Surface treatment tool, processing technique and device

Abstract

Embodiments of the present application provide a surface treatment tool, a processing technology and a device, which are used to solve the problem of poor flow and distribution uniformity of the surface polishing liquid of the surface treatment tool, and the problem of adverse effects on the polishing quality and polishing efficiency of the workpiece to be processed. The surface treatment tool comprises a polishing layer and a groove structure, the groove structure is arranged on the surface of the polishing layer, and the groove structure comprises multiple layers of grooves arranged along the radial direction of the polishing layer. Each layer of grooves comprises multiple groove units arranged in an array along the circumferential direction of the polishing layer, and the adjacent two groove units are connected end to end. In the adjacent two layers of grooves, the junction of the adjacent two groove units of the groove located in the inner layer is connected with one groove unit of the groove located in the outer layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of surface processing, in particular to a surface processing tool, a processing technology and a device. BACKGROUND

[0002] In the process of processing a workpiece to be processed by using a surface processing tool, the surface processing tool has the functions of storing and transporting polishing liquid, removing processing residual substances, transmitting mechanical load and maintaining polishing environment. When the surface of the surface processing tool is in a smooth state, uneven surface pressure distribution and poor flowability of the polishing liquid can easily cause problems such as over-polishing and scratching on the surface of the workpiece to be processed. At present, the commonly used method is to groove the surface of the surface processing tool to solve this problem.

[0003] In related technologies, common forms of grooves include concentric circle grooves, radial grooves, logarithmic spiral grooves, square grid grooves and Archimedes spiral grooves. However, due to the influence of the shape of the grooves and the centrifugal force in the rotation process of the surface processing tool, the residence time of the polishing liquid in different areas of the surface of the surface processing tool is greatly different, that is, the flow and distribution uniformity of the polishing liquid on the surface of the surface processing tool is poor, which further adversely affects the polishing quality and polishing efficiency of chemical mechanical polishing. SUMMARY

[0004] The present application discloses a surface processing tool, a processing technology and a device, which are used to solve the problem of poor flow and distribution uniformity of the polishing liquid on the surface of the surface processing tool, which adversely affects the polishing quality and polishing efficiency of the workpiece to be processed.

[0005] In a first aspect, the present application provides a surface processing tool, which comprises a polishing layer and a groove structure, the groove structure is arranged on the surface of the polishing layer, and the groove structure comprises a plurality of layers of grooves arranged along the radial direction of the polishing layer, each layer of grooves comprises a plurality of groove units arranged in an array along the circumferential direction of the polishing layer, and the two groove units adjacent to each other are connected end to end; in the two adjacent layers of grooves, the junction of the two groove units of the groove in the inner layer and one groove unit of the groove in the outer layer are connected.

[0006] The surface treatment tool relates to the technical field of surface treatment, and discloses a surface treatment tool with a groove structure.

[0007] In a possible implementation, the groove structure comprises adjacent first and second groove layers, and the first groove layer is located radially outside the second groove layer.

[0008] The first groove layer comprises adjacent first and second groove units, the first groove unit comprises first and second end points, the second groove unit comprises third and fourth end points, and the second and third end points are connected.

[0009] The second groove layer comprises adjacent and sequentially arranged third, fourth and fifth groove units, the fourth groove unit comprises fifth and sixth end points, the third groove unit is connected to the fifth end point, and the fifth groove unit is connected to the sixth end point.

[0010] The fifth end point is connected to the first groove unit and located between the first and second end points, and the sixth end point is connected to the second groove unit and located between the third and fourth end points.

[0011] In this way, the polishing liquid can flow from the groove unit of the inner groove layer into the two adjacent groove units of the outer layer through the two end points of the groove unit, and the groove structure can provide a smooth radial flow channel for the polishing liquid. In addition, this is also conducive to improving the connectivity between the parts of the groove structure. Even if a local area is blocked by particles, the polishing liquid can still flow through another channel.

[0012] In a possible implementation, the fifth end point is connected to the midpoint of the first groove unit, and the sixth end point is connected to the midpoint of the second groove unit. In this way, the symmetry and balance of the groove structure are improved, which is conducive to further improving the uniformity of the distribution and flow of the polishing liquid in the groove, and thus conducive to optimizing the polishing effect. In addition, the groove structure is designed in this way, which is convenient for processing and manufacturing, thereby reducing the manufacturing cost.

[0013] In a possible implementation, the groove structure comprises a third groove layer and a fourth groove layer adjacent to each other, the third groove layer is located radially outside the fourth groove layer; the groove units of the third groove layer are divided into groove unit groups, each groove unit group comprises at least two groove units; the groove units of the fourth groove layer and the groove unit groups of the third groove layer are correspondingly arranged and oppositely arranged along the radial direction of the polishing layer.

[0014] In this way, the groove unit groups of the third groove layer are arranged to facilitate the adjustment of the uniformity of the groove structure, so as to avoid the sudden change of the groove contact area of the workpiece to be processed during the polishing process due to the large area occupied by the single groove unit and the formation of the internal region as a groove blank area, thereby facilitating the improvement of the uniformity of pressure transmission and the consistency of material removal during the polishing process, so as to obtain a high-quality and high-flatness polishing surface.

[0015] In a possible implementation, the third groove layer and the fourth groove layer constitute a pair of groove layers, and the groove structure comprises a plurality of pairs of groove layers arranged along the radial direction. In this way, the surface of the polishing layer can form a periodic and modular distributed groove structure, and the plurality of pairs of groove layers can further form channels along the radial direction for the flow of polishing liquid.

[0016] In a possible implementation, in the two adjacent pairs of groove layers, the third groove layer in the inner pair of groove layers comprises a first groove unit group, the first groove unit group comprises a sixth groove unit, and the fourth groove layer in the outer pair of groove layers comprises adjacent seventh and eighth groove units; the sixth groove unit is located between the seventh groove unit and the eighth groove unit, and the groove units of the first groove unit group other than the sixth groove unit are individually connected to the seventh groove unit and / or the eighth groove unit.

[0017] In this way, the inner groove of the inner pair of groove layers and the inner groove of the outer pair of groove layers form an effective connection relationship, and the inner and outer grooves of the inner pair of groove layers form an effective connection relationship, so that the inner groove of the inner pair of groove layers and the inner groove of the outer pair of groove layers are effectively connected, so that the polishing liquid can flow along the radial direction between different pairs of grooves.

[0018] In a possible implementation, the first groove unit group comprises two adjacent groove units, one of which is the sixth groove unit, and the sixth groove unit is located between the three equal division points of the seventh groove unit and the three equal division points of the eighth groove unit; the groove units of the first groove unit group other than the sixth groove unit are connected between the remaining two three equal division points of the seventh groove unit; or, the groove units of the first groove unit group other than the sixth groove unit are connected between the remaining two three equal division points of the eighth groove unit.

[0019] In this way, the circumferential distribution uniformity of the groove structure is improved, and the flow and distribution uniformity of the polishing liquid are improved, so that the polishing quality and flatness of the polished surface of the workpiece are improved.

[0020] In a possible implementation, the groove structure includes a first groove group and a second groove group arranged along the radial direction of the polishing layer, the first groove group is located radially outward of the second groove group; the first groove group includes adjacent first and second groove layers; the second groove group includes a plurality of pairs of groove layers arranged along the radial direction of the polishing layer, each pair of groove layers includes adjacent third and fourth groove layers, the third groove layer is located radially outward of the fourth groove layer, a plurality of groove units of the third groove layer are divided into a plurality of groove unit groups, each groove unit group includes at least two groove units, the groove units of the fourth groove layer and the groove unit groups of the third groove layer are one-to-one corresponding and oppositely arranged along the radial direction of the polishing layer; the outermost third groove layer of the second groove group is formed as the innermost groove layer of the first groove group.

[0021] In this way, the grooves of the second groove group located radially inward of the surface treatment tool facilitate the rapid discharge of the polishing liquid in the inner region with a small linear velocity, and the grooves of the first groove unit group located radially outward of the surface treatment tool facilitate the extension of the residence time of the polishing liquid in the outer region with a large linear velocity, so that the polishing liquid on the surface treatment tool is more uniformly distributed, and a stable removal rate and a better planarization degree can be achieved on the surface of the workpiece.

[0022] In a possible implementation, the groove unit is formed as a continuous curved segment, and the groove unit is arched along the radial direction of the polishing layer from outside to inside. In this way, the groove unit does not block the discharge of the polishing liquid to the radial outside, avoiding the damage to the surface of the workpiece caused by the discharge of the debris carried by the polishing liquid.

[0023] In a possible implementation, the groove unit is formed as a smooth curved segment. In this way, there is no inflection point, sharp corner, etc. on the groove unit, so that the local turbulence or vortex of the polishing liquid caused by the existence of the inflection point, sharp corner, etc. can be avoided, and the consistency of the flow velocity of the polishing liquid in the groove is improved.

[0024] In a possible implementation, the groove unit is formed as an arc segment, and two adjacent groove units are tangent to each other. In this way, the geometric characteristics of the arc segment itself facilitate the continuity of the curvature and the consistency of the direction of the flow path of the polishing liquid in the groove, facilitate the elimination of the flow disturbance source of the polishing liquid, and the fluid uniformity of the polishing liquid is improved.

[0025] In a possible implementation, the surface of the polishing layer has a central region, and the groove structure is arranged around the central region in the circumferential direction of the polishing layer. In this way, the manufacturing difficulty of the surface treatment tool is reduced, and the production cost is reduced.

[0026] In a second aspect, the application further provides a processing process, which uses the surface treatment tool according to any one of the above technical solutions to process a workpiece. Since the processing process provided by the application uses the surface treatment tool according to any one of the above technical solutions, they can solve the same technical problems and achieve the same effects.

[0027] In a third aspect, the application further provides a device, which is processed by the surface treatment tool according to any one of the above technical solutions. Since the device provided by the application is processed by the surface treatment tool according to any one of the above technical solutions, they can solve the same technical problems and achieve the same effects. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0029] Figure 1 A schematic diagram of a surface treatment tool provided by some embodiments of the present application;

[0030] Figure 2 A schematic diagram of a surface treatment tool provided by some embodiments of the present application;

[0031] Explanation of reference signs:

[0032] 10 - surface treatment tool;

[0033] 1 - polishing layer;

[0034] 11 - central region;

[0035] 2 - groove structure;

[0036] 21 - first groove group; 22 - second groove group; 23 - first groove layer; 24 - second groove layer; 25 - third groove layer; 26 - fourth groove layer; 27 - first groove unit group;

[0037] 231 - first groove unit; 232 - second groove unit; 241 - third groove unit; 242 - fourth groove unit; 243 - fifth groove unit; 251 - sixth groove unit; 261 - seventh groove unit; 262 - eighth groove unit. DETAILED DESCRIPTION

[0038] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of the present application.

[0039] In addition, it should be further noted that, for the convenience of description, only the parts related to the present application are shown in the drawings. The embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0040] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth", "fifth", "sixth" can explicitly or implicitly include one or more of the features.

[0041] In the embodiments of the present application, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0042] In order to facilitate the description of the technical solutions of the present application, before the surface treatment tool 10 in the embodiments of the present application is described in detail, some concepts related to the present application are first described.

[0043] Chemical Mechanical Planarization (CMP) is a global planarization process widely used in the construction of multilayer metal interconnect structures. Its core objective is to achieve a high degree of planarization of the workpiece surface through the synergistic effect of chemical reaction and mechanical abrasion. CMP is widely used in semiconductor manufacturing to achieve a high degree of planarization of the wafer surface, providing ideal substrate conditions for subsequent photolithography, deposition, and other processes. Specifically, in the CMP process, chemical reagents in the slurry react with the wafer surface material to generate a softening layer or compound (such as oxide) that is easily removed. Then, pressure is applied through the relative movement between the surface treatment tool 10 and the wafer to grind and remove the reaction products, thereby achieving continuous material removal.

[0044] The specific embodiments involved in this application are described in detail below with reference to the accompanying drawings.

[0045] This application provides a surface treatment tool 10, which can be used in chemical mechanical polishing processes, such as surface planarization of wafers in the semiconductor manufacturing field. During chemical mechanical polishing, the surface treatment tool 10 can store and transport polishing slurry. The chemical reagents in the polishing slurry can react with the surface material of the workpiece to soften the surface. Furthermore, the surface treatment tool 10 removes the surface material of the workpiece by transferring a mechanical load to it.

[0046] Of course, the surface treatment tool 10 can also be used for other processing techniques, such as precision mechanical polishing of the surfaces of optical glass, sapphire, ceramics and other products. This application embodiment does not impose specific limitations on the specific application scenarios of the surface treatment tool 10.

[0047] The surface treatment tool 10 can be a polishing component, specifically, it can include, but is not limited to, a polishing pad, a polishing disc, or a polishing block. This application uses the surface treatment tool 10 as a polishing pad as an example for illustration, which does not constitute a special limitation on this application.

[0048] like Figure 1 As shown, Figure 1 This is a schematic diagram of a surface treatment tool 10 provided in some embodiments of this application. In some embodiments, the surface treatment tool 10 may include a polishing layer 1 and a groove structure 2, the groove structure 2 being disposed on the surface of the polishing layer 1.

[0049] Based on the above, optionally, the groove structure 2 can be distributed on the entire surface of the polishing layer 1, or the groove structure 2 can be distributed in a local area of ​​the surface of the polishing layer 1.

[0050] likeFigure 1 As shown, in some embodiments, the surface of the polishing layer 1 has a central region 11, and the groove structure 2 is arranged along the circumferential direction of the polishing layer 1 around the central region 11. That is, the central region 11 of the polishing layer 1 is not covered by the groove structure 2. Of course, in other embodiments, the groove structure 2 can also maximize the coverage of the entire surface of the polishing layer 1 as allowed by the machining process of the surface treatment tool 10, which is not specifically limited in the present application. Due to the limitation of the machining process, the small area remaining in the middle of the polishing layer 1 which cannot be observed obviously does not belong to the aforementioned central region 11.

[0051] In this way, it is beneficial to reduce the manufacturing difficulty of the surface treatment tool 10, thereby reducing the production manufacturing cost.

[0052] The shape of the polishing layer 1 can include but is not limited to being formed into a circle, an ellipse, a square, etc., and in the embodiments of the present application, the polishing layer 1 is exemplarily illustrated as being formed into a circle, which does not constitute a special limitation to the present application.

[0053] It should be noted that if the shape of the polishing layer 1 is not a regular circle, the circumferential direction of the polishing layer 1 can refer to the direction extending along the outer edge of the polishing layer 1, and the radial direction of the polishing layer 1 can refer to the direction from the outer edge of the polishing layer 1 to the center of the polishing layer 1.

[0054] In order for the surface treatment tool 10 to maintain uniform and consistent flow of the surface polishing liquid during the polishing process, thereby ensuring the stability of the surface removal rate of the workpiece and excellent planarization degree. As shown in the figure, Figure 1 As shown, in some embodiments, the groove structure 2 includes a plurality of layers of grooves arranged along the radial direction of the polishing layer 1, each layer of grooves includes a plurality of groove units arranged in an array along the circumferential direction of the polishing layer 1, and the adjacent two groove units are end-to-end. In the adjacent two layers of grooves, the junction of the adjacent two groove units of the groove in the inner layer and one groove unit of the groove in the outer layer are connected.

[0055] It should be noted that in the embodiments of the present application, "end-to-end" means that the endpoints of the adjacent two groove units are connected, and there is no common side or overlapping area between the adjacent two groove units.

[0056] Based on the above, optionally, the connection point of two adjacent trench units in the inner layer can be connected to a trench unit in the outer layer. For example, the connection point of two adjacent trench units in the inner layer can be connected to the endpoint of a trench unit in the outer layer, that is, the trench units in the inner layer and the trench units in the outer layer are arranged opposite each other. As another example, the connection point of two adjacent trench units in the inner layer can be connected to any two or more equally spaced points of a trench unit in the outer layer. Optionally, the connection point of two adjacent trench units in the inner layer can also be connected to two trench units in the outer layer.

[0057] Based on this, on the one hand, each trench layer consists of multiple trench units arranged in a circumferential array along the polishing layer 1, with adjacent trench units connected end-to-end to form a continuous circumferential annular flow channel structure. This ensures sufficient trench area and also helps to store polishing fluid, improving the residence time and utilization rate of the polishing fluid. On the other hand, adjacent trench layers are functionally connected through the connection points of the inner trench units and the outer trench units, constructing a radial flow channel along the polishing layer 1. This allows the polishing fluid to flow across trench layers at different radii. Thus, during the rotation of the surface treatment tool 10, the trench structure 2 can guide the polishing fluid from the inner side to the outer periphery in an orderly manner, so as to promptly discharge debris carried by the polishing fluid. Furthermore, it helps to improve the flow and distribution uniformity of the polishing fluid on the entire polishing surface, thereby improving the polishing quality and efficiency of the surface treatment tool 10.

[0058] like Figure 1 As shown, in some embodiments, the trench unit can be formed as a continuous curved segment, and the trench unit arches from the outside to the inside along the radial direction of the polishing layer 1. Exemplarily, the trench unit can be formed as an arc segment or a continuous broken line segment, such as a circular arc segment, an elliptical arc segment, a double broken line segment, a triple broken line segment, etc.

[0059] When the surface treatment tool 10 rotates at high speed, the centrifugal force tends to throw the polishing liquid outward, while the inwardly arched groove unit forms a "reverse guidance" effect on the liquid, partially offsetting the centrifugal effect, causing the liquid to deflect inward or flow back during the flow process, prolonging the residence time of the polishing liquid and enhancing the fullness of the chemical reaction.

[0060] The groove unit arches from the outside to the inside along the radial direction of the polishing layer 1. The groove unit can provide a flow path from the inside to the outside for the polishing fluid. In this way, the groove unit will not block the polishing fluid from being discharged radially to the outside, thus avoiding the obstruction of the discharge of debris carried by the polishing fluid and causing damage to the surface of the workpiece.

[0061] like Figure 1As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved.

[0062] As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved. Figure 1 As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved.

[0063] The following embodiments are further descriptions based on the groove units being formed as circular arc segments, which should not be considered as special limitations of the present application.

[0064] As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved.

[0065] Figure 1 As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved.

[0066] As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved. Figure 1 As shown in some embodiments, the groove units can be formed as smooth curve segments. For example, the groove units can be formed as circular arc segments, elliptical arc segments, parabolic segments, etc. In this way, there are no inflection points, sharp corners, etc. on the groove units, so that local turbulence or vortex of the polishing liquid caused by the presence of inflection points, sharp corners, etc. can be avoided, and the consistency of the flow speed of the polishing liquid in the grooves can be improved.

[0067] ​In this way, the polishing fluid can flow from the inner trench unit into the two adjacent outer trench units through its two ends. The trench structure 2 can provide a smooth radial flow channel for the polishing fluid. In addition, this is also conducive to improving the connectivity between the various parts of the trench structure 2. Even if a channel is blocked due to particle blockage in a local area, the polishing fluid can still flow through another channel.

[0068] Based on the above, the fifth endpoint can be connected to the midpoint of the first trench unit 231, and the sixth endpoint can be connected to the midpoint of the second trench unit 232.

[0069] When the fifth endpoint is connected to the midpoint of the first trench unit 231 and the sixth endpoint is connected to the midpoint of the second trench unit 232, the position where the polishing liquid enters the outer trench from the inner layer is exactly at the geometric center of its length direction, so that the liquid diffuses symmetrically from the midpoint to both ends, forming a bidirectional equidistant flow path, avoiding the uneven phenomenon of "fast flow on one side and slow flow on the other side" caused by eccentric liquid entry.

[0070] This design improves the symmetry and balance of the groove structure 2, which in turn enhances the distribution and flow uniformity of the polishing fluid within the groove, thereby optimizing the polishing effect and improving the smoothness of the workpiece surface. Furthermore, this design of the groove structure 2 facilitates manufacturing, thus reducing production costs.

[0071] Of course, the fifth endpoint can also be connected to other positions of the first trench unit 231. For example, the fifth endpoint can also be connected to the third or fourth division point of the first trench unit 231. The sixth endpoint can also be connected to other positions of the second trench unit 232. For example, the sixth endpoint can also be connected to the third or fourth division point of the second trench unit 232.

[0072] The surface treatment tool 10 of other embodiments of this application will now be described. For example... Figure 2 As shown, Figure 2 This is a schematic diagram of a surface treatment tool 10 provided for other embodiments of this application. In other embodiments, the surface treatment tool 10 includes a polishing layer 1 and a groove structure 2 disposed on the surface of the polishing layer 1, wherein this embodiment and the above-described Figure 1 The parts that are the same as those in the embodiments shown will not be described again; please refer to the above embodiments.

[0073] In other embodiments, the multi-layered trenches of the trench structure 2 can be divided into multiple groups of trenches arranged radially. For example, the trench structure 2 may include two, three, four or more groups of trenches. This application embodiment is illustrated by the example of the trench structure 2 including two groups of trenches, which does not constitute a special limitation on this application.

[0074] As shown in the drawings, in some embodiments, the groove structure 2 comprises a first groove group 21 and a second groove group 22 arranged along the radial direction of the polishing layer 1, and the first groove group 21 is located radially outside the second groove group 22. Figure 2 As shown in the drawings, in some embodiments, the groove structure 2 comprises a first groove group 21 and a second groove group 22 arranged along the radial direction of the polishing layer 1, and the first groove group 21 is located radially outside the second groove group 22.

[0075] In the above embodiments, the first groove group 21 comprises a first groove layer 23 and a second groove layer 24 arranged adjacently, and the structures of the first groove layer 23 and the second groove layer 24 and the connection relationship therebetween are the same as those of the first groove layer 23 and the second groove layer 24 in the above embodiments, and thus the description thereof will not be repeated herein. Figure 1 In the above embodiments, the first groove group 21 comprises a first groove layer 23 and a second groove layer 24 arranged adjacently, and the structures of the first groove layer 23 and the second groove layer 24 and the connection relationship therebetween are the same as those of the first groove layer 23 and the second groove layer 24 in the above embodiments, and thus the description thereof will not be repeated herein.

[0076] In the above embodiments, the second groove group 22 comprises one or more pairs of groove layers arranged along the radial direction of the polishing layer 1. In this way, the surface of the polishing layer 1 can form a periodic and modular groove structure 2, and the multiple pairs of groove layers can further form channels along the radial direction for the flow of polishing liquid.

[0077] In the above embodiments, the second groove group 22 comprises one or more pairs of groove layers arranged along the radial direction of the polishing layer 1. In this way, the surface of the polishing layer 1 can form a periodic and modular groove structure 2, and the multiple pairs of groove layers can further form channels along the radial direction for the flow of polishing liquid.

[0078] As shown in the drawings, in some embodiments, the groove structure 2 comprises a first groove group 21 and a second groove group 22 arranged along the radial direction of the polishing layer 1, and the first groove group 21 is located radially outside the second groove group 22. Figure 2 As shown in the drawings, in some embodiments, the groove structure 2 comprises a first groove group 21 and a second groove group 22 arranged along the radial direction of the polishing layer 1, and the first groove group 21 is located radially outside the second groove group 22.

[0079] In the above embodiments, each groove unit group comprises at least two groove units, which can include the following cases: for example, each groove unit group comprises two groove units; for another example, each groove unit group comprises more than two groove units, which can be three, four, or five, etc.

[0080] It should be noted that the "opposite arrangement" in the embodiments of the present application can be understood as follows: the heads of the two oppositely arranged structures correspond to the connection, and one of them can be located within the range of the area defined by the other. That is, the opposite arrangement of one groove unit of the fourth groove layer 26 and one groove unit group of the third groove layer 25 means that the heads of the one groove unit of the fourth groove layer 26 and the one groove unit group of the third groove layer 25 correspond to the connection, and the groove unit group is located within the arch area range defined by the corresponding groove unit.

[0081] In this way, the arrangement of the groove unit groups of the third groove layer 25 is conducive to adjusting the uniformity of the groove structure 2, avoiding the situation that the area occupied by a single groove unit is too large, and thus the internal region defined by the single groove unit forms a groove blank area, resulting in a sudden change in the groove contact area of the workpiece during polishing, so as to improve the uniformity of pressure transmission and the consistency of material removal during polishing, and to obtain a high-quality and high-flatness polished surface.

[0082] As shown in FIG. 1, in some embodiments, the third groove layer 25 in the inner layer of the two adjacent groove layer pairs comprises a first groove unit group 27, and the fourth groove layer 26 in the outer layer of the two adjacent groove layer pairs comprises a sixth groove unit 251 in the first groove unit group 27 and a seventh groove unit 261 adjacent to the sixth groove unit 251. Figure 2 As shown in FIG. 2, in some other embodiments, the third groove layer 25 in the inner layer of the two adjacent groove layer pairs comprises a first groove unit group 27, the first groove unit group 27 comprises a sixth groove unit 251, the fourth groove layer 26 in the outer layer of the two adjacent groove layer pairs comprises a seventh groove unit 261 and an eighth groove unit 262 adjacent to the seventh groove unit 261. The sixth groove unit 251 is connected between the seventh groove unit 261 and the eighth groove unit 262, the groove units in the first groove unit group 27 other than the sixth groove unit 251 are individually connected to the seventh groove unit 261; or the groove units in the first groove unit group 27 other than the sixth groove unit 251 are individually connected to the eighth groove unit 262; or part of the groove units in the first groove unit group 27 other than the sixth groove unit 251 are individually connected to the seventh groove unit 261, and the other part of the groove units in the first groove unit group 27 other than the sixth groove unit 251 are individually connected to the eighth groove unit 262.

[0083] Based on the above, optionally, the seventh groove unit 261 and the eighth groove unit 262 are both divided into multiple parts, the two ends of the sixth groove unit 251 are connected to the multiple division points of the seventh groove unit 261 and the eighth groove unit 262 respectively, and the remaining groove units in the first groove unit group 27 on one side of the sixth groove unit 251 can be connected between the remaining multiple division points of the seventh groove unit 261, and the remaining groove units in the first groove unit group 27 on the other side of the sixth groove unit 251 can be connected between the remaining multiple division points of the eighth groove unit 262.

[0084] In this way, the effective connection relationship is formed between the inner groove of the inner groove pair and the outer groove of the outer groove pair, and the connection relationship between the inner groove and the outer groove of the inner groove pair, so that the inner groove of the inner groove pair and the inner groove of the outer groove pair are effectively connected, so that the polishing liquid can flow between different groove pairs in the radial direction.

[0085] As shown in FIG. 1, in some embodiments, the third groove layer 25 in the inner layer of the two adjacent groove layer pairs comprises a first groove unit group 27, and the fourth groove layer 26 in the outer layer of the two adjacent groove layer pairs comprises a sixth groove unit 251 in the first groove unit group 27 and a seventh groove unit 261 adjacent to the sixth groove unit 251. Figure 2As shown, specifically, in some other embodiments, the first trench unit group 27 includes two trench units, one of which is the sixth trench unit 251. The sixth trench unit 251 is connected between the trisection points of the seventh trench unit 261 and the trisection points of the eighth trench unit 262, and the trench units of the first trench unit group 27 other than the sixth trench unit 251 are connected between the remaining two trisection points of the seventh trench unit 261.

[0086] Alternatively, the trench units of the first trench unit group 27, excluding the sixth trench unit 251, are connected between the remaining two trisection points of the eighth trench unit 262.

[0087] For example, the first trench unit group 27 includes two adjacent sixth trench units 251 and another trench unit. The seventh trench unit 261 and the eighth trench unit 262 are each divided into three equal regions, each with two trisection points, dividing the trench unit length into three segments. The trisection points of each of the seventh trench unit 261 and the eighth trench unit 262 are located at their respective one-third and two-thirds points. The sixth trench unit 251 is connected between the two-thirds point of the seventh trench unit 261 and the one-third point of the eighth trench unit 262, while the other trench unit is connected between the one-third and two-thirds points of the eighth trench unit 262 itself.

[0088] This also helps to improve the circumferential distribution uniformity of the groove structure 2, which in turn helps to improve the flow and distribution uniformity of the polishing fluid, thereby improving the polishing quality and flatness of the polished surface of the workpiece.

[0089] like Figure 2 As shown, in some other embodiments, the outermost third trench layer 25 of the second trench group 22 is formed as the innermost trench layer of the first trench group 21, so that the first trench group 21 and the second trench group 22 are continuous along the radial direction of the polishing layer 1 and maintain a certain arrangement pattern.

[0090] In this way, the grooves of the second groove group 22 located on the radial inner side of the polishing layer 1 are conducive to the rapid discharge of polishing liquid in the inner area with a lower linear velocity, while the grooves of the first groove unit group 27 located on the radial outer side of the polishing layer 1 are conducive to extending the residence time of polishing liquid in the outer area with a higher linear velocity. This makes the polishing liquid distribution on the surface treatment tool 10 more uniform, and enables a stable removal rate and a better flatness on the surface of the workpiece.

[0091] The surface treatment tool 10 of some embodiments of this application will now be described. In some embodiments, the surface treatment tool 10 includes a polishing layer 1 and a groove structure 2 disposed on the surface of the polishing layer 1, wherein this embodiment and the above-described Figure 2The same parts of the embodiments shown will not be described again, and reference can be made to the above embodiments.

[0092] In yet some embodiments, the multi-layered grooves of the trench structure 2 along the radial direction of the polishing layer 1 are formed as a groove group, which can include a plurality of pairs of groove layers, each pair of groove layers can include an adjacent third groove layer 25 and a fourth groove layer 26.

[0093] Wherein, the structure of each of the third groove layer 25 and the fourth groove layer 26 and the relationship between the two, as well as the relationship between the two adjacent pairs of groove layers and the above Figure 2 The same parts of the embodiments shown will not be described again, and reference can be made to the above embodiments.

[0094] Some embodiments of the present application provide a processing process, which uses the surface treatment tool of any of the above technical solutions to process a workpiece. Since the processing process provided by the present application uses the surface treatment tool of any of the above technical solutions, they can solve the same technical problems and achieve the same effects.

[0095] For example, the processing process can include a chemical mechanical polishing process or a surface precision mechanical polishing process, etc.

[0096] Some embodiments of the present application provide a device, which is processed by the surface treatment tool of any of the above technical solutions. Since the device provided by the present application is processed by the surface treatment tool of any of the above technical solutions, they can solve the same technical problems and achieve the same effects.

[0097] For example, the device can be a semiconductor device, for example, can be a wafer, and the device can be processed by the above processing process using the surface treatment tool.

[0098] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0099] The above preferred embodiments have further described the purposes, technical solutions and advantages of the present application in detail, and it should be understood that the above description is only for the preferred embodiments of the present application and should not be used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A surface treatment tool characterized by comprising: The polishing layer comprises: a groove structure arranged on the surface of the polishing layer, the groove structure comprising a plurality of groove layers arranged along the radial direction of the polishing layer, each groove layer comprising a plurality of groove units arranged in an array along the circumferential direction of the polishing layer, the groove units being formed as arc segments and being arched from outside to inside along the radial direction of the polishing layer, and adjacent two groove units being connected end to end; in adjacent two groove layers, the connecting points of adjacent two groove units of the groove in the inner layer and one groove unit of the groove in the outer layer are connected. The groove structure comprises adjacent first and second groove layers, the first groove layer being located radially outside the second groove layer; 2. The surface treatment tool of claim 1, wherein, The first groove layer comprises adjacent first and second groove units, the first groove unit comprising first and second end points, the second groove unit comprising third and fourth end points, and the second end point and the third end point being connected; The second groove layer comprises adjacent and sequentially arranged third, fourth and fifth groove units, the fourth groove unit comprising fifth and sixth end points, the third groove unit being connected to the fifth end point, and the fifth groove unit being connected to the sixth end point; The fifth end point is connected to the first groove unit and located between the first and second end points, and the sixth end point is connected to the second groove unit and located between the third and fourth end points. The fifth end point is connected to the midpoint of the first groove unit, and the sixth end point is connected to the midpoint of the second groove unit.

3. The surface treatment tool of claim 2, wherein, The groove structure comprises adjacent third and fourth groove layers, the third groove layer being located radially outside the fourth groove layer; 4. The surface treatment tool of claim 1, wherein The groove units of the third groove layer are divided into a plurality of groove unit groups, each groove unit group comprising at least two groove units; The groove units of the fourth groove layer and the groove unit groups of the third groove layer correspond one by one and are arranged oppositely along the radial direction of the polishing layer. The third and fourth groove layers constitute a pair of groove layers, and the groove structure comprises a plurality of pairs of groove layers arranged along the radial direction.

5. The surface treatment tool of claim 4, wherein, In adjacent two pairs of groove layers, the third groove layer in the inner pair of groove layers comprises a first groove unit group, the first groove unit group comprising a sixth groove unit, and the fourth groove layer in the outer pair of groove layers comprises adjacent seventh and eighth groove units; 6. The surface treatment tool of claim 5, wherein, The sixth groove unit is connected between the seventh and eighth groove units, and the groove units of the first groove unit group other than the sixth groove unit are individually connected to the seventh and / or eighth groove units. The first groove unit group comprises two adjacent groove units, one of which is the sixth groove unit, and the sixth groove unit is connected between the trisection point of the seventh groove unit and the trisection point of the eighth groove unit; 7. The surface treatment tool of claim 6, wherein, ​ The groove units of the first groove unit group, except the sixth groove unit, are connected between the other two trisection points of the seventh groove unit; Or, the groove units of the first groove unit group, except the sixth groove unit, are connected between the other two trisection points of the eighth groove unit.

8. The surface treatment tool of claim 2, wherein, The groove structure comprises a first groove group and a second groove group arranged along the radial direction of the polishing layer, the first groove group is located radially outside the second groove group; The first groove group comprises the first groove layer and the second groove layer which are adjacent; The second groove group comprises a plurality of pairs of groove layers arranged along the radial direction of the polishing layer, each pair of groove layers comprises a third groove layer and a fourth groove layer which are adjacent, the third groove layer is located radially outside the fourth groove layer, a plurality of groove units of the third groove layer are divided into a plurality of groove unit groups, each groove unit group comprises at least two groove units, the groove units of the fourth groove layer and the groove unit groups of the third groove layer are one-to-one corresponding and oppositely arranged along the radial direction of the polishing layer; The outermost third groove layer of the second groove group is formed as one groove layer of the innermost first groove group.

9. The surface treatment tool of any one of claims 1-8, wherein, The groove units are formed as circular arc segments, and two adjacent groove units are tangent to each other.

10. The surface treatment tool of any one of claims 1-8, wherein, The surface of the polishing layer has a central region, and the groove structure is arranged around the central region along the circumferential direction of the polishing layer.

11. A processing procedure, characterized by The machining process uses the surface treatment tool according to any one of claims 1-10 to process a workpiece.

12. A device, characterized by The device is prepared by processing the surface treatment tool according to any one of claims 1-10. The device is prepared by processing the surface treatment tool according to any one of claims 1-10.

Images