Power module and electronic device

Abstract

The invention provides a power module and electronic equipment. The power module comprises a substrate, a plurality of terminals, a packaging body and a plurality of window structures. Wherein at least one terminal is of a first terminal structure, the first terminal structure is electrically connected with the substrate, the first terminal structure comprises a first area and a second area, the projection of the first area on the plane where the substrate is located is located on the surface of the substrate, and the projection of the second area on the plane where the substrate is located exceeds the boundary of the substrate; the packaging body is used for packaging the substrate and the plurality of first terminal structures, so that the substrate and the plurality of first terminal structures are located in the packaging body, the window structure is located in the packaging body above the second region and exposes a part of surface of the second region, and the window structure is connected with an external circuit through the exposed part of surface of the second region. Therefore, by arranging the first terminal structure and the window structure, the reliability of the power module can be improved.

Description

Technical Field

[0001] This invention relates to the field of electronic circuits, and more particularly to a power module and an electronic device. Background Technology

[0002] A power module is a modular component that integrates multiple power semiconductor devices (such as IGBTs, MOSFETs, diodes, etc.) with drive circuits, protection circuits, thermal management structures, etc., into a single package. Through optimized layout and interconnection technology, it achieves efficient conversion and control of electrical energy.

[0003] In the existing technology, only the main body of the power module is encapsulated. The terminals of the encapsulated power module are completely exposed, which increases the safety risks of the power module, as well as the possibility of electrical performance degradation and mechanical failure, thereby reducing the reliability of the power module. Summary of the Invention

[0004] This invention provides a power module and an electronic device, which improves the reliability of the power module by increasing the terminal insulation of the power module.

[0005] According to a first aspect of the present invention, a power module is provided, comprising: substrate; A plurality of terminals, at least one of which is a first terminal structure, the first terminal structure being electrically connected to the substrate, the first terminal structure including a first region and a second region, the projection of the first region onto the plane of the substrate being located on the surface of the substrate, and the projection of the second region onto the plane of the substrate being located extending beyond the boundary of the substrate. A package for encapsulating the substrate and a plurality of the terminals, wherein the substrate and the first terminal structure are located within the package; Several window structures are located in the package above the second region and expose a portion of the surface of the second region, and are connected to external circuitry through the exposed portion of the surface of the second region.

[0006] Optionally, at least one of the terminals is a second terminal structure, the second terminal structure including a third region and a fourth region, the projection of the third region on the substrate is located on the surface of the substrate, and the projection of the fourth region on the plane of the substrate extends beyond the boundary of the substrate and is exposed outside the package body.

[0007] Optionally, the plurality of terminals includes a DC positive terminal, a DC negative terminal, and an AC terminal. At least one of the DC positive terminal, the DC negative terminal, and the AC terminal is the first terminal structure. The DC positive terminal, the DC negative terminal, and the AC terminal are disposed on the same side of the substrate. The DC positive terminal and the DC negative terminal are located on one side of the substrate, and the AC terminal and the DC positive terminal are respectively located on opposite sides of the substrate.

[0008] Optionally, the plurality of terminals may further include a plurality of signal terminals spaced apart on the surface of the substrate, wherein the signal terminals are the same as the first terminal structure.

[0009] Optionally, at least one of the DC positive terminal and the DC negative terminal is a first terminal structure, and the DC positive terminal and the DC negative terminal are spaced apart along the surface of the substrate.

[0010] Optionally, the second regions of at least two first terminals are arranged in a direction perpendicular to the surface of the substrate. The first terminal is a first terminal structure. A first insulating layer is provided between the second regions of adjacent first terminals. The first terminal is either the DC positive terminal or the DC negative terminal. Furthermore, among the at least two first terminals, the second region of the first terminal closer to the substrate has a larger length.

[0011] Optionally, among the plurality of terminals, the second region of the first terminal and the fourth region of the second terminal are arranged in a direction perpendicular to the surface of the substrate. The first terminal is a first terminal structure, and the second terminal is a second terminal structure. The first terminal is the DC positive terminal or the DC negative terminal, and the second terminal is the DC positive terminal or the DC negative terminal. A first insulating layer is provided between adjacent first terminals, between adjacent second terminals, and between adjacent first terminals and second terminals. Furthermore, in the first terminal, the length of the second region of the first terminal closer to the substrate is larger.

[0012] Optionally, the thickness of the package corresponding to the upper and lower parts of the second region is less than the thickness of the package corresponding to the upper and lower parts of the substrate.

[0013] Optionally, the first terminal structure or the second terminal structure is a stepped integrated lead frame with uniform thickness.

[0014] Optionally, the first terminal structure or the second terminal structure is a stepped integrated lead frame, which has a first step and a second step. One side of the first step is electrically connected to the surface of the substrate by solder, and the second step is used to connect to an external circuit. The thickness of the first step is greater than the thickness of the second step.

[0015] Optionally, a cubic metal pad is provided between the stepped integrated lead frame and the substrate surface. The cubic metal pad is electrically connected to the substrate surface by solder, and the stepped integrated lead frame is electrically connected to the cubic metal pad by solder.

[0016] Optionally, the substrate is any one of an active metal soldering substrate, a direct copper-clad substrate, and a hard brush circuit board.

[0017] According to a second aspect of the present invention, an electronic device is provided, comprising: The aforementioned power module; Several connection structures, the two ends of which are respectively used to connect an external circuit and a portion of the second area of ​​the first terminal structure exposed by the window structure; A plurality of second insulating layers are provided, which fill the window structure and cover the surfaces of the connection structures located within the window structure and the first terminal structures exposed by the window structure.

[0018] Optionally, the method for welding a portion of the second region of the first terminal structure exposed by the connection window structure is ultrasonic welding, laser welding, or solder welding.

[0019] Compared with the prior art, the technical solution of the present invention has the following beneficial effects: In a power module provided by the present invention, there are a substrate, several terminals, a package, and several window structures. At least one terminal is a first terminal structure electrically connected to the substrate. The first terminal structure includes a first region and a second region. The projection of the first region onto the plane of the substrate is located on the substrate surface, and the projection of the second region onto the plane of the substrate extends beyond the substrate boundary. The substrate and several first terminal structures are located within the package. Window structures are located within the package above the second region and expose a portion of the surface of the second region, allowing connection to an external circuit through the exposed surface of the second region. Therefore, since the surfaces of the first terminal structures, except for the portion corresponding to the window structures, are enclosed by the package, the first terminal structures have high insulation, thereby reducing safety risks, electrical performance degradation, and the possibility of mechanical failure, thus improving the reliability of the power module. Furthermore, since the projection of the second region onto the plane of the substrate extends beyond the substrate boundary and the window structures expose a portion of the surface of the second region, the exposed surface of the second region of the first terminal structure can be electrically connected to an external circuit via laser welding, ultrasonic welding, or solder welding without damaging the substrate. Attached Figure Description

[0020] Figure 1 It is a power module with a planar layout structure; Figure 2 It is a power module with a stacked layout structure; Figure 3 This is a schematic diagram of the power module provided in the first embodiment of the present invention; Figure 4 yes Figure 3 A schematic diagram of the cross-sectional structure; Figure 5 yes Figure 3 Top view; Figure 6 This is a schematic diagram of the power module provided in the second embodiment of the present invention; Figure 7 yes Figure 6 A schematic diagram of the cross-sectional structure; Figure 8 This is a schematic diagram of the power module provided in the third embodiment of the present invention; Figure 9 This is a cross-sectional structural diagram of the power module provided in the fourth embodiment of the present invention; Figure 10 This is a cross-sectional structural diagram of the power module provided in the fifth embodiment of the present invention; Figure 11 This is a cross-sectional structural diagram of the power module provided in the sixth embodiment of the present invention.

[0021] Explanation of reference numerals in the attached figures: 1-Package; 2-window structure; 3-Substrate; DC+- DC positive terminal; DC - Negative DC terminal; AC terminal; 41- Solder; 42-Cube-shaped metal pad; 43 - Leadframe; 44-Second Zone; 5-First insulating layer; 61 - Second terminal structure. Detailed Implementation

[0022] As described in the background section, since the terminals of the encapsulated power module are completely exposed, the safety risks, electrical performance degradation, and mechanical failure of the power module increase, thus reducing the reliability of the power module.

[0023] Figure 1 It is a power module with a planar layout structure. Figure 2 It is a power module with a stacked layout structure.

[0024] Traditional power module terminal layouts include planar layout structures and stacked layout structures.

[0025] Please refer to Figure 1 The terminals 30 in the planar layout structure are spaced apart and located on the same horizontal plane, which makes the circuit inductance of the power module large and the creepage distance between the terminals small.

[0026] Please refer to Figure 2 Terminals 10 and 20 have a stacked layout structure. Since the spacing between terminals in the stacked layout structure is smaller than that in the planar layout structure, the circuit inductance can be reduced. However, the insulation will be further reduced, which will cause a greater risk of breakdown when using a stacked layout structure for terminals with excessive current, thus further reducing the reliability of the power module.

[0027] In view of this, the present invention creatively proposes a power module, comprising: substrate; A plurality of terminals, at least one of which is a first terminal structure, the first terminal structure being electrically connected to the substrate, the first terminal structure including a first region and a second region, the projection of the first region onto the plane of the substrate being located on the surface of the substrate, and the projection of the second region onto the plane of the substrate being located extending beyond the boundary of the substrate. A package for encapsulating the substrate and a plurality of the terminals, wherein the substrate and the first terminal structure are located within the package; Several window structures are located in the package above the second region and expose a portion of the surface of the second region, and are connected to external circuitry through the exposed portion of the surface of the second region.

[0028] Therefore, since the first terminal structure, except for the surface corresponding to the window structure, is completely encapsulated, it possesses high insulation properties. This reduces safety risks, electrical performance degradation, and the possibility of mechanical failure, thereby improving the reliability of the power module. Furthermore, because the projection of the second region onto the plane of the substrate extends beyond the substrate boundary and the window structure exposes a portion of the second region's surface, the exposed surface of the second region of the first terminal structure can be electrically connected to external circuitry via laser welding, ultrasonic welding, or solder welding without damaging the substrate.

[0029] The embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention. The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0030] Figure 3 This is a schematic diagram of the power module provided in the first embodiment of the present invention. Figure 4 yes Figure 3 A cross-sectional structural diagram. Figure 5 yes Figure 3 A top view. Among them, Figure 5 The relative positions of the DC positive terminal, DC negative terminal, and substrate are only schematically shown in the diagram.

[0031] Please refer to Figure 3 and Figure 4The first embodiment of the present invention provides a power module, including a substrate 3, a plurality of terminals, a package 1, and a plurality of window structures 2.

[0032] In this embodiment, substrate 3 is an active metal brazing substrate, which has a sandwich structure of "copper layer-ceramic layer-copper layer". The middle ceramic layer is used for heat dissipation, and the upper and lower copper layers serve as the electrical connection carriers for chip electrodes and external circuits. Of course, those skilled in the art should realize that substrate 3 can also be a direct copper-clad substrate, a hard-brushed circuit board, or a substrate made of other materials.

[0033] At least one of the terminals is a first terminal structure. The first terminal structure is electrically connected to the substrate 3. The first terminal structure includes a first region and a second region 44. The projection of the first region onto the plane of the substrate 3 is located on the surface of the substrate 3. The projection of the second region 44 onto the plane of the substrate 3 extends beyond the boundary of the substrate 3.

[0034] The package 1 is used to encapsulate the substrate 3 and a plurality of terminals, and the substrate 3 and the first terminal structure are located inside the package 1.

[0035] In this embodiment, the power module is encapsulated using a molding compound filling method to protect the chips, pin frames, and internal interconnect structures within the power module.

[0036] Several window structures 2 are located within the package 1 above the second region 44 and expose a portion of the surface of the second region 44, connecting to external circuitry through the exposed portion of the second region 44. Specifically, since the window structures 2 are located in the second region 44, and the projection of the second region 44 onto the plane of the substrate 3 extends beyond the boundary of the substrate 3, the projection of the window structures 2 onto the plane of the substrate 3 extends beyond the boundary of the substrate 3. This allows for electrical connection between the portion of the second region 44 of the first terminal structure exposed through the window structures 2 and the external circuitry via laser welding, ultrasonic welding, or solder 41 welding without damaging the substrate 3.

[0037] In this embodiment, the window structure 2 can be square or circular. Of course, the window structure 2 can also be other shapes, and the present invention does not limit this.

[0038] In this embodiment, each second zone 44 corresponds to at least one window structure 2. The present invention does not limit the number of window structures 2.

[0039] In this embodiment, at least one of the plurality of terminals is a second terminal structure. The second terminal structure includes a third region and a fourth region. The projection of the third region on the substrate 3 is located on the surface of the substrate 3. The projection of the fourth region on the plane of the substrate 3 extends beyond the boundary of the substrate 3 and is exposed outside the package 1.

[0040] In this embodiment, the thickness of the package 1 corresponding to the second region 44 is less than the thickness of the package 1 corresponding to the upper and lower parts of the substrate 3.

[0041] In this embodiment, the power module includes four types of terminals: a DC positive terminal (DC+), a DC negative terminal (DC-), an AC terminal, and a signal terminal. Since the DC positive terminal (DC+), the DC negative terminal (DC-), and the AC terminal require high current, the widths of these terminals are greater than the width of the signal terminal. Furthermore, the number of each of these terminals is at least one.

[0042] In this embodiment, the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal are disposed on the same side of the substrate 3. The DC positive terminal DC+ and the DC negative terminal DC- are located on the same side of the substrate 3, and the AC terminal AC and the DC positive terminal DC+ are located on opposite sides of the substrate 3, respectively.

[0043] In addition, at least one of the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal AC is the first terminal structure.

[0044] For ease of explanation, this embodiment uses the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal as examples of first terminal structures. Of course, in other embodiments, some of the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal may be used as first terminal structures.

[0045] Based on this, the signal terminal can also be the first terminal structure.

[0046] In this embodiment, the DC positive terminal DC+ and the DC negative terminal DC- have a stacked structure. Specifically, the second regions 44 of at least two first terminals are arranged in a direction perpendicular to the substrate surface. The first terminals are first terminal structures, and a first insulating layer 5 is provided between the second regions 44 of adjacent first terminals. The first terminals are either the DC positive terminal DC+ or the DC negative terminal DC-. Furthermore, among the at least two first terminals, the second region 44 of the first terminal closer to the substrate has a larger length. Since the length of the second region 44 of the lower first terminal is greater than that of the upper first terminal, and the first insulating layer 5 is provided between the second regions 44 of adjacent first terminals, the surface portion of the lower first terminal is covered by the insulating layer. The window structure is disposed in the upper package of the remaining surface. Therefore, the distance between the window structure corresponding to the lower first terminal and the substrate is larger than that between the window structure corresponding to the upper first terminal and the substrate. Therefore, the insulation between the DC positive terminal DC+ and the DC negative terminal DC- is better. In particular, compared with the traditional stacked layout structure, it greatly reduces the risk of the terminals being easily broken down when the current is too high when using the stacked layout structure, thus further improving the reliability of the power module.

[0047] In this embodiment, the first terminal structure or the second terminal structure 61 is a stepped integrated lead frame 43 with uniform thickness. A cubic metal pad 42 is provided between the stepped integrated lead frame 43 and the substrate surface. The cubic metal pad 42 is electrically connected to the substrate surface 3 via solder, and the stepped integrated lead frame 43 is electrically connected to the cubic metal pad 42 via solder. For details, please refer to... Figure 5 In the stacked structure, cubic metal pads 42 corresponding to the DC positive terminal DC+ and the DC negative terminal DC- are distributed at intervals on the substrate 3. The DC positive terminal DC+ and the DC negative terminal DC- have different heights, and the DC positive terminal DC+ and the DC negative terminal DC- are isolated by the package body 1 and the first insulating layer 5.

[0048] The material of the first insulating layer 5 is an insulating material such as AMB, DBC, molding compound, ceramic, or insulating film.

[0049] Figure 6 This is a schematic diagram of the power module provided in the second embodiment of the present invention. Figure 7 yes Figure 6 A schematic diagram of the cross-sectional structure.

[0050] Please refer to Figure 6 and Figure 7The second embodiment of the present invention is a modified embodiment of the first embodiment described above. The main difference between the second embodiment and the first embodiment is that the DC positive terminal DC+ and the DC negative terminal DC-, which are designed with a stacked structure, have a first terminal structure in some parts and a second terminal structure in the remaining parts.

[0051] Specifically, among the plurality of terminals, the second region 44 of the first terminal and the fourth region of the second terminal are arranged in a direction perpendicular to the surface of the substrate. The first terminal is a first terminal structure, and the second terminal is a second terminal structure 61. The first terminal is the DC positive terminal DC+ or the DC negative terminal DC-, and the second terminal is the DC positive terminal DC+ or the DC negative terminal DC-. A first insulating layer 5 is provided between adjacent first terminals, between adjacent second terminals, and between adjacent first terminals and second terminals. Furthermore, in the first terminal, the length of the second region 44 of the first terminal closer to the substrate is larger.

[0052] Figure 8 This is a schematic diagram of the power module provided in the third embodiment of the present invention.

[0053] Please refer to Figure 8 The third embodiment of the present invention is a modified embodiment of the first embodiment described above. The main difference between the third embodiment and the first embodiment is that the DC positive terminal DC+ and the DC negative terminal DC- have a planar layout structure.

[0054] Specifically, at least one of the DC positive terminal DC+ and the DC negative terminal DC- is a first terminal structure, and the DC positive terminal DC+ and the DC negative terminal DC- are spaced apart along the surface direction of the substrate 3. For example, please refer to... Figure 3 The DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal are all first terminal structures. The DC positive terminal DC+ and the DC negative terminal DC- are spaced apart on one side of the substrate. This makes the insulation between the DC positive terminal DC+, the DC negative terminal DC-, and the AC terminal higher compared to terminals with a completely exposed planar layout structure. This reduces safety risks, electrical performance degradation, and the possibility of mechanical failure, thereby improving the reliability of the power module.

[0055] Figure 9 This is a cross-sectional structural diagram of the power module provided in the fourth embodiment of the present invention.

[0056] Please refer to Figure 9The fourth embodiment of the present invention is a modified embodiment of the first embodiment described above. The main difference between the fourth embodiment and the first embodiment is that the stepped integrated lead frame 43 is electrically connected to the substrate by solder.

[0057] Figure 10 This is a cross-sectional structural diagram of the power module provided in the fifth embodiment of the present invention.

[0058] Please refer to Figure 10 The fifth embodiment of the present invention is a modified embodiment of the first embodiment described above. The main difference between the fifth embodiment and the first embodiment is that the stepped integrated lead frame 43 is electrically connected to the substrate by laser welding or ultrasonic welding.

[0059] Figure 11 This is a cross-sectional structural diagram of the power module provided in the sixth embodiment of the present invention.

[0060] Please refer to Figure 11 The sixth embodiment of the present invention is a variation of the first embodiment described above. The main difference between the sixth embodiment and the first embodiment is that the thickness of the stepped integrated lead frame 43 is uneven.

[0061] Specifically, the first terminal structure or the second terminal structure 61 is a stepped integrated lead frame 43. The stepped integrated lead frame 43 has a first step and a second step. One side of the first step is electrically connected to the surface of the substrate by solder. The second step is used to connect to an external circuit. Furthermore, the thickness of the first step is greater than the thickness of the second step.

[0062] The lead frame is made of copper.

[0063] In summary, the power module provided in this embodiment of the invention includes a substrate, a plurality of terminals, a package, and a plurality of window structures. At least one terminal is a first terminal structure, electrically connected to the substrate. The first terminal structure includes a first region and a second region. The projection of the first region onto the plane of the substrate is located on the substrate surface, and the projection of the second region onto the plane of the substrate extends beyond the substrate boundary. The substrate and the plurality of first terminal structures are located within the package. The window structures are located within the package above the second region and expose a portion of the surface of the second region, allowing connection to an external circuit through the exposed surface of the second region. Therefore, since the surfaces of the first terminal structure, except for the portion corresponding to the window structure, are enclosed by the package, the first terminal structure has high insulation, thereby reducing safety risks, electrical performance degradation, and the possibility of mechanical failure, thus improving the reliability of the power module. Furthermore, since the projection of the second region onto the plane of the substrate extends beyond the substrate boundary and the window structures expose a portion of the surface of the second region, the exposed surface of the second region of the first terminal structure can be electrically connected to an external circuit via laser welding, ultrasonic welding, or solder welding without damaging the substrate.

[0064] The present invention also provides an electronic device, including the power module described above, a plurality of connection structures, a plurality of second insulating layers, and a plurality of second insulating layers.

[0065] The two ends of the connection structure are respectively used to connect to an external circuit and a portion of the second area of ​​the first terminal structure exposed by the window structure. The second insulating layer fills the window structure and covers the portion of the connection structure located within the window structure and the surface of the first terminal structure exposed by the window structure. Specifically, the second insulating layer fills the remaining portion of the window structure except for the connection structure, so that the surface of the second area exposed by the window structure, except for the position where it intersects with the connection structure, is covered by the second insulating layer, thereby further improving the insulation of the first terminal structure and thus improving the reliability of the power module.

[0066] The method for exposing a portion of the second region of the first terminal structure through the connecting window structure is any one of ultrasonic welding, laser welding, or solder welding.

[0067] The material of the second insulating layer can be insulating adhesive. Of course, there are many other materials that can be used for the second insulating layer, and this invention does not limit them.

[0068] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A power module, characterized in that, include: substrate; A plurality of terminals, at least one of which is a first terminal structure, the first terminal structure being electrically connected to the substrate, the first terminal structure including a first region and a second region, the projection of the first region onto the plane of the substrate being located on the surface of the substrate, and the projection of the second region onto the plane of the substrate being located extending beyond the boundary of the substrate. A package for encapsulating the substrate and a plurality of the terminals, wherein the substrate and the first terminal structure are located within the package; Several window structures are located in the package above the second region and expose a portion of the surface of the second region, and are connected to external circuitry through the exposed portion of the surface of the second region.

2. The power module according to claim 1, characterized in that, At least one of the terminals is a second terminal structure, the second terminal structure including a third region and a fourth region, the projection of the third region on the substrate is located on the surface of the substrate, and the projection of the fourth region on the plane of the substrate extends beyond the boundary of the substrate and is exposed outside the package body.

3. The power module according to claim 2, characterized in that, The plurality of terminals includes a DC positive terminal, a DC negative terminal, and an AC terminal. At least one of the DC positive terminal, the DC negative terminal, and the AC terminal is the first terminal structure. The DC positive terminal, the DC negative terminal, and the AC terminal are disposed on the same side of the substrate. The DC positive terminal and the DC negative terminal are located on one side of the substrate, and the AC terminal and the DC positive terminal are respectively located on opposite sides of the substrate.

4. The power module according to claim 3, characterized in that, The plurality of terminals also includes a plurality of signal terminals spaced apart on the surface of the substrate, wherein the signal terminals are the structure of the first terminal.

5. The power module according to claim 3, characterized in that, At least one of the DC positive terminal and the DC negative terminal is a first terminal structure, and the DC positive terminal and the DC negative terminal are spaced apart along the surface of the substrate.

6. The power module according to claim 3, characterized in that, The second regions of at least two first terminals are arranged in a direction perpendicular to the surface of the substrate. The first terminal is a first terminal structure. A first insulating layer is provided between the second regions of adjacent first terminals. The first terminal is either the DC positive terminal or the DC negative terminal. Furthermore, among the at least two first terminals, the second region of the first terminal closer to the substrate has a larger length.

7. The power module according to claim 3, characterized in that, In the plurality of terminals, the second region of the first terminal and the fourth region of the second terminal are arranged in a direction perpendicular to the surface of the substrate. The first terminal is a first terminal structure, and the second terminal is a second terminal structure. The first terminal is the DC positive terminal or the DC negative terminal, and the second terminal is the DC positive terminal or the DC negative terminal. A first insulating layer is provided between adjacent first terminals, between adjacent second terminals, and between adjacent first terminals and second terminals. In the first terminal, the length of the second region of the first terminal that is closer to the substrate is larger.

8. The power module according to claim 2, characterized in that, The thickness of the package corresponding to the upper and lower parts of the second region is less than the thickness of the package corresponding to the upper and lower parts of the substrate.

9. The power module according to claim 2, characterized in that, The first terminal structure or the second terminal structure is a stepped, integrated lead frame with uniform thickness.

10. The power module according to claim 2, characterized in that, The first terminal structure or the second terminal structure is a stepped integrated lead frame. The stepped integrated lead frame has a first step and a second step. One side of the first step is electrically connected to the surface of the substrate by solder. The second step is used to connect to an external circuit. The thickness of the first step is greater than the thickness of the second step.

11. The power module according to claim 9 or 10, characterized in that, A cubic metal pad is provided between the stepped integrated lead frame and the substrate surface. The cubic metal pad is electrically connected to the substrate surface by solder, and the stepped integrated lead frame is electrically connected to the cubic metal pad by solder.

12. The power module according to claim 1, characterized in that, The substrate is any one of an active metal brazing substrate, a direct copper-clad substrate, and a hard brush circuit board.

13. An electronic device, characterized in that, include: The power module as described in any one of claims 1-12; Several connection structures, the two ends of which are respectively used to connect an external circuit and a portion of the second area of ​​the first terminal structure exposed by the window structure; A plurality of second insulating layers are provided, which fill the window structure and cover the surfaces of the connection structures located within the window structure and the first terminal structures exposed by the window structure.

14. The electronic device according to claim 13, characterized in that, The method for exposing a portion of the second region surface of the first terminal structure through the connecting window structure of the connection structure is any one of ultrasonic welding, laser welding, or solder welding.

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