Method, device and equipment for detecting stitch bonding pad of printed circuit board and storage medium
By comparing component information and pin data during printed circuit board engineering, the system automatically detects stacked pads, solving the problems of low detection accuracy and efficiency in existing technologies, and achieving efficient and accurate stacked pad detection.
Patent Information
- Application Number
- CN202410626380.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-11-21
Smart Images
Figure CN120995973A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of printed circuit board, and particularly relates to a printed circuit board's overlap pad detection method, device, equipment and storage medium. BACKGROUND
[0002] In the design process of a printed circuit board (PCB), there is a design requirement of overlap welding between two or more components, and efficient overlap pad detection of the components that need to be designed for overlap welding is an important factor for improving the quality of PCB design.
[0003] The existing method for detecting the overlap pad of the PCB is mostly manual detection, for example, a PCB designer checks each component in the PCB design drawing one by one based on the circuit schematic diagram through manual verification to determine whether the components that need to be overlap welded have been processed for overlap pad. SUMMARY
[0004] The present application provides a printed circuit board's overlap pad detection method, device, equipment and storage medium to solve the defects of low accuracy and efficiency of the overlap pad detection of the printed circuit board in the prior art, and achieve the purpose of improving the accuracy and efficiency of the overlap pad detection of the printed circuit board.
[0005] The present application provides a printed circuit board's overlap pad detection method, comprising:
[0006] Obtaining component information and component pin information of all components in a printed circuit board project;
[0007] Finding component information including a first attribute from all the component information, and determining the component corresponding to the component information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has an overlap welding association relationship with at least one target component;
[0008] Comparing the component information and the component pin information of the reference component with the component information and the component pin information of each target component respectively to obtain an overlap pad detection result.
[0009] According to the printed circuit board's overlap pad detection method provided by the present application, the component information includes layer information;
[0010] The comparison of the component information and the component pin information of the reference component with the component information and the component pin information of each target component respectively to obtain an overlap pad detection result comprises:
[0011] For each of the target devices, layer comparison results are obtained by comparing the layer information of the reference device with the layer information of the target device;
[0012] In a case where the layer comparison results represent that the reference device and the target device are in the same layer, device pin information of the reference device is compared with device pin information of the target device to obtain a stacked pad detection result;
[0013] In a case where the layer comparison results represent that the reference device and the target device are in different layers, a stacked pad detection result representing that no stacked pad processing is performed is obtained.
[0014] According to the printed circuit board stacked pad detection method provided by the application, the device pin information comprises network names of pins and pin data;
[0015] The comparison of the device pin information of the reference device with the device pin information of the target device to obtain a stacked pad detection result comprises:
[0016] The network names of the pins of the reference device are compared with the network names of the pins of the target device to obtain network name comparison results;
[0017] In a case where the network name comparison results represent that a first pin of the reference device and a second pin of the target device correspond to the same network name, pin data of the first pin and pin data of the second pin are obtained;
[0018] The pin data of the first pin and the pin data of the second pin are compared to obtain a stacked pad detection result.
[0019] According to the printed circuit board stacked pad detection method provided by the application, the pin data comprises pin center coordinates and pin sizes;
[0020] The comparison of the pin data of the first pin with the pin data of the second pin to obtain a stacked pad detection result comprises:
[0021] Based on the pin center coordinates and the pin sizes of the first pin, a first position range of the first pin in a horizontal direction and a second position range of the first pin in a vertical direction are determined;
[0022] Based on the pin center coordinates and the pin sizes of the second pin, a third position range of the second pin in the horizontal direction and a fourth position range of the second pin in the vertical direction are determined;
[0023] The first position range is compared with the third position range, and the second position range is compared with the fourth position range to obtain a stacked pad detection result.
[0024] The printed circuit board's overlap pad detection method provided by the present application, the comparison between the first position range and the third position range and the comparison between the second position range and the fourth position range obtain an overlap pad detection result, comprising:
[0025] In the case that the first position range and the third position range have an overlapping area and the second position range and the fourth position range have an overlapping area, an overlap pad detection result representing that the overlap pad processing has been done is obtained; or,
[0026] In the case that the first position range and the third position range do not have an overlapping area or the second position range and the fourth position range do not have an overlapping area, an overlap pad detection result representing that the overlap pad processing has not been done is obtained.
[0027] The printed circuit board's overlap pad detection method provided by the present application, the method further comprises:
[0028] Adding a first attribute to the reference device in the corresponding schematic diagram of the printed circuit board project to obtain a target schematic diagram;
[0029] Generating a corresponding netlist based on the target schematic diagram;
[0030] Importing the netlist into a printed circuit board design program to obtain the printed circuit board project.
[0031] The present application also provides a printed circuit board's overlap pad detection device, comprising:
[0032] An acquisition module for acquiring device information and device pin information of all components in a printed circuit board project;
[0033] A determination module for searching for device information including a first attribute from all the device information and determining the component corresponding to the device information including the first attribute as a reference device, the first attribute being used to represent that the corresponding component has an overlap pad association relationship with at least one target device;
[0034] A processing module for comparing the device information and the device pin information of the reference device with the device information and the device pin information of each target device respectively to obtain an overlap pad detection result.
[0035] The present application also provides an electronic device comprising a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor implements the printed circuit board's overlap pad detection method according to any one of the above-mentioned methods when executing the computer program.
[0036] The application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the soldering pad detection method of the printed circuit board.
[0037] The application further provides a computer program product, which comprises a computer program, and the computer program is executed by a processor to implement the soldering pad detection method of the printed circuit board.
[0038] The application provides a soldering pad detection method, device, equipment and storage medium of a printed circuit board. The method comprises the following steps: obtaining device information and device pin information of all components in a printed circuit board project; searching for device information comprising a first attribute from the device information, and determining a component corresponding to the device information comprising the first attribute as a reference component, the first attribute being used to represent that the corresponding component has a soldering association relationship with at least one target component; and comparing the device information and the device pin information of the reference component with device information and device pin information of each target component, to obtain a soldering pad detection result. By searching for the device information comprising the first attribute, the reference component and the at least one target component having the soldering association relationship can be quickly and accurately determined, and the device information and the device pin information of the reference component and each target component are compared respectively, so that whether the reference component and each target component have been processed by the soldering pad can be quickly and accurately determined, and manual detection is avoided, thereby improving the accuracy and efficiency of the soldering pad detection. BRIEF DESCRIPTION OF DRAWINGS
[0039] In order to more clearly illustrate the technical solutions of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0040] Figure 1 is a schematic diagram of a schematic diagram in the prior art;
[0041] Figure 2 is a schematic diagram of a partial PCB design diagram in the prior art;
[0042] Figure 3 is one of the flowcharts of the soldering pad detection method of the printed circuit board provided by the embodiments of the present application;
[0043] Figure 4 is a schematic diagram of a first pin provided by the embodiments of the present application;
[0044] Figure 5 is a schematic diagram of a schematic diagram provided by the embodiments of the present application;
[0045] Figure 6 is a schematic diagram of a netlist provided by an embodiment of the present application;
[0046] Figure 7 is an interface schematic diagram of a printed circuit board project provided by an embodiment of the present application;
[0047] Figure 8 is a flowchart of a second embodiment of a method for detecting a stacked pad of a printed circuit board provided by an embodiment of the present application;
[0048] Figure 9 is a structural schematic diagram of a stacked pad detection device of a printed circuit board provided by an embodiment of the present application;
[0049] Figure 10 is a structural schematic diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION
[0050] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0051] It should be noted that the serial numbers of the described objects in the present application, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning.
[0052] In actual application, the PCB needs to be designed according to the corresponding schematic diagram. During the schematic diagram design, there is a need for circuit function selection welding. Usually, the selection welding resistor is processed by stacked pad during the PCB design through the way of marking text on the schematic diagram. Figure 1 is a schematic diagram of a prior art schematic diagram, as shown in Figure 1 In the schematic diagram, if one pin (i.e. pin) of C5080 and one pin of C5088 need to be stacked, the text "share a pin" or "share a pin" will be marked in the diagram.
[0053] Figure 2 is a schematic diagram of a partial PCB design diagram in the prior art, as shown in Figure 2As shown, in the PCB design diagram, key information of the component can be displayed, such as the position number or code of the component, but the text marked in the schematic diagram will not be displayed. In actual PCB design, there are many explanatory texts in the schematic diagram, and the explanatory texts of the overlapping pads are easy to be ignored by the designers, resulting in that the overlapping pads are not processed according to the requirements of the schematic diagram in the PCB design. If the overlapping pads are not processed, the signal in the PCB may have signal quality problems due to the too long stub line. Therefore, it is necessary to comprehensively check the overlapping pads in the PCB to improve the quality of the PCB design.
[0054] In practice, when the PCB designer processes the components in the PCB, the designer focuses on the text information of each component that needs to be processed in the portable document format (PDF) file generated from the schematic diagram, and completes the overlapping pad production according to the requirements of the text information. However, since the number of pages of the schematic diagram PDF is generally large, and the text description information therein is also large, the PCB designer may not carefully read the schematic diagram information or forget the information for making the overlapping pads, resulting in that the overlapping pads are not selected according to the requirements, and problems such as omission or error of the overlapping pad production occur. When checking the overlapping pads in the PCB design, the PCB designer also relies on manual review to detect whether the overlapping pads in the PCB design are processed comprehensively and correctly. However, due to the differences in the checking ability and the carefulness of the personnel, the existing overlapping pad detection method has low accuracy and efficiency.
[0055] Therefore, the embodiment of the present application provides a printed circuit board overlapping pad detection method, which comprises the following steps: obtaining component information and component pin information of all components in a printed circuit board project; searching for component information including a first attribute from all component information, and determining a component corresponding to the component information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has an overlapping pad association relationship with at least one target component; and comparing the component information and the component pin information of the reference component with the component information and the component pin information of each target component, respectively, to obtain an overlapping pad detection result. By searching for the component information including the first attribute, the reference component and the at least one target component having the overlapping pad association relationship can be quickly and accurately determined, and the component information and the component pin information of the reference component and each target component are compared respectively, so that whether the overlapping pad processing between the reference component and each target component has been performed can be quickly and accurately determined, and manual detection is avoided, thereby improving the accuracy and efficiency of the overlapping pad detection.
[0056] The printed circuit board overlap pad detection method provided by the embodiment of the present application can be executed by an electronic device such as a mobile phone, a tablet computer, a computer, a server or a server cluster, or a specially designed smart device, or a printed circuit board overlap pad detection device arranged in the electronic device or the smart device, and the printed circuit board overlap pad detection device can be realized by software, hardware or a combination of both. The method of the present application can be applied to various printed circuit board overlap pad detection scenarios. The following will be described in combination with Figures 3 to 8 The printed circuit board overlap pad detection method provided by the embodiment of the present application is described. Figure 3 is one of the flowcharts of the printed circuit board overlap pad detection method provided by the embodiment of the present application, as shown in the figure, the printed circuit board overlap pad detection method comprises steps 310 to 330. Figure 3
[0057] Step 310: Obtain device information and device pin information of all components in a printed circuit board project.
[0058] Specifically, the printed circuit board project can be understood as a design program file of the printed circuit board. By reading the design program file of the printed circuit board through a PCB design program, the device information and device pin information of all components in the printed circuit board project can be obtained.
[0059] Among them, the device information is information representing the overall characteristics of the component, which can include, for example, bit number, attribute value, layer information, component model, component characteristic parameters and the like; the device pin information is information representing the pins of the component, which can include, for example, pin number, pin coordinates, pin connection network name and the like.
[0060] Step 320: Find the device information including the first attribute from all device information, and determine the component corresponding to the device information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has an overlap welding association relationship with at least one target component.
[0061] Specifically, the reference component can be understood as a component including the first attribute, and the first attribute can be an attribute representing that the component including the first attribute has an overlap welding association relationship with at least one target component, and the target component can be understood as a component that should be overlap welded with the reference component.
[0062] For example, the first attribute can be a ROOM attribute, which is used to identify and manage the components. If the component with bit number C5088 includes a ROOM attribute, the C5088 component is the reference component. If the attribute value of the ROOM attribute of the C5088 component is "share to C5080", the C5080 is the bit number of the target component, and the C5080 component is a target component that has a reflow association with the C5088 component.
[0063] For example, the component information including the first attribute can be found from all component information by means of traversal query, and the reference component and the target component can be determined. For example, the PCB project is opened by a PCB design application, all component information and component pin information of components are obtained by cyclic traversal, the obtained component information and component pin information are stored in a component list, and the list is stored in a dictionary. The component list can be traversed quickly in the form of key-value pair by taking the bit number of the component as the key and the content of the component list as the value. The first attribute value of each component can be obtained by cyclic traversal of the value of the dictionary. For example, if there is a ROOM attribute value "share to C5080", the latter half C5080 of the attribute value can be used to determine the target component. If it is a multi-component reflow pad, for example, the ROOM attribute value is "share to C5080, C5090", the latter half of the attribute value can be intercepted, and it can be determined whether there is a separator ",". If there is, the separator "," can be split to obtain the bit numbers of all target components, i.e. "C5080" and "C5090", so that multiple target components are determined. Then, the bit numbers "C5080" and "C5090" of the target components can be used as keys to query the values corresponding to the keys, so as to obtain the component information and component pin information of the C5080 component and the component information and component pin information of the C5090 component.
[0064] In step 330, the component information and component pin information of the reference component are compared with the component information and component pin information of each target component respectively, and a reflow pad detection result is obtained.
[0065] Specifically, the reflow pad detection result can be obtained by comparing the reference component with each target component one by one in the reflow pad comparison item, and the reflow pad detection result can include a detection result indicating that the reference component and the target component have been processed by the reflow pad, and a detection result indicating that the reference component and the target component have not been processed by the reflow pad.
[0066] The overlay pad comparison item can be understood as a comparison item set based on at least one type of information in the device information and the device pin information. For example, the corresponding overlay pad comparison item is set based on at least one type of information in the device information, the comparison item includes a comparison condition; the acquired type of information of the reference device is compared with the type of information of a target device, and when the comparison result meets the comparison condition of the overlay pad comparison item, it is determined that the reference device and the target device pass the comparison, and an overlay pad detection result indicating that the reference device and the target device have been processed by the overlay pad is obtained. Through the comparison of the overlay pad comparison item, fast and accurate automatic overlay pad detection can be realized, and manual verification can be avoided, thereby improving efficiency and accuracy.
[0067] The method for detecting the overlay pad of the printed circuit board provided by the embodiment of the application comprises the following steps: obtaining device information and device pin information of all components in a printed circuit board project; finding device information comprising a first attribute from all the device information, and determining the component corresponding to the device information comprising the first attribute as a reference device, the first attribute being used to indicate that the corresponding component has an overlay association relationship with at least one target device; and comparing the device information and the device pin information of the reference device with the device information and the device pin information of each target device respectively to obtain an overlay pad detection result. By finding the device information comprising the first attribute, the reference device and the at least one target device having the overlay association relationship can be determined quickly and accurately, and the device information and the device pin information of the reference device and each target device are compared respectively, so that whether the reference device and each target device have been processed by the overlay pad can be determined quickly and accurately, and manual detection by one-by-one verification can be avoided, thereby improving the accuracy and efficiency of the overlay pad detection.
[0068] For example, when the overlay pad processing is performed between components, the overlay pad processing is usually performed on components arranged on the same layer as needed, especially for surface-mounted components. If two surface-mounted components are arranged on different layers of a PCB, the overlay pad processing cannot be performed. Therefore, when the overlay pad detection is performed, the layer information in the device information can be compared to simplify the comparison items and further improve the detection efficiency.
[0069] In an embodiment, the device information comprises layer information, and the comparison between the device information and the device pin information of the reference device and the device information and the device pin information of each target device to obtain the overlay pad detection result can be implemented in the following manner:
[0070] The layer comparison result is obtained by comparing the layer information of the reference device with the layer information of the target device. In a case where the layer comparison result indicates that the reference device and the target device are in the same layer, the device pin information of the reference device is compared with the device pin information of the target device to obtain the overlap pad detection result. In a case where the layer comparison result indicates that the reference device and the target device are in different layers, the overlap pad detection result indicating that the overlap pad processing is not performed is obtained.
[0071] Specifically, the layer information is information indicating a layer in which the component is arranged in the PCB. For example, the layer information includes a top layer (Top Layer) and a bottom layer (Bottom Layer).
[0072] For example, after obtaining the layer information of the reference device and the layer information of the target device, the layer comparison result can be obtained by comparing the layer information. The layer comparison result can include a layer comparison result indicating that the reference device and the target device are in the same layer, and a layer comparison result indicating that the reference device and the target device are in different layers. When the layer comparison result indicating that the reference device and the target device are in different layers is obtained, the detection result indicating that the reference device and the target device are not processed by the overlap pad can be directly obtained. When the layer comparison result indicating that the reference device and the target device are in the same layer is obtained, the overlap pad detection result can be obtained by further comparing the device pin information of the reference device with the device pin information of the target device.
[0073] For example, when the C5088 component is taken as the reference device and the C5080 component is taken as the target device, if the layer information of the C5088 component is Top and the layer information of the C5080 component is Bottom, the layer comparison result indicating that the C5088 component and the C5080 component are in different layers can be obtained by comparing the layer information. Based on the layer comparison result, the overlap pad detection result indicating that the reference device and the target device are not processed by the overlap pad can be obtained. Alternatively, an error prompt information can be outputted to prompt the PCB designer that the C5088 component and the C5080 component should be processed by the overlap pad but are not processed by the overlap pad.
[0074] In the embodiment, the device information includes layer information; the layer information of the reference device is compared with the layer information of the target device to obtain a layer comparison result; in a case where the layer comparison result indicates that the reference device and the target device are in the same layer, device pin information of the reference device is compared with device pin information of the target device to obtain a stacked pad detection result; in a case where the layer comparison result indicates that the reference device and the target device are in different layers, a stacked pad detection result indicating that no stacked pad processing is performed is obtained. In this way, the layer information can be compared quickly, and the stacked pad detection result can be obtained efficiently.
[0075] In actual application, after it is determined that the reference device and the target device are in the same layer, further comparison is needed to obtain the stacked pad detection result. The object of the stacked pad setting between the components is the pin of the component, and therefore, the network name and the pin data of the pin in the device pin information are compared further, and a stacked pad detection result with high accuracy can be obtained.
[0076] In an embodiment, the device pin information includes the network name and the pin data of the pin; when the device pin information of the reference device is compared with the device pin information of the target device to obtain the stacked pad detection result, the comparison can be implemented in the following manner:
[0077] The network name of each pin of the reference device is compared with the network name of each pin of the target device to obtain a network name comparison result; in a case where the network name comparison result indicates that the first pin of the reference device and the second pin of the target device correspond to the same network name, the pin data of the first pin and the pin data of the second pin are obtained; the pin data of the first pin and the pin data of the second pin are compared to obtain the stacked pad detection result.
[0078] Specifically, in the PCB design, the network name of the pin refers to the circuit network name connected by the pin of the component, the network name is used to identify the connection mode between different parts in the circuit, and the network name can be used to guide the wiring and connection. The pin data is data used to represent the characteristics of the pin, for example, can include the pin center coordinates and the pin size, etc. The first pin and the second pin are the pins with the same network name in the reference device and the target device.
[0079] For example, the PCB engineering includes resistor R1 and microcontroller U1. Microcontroller U1 has multiple pins, some of which are used for power connection (such as VCC and GND), and some of which are used for signal input / output (such as IO1, IO2, etc.). In the PCB design, each pin needs to be assigned a network name. For example: the VCC pin of microcontroller U1 can be assigned the network name of "+5V", indicating that this pin needs to be connected to a 5V power supply. The GND pin of microcontroller U1 can be assigned the network name of "GND", indicating that this pin needs to be connected to ground. The IO1 pin of microcontroller U1 can be assigned the network name of "SIGNAL_OUT", indicating that this pin is a signal output pin. Each pin of resistor R1 and capacitor C1 can also have its own network name, for example, one end of resistor R1 is connected to the "+5V" network and the other end is connected to the "SIGNAL_IN" network, then the network name of the pin connected to "+5V" is "+5V", and the network name of the pin connected to "SIGNAL_IN" is "SIGNAL_IN". For example, the network name of one pin of the reference device C5088 is "+5V", and the network name of one pin of the target device C5080 is also "+5V", then the "+5V" pin of C5088 is the first pin, and the "+5V" pin of C5080 is the second pin.
[0080] For example, after determining that the reference device and the target device are on the same layer based on the steps in the above embodiment, device pin information of the reference device and the target device is obtained respectively, and the device pin information includes network name and pin data of the pin. All pins of the two components are compared in a loop, and if the network name connected to a pin of the reference device is consistent with the network name connected to a pin of the target device, the pin with the consistent network name should be the pin that needs to be stacked. The pin number of the pin connected by the network name is obtained, and the pin data of the two pins that need to be stacked can be extracted. That is, the network name of each pin of the reference device is compared with the network name of each pin of the target device to obtain a network name comparison result, and the network name comparison result includes a network name comparison result representing that a first pin of the reference device corresponds to the same network name as a second pin of the target device, and a network name comparison result representing that the first pin of the reference device corresponds to a different network name from the second pin of the target device. In the case where the network name comparison result represents that the first pin of the reference device corresponds to the same network name as the second pin of the target device, pin data of the first pin and pin data of the second pin are obtained; the pin data of the first pin and the pin data of the second pin are compared to obtain a stacked pad detection result. When the network name comparison result is the result representing that the first pin of the reference device corresponds to a different network name from the second pin of the target device, it indicates that there is no pin with the same network name in each pin of the reference device and the target device, and then it is possible that the attribute description information of at least one of the reference device and the target device is incorrect. At this time, review prompt information prompting the PCB designer to check whether the stacked pad required in the schematic diagram is correct can be output.
[0081] In the embodiment, through comparison of the network names, whether the pins of the reference device and the target device correspond to the same network name can be quickly compared, and then in the case where the pins correspond to the same network name, the first pin and the second pin can be determined, and further comparison can be performed to obtain a stacked pad detection result with higher accuracy. Based on this, the efficiency and accuracy of detection can be further improved.
[0082] In an embodiment, the pin data includes pin center coordinates and pin size; when the pin data of the first pin and the pin data of the second pin are compared to obtain the stacked pad detection result, the comparison can be realized by the following way:
[0083] The first position range of the first pin in the horizontal direction and the second position range of the first pin in the vertical direction are determined based on the pin center coordinates and the pin size of the first pin; the third position range of the second pin in the horizontal direction and the fourth position range of the second pin in the vertical direction are determined based on the pin center coordinates and the pin size of the second pin; the first position range and the third position range are compared, and the second position range and the fourth position range are compared to obtain the stacked pad detection result.
[0084] Specifically, the pin center coordinate can be a coordinate value of a center point of the pin in the PCB coordinate system, the pin size can be an area size of the pin occupying the surface of the PCB, and the pin size can include a pin width and a pin height. The shape of the pin on the PCB can be any shape, such as a rectangle, a square, a circle, or a special shape, and thus the pin width can be understood as the maximum length of the pin in the horizontal direction, and the pin height can be understood as the maximum length of the pin in the vertical direction. The pin size can also be referred to as the pad size of the pin.
[0085] For example, when the first position range of the first pin in the horizontal direction and the second position range of the first pin in the vertical direction are determined based on the pin center coordinate and the pin size of the first pin, and the third position range of the second pin in the horizontal direction and the fourth position range of the second pin in the vertical direction are determined based on the pin center coordinate and the pin size of the second pin, a coordinate value calculation method can be used.
[0086] Taking a rectangular first pin as an example, Figure 4 is a schematic diagram of the first pin provided by an embodiment of the present application, as Figure 4 shown, the horizontal direction can be understood as the X-axis direction of the PCB coordinate system, and the vertical direction can be understood as the Y-axis direction of the PCB coordinate system. For example, the coordinate of the center point of the first pin is (x, y), the pin width is d, and the pin height is h, and then the first position range can be calculated as to The second position range is to wherein can be understood as the minimum value of the pin in the X-axis direction, can be understood as the maximum value of the pin in the X-axis direction, can be understood as the minimum value of the pin in the Y-axis direction, can be understood as the maximum value of the pin in the Y-axis direction.
[0087] Based on the above method, the first position range of the first pin in the horizontal direction and the second position range of the first pin in the vertical direction can be calculated. Similarly, the third position range of the second pin in the horizontal direction and the fourth position range of the second pin in the vertical direction can also be determined by the calculation method based on the pin center coordinate and the pin size of the second pin.
[0088] In an implementation mode, when the overlap pad detection result is obtained by comparing the first position range with the third position range and comparing the second position range with the fourth position range, the comparison can be realized by the following method:
[0089] In a case where the first position range and the third position range have an overlapping area and the second position range and the fourth position range have an overlapping area, an overlap pad detection result indicating that the overlap pad processing has been performed is obtained; or in a case where the first position range and the third position range do not have an overlapping area or the second position range and the fourth position range do not have an overlapping area, an overlap pad detection result indicating that the overlap pad processing has not been performed is obtained.
[0090] Specifically, when determining whether the first position range and the third position range have an overlapping area, a comparison can be made between the maximum value of the third position range and the maximum value and the minimum value of the first position range, and a comparison can also be made between the minimum value of the third position range and the maximum value and the minimum value of the first position range. When determining whether the second position range and the fourth position range have an overlapping area, a comparison can be made between the maximum value of the fourth position range and the maximum value and the minimum value of the second position range, and a comparison can also be made between the minimum value of the fourth position range and the maximum value and the minimum value of the second position range.
[0091] For example, the maximum value of the first position range is X 1max , the minimum value is X 1min , the maximum value of the second position range is Y 1max , the minimum value is Y 1min , the maximum value of the third position range is X 2max , the minimum value is X 2min , and the maximum value of the fourth position range is Y 2max , the minimum value is Y 2min . Through comparison, if X 1min X 2max X 1max , or X 1min X 2min X 1max , it indicates that the first pin and the second pin have an overlapping area in the horizontal direction; if Y 1min Y 2max Y 1max , or Y 1min Y 2min Y 1max , it indicates that the first pin and the second pin have an overlapping area in the vertical direction. If the first pin and the second pin have overlapping areas in both the horizontal direction and the vertical direction, i.e., the first position range and the third position range have an overlapping area and the second position range and the fourth position range have an overlapping area, it indicates that the first pin and the second pin overlap, and an overlap pad detection result indicating that the first pin and the second pin have been subjected to overlap pad processing can be obtained, which can also be understood as an overlap pad detection result indicating that the reference device and the target device have been subjected to overlap pad processing.
[0092] Similarly, by comparison, if X 1min <X 2max <X 1max , or X 1min <X 2min <X 1max , it indicates that there is no overlapping area between the first pin and the second pin in the horizontal direction; if Y 1min <Y 2max <Y 1max , or Y 1min <Y 2min <Y 1max , it indicates that there is no overlapping area between the first pin and the second pin in the vertical direction. If there is no overlapping area between the first pin and the second pin in the horizontal direction or the vertical direction, i.e., there is no overlapping area between the first position range and the third position range, or there is no overlapping area between the second position range and the fourth position range, it indicates that the first pin and the second pin cannot overlap, and the overlap pad detection result representing that the first pin and the second pin are not processed by the overlap pad can be obtained, which can also be understood as the overlap pad detection result representing that the reference device and the target device are not processed by the overlap pad.
[0093] In the embodiment, the position range of the pin, i.e., the position range of the pin in the PCB, can be quickly determined through the pin center coordinates and the pin size; and whether the first pin and the second pin overlap can be accurately determined by comparing the position ranges of the first pin and the second pin. If they overlap, the first pin and the second pin are processed by the overlap pad; if they do not overlap, the first pin and the second pin are not processed by the overlap pad. Further, in the case that there is an overlapping area between the first position range and the third position range, and there is an overlapping area between the second position range and the fourth position range, the overlap pad detection result representing that the first pin and the second pin are processed by the overlap pad is obtained; or in the case that there is no overlapping area between the first position range and the third position range, or there is no overlapping area between the second position range and the fourth position range, the overlap pad detection result representing that the first pin and the second pin are not processed by the overlap pad is obtained. Based on this, whether there is an overlapping area can be quickly, accurately and effectively determined, and the overlap pad detection result with high accuracy can be obtained.
[0094] In an embodiment, the method further comprises: adding the first attribute to the reference device in the schematic diagram corresponding to the printed circuit board project to obtain a target schematic diagram; generating a corresponding netlist based on the target schematic diagram; importing the netlist into a printed circuit board design program to obtain the printed circuit board project.
[0095] Specifically, before designing the printed circuit board, the schematic diagram is usually designed first. The schematic diagram can be a diagram showing the principle of the circuit meeting the designer's requirements. In the schematic diagram corresponding to the printed circuit board project, the first attribute can be added to the reference device to obtain a target schematic diagram.
[0096] Figure 5 This is a schematic diagram of the principle provided in the embodiment of the present invention, such as... Figure 5 As shown, in the schematic, the ROOM attribute is added to the reference device C5088 with the attribute value "share to C5080". It should be understood that the attribute value can be "share to tag number 1, tag number 2, tag number 3". Here, tag number 1, tag number 2, and tag number 3 are all tag numbers of target devices that have a bonding relationship with the reference device. The number of target devices can be one, two, or more. After adding the first attribute to all reference devices that require it, the target schematic is obtained.
[0097] For example, a schematic application can be used to generate a corresponding netlist for a target schematic. Figure 6 This is a schematic diagram of the netlist provided in an embodiment of the present invention, such as... Figure 6 As shown, the temp.tel property in the netlist will generate the corresponding ROOM property and its value.
[0098] Furthermore, importing the netlist into a printed circuit board (PCB) design program yields the PCB project. The PCB design program can be understood as a software program for PCB design, such as various Electronic Design Automation (EDA) software like Altium Designer, Eagle PCB Design, and KiCad.
[0099] Figure 7 This is a schematic diagram of the interface of a printed circuit board process provided in an embodiment of the present invention, such as... Figure 7 As shown, after importing the netlist into the PCB design program, the ROOM attribute and its value will be displayed in the device information of the reference device C5088.
[0100] Compared to existing methods where PCB designers read the textual descriptions in the schematic PDF and then manually process the pads in the PCB design program, the method in this embodiment adds a first attribute to the reference device in the schematic corresponding to the printed circuit board project and imports the generated netlist into the printed circuit board design program to obtain the printed circuit board project. Therefore, it can avoid manual reading of the schematic for information transmission, thereby achieving rapid and accurate acquisition of relevant information about the pads. This solves the problem of low intuitiveness and accuracy when transmitting pad information in the schematic PDF, achieving the goal of intuitive, clear, and accurate transmission of pad information, and creating the foundation for automated pad detection.
[0101] Next, through Figure 8A specific implementation of the embodiment of the present application is described, Figure 8 is a flowchart of the second embodiment of the printed circuit board's overlap pad detection method provided by the present application.
[0102] As shown in the figure, Figure 8 After starting the overlap pad detection, all component information is acquired, that is, the component information and the component pin information of all components are acquired. All reference components containing the ROOM attribute are obtained. The bit number information in the ROOM attribute is intercepted. The layer information of the two components is compared, that is, the layer information comparison is performed based on the reference component and the target component. It is judged whether the layer information is consistent: if not, it is prompted that the two components are not placed on the same layer, and the overlap pad detection result is output through the report; if yes, it is compared whether there is the same network name of all pins of the two components. It is judged whether the network name of the pin is the same: if not, it is prompted that there is no overlap pad pin, please check, and the overlap pad detection result is output through the report; if yes, the overlap of the network name same pin of the two components is compared. It is judged whether the pin has an overlapping area: if not, it is prompted that the pins do not overlap, please check, and the overlap pad detection result is output through the report; if yes, the overlap pad detection result is output through the report. Then the overlap pad detection is ended.
[0103] Based on this, the automatic PCB overlap pad detection can be quickly and accurately realized, and the detection accuracy and efficiency are improved. Through the method, whether each component which needs to be processed by the overlap pad has been processed by the overlap pad can be comprehensively, efficiently and accurately detected. The design quality of the PCB can be improved by using the automatic detection of each overlap pad of the PCB. The problems of the signal quality of the PCB caused by the non-overlap pad processing can be avoided, and the situation of changing the board caused by the signal problem can be avoided. The influence on the product quality and the product development cycle can be reduced.
[0104] The printed circuit board's overlap pad detection device provided by the embodiment of the present application is described below. The printed circuit board's overlap pad detection device described below can be correspondingly referred to the printed circuit board's overlap pad detection method described above.
[0105] Figure 9 is a structural schematic diagram of the printed circuit board's overlap pad detection device provided by the present application. As shown in the figure, Figure 9 The printed circuit board's overlap pad detection device 900 includes:
[0106] The acquisition module 910 is configured to acquire the component information and the component pin information of all components in the printed circuit board project.
[0107] The determining module 920 is configured to find the component information including the first attribute from all the component information, and determine the component corresponding to the component information including the first attribute as the reference component, where the first attribute is used to represent that the corresponding component has a reflow association relationship with at least one target component.
[0108] The processing module 930 is configured to compare the component information and the component pin information of the reference component with the component information and the component pin information of each target component respectively, to obtain a reflow pad detection result.
[0109] In an example embodiment, the component information includes layer information; and the processing module 930 is specifically configured to:
[0110] For each target component, the layer information of the reference component is compared with the layer information of the target component to obtain a layer comparison result;
[0111] In a case where the layer comparison result represents that the reference component and the target component are in the same layer, the component pin information of the reference component is compared with the component pin information of the target component to obtain the reflow pad detection result;
[0112] In a case where the layer comparison result represents that the reference component and the target component are in different layers, a reflow pad detection result representing that no reflow pad processing is performed is obtained.
[0113] In an example embodiment, the component pin information includes a network name of a pin and pin data; and the processing module 930 is specifically configured to:
[0114] The network name of each pin of the reference component is compared with the network name of each pin of the target component to obtain a network name comparison result;
[0115] In a case where the network name comparison result represents that a first pin of the reference component and a second pin of the target component correspond to the same network name, the pin data of the first pin and the pin data of the second pin are obtained;
[0116] The pin data of the first pin and the pin data of the second pin are compared to obtain the reflow pad detection result.
[0117] In an example embodiment, the pin data includes pin center coordinates and pin size; and the processing module 930 is specifically configured to:
[0118] The pin center coordinates and the pin size of the first pin are used to determine a first position range of the first pin in a horizontal direction and a second position range of the first pin in a vertical direction;
[0119] The pin center coordinates and the pin size of the second pin are used to determine a third position range of the second pin in the horizontal direction and a fourth position range of the second pin in the vertical direction.
[0120] The first position range and the third position range are compared, and the second position range and the fourth position range are compared to obtain the overlap pad detection result.
[0121] In an example embodiment, the processing module 930 is specifically configured to:
[0122] In a case where the first position range and the third position range have an overlapping area, and the second position range and the fourth position range have an overlapping area, the overlap pad detection result representing that the overlap pad processing has been performed is obtained; or,
[0123] In a case where the first position range and the third position range do not have an overlapping area, or the second position range and the fourth position range do not have an overlapping area, the overlap pad detection result representing that the overlap pad processing has not been performed is obtained.
[0124] In an example embodiment, the overlap pad detection device 900 of the printed circuit board further comprises an adding module, a generating module, and an importing module.
[0125] The adding module is configured to add a first attribute to a reference device in a schematic diagram corresponding to a printed circuit board project to obtain a target schematic diagram.
[0126] The generating module is configured to generate a corresponding netlist based on the target schematic diagram.
[0127] The importing module is configured to import the netlist into a printed circuit board design program to obtain the printed circuit board project.
[0128] The device of the embodiment can be used to execute the method of any one of the printed circuit board overlap pad detection method-side embodiments, and the specific implementation process and technical effects are similar to those of the printed circuit board overlap pad detection method-side embodiments. For details, refer to the detailed description in the printed circuit board overlap pad detection method-side embodiments, which will not be repeated here.
[0129] Figure 10 is a schematic diagram of the physical structure of the electronic device provided by the embodiment of the present application, such as Figure 10As shown, the electronic device can include a processor 1010, a communications interface 1020, a memory 1030, and a communications bus 1040, wherein the processor 1010, the communications interface 1020, and the memory 1030 complete mutual communication through the communications bus 1040. The processor 1010 can invoke a logical instruction in the memory 1030 to execute the above-mentioned printed circuit board overlap pad detection method, which includes: obtaining device information and device pin information of all components in a printed circuit board project; finding component information including a first attribute from all device information, and determining a component corresponding to the component information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has an overlap welding association relationship with at least one target component; and comparing the device information and the device pin information of the reference component with the device information and the device pin information of each target component, to obtain an overlap pad detection result.
[0130] In addition, the logical instruction in the memory 1030 described above can be implemented in the form of a software functional unit and sold or used as an independent product, and can be stored in a computer-readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.
[0131] On the other hand, the present application also provides a computer program product, which includes a computer program, the computer program can be stored on a computer readable storage medium, and the computer program can be executed by a processor to enable a computer to execute the above-mentioned printed circuit board overlap pad detection method, which includes: obtaining device information and device pin information of all components in a printed circuit board project; finding component information including a first attribute from all device information, and determining a component corresponding to the component information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has an overlap welding association relationship with at least one target component; and comparing the device information and the device pin information of the reference component with the device information and the device pin information of each target component, to obtain an overlap pad detection result.
[0132] In yet another aspect, the present application also provides a computer readable storage medium, having stored thereon a computer program, which, when executed by a processor, implements the method for detecting a soldering pad of a printed circuit board provided by any of the above methods, and the method comprises: obtaining device information and device pin information of all components in a printed circuit board project; searching for the device information comprising a first attribute from all the device information, and determining the component corresponding to the device information comprising the first attribute as a reference component, the first attribute being used to represent that the corresponding component has a soldering association relationship with at least one target component; and comparing the device information and the device pin information of the reference component with the device information and the device pin information of each target component respectively to obtain a soldering pad detection result.
[0133] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs. Those skilled in the art can understand and implement without creative labor.
[0134] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be realized by means of software and necessary general hardware platform, and of course can also be realized by hardware. Based on such understanding, the above technical solutions can be embodied in the form of software product, which can be stored in a computer readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes a plurality of instructions to make a computer device (which can be a personal computer, server, or network device, etc.) execute the method described in each embodiment or some parts of the embodiment.
[0135] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A method of detecting a soldered land of a printed circuit board, characterized by, The method comprises the following steps: Obtaining device information and device pin information of all components in a printed circuit board project; Searching for device information including a first attribute from all the device information, and determining a component corresponding to the device information including the first attribute as a reference component, the first attribute being used to represent that the corresponding component has a reflow welding association relationship with at least one target component; Comparing the device information and the device pin information of the reference component with the device information and the device pin information of each target component to obtain a reflow pad detection result.
2. The print circuit board's solder pad detection method according to claim 1, characterized in that, The device information includes layer information; The comparison of the device information and the device pin information of the reference component with the device information and the device pin information of each target component to obtain a reflow pad detection result comprises: For each target component, comparing the layer information of the reference component with the layer information of the target component to obtain a layer comparison result; In the case that the layer comparison result represents that the reference component and the target component are in the same layer, comparing the device pin information of the reference component with the device pin information of the target component to obtain a reflow pad detection result; In the case that the layer comparison result represents that the reference component and the target component are in different layers, obtaining a reflow pad detection result representing that no reflow pad processing is performed.
3. The print circuit board's solder pad detection method of claim 2, wherein, The device pin information includes network name and pin data of the pin; The comparison of the device pin information of the reference component with the device pin information of the target component to obtain a reflow pad detection result comprises: Comparing the network name of each pin of the reference component with the network name of each pin of the target component to obtain a network name comparison result; In the case that the network name comparison result represents that a first pin of the reference component and a second pin of the target component correspond to the same network name, obtaining pin data of the first pin and pin data of the second pin; Comparing the pin data of the first pin with the pin data of the second pin to obtain a reflow pad detection result.
4. The method of claim 3, wherein The pin data includes pin center coordinates and pin size; The comparison of the pin data of the first pin with the pin data of the second pin to obtain a reflow pad detection result comprises: Determining a first position range of the first pin in a horizontal direction and a second position range of the first pin in a vertical direction based on the pin center coordinates and the pin size of the first pin; Determining a third position range of the second pin in the horizontal direction and a fourth position range of the second pin in the vertical direction based on the pin center coordinates and the pin size of the second pin; Comparing the first position range with the third position range, and comparing the second position range with the fourth position range to obtain a reflow pad detection result.
5. The method of claim 4, wherein the step of detecting the soldering pads of the printed circuit board is characterized by, The comparison of the first position range with the third position range, and the comparison of the second position range with the fourth position range to obtain a reflow pad detection result comprises: In a case where the first position range and the third position range have an overlapping area and the second position range and the fourth position range have an overlapping area, a pad-on-pad detection result representing that the pad-on-pad processing has been performed is obtained; or In a case where the first position range and the third position range do not have an overlapping area or the second position range and the fourth position range do not have an overlapping area, a pad-on-pad detection result representing that the pad-on-pad processing has not been performed is obtained.
6. The method of claim 1-5, wherein The method further comprises: adding a first attribute to the reference device in a corresponding schematic diagram of the printed circuit board project to obtain a target schematic diagram; generating a corresponding netlist based on the target schematic diagram; importing the netlist into a printed circuit board design program to obtain the printed circuit board project.
7. A printed circuit board's solder pad inspection apparatus, characterized by, comprises: an acquisition module, configured to acquire device information and device pin information of all components in a printed circuit board project; a determination module, configured to find device information including a first attribute from all the device information, and determine a component corresponding to the device information including the first attribute as a reference device, the first attribute being used to represent that the corresponding component has a pad-on-pad association relationship with at least one target device; a processing module, configured to compare the device information and the device pin information of the reference device with device information and device pin information of each of the target devices respectively to obtain a pad-on-pad detection result.
8. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the pad-on-pad detection method of the printed circuit board according to any one of claims 1 to 6.
9. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the pad-on-pad detection method of the printed circuit board according to any one of claims 1 to 6.
10. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the pad-on-pad detection method of the printed circuit board according to any one of claims 1 to 6.