Silicon wafer processing system, method and device for identifying state of silicon wafer in silicon wafer box, and medium

Abstract

The invention discloses a silicon wafer processing system, a method and a device for identifying the state of a silicon wafer in a silicon wafer box, and a medium, the silicon wafer box comprises a plurality of slot positions which are sequentially arranged along a first direction, and the slot positions are used for placing the silicon wafer. The method for identifying the state of the silicon wafer in the silicon wafer box comprises the following steps: acquiring current state data of each slot in the silicon wafer box; respectively determining the current state of the silicon wafer in each slot according to the current state data of each slot; and displaying the current state image of each slot in the silicon wafer box image in the same picture according to the current state of the silicon wafer in each slot. According to the technical scheme, the states of the silicon wafers in the slots in the silicon wafer box can be visually displayed, the states of the silicon wafers in the slots are displayed in the same picture, and integrated display of the states of the silicon wafers is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a silicon wafer processing system and a method, apparatus and medium for identifying the state of silicon wafers in a silicon wafer cassette. Background Technology

[0002] In semiconductor device manufacturing, precise handling and state control of silicon wafers are crucial for ensuring process quality. In semiconductor device manufacturing, silicon wafers need to be removed from the wafer cassette and transferred to the stage for exposure and other steps. The state of the wafer in each slot can be determined by assessing whether it is located in its designated slot within the wafer cassette, whether it is in transit, whether exposure has occurred, and whether any abnormalities have been detected. Because there are many conditions to consider, the possible combinations of wafer states are numerous. Furthermore, when the wafer cassette contains multiple slots, the states of the wafers in each slot may differ, making the state management of silicon wafers within the wafer cassette quite complex.

[0003] Therefore, how to integrate and manage the state of silicon wafers in a silicon wafer cassette has become a pressing technical problem that needs to be solved. Summary of the Invention

[0004] This invention provides a silicon wafer processing system and a method, device, and medium for identifying the state of silicon wafers in a silicon wafer box. It can intuitively display the state of silicon wafers in each slot of the silicon wafer box, realize the integrated display of the state of silicon wafers in each slot of the silicon wafer box, save the time of screen switching, and help improve production efficiency.

[0005] In a first aspect, the present invention provides a method for identifying the state of silicon wafers in a wafer cassette, the wafer cassette comprising a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers, the method for identifying the state of silicon wafers in the wafer cassette comprising:

[0006] Obtain the current status data of each slot in the silicon wafer cassette;

[0007] Based on the current state data of each slot, determine the current state of the silicon wafer in each slot;

[0008] Based on the current state of the silicon wafers in each slot, the current state images of each slot in the silicon wafer cassette image are displayed in the same frame.

[0009] Optionally, the state of the silicon wafer in the slot consists of at least three dimensions, with each dimension including at least two state categories;

[0010] The state image of the slot is composed of at least image shape, image fill and image color; the image shapes corresponding to at least two state categories under at least one dimension are different, the image fills corresponding to at least two state categories under at least one dimension are different, and the image colors corresponding to at least two state categories under at least one dimension are different.

[0011] Optionally, obtaining the current status data of each slot in the silicon wafer cassette includes:

[0012] Obtain the current silicon wafer scanning information and the current silicon wafer station information for each slot;

[0013] Based on the current silicon wafer scanning information and the current silicon wafer station information of each slot, the current status data of each slot is determined respectively.

[0014] Optionally, based on the current silicon wafer scanning information and the current silicon wafer station information of each slot, the current status data of each slot is determined, including:

[0015] Based on the current silicon wafer scanning information of each slot, the current silicon wafer data in each slot is determined respectively;

[0016] Based on the current silicon wafer station information of each slot, determine the current transfer data and current exposure data of the silicon wafer in each slot.

[0017] The current status data of the slot is determined based on the current silicon wafer data, the current transfer data, and the current exposure data for the same slot.

[0018] Optionally, the status data of the slot includes silicon wafer data, transmission data, exposure data, and at least one redundant data; wherein the redundant data of each slot is the same;

[0019] In the same state data, the silicon wafer data, the transmission data, the exposure data, and the redundant data are all 4-bit binary data.

[0020] Optionally, based on the current state data of each slot, the current state of the silicon wafer in each slot is determined, including:

[0021] The current state data in each slot is analyzed to determine the silicon wafer state, transfer state, and exposure state of the silicon wafer in each slot.

[0022] Optionally, each 4 bits of data in the current state data constitutes a data group; any two adjacent data groups constitute a set of computational data.

[0023] The current state data within each slot is parsed to determine the wafer state, transfer state, and exposure state of the silicon wafer within each slot, including:

[0024] The logical operation results of each of the calculated data and the preset data in the same current state data are determined respectively; wherein, the preset data is 8-bit binary data;

[0025] Based on the results of the logical operation, the wafer state, transfer state, and exposure state of the silicon wafers in each slot are determined respectively.

[0026] Optionally, before obtaining the current status data of each slot in the silicon wafer cassette, the method further includes:

[0027] When the scanning device is controlling the scanning device to scan each slot of the silicon wafer cassette, the current scanning status of the silicon wafer cassette is obtained;

[0028] Based on the current scan status of the silicon wafer cassette, display the current status image of the silicon wafer cassette.

[0029] Optionally, based on the current scan state of the silicon wafer cassette, a current state image of the silicon wafer cassette is displayed, including:

[0030] When it is determined that the silicon wafer cassette has been successfully scanned based on its current scanning status, a first state image of the silicon wafer cassette is displayed, and the step of obtaining the current state data of each slot in the silicon wafer cassette is executed.

[0031] When it is determined that the silicon wafer cassette is scanning incorrect based on its current scanning status, a second state image of the silicon wafer cassette is displayed.

[0032] The first state image includes a silicon wafer cassette with a first shape outline, a first scan indication image located within the first shape outline, and state images of each slot.

[0033] The second status image includes a silicon wafer cassette with the first shape outline, and a second scan indication image and a status warning image located within the first shape outline;

[0034] The color of the first scan indication image is different from the color of the second scan indication image.

[0035] Optionally, before controlling the scanning device to scan each slot of the silicon wafer cassette, the method further includes:

[0036] Obtain the current rotation state of the silicon wafer cassette;

[0037] Based on the current rotation state, display the current state image of the silicon wafer cassette.

[0038] Optionally, based on the current rotation state, display an image of the current state of the silicon wafer cassette, including:

[0039] When the silicon wafer cassette is determined to be rotated into position based on the current rotation state, a third state image of the silicon wafer cassette is displayed;

[0040] When it is determined from the current rotation state that the silicon wafer cassette has not been rotated into position, a fourth state image of the silicon wafer cassette is displayed;

[0041] The third state image includes a silicon wafer cassette with a second shape outline, a first rotation indicator image located within the second shape outline, and multiple slot images arranged along the first direction.

[0042] The fourth state image includes a silicon wafer cassette with a third shape outline, as well as a second rotation indicator image and a state warning image located within the third shape outline;

[0043] The color of the first rotation indicator image is different from the color of the second rotation indicator image.

[0044] In a second aspect, the present invention provides a silicon wafer state identification device in a silicon wafer cassette, the silicon wafer cassette including a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers, the silicon wafer state identification device in the silicon wafer cassette comprising:

[0045] The data acquisition module is used to acquire the current status data of each slot in the silicon wafer box;

[0046] The status determination module is used to determine the current status of the silicon wafer in each slot based on the current status data of each slot.

[0047] The image display module is used to display the current state image of each slot in the silicon wafer box image in the same screen according to the current state of the silicon wafer in each slot.

[0048] Thirdly, the present invention provides a silicon wafer processing system, comprising at least: a silicon wafer cassette, a conveying mechanism, multiple workpiece stages, and a control module;

[0049] The silicon wafer cassette includes a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers;

[0050] The conveying mechanism is used to control the transfer of the silicon wafers in the slots between the workpiece stages;

[0051] The control module is used to execute the silicon wafer status identification method in the silicon wafer cassette described in any of the above-mentioned methods.

[0052] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions for causing a processor to execute the silicon wafer state identification method in a silicon wafer cassette as described in any of the preceding claims.

[0053] Fifthly, the present invention provides a computer program product comprising a computer program that, when executed by a processor, implements the silicon wafer state identification method in a silicon wafer cassette according to any one of the preceding claims.

[0054] The technical solution of this invention acquires the current state data of each slot in a silicon wafer cassette and determines the current state of the silicon wafer in each slot based on this data. This allows for the simultaneous display of the current state images of each slot in the silicon wafer cassette image on the same screen, enabling the integrated display of the silicon wafer status images in each slot without the need for additional image switching controls, thus reducing development and maintenance costs. Furthermore, in semiconductor device manufacturing processes, the current state images of each slot in the silicon wafer cassette image can be intuitively viewed, allowing for timely implementation of countermeasures, thereby reducing semiconductor device production costs and improving production efficiency. Attached Figure Description

[0055] Figure 1 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 1 of the present invention;

[0056] Figure 2 This is a schematic diagram of the silicon wafer processing system provided in an embodiment of the present invention;

[0057] Figure 3 This is a schematic diagram of the status images of each slot in the silicon wafer cassette provided in an embodiment of the present invention;

[0058] Figure 4 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 2 of the present invention;

[0059] Figure 5 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 3 of the present invention;

[0060] Figure 6 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 4 of the present invention;

[0061] Figure 7 This is a schematic diagram of the first state image of the silicon wafer cassette provided in an embodiment of the present invention;

[0062] Figure 8This is a schematic diagram of the second state image of the silicon wafer cassette provided in an embodiment of the present invention;

[0063] Figure 9 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 5 of the present invention;

[0064] Figure 10 This is a schematic diagram of the third state image of the silicon wafer cassette provided in an embodiment of the present invention;

[0065] Figure 11 This is a schematic diagram of the fourth state image of the silicon wafer cassette provided in an embodiment of the present invention;

[0066] Figure 12 This is a schematic diagram of a state image of a silicon wafer cassette placement stage without a silicon wafer cassette placed, provided in an embodiment of the present invention.

[0067] Figure 13 This is a schematic diagram of the structure of a silicon wafer status identification device in a silicon wafer box provided in Embodiment Six of the present invention. Detailed Implementation

[0068] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0069] The terminology used in the embodiments of this invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. It should be noted that directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this invention are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this invention. Furthermore, in the context, it should be understood that when referring to an element being formed "on" or "below" another element, it can be formed not only directly on or below the other element, but also indirectly on or below it through intermediate elements. The terms "first," "second," etc., are used for descriptive purposes only and do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0070] The term "comprising" and its variations as used in this invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment".

[0071] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish the corresponding contents and are not used to limit the order or interdependence.

[0072] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0073] Example 1

[0074] Figure 1 This is a flowchart illustrating a method for identifying the state of silicon wafers in a wafer cassette according to Embodiment 1 of the present invention. This embodiment can be used to accurately determine the state of silicon wafers in a wafer cassette. This method can be executed by a silicon wafer state identification device in the wafer cassette. This device can be implemented in software and / or hardware, and is generally integrated into the control module of a silicon wafer processing system. The wafer cassette may include multiple slots arranged sequentially along a first direction, and the slots are used to place silicon wafers. (Reference) Figure 1 The silicon wafer state identification method in the silicon wafer cassette of this embodiment includes:

[0075] S110. Obtain the current status data of each slot in the silicon wafer box.

[0076] The status data of the slots in the silicon wafer cassette can include multiple bits of binary data, where each bit can be either "0" or "1" to represent different states of the silicon wafer in the slot. This status data can be stored in a corresponding memory, allowing it to be directly retrieved when needed. The status data in the memory can be updated in real time based on signals detected by various sensors.

[0077] Specifically, Figure 2 This is a schematic diagram of the silicon wafer processing system provided in an embodiment of the present invention, as shown below. Figure 2As shown, the silicon wafer processing system may include a conveying mechanism 40 and multiple workpiece stages. The multiple workpiece stages include at least a wafer cassette placement stage 50 and an exposure stage 60. A wafer cassette 70 can be placed on the wafer cassette placement stage 50. The wafer cassette 70 includes multiple slots arranged sequentially along a first direction, each slot capable of holding one silicon wafer. The conveying mechanism 40 may include, for example, a robotic arm. The conveying mechanism 40 can remove a silicon wafer from a slot in the wafer cassette 70 placed on the wafer cassette placement stage 50 and convey it to other workpiece stages, such as the exposure stage 60. Alternatively, the conveying mechanism 40 can also convey the silicon wafer from the exposure stage 60 back to the wafer cassette placement stage 50 and place it in a slot in the wafer cassette 70. In this case, by setting corresponding sensors on the conveying mechanism 40 and each workpiece stage, such sensors including but not limited to image acquisition sensors 90, pressure detection sensors, position detection sensors, and scanning devices 00, the position of the silicon wafer corresponding to each slot and the fabrication process can be monitored. For example, silicon wafers located in wafer cassette 70 can be scanned sequentially from slot 1 to slot N along the positive direction of the first direction using scanning equipment 00 to determine whether the silicon wafers in wafer cassette 70 are abnormal; silicon wafers transported on conveyor mechanism 40 can have their images acquired by image acquisition sensor 90 mounted on conveyor mechanism 40 to determine the slot for placing the silicon wafer; during silicon wafer exposure, optical sensors can be used to determine whether the silicon wafer has been accurately exposed. At this time, the control module of the silicon wafer processing system can acquire the signals acquired by each sensor, generate status data for each slot according to the signals acquired by each sensor, and store the generated status data of each slot in the memory for subsequent applications.

[0078] S120. Based on the current status data of each slot, determine the current status of the silicon wafer in each slot.

[0079] Different state data correspond to different states of silicon wafers within a slot, and the state of the silicon wafers in each slot is a combination of states of the silicon wafers in various dimensions. There can be a certain mapping relationship between the state data of a slot and the state of the silicon wafers within that slot. Based on this mapping relationship and the current state data of the slot, the current state of the silicon wafers within that slot can be determined.

[0080] In an optional embodiment, the state of the silicon wafer in the slot consists of at least three dimensions, with each dimension including at least two state categories. That is, the state of the silicon wafer in the slot can consist of three or more dimensions, and each dimension can include two or more state categories.

[0081] Specifically, in the semiconductor device manufacturing process, the status data of each slot is generated based on the signals from the sensors installed on each workpiece stage and the conveying mechanism in the silicon wafer processing system. The sensors installed on each workpiece stage and the conveying mechanism can determine the current position of the silicon wafer in each slot and the process at the current position. Therefore, the current state of the silicon wafer in that slot can be determined based on the status data of the slot.

[0082] For example, taking the state of the silicon wafer in the slot as consisting of three dimensions, namely the first dimension, the second dimension, and the third dimension, the state classification under the first dimension can include no silicon wafer in the slot and silicon wafer present, etc. The state classification under the second dimension can include the silicon wafer corresponding to the slot being transported and not being transported, etc. The state classification under the third dimension can include the silicon wafer corresponding to the slot being exposed and not exposed, etc. The status data for each slot can include 3 bits of binary data. In the status data of the same slot, bits 0 to 2 represent the status classification under the first, second, and third dimensions, respectively. Under the first dimension, when there is no silicon wafer in the slot, the 0th bit can be "0" and when there is a silicon wafer in the slot, the 0th bit can be "1". Under the second dimension, when the silicon wafer corresponding to the slot is being transported, the 1st bit can be "1" and when the silicon wafer corresponding to the slot is not being transported, the 1st bit can be "0". Under the third dimension, when the silicon wafer corresponding to the slot has been exposed, the 2nd bit can be "1" and when the silicon wafer corresponding to the slot has not been exposed, the 2nd bit can be "0". For example, when the current status data of a slot is "101", it can be determined that there is a silicon wafer in the slot and that the silicon wafer has been exposed. Thus, the status of the silicon wafer in the slot can be determined as the silicon wafer being located in the slot and exposed. When the current status data of a slot is "010", it can be determined that there is no silicon wafer in the slot and that the corresponding silicon wafer in the slot has not been exposed and is being transported. Thus, the status of the silicon wafer in the slot can be determined as the silicon wafer not being in the slot, being transported, and not yet exposed.

[0083] It should be noted that the above example only illustrates the technical solution of the present invention by limiting the state of the silicon wafer in the slot from three dimensions. However, in the embodiments of the present invention, the state composition of the silicon wafer in the slot is not limited to this, and can also be composed of more dimensions. In this case, the number of bits included in the state data can be further increased. Furthermore, the above example only illustrates the technical solution of the embodiments of the present invention by including two state categories under each dimension. In the embodiments of the present invention, each dimension can also include more state categories, and the number of state categories under each dimension can be the same or different. The specific design can be tailored according to the needs of the embodiments, and the embodiments of the present invention do not impose specific limitations on this.

[0084] S130. Based on the current state of the silicon wafers in each slot, display the current state image of each slot in the silicon wafer box image on the same screen.

[0085] The state of the silicon wafers within a slot varies, resulting in different state images displayed in the wafer cassette image. These state images may include, but are not limited to, the shape, filling pattern, and filling color of the silicon wafers within the slot. Differences in state images can be reflected through variations in the shape, filling pattern, and filling color of the silicon wafers within the slot. A mapping relationship can exist between the state of the silicon wafers within a slot and the state image of the slot. Based on this mapping relationship and the current state of the silicon wafers within the slot, the current state image of the slot can be determined. Furthermore, the current state images of each slot in the wafer cassette image are displayed on the same screen. This means that different slot state images can be displayed within the same screen, and the state images of each slot displayed on this screen can be different. Therefore, the state images of slots with different silicon wafer states can be viewed intuitively without switching screens.

[0086] In an optional embodiment, when the state of the silicon wafer in the slot consists of at least three dimensions, each dimension including at least two state categories, the state image of the slot consists of at least image shape, image fill and image color; the image shapes corresponding to at least two state categories in at least one dimension are different, the image fills corresponding to at least two state categories in at least one dimension are different, and the image colors corresponding to at least two state categories in at least one dimension are different.

[0087] For example, refer to Figure 3Taking the state of silicon wafers in a slot as an example, which consists of three dimensions, namely the first dimension, the second dimension, and the third dimension. The state classification under the first dimension can include no silicon wafer in the slot, normal silicon wafers present, and abnormal silicon wafers present. Abnormal silicon wafers can include thick wafers, thin wafers, stacked wafers, curved wafers, and wafers spanning slots. The state classification under the second dimension can include whether the silicon wafer corresponding to the slot is being transported or not. The state classification under the third dimension can include whether the silicon wafer corresponding to the slot has been normally exposed, abnormally exposed, is being exposed, or has not been exposed. Thus, when it is determined from the current state of the silicon wafers in the slot that there are no silicon wafers in the slot, and the silicon wafer corresponding to the slot is not being conveyed or is not on other worktables, i.e., no silicon wafer is placed in the slot, the image shape of the status image of the slot (e.g., slots 7, 14, and 21) can be a rounded rectangle, and no image color can be set in the rounded rectangle; when it is determined from the current state of the silicon wafers in the slot that the silicon wafers in the slot are being conveyed, the image shape of the status image of the slot (e.g., slots 19, 20, 22, and 24) can be a right-angled rectangle, and the right-angled rectangle can have " The image fill for "..." is used when, based on the current state of the silicon wafer in the slot, it is determined that there is no silicon wafer in the slot and the wafer is not being conveyed, meaning the wafer in the slot may be located on another worktable. The image shape of the status image for that slot (e.g., slots 6, 9, 10, 13, 15, 16, and 25) can be a right-angled rectangle, and no "..." image fill is set within the right-angled rectangle. When, based on the current state of the silicon wafer in the slot, it is determined that the wafer is located in the slot and that the wafer is an abnormal wafer, the image shape of the status image for that slot (e.g., slots 2, 3, 8, 12, 17, and 23) is used. The image can be a rounded rectangle, and the image fill can be set according to the specific abnormality of the silicon wafer, such as whether the silicon wafer is thick, thin, stacked, curved, or spanned. When it is determined from the current state of the silicon wafer in the slot that the silicon wafer is located in the slot and that the silicon wafer is normal, the image shape of the status image of the slot (e.g., slots 1, 4, 5, 11, and 18) can be a rounded rectangle, and no corresponding image fill is set in the rounded rectangle. When it is determined from the current state of the silicon wafer in the slot that the silicon wafer is not exposed, the status of the slot (e.g., slots 5, 11, 16, 18, and 19) can be set. The image color can be gray-black; when it is determined that the silicon wafer has been properly exposed based on the current state of the silicon wafer in the slot, the image color of the status image of that slot (e.g., slots 4, 13, and 24) can be green; when it is determined that the silicon wafer is being exposed based on the current state of the silicon wafer in the slot, the image color of the status image of that slot (e.g., slots 6, 10, 15, 20, and 25) can be blue; when it is determined that the silicon wafer has been exposed incorrectly based on the current state of the silicon wafer in the slot, the image color of the status image of that slot (e.g., slots 6, 10, 15, 20, and 25) can be red.In this way, by setting the image shape, image color and image fill of the status image of each slot according to the current status of the silicon wafer in each slot, the current status of the silicon wafer in each slot can be intuitively known, which facilitates subsequent process arrangement and helps to improve production efficiency.

[0088] It should be noted that the above is only an example of the state of the silicon wafer in the slot including three dimensions. In other optional embodiments, the state of the silicon wafer in the slot may also include more dimensions, such as whether the silicon wafer is being inspected. By setting more image fill, image color and image shape, more dimensions of state can be displayed. The specific design can be made according to actual needs, and the embodiments of the present invention do not limit this.

[0089] It is understood that, in the embodiments of the present invention, the specific image shapes for different state classifications within the same dimension are not limited to the rounded rectangles and right rectangles mentioned above. Any shape can be selected according to actual needs, such as regular or irregular image shapes like circles, ellipses, triangles, pentagons, and hexagons. The specific design can be tailored to actual needs, and the embodiments of the present invention do not impose any specific limitations on this. Similarly, image filling and image shapes are not limited to the above forms; that is, image colors can use any known color system, and image filling can use any known filling shape. The specific design can be tailored to actual needs, and the embodiments of the present invention do not impose any limitations on this.

[0090] This embodiment acquires the current status data of each slot in the silicon wafer cassette and determines the current status of the silicon wafer in each slot based on this data. Based on the current status of the silicon wafer in each slot, the current status images of each slot in the silicon wafer cassette image are simultaneously displayed on the same screen. This allows the status images of the silicon wafers in each slot of the silicon wafer cassette to be integrated and displayed on the same screen without the need for additional image switching controls, thus reducing development and maintenance costs. Furthermore, in semiconductor device manufacturing processes, the current status images of each slot in the silicon wafer cassette image can be viewed intuitively, enabling timely responses based on the current status images of each slot, thereby reducing semiconductor device production costs and improving semiconductor device production efficiency.

[0091] Example 2

[0092] Figure 4 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette according to Embodiment 2 of the present invention. This embodiment, based on the above embodiments, provides a detailed explanation of the method for obtaining the current state data of each slot in the silicon wafer cassette. Figure 4 As shown, the method for identifying the state of silicon wafers in the silicon wafer cassette includes:

[0093] S210: Obtain the current silicon wafer scanning information and the current silicon wafer station information for each slot.

[0094] The silicon wafer scanning information for each slot can be obtained by scanning the silicon wafer cassette placed on the silicon wafer cassette platform using the corresponding scanning sensor. The current silicon wafer scanning information for each slot can be determined by the scanning information fed back by the scanning device.

[0095] For example, when the wafer cassette includes N slots (N being an integer greater than 1), a scanning device can be used to scan the silicon wafers in each slot sequentially from slot 1 to slot N along the forward direction of the first direction, and feed back the forward scan information to the control module. This allows the control module to determine the thickness and position of the silicon wafers in each slot scanned along the forward direction of the first direction based on the forward scan information. Then, the scanning device can be used to scan the silicon wafers in each slot sequentially from slot N to slot 1 along the reverse direction of the first direction, and feed back the reverse scan information to the control module. This allows the control module to determine the thickness and position of the silicon wafers in each slot scanned along the reverse direction of the first direction based on the reverse scan information. In this way, the control module can combine the forward and reverse scan information to determine the silicon wafer scanning information for each slot.

[0096] The wafer station information for each slot can be acquired using sensors installed on each workpiece stage and conveyor mechanism. For example, a one-to-one mapping relationship can be established between each slot and a wafer. After a wafer is removed from its slot, the sensors at each workpiece stage and conveyor mechanism can track the wafer in that slot in real time, thereby determining whether the wafer has passed through or is currently on the workpiece stage or conveyor mechanism where the sensor is located. Thus, by combining the information acquired by the sensors at each workpiece stage and conveyor mechanism, the wafer station information for each slot can be determined.

[0097] S220. Based on the current silicon wafer scanning information and current silicon wafer station information of each slot, determine the current status data of each slot.

[0098] Different silicon wafer scanning information and silicon wafer station information can correspond to different status data. There can be a certain mapping relationship between the silicon wafer scanning information and silicon wafer station information of a slot and the status data of the slot. Based on each mapping relationship and the current silicon wafer scanning information and current silicon wafer station information of the slot, the current status data of the slot can be determined.

[0099] Optionally, based on the current silicon wafer scanning information and current silicon wafer station information of each slot, the current status data of each slot can be determined. Specifically, this may include: determining the current silicon wafer data in each slot based on the current silicon wafer scanning information; determining the current transfer data and current exposure data of the silicon wafers in each slot based on the current silicon wafer station information; and determining the current status data of the same slot based on the current silicon wafer data, current transfer data, and current exposure data.

[0100] Specifically, the silicon wafer scanning information for each slot is determined by the control module by combining information from both forward and reverse scans. By performing forward and reverse scans on each slot in the wafer cassette, the thickness and position of the silicon wafers within each slot can be determined. This allows for the determination of whether a silicon wafer is present in each slot, and whether the wafers in slots containing wafers are abnormal. For abnormal wafers, the specific type of abnormality can be identified, thus generating corresponding silicon wafer data. For example, if the thickness of a silicon wafer in a slot exceeds the upper limit of the normal range based on forward and reverse scans, the wafer in that slot is identified as a thick wafer, and silicon wafer data corresponding to a thick wafer can be generated. If the thickness of a silicon wafer in a slot is less than the lower limit of the normal range based on forward and reverse scans, the wafer is identified as a thin wafer, and silicon wafer data corresponding to a thin wafer can be generated. If two silicon wafers are placed in the same slot based on forward and reverse scans, the wafers are identified as stacked wafers, and silicon wafer data corresponding to stacked wafers can be generated. When forward and reverse scanning determine a deviation in the horizontal position of the silicon wafer, it can be identified as a curved wafer, and corresponding silicon wafer data can be generated. When forward and reverse scanning determine that the silicon wafer is a slot-crossing wafer, corresponding silicon wafer data can be generated. When forward and reverse scanning determine that there are no abnormalities in the silicon wafer within the slot (i.e., the wafer is normal), corresponding silicon wafer data can be generated. When forward and reverse scanning determine that there is no silicon wafer in the slot, corresponding silicon wafer data can be generated. The silicon wafer data corresponding to thick wafers, thin wafers, stacked wafers, curved wafers, slot-crossing wafers, normal wafers, and no wafers are all different, allowing for subsequent determination of the wafer status within the slot based on the data.

[0101] In an optional embodiment, the silicon wafer data within the slot can be 4 bits of binary data, that is, the silicon wafer data within the slot can be represented by binary data from "0000" to "1111". For example, when the current silicon wafer scan information of the slot determines that there is no silicon wafer in the slot, the current silicon wafer data of the slot can be determined to be "0000"; when the current silicon wafer scan information of the slot determines that there is a normal silicon wafer in the slot, the current silicon wafer data of the slot can be determined to be "1111". In the case where the current silicon wafer scan information of the slot determines that there is an abnormal silicon wafer in the slot, the corresponding status data can be determined from the binary data between "0000" and "1111" according to the actual abnormality of the silicon wafer.

[0102] Accordingly, based on the silicon wafer scanning information, it can be determined whether a silicon wafer exists in each slot. If no silicon wafer is present in a slot, the position of the silicon wafer in each slot can be determined based on the silicon wafer station information determined by sensors on each workpiece stage and the conveying mechanism. This allows for the determination of whether the silicon wafer in each slot is being conveyed, and consequently, the conveying data of the silicon wafer within the slot. In an optional embodiment, the conveying data of the silicon wafer within the slot can be 4 bits of binary data, i.e., binary data from "0000" to "1111" can be used to represent the conveying data of the silicon wafer within the slot. For example, when the current silicon wafer station information of the slot indicates that the silicon wafer is being conveyed, the current conveying data of the slot can be "1111"; when the current silicon wafer station information of the slot indicates that the silicon wafer is not being conveyed, it can be determined that the silicon wafer is within the slot or on another workpiece stage, and the current conveying data of that slot can be "0000".

[0103] Similarly, when the workpiece stage of the silicon wafer processing system includes an exposure stage, the silicon wafer station information determined by the sensors installed at the exposure stage can be used to determine whether the silicon wafer in each slot has been exposed, and the specific exposure status. Different exposure data can be determined based on different exposure statuses. In an optional embodiment, the exposure data of the slot can be 4-bit binary data, that is, the exposure data of the silicon wafer in the slot can be represented by binary data from "0000" to "1111". For example, when the current silicon wafer station information of the slot determines that the silicon wafer in the slot has not been exposed, the current exposure data of the slot can be determined to be "0000"; when the current silicon wafer station information of the slot determines that the silicon wafer in the slot has been normally exposed, the current exposure data of the slot can be determined to be "1111"; when the current silicon wafer station information of the slot determines that the silicon wafer in the slot has an exposure error, the current exposure data of the slot can be determined to be "0010"; when the current silicon wafer station information of the slot determines that the silicon wafer in the slot has been normally exposed, the current exposure data of the slot can be determined to be "1010".

[0104] Furthermore, after determining the current silicon wafer data, current transfer data, and current exposure data for each slot, the current status data of that slot can be determined based on the current silicon wafer data, current transfer data, and current exposure data for the same slot. For example, the status data of a slot can be a combination of the silicon wafer data, transfer data, and exposure data for that slot. When the silicon wafer data, transfer data, and exposure data are all 4-bit binary data, the status data can include 12-bit binary data. In this 12-bit binary data, bits 0 to 3 are silicon wafer data, bits 4 to 7 are transfer data, and bits 8 to 11 are exposure data.

[0105] Based on the above embodiments, assuming the slot status data includes wafer data, transmission data, and exposure data, the slot status data may further include at least one redundant data; each redundant data may also be 4 bits of binary data. The redundant data can serve as reserved data bits for the status data, facilitating the addition of more dimensions of status classification data later. To facilitate subsequent development, the redundant data for each slot can be the same data, for example, the redundant data for each slot can all be "0000" or "1111". The specific design can be tailored to actual needs, and this embodiment of the invention does not impose specific limitations on this.

[0106] It is understood that the status data includes at least one redundant data, that is, it may include one or more redundant data. The specific design can be tailored to actual needs, and this embodiment of the invention does not impose specific limitations on this. In an exemplary embodiment, the status data may include one redundant data. In this case, the status data can be 16-bit binary data, so that each status data occupies only 2 bytes of storage space. This reduces the amount of memory occupied by each status data, while also enabling higher data transmission efficiency and improving the parsing speed of the status data. This, in turn, helps improve the display effect of the slot status image and reduces the development and maintenance costs of the silicon wafer status determination control.

[0107] S230. Based on the current status data of each slot, determine the current status of the silicon wafer in each slot.

[0108] S240. Based on the current state of the silicon wafers in each slot, display the current state image of each slot in the silicon wafer box image on the same screen.

[0109] This embodiment acquires the silicon wafer scanning signals and silicon wafer station information of each slot in real time. Based on the current silicon wafer scanning information and current silicon wafer station information of each slot, the current status data of each slot is determined. This allows the status data to be composed of silicon wafer data, transmission data, exposure data, and redundant data with a small footprint. As a result, the silicon wafer status data can be presented with a small space and code. Furthermore, when determining the silicon wafer status based on the status data, the status data can be quickly called and parsed, which helps to reduce the development and maintenance costs of the silicon wafer status identification method.

[0110] Example 3

[0111] Figure 5 This is a flowchart illustrating the silicon wafer state identification method in a wafer cassette provided in Embodiment 3 of the present invention. This embodiment, based on the above embodiments, provides a detailed explanation of determining the silicon wafer state within a slot based on the current state data of the slot. Figure 5 As shown, the method for identifying the state of silicon wafers in the silicon wafer cassette includes:

[0112] S310. Obtain the current status data of each slot in the silicon wafer box.

[0113] In an optional embodiment, the status data of the slot may include silicon wafer data, transmission data, exposure data, and at least one redundant data; wherein the redundant data of each slot is the same; in the same status data, the silicon wafer data, transmission data, exposure data, and redundant data are all 4 bits of binary data.

[0114] S320. Analyze the current status data in each slot to determine the wafer status, transfer status and exposure status of the silicon wafer in each slot.

[0115] Specifically, the status data within each slot includes wafer data, transfer data, exposure data, and at least one redundant data. The wafer status, transfer status, and exposure status of the wafers in each slot can be determined by parsing the wafer data, transfer data, and exposure data separately. There are corresponding mapping relationships between wafer data and wafer status, transfer data and transfer status, and exposure data and exposure status. These mapping relationships can exist in the form of relational tables or formulas. By substituting the wafer data, transfer data, and exposure data into the corresponding relational tables or formulas, the wafer status, transfer status, and exposure status within each slot can be determined separately.

[0116] In an optional embodiment, every 4 bits of data in the current state data can form a data group; any two adjacent data groups form a computational data.

[0117] The current status data in each slot is parsed to determine the wafer status, transfer status, and exposure status of the silicon wafer in each slot. Specifically, this may include: determining the logical operation results of each calculated data and preset data in the same current status data; and determining the wafer status, transfer status, and exposure status of the silicon wafer in each slot based on the logical operation results. The preset data is 8-bit binary data.

[0118] Specifically, since the silicon wafer data, transmission data, exposure data, and redundant data in the status data are all 4-bit binary data, each 4-bit data in the current status data is grouped into a data set. That is, silicon wafer data is grouped into one data set, transmission data into another, exposure data into another, and each redundant data set into a third. For example, when the status data is 16-bit binary data, bits 0 to 3 are silicon wafer data, bits 4 to 7 are transmission data, bits 8 to 11 are exposure data, and bits 12 to 15 are redundant data. Any two adjacent data sets constitute one set of computational data. That is, silicon wafer data and transmission data constitute the first set of computational data, transmission data and exposure data constitute the second set of computational data, and exposure data and redundant data constitute the third set of computational data. In other words, each 8-bit binary data set constitutes one set of computational data. The first, second, and third computational data are logically operated on with preset data respectively. Based on the logical operation results between each computational data and the preset data in the status data of the same slot, the wafer status, transfer status, and exposure status of the silicon wafer in that slot are determined respectively.

[0119] For example, the first, second, and third operational data in the status data of the same slot are logically ANDed with preset data. First, the third operational data is logically ANDed with the preset data to determine the logical operation result. Based on this result, the exposure status of the silicon wafer in that slot can be determined, i.e., the silicon wafer's exposure status can be normal exposure, exposure error, exposure in progress, or no exposure. After determining the silicon wafer's exposure status, the second operational data is logically ANDed with the preset data to determine the logical operation result. Based on this result, the conveying status of the silicon wafer in that slot can be determined, i.e., the silicon wafer's conveying status can be conveying in progress or not conveying. After determining the silicon wafer's conveying status, the first operational data is logically ANDed with the preset data. Based on this result, the silicon wafer's status in that slot can be determined, i.e., the silicon wafer's status can be no silicon wafer, normal silicon wafer, thinner silicon wafer, thicker silicon wafer, stacked silicon wafers, or silicon wafers spanning multiple slots.

[0120] It is understood that, given that the preset data is 8 bits of binary data, this embodiment of the invention does not specifically limit the specific value of the preset data. The preset data can exist in binary or hexadecimal form, and can be designed according to actual needs. This embodiment of the invention does not specifically limit this. In an exemplary embodiment, the preset data can be hexadecimal data 0xF, equivalent to 8 bits of binary data "0000 1111".

[0121] S330. Based on the current state of the silicon wafers in each slot, display the current state image of each slot in the silicon wafer box image on the same screen.

[0122] This embodiment analyzes the current status data in each slot to determine the wafer status, transport status, and exposure status of the silicon wafers in each slot, thereby determining the status image of each slot in the wafer cassette image. This allows the various states of the silicon wafers in each slot to be presented intuitively through the status image, facilitating quick identification of the silicon wafer status in each slot and improving the display efficiency of the status image.

[0123] Example 4

[0124] Figure 6 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 4 of the present invention. This embodiment describes the scanning state of the silicon wafer cassette before acquiring the silicon wafer state data, based on the above embodiments. Figure 6 As shown, the method for identifying the state of silicon wafers in the silicon wafer cassette includes:

[0125] S410. When controlling the scanning device to scan each slot of the silicon wafer cassette, obtain the current scanning status of the silicon wafer cassette.

[0126] After placing the silicon wafer cassette on the silicon wafer cassette placement stage, each slot of the silicon wafer cassette needs to be scanned. Specifically, the scan can be performed first along the forward direction of the first direction, and then along the reverse direction of the first direction. After scanning the silicon wafer cassette, the silicon wafer scanning information of each slot can be determined accordingly. Based on the silicon wafer scanning information, the scanning status of the silicon wafer cassette can be determined accordingly.

[0127] In an optional embodiment, the scanning status of the silicon wafer cassette may include scan completed, scan incomplete, scanning in progress, and scan error. Thus, when the control module receives partial scan information in the forward direction and / or partial scan information in the reverse direction from the scanning device, it can determine that the scanning status of the silicon wafer cassette is scanning in progress; when the control module receives all scan information in the forward direction and all scan information in the reverse direction from the scanning device, it can determine that the scanning status of the silicon wafer cassette is scan completed; when the control module does not receive scan information in the forward direction and does not receive scan information in the reverse direction from the scanning device, it can determine that the scanning status of the silicon wafer cassette is scan incomplete; when the control module receives scan error information in the forward direction and / or scan error information in the reverse direction from the scanning device, it can determine that the scanning status of the silicon wafer cassette is scan error.

[0128] S420. Display the current status image of the silicon wafer cassette based on its current scanning status.

[0129] Different scanning states of the silicon wafer cassette can correspond to different state images of the silicon wafer cassette. For example, the state images of the silicon wafer cassette corresponding to different scanning states can have different shape contours, different scanning indication images, and different slot state images.

[0130] In an optional embodiment, displaying the current state image of the silicon wafer cassette based on its current scanning state may specifically include: when it is determined that the silicon wafer cassette scan is successful based on its current scanning state, displaying a first state image of the silicon wafer cassette and performing the step of acquiring the current state data of each slot in the silicon wafer cassette; and when it is determined that the silicon wafer cassette scan is erroneous based on its current scanning state, displaying a second state image of the silicon wafer cassette.

[0131] The first state image includes a silicon wafer cassette with a first shape outline, a first scan indicator image located within the first shape outline, and state images of each slot; the second state image includes a silicon wafer cassette with a first shape outline, a second scan indicator image located within the first shape outline, and a state warning image; the color of the first scan indicator image is different from the color of the second scan indicator image.

[0132] Understandably, when controlling the scanning device to scan the silicon wafer cassette, it can first scan each slot in the wafer cassette along the forward direction of the first direction, and then scan each slot in the wafer cassette along the reverse direction of the first direction. If the state of the silicon wafer in each slot can be accurately obtained after scanning along both the forward and reverse directions of the first direction, then the scanning status of the silicon wafer cassette can be determined to be a successful scan; if the state of the silicon wafer in each slot cannot be accurately obtained, then the scanning status of the silicon wafer cassette can be determined to be a scanning error.

[0133] In one exemplary embodiment, reference is made to... Figure 7 In the first status image displayed after a successful scan of the silicon wafer cassette, the first shape outline can be any shape that matches the actual shape of the silicon wafer cassette. The specific design can be tailored to actual needs; for example, the first shape outline can be a rounded rectangle. The area within the first shape outline can be divided into a slot display area and a status indicator area located to one side of the slot display area. The first scan indicator image is located in the status indicator area. The first scan indicator image can include multiple indicator light images, including at least one scan indicator light image. When the scan status is "scan successful," the scan indicator light image can display a corresponding indicator color, such as green. A text image can also be placed to one side of the scan indicator light image to more intuitively and clearly express the current indicator status. For example, when the scan status is "scan successful," the green scan indicator light image can display the text "Useable." Accordingly, the slot display area includes multiple slot images arranged sequentially along the first direction. Based on the scanning status of the wafer cassette, it can be determined whether a silicon wafer exists in each slot, and the condition of the silicon wafer in slots where a wafer exists. Specifically, the silicon wafer in a slot can be a normal wafer or an abnormal wafer. Abnormal wafers can include thin wafers, thick wafers, stacked wafers, curved wafers, or wafers spanning multiple slots. Slot images of slots without wafers are not filled; they can be blank. Slot images of slots with wafers have a corresponding filled pattern based on the condition of the wafer in that slot. Thus, after a successful scan of the wafer cassette, a first-state image is displayed, allowing for a clear understanding of the current scanning status, facilitating subsequent process planning, and improving production efficiency.

[0134] In another exemplary embodiment, reference is made to... Figure 8In the second state image of a failed silicon wafer cassette scan, the first shape outline of the silicon wafer cassette can also be a rounded rectangle. This first shape outline area can also include a slot display area and a status indicator area located to one side of the slot display area. The second scan indicator image can be located within the status indicator area. The indicator color corresponding to the scan indicator light image in the second scan indicator image is different from the indicator color corresponding to the scan indicator light image in the first scan indicator image; for example, the indicator color corresponding to the scan indicator light image in the second scan indicator image can be red. The second scan indicator image can also include a text image located to one side of the scan indicator light image. This text image can be, for example, "Error," to intuitively express that the current scan status is a scan error. The slot display area can include multiple slot images arranged sequentially along the first direction. Each slot image is blank, with no fill. A status warning image is located within the slot display area and covers part of the slot image. The status warning image can be any image with a warning function; for example, the status warning image can be a red-filled triangle with a white exclamation mark inside, and the status warning image can flash at a certain frequency. Thus, the second-state image can be used to intuitively determine whether the current scanning status is a scanning error, making it easier for relevant personnel to find the cause of the error in a timely manner.

[0135] S430: Obtain the current status data of each slot in the silicon wafer cassette.

[0136] S440. Based on the current status data of each slot, determine the current status of the silicon wafer in each slot.

[0137] S450: Based on the current state of the silicon wafers in each slot, display the current state image of each slot in the silicon wafer box image on the same screen.

[0138] This embodiment controls the scanning device to scan each slot of the silicon wafer cassette, obtains the current scanning status of the silicon wafer cassette, and then displays the current status image of the silicon wafer cassette. It can intuitively display the scanning progress and abnormal situations through image information, so that users can quickly understand the scanning status of the silicon wafer cassette, discover scanning errors and other problems in a timely manner, and improve the production efficiency of semiconductor devices.

[0139] Example 5

[0140] Figure 9 This is a flowchart illustrating the silicon wafer state identification method in a silicon wafer cassette provided in Embodiment 5 of the present invention. This embodiment describes the method for determining the selected state of the silicon wafer cassette based on the above embodiments. Figure 9 As shown, the method for identifying the state of silicon wafers in the silicon wafer cassette includes:

[0141] S510: Obtain the current rotation state of the silicon wafer cassette.

[0142] Specifically, in semiconductor device manufacturing processes, silicon wafers are first placed in wafer cassettes, and then the wafer cassettes are placed on wafer cassette placement stages. When placing the wafer cassettes on the stage, the wafer pick-and-place ports of the wafer cassettes must face the conveyor mechanism to ensure accurate wafer pick-and-place. At this point, it is necessary to detect whether the wafer pick-and-place ports of the wafer cassettes are facing the conveyor mechanism. If the wafer pick-and-place ports are not facing the conveyor mechanism, the wafer cassettes need to be rotated until the wafer pick-and-place ports are facing the conveyor mechanism. During the period between placing the wafer cassettes on the stage and rotating the wafer pick-and-place ports to face the conveyor mechanism, appropriate sensors are needed to monitor the rotation status of the wafer cassettes in real time. Information can be collected using image acquisition sensors, image detection sensors, and in-situ detection sensors, and the collected signals can be used to determine the current rotation status of the wafer cassettes.

[0143] In an optional embodiment, the rotation state of the wafer cassette can include being rotated into position and not being rotated into position. Being rotated into position means that the wafer pick-and-place port of the wafer cassette faces the side of the conveying mechanism, allowing the conveying mechanism to smoothly remove wafers from and place them back into the wafer cassette. Being not rotated into position means that the wafer pick-and-place port of the wafer cassette does not face the side of the conveying mechanism, preventing the conveying mechanism from picking up or placing wafers.

[0144] S520. Display the current state image of the silicon wafer cassette based on the current rotation state.

[0145] Different rotation states of the silicon wafer cassette can correspond to different state images of the silicon wafer cassette. For example, the state images of the silicon wafer cassette corresponding to different rotation states can have different shape contours, different rotation indicator images, and different slot state images.

[0146] In an optional embodiment, the current state image of the silicon wafer cassette is displayed according to the current rotation state. Specifically, this may include: displaying a third state image of the silicon wafer cassette when it is determined that the silicon wafer cassette has rotated into place according to the current rotation state; and displaying a fourth state image of the silicon wafer cassette when it is determined that the silicon wafer cassette has not rotated into place according to the current rotation state.

[0147] The third state image includes a silicon wafer cassette with a second shape outline, a first rotation indicator image located within the second shape outline, and multiple slot images arranged along a first direction; the fourth state image includes a silicon wafer cassette with a third shape outline, a second rotation indicator image located within the third shape outline, and a status warning image; the color of the first rotation indicator image is different from the color of the second rotation indicator image.

[0148] In one exemplary embodiment, reference is made to... Figure 10When the silicon wafer cassette is determined to be in position based on its current rotation state, a third state image of the silicon wafer cassette is displayed. In this third state image, the second shape outline can be a right-angled rectangle. The area within the second shape outline can include a slot display area and a status indicator area located on one side of the slot display area. The status indicator area can display a first rotation indicator image, which can include a rotation indicator light image. The rotation indicator light image can display a corresponding indicator color to indicate that the current rotation state is in position; for example, the indicator color of the rotation indicator light image can be green. The slot display area displays multiple slot images arranged sequentially along a first direction. The shape of each slot image can be a right-angled rectangle, and all right-angled rectangles can have the same fill color; for example, all right-angled rectangles can be filled with blue.

[0149] In another exemplary embodiment, reference is made to... Figure 11 When the wafer cassette is determined not to be fully rotated based on the current rotation state, a fourth state image of the wafer cassette is displayed. In this fourth state image, the third shape outline of the wafer cassette can also be a rounded rectangle. The area of ​​this third shape outline can also include a slot display area and a status indicator area located to one side of the slot display area. The second rotation indicator image can be located within the status indicator area. The indicator color corresponding to the rotation indicator light image in the second rotation indicator image is different from the indicator color corresponding to the rotation indicator light image in the first rotation indicator image. For example, the indicator color corresponding to the scan indicator light image in the second rotation indicator image can be yellow. The second rotation indicator image can also include a text image located to one side of the rotation indicator light image. This text image can be, for example, "ready," to intuitively express that the current rotation state is not fully rotated. The slot display area can include multiple slot images arranged sequentially along the first direction. Each slot image is blank, with no fill. The status warning image is located within the slot display area and covers part of the slot image. The status warning image can be any image that serves as a warning or reminder. For example, the status warning image can be a red-filled triangle with a white exclamation mark inside, and this status warning image can flash at a certain frequency. In this way, through the fourth status image, it can be intuitively determined that the current rotation status is not yet in place, allowing relevant personnel to promptly control the silicon wafer cassette to continue rotating until it is in place.

[0150] Based on the above embodiments, optionally, before obtaining the current rotation state of the silicon wafer cassette, the method may further include: obtaining the placement state of the silicon wafer cassette on the silicon wafer cassette placement platform, i.e., whether a silicon wafer cassette is placed on the silicon wafer cassette placement platform. If no silicon wafer cassette is placed on the silicon wafer cassette placement platform, a state image of no silicon wafer cassette can be displayed. This state image of no silicon wafer cassette can include a first shape outline, and a cassette indication image and a cassette warning image located within the first shape outline. For example, as shown... Figure 12 As shown, the first shape outline can be a rounded rectangle. The area within the first shape outline can include a slot display area and a status indicator area located on one side of the slot display area. The status indicator area can display a box indicator image, which can include a box indicator light image, and the indicator color of the box indicator light image can be gray. The slot display area can display a box warning image, which can include any image that can serve as a warning reminder, such as a red-filled triangle with a white exclamation mark inside the triangle, and the box warning image can flash at a certain frequency. In this way, by viewing the status image of no silicon wafer box, it can be intuitively known that no silicon wafer box is placed on the silicon wafer box placement table, making it convenient for relevant personnel to know the placement status of the silicon wafer box in a timely manner.

[0151] In other embodiments, when a silicon wafer cassette is placed on the wafer cassette placement stage, a third or fourth state image can be displayed. This third or fourth state image may further include a cassette indicator image, which can include a cassette indicator light image. In this case, the indicator color of the cassette indicator light image can be green, and the size of the silicon wafer in each slot of the wafer cassette can also be displayed within the cassette indicator light image. For example, for a 4-inch silicon wafer, the cassette indicator light image can display the number 4. This allows for a direct visual indication of whether a silicon wafer cassette is placed on the wafer cassette placement stage, facilitating subsequent process operations.

[0152] S530. When controlling the scanning device to scan each slot of the silicon wafer cassette, obtain the current scanning status of the silicon wafer cassette.

[0153] S540. Based on the current scanning status of the silicon wafer cassette, display the current status image of the silicon wafer cassette.

[0154] S550: Obtain the current status data of each slot in the silicon wafer cassette.

[0155] S560. Based on the current status data of each slot, determine the current status of the silicon wafer in each slot.

[0156] S570. Based on the current state of the silicon wafers in each slot, display the current state image of each slot in the silicon wafer box image on the same screen.

[0157] This embodiment obtains the current rotation state of the silicon wafer cassette and then displays an image of the current state of the silicon wafer cassette. This allows for a clear understanding that the current rotation state is not yet in place, enabling relevant personnel to promptly control the silicon wafer cassette to continue rotating until it is in place, thereby improving the production efficiency of semiconductor devices.

[0158] Example 6

[0159] Figure 13This is a schematic diagram of a silicon wafer state identification device in a silicon wafer cassette according to Embodiment Six of the present invention. This device can determine the state of the silicon wafers in the wafer cassette. The device can be implemented by software and / or hardware and is generally integrated into a silicon wafer processing system. The wafer cassette includes multiple slots arranged sequentially along a first direction, and the slots are used to place silicon wafers. (Refer to...) Figure 13 The silicon wafer status identification device in the silicon wafer cassette includes:

[0160] The data acquisition module 610 is used to acquire the current status data of each slot in the silicon wafer box;

[0161] The status determination module 620 is used to determine the current status of the silicon wafer in each slot based on the current status data of each slot.

[0162] The image display module 630 is used to display the current status image of each slot in the silicon wafer box image on the same screen according to the current status of the silicon wafers in each slot.

[0163] Optionally, the state of the silicon wafer in the slot consists of at least three dimensions, each dimension including at least two state categories; the state image of the slot consists of at least image shape, image fill and image color; the image shapes corresponding to at least two state categories in at least one dimension are different, the image fills corresponding to at least two state categories in at least one dimension are different, and the image colors corresponding to at least two state categories in at least one dimension are different.

[0164] Optionally, the data acquisition module 610 may include an information acquisition unit and a data determination unit. The information acquisition unit is used to acquire the current silicon wafer scanning information and the current silicon wafer station information of each slot. The data determination unit is used to determine the current status data of each slot based on the current silicon wafer scanning information and the current silicon wafer station information of each slot.

[0165] Optionally, the data determination unit is specifically used to: determine the current silicon wafer data in each slot based on the current silicon wafer scanning information of each slot; determine the current transfer data and current exposure data of the silicon wafer in each slot based on the current silicon wafer station information of each slot; and determine the current status data of the slot based on the current silicon wafer data, current transfer data, and current exposure data of the same slot.

[0166] Optionally, the status data of the slot includes silicon wafer data, transfer data, exposure data, and at least one redundant data; wherein, the redundant data of each slot is the same; in the same status data, silicon wafer data, transfer data, exposure data and redundant data are all 4 bits of binary data.

[0167] Optionally, the state determination module 620 may include a state parsing unit, which is used to parse the current state data in each slot and determine the silicon wafer state, transfer state and exposure state of the silicon wafer in each slot respectively.

[0168] Optionally, each 4 bits of data in the current state data constitutes a data group; any two adjacent data groups constitute a computational data; the state parsing unit is specifically used to: determine the logical operation results of each computational data and preset data in the same current state data; wherein, the preset data is 8 bits of binary data; and determine the silicon wafer state, transfer state and exposure state of the silicon wafer in each slot according to the logical operation results.

[0169] Optionally, the silicon wafer status determination module in the silicon wafer box may further include: a scan status acquisition module, used to acquire the current scan status of the silicon wafer box when controlling the scanning device to scan each slot of the silicon wafer box; and a silicon wafer box display module, used to display the current status image of the silicon wafer box according to the current scan status of the silicon wafer box.

[0170] Optionally, the wafer cassette display module is further configured to: when the wafer cassette scan is successful based on its current scanning status, display a first state image of the wafer cassette and execute the step of acquiring the current state data of each slot in the wafer cassette; when the wafer cassette scan is incorrect based on its current scanning status, display a second state image of the wafer cassette; wherein the first state image includes a wafer cassette with a first shape outline, a first scan indication image located within the first shape outline, and state images of each slot; the second state image includes a wafer cassette with a first shape outline, a second scan indication image located within the first shape outline, and a status warning image; the color of the first scan indication image is different from the color of the second scan indication image.

[0171] Optionally, the silicon wafer state determination module in the silicon wafer box may further include: a rotation state acquisition module for acquiring the current rotation state of the silicon wafer box; and a silicon wafer box display module for displaying the current state image of the silicon wafer box based on the current rotation state.

[0172] Optionally, the wafer cassette display module is further configured to: display a third state image of the wafer cassette when the wafer cassette is determined to be in position based on the current rotation state; and display a fourth state image of the wafer cassette when the wafer cassette is determined not to be in position based on the current rotation state; wherein the third state image includes a wafer cassette with a second shape outline, a first rotation indicator image located within the second shape outline, and multiple slot images arranged along a first direction; the fourth state image includes a wafer cassette with a third shape outline, a second rotation indicator image located within the first shape outline, and a status warning image; the color of the first rotation indicator image is different from the color of the second rotation indicator image.

[0173] The silicon wafer state identification device in the silicon wafer cassette described above can execute the silicon wafer state identification method in the silicon wafer cassette provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the method. Technical details not described in detail in this embodiment can be found in the silicon wafer state identification method in the silicon wafer cassette provided in any embodiment of the present invention.

[0174] Since the silicon wafer state identification device in the wafer cassette described above is an apparatus capable of executing the silicon wafer state identification method in the wafer cassette of the present invention, those skilled in the art can understand the specific implementation and various variations of the silicon wafer state identification device in the wafer cassette of this embodiment based on the silicon wafer state identification method in the wafer cassette of the present invention. Therefore, how the silicon wafer state identification device in the wafer cassette implements the silicon wafer state identification method in the wafer cassette of the present invention will not be described in detail here. Any apparatus used by those skilled in the art to implement the silicon wafer state identification method in the wafer cassette of the present invention falls within the scope of protection of this application.

[0175] Example 7

[0176] This embodiment provides a silicon wafer processing system, comprising at least: a silicon wafer cassette, a conveying mechanism, multiple workpiece stages, and a control module; the silicon wafer cassette includes multiple slots arranged sequentially along a first direction, the slots being used to place silicon wafers; the conveying mechanism is used to control the transfer of silicon wafers within the slots between the workpiece stages; the control module is used to execute the silicon wafer state identification method in the silicon wafer cassette as described above. Therefore, the silicon wafer processing system provided in this embodiment can execute the silicon wafer state identification method in the silicon wafer cassette as described above, and can achieve the effect of the silicon wafer state identification method in the silicon wafer cassette of the above embodiment. Similarities can be found in the above description, and will not be repeated here.

[0177] Example 8

[0178] This embodiment provides a computer-readable storage medium storing computer instructions. The computer instructions are used to cause a processor to execute the silicon wafer state identification method in the silicon wafer cassette as described above. Therefore, it has the beneficial effects of the corresponding silicon wafer state identification method in the silicon wafer cassette. The similarities can be referred to the description above, and will not be repeated here.

[0179] This embodiment also provides a computer program product, which includes a computer program. When the computer program is executed by a processor, it implements the silicon wafer state identification method in the silicon wafer cassette according to any of the above-mentioned methods. Therefore, it has the beneficial effects of the corresponding silicon wafer state identification method in the silicon wafer cassette. The similarities can be referred to the description above, and will not be repeated here.

[0180] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for identifying the state of silicon wafers in a silicon wafer cassette, characterized in that, The silicon wafer cassette includes a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers. The method for identifying the state of silicon wafers in the silicon wafer cassette includes: Obtain the current status data of each slot in the silicon wafer cassette; Based on the current state data of each slot, determine the current state of the silicon wafer in each slot; Based on the current state of the silicon wafers in each slot, the current state images of each slot in the silicon wafer cassette image are displayed in the same frame.

2. The method for identifying the state of silicon wafers in a wafer cassette according to claim 1, characterized in that, The state of the silicon wafer in the slot consists of at least three dimensions, and each dimension includes at least two state categories. The state image of the slot is composed of at least image shape, image fill and image color; the image shapes corresponding to at least two state categories under at least one dimension are different, the image fills corresponding to at least two state categories under at least one dimension are different, and the image colors corresponding to at least two state categories under at least one dimension are different.

3. The method for identifying the state of silicon wafers in a wafer cassette according to claim 1, characterized in that, Obtaining the current status data of each slot in the silicon wafer cassette includes: Obtain the current silicon wafer scanning information and the current silicon wafer station information for each slot; Based on the current silicon wafer scanning information and the current silicon wafer station information of each slot, the current status data of each slot is determined respectively.

4. The method for identifying the state of silicon wafers in a wafer cassette according to claim 3, characterized in that, Based on the current silicon wafer scanning information and the current silicon wafer station information of each slot, the current status data of each slot is determined, including: Based on the current silicon wafer scanning information of each slot, the current silicon wafer data in each slot is determined respectively; Based on the current silicon wafer station information of each slot, determine the current transfer data and current exposure data of the silicon wafer in each slot. The current status data of the slot is determined based on the current silicon wafer data, the current transfer data, and the current exposure data for the same slot.

5. The method for identifying the state of silicon wafers in a wafer cassette according to claim 1, characterized in that, The status data of the slot includes silicon wafer data, transmission data, exposure data, and at least one redundant data; wherein the redundant data of each slot is the same. In the same state data, the silicon wafer data, the transmission data, the exposure data, and the redundant data are all 4-bit binary data.

6. The method for identifying the state of silicon wafers in a wafer cassette according to claim 5, characterized in that, Based on the current state data of each slot, the current state of the silicon wafer in each slot is determined, including: The current state data in each slot is analyzed to determine the silicon wafer state, transfer state, and exposure state of the silicon wafer in each slot.

7. The method for identifying the state of silicon wafers in a wafer cassette according to claim 6, characterized in that, In the current state data, each 4 bits of data constitute a data group; any two adjacent data groups constitute a set of computational data. The current state data within each slot is parsed to determine the wafer state, transfer state, and exposure state of the silicon wafer within each slot, including: The logical operation results of each of the calculated data and the preset data in the same current state data are determined respectively; wherein, the preset data is 8-bit binary data; Based on the results of the logical operation, the wafer state, transfer state, and exposure state of the silicon wafers in each slot are determined respectively.

8. The method for identifying the state of silicon wafers in a wafer cassette according to claim 1, characterized in that, Before acquiring the current status data of each slot in the silicon wafer cassette, the method further includes: When the scanning device is controlling the scanning device to scan each slot of the silicon wafer cassette, the current scanning status of the silicon wafer cassette is obtained; Based on the current scan status of the silicon wafer cassette, display the current status image of the silicon wafer cassette.

9. The method for identifying the state of silicon wafers in a wafer cassette according to claim 8, characterized in that, Based on the current scan state of the silicon wafer cassette, display the current state image of the silicon wafer cassette, including: When it is determined that the silicon wafer cassette has been successfully scanned based on its current scanning status, a first state image of the silicon wafer cassette is displayed, and the step of obtaining the current state data of each slot in the silicon wafer cassette is executed. When it is determined that the silicon wafer cassette is scanning incorrect based on its current scanning status, a second state image of the silicon wafer cassette is displayed. The first state image includes a silicon wafer cassette with a first shape outline, a first scan indication image located within the first shape outline, and state images of each slot. The second status image includes a silicon wafer cassette with the first shape outline, and a second scan indication image and a status warning image located within the first shape outline; The color of the first scan indication image is different from the color of the second scan indication image.

10. The method for identifying the state of silicon wafers in a wafer cassette according to claim 8, characterized in that, Before the scanning device scans each slot of the silicon wafer cassette, the procedure also includes: Obtain the current rotation state of the silicon wafer cassette; Based on the current rotation state, display the current state image of the silicon wafer cassette.

11. The method for identifying the state of silicon wafers in a wafer cassette according to claim 10, characterized in that, Based on the current rotation state, display the current state image of the silicon wafer cassette, including: When the silicon wafer cassette is determined to be rotated into position based on the current rotation state, a third state image of the silicon wafer cassette is displayed; When it is determined from the current rotation state that the silicon wafer cassette has not been rotated into position, a fourth state image of the silicon wafer cassette is displayed; The third state image includes a silicon wafer cassette with a second shape outline, a first rotation indicator image located within the second shape outline, and multiple slot images arranged along the first direction. The fourth state image includes a silicon wafer cassette with a third shape outline, as well as a second rotation indicator image and a state warning image located within the third shape outline; The color of the first rotation indicator image is different from the color of the second rotation indicator image.

12. A silicon wafer status identification device in a silicon wafer cassette, characterized in that, The silicon wafer cassette includes a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers. The silicon wafer status identification device in the silicon wafer cassette includes: The data acquisition module is used to acquire the current status data of each slot in the silicon wafer box; The status determination module is used to determine the current status of the silicon wafer in each slot based on the current status data of each slot. The image display module is used to display the current state image of each slot in the silicon wafer box image in the same screen according to the current state of the silicon wafer in each slot.

13. A silicon wafer processing system, characterized in that, At least including: Silicon wafer cassette, conveying mechanism, multiple workpiece stages, and control module; The silicon wafer cassette includes a plurality of slots arranged sequentially along a first direction, the slots being used to place silicon wafers; The conveying mechanism is used to control the transfer of the silicon wafers in the slots between the workpiece stages; The control module is used to execute the silicon wafer status identification method in the silicon wafer cassette according to any one of claims 1-11.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the silicon wafer state identification method in a silicon wafer cassette according to any one of claims 1-11.

15. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the silicon wafer state identification method in a silicon wafer cassette according to any one of claims 1-11.

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