Polishing method for notebook computer display screen and notebook computer display screen

Abstract

The invention relates to a polishing method of a notebook computer display screen and the notebook computer display screen, and belongs to the technical field of display screen manufacturing, the polishing method of the notebook computer display screen comprises the following steps: a pretreatment stage: pretreating the surface of a glass substrate to form a microstructure stress guide channel; a coarse grinding stage: thinning the glass substrate on which the microstructure stress channel is formed by adopting a compound abrasive with a first preset concentration to obtain a coarsely ground glass substrate; a fine grinding stage: performing fine grinding and thinning on the coarsely ground glass substrate by adopting a compound grinding material with a second preset concentration to obtain a finely ground glass substrate; and a polishing stage: polishing the finely ground glass substrate by using a polishing solution to obtain the polished glass substrate. The method has the advantages that the problem of stress concentration caused by a traditional thinning method is solved, and the strength and impact resistance of the glass substrate are guaranteed while thinning is facilitated.

Description

Technical Field

[0001] This application relates to the field of display manufacturing technology, and in particular to a polishing method for a notebook computer display screen and a notebook computer display screen. Background Technology

[0002] Thinning technology for laptop screens is one of the keys to making electronic devices thinner, lighter, and more portable.

[0003] Currently, there are three main methods for thinning display glass substrates: physical mechanical polishing, which uses a single abrasive slurry for multiple polishing processes; chemical mechanical thinning, which softens the surface layer through a chemical reaction before mechanical polishing; and laser-assisted polishing, which uses laser pretreatment to alter material properties before mechanical polishing. However, these thinning methods can easily lead to stress concentration while reducing the thickness of the display glass, thus reducing its impact resistance and strength. Summary of the Invention

[0004] To effectively avoid stress concentration problems caused by traditional thinning methods and to help ensure the strength and impact resistance of the glass substrate while thinning, this application provides a polishing method for a laptop screen and a laptop screen.

[0005] Firstly, this application provides a method for polishing a laptop screen, which employs the following technical solution: A method for polishing a laptop computer display screen includes the following steps: In the pretreatment stage, the surface of the glass substrate is pretreated to form microstructure stress guiding channels; In the coarse grinding stage, a composite abrasive of a first preset concentration is used to thin the glass substrate on which the microstructure stress guiding channel is formed, to obtain the coarsely ground glass substrate. In the fine grinding stage, a composite abrasive of a second preset concentration is used to finely grind and thin the glass substrate after coarse grinding to obtain a finely ground glass substrate. In the polishing stage, polishing fluid is used to polish the finely ground glass substrate to obtain a polished glass substrate.

[0006] By adopting the above technical solution, the surface of the glass substrate is pretreated during polishing to form microstructure stress guiding channels. In the rough grinding stage, the microstructure stress guiding channels can guide the generated mechanical or thermal stress, avoiding stress concentration that could lead to uneven deformation or cracks in the substrate. On the other hand, the microstructure stress guiding channels help to block the extension of microcracks that may be generated during grinding and polishing, preventing the disorderly spread of cracks from affecting the strength of the substrate. This effectively avoids the stress concentration problem caused by traditional thinning methods and helps to ensure the strength and impact resistance of the glass substrate while thinning.

[0007] Preferably, the pretreatment of the glass substrate surface includes laser etching of multiple grooves on the glass substrate surface, wherein the multiple grooves are parallel to each other.

[0008] By adopting the above technical solution, multiple grooves can achieve stress guidance during the grinding and polishing stage, avoid stress concentration, and ensure the strength and impact resistance of the glass substrate.

[0009] Preferably, the spacing between adjacent grooves is 180μm-220μm, and the depth of the groove is 25μm-35μm.

[0010] By adopting the above technical solutions, appropriate spacing and depth can ensure the effectiveness of the microstructure stress guidance channels.

[0011] Preferably, the length direction of the groove is parallel to the width direction of the glass substrate, and the depth of the groove increases from the center of the glass substrate to the two side edges.

[0012] By adopting the above technical solution, the length of the groove can be shortened, making it easier to guide stress; and the gradual design of the groove depth can better adapt to the stress difference between the edge and center of the glass substrate, making it easier to guide stress more evenly.

[0013] Preferably, the cross-section of the groove is arc-shaped, and the edges of the groove are rounded.

[0014] Preferably, the second preset concentration is half of the first preset concentration, the polishing pressure in the coarse grinding stage is 0.25MPa-0.35MPa, the polishing pressure in the fine grinding stage is 0.1MPa-0.2MPa, the polishing pressure in the polishing stage is 0.03MPa-0.07MPa, the polishing rate in the coarse grinding stage is 4.5μm / min-5.5μm / min, and the surface roughness Ra of the glass substrate after fine grinding is ≤0.5μm.

[0015] Preferably, the composite abrasive includes diamond abrasive and cerium oxide abrasive, wherein the mass ratio of diamond abrasive to cerium oxide abrasive is 1:3, and the particle size of both diamond abrasive and cerium oxide abrasive is 0.5μm-5μm.

[0016] Preferably, the polishing fluid is a pH-responsive polishing fluid, and when pH=8, the viscosity of the pH-responsive polishing fluid decreases to 10 mPa·s.

[0017] Preferably, the polishing method further includes a post-processing stage after the polishing stage, in which the polished glass substrate is ultrasonically cleaned and then subjected to quality inspection.

[0018] Secondly, the notebook computer display screen provided in this application adopts the following technical solution: A laptop computer display screen includes a glass substrate obtained by the polishing method, and further includes an iron frame, a reflective layer, a light guide plate, a diffusion layer and a composite brightness enhancement layer installed in sequence. The glass substrate is installed on the side of the composite brightness enhancement layer away from the diffusion layer, and the thickness of the glass substrate is 0.25mm-0.35mm.

[0019] In summary, this application includes the following beneficial technical effects: During polishing, the surface of the glass substrate is first pretreated to form microstructure stress guiding channels. Subsequently, thinning and polishing are carried out in three stages using composite abrasives and polishing slurries of different concentrations. Because microstructure stress guiding channels are formed on the surface of the glass substrate during the pretreatment stage, during the rough grinding stage, on the one hand, the microstructure stress guiding channels can guide the mechanical or thermal stress generated, avoiding stress concentration that could lead to uneven deformation or cracks in the substrate. On the other hand, the microstructure stress guiding channels help to block the extension of microcracks that may be generated during grinding and polishing, preventing the disorderly propagation of cracks from affecting the strength of the substrate. This effectively avoids the stress concentration problem caused by traditional thinning methods, and helps to ensure the strength and impact resistance of the glass substrate while thinning. Attached Figure Description

[0020] Figure 1 This is a schematic flowchart of the laptop screen polishing method provided in the embodiments of this application.

[0021] Figure 2 This is a partial plan view of a laptop computer display screen provided in an embodiment of this application.

[0022] Explanation of reference numerals in the attached drawings: 1. Glass substrate; 2. Iron frame; 3. Reflective layer; 4. Light guide plate; 5. Diffuse layer; 6. Composite light enhancement layer; 7. Support strip; 8. Encapsulation strip. Detailed Implementation

[0023] The following combination Figures 1-2 This application will be described in further detail.

[0024] Reference Figure 1 This application discloses a method for polishing a laptop computer display screen. The polishing method for a laptop computer display screen includes the following steps: S1: Pre-treatment stage, the surface of glass substrate 1 is pre-treated to form microstructure stress guiding channels; S2: In the coarse grinding stage, the glass substrate 1 with microstructured stress channels is thinned using a composite abrasive of the first preset concentration to obtain the coarsely ground glass substrate 1. S3: Fine grinding stage, the glass substrate 1 after coarse grinding is thinned by using composite abrasive of the second preset concentration to obtain finely ground glass substrate 1; S4: Polishing stage, polishing fluid is used to polish the finely ground glass substrate 1 to obtain polished glass substrate 1; S5: In the post-processing stage, the polished glass substrate 1 is ultrasonically cleaned and then inspected.

[0025] During polishing, each stage is performed sequentially. First, the surface of the glass substrate 1 is pretreated to form microstructure stress guiding channels. Then, through the rough grinding stage, fine grinding stage, and polishing stage, different concentrations of composite abrasives and polishing fluids are used for thinning and polishing. After polishing, the glass substrate 1 is cleaned and inspected, thus completing the polishing process of the display screen glass substrate 1. Because microstructure stress guiding channels are formed on the surface of the glass substrate 1 during the pretreatment stage, during the rough grinding stage, on the one hand, the microstructure stress guiding channels can guide the generated mechanical or thermal stress, avoiding stress concentration distribution that could lead to uneven deformation or cracks in the substrate. On the other hand, the microstructure stress guiding channels can block the extension of microcracks that may be generated during grinding and polishing, preventing the disorderly propagation of cracks from affecting the strength of the substrate. This effectively avoids the stress concentration problem caused by traditional thinning methods, helping to ensure the strength and impact resistance of the glass substrate 1 while thinning.

[0026] Specifically, step S1 includes: S11: Cleaning of glass substrate 1; S12: Laser etching multiple grooves on the surface of the cleaned glass substrate 1, with the multiple grooves being parallel to each other; S13: Clean the glass substrate 1 with multiple grooves etched on it.

[0027] In step S11, laser etching is performed using laser etching equipment. Specifically, cold etching is used, such as ultraviolet laser or ultrashort pulse laser. Cold etching can avoid the problem of melting and hardening as much as possible and reduce stress concentration on the glass substrate 1.

[0028] Further, in step S11, the spacing between adjacent grooves is 180μm-220μm, the depth of the groove is 25μm-35μm, preferably, the spacing between adjacent grooves is 200μm, and the maximum depth of the groove is 30μm.

[0029] By forming a microstructure stress guiding channel consisting of multiple grooves on the surface of the glass substrate 1, not only will it not affect the subsequent grinding and polishing of the glass substrate 1, but it can also achieve stress guidance during the grinding and polishing stage, avoid stress concentration, and ensure the strength and impact resistance of the glass substrate 1; and the appropriate spacing and depth can ensure the effectiveness of the microstructure stress guiding channel.

[0030] Furthermore, the length direction of the groove is parallel to the width direction of the glass substrate 1, which can shorten the length of the groove and facilitate stress guidance. The depth of the groove increases from the center of the glass substrate 1 to both sides, which can better adapt to the stress difference between the edge and center of the glass substrate 1 and adapt to the working condition where the stress at the edge of the glass substrate 1 is greater than the stress at the center, making it easier to guide stress more evenly. At the same time, it can improve the flow of polishing fluid and improve the cooling, lubrication and impurity removal effects.

[0031] In other embodiments, step S12 can also be designed as laser etching of spiral or honeycomb mesh grooves on the surface of the cleaned glass substrate 1. Designing the grooves as spiral or honeycomb mesh shapes helps to guide stress from the center outwards.

[0032] Furthermore, the groove has a circular arc cross-section and rounded edges. During the rough grinding stage, when stress and cracks extend to the groove wall, they are redirected along the tangent direction of the inner wall of the groove, which helps dissipate energy and optimize stress dispersion. In other embodiments, the groove cross-section can also be U-shaped, V-shaped, or other shapes.

[0033] Furthermore, in step S2, during the rough grinding stage, the glass substrate 1 is fixed by vacuum adsorption to ensure the flatness of the glass substrate 1 and avoid uneven stress caused by clamping.

[0034] In other embodiments, the edge of the grinding wheel in the coarse grinding stage can be chamfered along the circumference. On the one hand, this avoids sharp right-angle transitions and can significantly reduce stress concentration; on the other hand, it can effectively guide the flow of grinding fluid when the grinding head rotates at high speed. The grinding surface of the grinding wheel in the coarse grinding stage can be designed as a smooth plane or a curved surface as needed.

[0035] Furthermore, after the rough grinding stage and before the fine grinding stage, the glass substrate 1 after rough grinding is cleaned; after the fine grinding stage and before the polishing stage, the glass substrate 1 after fine grinding is also cleaned, so as to ensure that the three stages of grinding and polishing do not affect each other.

[0036] Specifically, in steps S2 and S3, the second preset concentration is half of the first preset concentration, which can significantly improve the material removal rate and shorten the processing time in the coarse grinding stage; while in the fine grinding stage, the concentration of the composite abrasive is reduced, so that the scratch depth is gradually reduced, and finally the transition from "macroscopic flatness" to "microscopic smoothness" is achieved.

[0037] Further, the first preset concentration is 40%, and the second preset concentration is 20%; the polishing pressure in the rough grinding stage is 0.25MPa-0.35MPa, preferably 0.3MPa; the polishing pressure in the fine grinding stage is 0.1MPa-0.2MPa, preferably 0.15MPa; the polishing pressure in the polishing stage is 0.03MPa-0.07MPa, preferably 0.05MPa; the polishing rate in the rough grinding stage is 4.5μm / min-5.5μm / min, preferably 5μm / min; after fine grinding, the surface roughness Ra of the glass substrate 1 is ≤0.5μm, improving light transmittance. By limiting the relevant parameters of the rough grinding stage and the fine grinding stage, the processing efficiency is improved while ensuring polishing quality.

[0038] Specifically, in steps S2 and S3, the composite abrasive includes diamond abrasive and cerium oxide abrasive, with a mass ratio of diamond abrasive to cerium oxide abrasive of 1:3, and the particle size of both diamond abrasive and cerium oxide abrasive is 0.5μm-5μm.

[0039] In this application, a composite abrasive including diamond abrasive and cerium oxide abrasive is used. It can not only use the hardness of diamond abrasive to remove materials quickly, but also use the chemical activity of cerium oxide abrasive to promote a soft chemical reaction on the surface of glass substrate 1, thereby achieving nanoscale material removal and significantly reducing surface roughness. Through the synergy of composite abrasive, the problems of low efficiency or insufficient precision of single abrasive can be avoided, making it suitable for the needs of high light transmittance and scratch resistance of display glass.

[0040] Specifically, in step S4, the polishing slurry is a pH-responsive polishing slurry. A pH-responsive polishing slurry is a type of polishing slurry that is chemically designed so that its components are sensitive to pH and can dynamically adjust according to changes in the ambient pH value. When pH=8, the viscosity of the pH-responsive polishing slurry drops to 10 mPa·s, which can better adapt to different polishing requirements. The abrasive in the pH-responsive polishing slurry can be nano-diamond, cerium oxide, colloidal silica, etc.; the pH-responsive additives in the pH-responsive polishing slurry can be organic bases, amphoteric surfactants, etc., and there are no restrictions on this.

[0041] The implementation principle of the polishing method in this application embodiment is as follows: During polishing, each stage is carried out sequentially. First, a microstructure stress guiding channel is formed by laser etching parallel grooves in the pretreatment stage. Then, through three stages of rough grinding, fine grinding and polishing, composite abrasives and polishing fluid with appropriate parameters are used for thinning and polishing. Finally, the polished glass substrate 1 is cleaned and inspected, thus completing the polishing process of the display glass substrate 1.

[0042] Because the microstructure stress guiding channels formed on the surface of the glass substrate 1 during the pretreatment stage can guide and disperse stress during subsequent rough grinding, fine grinding and polishing, thus avoiding stress concentration. On the one hand, this avoids uneven deformation or cracks in the substrate caused by stress concentration distribution. On the other hand, it can block the extension of microcracks that may be generated during grinding and polishing, and prevent the disorderly spread of cracks from affecting the strength of the substrate. This can effectively avoid the stress concentration problem caused by traditional thinning methods, and help to ensure the strength and impact resistance of the glass substrate 1 while thinning.

[0043] Reference Figure 2 This application also discloses a laptop computer display screen. The laptop computer display screen includes a glass substrate 1 obtained by double-sided polishing using the polishing method described above, and further includes an iron frame 2, a reflective layer 3, a light guide plate 4, a diffusion layer 5, and a composite brightness enhancement layer 6, which are sequentially mounted from the bottom to the surface of the screen. The glass substrate 1 is mounted on the side of the composite brightness enhancement layer 6 away from the diffusion layer 5. Specifically, the glass substrate 1 has a glass-liquid crystal-glass sandwich structure, and the thickness of the glass substrate 1 is 0.25mm-0.35mm, preferably 0.3mm. Further, the thickness of the iron frame 2 is 0.25mm, the thickness of the reflective layer 3 is 0.15mm, the thickness of the light guide plate 4 is 0.45mm, the thickness of the diffusion layer 5 is 0.1mm, and the thickness of the composite brightness enhancement layer 6 is 0.13mm.

[0044] Reference Figure 2 To facilitate the installation of the glass substrate 1, an encapsulation strip 8 is installed inside the iron frame 2. The encapsulation strip 8 is located on the same side of the reflective layer 3, the light guide plate 4, the diffusion layer 5, and the composite brightness enhancement layer 6. A support strip 7 is installed between the glass substrate 1 and the composite brightness enhancement layer 6. One end of the support strip 7 away from the glass substrate 1 abuts against the composite brightness enhancement layer 6, and the other end abuts against the encapsulation strip 8, so as to facilitate the relative fixation of each layer structure.

[0045] The implementation principle of the laptop computer display screen in this application embodiment is as follows: using a glass substrate 1 treated by the above-mentioned polishing method, it is possible to ensure strength and impact resistance while maintaining a relatively thin profile, thereby ensuring the thinness and reliability of the display screen; through the cooperation of each layer structure, the iron frame 2 provides physical support and protection, the reflective layer 3 improves light utilization, the light guide plate 4 uniformly conducts light, the diffusion layer 5 makes the light evenly distributed, and the composite light enhancement layer 6 enhances the display effect, together forming a high-performance laptop computer display screen, meeting the market demand for high-quality laptop computer displays that are thin and light and have good strength.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A method for polishing a laptop computer display screen, characterized in that, Includes the following steps: In the pretreatment stage, the surface of the glass substrate (1) is pretreated to form microstructure stress guiding channels; In the coarse grinding stage, a composite abrasive of the first preset concentration is used to thin the glass substrate (1) on which the microstructure stress guiding channel is formed, so as to obtain the coarsely ground glass substrate (1). In the fine grinding stage, the glass substrate (1) after coarse grinding is thinned by using composite abrasive of the second preset concentration to obtain the finely ground glass substrate (1); In the polishing stage, polishing fluid is used to polish the finely ground glass substrate (1) to obtain the polished glass substrate (1).

2. The polishing method for a laptop screen according to claim 1, characterized in that: The pretreatment of the glass substrate (1) surface includes laser etching of multiple grooves on the glass substrate (1) surface, the multiple grooves being parallel to each other.

3. The polishing method for a laptop computer display screen according to claim 2, characterized in that: The spacing between adjacent grooves is 180μm-220μm, and the depth of the grooves is 25μm-35μm.

4. The polishing method for a laptop computer display screen according to claim 2, characterized in that: The length direction of the groove is parallel to the width direction of the glass substrate (1), and the depth of the groove increases from the center of the glass substrate (1) to the two side edges.

5. The polishing method for a laptop computer display screen according to claim 2, characterized in that: The groove has a circular arc cross-section, and the edges of the groove are rounded.

6. The polishing method for a laptop computer display screen according to claim 1, characterized in that: The second preset concentration is half of the first preset concentration. The polishing pressure of the coarse grinding stage is 0.25MPa-0.35MPa, and the polishing pressure of the fine grinding stage is 0.1MPa-0.2MPa. The polishing pressure of the polishing stage is 0.03MPa-0.07MPa. The polishing rate of the coarse grinding stage is 4.5μm / min-5.5μm / min. The surface roughness Ra of the glass substrate (1) after fine grinding is ≤0.5μm.

7. The polishing method for a laptop computer display screen according to claim 1, characterized in that: The composite abrasive includes diamond abrasive and cerium oxide abrasive, with a mass ratio of diamond abrasive to cerium oxide abrasive of 1:3, and the particle size of both diamond abrasive and cerium oxide abrasive is 0.5μm-5μm.

8. The polishing method for a laptop computer display screen according to claim 1, characterized in that: The polishing fluid is a pH-responsive polishing fluid. When pH=8, the viscosity of the pH-responsive polishing fluid decreases to 10 mPa·s.

9. The polishing method for a laptop computer display screen according to claim 1, characterized in that: The polishing method also includes a post-processing stage after the polishing stage, in which the polished glass substrate (1) is ultrasonically cleaned and then inspected.

10. A notebook computer display screen, comprising a glass substrate (1) obtained by the polishing method described in any one of claims 1-9, characterized in that: It also includes an iron frame (2), a reflective layer (3), a light guide plate (4), a diffusion layer (5) and a composite light enhancement layer (6) installed in sequence. The glass substrate (1) is installed on the side of the composite light enhancement layer (6) away from the diffusion layer (5). The thickness of the glass substrate (1) is 0.25mm-0.35mm.

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