Compact wafer linear carrying mechanism

Abstract

The compact type wafer linear carrying mechanism comprises a rotating platform, the bottom of the rotating platform is connected with a rotating motor, the upper end of the rotating platform is connected with a first rotating arm, and one end in the first rotating arm is connected with a first rotating joint assembly in driving connection with the rotating motor; the other end in the first rotating arm is connected with a second rotating joint assembly, the second rotating joint assembly and the first rotating joint assembly are synchronously connected through a first synchronous belt, the first rotating arm is provided with a second rotating arm driven by the second rotating joint assembly to rotate, and the second rotating arm is internally connected with a third rotating joint assembly. The third rotating joint assembly and the second rotating joint assembly are synchronously connected through a second synchronous belt, and the second rotating arm is provided with a vacuum adsorption finger driven by the third rotating joint assembly to rotate. A synchronous belt and synchronous wheel structure is used, miniaturization of the linear carrying mechanism is achieved, and the linear carrying mechanism can be applied to a narrow space.

Description

Technical Field

[0001] This invention relates to a compact wafer linear transport mechanism. Background Technology

[0002] Currently, common wafer handling methods can be broadly categorized into two types: wafer handling robots and linear handling modules. The former offers more comprehensive functionality, typically possessing 3-4 motion axes and capable of high-speed movement in the XZΘ directions, hence its consistently high price. The latter, linear handling mechanisms, are lead screw or synchronous belt linear modules. Due to the presence of indispensable components such as head and tail support units, sliders, transmission mechanisms, and power sources, the overall module's length is significantly greater than the required stroke. For example, a handling module with a stroke of 400mm has a total length of approximately 600mm. If a pick-and-place suction component is installed, and considering the distance the component needs to extend into the material tray during pick-and-place, the overall required installation space will further increase. The disadvantage is its large space occupation, making it difficult to apply to compact equipment.

[0003] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a new type of compact wafer linear transport mechanism with greater industrial application value. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to provide a compact wafer linear transport mechanism.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A compact wafer linear transport mechanism includes a rotating platform. A rotary motor is connected to the bottom of the rotating platform, and a first rotating arm is connected to the upper end of the rotating platform. One end of the first rotating arm is connected to a first rotating joint assembly driven by the rotary motor, and the other end of the first rotating arm is connected to a second rotating joint assembly. The second rotating joint assembly and the first rotating joint assembly are synchronously connected via a first synchronous belt. A second rotating arm, driven to rotate by the second rotating joint assembly, is mounted on the first rotating arm. A third rotating joint assembly is connected to the second rotating arm opposite to the second rotating joint assembly, and the third rotating joint assembly and the second rotating joint assembly are synchronously connected via a second synchronous belt. A vacuum suction finger, driven to rotate by the third rotating joint assembly, is mounted on the second rotating arm.

[0007] Preferably, in the compact wafer linear transport mechanism, a first tensioning component for tensioning a first synchronous belt is connected inside the first rotating arm, and a second tensioning component for tensioning a second synchronous belt is connected inside the second rotating arm.

[0008] Preferably, in the compact wafer linear transport mechanism, the first tensioning component and the second tensioning component have the same structure.

[0009] The second tensioning assembly includes a left tensioning member and a right tensioning member with the same structure. The left tensioning member includes a tensioning frame. Both ends of the tensioning frame are connected to tensioning wheels via rotating shafts. The tensioning frame has adjustment and fixing holes. The adjustment and fixing holes are used to connect the tensioning frame to the corresponding rotating arm via fixing bolts.

[0010] Preferably, in the compact wafer linear transport mechanism, the second rotary joint assembly includes a fixed shaft frame connected within a first rotary arm. A bearing housing is connected to the fixed shaft frame, and a cross-bearing ball bearing is connected within the bearing housing. A rotating shaft passes through the cross-bearing ball bearing. A vertical fixed shaft is connected to the fixed shaft, which passes through the rotating shaft. A lower synchronous pulley is connected to the lower end of the rotating shaft. The rotating shaft is connected to the second rotary arm via a connecting disc synchronously connected to the rotating shaft. The upper ends of the rotating shaft and the fixed shaft extend into the second rotary arm, and an upper synchronous pulley is connected to the upper end of the rotating shaft.

[0011] Preferably, in the compact wafer linear transport mechanism, a sensor is connected to the rotating platform, and a sensing plate that cooperates with the sensor is connected to the bottom of the first rotating arm.

[0012] Preferably, in the compact wafer linear transport mechanism, at least two sensors are provided, which are located at different positions on the rotating platform and are in contact with the sensing sheet.

[0013] Preferably, in the compact wafer linear transport mechanism, the vacuum adsorption finger is connected to the third rotary joint assembly via a finger extension arm.

[0014] Preferably, in the compact wafer linear transport mechanism, the first rotary joint assembly includes a first synchronous wheel and a rotary connecting seat. The rotary motor's drive shaft is connected to the rotary connecting seat, which rotates synchronously with it. The rotary connecting seat is connected to a first rotary arm, which rotates synchronously with it. The upper end of the rotary motor's drive shaft extends into the first rotary arm and is connected to the first synchronous wheel. The first synchronous wheel is synchronously connected to the lower synchronous wheel via a first synchronous belt.

[0015] Preferably, in the compact wafer linear transport mechanism, the third rotary joint assembly includes a bearing fixing shaft connected to a second rotary arm. A second synchronous pulley is connected to the bearing fixing shaft via a bearing. The second synchronous pulley is synchronously connected to the upper synchronous pulley via a second synchronous belt. The second synchronous pulley is connected to a vacuum adsorption finger via a bearing outer pressure plate.

[0016] By means of the above-described solution, the present invention has at least the following advantages:

[0017] This invention employs a robotic arm-like mechanism, using synchronous belts and pulleys as power transmission components to achieve linear movement in one direction. Simultaneously, multiple synchronous pulleys of varying diameters are used at different joints to precisely control the reduction ratio, ensuring the fingers always move in a straight line. Compared to lead screws or synchronous belt linear modules, this structure requires approximately 25% less installation space in the length direction, providing a solution for use in confined spaces.

[0018] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the first rotary joint assembly of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the second rotary joint assembly of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure after the present invention has been rotated. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] Example

[0028] like Figure 1 and Figure 2 As shown, a compact wafer linear transport mechanism includes a rotating platform 1. A rotating motor 2 is connected to the bottom of the rotating platform 1, and a first rotating arm 3 is connected to the upper end of the rotating platform 1. A first rotating joint assembly 7, which is driven and connected to the rotating motor 2, is connected to one end of the first rotating arm 3, and a second rotating joint assembly 8 is connected to the other end of the first rotating arm 3. The second rotating joint assembly 8 and the first rotating joint assembly 7 are synchronously connected via a first synchronous belt 12. A second rotating arm 4, which is driven to rotate by the second rotating joint assembly 8, is mounted on the first rotating arm 3. A third rotating joint assembly 10 is connected to the second rotating arm 4, which is opposite to the second rotating joint assembly 8, and is synchronously connected to the second rotating joint assembly 8 via a second synchronous belt 11. A vacuum suction finger 6, which is driven to rotate by the third rotating joint assembly 10, is mounted on the second rotating arm 4.

[0029] In this embodiment, the tensioning assembly can be used to tension the timing belt, thereby ensuring the normal operation of the rotating arm. The first rotating arm 3 is connected to a first tensioning assembly 13 for tensioning the first timing belt, and the second rotating arm 4 is connected to a second tensioning assembly 9 for tensioning the second timing belt.

[0030] Meanwhile, the first tensioning assembly 13 and the second tensioning assembly 9 have the same structure. The second tensioning assembly 9 includes a left tensioning member 91 and a right tensioning member 92 with the same structure. The left tensioning member 91 includes a tensioning frame 93. Both ends of the tensioning frame 93 are connected to tensioning wheels 94 via rotating shafts. The tensioning frame 93 has adjustment and fixing holes 95. The adjustment and fixing holes 95 are used to connect the tensioning frame to the corresponding rotating arm via fixing bolts.

[0031] In an embodiment, such as Figure 3As shown, the second rotary joint assembly 8 includes a fixed shaft frame 81, which is connected to the first rotary arm. A bearing seat 82 is connected to the fixed shaft frame 81, and a cross ball bearing 83 is connected inside the bearing seat 82. A rotating shaft 84 passes through the cross ball bearing 83. A vertical fixed shaft 85 is connected to the fixed shaft 81 and passes through the rotating shaft. A lower synchronous pulley 86 is connected to the lower end of the rotating shaft 84. The rotating shaft 84 is connected to the second rotary arm 4 through a connecting disc that is synchronously connected to the rotating shaft. The upper ends of the rotating shaft and the fixed shaft extend into the second rotary arm, and an upper synchronous pulley 87 is connected to the upper end of the rotating shaft.

[0032] In the aforementioned second rotary joint assembly, the connecting plate on the rotating shaft is an integral structure, improving its synchronization and robustness. Simultaneously, upper and lower bearing pressure plates are connected to the bearing housing, further enhancing its stability.

[0033] In this embodiment, a sensor 14 is connected to the rotating platform 1, and a sensing plate 15, which engages with the sensor 14, is connected to the bottom of the first rotating arm 3. The position of the first rotating arm can be sensed by the sensor (Omron EE-SX674) and the sensing plate. At least two sensors 2 are provided, located at different positions on the rotating platform and each engaging with the sensing plate. High precision is achieved by using sensors at different positions. The placement of the sensors is prior art known to those skilled in the art and is determined according to requirements, and will not be elaborated further.

[0034] In this embodiment, the vacuum-adsorbed finger 6 is connected to the third rotary joint assembly 10 via the finger extension arm 5.

[0035] In an embodiment, the first rotary joint assembly 7 includes a first synchronous wheel 701 and a rotary connecting seat 702. The rotary motor 2 has a drive shaft connected to the rotary connecting seat 702, which rotates synchronously with it. The rotary connecting seat 702 has a first rotary arm 3, which rotates synchronously with it. The upper end of the drive shaft of the rotary motor extends into the first rotary arm and is connected to the first synchronous wheel 701. The first synchronous wheel is synchronously connected to the lower synchronous wheel through a first synchronous belt.

[0036] In an embodiment, such as Figure 4 As shown, the third rotary joint assembly 10 includes a bearing fixing shaft 101, which is connected to the second rotary arm. A second synchronous pulley 102 is connected to the bearing fixing shaft 101 via a bearing. The second synchronous pulley 102 is synchronously connected to the upper synchronous pulley via a second synchronous belt. The second synchronous pulley 102 is connected to the vacuum suction finger 6 via a bearing outer pressure plate 103.

[0037] This invention uses multiple synchronous pulleys of different diameters at different rotary joint components to achieve precise control of the reduction ratio, thereby realizing linear motion. The selection of synchronous pulleys of different diameters is prior art known to those skilled in the art and will not be elaborated further.

[0038] The working principle of this invention is as follows:

[0039] In operation, the drive shaft of the rotary motor drives the rotary connecting seat in the first rotary joint assembly, causing the first rotary arm to rotate. Simultaneously, the first synchronous pulley in the first rotary joint assembly also rotates under the drive shaft, causing the first synchronous belt to drive the rotation of the second rotary joint assembly. The rotation of the second rotary joint assembly then drives the second rotary arm to rotate, and the upper synchronous pulley inside the second rotary arm also rotates synchronously. The rotation of the upper synchronous pulley drives the rotation of the third rotary joint assembly via the second synchronous belt. The rotation of the third rotary joint assembly then drives the rotation of the vacuum-adsorbed finger. Driven by synchronous pulleys of different diameters, and under the control of the back-end control system (PLC), the rotational speed of the rotary arm is controlled by the synchronous pulleys of different diameters and the synchronous belt, thereby achieving linear motion of the first rotary arm, the second rotary arm, and the vacuum-adsorbed finger. Figure 5 As shown.

[0040] This invention employs a robotic arm-like mechanism, using synchronous belts and pulleys as power transmission components to achieve linear movement in one direction. Simultaneously, multiple synchronous pulleys of varying diameters are used at different joints to precisely control the reduction ratio, ensuring the fingers always move in a straight line. Compared to lead screws or synchronous belt linear modules, this structure requires approximately 25% less installation space in the length direction, providing a solution for use in confined spaces.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0044] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A compact wafer linear transfer mechanism, characterized by: The system includes a rotating platform (1), a rotating motor (2) connected to the bottom of the rotating platform (1), a first rotating arm (3) connected to the upper end of the rotating platform (1), a first rotating joint assembly (7) connected to the rotating motor (2) at one end of the first rotating arm (3), a second rotating joint assembly (8) connected to the other end of the first rotating arm (3), the second rotating joint assembly (8) and the first rotating joint assembly (7) being synchronously connected via a first synchronous belt (12), a second rotating arm (4) driven to rotate by the second rotating joint assembly (8) mounted on the first rotating arm (3), a third rotating joint assembly (10) connected to the second rotating arm (4) opposite to the second rotating joint assembly (8), the third rotating joint assembly (10) and the second rotating joint assembly (8) being synchronously connected via a second synchronous belt (11), and a vacuum suction finger (6) driven to rotate by the third rotating joint assembly (10) mounted on the second rotating arm (4).

2. The compact wafer linear transport mechanism of claim 1, wherein: The first rotating arm (3) is internally connected to a first tensioning assembly (13) for tensioning the first synchronous belt, and the second rotating arm (4) is internally connected to a second tensioning assembly (9) for tensioning the second synchronous belt.

3. The compact wafer linear transport mechanism of claim 2, wherein: The first tensioning component (13) and the second tensioning component (9) have the same structure. The second tensioning assembly (9) includes a left tensioning member (91) and a right tensioning member (92) with the same structure. The left tensioning member (91) includes a tensioning frame (93). Both ends of the tensioning frame (93) are connected to tensioning wheels (94) via rotating shafts. The tensioning frame (93) is provided with adjustment and fixing holes (95). The adjustment and fixing holes (95) are used to connect the tensioning frame to the corresponding rotating arm via fixing bolts.

4. The compact wafer linear transport mechanism of claim 1, wherein: The second rotary joint assembly (8) includes a fixed shaft frame (81) connected inside the first rotary arm. A bearing seat (82) is connected to the fixed shaft frame (81). A cross ball bearing (83) is connected inside the bearing seat (82). A rotating shaft (84) passes through the cross ball bearing (83). A vertical fixed shaft (85) is connected to the fixed shaft frame (81). The fixed shaft (85) passes through the rotating shaft. A lower synchronous pulley (86) is connected to the lower end of the rotating shaft (84). The rotating shaft (84) is connected to the second rotary arm (4) through a connecting disc that is synchronously connected to the rotating shaft. The upper ends of the rotating shaft and the fixed shaft extend into the second rotary arm, and an upper synchronous pulley (87) is connected to the upper end of the rotating shaft.

5. The compact wafer linear transport mechanism of claim 1, wherein: A sensor (14) is connected to the rotating platform (1), and a sensor plate (15) that cooperates with the sensor (14) is connected to the bottom of the first rotating arm (3).

6. The compact wafer linear transport mechanism of claim 5, wherein: The sensor (2) is provided in at least two locations, which are located at different positions on the rotating platform and are in contact with the sensing plate.

7. The compact wafer linear transport mechanism according to claim 1, characterized in that: The vacuum-adhesive finger (6) is connected to the third rotary joint assembly (10) via a finger extension arm.

8. The compact wafer linear transport mechanism according to claim 1, characterized in that: The first rotary joint assembly (7) includes a first synchronous pulley (701) and a rotary connecting seat (702). The rotary motor (2) has a rotary connecting seat (702) that rotates synchronously with it connected to its drive shaft. The rotary connecting seat (702) has a first rotary arm (3) that rotates synchronously with it connected to it. The upper end of the drive shaft of the rotary motor extends into the first rotary arm and is connected to the first synchronous pulley (701). The first synchronous pulley is synchronously connected to the lower synchronous pulley through a first synchronous belt.

9. The compact wafer linear transport mechanism according to claim 1, characterized in that: The third rotary joint assembly (10) includes a bearing fixing shaft (101), which is connected to the second rotary arm. A second synchronous pulley (102) is connected to the bearing fixing shaft (101) via a bearing. The second synchronous pulley (102) is synchronously connected to the upper synchronous pulley via a second synchronous belt. The second synchronous pulley (102) is connected to the vacuum adsorption finger (6) via a bearing outer pressure plate (103).

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