4-inch Wafer automatic film forming equipment

Abstract

The invention discloses 4-inch Wafer automatic film forming equipment which comprises a frame used for installation and a full-automatic manipulator system located at the top of the frame. The mechanical claw is used for grabbing a 4-inch wafer; a film forming system and a drying system are arranged below the mechanical claw; and an air draft system consisting of an air draft valve and an air draft adjusting plate is arranged on the overflow box. According to the 4-inch Wafer automatic film forming equipment, the film forming uniformity and quality are improved, meanwhile, the production efficiency and the product yield are greatly improved, a water bath heating and ultrasonic auxiliary technology is adopted, it is ensured that film forming liquid medicine is evenly heated, bubbles are removed, and the film forming efficiency is greatly improved by combining precise rotation control and an efficient IPA soaking and nitrogen drying combined technology. The film forming and drying effects are optimized, the production period is shortened, the film forming damage and stripping phenomena are reduced, manual intervention is reduced, the operation stability and the production efficiency are improved, comprehensive automatic control is achieved, and the service life of liquid medicine is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of 4-inch wafer film forming technology, in particular to 4-inch wafer automatic film forming equipment. BACKGROUND

[0002] Wafer refers to a silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. After high-purity polysilicon is dissolved and added to a silicon crystal seed, a cylindrical single crystal silicon is slowly drawn, and after grinding, polishing and slicing, a silicon wafer, that is, a wafer, is formed. In the manufacturing process, wafer film forming technology is one of the key processes, which is used to form a uniform thin film on the wafer surface to achieve various functions such as insulation, conductivity or optical properties, such as: Publication No. CN109423625B discloses a film forming method and a film forming device. When a substrate is formed by using a gas containing an organic metal compound, the back surface of the substrate is prevented from being contaminated by metal. The following processes are implemented: a pre-coating process, a first gas containing silicon is supplied to a processing container in a state where a substrate (W) is not moved in, and the surface of the components in the processing container including a placement table for placing the substrate (W) is covered with a film made of silicon; a placement process, then the substrate (W) is placed on the placement table with its back surface in contact with the film made of silicon; and a film forming process, then a second gas containing an organic metal compound is supplied to the processing container, thereby forming a film made of metal constituting the organic metal compound on the substrate (W); The current wafer equipment still has some defects, such as the existing 4-inch wafer film forming technology is low in technicality, the film forming thickness is uneven, and it is not suitable for batch production, the film forming thickness is uncontrollable, and there is no parameter monitoring; Therefore, the present application provides 4-inch wafer automatic film forming equipment to solve the above problems. SUMMARY

[0003] The present application aims to provide 4-inch wafer automatic film forming equipment to solve the above problems in the background art, such as the existing 4-inch wafer film forming technology is low in technicality, the film forming thickness is uneven, and it is not suitable for batch production, the film forming thickness is uncontrollable, and there is no parameter monitoring.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: 4-inch wafer automatic film forming equipment, comprising a frame for installation, and a full-automatic mechanical hand system located at the top of the frame; Further comprising: The full-automatic mechanical arm system comprises a rotary motor, a rotary support, a lifting support, a lifting module, a horizontal module, a rotary stabilizing ring, a guide rail, a horizontal support and a drag chain, is used for realizing up-down movement, left-right movement and rotary movement of a mechanical claw, and the mechanical claw is used for grabbing a 4-inch wafer; The mechanical claw comprises a mechanical claw fixing ring, a mechanical claw palm plate, a mechanical finger, a wafer fixing nut, a mechanical arm and a mechanical hand slot cover. A film forming system and a drying system are arranged below the mechanical claw. An air extraction system composed of an air extraction valve and an air extraction adjusting plate is arranged on the overflow box.

[0005] As a preferred technical scheme of the present application, the film forming system comprises a film forming inner groove, a film forming outer groove, a heater, an ultrasonic vibration plate, an outer groove liquid inlet pipe, an automatic slot cover, an overflow box and a recovery barrel; The film forming inner groove is mounted on the upper end of the film forming outer groove through bolts, the heater is fixed on the film forming outer groove through a nut, the ultrasonic vibration plate is mounted in the film forming outer groove, the outer groove liquid inlet pipe is welded in the front side surface of the film forming outer groove in a penetrating manner, the automatic slot cover is arranged above the film forming outer groove, the ultrasonic vibration plate is connected with an ultrasonic wave generator, and the recovery barrel is arranged below the film forming outer groove. An overflow box is arranged on the inner wall of the film forming outer groove, for prompting to stop liquid feeding.

[0006] As a preferred technical scheme of the present application, the drying system comprises a drying slot discharge port, a drying slot and a nitrogen drying gas inlet pipe; The drying slot discharge port is located at the bottom of the drying slot, and the nitrogen drying gas inlet pipe is arranged at the upper end of the drying slot.

[0007] As a preferred technical scheme of the present application, the air extraction system comprises an air extraction valve, an air extraction channel and an air extraction adjusting plate; The air extraction valve is located at the top of the frame, the air extraction channel is arranged in close contact with the frame, and the upper end of the air extraction channel is in communication with the air extraction valve; The air extraction adjusting plate is mounted on the frame.

[0008] As a preferred technical scheme of the present application, the air extraction adjusting plate comprises a fixed plate, an adjusting frame and a pushing block; The adjusting frame is slidingly mounted on the fixed plate, and the fixed plate is integrally provided with the pushing block at the upper end; Strip-shaped hollow structures are equidistantly formed on the surface of the fixed plate, and the lower end of the adjusting frame is provided with a strip-shaped structure corresponding to the hollow structures.

[0009] As a preferred technical scheme of the present application, the rotary motor output end is connected with the mechanical arm through a shaft coupling; The horizontal support is fixedly installed in the interior of the frame by bolts, the horizontal module is fixed on the horizontal support by nuts, the lifting module is installed on the horizontal module, guide rails for supporting are arranged below the lifting module, the drag chain is located at the side of the horizontal module, and lifting supports are installed on the lower surface of the lifting module; A rotating support is installed on the lifting module by bolts, and a rotating motor is fixed on the rotating support; The lower end of the lifting support is provided with a rotating stabilizing ring for penetrating the mechanical arm.

[0010] As a preferred technical scheme of the present application, the mechanical claw fixing ring is installed at the lower end of the mechanical arm by bolts; The mechanical claw fixing ring is fixed on the upper surface of the mechanical claw palm plate by bolts, mechanical fingers are arranged at equal angles on the lower surface of the mechanical claw palm plate, wafer fixing nuts are threadedly installed at the lower ends of the mechanical fingers; The mechanical hand groove cover is located on the mechanical arm.

[0011] As a preferred technical scheme of the present application, a daylight lamp installed on the frame is arranged above the automatic groove cover.

[0012] As a preferred technical scheme of the present application, the material of the film forming inner groove is quartz, and the material of the film forming outer groove is PP.

[0013] As a preferred technical scheme of the present application, a control panel for operation is arranged on the exterior of the frame, and a front maintenance door is installed on the bottom of the frame.

[0014] Compared with the prior art, the 4-inch wafer automatic film forming equipment improves the uniformity and quality of film forming, greatly improves the production efficiency and the yield of products, adopts water bath heating and ultrasonic auxiliary technology to ensure that the film forming liquid is uniformly heated and bubbles are removed, combines precise rotation control and efficient IPA soaking and nitrogen drying combination technology to further optimize the film forming and drying effect, shortens the production cycle, reduces film forming damage and peeling phenomenon, reduces manual intervention, improves operation stability and production efficiency, realizes overall automatic control, keeps the equipment clean, prolongs the service life of the liquid medicine, and reduces the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a side view structure schematic diagram of the present application; Figure 2 It is a front view structure schematic diagram of the present application; Figure 3 It is a full-automatic mechanical hand system structure schematic diagram of the present application; Figure 4This is a schematic diagram of the connection structure between the horizontal module and the horizontal support of the present invention; Figure 5 This is a schematic diagram of the mechanical claw structure of the present invention; Figure 6 This is a bottom view schematic diagram of the connection between the 4-inch wafer and the wafer fixing nut of the present invention; Figure 7 This is a schematic diagram of the film-forming system of the present invention; Figure 8 This is a schematic diagram of the drying system structure of the present invention; Figure 9 This is a top view of the overflow box structure of the present invention; Figure 10 This is a schematic diagram of the drying system structure of the present invention; Figure 11 These are the parameters of the film-forming system of the present invention; Figure 12 These are the parameters of the drying system of the present invention; Figure 13 This is a diagram showing the location of the uniformity measurement points in this invention.

[0016] In the diagram: 1. Rotary motor; 2. Rotary motor rotating bracket; 3. Lifting bracket; 4. Lifting module; 5. Horizontal module; 6. Rotary stabilizing ring; 7. Guide rail; 8. Horizontal bracket; 9. Cable chain; 10. Mechanical claw fixing ring; 11. Mechanical claw palm plate; 12. Mechanical finger; 13. Wafer fixing nut; 14. 4-inch wafer; 15. Robotic arm; 16. Inner film-forming tank; 17. Outer film-forming tank; 18. Heater; 19. Drying tank discharge port; 20. 2801. Ultrasonic vibrating plate; 2802. External tank liquid inlet pipe; 2803. Drying tank; 2804. Nitrogen drying air inlet pipe; 2805. Exhaust valve; 2806. Ultrasonic generator; 2807. Exhaust duct; 2808. Control panel; 2809. Exhaust adjustment plate; 28000. Fixing plate; 28000. Adjustment frame; 28000. Toggle block; 28001. Front maintenance door; 3800. Fluorescent lamp; 38000. Robotic arm tank cover; 38000. Automatic tank cover; 3801. Overflow box; 3802. Frame; 3803. Recycling bin. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1-13 The present invention provides a technical solution: a 4-inch wafer automatic film forming device. like Figure 7 and Figure 8As shown, the film-forming system includes an inner film-forming tank 16, an outer film-forming tank 17, a heater 18, an ultrasonic vibrating plate 20, an outer tank inlet pipe 21, an automatic tank cover 32, an overflow box 33, and a recovery tank 35. The inner film-forming tank 16 is bolted to the upper end of the outer film-forming tank 17. The heater 18 is fixed to the outer film-forming tank 17 with nuts. An ultrasonic vibrating plate 20 is installed inside the outer film-forming tank 17. The outer tank inlet pipe 21 is welded through to the front surface of the outer film-forming tank 17. An automatic tank cover 32 is provided above the outer film-forming tank 17. The ultrasonic vibrating plate 20 is connected to the ultrasonic generator 25. A recovery tank 35 is provided below the outer film-forming tank 17. An overflow box 33 is provided on the inner wall of the film-forming outer tank 17 to indicate when to stop liquid feeding; By adopting the above technical solution, the film-forming system can achieve uniform heating and stable distribution of the film-forming liquid. The material selection of the inner film-forming tank 16 and the outer film-forming tank 17, as well as the installation of the heater 18 and the ultrasonic vibration plate 20, ensure the uniformity of temperature and ultrasound during the film-forming process, thereby improving the uniformity and quality of film formation. At the same time, the frame 34 on the inner wall can effectively indicate the stop of liquid feeding, prevent the liquid from overflowing, and ensure the stability of the film-forming process.

[0019] like Figure 8 As shown, the drying system includes a drying tank outlet 19, a drying tank 22, and a nitrogen drying inlet pipe 23; The drying tank discharge port 19 is located at the bottom of the drying tank 22, and the upper end of the drying tank 22 is provided with a nitrogen drying inlet pipe 23. By adopting the above technical solution, the drying system achieves a highly efficient drying process through a reasonable structural layout. The combination of the drying tank discharge port 19 and the drying tank 22, as well as the setting of the nitrogen drying inlet pipe 23, enables the drying process to be carried out quickly and evenly, avoiding film damage and peeling, and improving the product yield.

[0020] like Figure 1 and Figure 2 As shown, the ventilation system includes a ventilation valve 24, a ventilation duct 26, and a ventilation regulating plate 28; The exhaust valve 24 is located at the top of the frame 34, the exhaust duct 26 is fitted to the frame 34, and the upper end of the exhaust duct 26 is connected to the exhaust valve 24. The ventilation regulating plate 28 is mounted on the frame 34; By adopting the above technical solution, the exhaust system can effectively remove exhaust gases and volatile substances generated during equipment operation, maintaining a clean and stable internal environment. Through the coordinated action of the exhaust valve 24, exhaust duct 26, and exhaust regulating plate 28, precise control of the exhaust volume is achieved, further improving the safety and reliability of the equipment.

[0021] likeFigure 10 As shown, the exhaust regulating plate 28 includes a fixed plate 2801, an adjusting bracket 2802, and a toggle block 2803; The adjusting frame 2802 is slidably mounted on the fixed plate 2801, and the upper end of the fixed plate 2801 is integrally provided with a toggle block 2803; The surface of the fixing plate 2801 is provided with strip-shaped hollow structures at equal intervals, and the lower end of the adjustment frame 2802 is a strip-shaped structure corresponding to the hollow structure. By adopting the above technical solution, the adjustable structure of the exhaust regulating plate 28 makes the exhaust adjustment more flexible and precise. Through the cooperation of the sliding regulating frame 2802 and the strip-shaped hollow structure, the exhaust volume can be adjusted according to actual needs, further optimizing the operating environment of the equipment and improving the stability and service life of the equipment.

[0022] Such as 1 and Figure 3 As shown, the output end of the rotary motor 1 is connected to the robotic arm 15 via a coupling; The horizontal support 8 is fixedly installed inside the frame 34 by bolts. The horizontal module 5 is fixed to the horizontal support 8 by nuts. The lifting module 4 is installed on the horizontal module 5. The guide rail 7 that provides support is provided below the lifting module 4. The drag chain 9 is located on the side of the horizontal module 5. The lifting support 3 is installed on the lower surface of the lifting module 4. A rotating bracket 2 is bolted onto the lifting module 4, and a rotating motor 1 is fixed on the rotating bracket 2. The lower end of the lifting support 3 is provided with a rotational stabilizing ring 6 for passing through the robotic arm 15; By adopting the above technical solution, efficient and stable transfer of wafers between various systems is achieved. Through the coordinated work of components such as rotary motor 1, rotary support 2, and lifting module 4, the precise movement and operational stability of the robot are ensured, thereby improving production efficiency and product quality.

[0023] like Figure 5 As shown, the mechanical claw retaining ring 10 is installed on the lower end of the robotic arm 15 by bolts; The mechanical claw retaining ring 10 is fixed to the upper surface of the mechanical claw palm plate 11 by bolts. Mechanical fingers 12 are provided at equal angles on the lower surface of the mechanical claw palm plate 11. A wafer fixing nut 13 is threaded onto the lower end of the mechanical fingers 12. The robotic arm slot cover 31 is located on the robotic arm 15; The above technical solution can firmly fix and support 4-inch wafers. Through the cooperation of mechanical claw fixing ring 10, mechanical claw palm plate 11 and mechanical fingers 12, as well as the use of wafer fixing nut 13, the stability of the wafer during film formation and drying is ensured, avoiding wafer shaking and damage, and improving the uniformity and quality of film formation.

[0024] like Figure 1As shown, a fluorescent lamp 30 mounted on a frame 34 is provided above the automatic slot cover 32; By adopting the above technical solution, the automatic tank cover 32 can close the tank when not in operation, preventing the liquid from being contaminated and volatilized. This not only extends the service life of the liquid but also reduces environmental pollution and improves the safety and environmental friendliness of the equipment.

[0025] The inner film-forming groove 16 is made of quartz steel, and the outer film-forming groove 17 is made of PP material. Using the above technical solution, the inner film-forming tank 16 is made of quartz steel, which has good high temperature resistance and chemical stability, and can ensure uniform heating and stable distribution of the film-forming liquid. The outer film-forming tank 17 is made of PP material, which has good corrosion resistance and lightweight characteristics, further improving the stability and service life of the equipment.

[0026] like Figure 2 As shown, a control panel 27 for operation is provided on the outside of the frame 34, and a front maintenance door 29 is installed at the bottom of the frame 34. By adopting the above technical solution, operators can easily operate and monitor the equipment, thereby improving the automation level and ease of operation of the equipment.

[0027] First, turn on the heater 18 in advance and pour the film-forming solution into the film-forming inner tank 16 to heat the temperature of the film-forming inner tank 16 to 50°C, ensuring that the film-forming solution is heated evenly. Then, inject water into the interior of the film-forming outer tank 17 through the outer tank inlet pipe 21 until it reaches the position of the frame 34, and then stop the injection. The 4-inch wafer 14 is fixed below the mechanical finger 12 by the wafer fixing nut 13 to ensure that the wafer is horizontal and has minimal contact with the mechanical claw, so as to avoid affecting the film thickness. The horizontal module 5 controls the horizontal direction of the 4-inch wafer 14, while the vertical module 4 controls its vertical direction. Through their combined operation, the 4-inch wafer 14 is moved above the film deposition system, ensuring it is directly above the film deposition tank 16. The ultrasonic generator 25 is then activated, causing the ultrasonic transducer 20 to operate, emitting ultrasonic waves at a frequency of 80kHz to eliminate air bubbles in the film deposition solution and prevent pitting in the film. The vertical module 4 ensures the 4-inch wafer 14 is stably fed into the deposition system. The wafer 14 is placed in the film-forming tank 16, ensuring that it is completely immersed in the film-forming solution. The rotary motor 1 is turned on to make the 4-inch wafer 14 rotate at a speed of 200 r / min. After rotating for 30 seconds, the rotation is stopped. Then, the 4-inch wafer 14 is slowly lifted out by the lifting module 4 to ensure that the film-forming solution on the wafer surface is evenly distributed. When the 4-inch wafer 14 is lowered to 16, the opening is covered by the robotic arm tank cover 31 to prevent the solution from splashing out. At the same time, when not in use, the automatic tank cover 32 will also cover the opening to prevent solution contamination. Then, the 4-inch wafer 14 is moved to the drying system via the horizontal module 5. With the lifting module 4, the 4-inch wafer 14 is positioned in the center of the drying tank 22. The drying tank outlet 19 is opened, allowing IPA liquid to enter the drying tank 22 through the outlet 19 and soak over the mechanical gripper for 60 seconds. During the soaking process, ensure that the IPA liquid completely covers the wafer surface to remove any residual moisture that may have remained during the film formation process. The IPA liquid is then drained from the outlet 19 to ensure that there is no residue in the drying tank 22. Then, hot nitrogen is introduced into the drying tank 22 through the nitrogen drying inlet pipe 23 to maintain the temperature at 50°C. Then, the rotary motor 1 is turned on to rotate the 4-inch wafer 14 at a speed of 400 r / min for 30 seconds before stopping. During the rotation, the nitrogen passes through the wafer surface and removes moisture, ensuring that the drying process is efficient and without damage. Finally, the 4-inch wafer 14 is removed by lifting module 4 and horizontal module 5, the wafer fixing nut 13 is unscrewed, the 4-inch wafer 14 is removed, and then other instruments are used for measurement, such as the uniformity measurement point location diagram. The peeling phenomenon can be observed by visually inspecting the state of the film, and the drying state can be observed by observing whether there are water droplets on the surface. The formula for measuring COV is as follows:

[0028] in ,

[0029] This is how to use the 4-inch wafer automatic film forming equipment.

[0030] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

A 1.4-inch wafer automatic film forming device, including a frame (34) for mounting and a fully automatic robotic arm system located on top of the frame; Its features are: Also includes: The fully automatic robotic arm system includes a rotary motor (1), a rotary support (2), a lifting support (3), a lifting module (4), a horizontal module (5), a rotary stabilizing ring (6), a guide rail (7), a horizontal support (8), and a drag chain (9). The fully automatic robotic arm system is used to realize the up-and-down movement, left-and-right movement, and rotational movement of the robotic claw. The robotic claw is used to grip a 4-inch wafer (14). The mechanical claw includes a mechanical claw fixing ring (10), a mechanical claw palm plate (11), a mechanical finger (12), a wafer fixing nut (13), a mechanical arm (15), and a mechanical hand slot cover (31). A film-forming system and a drying system are provided below the mechanical claw; The overflow box (33) is equipped with an exhaust system consisting of an exhaust valve (24) and an exhaust regulating plate (28).

2. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The film-forming system includes an inner film-forming tank (16), an outer film-forming tank (17), a heater (18), an ultrasonic vibrating plate (20), an outer tank inlet pipe (21), an automatic tank cover (32), an overflow box (33), and a recovery tank (35). The inner film-forming tank (16) is bolted to the upper end of the outer film-forming tank (17), the heater (18) is fixed to the outer film-forming tank (17) with a nut, an ultrasonic vibrating plate (20) is installed inside the outer film-forming tank (17), the outer tank inlet pipe (21) is welded through to the front surface of the outer film-forming tank (17), an automatic tank cover (32) is provided above the outer film-forming tank (17), the ultrasonic vibrating plate (20) is connected to the ultrasonic generator (25), and a recycling tank (35) is provided below the outer film-forming tank (17). An overflow box (33) is provided on the inner wall of the film-forming outer tank (17) to indicate when to stop liquid feeding.

3. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The drying system includes a drying tank outlet (19), a drying tank (22), and a nitrogen drying inlet pipe (23). The drying tank outlet (19) is located at the bottom of the drying tank (22), and the upper end of the drying tank (22) is provided with a nitrogen drying inlet pipe (23).

4. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The ventilation system includes a ventilation valve (24), a ventilation duct (26), and a ventilation regulating plate (28). The exhaust valve (24) is located at the top of the frame (34), the exhaust duct (26) is fitted to the frame (34), and the upper end of the exhaust duct (26) is connected to the exhaust valve (24). The ventilation regulating plate (28) is mounted on the frame (34).

5. The 4-inch wafer automatic film forming equipment according to claim 4, characterized in that: The exhaust regulating plate (28) includes a fixed plate (2801), an adjusting bracket (2802), and a toggle block (2803); The adjusting frame (2802) is slidably mounted on the fixed plate (2801), and the upper end of the fixed plate (2801) is integrally provided with a toggle block (2803). The surface of the fixing plate (2801) is provided with strip-shaped hollow structures at equal intervals, and the lower end of the adjusting frame (2802) is a strip-shaped structure corresponding to the hollow structure.

6. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The output end of the rotary motor (1) is connected to the robotic arm (15) via a coupling; The horizontal support (8) is fixedly installed inside the frame (34) by bolts. The horizontal module (5) is fixed on the horizontal support (8) by nuts. The horizontal module (5) is equipped with a lifting module (4). A guide rail (7) is provided below the lifting module (4) to provide support. The drag chain (9) is located on the side of the horizontal module (5). The lifting support (3) is installed on the lower surface of the lifting module (4). A rotating bracket (2) is installed on the lifting module (4) by bolts, and a rotating motor (1) is fixed on the rotating bracket (2). The lower end of the lifting bracket (3) is provided with a rotational stabilizing ring (6) for passing through the robotic arm (15).

7. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The mechanical claw retaining ring (10) is bolted to the lower end of the mechanical arm (15); The mechanical claw fixing ring (10) is fixed to the upper surface of the mechanical claw palm plate (11) by bolts. The mechanical claw palm plate (11) is provided with mechanical fingers (12) at equal angles on the lower surface. The lower end of the mechanical fingers (12) is threaded with a wafer fixing nut (13). The robotic arm slot cover (31) is located on the robotic arm (15).

8. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: A fluorescent lamp (30) mounted on a frame (34) is provided above the automatic slot cover (32).

9. The 4-inch wafer automatic film forming equipment according to claim 2, characterized in that: The inner film-forming groove (16) is made of quartz steel, and the outer film-forming groove (17) is made of PP material.

10. The 4-inch wafer automatic film forming equipment according to claim 1, characterized in that: The frame (34) is provided with a control panel (27) for operation on the outside, and a front maintenance door (29) is provided at the bottom of the frame (34).

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