Integrated packaging structure with inductor and integrated circuit and manufacturing method thereof

Abstract

The invention provides an integrated packaging structure with an inductor and an integrated circuit and a manufacturing method thereof. The integrated package structure having an inductor and an integrated circuit includes: a substrate having a preset circuit layout; the integrated circuit is arranged on the substrate, the integrated circuit is jointed with the substrate in an inverted mode, a joint object for jointing the integrated circuit and the substrate is coated by a coating material, and the integrated circuit is exposed out of the back surface of the integrated circuit; the inductor is arranged above the integrated circuit, the lower surface of the inductor is connected with the back surface of the integrated circuit, and at least one part of a connecting area between the lower surface of the inductor and the back surface of the integrated circuit is not provided with the sealing and filling glue.

Description

Technical Field

[0001] This invention relates to an integrated package structure having an inductor and an integrated circuit, and a method for manufacturing the same, particularly to an integrated package structure having an inductor and an integrated circuit in which at least a portion of the connection area between the lower surface of the inductor and the back surface of the integrated circuit is free of encapsulant, and a method for manufacturing the same. Background Technology

[0002] like Figure 1 As shown, the prior art has an integrated package structure 10 for inductors and integrated circuits, including a substrate 101, an integrated circuit 102, a passive component 103, and an inductor 104. This integrated package structure is a discrete component, resulting in a large overall volume and area occupied, which is not conducive to miniaturization design.

[0003] Another existing technology, such as the structure described in US Patent 11317545, has an integrated package structure of inductor and integrated circuit. It uses a metal sheet surrounding the inductor to assist in heat dissipation for the integrated circuit below, and a heatsink is placed on top. However, this design has several problems, including the surface flatness of the connection between the metal sheet and the inductor, and the need for thermal paste to connect the magnetic materials of the metal sheet and the inductor, which reduces the overall heat dissipation capacity. Furthermore, the heatsink above the inductor needs to be connected to the uneven metal sheet via a thermal interface material (TIM). The low thermal conductivity of the TIM and the uneven metal sheet structure result in uneven spacing between the heatsink and the metal sheet, further reducing the heat dissipation effect.

[0004] Furthermore, in designs that stack multiple electronic components, each component is typically protected by a coating material such as compound to prevent physical, chemical, or electrical disturbances. This is particularly true in power modules, where passive components such as inductors and capacitors are often combined with power switching integrated circuits (SPS ICs) to form a buck module. The ideal heat dissipation solution is to directly connect the IC chip to the high thermal conductivity metal plate on the inductor, which saves space and effectively improves heat dissipation. However, this approach can leave the IC exposed beneath the external metal plate, making it susceptible to external electrical potentials and potentially leading to burnout. For safety, ICs are usually still protected with compound, but this sacrifices some heat dissipation efficiency.

[0005] To address the aforementioned problems, this invention provides an improved design. By using encapsulating material molding or underfill to protect the sides and underlying components of the IC chip, and exposing the back of the IC chip, better heat dissipation is achieved. Furthermore, in this embodiment, a metal with high thermal conductivity is placed inside the inductor, utilizing a conductive magnetic alloy material (thermal conductivity approximately 5-25 W / mK) for heat dissipation. This material has better thermal conductivity than the molded encapsulant (thermal conductivity approximately 1-3 W / mK) and simultaneously possesses insulation and heat dissipation properties, reducing the risk of leakage in the environment. Summary of the Invention

[0006] From one perspective, the present invention provides an integrated package structure having an inductor and an integrated circuit, comprising: a substrate having a predetermined circuit layout; an integrated circuit disposed on the substrate and flip-chip bonded to the substrate, wherein a bonding agent of the integrated circuit and the substrate is covered by a covering material, wherein the integrated circuit exposes a back side of the integrated circuit; and an inductor disposed above the integrated circuit, wherein a lower surface of the inductor is connected to the back side of the integrated circuit to form a connection region, wherein at least a portion of the connection region is free of encapsulant.

[0007] In one embodiment, after molding, the encapsulant on the back side of the integrated circuit is ground to expose the back side of the integrated circuit.

[0008] In one embodiment, the back side of the integrated circuit is exposed after being underfilled with adhesive and without being molded.

[0009] In one embodiment, the back side of the integrated circuit is either non-BSM (non-back metal plating) or has BSM.

[0010] In one embodiment, the substrate includes a lead frame or a printed circuit board (PCB).

[0011] In one embodiment, a magnetic material providing the inductance value includes a ceramic magnetic material or a metallic soft magnetic material. The ceramic magnetic material includes nickel-zinc ferrite, manganese-zinc ferrite, or magnesium-copper-zinc ferrite, and the metallic soft magnetic material includes carbon-based iron powder, iron-nickel alloy, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, or amorphous alloy.

[0012] In one embodiment, the joint includes at least one metal pillar, at least one solder ball, or at least one copper-copper bonding.

[0013] In one embodiment, the inductor may be in the form of exposed magnetic material or embedded metal.

[0014] In one embodiment, when the inductor is in the form of an exposed magnetic material, a magnetic material providing the inductance value is connected to the back side of the integrated circuit.

[0015] In one embodiment, when the inductor is in the form of a metal-clad type, a cladding metal sheet on the outside of the inductor is connected to the back side of the integrated circuit.

[0016] In one embodiment, when the inductor is in the form of a metal inlay, a magnetic material or a frame on the outside of the inductor is connected to the back side of the integrated circuit.

[0017] In one embodiment, the lower surface of the inductor is connected to the back side of the integrated circuit via a thermal interface material (TIM) or a solder.

[0018] In one embodiment, a metal plate is disposed above the inductor, and the metal plate is connected to the upper surface of the inductor via a thermal interface material or a solder.

[0019] In one embodiment, the exposed portion or the entire back side of the integrated circuit is connected to the lower surface of the inductor.

[0020] In another viewpoint, the present invention provides an integrated package structure having an inductor and an integrated circuit, comprising: a substrate having a predetermined circuit layout; an integrated circuit disposed on the substrate and flip-chip bonded to the substrate, wherein a bonding agent between the integrated circuit and the substrate is covered by a covering material, wherein the integrated circuit exposes a back side of the integrated circuit; a metal plate disposed above the integrated circuit, wherein a lower surface of the metal plate is connected to the back side of the integrated circuit, and at least a portion of a connection area between the lower surface of the metal plate and the back side of the integrated circuit is free of encapsulant; and an inductor disposed below the substrate and connected to the substrate.

[0021] In another viewpoint, the present invention provides a method for manufacturing an integrated package structure having an inductor and an integrated circuit, comprising: providing an integrated circuit; disposing the integrated circuit on a substrate, wherein the integrated circuit is flip-chip bonded to the substrate; after molding the integrated circuit, grinding the encapsulant on its back side, or without molding the integrated circuit, performing underfill on the integrated circuit to expose a back side of the integrated circuit; and disposing an inductor above the integrated circuit, wherein a lower surface of the inductor is connected to the back side of the integrated circuit to form a connection region, wherein at least a portion of the connection region is free of encapsulant.

[0022] In another viewpoint, the present invention provides a method for manufacturing an integrated package structure having an inductor and an integrated circuit, comprising: providing an integrated circuit; disposing the integrated circuit on a substrate, wherein the integrated circuit is flip-chip bonded to the substrate; after molding the integrated circuit, grinding the encapsulant on its back side, or without molding the integrated circuit, performing underfill on the integrated circuit to expose a back side of the integrated circuit; disposing a metal plate above the integrated circuit, wherein a lower surface of an inductor of the metal plate is connected to the back side of the integrated circuit to form a connection area, wherein at least a portion of the connection area is free of encapsulant; and disposing an inductor below the substrate and connecting it to the substrate.

[0023] The following detailed description through specific embodiments will make it easier to understand the purpose, technical content, features and effects achieved by the present invention. Attached Figure Description

[0024] Figure 1 The prior art shows an integrated packaging structure 10 for inductors and integrated circuits.

[0025] Figure 2 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0026] Figure 3 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0027] Figure 4 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0028] Figure 5 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0029] Figure 6 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0030] Figure 7 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0031] Figure 8 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0032] Figure 9 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0033] Figure 10 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0034] Figure 11 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0035] Figure 12 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0036] Figure 13 This diagram shows a cross-sectional view of an embodiment of an integrated package structure having an inductor and an integrated circuit according to the present invention.

[0037] Figure 14A , Figure 14B and Figure 14C This is a perspective view of an embodiment of a manufacturing method for an integrated package structure 50 having an inductor and an integrated circuit according to the present invention.

[0038] Figure 15A , Figure 15B , Figure 15C and Figure 15D A cross-sectional schematic diagram of a method for manufacturing an integrated package structure 110 having an inductor and an integrated circuit according to the present invention is shown.

[0039] Explanation of symbols in the diagram

[0040] 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130: Features an integrated package structure combining inductors and integrated circuits.

[0041] 201: Substrate

[0042] 202: Integrated Circuits

[0043] 202a: Reverse side

[0044] 203: Passive Components

[0045] 204: Inductor

[0046] 204a: Lower surface of inductor

[0047] 204b: Top surface of inductor

[0048] 2041: Magnetic Materials

[0049] 2042: Coated metal sheet

[0050] 2043: Frame

[0051] 20431: Top Plate

[0052] 20432: Base Plate

[0053] 20433: Vertical box

[0054] 205: Elevated Column

[0055] 205a: Upper surface of the raised column

[0056] 206: Covering material

[0057] 207: Joint

[0058] 208: Thermal interface materials

[0059] 209: Metal Plate

[0060] 209a: Lower surface of metal plate

[0061] CTA: Connecting Area Detailed Implementation

[0062] The accompanying drawings in this invention are all schematic and are mainly intended to show the interrelationships between the various circuit components. The shapes and dimensions are not drawn to scale.

[0063] Figure 2 This diagram shows a cross-sectional view of an embodiment of an integrated package structure comprising an inductor and an integrated circuit according to the present invention. Figure 2 As shown, the integrated package structure 20 with inductor and integrated circuit includes a substrate 201, an integrated circuit 202, and an inductor 204. The substrate 201 has a preset circuit layout for carrying and connecting other electronic components. The substrate 201 can be a printed circuit board (PCB) or a lead frame, which has the function of electrical signal transmission and forms an electrical connection with the integrated circuit 202.

[0064] Integrated circuit 202 is flip-chip mounted on substrate 201, bonding to substrate 201 via flip-chip bonding, providing a stable electrical connection and reducing connection impedance. The back surface 202a of integrated circuit 202 is partially or completely exposed after the packaging process to facilitate heat dissipation. The bonding material 207 connecting integrated circuit 202 and substrate 201 is covered by a covering material 206 to protect the electrical connection and prevent external interference. The covering material 206 can be used for packaging using underfill or molding, but it does not cover at least a portion of the back surface 202a of integrated circuit 202, leaving the back surface exposed to promote heat conduction. In this embodiment, packaging is performed using molding, and after molding, the encapsulant on the back surface 202a of integrated circuit 202 is ground to expose the back surface 202a of integrated circuit 202.

[0065] An inductor 204 is disposed above the integrated circuit 202 and contains magnetic material. The lower surface 204a of the inductor is connected to the back surface 202a of the integrated circuit 202, forming a connection region CTA. At least a portion of the connection region CTA is free of encapsulant to ensure optimized heat dissipation. The magnetic material in the inductor 204 has a higher thermal conductivity than the encapsulant, which helps dissipate heat from the integrated circuit 202, while also providing insulation to prevent the risk of current leakage.

[0066] According to the present invention, the integrated packaging structure 20 of this embodiment can not only effectively enhance the heat dissipation efficiency of the integrated circuit 202, but also reduce the overall space occupied. The covering material 206 is only used to protect the electrical connections on the sides and bottom of the integrated circuit 202, without covering the back of the integrated circuit, thereby keeping the heat dissipation path unobstructed and reducing the thermal resistance caused by the use of thermal interface materials or thermal paste.

[0067] like Figure 2 As shown, in one embodiment, the integrated package structure 20 according to the present invention has improved heat dissipation characteristics, enhancing the connection and heat dissipation effect between the inductor 204 and the integrated circuit 202 through specific technical features. For example, the back surface 202a of the integrated circuit 202 can be optionally without back metal plating (non-BSM), or with back metal plating (BSM) depending on heat dissipation and conductivity requirements, to enhance heat conduction or provide specific electrical connections. This selective design allows the back surface 202a of the integrated circuit 202 to be processed accordingly according to application requirements, thereby further optimizing heat dissipation and electrical performance.

[0068] In one embodiment, the magnetic material within the inductor 204 can be composed of ceramic magnetic materials or soft metallic magnetic materials. Specifically, the magnetic material can be selected from ceramic materials such as nickel-zinc ferrite, manganese-zinc ferrite, or magnesium-copper-zinc ferrite, or soft metallic magnetic materials such as carbon-based iron powder, iron-nickel alloy, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, and amorphous alloy. These magnetic materials not only possess high thermal conductivity, which helps improve the heat dissipation efficiency of the inductor 204, but also have insulating properties, protecting the integrated circuit 202 from electrical interference.

[0069] The bonding element 207 between the integrated circuit 202 and the substrate 201 may include at least one metal pillar, at least one solder ball, or at least one copper-copper bond. These bonding methods provide a stable electrical and mechanical connection between the integrated circuit 202 and the substrate 201, and achieve a balance between electrical connection strength and thermal conductivity according to the requirements of the package structure. This design ensures a stable connection between the integrated circuit 202 and the substrate 201, and achieves good electrical conductivity and heat dissipation.

[0070] The inductor 204 can be configured in different ways, such as with exposed magnetic material, metal-clad, or metal-embedded structures. Figure 2 In the illustrated embodiment, the inductor 204 employs an exposed magnetic material, with the magnetic material 2041 exposed on the lower surface 204a of the inductor and connected to the back surface 202a of the integrated circuit 202, forming a connection area CTA. At least a portion of this connection area CTA is free of sealant to ensure optimized heat dissipation. This direct connection design effectively improves the thermal conductivity between the inductor 204 and the integrated circuit 202, resulting in superior overall heat dissipation performance.

[0071] In one embodiment, the lower surface 204a of the inductor can be connected to the back surface 202a of the integrated circuit 202 via thermal interface material (TIM) or solder. This TIM provides an efficient heat transfer path while ensuring a stable connection between the inductor 204 and the integrated circuit 202, thereby reducing heat dissipation resistance and improving heat dissipation efficiency. This design optimizes heat dissipation performance while ensuring connection stability.

[0072] In one embodiment, the back surface 202a of the integrated circuit 202 may be partially or completely exposed to facilitate connection with the lower surface 204a of the inductor. By exposing the back surface 202a of the integrated circuit 202, the present invention effectively enhances heat dissipation efficiency and reduces thermal resistance introduced by the use of encapsulant or other materials. This design ensures unobstructed heat dissipation paths and significantly improves the performance of the integrated circuit 202 in applications with high heat dissipation requirements.

[0073] Figure 3This shows a cross-sectional schematic diagram of another embodiment of the integrated package structure 30 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 2 The main difference in the illustrated embodiment is the packaging method of the integrated circuit 202.

[0074] exist Figure 3 In the illustrated embodiment, the integrated circuit 202 is mounted on the substrate 201 and bonded to the substrate 201 via a flip-chip connection, providing a stable electrical connection and reducing connection impedance. Figure 2 The difference is that this embodiment uses an underfill method instead of molding. The underfill covering material 206 is used to fill the gap between the integrated circuit 202 and the substrate 201 to enhance mechanical strength and provide protection, but does not cover the back side of the integrated circuit 202, thus exposing the back side of the integrated circuit 202 for easy heat conduction. In one embodiment, after underfilling without molding, the back side of the integrated circuit 202 is exposed, and the underfill covers all the bonding materials 207 between the integrated circuit 202 and the substrate 201 with the covering material.

[0075] Inductor 204 is positioned above integrated circuit 202, and its lower surface is directly connected to the exposed back surface of integrated circuit 202, forming a heat dissipation connection area. This direct connection design ensures unobstructed heat dissipation and avoids additional thermal resistance that might be introduced by molding. Bond 207 is located between integrated circuit 202 and substrate 201, ensuring a stable electrical connection between the two and providing necessary mechanical support when using a primer filler.

[0076] In this embodiment, the underfill provides side and bottom protection for the integrated circuit 202 while allowing the back of the integrated circuit 202 to remain exposed, maximizing heat dissipation. This design further improves the heat dissipation performance of the integrated package structure 30 and reduces the volume occupied by molding, resulting in a more miniaturized and efficient overall structure. This configuration of the present invention offers advantages in effective heat dissipation, stability, and space utilization, making it suitable for high power density and miniaturized electronic packaging applications.

[0077] Figure 4 This shows a cross-sectional schematic diagram of another embodiment of the integrated package structure 40 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 2 The difference in the embodiments lies in the type design of the coupling 207 to accommodate different process requirements and electrical connection characteristics.

[0078] exist Figure 4In the illustrated embodiment, the integrated circuit 202 is mounted on the substrate 201 and bonded to the substrate 201 via a flip-chip connection. To achieve a stable electrical and mechanical connection, the bonding element 207 employs a structure with at least one solder ball, replacing... Figure 2 The metal pillars or copper-copper bonding shown are solder balls. Solder balls have good conductivity and moderate elasticity, which helps buffer stress between the substrate 201 and the integrated circuit 202 and provides a stable electrical connection, making them particularly suitable for packaging structures with high reliability requirements.

[0079] In this embodiment, the bonding material 207 between the integrated circuit 202 and the substrate 201 is covered by a covering material 206. The covering material 206 can be applied using an underfill or molding method to protect the bonding area and improve the overall package stability. The covering material 206 fills the gap between the integrated circuit 202 and the substrate 201, providing mechanical support and preventing interference from environmental factors.

[0080] Furthermore, the inductor 204 is positioned above the integrated circuit 202, with its lower surface 204a directly connected to the exposed back surface 202a of the integrated circuit 202, forming a heat dissipation connection area. This direct connection between the lower surface 204a of the inductor and the back surface 202a of the integrated circuit 202 provides an efficient heat conduction path, contributing to improved heat dissipation of the integrated circuit 202. Since solder balls also have good thermal conductivity, this embodiment achieves excellent heat dissipation performance and stable electrical connections.

[0081] In this embodiment, the integrated package structure 40 uses solder balls as connectors 207, providing not only reliable electrical connections but also contributing to better mechanical stability, making it suitable for applications requiring durability and heat dissipation. This design maintains the compactness and stability of the package structure while meeting electrical and thermal management requirements.

[0082] Figure 5 This shows a cross-sectional schematic diagram of another embodiment of the integrated package structure 50 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 2 The main difference in the embodiment shown lies in the structural design of the inductor 204. Figure 2 The inductor 204 is an exposed magnetic material type, while... Figure 5 In this design, the inductor 204 is metal-clad, which further enhances its heat dissipation and protection characteristics.

[0083] exist Figure 5In the illustrated embodiment, inductor 204 comprises magnetic material 2041 and a metal-clad sheet 2042. The metal-clad sheet 2042 completely or partially covers the magnetic material 2041, providing additional mechanical protection and a more efficient heat conduction path. The lower part of inductor 204 is designed such that the back surface 202a of integrated circuit 202 is partially connected to the magnetic material 2041 and partially connected to the metal-clad sheet 2042, achieving a balance between heat dissipation and electrical isolation performance. This structural design allows heat to be effectively conducted from integrated circuit 202 to the magnetic material 2041 and the metal-clad sheet 2042 of inductor 204, and further dissipated through the metal-clad sheet 2042.

[0084] This embodiment can also adjust the connection configuration as needed. In some embodiments, the back surface 202a of the integrated circuit 202 may be connected only to the magnetic material 2041 to emphasize electrical isolation; or only to the cladding metal sheet 2042 to further enhance heat dissipation performance. This flexible design choice can adapt to different application requirements and be adjusted according to the system's heat dissipation requirements and electrical isolation requirements.

[0085] The integrated circuit 202 is flip-chip mounted on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 may include metal pillars, solder balls, or copper-copper bonding, providing stable electrical connection and mechanical support. In this embodiment, the covering material 206 is used to protect the bonding area from environmental interference while maintaining the mechanical stability between the integrated circuit 202 and the substrate 201.

[0086] Overall, the integrated package structure 50, through the metal-clad design of the inductor 204, not only enhances the effectiveness of the heat dissipation path but also improves the mechanical strength of the inductor 204, making it suitable for high power density and high reliability applications. This design provides high structural flexibility while ensuring good thermal conductivity and mechanical stability to meet diverse heat dissipation and electrical isolation requirements.

[0087] Figure 6 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 60 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 2 The different embodiments are mainly due to the structural form of the inductor 204. Figure 2 The inductor 204 is an exposed magnetic material type, while Figure 6 The inductor 204 in the middle adopts a metal embedded design, which further enhances the mechanical strength and heat dissipation performance of the inductor.

[0088] In this embodiment, the inductor 204 includes a magnetic material 2041 and a frame 2043 embedded within the magnetic material 2041. The frame 2043 is made of a metallic material with a high thermal conductivity, providing additional heat conduction pathways. The structure of the frame 2043 includes a top plate 20431, a bottom plate 20432, and at least one vertical frame 20433 between the top plate 20431 and the bottom plate 20432. This design forms a robust embedded frame structure, enabling the inductor 204 to maintain a high inductance value while possessing better heat dissipation and stability.

[0089] Magnetic material 2041 is the primary material providing the inductance value and can be used to cover the lower part of the inductor 204 with frame 2043. In this embodiment, the metal portion of frame 2043 effectively conducts heat away from the inside of the inductor 204, particularly through the structure of top plate 20431, bottom plate 20432, and vertical frame 20433, which efficiently dissipates heat to the surrounding environment. In the lower part of the inductor 204, magnetic material 2041 is directly connected to the back surface 202a of integrated circuit 202, forming a direct heat conduction path, thereby ensuring that the heat from integrated circuit 202 can be quickly transferred to the inductor 204 for heat dissipation.

[0090] The integrated circuit 202 is flip-chip mounted on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 can be a metal pillar, solder ball, or copper-copper bonding method to ensure electrical stability and mechanical support between the integrated circuit 202 and the substrate 201. In this embodiment, the covering material 206 fills the space between the integrated circuit 202 and the substrate 201, protecting the bonding area from external environmental interference and providing mechanical strength.

[0091] The integrated package structure 60 of this embodiment, through the design of the metal-embedded inductor 204, not only enhances the mechanical strength and heat dissipation capacity of the inductor but also provides highly stable inductance characteristics. The embedded structure of the frame 2043 allows for effective heat dissipation of the inductor 204 while maintaining direct connection between the magnetic material 2041 and the back surface 202a of the integrated circuit 202, making it suitable for high power density applications with stringent heat dissipation requirements. This design ensures efficient heat dissipation while also improving the overall stability and reliability of the package structure.

[0092] Figure 7 This shows a cross-sectional schematic diagram of another embodiment of the integrated package structure 70 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 6 The illustrated embodiment also features a metal-embedded inductor 204 design, but the two differ in details. Figure 7In one embodiment, the metal base plate 20432 of the inductor 204 is exposed on the lower surface 204a of the inductor and is connected to the back surface 202a of the integrated circuit 202, forming a direct heat conduction path. While... Figure 6 In one embodiment, the back surface 202a of the integrated circuit 202 is connected to the magnetic material 2041.

[0093] In this embodiment, the inductor 204 comprises a magnetic material 2041 and a frame 2043, the frame 2043 being made of a metallic material with a high thermal conductivity. The frame 2043 includes a top plate 20431, a bottom plate 20432, and a vertical frame 20433 between the top plate 20431 and the bottom plate 20432. This design provides a stable structure that allows the inductor 204 to dissipate heat effectively. The frame 2043 is embedded within the magnetic material 2041, but in this embodiment, the bottom plate 20432 is selectively exposed on the lower surface 204a of the inductor, allowing the bottom plate 20432 to directly connect to the back surface 202a of the integrated circuit 202, thus enhancing thermal conductivity.

[0094] Furthermore, depending on the application requirements, the top plate 20431 of the inductor 204 can be exposed or not exposed on the upper surface 204b of the inductor. If the top plate 20431 is exposed on the upper surface 204b, this design can further enhance the heat dissipation effect, allowing heat to be dissipated from the inductor 204 to the surrounding environment more quickly; while if the top plate 20431 is not exposed on the upper surface 204b, it can provide additional electromagnetic shielding, suitable for application environments with higher requirements for electromagnetic interference.

[0095] The integrated circuit 202 is flip-chip mounted on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 may include metal pillars, solder balls, or copper-copper bonding, providing stable electrical connection and mechanical support. In this embodiment, the covering material 206 fills the space between the integrated circuit 202 and the substrate 201, protecting the bonding area and providing mechanical stability.

[0096] In summary, the integrated packaging structure 70 of this embodiment enhances thermal conductivity through the direct connection between the metal base plate 20432 and the back surface 202a of the integrated circuit 202, while also providing flexible design options. The exposure or non-exposure of the top plate 20431, depending on requirements, can further optimize heat dissipation or electromagnetic shielding performance. This structure is suitable for applications with high heat dissipation and high electromagnetic interference requirements, giving the present invention significant advantages in heat dissipation efficiency, electromagnetic compatibility, and stability.

[0097] Figure 8 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 80 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 2The embodiments shown are similar, but further reveal the thermal conduction connection between inductor 204 and integrated circuit 202 to enhance heat dissipation performance.

[0098] exist Figure 8 In the illustrated embodiment, a thermal interface material (TIM) 208 is disposed between the lower surface 204a of the inductor and the back surface 202a of the integrated circuit 202 to connect the two. The TIM 208 has excellent thermal conductivity, effectively filling the gap between the inductor 204 and the integrated circuit 202, thereby reducing contact thermal resistance and improving thermal conductivity. This design ensures that the heat generated by the integrated circuit 202 during operation can be rapidly transferred to the inductor 204 through the TIM 208 and then dissipated into the external environment.

[0099] In another embodiment, the lower surface 204a of the inductor and the back surface 202a of the integrated circuit 202 can be connected by solder. Solder has higher thermal conductivity, which can further enhance the heat transfer effect. This design is suitable for applications with higher heat dissipation requirements and helps the integrated circuit 202 to operate stably.

[0100] As in other embodiments, the integrated circuit 202 is flip-chip disposed on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 may include metal pillars, solder balls, or copper-copper bonding, providing stable electrical connection and mechanical support. A covering material 206 fills the space between the integrated circuit 202 and the substrate 201, protecting the bonding area and improving structural stability.

[0101] The integrated package structure 80 of this embodiment connects the inductor 204 and the integrated circuit 202 via thermal interface material 208 or solder, which not only enhances the overall heat conduction efficiency but also maintains a stable electrical and mechanical connection. This structural design is suitable for high-power-density electronic applications, effectively improving heat dissipation performance and enhancing the stability and reliability of the integrated circuit.

[0102] Figure 9 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 90 having an inductor and an integrated circuit according to the present invention. This embodiment... Figure 8 Further improvements were made to enhance the overall heat dissipation performance. Figure 8 A thermal interface material 208 is provided between the lower surface 204a of the inductor 204 and the back surface 202a of the integrated circuit 202, while... Figure 9 In the middle, a metal plate 209 is added above the inductor 204 to further optimize the heat dissipation path.

[0103] In this embodiment, a metal plate 209 is disposed above the inductor 204 and connected to the upper surface 204b of the inductor via a thermal interface material 208. The thermal interface material 208 has excellent thermal conductivity, filling the gap between the metal plate 209 and the upper surface 204b of the inductor, thereby reducing thermal resistance and ensuring more efficient heat transfer from the inductor 204 to the metal plate 209. This design allows the heat generated by the inductor 204 during operation to be rapidly transferred to the metal plate 209 and then dissipated to the external environment, improving the heat dissipation efficiency of the packaging structure.

[0104] In another embodiment, the upper surface 204b of the inductor can be connected to the metal plate 209 using solder. The high thermal conductivity of the solder further enhances heat transfer, making it suitable for applications requiring higher heat dissipation efficiency. This design ensures the stability of the inductor 204 under high power density operation, preventing overheating.

[0105] The integrated circuit 202 is flip-chip mounted on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 can be a metal pillar, solder ball, or copper-copper bonding agent, providing stable electrical and mechanical connections. A covering material 206 is filled between the integrated circuit 202 and the substrate 201 to protect the bonding area and improve structural stability.

[0106] In summary, the integrated package structure 90 of this embodiment, by placing a metal plate 209 above the inductor 204 and connecting it using a thermal interface material 208, not only optimizes the heat dissipation path but also further improves the stability and heat dissipation efficiency of the package structure. This design is particularly suitable for electronic applications with high power density and high heat dissipation requirements, effectively improving overall heat dissipation performance and ensuring the stability and reliability of integrated circuits and inductors in high-power operating environments.

[0107] Figure 10 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 100 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 9 Compared to the previous embodiment, the main difference lies in the exposed area of ​​the back surface 202a of the integrated circuit 202 and its connection method with the inductor 204.

[0108] exist Figure 10 In the illustrated embodiment, the back surface 202a of the integrated circuit 202 is not completely exposed, but only partially exposed, and is connected to the lower surface 204a of the inductor via a thermal interface material 208. This partially exposed design allows the back surface 202a of the integrated circuit 202 to be exposed only where heat conduction is required, while other parts are protected by the covering material 206, thereby achieving a balance between thermal conductivity and structural stability.

[0109] The thermal interface material 208 is filled between the exposed portion of the back surface 202a of the integrated circuit 202 and the lower surface 204a of the inductor 204. It possesses excellent thermal conductivity, effectively reducing contact thermal resistance and allowing heat from the integrated circuit 202 to be rapidly conducted to the inductor 204 via the thermal interface material 208, and further dissipated to the external environment. In this embodiment, the thermal interface material 208 is only filled on the partially exposed back surface 202a of the integrated circuit 202. This selective filling design effectively improves heat dissipation efficiency while protecting other areas of the integrated circuit 202 from environmental influences.

[0110] Furthermore, a metal plate 209 is disposed above the inductor 204 and is connected to the upper surface 204b of the inductor via another thermal interface material 208. This thermal interface material 208 provides an efficient heat transfer path from the inductor 204 to the metal plate 209, allowing the heat from the inductor 204 to be rapidly conducted to the metal plate 209 and then dissipated into the external environment, further improving the heat dissipation performance of the integrated package structure 100.

[0111] The integrated circuit 202 is flip-chip mounted on the substrate 201 and electrically connected to the substrate 201 via a bonding agent 207. The bonding agent 207 may include metal pillars, solder balls, or copper-copper bonding to provide stable electrical connection and mechanical support. A covering material 206 fills the space between the integrated circuit 202 and the substrate 201 to protect the bonding area and enhance the stability of the structure.

[0112] Overall, the integrated package structure 100 of this embodiment, through the partially exposed back surface 202a of the integrated circuit 202 and the selective filling with thermal interface material 208, not only achieves good heat conduction but also enhances structural stability. The metal plate 209 further improves the overall heat dissipation capacity, making this design suitable for applications with high power density and high heat dissipation requirements, ensuring the stable operation of the integrated circuit and inductor.

[0113] Figure 11 This diagram shows a cross-sectional view of an embodiment of an integrated package structure comprising an inductor and an integrated circuit according to the present invention. Figure 11 As shown, the integrated package structure 110 with inductor and integrated circuit includes a substrate 201, an integrated circuit 202, and an inductor 204. The substrate 201 has a preset circuit layout for carrying and connecting other electronic components. The substrate 201 can be a printed circuit board (PCB) or a lead frame, which has the function of electrical signal transmission and forms an electrical connection with the integrated circuit 202.

[0114] Integrated circuit 202 is flip-chip mounted on substrate 201, bonding to substrate 201 via flip-chip bonding, providing a stable electrical connection and reducing connection impedance. The backside 202a of integrated circuit 202 is partially or completely exposed after the packaging process to facilitate heat dissipation. The bonding material 207 connecting integrated circuit 202 and substrate 201 is covered by a covering material 206 to protect the electrical connection and prevent external interference. The covering material 206 can be used for packaging using underfill or molding, but it does not cover at least a portion of the backside 202a of integrated circuit 202, leaving the backside exposed to promote heat conduction. In this embodiment, molding is used for packaging, and after molding, the encapsulant on the backside 202a of integrated circuit 202 is ground to expose the backside 202a of integrated circuit 202. Inductor 204 is disposed below substrate 201.

[0115] A metal plate 209 is disposed above the integrated circuit 202, wherein the lower surface 209a of the metal plate 209 is connected to the back surface 202a of the integrated circuit 204, forming a connection area CTA. At least a portion of the connection area CTA between the lower surface 209a of the metal plate and the back surface 202a of the integrated circuit 202 is free of sealant to ensure optimized heat dissipation.

[0116] According to the present invention, the integrated packaging structure 110 of this embodiment can not only effectively enhance the heat dissipation efficiency of the integrated circuit 202, but also reduce the overall space occupied. The covering material 206 is only used to protect the electrical connections on the sides and bottom of the integrated circuit 202, and does not cover the back of the integrated circuit, thereby keeping the heat dissipation path unobstructed and reducing the thermal resistance caused by the use of thermal interface materials or thermal paste.

[0117] like Figure 11 As shown, in one embodiment, the integrated package structure 110 according to the present invention has improved heat dissipation characteristics, enhancing the connection and heat dissipation effect between the metal plate 209 and the integrated circuit 202 through specific technical features. For example, the back surface 202a of the integrated circuit 202 can be optionally without back metal plating (non-BSM), or with back metal plating (BSM) depending on heat dissipation and conductivity requirements, to enhance heat conduction or provide specific electrical connections. This selective design allows the back surface 202a of the integrated circuit 202 to be processed accordingly according to application requirements, thereby further optimizing heat dissipation and electrical performance.

[0118] In one embodiment, the magnetic material within the inductor 204 can be composed of ceramic magnetic materials or soft metallic magnetic materials. Specifically, the magnetic material can be selected from ceramic materials such as nickel-zinc ferrite, manganese-zinc ferrite, or magnesium-copper-zinc ferrite, or soft metallic magnetic materials such as carbon-based iron powder, iron-nickel alloy, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, and amorphous alloy. These magnetic materials not only possess high thermal conductivity, which helps improve the heat dissipation efficiency of the inductor 204, but also have insulating properties, protecting the integrated circuit 202 from electrical interference.

[0119] The bonding element 207 between the integrated circuit 202 and the substrate 201 may include at least one metal pillar, at least one solder ball, or at least one copper-copper bond. These bonding methods provide a stable electrical and mechanical connection between the integrated circuit 202 and the substrate 201, and achieve a balance between electrical connection strength and thermal conductivity according to the requirements of the package structure. This design ensures a stable connection between the integrated circuit 202 and the substrate 201, and achieves good electrical conductivity and heat dissipation.

[0120] The inductor 204 can be configured in different ways, such as with exposed magnetic material, metal-clad, or metal-embedded structures. Figure 11 In the illustrated embodiment, the inductor 204 is in the form of exposed magnetic material. The inductor 204 can also be metal-clad or metal-embedded, as described in the references below. Figure 5 and Figure 6 The embodiments shown are not described in detail here.

[0121] In one embodiment, the lower surface 209a of the metal plate can be connected to the back surface 202a of the integrated circuit 202 via thermal interface material (TIM) 208 or solder. The TIM 208 provides an efficient heat transfer path while ensuring a stable connection between the metal plate 209 and the integrated circuit 202, thereby reducing heat dissipation resistance and improving heat dissipation efficiency. This design optimizes heat dissipation performance while ensuring connection stability.

[0122] In one embodiment, the back surface 202a of the integrated circuit 202 may be partially or completely exposed to facilitate connection with the lower surface 209a of the metal plate. By exposing the back surface 202a of the integrated circuit 202, the present invention effectively enhances heat dissipation efficiency and reduces thermal resistance introduced by the use of sealant or other materials. This design ensures unobstructed heat dissipation paths and significantly improves the performance of the integrated circuit 202 in applications with high heat dissipation requirements.

[0123] Figure 12 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 120 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 11The main difference in the illustrated embodiment is the packaging method of the integrated circuit 202.

[0124] exist Figure 12 In the illustrated embodiment, the integrated circuit 202 is mounted on the substrate 201 and bonded to the substrate 201 via a flip-chip connection, providing a stable electrical connection and reducing connection impedance. Figure 11 The difference is that this embodiment uses an underfill method instead of molding. The underfill coating material 206 is used to fill the gap between the integrated circuit 202 and the substrate 201 to enhance mechanical strength and provide protection, but does not cover the back surface 202a of the integrated circuit 202, thereby exposing the back surface 202a of the integrated circuit 202 for easy heat conduction.

[0125] In this embodiment, the underfill provides side and bottom protection for the integrated circuit 202 while allowing the back of the integrated circuit 202 to remain exposed, maximizing heat dissipation. This design further improves the heat dissipation performance of the integrated package structure 120 and reduces the volume occupied by molding, resulting in a more compact and efficient overall structure. This configuration of the present invention offers advantages in effective heat dissipation, stability, and space utilization, making it suitable for high power density and miniaturized electronic packaging applications.

[0126] Figure 13 This shows a cross-sectional schematic diagram of another embodiment of an integrated package structure 130 having an inductor and an integrated circuit according to the present invention. This embodiment is similar to... Figure 11 Compared to the previous embodiment, the main difference lies in the exposed area of ​​the back surface 202a of the integrated circuit 202 and its connection method with the metal plate 209.

[0127] exist Figure 13 In the illustrated embodiment, the back surface 202a of the integrated circuit 202 is not completely exposed, but only partially exposed, and is connected to the lower surface 209a of the metal plate via a thermal interface material 208. This partially exposed design allows the back surface 202a of the integrated circuit 202 to be exposed only where heat conduction is required, while other parts are protected by the covering material 206, thereby achieving a balance between thermal conductivity and structural stability.

[0128] The thermal interface material 208 is filled between the exposed portion of the back surface 202a of the integrated circuit 202 and the lower surface 204a of the inductor 204. It possesses excellent thermal conductivity, effectively reducing contact thermal resistance and allowing heat from the integrated circuit 202 to be rapidly conducted to the inductor 204 via the thermal interface material 208, and further dissipated to the external environment. In this embodiment, the thermal interface material 208 is only filled on the partially exposed back surface 202a of the integrated circuit 202. This selective filling design effectively improves heat dissipation efficiency while protecting other areas of the integrated circuit 202 from environmental influences.

[0129] Figure 14A , Figure 14B and Figure 14C A perspective view shows a method for manufacturing an integrated package structure 50 incorporating an inductor and an integrated circuit according to the present invention. This embodiment is related to... Figure 5 The corresponding cross-sectional view reveals the manufacturing steps and related features of the packaging structure.

[0130] First, such as Figure 14A As shown, and also refer to Figure 5 The manufacturing method begins by placing an integrated circuit 202 on a substrate 201, and the integrated circuit 202 is bonded to the substrate 201 in a flip-chip manner. Wherein, such as Figure 5 As shown, connector 207 connects integrated circuit 202 to substrate 201. Substrate 201 has a preset circuit layout for mounting and connecting other electronic components, such as... Figure 14A The passive component 203 is shown. The substrate 201 can be a printed circuit board (PCB) or a lead frame, providing electrical signal transmission and forming an electrical connection with the integrated circuit 202. Additionally, riser pillars 205 (e.g., copper pillars) are provided to increase the connection height between the inductor 204 and the substrate 201, particularly useful when the leads of the inductor 204 are not long enough. The riser pillars 205 are not essential components and can be used selectively depending on different design requirements in practical applications.

[0131] Next, as Figure 14B As shown, and also refer to Figure 5After the integrated circuit 202 is molded, its back surface 202a is ground to expose the back surface 202a of the integrated circuit 202 and the upper surface 205a of the shim pillar 205. This step can be performed by molding or underfilling, the purpose of which is to partially expose the back surface 202a of the integrated circuit 202, thereby improving thermal conductivity. Simultaneously, the bonding material 207 connecting the integrated circuit 202 and the substrate 201 is covered by a covering material 206 to protect the electrical connection area and prevent interference from the external environment. The covering material 206 can be implemented by underfilling or molding, but it is necessary to ensure that at least a portion of the back surface 202a of the integrated circuit 202 remains exposed to facilitate subsequent thermal management.

[0132] Finally, as Figure 14C As shown, and also refer to Figure 5 An inductor 204 is disposed above the integrated circuit 202 to form an integrated package structure. The lower surface 204a of the inductor 204 is connected to the back surface 202a of the integrated circuit 202 in a connection area CTA, where at least a portion is free of encapsulant to ensure the effectiveness of the heat conduction path. The inductor 204 comprises a magnetic material 2041 and a metal-clad sheet 2042. In this embodiment, the inductor 204 is in the form of a metal-clad type, and the metal-clad sheet 2042 is connected to the back surface 202a of the integrated circuit 202. This design enhances heat conduction performance and further improves the heat dissipation effect of the integrated circuit.

[0133] In other embodiments, the inductor 204 may be in the form of, for example... Figure 2 The magnetic material shown is exposed or as shown Figure 6 The metal-embedded design shown is adapted to meet different heat dissipation and electromagnetic interference requirements. This embodiment, through the above design, ensures that the integrated package structure 50 has efficient heat dissipation capabilities and electrical stability, making it particularly suitable for high-power-density electronic applications.

[0134] Figure 15A , Figure 15B and Figure 15C A cross-sectional schematic diagram is shown illustrating a method for manufacturing an integrated package structure 110 incorporating an inductor and an integrated circuit according to the present invention. This embodiment is related to... Figure 11 The corresponding cross-sectional view reveals the manufacturing steps and related features of the packaging structure.

[0135] First, such as Figure 15A As shown, and also refer to Figure 11The manufacturing method begins by placing an integrated circuit 202 on a substrate 201, with the integrated circuit 202 bonded to the substrate 201 in a flip-chip manner. A bonding agent 207 connects the integrated circuit 202 and the substrate 201. The substrate 201 has a predetermined circuit layout for carrying and connecting other electronic components. The substrate 201 can be a printed circuit board (PCB) or a lead frame, providing electrical signal transmission functionality and forming an electrical connection with the integrated circuit 202.

[0136] Next, as Figure 14B As shown, and also refer to Figure 11 After the integrated circuit 202 is molded, its back surface 202a is ground to expose it. This step can be performed by molding or underfilling, the purpose of which is to partially expose the back surface 202a of the integrated circuit 202, thereby improving thermal conductivity. Simultaneously, the bonding material 207 connecting the integrated circuit 202 and the substrate 201 is covered by a covering material 206 to protect the electrical connection area and prevent interference from the external environment. The covering material 206 can be implemented by underfilling or molding, but it is necessary to ensure that at least a portion of the back surface 202a of the integrated circuit 202 remains exposed to facilitate subsequent thermal management.

[0137] Next, as Figure 15C As shown, and also refer to Figure 11 A metal plate 209 is disposed above the integrated circuit 202. The lower surface 209a of the metal plate 209 is connected to the back surface 202a of the integrated circuit 204, forming a connection area CTA. At least a portion of the connection area CTA between the lower surface 209a of the metal plate and the back surface 202a of the integrated circuit 202 is free of sealant to ensure optimized heat dissipation.

[0138] Next, as Figure 15D As shown, and also refer to Figure 11 An inductor 204 is disposed below and connected to the substrate 201. The inductor 204 includes a magnetic material 2041. In this embodiment, the inductor 204 is in the form of an exposed magnetic material.

[0139] In other embodiments, the inductor 204 may be in the form of, for example... Figure 5 The metal-clad type shown or as Figure 6 The metal-embedded design shown is adapted to meet different heat dissipation and electromagnetic interference requirements. Through the above design, this embodiment ensures that the integrated package structure 110 has efficient heat dissipation capabilities and electrical stability, making it particularly suitable for high-power-density electronic applications.

[0140] The present invention has been described above with reference to embodiments. However, the above description is only intended to facilitate understanding of the invention by those skilled in the art and is not intended to limit the scope of the invention. Various equivalent variations can be conceived by those skilled in the art within the same spirit of the invention. For example, the number of integrated circuits on the lead frame may differ from that shown in the drawings, the passive components may be placed in a different order, or the shape of the electronic components may differ from that shown in the drawings. The scope of the present invention should cover the above and all other equivalent variations.

Claims

1. An integrated package structure comprising an inductor and an integrated circuit, comprising: A substrate having a pre-defined circuit layout; An integrated circuit is disposed on the substrate and is flip-chip bonded to the substrate. A bonding agent between the integrated circuit and the substrate is covered by a covering material, wherein one back side of the integrated circuit is exposed. An inductor is disposed above the integrated circuit, wherein a lower surface of the inductor is connected to the back surface of the integrated circuit to form a connection area, wherein at least a portion of the connection area is free of sealant.

2. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, After the integrated circuit is molded, the sealant on its back is ground to expose the back side of the integrated circuit.

3. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, The back side of the integrated circuit is exposed after being filled with adhesive and formed without molding.

4. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, The back side of the integrated circuit may be without back metal plating or have back metal plating.

5. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, The substrate includes a lead frame or a printed circuit board.

6. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, A magnetic material that provides inductance values ​​includes ceramic magnetic materials or soft metallic magnetic materials. The ceramic magnetic materials include nickel-zinc ferrite, manganese-zinc ferrite, or magnesium-copper-zinc ferrite. The soft metallic magnetic materials include carbon-based iron powder, iron-nickel alloy, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, or amorphous alloy.

7. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, The joint includes at least one metal post, at least one solder ball, or at least one copper-copper joint.

8. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, The inductor can be in the form of exposed magnetic material or embedded metal.

9. The integrated package structure with inductor and integrated circuit as described in claim 8, wherein, When the inductor is in the form of an exposed magnetic material, a magnetic material providing the inductance value is connected to the back side of the integrated circuit.

10. The integrated package structure having an inductor and an integrated circuit as described in claim 8, wherein, When the inductor is in the form of a metal inlay, a magnetic material or a frame on the outside of the inductor is connected to the back side of the integrated circuit.

11. The integrated package structure having an inductor and an integrated circuit as described in claim 1, wherein, The lower surface of the inductor is connected to the back side of the integrated circuit via a thermal interface material or a solder.

12. The integrated package structure with inductor and integrated circuit as described in claim 1, wherein, A metal plate is provided above the inductor, and the metal plate is connected to the upper surface of the inductor through a thermal interface material or a solder.

13. The integrated package structure having an inductor and an integrated circuit as described in claim 1, wherein, The exposed portion or the entire back side of the integrated circuit is connected to the lower surface of the inductor.

14. An integrated package structure comprising an inductor and an integrated circuit, comprising: A substrate having a pre-defined circuit layout; An integrated circuit is disposed on the substrate and is flip-chip bonded to the substrate. A bonding agent that bonds the integrated circuit to the substrate is covered by a covering material, wherein the integrated circuit exposes a back side of the integrated circuit. A metal plate is disposed above the integrated circuit, wherein a lower surface of the metal plate is connected to the back surface of the integrated circuit, and at least a portion of a connection area between the lower surface of the metal plate and the back surface of the integrated circuit is free of sealant. as well as An inductor is disposed below the substrate and connected to the substrate.

15. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The form in which the coating material covers the joint includes: primer filling or molding.

16. The integrated package structure having an inductor and an integrated circuit as described in claim 15, wherein, After the integrated circuit is molded, the sealant on its back is ground to expose the back of the integrated circuit.

17. The integrated package structure having an inductor and an integrated circuit as described in claim 15, wherein, When the integrated circuit is filled with adhesive and not molded, the back side of the integrated circuit is exposed.

18. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The back side of the integrated circuit may be without back metal plating or have back metal plating.

19. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The substrate includes a lead frame or a printed circuit board.

20. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The magnetic material providing the inductance value includes ceramic magnetic materials or soft metallic magnetic materials. The ceramic magnetic materials include nickel-zinc ferrite, manganese-zinc ferrite, and magnesium-copper-zinc ferrite. The soft metallic magnetic materials include carbon-based iron powder, iron-nickel alloy, iron-silicon alloy, iron-silicon-aluminum alloy, iron-silicon-chromium alloy, or amorphous alloy.

21. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The joint includes at least one metal post, at least one solder ball, or at least one copper-copper joint.

22. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The inductor can be in the form of exposed magnetic material or embedded metal.

23. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The lower surface of the metal plate is connected to the back side of the integrated circuit via a thermal interface material.

24. The integrated package structure having an inductor and an integrated circuit as described in claim 14, wherein, The exposed portion or the entire back side of the integrated circuit is connected to the lower surface of the metal plate.

25. A method for manufacturing an integrated package structure comprising an inductor and an integrated circuit, comprising: Provide an integrated circuit; The integrated circuit is disposed on a substrate, and the integrated circuit is bonded to the substrate in a flip-chip manner; After the integrated circuit is molded, the encapsulant on its back side is ground, or the integrated circuit is not molded but a base filler is applied to expose one back side of the integrated circuit; and An inductor is disposed above the integrated circuit, wherein a lower surface of the inductor is connected to the back surface of the integrated circuit to form a connection area, wherein at least a portion of the connection area is free of sealant.

26. The manufacturing method of the integrated package structure having an inductor and an integrated circuit as described in claim 25, wherein, The inductor can be in the form of exposed magnetic material or embedded metal.

27. The manufacturing method of the integrated package structure having an inductor and an integrated circuit as described in claim 26, wherein, When the inductor is in the form of an exposed magnetic material, a magnetic material providing the inductance value is connected to the back side of the integrated circuit.

28. The manufacturing method of the integrated package structure having an inductor and an integrated circuit as described in claim 26, wherein, When the inductor is in the form of a metal inlay, a magnetic material or a frame on the outside of the inductor is connected to the back side of the integrated circuit.

29. A method for manufacturing an integrated package structure comprising an inductor and an integrated circuit, comprising: Provide an integrated circuit; The integrated circuit is disposed on a substrate, and the integrated circuit is bonded to the substrate in a flip-chip manner; After the integrated circuit is molded, the encapsulant on its back is ground, or the integrated circuit is not molded, but an underfill is applied to the integrated circuit to expose one back side of the integrated circuit; A metal plate is disposed above the integrated circuit, wherein the lower surface of an inductor on the metal plate is connected to the back surface of the integrated circuit to form a connection area, wherein at least a portion of the connection area is free of sealant; and An inductor is placed under the substrate and connected to the substrate.

30. The manufacturing method of the integrated package structure having an inductor and an integrated circuit as described in claim 29, wherein, The inductor can be in the form of exposed magnetic material or embedded metal.

31. The manufacturing method of the integrated package structure having an inductor and an integrated circuit as described in claim 29, wherein, The lower surface of the metal plate is connected to the back side of the integrated circuit via a thermal interface material.

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