Functional board and medical detection equipment

Abstract

The invention discloses a functional board and medical detection equipment, the functional board comprises a glass substrate, a sensing layer and an electrode layer, and the glass substrate is internally provided with an accommodating cavity; the sensing layer is arranged in the accommodating cavity; the electrode layer is arranged on the surface of at least one side of the glass substrate, and the sensing layer is electrically connected with the electrode layer. Therefore, by embedding the sensing layer in the accommodating cavity of the glass substrate, on one hand, occupation of the sensing layer on the surface space of the glass substrate can be reduced, flexible arrangement of structures such as an electrode layer on the surface of the glass substrate is facilitated, the overall thickness of the functional board can also be reduced, and light, thin and integrated development of the functional board is facilitated; and on the other hand, the embedded sensing layer can also prevent the solution from flowing through the sensing layer to cause corrosion and even failure to the sensing layer, so that the sensing reliability of the sensing layer can be ensured.

Description

Technical Field

[0001] This invention belongs to the field of medical testing technology. Specifically, this invention relates to a functional board and a medical testing device. Background Technology

[0002] In the field of medical testing, electrode detection is a crucial means of realizing many detection functions, and its performance is of paramount importance. The functional board on which the electrodes are placed serves as the basic carrier for electrode detection, and its reliability directly affects the accuracy of the test results.

[0003] Currently, FR4 circuit boards are commonly used as functional boards for setting electrodes. Thermistors are first soldered onto the FR4 circuit board using solder paste, and then the board is heated and cured in a reflow oven. This setup means that during the testing process, the solution also flows through the thermistor, which poses a high risk of thermistor failure after multiple tests. Summary of the Invention

[0004] One objective of this invention is to provide a new technical solution for a functional board and a medical testing device.

[0005] According to a first aspect of the present invention, a functional board is provided for a medical testing device, comprising:

[0006] A glass substrate having a receiving cavity inside;

[0007] A sensing layer is disposed in the receiving cavity;

[0008] An electrode layer is disposed on at least one side surface of the glass substrate, and the sensing layer is electrically connected to the electrode layer.

[0009] Optionally, it further includes an insulating layer disposed on at least one side surface of the glass substrate, the insulating layer having a first electrical connection hole, one side of the first electrical connection hole being electrically connected to the electrode layer, and the other side of the first electrical connection hole being electrically connected to the sensing layer.

[0010] Optionally, at least the wall of the first electrical connection hole is provided with a copper layer.

[0011] Optionally, it further includes a heating layer disposed within the insulating layer, and the sensing layer includes a temperature sensor.

[0012] Optionally, the heating layer and the temperature sensor are connected at the same height as the insulating layer;

[0013] And / or, the distance between the heating layer and the temperature sensor is 300-2000μm.

[0014] Optionally, the sensing layer includes a temperature sensor.

[0015] Optionally, it also includes a solder resist layer, which is disposed on the surface of the glass substrate and exposes a portion of the electrode layer.

[0016] Optionally, it also includes a detection hole that penetrates the solder resist layer and the glass substrate.

[0017] Optionally, a second electrical connection hole is formed on the glass substrate, and the electrode layers are respectively provided on both sides of the glass substrate, with the second electrical connection hole connecting between the two opposing electrode layers.

[0018] Optionally, the thickness of the glass substrate is 0.1-5.0 mm, and the flatness of the glass substrate is 0.01-0.50 mm / m.

[0019] Optionally, the glass substrate has a glass transition temperature of 530-660°C and a coefficient of thermal expansion of 3.0-3.6 ppm / °C.

[0020] According to a second aspect of the present invention, a medical testing device is provided, comprising the functional board described in the first aspect.

[0021] One technical advantage of this invention is that:

[0022] By embedding the sensing layer within the cavity of the glass substrate, on the one hand, the space occupied by the sensing layer on the surface of the glass substrate can be reduced, which facilitates the flexible arrangement of structures such as the electrode layer on the surface of the glass substrate. It can also reduce the overall thickness of the functional board, which is conducive to the development of the functional board towards thinner and more integrated designs. On the other hand, the embedded sensing layer can also prevent the solution from flowing through the sensing layer and causing corrosion or even failure, thereby ensuring the sensing reliability of the sensing layer.

[0023] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0025] Figure 1 A schematic diagram of a functional board provided in one embodiment of the present invention;

[0026] Figure 2 Another schematic diagram of a functional board provided in one embodiment of the present invention.

[0027] The components are: 1. Glass substrate; 11. Second electrical connection hole; 2. Sensing layer; 3. Electrode layer; 4. Insulating layer; 41. First electrical connection hole; 5. Heating layer; 6. Solder resist layer; 7. Detection hole; 8. Housing. Detailed Implementation

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0029] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0034] In related technologies, FR4 circuit boards are commonly used as functional boards for setting electrodes. However, FR4 circuit boards are prone to deformation, which directly affects the structural stability of the electrodes and the accurate acquisition of detection signals.

[0035] like Figure 1 and Figure 2 As shown, the functional board provided in this application includes:

[0036] A glass substrate 1, wherein the glass substrate 1 has a receiving cavity;

[0037] Sensing layer 2, wherein the sensing layer 2 is disposed in the receiving cavity;

[0038] Electrode layer 3 is disposed on at least one side surface of the glass substrate 1, and the sensing layer 2 is electrically connected to the electrode layer 3.

[0039] like Figure 1 and Figure 2 As shown, the glass substrate 1 serves as the supporting structure for the functional plate. Made of glass, its high flatness ensures the consistency of the solution volume contacted by the electrodes on the functional plate surface, thereby guaranteeing the accuracy of electrode testing. Therefore, the high flatness of the glass substrate 1 contributes to improving the accuracy and reliability of medical testing equipment.

[0040] In addition, the glass substrate 1 also has good acid and alkali resistance, high temperature resistance and good mechanical strength, which enables the functional board to work stably under extreme conditions, and the functional board also has good impact resistance.

[0041] In one embodiment, an anti-fouling coating can be provided on the surface of the glass substrate 1 to reduce non-specific adsorption, so that the functional plate can be used for biological sample analysis such as blood testing.

[0042] In one embodiment, through-hole glass technology can be used to vertically stack multiple glass substrates 1, further increasing the integration density of the functional board. For example, the functional board may include two glass substrates 1, one of which has a biosensing layer embedded in it, and the other has a microfluidic layer embedded in it, to enrich the detection functions of the functional board.

[0043] The receiving cavity can be formed by laser etching or wet etching to accommodate the sensing layer 2, so that the sensing layer 2 is embedded inside the glass substrate 1 rather than connected to the surface of the glass substrate 1. By adjusting the laser etching parameters, receiving cavities of different shapes and sizes, such as circular, rectangular, and annular, can be formed to accommodate various sensing layers 2.

[0044] This configuration has several advantages. First, it reduces the space occupied by the sensing layer 2 on the surface of the glass substrate 1, facilitating the flexible arrangement of structures such as the electrode layer 3 on the surface of the glass substrate 1. It also reduces the overall thickness of the functional board, contributing to the development of thinner and more integrated functional boards. Second, the embedded sensing layer 2 can prevent the solution from flowing through it and causing corrosion or even failure, thus ensuring the sensing reliability of the sensing layer 2.

[0045] Furthermore, embedding the sensing layer 2 within the cavity of the glass substrate 1 avoids interference from external environmental factors such as humidity and mechanical stress, significantly improving the signal-to-noise ratio of the sensing signal.

[0046] The electrode layer 3 includes at least one test electrode, which is the part of the functional plate that is in direct contact with the solution to be tested. The electrode layer 3 can convert chemical signals in the solution into electrical signals for transmission.

[0047] The materials of electrode layer 3 include, but are not limited to, indium tin oxide, gold, copper, and aluminum. Depending on the actual testing requirements, electrode layer 3 can be disposed on one side of the glass substrate 1 or on both sides of the glass substrate 1.

[0048] like Figure 1 and Figure 2 As shown, the electrical connection between the sensing layer 2 and the electrode layer 3 can be achieved through gold wire bonding and welding, or through drilling and electroplating. This allows the sensing layer 2 to detect signals such as temperature, current, and pressure of the solution flowing through the electrode layer 3 and convert them into corresponding electrical signals.

[0049] This configuration allows for an electrical connection between the sensing layer 2 and the electrode layer 3. On one hand, the sensing layer 2 can quickly and accurately detect minute changes in heat, pressure, or current generated during the reaction between the solution and the electrode layer 3, enabling the functional plate to reliably detect the composition and content of the solution. On the other hand, corresponding to the electrode layers 3 coated with recognition enzymes, the sensing layer 2 can work in conjunction with these electrode layers 3 to detect the composition and content of the solution, exhibiting fast response and high sensitivity.

[0050] Optionally, an insulating layer 4 is included, which is disposed on at least one side surface of the glass substrate 1. The insulating layer 4 has a first electrical connection hole 41, one side of which is electrically connected to the electrode layer 3, and the other side of which is electrically connected to the sensing layer 2.

[0051] like Figure 1 and Figure 2 As shown, the insulating layer 4 is a layer structure formed by insulating materials, including but not limited to inorganic materials such as silicon oxide, silicon nitride, silicon dioxide, and silicon oxynitride, as well as polymers such as polyimide and parylene. The insulating layer 4 ensures the insulation of the sensing layer 2, thereby ensuring that the sensing layer 2 can work normally and stably.

[0052] In one embodiment, an insulating layer 4 can be formed on one side surface of the glass substrate 1, and an electrode layer 3 can be formed on the side of the insulating layer 4 away from the glass substrate 1. The electrode layer 3 and the sensing layer 2 on both sides of the insulating layer 4 are electrically connected by a gold wire bonding process or a drilling and electroplating process.

[0053] In one embodiment, insulating layers 4 can be respectively provided on both sides of the glass substrate 1 to form a structure in which the glass substrate 1 is sandwiched between two insulating layers 4. In this case, both insulating layers 4 can be electrically connected to the sensing layer 2, thereby accommodating the design of the sensing layer 2 with multiple sensors and also helping to enhance the detection capability of the functional board.

[0054] Optionally, at least the wall of the first electrical connection hole 41 is provided with a copper layer.

[0055] Specifically, the electrical connection between the sensing layer 2 and the electrode layer 3 can be achieved through a drilling and copper plating process. That is, a through-hole is first etched into the insulating layer 4 using laser etching, and then a copper layer is deposited on the inner wall of the through-hole using electroplating to form the first electrical connection hole 41. In this way, the sensing layer 2 can detect signals such as the temperature, current, and pressure of the solution flowing through the electrode layer 3 and convert them into corresponding electrical signals.

[0056] The copper layer needs to extend to the electrode layer 3 in order to form an electrical connection.

[0057] Among them, the through holes etched by laser etching process are usually vertical through holes. The electrode layer 3 is directly connected to the sensing layer 2 through the vertical through holes and the sidewall coating, which reduces parasitic resistance and capacitance, thereby reducing signal transmission loss.

[0058] In one embodiment, the through-hole etched by laser etching can be filled with a copper layer to ensure a good and stable electrical connection.

[0059] Optionally, it also includes a heating layer 5 disposed within the insulating layer 4, and the sensing layer 2 includes a temperature sensor.

[0060] like Figure 1 and Figure 2 As shown, the heating layer 5 is connected to the surface of the glass substrate 1 and embedded within the insulating layer 4. This allows the insulating layer 4 to cover the heating layer 5 and isolate the heat generated by the heating layer 5 during heating, preventing damage to the electrode layer 3 on the side of the insulating layer 4 away from the glass substrate 1. This improves the reliability of the functional board. The heating layer 5 includes, but is not limited to, heating wires and heating tubes.

[0061] When using this functional board for detection, the heating layer 5 can be heated to the required temperature to meet the detection needs. That is, on the one hand, the temperature sensor can detect the heat change generated by the reaction between the solution flowing through the electrode layer 3 and the electrode layer 3, and convert it into a corresponding electrical signal, thereby detecting the composition and content of the solution; on the other hand, the temperature sensor can also be used as a temperature feedback element in conjunction with the heating layer 5 to achieve precise temperature control, thereby ensuring that the reaction between the solution and the electrode layer 3 can take place at the optimal temperature, thus improving the detection performance of the functional board.

[0062] Optionally, the heating layer 5 and the temperature sensor are connected at the same height as the insulating layer 4;

[0063] And / or, the distance between the heating layer 5 and the temperature sensor is 300-2000μm.

[0064] like Figure 1 and Figure 2 As shown, the heating layer 5 is connected to the lower surface of the insulating layer 4 and faces upwards, while the temperature sensor is connected to the lower surface of the insulating layer 4 and faces downwards. By connecting the heating layer 5 and the temperature sensor to the same surface of the insulating layer 4, the distance between them can be shortened, thereby improving the temperature measurement accuracy of the temperature sensor and facilitating temperature control.

[0065] In one embodiment, the distance between the heating layer 5 and the temperature sensor can be set to a range of 300-2000μm. This can shorten the distance between the heating layer 5 and the temperature sensor, thereby improving the temperature measurement accuracy of the temperature sensor, while avoiding damage to the heating layer 5 caused by the etching of the cavity inside the glass substrate 1. It also helps with the circuit layout inside the glass substrate 1, thereby improving the structural reliability of the functional board.

[0066] Optionally, the sensing layer 2 includes a temperature sensor.

[0067] Specifically, the sensing layer 2 may include a temperature sensor, enabling the sensing layer 2 to detect the temperature signal of the solution flowing through the electrode layer 3 and convert it into a corresponding electrical signal.

[0068] In one embodiment, the sensing layer 2 may include a temperature sensor and a pressure sensor. The temperature sensor can detect the temperature signal of the solution flowing through the electrode layer 3 and convert it into a corresponding electrical signal. The pressure sensor can detect the pressure signal of the solution flowing through the electrode layer 3 and convert it into a corresponding electrical signal. The combination of the two can improve the detection accuracy of the sensing layer 2. Alternatively, the temperature sensor and pressure sensor can be embedded on both sides of the glass substrate 1, respectively, so that the temperature sensor and pressure sensor can detect different solutions flowing through for temperature control, which can also enhance the detection capability of the functional board.

[0069] Optionally, it also includes a solder resist layer 6, which is disposed on the surface of the glass substrate 1 and exposes a portion of the electrode layer 3.

[0070] like Figure 1 and Figure 2 As shown, the solder resist layer 6 can be a graphite solder resist layer. By placing the solder resist layer 6 on the surface of the glass substrate 1, the functional board can be locally protected. For example, during the soldering, assembly or subsequent use of the functional board, it can prevent the non-electrode areas of the functional board or the glass substrate 1 from being damaged by heat, chemical corrosion or mechanical damage.

[0071] The test electrode is exposed through the solder mask layer 6, ensuring that the test electrode can directly contact the solution to be tested, so that the chemical signal in the solution can be converted into an electrical signal for transmission, thereby enabling it to perform its electrochemical detection function normally.

[0072] Optionally, it also includes a detection hole 7, which penetrates the solder resist layer 6 and the glass substrate 1.

[0073] like Figure 2 As shown, the detection hole 7 can form a detection channel for the functional board. The solution flows in from one detection hole 7, is detected by the electrode layer 3, and then flows out from another detection hole 7, which helps to improve the detection efficiency of the functional board.

[0074] After each test is completed, cleaning can be performed: the cleaning solution flows in from one test hole 7 and then flows out from another test hole 7 to clean the test channel and the surface of the electrode layer 3, which helps the functional board to be used multiple times.

[0075] In one embodiment, the detection hole 7 can be configured as a non-metallized through hole and used as a detection channel. Since the walls of the non-metallized through hole do not contain metal ions, the precipitation of metal ions on the hole walls can be avoided, which could affect the purity of the detection solution or interfere with the detection accuracy of the electrode, thus ensuring the detection accuracy of the electrode.

[0076] like Figure 2 As shown, the functional board also includes a housing 8, which is disposed on one side of the glass substrate 1 and covers the sensing layer 2 and the exposed electrode layer 3, so that only two detection holes 7 are exposed on the functional board, thereby ensuring the structure of the sensing layer 2, electrode layer 3 and other components, which is conducive to the multiple uses of the functional board.

[0077] Optionally, a second electrical connection hole 11 is provided on the glass substrate 1, and the electrode layers 3 are respectively provided on both sides of the glass substrate 1. The second electrical connection hole 11 is connected between the two opposite electrode layers 3.

[0078] like Figure 1 and Figure 2 As shown, the electrical connection between the electrode layers 3 on both sides can be achieved through a drilling and copper plating process. That is, a through hole is first etched on the glass substrate 1 using a laser etching process, and then a copper layer is deposited on the inner wall of the through hole using an electroplating process to form the second electrical connection hole 11.

[0079] The copper layer needs to extend to the two opposing electrode layers 3 to form an electrical connection. The two opposing electrode layers 3 can be a test electrode and a reference electrode, which work together to detect the solution.

[0080] Among them, the through holes etched by laser etching process are usually vertical through holes. The two opposite electrode layers 3 are directly connected through the vertical through holes and the sidewall coating, which reduces parasitic resistance and capacitance, thereby reducing signal transmission loss.

[0081] In one embodiment, the through-hole etched by laser etching can be filled with a copper layer to ensure a good and stable electrical connection.

[0082] Optionally, the thickness of the glass substrate 1 is 0.1-5.0 mm, and the flatness of the glass substrate 1 is 0.01-0.50 mm / m.

[0083] Specifically, a glass substrate 1 with a thickness ranging from 0.1 to 5.0 mm provides sufficient mechanical strength for the functional panel. During the manufacturing, transportation, and use of medical testing equipment, the functional panel may be subjected to various external forces, such as compression and impact. A glass substrate 1 with a certain thickness can withstand these external forces without easily breaking or being damaged, thereby protecting the structure on it and ensuring the normal operation of the equipment.

[0084] Furthermore, the glass substrate 1 also possesses excellent electrical insulation properties, and its thickness affects these insulation performance. Within a certain range, a thicker glass substrate 1 can provide better electrical insulation, reducing leakage and interference between different circuit layers and improving the electrical performance and stability of the functional board. This is crucial for precise electrical signal detection and processing in medical testing equipment.

[0085] Flatness refers to the height difference per meter. In medical testing equipment, the electrode layer 3 on the functional board needs to accurately transmit and process electrical signals. The flatness of the glass substrate 1 affects the layout and connection of the circuits on it. If the flatness of the glass substrate 1 is poor, it will cause undulations and bending in the circuit layer, increasing the resistance and inductance of the circuit, thereby generating signal interference and attenuation. Setting the flatness of the glass substrate 1 within the range of 0.01-0.50 mm / m can effectively reduce this interference, ensure accurate transmission and processing of electrical signals, and improve the sensitivity and accuracy of detection.

[0086] Furthermore, the flatness of the glass substrate 1 also affects the surface flatness of the electrode layer 3 disposed on it, thereby affecting the contact area and contact quality between the electrode layer 3 and the solution. A glass substrate 1 with good flatness can make the surface of the electrode layer 3 more uniform, ensuring that the electrode layer 3 is in full contact with the solution, improving the efficiency and stability of the electrochemical reaction, and thus improving the reliability of the detection results.

[0087] Optionally, the glass substrate 1 has a glass transition temperature of 530-660°C and a coefficient of thermal expansion of 3.0-3.6 ppm / °C.

[0088] Specifically, the manufacturing process of functional boards may involve some high-temperature processes, such as thin film deposition and annealing. Glass substrate 1 with a glass transition temperature in the range of 530-660℃ can maintain relatively stable physical and chemical properties under these high-temperature conditions, avoiding problems such as softening, deformation or structural damage to glass substrate 1, thereby ensuring the smooth progress of the functional board manufacturing process and the stability of the finished product quality.

[0089] When the glass substrate 1 is subjected to rapid temperature changes, if its glass transition temperature is low, it is prone to generating large thermal stress, which can lead to cracking or damage to the glass substrate 1. A higher glass transition temperature allows the glass substrate 1 to better maintain its structural integrity under thermal shock, reducing the generation and accumulation of thermal stress, improving the thermal shock resistance of the functional board, and thus extending the service life of the functional board.

[0090] Functional boards typically consist of multiple materials, including a glass substrate 1, a sensing layer 2, an electrode layer 3, an insulating layer 4, and a solder resist layer 6. Different materials have different coefficients of thermal expansion, which can lead to thermal mismatch stress when temperatures change. The coefficient of thermal expansion of the glass substrate 1 is set at 3.0-3.6 ppm / ℃, which is relatively small compared to common metallic materials such as copper (with a coefficient of thermal expansion of approximately 16.5 ppm / ℃). By rationally selecting the materials and processes for other structural layers, the differences in thermal expansion between the layers can be minimized when temperatures change, reducing the impact of thermal mismatch stress on the board's performance and preventing problems such as interlayer delamination and cracking.

[0091] In medical testing equipment, the dimensional stability of functional boards is crucial to the overall performance and assembly accuracy of the equipment. A glass substrate 1 with a coefficient of thermal expansion of 3.0-3.6 ppm / ℃ exhibits minimal dimensional change with temperature variations, ensuring the dimensional accuracy of the functional boards under different temperature conditions. This reduces assembly errors and performance degradation caused by dimensional changes, and also improves the reliability and lifespan of the equipment.

[0092] This application also provides a medical testing device, including the aforementioned functional board.

[0093] The medical testing equipment includes, but is not limited to, blood gas analyzers and urine analyzers. When this function board is applied to different medical testing equipment, the solutions, i.e., body fluids, include, but are not limited to, blood, sweat, tears, and saliva.

[0094] Taking a blood gas analyzer as an example, the aforementioned function board can detect the components and content of the blood flowing through it, thereby guiding users in health management.

[0095] This application also provides a hygiene care product, such as a diaper, which includes the aforementioned functional panels.

[0096] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that these examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A functional board for use in medical testing equipment, characterized in that, include: A glass substrate (1) having a receiving cavity inside; Sensing layer (2), the sensing layer (2) is disposed in the receiving cavity; An electrode layer (3) is disposed on at least one side surface of the glass substrate (1), and the sensing layer (2) is electrically connected to the electrode layer (3).

2. The functional board according to claim 1, characterized in that, It also includes an insulating layer (4), which is disposed on at least one side surface of the glass substrate (1). The insulating layer (4) has a first electrical connection hole (41). One side of the first electrical connection hole (41) is electrically connected to the electrode layer (3), and the other side of the first electrical connection hole (41) is electrically connected to the sensing layer (2).

3. The functional board according to claim 2, characterized in that, At least the wall of the first electrical connection hole (41) is provided with a copper layer.

4. The functional board according to claim 2, characterized in that, It also includes a heating layer (5) disposed within the insulating layer (4), and the sensing layer (2) includes a temperature sensor.

5. The functional board according to claim 4, characterized in that, The heating layer (5) and the temperature sensor are connected at the same height as the insulating layer (4); And / or, the distance between the heating layer (5) and the temperature sensor is 300-2000μm.

6. The functional board according to claim 1, characterized in that, The sensing layer (2) includes a temperature sensor.

7. The functional board according to claim 1, characterized in that, It also includes a solder resist layer (6), which is disposed on the surface of the glass substrate (1) and exposes part of the electrode layer (3).

8. The functional board according to claim 7, characterized in that, It also includes a detection hole (7) that penetrates the solder resist layer (6) and the glass substrate (1).

9. The functional board according to claim 1, characterized in that, The glass substrate (1) has a second electrical connection hole (11) and the electrode layers (3) are respectively provided on both sides of the glass substrate (1). The second electrical connection hole (11) is connected between the two opposite electrode layers (3).

10. The functional board according to claim 1, characterized in that, The thickness of the glass substrate (1) is 0.1-5.0 mm, and the flatness of the glass substrate (1) is 0.01-0.50 mm / m.

11. The functional board according to claim 1, characterized in that, The glass substrate (1) has a glass transition temperature of 530-660℃ and a coefficient of thermal expansion of 3.0-3.6ppm / ℃.

12. A medical testing device, characterized in that, Includes the functional board as described in any one of claims 1-11.

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