Processing method of portable bypass protection device
By integrating the bypass diode with the cover plate and screwing it onto the support platform, the processing method solves the problems of assembly cost waste and welding stress in traditional bypass protection devices, enabling quick installation and replacement and improving product maintainability.
Patent Information
- Application Number
- CN202511154480.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-18
- Publication Date
- 2025-11-28
AI Technical Summary
The assembly process of traditional bypass protection devices results in cost waste, product yield loss, and diode failure due to welding stress, and they are also inconvenient to maintain.
The bypass diode and cover plate are integrated into a single unit using a two-part processing method, and then screwed together with the support platform to form a closed U-shaped junction box. The screwing connection reduces welding stress and simplifies the installation and replacement process.
It achieves a one-stop bypass solution, reduces production costs, improves installation and replacement efficiency, avoids diode failure caused by welding stress, and enhances product maintainability.
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Figure CN121017690A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of photovoltaic cells, in particular to a processing method of a portable bypass protection device. BACKGROUND
[0002] A processing method of a portable bypass protection device mainly has two parts: a photovoltaic bypass diode and a photovoltaic junction box. The assembly method of the traditional bypass device is that the bypass diode is assembled by a packaging factory, then transported to a junction box factory for assembly, and then transported to a battery assembly factory for final installation and use. In this process, due to the production process, transportation process and control method of each stage manufacturer, there is a large cost waste and many process variables, which will cause a certain impact on the yield loss of the product, and it is not convenient for the maintenance of the subsequent bypass protection device.
[0003] There is also an existing production process, which mainly uses a high-temperature soldering iron to press the two ends of the bus bar and the diode to high-temperature weld them. When the equipment is abnormal or the parameters are abnormal, such as excessive pressure, long pressing time, etc., the welding stress of this part will be directly transmitted to the diode body, and in severe cases, it may even cause the diode body to break and fail. SUMMARY
[0004] The present application provides a processing method of a portable bypass protection device with simple structure, convenient assembly and high efficiency.
[0005] The technical scheme of the present application is as follows: a processing method of a portable bypass protection device, comprising the following steps: 1) mounting of the bypass diode and the cover plate: First, the bypass diode is formed by assembly welding process, then the bypass diode is connected in the opening of the cover plate, and the glue is poured; 2) mounting of the support platform and the base: The support platform is mounted in the base and welded with the two bus bars; the base is filled with sealing glue in the welding area; 3) the combination of the bypass diode and the cover plate is inverted and connected with the base to form a closed U-shaped junction box, wherein the bypass diode is screw-connected with the support platform.
[0006] The bypass diode comprises a pair of symmetrically arranged frames, two frames are positive and negative frames, The support platform comprises a pair of symmetrically arranged support frames, two support frames are negative and positive support frames, The positive frame is used to connect the positive support frame, and the negative frame is used to connect the negative support frame.
[0007] The frame is U-shaped and includes an upper bent pin and a lower bent pin. The U-shaped openings of a pair of frames are arranged opposite each other. The support frame is inverted L-shaped and includes a vertical section and a horizontal section. The vertical section has a groove, and the horizontal section is used to connect to the base. The downward-bent pin is used to connect to the groove in the support frame.
[0008] The inner sides of the lower bent pins of the pair of frames are respectively provided with arc-shaped openings. The vertical section is arc-shaped, and the vertical sections of the pair of supporting frames form cylinders. The grooves are threaded on the outside of the vertical sections. The lower bend pins of a pair of frames are screwed onto the vertical sections of a pair of support frames.
[0009] The base has an upward-facing positioning cylinder in the middle, and the vertical sections of a pair of support frames are located on both sides of the positioning cylinder.
[0010] The base is provided with a pair of lower busbar through holes, and the horizontal sections of the pair of support frames are respectively provided with upper busbar through holes. The upper busbar perforation and the lower busbar perforation correspond one-to-one; The top of the horizontal section is provided with a busbar welding area.
[0011] The base has a positioning boss on its inner side. The horizontal section of the support frame is provided with a positioning groove on its outer side, and the positioning boss is used to connect to the positioning groove.
[0012] The bypass diode also includes a jumper and a chip. One end of the jumper is connected to the bottom of the upper bent pin of the negative electrode frame via a chip, and the other end is connected to the bottom of the upper bent pin of the positive electrode frame. The upper bent pin of the positive electrode frame and the jumper are connected by a positioning structure. The positioning structure is as follows: the upper bent pin of the positive electrode frame is provided with a groove, and the jumper is provided with a protrusion, which is used to connect to the groove.
[0013] The cover plate has locking blocks at both ends of its bottom. The base has slots at both ends, and the card block is used to connect to the slot.
[0014] The jumper cable is equipped with a locking hole.
[0015] In operation, the bypass protection device is divided into two parts. One part is to combine the bypass diode with the junction box cover, and the other part is to combine the base with the support platform and connect it to the battery pack busbar in advance. Finally, the two parts are connected to complete the installation.
[0016] This invention provides a one-stop bypass solution, enabling quick installation and replacement. Attached Figure Description
[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In the drawings, the parts are not necessarily drawn to scale.
[0018] Figure 1 This is a schematic diagram of the connection structure between the cover plate and the bypass diode in this invention. Figure 2 This is a schematic diagram of a bypass diode. Figure 3 This is a schematic diagram of the jumper wire structure. Figure 4 This is a schematic diagram of the connection structure between the base and the support platform. Figure 5 yes Figure 4 A schematic diagram of the structure of the optimized implementation method, Figure 6 This is a structural diagram of the supporting platform. Figure 1 , Figure 7 This is a structural diagram of the supporting platform. Figure 2 , Figure 8 This is a schematic diagram of the junction box's connection structure; In the diagram, 1 is the cover plate, 11 is the opening, 12 is the locking block, and 13 is the support column. 2 is the base, 21 is the lower busbar perforation, 22 is the positioning boss, and 23 is the slot. 3 is the bypass diode, 31 is the frame, 311 is the negative frame, 312 is the positive frame, 32 is the upper bend pin, 33 is the lower bend pin, 34 is the jumper, 340 is the protrusion, 341 is the hinge hole, 35 is the chip, and 36 is the slot. 4 is the support platform, 41 is the support frame, 411 is the negative electrode support frame, 412 is the positive electrode support frame, 42 is the vertical section, 420 is the groove, 43 is the horizontal section, 44 is the upper busbar perforation, 45 is the busbar welding area, and 46 is the positioning groove. 5 is the positioning cylinder. Detailed Implementation
[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0020] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0022] The present invention is as follows Figures 1-8 As shown, a method for manufacturing a convenient bypass protection device includes the following steps: 1) Installation of bypass diode 3 and cover plate 1: First, the bypass diode 3 is welded into shape using an assembly welding process. Then, the bypass diode 3 is connected to the opening 11 of the cover plate 1, and glue is poured in. It is obtained by assembly and welding process (negative electrode frame welding area + solder paste + chip + solder paste + copper jumper connected to positive electrode frame welding area + solder paste, high temperature welding formation).
[0023] In the application, the cover plate has support columns 13 inside the opening to support and position the bypass diode (e.g., two rows of support columns are set inside the opening, and the bypass diode is positioned inside the two rows of support columns). Then, it is cast using a casting process to improve the product strength. The casting height needs to exceed the welding area (as a junction box cover). Conventional special adhesive can be used for the casting process. Figure 1 The pouring height can be adjusted according to the actual situation.
[0024] 2) Installation of support platform 4 and base 2: The support platform 4 is installed inside the base 2 and welded to the two busbars; the welding area of the base is potted with potting compound. The support platform is made of metal and is positioned and connected by positioning protrusions and positioning grooves. It is then welded to the busbar and the welding area of the base is potted (using photovoltaic-specific potting compound). Figure 5The glue pouring height can be adjusted according to the actual situation.
[0025] 3) Invert the assembly consisting of the bypass diode 3 and the cover plate 1, and then connect it to the base 2 to form a closed convex-shaped junction box. The bypass diode is screwed to the support platform. For example... Figure 8 The middle arrow indicates the connection action of the junction box.
[0026] The screw-on connection makes it easy to operate; the number of rotations is not fixed, just ensure the polarity is correct.
[0027] Conventional diodes are completely encapsulated inside a junction box, making subsequent disassembly and replacement inconvenient. A more efficient and faster replacement can be achieved by twisting the screw.
[0028] The existing production method involves installing the cover plates one by one after the potting adhesive has been poured in (and the potting adhesive has cured), which takes up production time.
[0029] This invention integrates the cover plate and the bypass diode into one unit through a novel structural design. Once the bypass diode is tightened, the cover plate is installed accordingly.
[0030] In the application, the bypass diode is cast into the cover plate of the junction box, and the support platform is combined with the junction box base. During the welding of the busbar, most of the welding stress is absorbed by the base and will not affect the bypass diode, thus avoiding failure.
[0031] This invention saves on product manufacturing costs and reduces product failures caused by stress generated during the installation of welded busbars, thereby improving the efficiency of subsequent product maintenance and replacement.
[0032] The bypass protection device in this invention includes a cover plate 1, a base 2, a bypass diode 3, and a support platform 4. The cover plate 1 is connected to the base 2 to form a U-shaped junction box. The bypass diode 3 is connected to the opening 11 of the upper cover plate 1 of the junction box, and the support platform 4 is connected to the base 2 at the bottom of the junction box. The bypass diode 3 is used to connect to the support platform 4.
[0033] In operation, the bypass protection device is divided into two parts. One part is to combine the bypass diode with the junction box cover, and the other part is to combine the base with the support platform and connect it to the battery pack busbar in advance. Finally, the two parts are connected to complete the installation.
[0034] This invention provides a one-stop bypass solution, enabling quick installation and replacement.
[0035] The bypass diode 3 includes a pair of symmetrically arranged frames 31, which are a negative electrode frame 311 and a positive electrode frame 312, respectively. The support platform 4 includes a pair of symmetrically arranged support frames 41, namely a negative electrode support frame 411 and a positive electrode support frame 412. The positive electrode frame is used to connect to the positive electrode support frame, and the negative electrode frame is used to connect to the negative electrode support frame.
[0036] The positive electrode frame is connected to the positive electrode support frame, and the negative electrode frame is connected to the negative electrode support frame to ensure reliable connection.
[0037] The frame is U-shaped and includes an upper bent pin 32 and a lower bent pin 33. The U-shaped openings of a pair of frames are arranged opposite each other. The support frame is inverted L-shaped and includes a vertical section 42 and a horizontal section 43. The vertical section is provided with a groove 420, and the horizontal section 43 is used to connect to the base 2. The downward bending pin 33 is used to connect to the groove 420 of the support frame.
[0038] During the fabrication of the frame in a bypass diode, the copper sheet is bent to form a U-shape.
[0039] The downward-bent pins are connected to the grooves in the support frame, facilitating the connection between the frame and the support frame (i.e., the connection between the bypass diode and the support platform).
[0040] The inner sides of the lower bent pins of the pair of frames are respectively provided with arc-shaped openings. The vertical segment 42 is arc-shaped, and the vertical segments of the pair of supporting frames form cylinders. The grooves are threaded on the outside of the vertical segments. The lower bent pins 33 of a pair of frames 31 are screwed onto the vertical sections 42 of a pair of support frames.
[0041] The vertical sections of a pair of support frames are cylindrical and have external threads. The pair of frames are connected to the pair of support frames by screwing them together, which facilitates assembly and disassembly.
[0042] The base has an upward positioning cylinder 5 in the middle, and the vertical sections of a pair of support frames are located on both sides of the positioning cylinder.
[0043] The positioning cylinder is installed to support and position the vertical section, thereby improving the stability of the installation.
[0044] The base 2 is provided with a pair of lower busbar perforations 21, and the horizontal sections of the pair of support frames are respectively provided with upper busbar perforations 44 (that is, the support platform is provided with a pair of upper busbar perforations). The upper busbar perforation and the lower busbar perforation correspond one-to-one; The top of the horizontal section is provided with a busbar welding area 45.
[0045] The installation of upper and lower busbar perforations facilitates easy and reliable connection of the busbars.
[0046] The base has a positioning boss 22 on its inner side. The horizontal section 43 of the support frame is provided with a positioning groove 46 on the outside, and the positioning boss is used to connect to the positioning groove.
[0047] The positioning boss and positioning groove are designed to facilitate the positioning and connection of the support frame, thereby improving reliability.
[0048] The bypass diode also includes a jumper 34 and a chip 35. One end of the jumper 34 is connected to the bottom of the upper bent pin of the negative electrode frame 311 via the chip 35, and the other end is connected to the bottom of the upper bent pin of the positive electrode frame 312. The upper bent pin of the positive electrode frame and the jumper are connected by a positioning structure. The positioning structure is as follows: the upper bent pin of the positive electrode frame is provided with a groove 36, and the jumper is provided with a protrusion 340, which is used to connect in the groove.
[0049] An embedded groove design has been added to the original soldering surface. The size of this groove corresponds to that of the copper jumper. The copper jumper protrudes and is embedded in the groove. After the solder paste is remelted, the range of motion of the jumper in the soldering area can be greatly reduced, avoiding the production of jumper misalignment and improving connection reliability.
[0050] The jumper wire is provided with a locking hole 341. The locking hole is provided to lock in the glue during pouring, thereby improving the reliability of the connection.
[0051] The cover plate has locking blocks 12 at both ends of its bottom. The base has slots 23 at both ends, and the card block 12 is used to connect in the slots 23.
[0052] The design incorporates card blocks and slots for connection, facilitating easy positioning and improving sealing.
[0053] Regarding the information disclosed in this case, the following points need to be clarified: (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design. (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments; The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.
Claims
1. A method for fabricating a convenient bypass protection device, characterized in that, Includes the following steps: 1) Bypass diode and cover plate mounting: First, the bypass diode is welded into shape using an assembly and welding process. Then, the bypass diode is connected to the opening in the cover plate and glue is poured in. 2) Installation of support platform and base: The support platform is installed inside the base and welded to the two busbars; the base is then filled with potting compound. 3) Invert the assembly consisting of the bypass diode and the cover plate, and then connect it to the base to form a closed U-shaped junction box, wherein the bypass diode is screwed to the support platform.
2. The processing method of a convenient bypass protection device according to claim 1, characterized in that, The bypass diode includes a pair of symmetrically arranged frames, which are a positive electrode frame and a negative electrode frame, respectively. The support platform includes a pair of symmetrically arranged support frames, which are a negative electrode support frame and a positive electrode support frame, respectively. The positive electrode frame is used to connect to the positive electrode support frame, and the negative electrode frame is used to connect to the negative electrode support frame.
3. The processing method of a convenient bypass protection device according to claim 2, characterized in that, The frame is U-shaped and includes an upper bent pin and a lower bent pin. The U-shaped openings of a pair of frames are arranged opposite each other. The support frame is inverted L-shaped and includes a vertical section and a horizontal section. The vertical section has a groove, and the horizontal section is used to connect to the base. The downward-bent pin is used to connect to the groove in the support frame.
4. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The inner sides of the lower bent pins of the pair of frames are respectively provided with arc-shaped openings. The vertical section is arc-shaped, and the vertical sections of the pair of supporting frames form cylinders. The grooves are threaded on the outside of the vertical sections. The lower bend pins of a pair of frames are screwed onto the vertical sections of a pair of support frames.
5. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The base has an upward-facing positioning cylinder in the middle, and the vertical sections of a pair of support frames are located on both sides of the positioning cylinder.
6. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The base is provided with a pair of lower busbar through holes, and the horizontal sections of the pair of support frames are respectively provided with upper busbar through holes. The upper busbar perforation and the lower busbar perforation correspond one-to-one; The top of the horizontal section is provided with a busbar welding area.
7. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The base has a positioning boss on its inner side. The horizontal section of the support frame is provided with a positioning groove on its outer side, and the positioning boss is used to connect to the positioning groove.
8. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The bypass diode also includes a jumper and a chip. One end of the jumper is connected to the bottom of the upper bent pin of the negative electrode frame via a chip, and the other end is connected to the bottom of the upper bent pin of the positive electrode frame. The upper bent pin of the positive electrode frame and the jumper are connected by a positioning structure. The positioning structure is as follows: the upper bent pin of the positive electrode frame is provided with a groove, and the jumper is provided with a protrusion, which is used to connect to the groove.
9. The processing method of a convenient bypass protection device according to claim 3, characterized in that, The cover plate has locking blocks at both ends of its bottom. The base has slots at both ends, and the card block is used to connect to the slot.
10. A method for manufacturing a convenient bypass protection device according to claim 8, characterized in that, The jumper cable is equipped with a locking hole.
Citation Information
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