gas per unit area is small, making turbulence difficult to generate. Therefore, the introduction of external air, which is an oxidizing gas, into the furnace wall 110 from the inlet 115, outlet 116, and opening 117 due to turbulence of the antioxidant gas can be suppressed. In other words, by increasing the total flow rate of the antioxidant gas and suppressing the amount of oxidizing gas introduced due to turbulence of the antioxidant gas, the obstruction of the reduction in oxidizing gas concentration can be prevented. Therefore, poor bonding caused by oxidation of substrate SB or bonding member BM can be suppressed, and the reliability of bonding is improved.

[0103] Furthermore, in the case of eutectic bonding where the substrate SB or bonding member BM is easily oxidized due to bonding at high temperatures, it is necessary to reduce the concentration of oxidizing gases, especially those remaining in the furnace wall 110, and this embodiment is effective.

[0104] Furthermore, the size relationship between the secondary mesh portion and the primary mesh portion, or the number relationship between the secondary mesh portion and the primary mesh portion, is not limited to those described above. The area of ​​the secondary mesh portion may also differ from the area of ​​the primary mesh portion. For example, by making the area of ​​the secondary mesh portion larger than the area of ​​the primary mesh portion, the antioxidant gas introduced from the gas inlet can be expanded in stages along the XY plane. Additionally, the number of secondary mesh portions may also differ from the number of primary mesh portions. For example, by configuring one secondary mesh portion to overlap with two or more primary mesh portions, the antioxidant gas introduced from the gas inlet can be expanded in stages along the XY plane.

[0105] The planar shape of the secondary mesh portion, or its positional relationship relative to the primary mesh portion, is not limited to those described above. The planar shape of the secondary mesh portion may also differ from that of the primary mesh portion. A portion of the secondary mesh portion may be located outside the area overlapping with the primary mesh portion, and the entire secondary mesh portion may be located outside the area overlapping with the primary mesh portion.

[0106] The size relationship of the areas of the first to fourth mesh sections is not limited to that described. For example, the areas of the first to fourth mesh sections may be approximately equal to each other. That is, the areas of the primary mesh sections of the first to fourth mesh sections may be approximately equal to each other, and the areas of the secondary mesh sections of the first to fourth mesh sections may also be approximately equal to each other.

[0107] In this embodiment, the joining device has two overlapping mesh portions in the Z-axis direction, namely a primary mesh portion and a secondary mesh portion, but is not limited to this. The mesh portion may have only one mesh portion in the Z-axis direction, or it may have three or more mesh portions. Furthermore, in this embodiment, the joining device has multiple mesh portions arranged along the X-axis direction, but it may also have multiple mesh portions arranged along the Y-axis direction.

[0108] The gas ejection section 170 has a gas ejection outlet 171, which forms a gas flow of antioxidant gas that crosses the opening 117 on the outer side of the furnace wall 110. The gas ejection section 170 is provided on the top wall 111. The gas ejection outlet 171 extends along the Y-axis direction, which intersects the transport direction of the substrate SB, i.e., the X-axis direction. The gas ejection section 170 is located on the negative X-axis side of the opening 117, and the gas ejection outlet 171 opens toward the opening 117.

[0109] The gas flow contributes to the clarity of the image captured by the camera unit 30. The antioxidant gas within the furnace wall 110 is heated by the heater 180 and released as a heated gas flow from the opening 117. This heated gas flow becomes a heat wave, causing fluctuations in the image captured by the camera unit 30. The gas flow formed by the gas nozzle 171 exhausts the heated gas flow from above the opening 117, thus suppressing the generation of the heat wave. Consequently, the image captured by the camera unit 30 becomes clearer.

[0110] Heater 180 heats the bonding member BM by heating the substrate SB within the furnace wall 110. Heater 180 is provided, for example, on the upper surface of the bottom wall 114 or inside the bottom wall 114. Heater 180 is located below the opening 117. When the bonding head 40 presses down on the bonding member BM through the electronic component CH, heater 180 abuts against the main surface SBb of the substrate SB, thus also functioning as a support platform to overcome the pressure of the bonding head 40 on the substrate SB. Heater 180 may also be located closer to the inlet 115 than to the outlet 116 to preheat the substrate SB, so that the bonding member BM reaches a sufficiently high temperature during bonding. Heater 180 is located away from the outlet 116 to suppress oxidation of the substrate SB. Furthermore, heaters may also be located on the inner surface or inside the side walls 112 and 113.

[0111] The camera unit 30 captures images of the substrate SB or the electronic component CH bonded to the substrate SB. For example, based on the acquired image, the camera unit 30 compares the bonding area of ​​the substrate SB with the camera's field of view and corrects the landing position of the bonding tool 43. Additionally, for example, after the electronic component CH is installed on the substrate SB, the camera unit 30 acquires an image of the installed substrate SB and the electronic component CH, and corrects the landing position during the next bonding operation. By making the image clearer, the mounting accuracy is improved, and the frequency of defective products leaving the substrate is suppressed. That is, the reliability of the bonding is improved.

[0112] like Figure 1 As shown, the camera unit 30 includes a camera drive mechanism 31 and a camera unit 33. The camera drive mechanism 31 is a dual-axis orthogonal actuator that moves the camera unit 33 along the Y-axis and Z-axis directions. The camera unit 33 is a two-dimensional image sensor. The camera unit 33 is not particularly limited and can be, for example, a charge-coupled device (CCD) image sensor, a complementary metal-oxide-semiconductor (CMOS) image sensor, etc.

[0113] Furthermore, the camera unit can also be a three-dimensional image sensor. When the camera unit is a three-dimensional image sensor, the camera unit drive mechanism can also be a single-axis actuator that moves the camera unit along the Y-axis direction.

[0114] The connector 40 bonds the electronic component CH to the substrate SB. The connector 40 transports the electronic component CH picked up from the electronic component supply section 50, passes through the opening 117 to approach the substrate SB, and bonds the electronic component CH to the substrate SB.

[0115] like Figure 1As shown, the bonding head 40 includes a bonding tool drive mechanism 41 and a bonding tool 43. The bonding tool drive mechanism 41 is a triaxial orthogonal actuator that moves the bonding tool 43 along the X-axis, Y-axis, and Z-axis directions. The bonding tool 43 bonds the electronic component CH to the substrate SB. For example, when the bonding member BM is a eutectic alloy, the bonding tool 43 has a pressurizing function that presses the bonding member BM while separating the electronic component CH. The bonding tool 43 may also have a heating function that heats the bonding member BM while separating the electronic component CH, and a wiping function that wipes the bonding member BM. The bonding tool 43 is a pick-up collet that picks up the electronic component CH from the electronic component supply section 50. The bonding tool 43, holding the electronic component CH, passes through the opening 117 and approaches the substrate SB. At this time, the track of the front end holding the electronic component CH in the bonding tool 43 is, for example, arc-shaped. As a result, compared with the case where the track is straight, the moving distance and moving time of the bonding tool 43 are shortened.

[0116] Electronic component supply unit 50 supplies electronic component CH. Electronic component supply unit 50 is not particularly limited, for example, it is a tray feeder or a belt feeder.

[0117] <<Jointing Method>>

[0118] Next, refer to Figures 4 to 9 The joining method using the joining device 1 will be described. Figure 4 This is a flowchart illustrating the joining method of the first embodiment of the present invention. Figures 5 to 9 This diagram illustrates the situation during the joining process. Hereinafter, the inner side of the furnace wall 110 will be referred to as "furnace interior". The outer side of the furnace wall 110 will be referred to as "furnace exterior".

[0119] First, antioxidant gas is introduced into the furnace (S10).

[0120] like Figure 5As shown, antioxidant gas is introduced into the furnace through gas inlet 130. Antioxidant gas is introduced through gas inlets 131 to 134 respectively. The order in which the antioxidant gas is introduced through gas inlets 131 to 134 can be adjusted appropriately. For example, the order can be adjusted according to the relative positions of inlet 115, outlet 116, and opening 117. As an example, antioxidant gas can be introduced first through gas inlets 131 and 134, which are furthest from opening 117, followed by gas inlets 132 and 133, which are closest to opening 117. Conversely, antioxidant gas can also be introduced first through gas inlets 132 and 133, followed by gas inlets 131 and 134.

[0121] The flow rate and velocity of the antioxidant gas at each of the gas inlets 131 to 134 can be the same. Alternatively, the flow rate and velocity of the antioxidant gas at each of the gas inlets 131 to 134 can be different. For example, the flow rate and velocity of the antioxidant gas at each of the gas inlets 131 to 134 can be appropriately adjusted based on the size relationship between the areas of the primary mesh sections 151 to 154 or the secondary mesh sections 161 to 164. As an example, the flow rate and velocity of the antioxidant gas in the gas inlet 131 and gas inlet 134 facing the primary mesh section 151 to 154 with the larger area can be greater than the flow rate and velocity of the antioxidant gas in the primary mesh section 152 and gas inlet 133 facing the primary mesh section 151 to 154 with the smaller area.

[0122] Pressure loss occurs in the antioxidant gas introduced from the gas inlet as it passes through the primary mesh section 150 and the secondary mesh section 160.

[0123] Specifically, such as Figure 5 As shown, the antioxidant gas introduced through the gas inlet 130 comes into contact with the primary mesh portion 150, resulting in a pressure loss within the antioxidant gas. The antioxidant gas that comes into contact with the primary mesh portion 150 diffuses in the space surrounded by the isolation wall 140 in the XY plane and sandwiched between the top wall 111 and the primary mesh portion 150 in the Z-axis direction (hereinafter referred to as the "primary diffusion chamber"). The antioxidant gas diffused into the primary diffusion chamber passes through the primary mesh portion 150 as the internal pressure of the primary diffusion chamber increases.

[0124] Then, the antioxidant gas passing through the primary mesh section 150 comes into contact with the secondary mesh section 160, where a further pressure loss occurs. The antioxidant gas that comes into contact with the secondary mesh section 160 diffuses in the space surrounded by the isolation wall 140 in the XY plane and sandwiched between the primary mesh section 150 and the secondary mesh section 160 in the Z-axis direction (hereinafter referred to as the "secondary diffusion chamber"). The antioxidant gas diffusing into the secondary diffusion chamber passes through the secondary mesh section 160 as the internal pressure of the secondary diffusion chamber increases.

[0125] Thus, through the pressure loss of the antioxidant gas based on the primary mesh section 150 and the secondary mesh section 160, the furnace becomes an antioxidant gas environment.

[0126] Specifically, the antioxidant gas introduced into the furnace through the gas inlet 130 diffuses along the XY plane through the primary and secondary diffusion chambers, passing through the secondary mesh section 160 and filling the furnace. The oxidizing gases in the furnace are replaced by the antioxidant gas, creating an antioxidant gas environment inside the furnace. The antioxidant gas passing through the secondary mesh section 161 is mainly released from the inlet 115 to the outside of the furnace. The antioxidant gas passing through the secondary mesh sections 162 and 163 is mainly discharged from the opening 117 to the outside of the furnace. The antioxidant gas passing through the secondary mesh section 164 is mainly released from the outlet 116 to the outside of the furnace. The oxidizing gases remaining in the furnace are squeezed out by the antioxidant gas released from the inlet 115, outlet 116, and opening 117.

[0127] Thus, the pressure loss generated by the primary mesh section 150 and the secondary mesh section 160 limits the inflow rate of the antioxidant gas. This prevents the entrainment and intake of external air, which is an oxidizing gas. Furthermore, it suppresses the temperature drop near the bonding area caused by the intake of external air, allowing bonding to be performed at an ideal temperature and improving bonding quality.

[0128] Next, the valve (not shown) is operated to supply gas to the gas ejection section 170, forming a gas flow in the junction area inside the furnace (S20).

[0129] like Figure 6 As shown, antioxidant gas is ejected from the gas outlet 171 of the gas ejection section 170. The gas flow flows along the top wall 111 in the positive X-axis direction, forming a curtain-like structure covering the opening 117.

[0130] Next, the conveying device (not shown) is controlled to move the substrate SB into the furnace and position it at the location corresponding to the opening 117 (S30).

[0131] Specifically, such as Figure 7As shown, the substrate SB is transported into the furnace from the inlet 115 by the conveying mechanism 20. Inside the furnace, the substrate SB is heated by the heater 180 and simultaneously transported below the opening 117. External air, which is an oxidizing gas, is wrapped around the substrate SB when it is introduced into the furnace, but the oxidizing gas is removed by the antioxidant gas released from the inlet 115.

[0132] Next, the joint 40 is controlled to move the electronic component CH into the furnace (S40).

[0133] like Figure 7 As shown, electronic component CH is picked up from electronic component supply unit 50 by bonding tool 43 and carried into furnace through opening 117. External air, which is an oxidizing gas, is trapped during the introduction of bonding tool 43 and electronic component CH into the furnace, but this oxidizing gas is removed by antioxidant gas released from opening 117. Furthermore, the oxidizing gas trapped in bonding tool 43 and electronic component CH is removed by the gas flow formed by gas outlet 171.

[0134] Next, the bonding head 40 is controlled to bond the electronic component CH to the substrate SB (S50) inside the furnace.

[0135] like Figure 8 As shown, electronic components CH are bonded to a substrate SB supported by a heater 180 using a bonding tool 43. The bonding member BM is heated by the heater 180 and pressurized by the bonding tool 43. When the bonding of one electronic component CH is completed, the bonding tool 43 releases the electronic component CH and guides it out of the furnace through the opening 117. Then, the bonding tool 43 moves towards the electronic component supply section 50 to pick up the next electronic component CH.

[0136] External air, acting as an oxidizing gas, is introduced into the space where the joining tool 43 exits through the opening 117 and is directed out of the furnace. This oxidizing gas is expelled by the anti-oxidizing gas released from the opening 117 and by the gas flow formed by the gas outlet 171.

[0137] While the bonding tool 43 moves outside the furnace, the camera unit 33 captures images of the orientation or position of the electronic component CH through the opening 117 to check for bonding defects. The antioxidant gas released from the opening 117 is a heat wave that causes a decrease in image quality in the camera image obtained by the camera unit 33, but it is expelled by the gas flow formed by the gas outlet 171. Therefore, the camera image obtained by the camera unit 33 is clearer, and the accuracy of determining bonding defects is improved.

[0138] Next, the substrate SB with the electronic components CH attached is removed from the furnace (S60).

[0139] like Figure 9 As shown, electronic components CH are repeatedly bonded to the substrate SB by the bonding tool 43. The substrate SB with a predetermined number of electronic components CH bonded is moved out of the furnace through the outlet 116 by the conveying mechanism 20. The substrate SB exiting the heater 180 is deheated during the conveying process, and the temperature of the substrate SB has dropped to a temperature at which oxidation will not occur when it is exited from the outlet 116.

[0140] External air, acting as an oxidizing gas, is introduced into the space where the substrate SB exits through the outlet 116 and is discharged out of the furnace. This oxidizing gas is then expelled by an antioxidant gas released from the outlet 116.

[0141] The following describes other embodiments. Furthermore, structures identical or similar to those shown in the first embodiment are labeled with the same or similar symbols, and their descriptions are omitted where appropriate. Additionally, the same effects resulting from the same structures will not be mentioned repeatedly.

[0142] <Second Implementation>

[0143] Next, refer to Figure 10 The structure of the heating furnace 200 of the second embodiment will be described. Figure 10 This is a cross-sectional view of a heating furnace according to a second embodiment of the present invention. In this embodiment, the difference from the first embodiment is that the antioxidant path further includes a flow path adjustment component.

[0144] Specifically, the heating furnace 200 includes a flow path adjustment member 250 that adjusts the flow path of the anti-oxidation gas instead of the primary mesh section 150. The flow path adjustment member 250 can also cause pressure loss in the anti-oxidation gas introduced from the gas inlet 130. Figure 10 In the example shown, the flow path adjustment member 250 has plate-shaped members 251, 252, 253, and 254. Plate-shaped member 251 corresponds to an example of a first plate-shaped member, plate-shaped member 252 corresponds to an example of a second plate-shaped member, plate-shaped member 253 corresponds to an example of a third plate-shaped member, and plate-shaped member 254 corresponds to an example of a fourth plate-shaped member.

[0145] A plate-shaped member 251 is disposed between the gas inlet 131 and the secondary mesh portion 161. The plate-shaped member 251 has a first main surface extending along the XY plane and facing the gas inlet 131, and a second main surface extending along the XY plane and facing the secondary mesh portion 161. The plate-shaped member 251 is flat, and both its first and second main surfaces are planar. The plate-shaped member 251 is connected to and held by a retaining member (not shown) in any one of the top wall 111, partition wall 142, partition wall 143, partition wall 144, partition wall 145, and secondary mesh portion 161. The area of ​​the plate-shaped member 251 is larger than the area of ​​the gas inlet 131 and smaller than the area of ​​the secondary mesh portion 161. In top view, the central portion of the plate-shaped member 251 overlaps with the central portion of the gas inlet 131. The antioxidant gas introduced through the gas inlet 131 touches the plate-shaped member 251 and diffuses along the XY plane, passes through the secondary mesh portion 161 and is supplied to the bottom wall 114 side.

[0146] A plate-shaped member 252 is disposed between the gas inlet 132 and the secondary mesh portion 162. The plate-shaped member 252 has a first main surface extending along the XY plane and facing the gas inlet 132, and a second main surface extending along the XY plane and facing the secondary mesh portion 162. The plate-shaped member 252 is flat, and both its first and second main surfaces are planar. The plate-shaped member 252 is connected to and held by a retaining member (not shown) in any one of the top wall 111, partition wall 142, partition wall 143, partition wall 145, partition wall 146, and secondary mesh portion 162. The area of ​​the plate-shaped member 252 is larger than the area of ​​the gas inlet 132 and smaller than the area of ​​the secondary mesh portion 162. In top view, the central portion of the plate-shaped member 252 overlaps with the central portion of the gas inlet 132. The antioxidant gas introduced through the gas inlet 132 touches the plate-shaped member 252 and diffuses along the XY plane, passes through the secondary mesh portion 162 and is supplied to the bottom wall 114 side.

[0147] A plate-shaped member 253 is disposed between the gas inlet 133 and the secondary mesh portion 163. The plate-shaped member 253 has a first main surface extending along the XY plane and facing the gas inlet 133, and a second main surface extending along the XY plane and facing the secondary mesh portion 163. The plate-shaped member 253 is flat, and both its first and second main surfaces are planar. The plate-shaped member 253 is connected to and held by a retaining member (not shown) in any one of the top wall 111, partition wall 142, partition wall 143, partition wall 147, partition wall 148, and secondary mesh portion 163. The area of ​​the plate-shaped member 253 is larger than the area of ​​the gas inlet 133 and smaller than the area of ​​the secondary mesh portion 163. In top view, the central portion of the plate-shaped member 253 overlaps with the central portion of the gas inlet 133. The antioxidant gas introduced through the gas inlet 133 touches the plate-shaped member 253 and diffuses along the XY plane, passes through the secondary mesh portion 163 and is supplied to the bottom wall 114 side.

[0148] A plate-shaped member 254 is disposed between the gas inlet 134 and the secondary mesh portion 164. The plate-shaped member 254 has a first main surface extending along the XY plane and facing the gas inlet 134, and a second main surface extending along the XY plane and facing the secondary mesh portion 164. The plate-shaped member 254 is flat, and both its first and second main surfaces are planar. The plate-shaped member 254 is connected to and held by a retaining member (not shown) in any one of the top wall 111, partition wall 142, partition wall 143, partition wall 148, partition wall 149, and secondary mesh portion 164. The area of ​​the plate-shaped member 254 is larger than the area of ​​the gas inlet 134 and smaller than the area of ​​the secondary mesh portion 164. In top view, the central portion of the plate-shaped member 254 overlaps with the central portion of the gas inlet 134. The antioxidant gas introduced through the gas inlet 134 touches the plate-shaped member 254 and diffuses along the XY plane, passes through the secondary mesh portion 164 and is supplied to the bottom wall 114 side.

[0149] The area of ​​plate member 251 is larger than the area of ​​plate member 252, and the area of ​​plate member 254 is larger than the area of ​​plate member 253. The areas of plate member 251 and plate member 254 are approximately equal, and the areas of plate member 252 and plate member 253 are approximately equal.

[0150] Alternatively, multiple plate-shaped members may be provided between the gas inlet 131 and the secondary mesh portion 161. In this case, the multiple plate-shaped members may be arranged in the XY plane direction, or may overlap each other at least partially in the Z-axis direction. Similarly, multiple plate-shaped members may be provided between the gas inlet 132 and the secondary mesh portion 162, between the gas inlet 133 and the secondary mesh portion 163, or between the gas inlet 134 and the secondary mesh portion 164.

[0151] Furthermore, the shape of the plate-shaped member is not limited to a flat plate. For example, at least one of the first main surface and the second main surface of the plate-shaped member may be a curved surface such as a concave or convex surface, a concave-convex surface arranged in a matrix, an inclined surface that is inclined relative to the top wall of the furnace wall, or a combination thereof.

[0152] In addition, a flow path adjustment component can be used to replace the primary mesh section, but this is not a limitation. A flow path adjustment component can also be used to replace the secondary mesh section. The flow path adjustment component can be located between the gas inlet and the primary mesh section, or between the primary and secondary mesh sections.

[0153] Furthermore, the flow path adjustment component may be a plate-shaped component, but is not limited to this. The flow path adjustment component may also be, for example, rock wool, ceramic wool, metal wool, porous ceramic material, porous metal material, etc.

[0154] <Third Implementation Method>

[0155] Next, refer to Figure 11 The structure of the coupling device 3 in the third embodiment will be described. Figure 11 This is a perspective view showing a bonding device according to a third embodiment of the present invention. In this embodiment, the shape of the opening for bringing the bonding tool close to the substrate differs from that in the first embodiment.

[0156] Specifically, in the joining device 3, an opening 317 is also provided on the first sidewall formed by the partition wall 143 and the sidewall 113. The opening 317 extends from the top wall 111 and spans the first sidewall in an L-shape. The gas ejection portion 370 extends from the top wall 111 and spans the first sidewall in an L-shape along the opening 317. The opening 317 and the gas ejection portion 370 may be provided, for example, on the top wall 111, the partition wall 143, and the sidewall 113, but it is sufficient that they are provided at least on the top wall 111 and the partition wall 143.

[0157] By also providing the opening 317 in the first sidewall, the track of the front end of the holding electronic component CH in the joining tool 43 is set to pass through the portion of the opening 317 provided in the first sidewall. Thus, compared to the track of the front end of the joining tool 43 in the first embodiment, the track of the front end of the joining tool 43 in this embodiment is compressed in the Z-axis direction. Therefore, the travel distance and travel time of the front end of the joining tool 43 are shortened. When the joining tool 43 passes through the portion of the opening 317 provided in the first sidewall, the external air, which is an oxidizing gas, entering the furnace due to the movement of the joining tool 43 along the Y-axis direction is suppressed by the gas flow formed by the gas ejection portion 370 provided in the portion of the first sidewall.

[0158] Hereinafter, some or all of the embodiments of the present invention will be described in the appendix. However, the present invention is not limited to the following descriptions.

[0159] [Postscript 1]

[0160] A coupling device, comprising:

[0161] The conveying mechanism transports the substrate.

[0162] A bonding tool is used to bond electronic components to the substrate; and

[0163] An antioxidant path having a wall extending along and surrounding the conveying mechanism;

[0164] The wall portion has:

[0165] The substrate is inserted through the inlet.

[0166] The opening allows for the approach or separation of the bonding tool from the substrate; and

[0167] The outlet allows the substrate with the attached electronic components to be exported.

[0168] The antioxidant pathway also includes:

[0169] A gas inlet is used to introduce an antioxidant gas into the inner side of the wall; and

[0170] The fine pores cause a pressure loss in the antioxidant gas introduced from the gas inlet to the inside of the wall.

[0171] According to the described configuration, an antioxidant gas, which generates pressure loss through the fine orifices, is supplied into the wall section. Therefore, the inflow velocity of the antioxidant gas is limited, suppressing turbulence and pressure drop within the furnace wall, and preventing the entrainment of external air. Furthermore, by supplying the antioxidant gas diffusely within the wall section, the velocity deviation per unit area of ​​the antioxidant gas is reduced, thereby suppressing turbulence caused by velocity deviation. By suppressing turbulence that increases the concentration of oxidizing gas within the wall section due to the introduction of external air (an oxidizing gas) from the inlet, outlet, and opening, oxidation of the substrate, etc., can be suppressed. Therefore, bonding defects caused by oxidation of the substrate, etc., can be suppressed, and improved bonding reliability can be achieved.

[0172] [Postscript 2]

[0173] According to the coupling device described in [Appendix 1], wherein,

[0174] The gas inlet is located on the wall.

[0175] The fine pores are provided on the inner side of the wall portion away from the gas inlet.

[0176] [Postscript 3]

[0177] According to the coupling device described in [Appendix 1] or [Appendix 2], wherein,

[0178] When viewed from above in a direction where the fine orifice overlaps with the gas inlet, the area of ​​the fine orifice is larger than the area of ​​the gas inlet.

[0179] According to the described form, since the mesh portion for diffusing the antioxidant gas is larger than the gas inlet, the flow rate deviation per unit area of ​​the antioxidant gas after passing through the fine pore portion can be reduced compared to the flow rate deviation per unit area of ​​the antioxidant gas after it has just been introduced into the wall portion through the gas inlet.

[0180] [Postscript 4]

[0181] The coupling device according to any one of [Appendix 1] to [Appendix 3], wherein,

[0182] The gas inlet has:

[0183] A first gas inlet is disposed between the inlet and the opening.

[0184] The second gas inlet is disposed between the first gas inlet and the opening.

[0185] A third gas inlet is disposed between the outlet and the opening; and

[0186] A fourth gas inlet is located between the third gas inlet and the outlet.

[0187] The fine-hole portion has:

[0188] The first fine orifice causes a pressure loss in the antioxidant gas introduced from the first gas inlet to the inside of the wall.

[0189] The second fine orifice causes a pressure loss in the antioxidant gas introduced from the second gas inlet into the inner side of the wall.

[0190] The third fine orifice causes a pressure loss in the antioxidant gas introduced from the third gas inlet into the inner side of the wall; and

[0191] The fourth fine orifice causes a pressure loss in the antioxidant gas introduced from the fourth gas inlet into the inner side of the wall.

[0192] [Postscript 5]

[0193] According to the coupling device described in [Appendix 4], wherein,

[0194] The aperture ratio of the second fine orifice is less than that of the first fine orifice.

[0195] The opening ratio of the third fine hole is less than that of the fourth fine hole.

[0196] According to the described configuration, the opening ratios of the second and third fine holes near the opening are small. The smaller the opening ratio of the fine holes, the greater the pressure loss of the antioxidant gas and the higher the degree of antioxidant gas diffusion. Therefore, the smaller the opening ratio of the fine holes, the smaller the flow rate deviation per unit area of ​​the antioxidant gas passing through the fine holes, effectively suppressing the generation of turbulence near the opening. Since electronic components are bonded to the substrate in the space below the opening, the substrate becomes susceptible to heating and oxidation near the opening. However, since the generation of turbulence near the opening can be effectively suppressed, the increase in the concentration of oxidizing gas near the opening in the inner side of the wall can be suppressed, effectively suppressing the oxidation of the substrate, etc.

[0197] [Postscript 6]

[0198] The coupling device according to any one of [Appendix 1] to [Appendix 5], wherein,

[0199] The fine-hole portion has:

[0200] A primary fine orifice causes a pressure loss in the antioxidant gas introduced from the gas inlet into the inner side of the wall; and

[0201] The secondary fine pore section causes a secondary pressure loss in the antioxidant gas that has passed through the primary fine pore section.

[0202] According to the described morphology, the antioxidant gas diffuses in stages through the primary and secondary pores, thus further suppressing the velocity deviation of the antioxidant gas per unit area that causes turbulence.

[0203] [Postscript 7]

[0204] The coupling device according to any one of [Appendix 1] to [Appendix 6],

[0205] It also includes an electronic component supply department that supplies the electronic components.

[0206] The joining tool picks up the electronic component from the electronic component supply section and moves the electronic component into the antioxidant path through the opening.

[0207] [Postscript 8]

[0208] The coupling device according to any one of [Appendix 1] to [Appendix 7], wherein,

[0209] The bonding tool presses the electronic component onto the substrate and heats it to eutectic bond the electronic component to the substrate.

[0210] According to the described form, when bonding is performed using a eutectic alloy, i.e., a eutectic alloy that is prone to oxidation of the substrate due to bonding at high temperatures, it is necessary to reduce the concentration of oxidizing gases, especially on the inner side of the wall. Therefore, this embodiment is more effective.

[0211] As described above, a joining device that can improve the reliability of the joining can be provided.

[0212] The embodiments described above are for the purpose of facilitating understanding of the present invention and are not intended to limit the interpretation of the present invention. The elements, their configurations, materials, conditions, shapes, and dimensions included in the embodiments are not limited to those illustrated and can be appropriately modified. Furthermore, the structures shown in different embodiments can be partially substituted or combined with each other.

Claims

1. A coupling device, comprising: The conveying mechanism transports the substrate. A bonding tool is used to bond electronic components to the substrate; as well as An antioxidant path having a wall extending along and surrounding the conveying mechanism; The wall portion has: The substrate is inserted through the inlet. The opening allows the joining tool to approach or separate from the substrate; as well as The outlet allows the substrate with the attached electronic components to be exported. The antioxidant pathway also includes: A gas inlet is used to introduce an antioxidant gas into the inner side of the wall; and The fine pores cause a pressure loss in the antioxidant gas introduced from the gas inlet to the inside of the wall.

2. The coupling device according to claim 1, wherein, The gas inlet is located on the wall. The fine pores are provided on the inner side of the wall portion away from the gas inlet.

3. The coupling device according to claim 1, wherein, When viewed from above in a direction where the fine orifice overlaps with the gas inlet, the area of ​​the fine orifice is larger than the area of ​​the gas inlet.

4. The coupling device according to claim 1, wherein, The gas inlet has: A first gas inlet is disposed between the inlet and the opening. The second gas inlet is disposed between the first gas inlet and the opening. A third gas inlet is disposed between the outlet and the opening; and A fourth gas inlet is located between the third gas inlet and the outlet. The fine-hole portion has: The first fine orifice causes a pressure loss in the antioxidant gas introduced from the first gas inlet to the inside of the wall. The second fine orifice causes a pressure loss in the antioxidant gas introduced from the second gas inlet into the inner side of the wall. The third fine orifice causes a pressure loss in the antioxidant gas introduced from the third gas inlet to the inside of the wall. as well as The fourth fine orifice causes a pressure loss in the antioxidant gas introduced from the fourth gas inlet into the inner side of the wall.

5. The coupling device according to claim 4, wherein, The aperture ratio of the second fine orifice is less than that of the first fine orifice. The opening ratio of the third fine hole is less than that of the fourth fine hole.

6. The coupling device according to claim 1, wherein, The fine-hole portion has: A primary fine orifice causes a pressure loss in the antioxidant gas introduced from the gas inlet into the inner side of the wall; and The secondary fine pore section causes a secondary pressure loss in the antioxidant gas that has passed through the primary fine pore section.

7. The coupling device according to claim 1, It also includes an electronic component supply department that supplies the electronic components. The joining tool picks up the electronic component from the electronic component supply section and moves the electronic component into the antioxidant path through the opening.

8. The coupling device according to any one of claims 1 to 7, wherein, The bonding tool presses the electronic component onto the substrate and heats it to eutectic bond the electronic component to the substrate.

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