Probe card

Abstract

The purpose of the present invention is to improve the heat removal efficiency for removing heat from a probe to the outside of a guide unit. A probe card is provided with: a plurality of probes (6); an upper guide plate (31a) having a plurality of first through-holes (41) for guiding needle roots (61) of the probes (6); a lower guide plate (31b) which has a plurality of second through-holes (42) for guiding the tip (62) of the probe (6), is disposed so as to face the upper guide plate (31a), and forms a buckling chamber (33) for buckling the probe (6) between the upper guide plate (31a) and the lower guide plate (31b); and a plurality of sliding members (5) each having a plurality of third through-holes (43) through which the probes (6) pass, the sliding members (5) being stacked inside the buckling chamber (33) and being slidable relative to each other.

Description

Technical Field

[0001] This invention relates to probe cards, and more specifically, to improvements in probe cards having an upper guide plate and a lower guide plate for guiding probes. Background Technology

[0002] A probe card is an inspection device used to inspect the electrical characteristics of semiconductor devices formed on a semiconductor wafer, and it has multiple probes that each contact the electrode pads on the semiconductor wafer. The probe card includes: an upper guide plate that guides the root portion of the probe; and a lower guide plate that guides the tip portion of the probe. During inspection, the electrode pad is pressed against the tip of the probe. Under the pressure from the electrode pad, the probe bends and deforms between the upper and lower guide plates, thereby enabling reliable electrical connection between the probe and the electrode pad.

[0003] During inspection, an electrical signal flows through the probe, generating heat. As the probe heats up, its resistance increases and its capacitance decreases. This results in reduced inspection accuracy, necessitating improved heat dissipation characteristics of the probe.

[0004] A probe card with a cooling structure having a cooling probe has been proposed previously (e.g., Patent Document 1). The probe card described in Patent Document 1 has a cooling structure in the space between an upper guide plate at the base of the probe and a lower guide plate at the tip of the probe. The cooling structure is a structure having a flow path for a cooling medium, and an example of a laminate formed by joining multiple thin metal plates is shown. Additionally, an example of filling the space between the upper and lower guide plates with a gel-like, deformable material is shown.

[0005] However, with such a cooling structure, there is a problem of reduced conductivity between the probe and the electrode pad. Vertical probes ensure sufficient probe pressure and conductivity to the electrode pad through probe deformation. Therefore, due to the use of a cooling structure with a flow path for the cooling medium, the probe deformation is hindered, making it difficult to ensure sufficient conductivity.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2013-088257 Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] The present application has been achieved in view of the above-described circumstances, and aims at improving heat dissipation efficiency of heat dissipated from probes. In particular, the present application aims at improving heat dissipation characteristics of a probe card without hindering flexural deformation of probes during inspection.

[0011] Means for solving the problem

[0012] The probe card according to the first aspect of the present application includes: a plurality of probes; an upper guide plate having a plurality of first through holes that guide needle root portions of the probes; a lower guide plate having a plurality of second through holes that guide needle tip portions of the probes, and disposed so as to face the upper guide plate with a flexure chamber for flexure of the probes formed therebetween; and a plurality of sliding members each having a plurality of third through holes through which the probes pass, and stacked in the flexure chamber so as to be slidable with respect to each other.

[0013] With this configuration, the sliding members slide in accordance with the flexural deformation of the probes. Therefore, the probes can be brought into contact with the sliding members during inspection without hindering the flexural deformation of the probes. Therefore, heat of the probes can be conducted to the sliding members, and further dissipated to the outside of the flexure chamber with the aid of the upper guide plate or the lower guide plate. Thus, heat dissipation efficiency of the guide unit can be improved.

[0014] The probe card according to the second aspect of the present application is configured such that the thermal conductivity of the sliding members is 3.32 W / m-k or more, in addition to the above-described configuration. With this configuration, heat dissipation efficiency of the guide unit can be improved.

[0015] The probe card according to the third aspect of the present application is configured such that the coefficient of friction of the sliding members is less than 0.11, in addition to the above-described configuration. With this configuration, the plurality of sliding members can be stacked so as to be slidable with respect to each other, and the sliding members can be prevented from hindering the flexural deformation.

[0016] The probe card according to the fourth aspect of the present application is configured such that the plurality of sliding members have the same shape, in addition to the above-described configuration. With this configuration, it is not necessary to prepare sliding members having different shapes, and manufacturing cost can be reduced.

[0017] The probe card according to the fifth aspect of the present application is configured such that the thickness of the sliding members disposed near the center in the up-down direction of the flexure chamber is thinner than the thickness of the sliding members disposed adjacent to the upper guide plate or the lower guide plate, in addition to the above-described configuration.

[0018] With this configuration, by making the thickness of the sliding members thinner near the center in the up-down direction of the flexure chamber where the flexural deformation of the probes is the greatest, the followability of the sliding members to the flexural deformation of the probes can be improved, and the sliding members can be prevented from hindering the flexural deformation of the probes.

[0019] The probe card of the sixth aspect of the present application, in addition to the above structure, is configured to have an intermediate guide plate disposed between the upper guide plate and the lower guide plate and having a plurality of fourth through holes that guide the probes, the fourth through holes being larger than the first through holes and the second through holes, the bending chamber being divided by the intermediate guide plate into an upper bending chamber and a lower bending chamber, and a plurality of the sliding members being disposed in the upper bending chamber and the lower bending chamber, respectively.

[0020] With this structure, heat of the sliding members can be discharged to the outside of the bending chamber by the intermediate guide plate, and heat discharge efficiency of the guide unit can be improved. Further, by making the fourth through holes larger than the first through holes and the second through holes, the intermediate guide plate can be prevented from interfering with the bending deformation of the probes.

[0021] The probe card of the seventh aspect of the present application, in addition to the above structure, is configured such that the third through holes of the sliding members disposed near the center in the vertical direction of the bending chamber are larger than the third through holes of the sliding members disposed adjacent to the upper guide plate or the lower guide plate.

[0022] With this structure, by making the third through holes larger near the center in the vertical direction of the bending chamber where the probes are most bent, the sliding members can be prevented from interfering with the bending deformation of the probes.

[0023] Effects of the Invention

[0024] According to the present application, the object is to improve heat discharge efficiency of discharging heat of probes. In particular, the object is to improve heat discharge characteristics of a probe card without interfering with the bending deformation of probes at the time of inspection. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a diagram showing a structure example of a probe card 100 of Embodiment 1 of the present application.

[0026] Figure 2 is a diagram showing a case at the time of inspection of the probe card 100 of Figure 1

[0027] Figure 3 is a diagram showing a case at the time of assembly of the guide unit 3.

[0028] Figure 4 is a diagram showing a structure example of a probe card 101 of Embodiment 2 of the present application.

[0029] Figure 5 is a diagram showing a structure example of a probe card 102 of Embodiment 3 of the present application. ​

[0030] Figure 6 Fig. 6 is a diagram showing a structure example of a probe card 103 according to Embodiment 4 of the present application. DETAILED DESCRIPTION

[0031] Embodiment 1

[0032] Figure 1 Fig. 1 is a diagram showing a structure example of a probe card 100 according to Embodiment 1 of the present application, and is a sectional view when the probe card 100 horizontally disposed is cut along a vertical plane. The probe card 100 is provided with a sliding member 5 for efficiently discharging heat of a probe 6 to the outside of a guide unit 3.

[0033] The probe card 100 is mounted to a card holder 21 in a manner that a disposition surface of the probe 6 opposes a semiconductor wafer 200 on a pedestal 20, and by moving the pedestal 20 up and down, a tip of the probe 6 can be brought into contact with an electrode pad 201 on the semiconductor wafer 200. The probe card 100 is provided with a main substrate 10, a reinforcing plate 11, the guide unit 3, a plurality of the sliding members 5, and a plurality of the probes 6.

[0034] (1) Main substrate 10, reinforcing plate 11

[0035] The main substrate 10 is a wiring substrate which is detachably mounted to a wafer probe, and for example, a glass epoxy substrate in a round plate shape is used. The main substrate 10 is horizontally disposed in a manner that an outer peripheral edge portion of a lower surface is supported by the card holder 21 of the wafer probe. A reinforcing plate 11 for suppressing strain of the main substrate 10 is mounted to a central portion of an upper surface of the main substrate 10, and a plurality of external terminals 10e which are connected to signal terminals of a tester device (not shown) are provided to an outer peripheral edge portion of the upper surface. Further, a probe electrode 10p for connecting the probe 6 is provided to a central portion of a lower surface of the main substrate 10.

[0036] (2) Guide unit 3

[0037] The guide unit 3 is a probe support member which performs positioning in a horizontal plane of the probe 6. The probe 6 is supported by the guide unit 3 in a manner that a tip is movable up and down, and elastically contacts with respect to the electrode pad 201. The guide unit 3 is provided with: an upper guide plate 31a and a lower guide plate 31b which are disposed in parallel with the main substrate 10; and a guide partition 32 which is disposed between the upper guide plate 31a and the lower guide plate 31b, and is mounted to a lower surface of the main substrate 10 by a guide unit mounting portion 12. Further, a plurality of the sliding members 5 are slidably stacked in a flexure chamber 33 of the guide unit 3.

[0038] The upper guide plate 31a is a guide plate that guides the needle root portion 61 of the probe 6, and is disposed so as to be separated downward from the main substrate 10 and to oppose the main substrate 10 by means of the guide unit mounting portion 12. The upper guide plate 31a uses an insulating plate-shaped member, such as a ceramic plate, formed with a plurality of first through-holes 41. The first through-holes 41 are holes that pass through the upper guide plate 31a in the thickness direction, and through which the probes 6 pass. The needle root portions 61 are disposed within the first through-holes 41, and the positions of the needle root portions 61 in the horizontal plane are defined by the first through-holes 41.

[0039] The lower guide plate 31b is a guide plate that guides the needle tip portion 62 of the probe 6, and is disposed so as to be separated further downward from the upper guide plate 31a and to oppose the upper guide plate 31a by means of the guide partition 32. The lower guide plate 31b uses an insulating plate-shaped member, such as a ceramic plate, formed with a plurality of second through-holes 42. The second through-holes 42 are holes that pass through the lower guide plate 31b in the thickness direction, and through which the probes 6 pass, and the needle tip portions 62 are disposed within the second through-holes 42. The needle tip portions 62 are supported by the second through-holes 42 so as to be able to move up and down, and the positions thereof in the horizontal plane are defined.

[0040] The guide partition 32 is a partition that is interposed between the upper guide plate 31a and the lower guide plate 31b, and the upper guide plate 31a and the lower guide plate 31b are disposed so as to oppose each other at a prescribed distance apart, thereby forming the flexure chamber 33.

[0041] The flexure chamber 33 is a space for the probes 6 to be flexibly deformed due to overdrive at the time of inspection, and is formed as a space sandwiched by the upper guide plate 31a and the lower guide plate 31b. Within the flexure chamber 33, a plurality of slide members 5 are disposed in layers, and a plurality of probes 6 are disposed so as to pass through the slide members 5.

[0042] (3) Slide member 5

[0043] The slide member 5 is an insulating plate-shaped member that discharges heat from the probes 6 to the outside of the flexure chamber 33, and is disposed so as to oppose the upper guide plate 31a and the lower guide plate 31b. Within the flexure chamber 33, a plurality of slide members 5 that are the same shape are stacked so that the main surfaces thereof oppose each other. Further, a plurality of third through-holes 43 are formed in the slide members 5, respectively. The third through-holes 43 are holes that pass through the slide members 5 in the thickness direction, and through which the probes 6 pass. The probes 6 pass through the slide members 5 in order by passing through the third through-holes 43 of the plurality of slide members 5 that are disposed in layers within the flexure chamber 33. The first through-holes 41 to the third through-holes 43 can be, for example, circular in cross section with the same diameter.

[0044] The slide members 5 are stacked so as to be slidable, and the main surfaces thereof are formed in a shape smaller than the horizontal cross section of the bending chamber 33. Therefore, the slide members 5 move in the horizontal plane in accordance with the deformation of the probe 6 at the time of inspection. Note that the slide members 5 are formed in a thin shape thinner than the upper guide plate 31a or the lower guide plate 31b, and a thin film such as a sheet or a film having flexibility can be used.

[0045] By forming the slide members 5 using a material having a small coefficient of friction, the friction between the slide members 5 at the time of horizontal movement can be reduced, and the slide members 5 can be arranged so as to be slidable. The slide members 5 are desirably formed using a material having a coefficient of friction of less than 0.11, and for example, a polyimide resin can be used.

[0046] In addition, by forming the slide members 5 using a material having good thermal conductivity, the heat dissipation efficiency from the bending chamber 33 can be improved. The slide members 5 can use a material having a thermal conductivity of 3.32 W / m-K or more, and for example, a fluororesin filled with a thermally conductive paste.

[0047] Furthermore, by forming the slide members 5 using a material having insulation, the horizontal cross section of the probe 6 can be surrounded by an insulating substance, and the high-frequency characteristics of the probe 6 can be improved compared to the conventional structure in which adjacent probes 6 are separated only by air. In particular, by forming the slide members 5 using a dielectric having a desired dielectric constant, the best high-frequency characteristics can be obtained.

[0048] (4) Probe 6

[0049] The probe 6 is a vertical probe extending in a direction intersecting the main substrate 10 and bent and deformed due to overdrive at the time of inspection. The probe 6 is formed of a conductive material having an elongated shape, and the upper end is connected to the probe electrode 10p, and the lower end is in contact with the electrode pad 201 on the object of inspection. In addition, the probe 6 passes through the first to third through-holes 41 to 43. The material of the probe 6 uses a metal material having both good elastic properties and good conductive properties, such as a nickel (Ni) alloy or a palladium (Pd) alloy.

[0050] The probe 6 is divided into a needle root portion 61 on the main substrate side, a needle tip portion 62 on the electrode pad side, and a deformation portion 63 sandwiched by the needle root portion 61 and the needle tip portion 62, and a locking portion 64 for preventing falling is provided in the needle root portion 61.

[0051] The probe 6 is bent and deformed due to stress (needle pressure) received from the electrode pad 201 at the time of inspection. Due to the bending and deformation of the probe 6 in the bending chamber 33, the front end of the probe 6 moves up and down in accordance with the amount of overdrive, and the probe 6 can be brought into elastic contact with the electrode pad 201. That is, by the probe 6 being bent and deformed, the probe 6 can be brought into contact with the electrode pad 201 at a prescribed needle pressure, and the continuity can be ensured.

[0052] The first through-hole 41 and the second through-hole 42, which are passed through by the same probe 6, are arranged to be offset in the same direction (bias direction D) by the same distance in the horizontal plane, and all the probes 6 are gently bent in the same direction at the time of non-inspection. Therefore, at the time of inspection, all the probes 6 are flexibly deformed in the bias direction D in the horizontal plane.

[0053] Figure 2 is a view showing the case at the time of inspection of the probe card 100. Figure 1 is a view showing the case at the time of overdrive after the pedestal 20 is raised from the state of Figure 1 to make the electrode pad 201 contact with the probe 6, and the pedestal 20 is further raised to make the probe 6 flexibly deform.

[0054] The probe 6, when contacting with the electrode pad 201, is raised at the tip end by the stress received from the electrode pad 201 and is flexibly deformed in the flexure chamber 33. Due to the flexible deformation of the probe 6, the side surface of the probe 6 abuts against the inner surface of the third through-hole 43, and the sliding member 5 is pushed by the probe 6 to horizontally move.

[0055] At this time, all the probes 6 are flexibly deformed in the same direction, that is, the bias direction D. On the other hand, the sliding member 5 has a shape having a length in the bias direction D smaller than the flexure chamber 33, can move in the bias direction D, and is stacked in the flexure chamber 33 so as to be slidable. Therefore, the sliding member 5 can move according to the flexible deformation of the probe 6, and it is difficult to hinder the flexible deformation of the probe 6.

[0056] The probe 6 at the time of inspection is flexibly deformed and is in a state of contacting with the sliding member 5, and thus the heat generated from the probe 6 is easily conducted to the sliding member 5, and the heat of the probe 6 can be efficiently discharged to the outside of the flexure chamber 33. The heat conducted from the probe 6 to the sliding member 5 is further conducted to the guide unit 3, and is emitted to the atmosphere from the guide unit 3 or is further conducted to the main substrate 10. For example, it is conducted between the adjacent sliding members 5 and is conducted to the upper guide plate 31a or the lower guide plate 31b. The conducted heat of the lower guide plate 31b is conducted to the main substrate 10 via the guide partition 32 and the guide unit mounting portion 12.

[0057] In addition, by passing the probe 6 through the third through-hole 43 of the sliding member 5, it is possible to maintain the interval of the adjacent probes 6 in the flexure chamber 33 even at the time of flexible deformation. Therefore, it is possible to prevent contact between the adjacent probes 6.

[0058] Further, by using the dielectric to form the sliding member 5, it is possible to improve the high frequency characteristics. When a high frequency signal is transmitted to the probes 6 arranged at a narrow pitch by means of the air layer, a mismatch of impedance occurs. By arranging the sliding member 5 having a prescribed dielectric constant between such probes 6, it is possible to match the impedance and improve the high frequency characteristics.

[0059] By arranging more sliding members 5 in the flexure chamber 33 in a manner that the total volume increases, it is possible to further improve the heat dissipation efficiency of the probes 6, and further improve the high frequency characteristics. However, in order for the sliding members 5 to move smoothly, the total thickness of the sliding members 5 needs to be smaller than the interval of the upper guide plate 31a and the lower guide plate 31b.

[0060] Figure 3 (a) to (d) of FIG. 8 are diagrams showing the case where the guide unit 3 is assembled, and show the method in which the probes 6 pass through the first to third through holes 41 to 43 in time series.

[0061] In Figure 3 In (a) of FIG. 8, the positioning of the guide plates 31a, 31b and the sliding member 5 using the positioning pin 7 for the passage of the probes 6 is shown. The positioning pin 7 is a pin that extends linearly, and by passing through the positioning through hole 45, the positioning of the guide plates 31a, 31b and the sliding member 5 is performed.

[0062] The positioning through hole 45 is a through hole that passes through the guide plates 31a, 31b and the sliding member 5 in the thickness direction. A plurality of positioning through holes 45 are provided in the guide plates 31a, 31b and the sliding member 5, respectively. If the guide plates 31a, 31b and the sliding member 5 are arranged in a manner that the positioning through holes 45 coincide, the first to third through holes 41 to 43 also coincide. Therefore, if the positioning pin 7 is passed through the positioning through hole 45, the first to third through holes 41 to 43 are aligned in a straight line, and it is possible to pass the probes 6.

[0063] In Figure 3 In (b) of FIG. 8, the insertion of the probes 6 is shown. The linear probes 6 pass through the first to third through holes 41 to 43 aligned in a straight line. The probes 6 pass from the side of the upper guide plate 31a, and the locking portion 64 abuts against the upper surface of the upper guide plate 31a to be locked in a manner that it does not fall off.

[0064] In Figure 3In (c) and (d) of FIG. 10, a case where the first and second through holes 41, 42 are offset is shown. By pulling out the positioning pin 7 from the positioning through hole 45 and horizontally moving the lower guide plate 31b in the offset direction D, it is possible to offset the arrangement of the first and second through holes 41, 42. By offsetting the first and second through holes 41, 42, the probe 6 is deformed, and the sliding member 5 moves in accordance with the deformation. By mounting the guide unit 3 thus assembled to the main substrate 10, the probe card 100 shown in FIG. 11 is obtained. Figure 1

[0065] The probe card 100 of the present embodiment has a plurality of probes 6, an upper guide plate 31a that guides the needle root portions 61 of the probes 6, a lower guide plate 31b that guides the needle tip portions 62 of the probes 6, and a plurality of sliding members 5. A bending chamber 33 for bending the probes 6 is formed between the upper guide plate 31a and the lower guide plate 31b, and the sliding members 5 are stacked in the bending chamber 33 and are slidable with respect to each other.

[0066] By adopting such a structure, it is possible to efficiently discharge the heat of the probes 6 by means of the sliding members 5. In addition, it is possible to prevent contact between adjacent probes 6 at the time of bending. Furthermore, it is possible to improve the high-frequency characteristics of the probes 6.

[0067] Embodiment Two

[0068] In Embodiment One, an example where the plurality of sliding members 5 are the same shape is described. In contrast, in the present embodiment, a case where the thicknesses of the plurality of sliding members 5 are different is described.

[0069] Figure 4 is a diagram showing a structure example of a probe card 101 of Embodiment Two of the present application, and Figure 1 Figure 2 In (a) of the diagram, the state before inspection is shown, and in (b), the state at the time of inspection is shown.

[0070] The probe card 101, if compared with the probe card 100 (Embodiment One) of Figure 1 Figure 2 differs in that the thicknesses of the plurality of sliding members 5 are different. In the probe card 100, since the shapes of all of the sliding members 5 are the same, it is not necessary to prepare sliding members 5 of different shapes, and thus it is possible to reduce manufacturing costs. In contrast, in the probe card 101, by making the thickness of the sliding member 5 arranged near the center in the up-down direction of the bending chamber 33 thin, the sliding member 5 easily moves, and the followability of the sliding member 5 to the deformation of the probe 6 is improved.

[0071] ​​​The thickness of the slide members 5 is stacked in a manner inversely proportional to the distance from the upper guide plate 31a or the lower guide plate 31b. That is, the slide members 5 adjacent to the upper guide plate 31a or the lower guide plate 31b are thickest, and the slide members 5 are thinnest in the vicinity of the center in the height direction of the flexure chamber 33. The thickness of the slide members 5 can be two kinds, or three or more kinds. Note that the shapes of the main surfaces of the plurality of slide members 5 are the same.

[0072] The flexure deformation of the probe 6 at the time of inspection is largest in the vicinity of the center in the up-and-down direction of the flexure chamber 33. Therefore, in the vicinity of the center in the up-and-down direction of the flexure chamber 33, the thickness of the slide members 5 is made thin, so that the slide members 5 more favorably follow the deformation of the deformation portion 63 of the probe 6 having a large flexure deformation, and the contact area of the probe 6 with the slide members 5 can be increased, and the thermal conductivity can be improved.

[0073] Embodiment Three

[0074] In the above-described embodiments, an example in which the guide unit 3 does not have an intermediate guide plate is described. In contrast, in the present embodiment, a case in which the guide unit 3 has an intermediate guide plate 31c is described.

[0075] Figure 5 is a diagram showing a structure example of the probe card 102 of Embodiment Three, and in (a) in the diagram, the state before inspection is shown, and in (b), the state at the time of inspection is shown. If the probe card 102 is brought into contact with the probe card 100 (Embodiment One), the probe card 102 is guided by the guide unit 3 of the probe card 100. Figure 1 Compared with the probe card 100 (Embodiment One) of

[0076] The intermediate guide plate 31c is a guide plate that guides the deformation portion 63 of the probe 6, and is disposed between the upper guide plate 31a and the lower guide plate 31b. The intermediate guide plate 31c is separated downward from the upper guide plate 31a by the upper guide partition 32a, and is disposed in opposition to the upper guide plate 31a. The lower guide plate 31b is separated downward from the intermediate guide plate 31c by the lower guide partition 32b, and is disposed in opposition to the intermediate guide plate 31c. That is, the flexure chamber 33 is divided into an upper flexure chamber 33a and a lower flexure chamber 33b by the intermediate guide plate 31c.

[0077] The intermediate guide plate 31c uses an insulating plate-shaped member, such as a ceramic plate, formed with a plurality of fourth through-holes 44. The fourth through-holes 44 are holes that pass through the intermediate guide plate 31c in the thickness direction, and allow the probes 6 to pass therethrough. The deformed portions 63 of the probes 6 are disposed within the fourth through-holes 44. The fourth through-holes 44 have a shape that does not hinder the bending deformation of the probes 6. For example, the cross section of the fourth through-holes 44 is set to an elongated shape in the bias direction D, and the length in the bias direction D is set to be greater than the maximum displacement amount of the probes 6 at the height of the intermediate guide plate 31c, and on the other hand, the width in the direction intersecting the bias direction D can be the same as the first and second through-holes 41, 42.

[0078] A plurality of sliding members 5 are respectively slidably stacked in the upper bending chamber 33a. Similarly, a plurality of sliding members 5 are respectively slidably stacked in the lower bending chamber 33b. Heat conducted from the probes 6 to these sliding members 5 can be discharged by the intermediate guide plate 31c in addition to the upper guide plate 31a and the lower guide plate 31b. The conducted heat of the sliding members 5 in the upper bending chamber 33a is conducted to the main substrate 10 by the upper guide partition 32a and the upper guide plate 31a. Therefore, compared to the case where the intermediate guide plate 31c is not present, the heat discharge efficiency can be improved.

[0079] Embodiment Four

[0080] In the above embodiments, an example in which the plurality of sliding members 5 are the same shape is described. In contrast, in the present embodiment, a case in which the sizes of the third through-holes 43 are different is described.

[0081] Figure 6 is a drawing showing a structure example of a probe card 103 of Embodiment Four, and in (a) in the drawing, the state before inspection is shown, and in (b), the state at the time of inspection is shown. The probe card 103 is the same as the probe card 100 (Embodiment One) of 1 and 2 except that the sizes of the third through-holes 43 are different. In the probe card 103, by making the sizes of the third through-holes 43 different, the bending deformation of the probes 6 is prevented from being hindered by the sliding members 5. Figure 1

[0082] The sliding members 5 increase the cross section of the third through-holes 43 in inverse proportion to the distance from the upper guide plate 31a or the lower guide plate 31b. That is, the cross section of the third through-holes 43 of the sliding members 5 adjacent to the upper guide plate 31a or the lower guide plate 31b is the smallest, and the cross section of the third through-holes 43 of the sliding members 5 disposed near the center in the height direction of the bending chamber 33 is the largest. The sizes of the third through-holes 43 can be two kinds, or three or more kinds. Note that the sizes of the third through-holes 43 formed in the same sliding member 5 are the same.​

[0083] The bending deformation of the probe 6 at the time of inspection is largest near the center in the up-and-down direction of the bending chamber 33. Therefore, by making the cross-sectional area of the third through-hole 43 of the slide member 5, which is disposed near the center in the up-and-down direction of the bending chamber 33, larger, the slide member 5 is less likely to interfere with the bending deformation at the time of inspection.

[0084] Reference Signs

[0086] 100-103 Probe card

[0087] 10 Main substrate

[0088] 10e External terminal

[0089] 10p Probe electrode

[0090] 11 Reinforcing plate

[0091] 12 Guide unit mounting portion

[0092] 3 Guide unit

[0093] 31a Upper guide plate

[0094] 31b Lower guide plate

[0095] 31c Intermediate guide plate

[0096] 32 Guide partition

[0097] 32a Upper guide partition

[0098] 32b Lower guide partition

[0099] 33 Bending chamber

[0100] 33a Upper bending chamber

[0101] 33b Lower bending chamber

[0102] 41 First through-hole

[0103] 42 Second through-hole

[0104] 43 Third through-hole

[0105] 44 Fourth through-hole

[0106] 45 Positioning through-hole

[0107] 5 Slide member

[0108] 6 Probe

[0109] 61 Needle root portion

[0110] 62 tip portion

[0111] 63 deformation portion

[0112] 64 locking portion

[0113] 7 positioning pin

[0114] D biasing direction

Claims

1. A probe card, characterized in that, The probe card has the following features: Multiple probes; The upper guide plate has a plurality of first through holes for guiding the root of the probe; The lower guide plate has a plurality of second through holes for guiding the tip of the probe and is configured to face the upper guide plate, and forms a buckling chamber between the lower guide plate and the upper guide plate for the probe to buckle. as well as Multiple sliding members, each having multiple third through holes through which the probe passes, are stacked in the buckling chamber and slide freely against each other.

2. The probe card according to claim 1, characterized in that, The thermal conductivity of the sliding component is above 3.32 W / m·K.

3. The probe card according to claim 1, characterized in that, The coefficient of friction of the sliding component is less than 0.

11.

4. The probe card according to any one of claims 1 to 3, characterized in that, The plurality of sliding components have the same shape.

5. The probe card according to any one of claims 1 to 3, characterized in that, The thickness of the sliding member disposed near the center of the buckling chamber in the vertical direction is thinner than the thickness of the sliding member disposed adjacent to the upper guide plate or the lower guide plate.

6. The probe card according to any one of claims 1 to 3, characterized in that, The probe card includes a middle guide plate disposed between the upper guide plate and the lower guide plate, and has multiple fourth through holes for guiding the probe. The fourth through hole is larger than the first through hole and the second through hole. The buckling chamber is divided into an upper buckling chamber and a lower buckling chamber by the intermediate guide plate, and multiple sliding members are respectively arranged in the upper buckling chamber and the lower buckling chamber.

7. The probe card according to any one of claims 1 to 3, characterized in that, The third through hole of the sliding member disposed near the center of the buckling chamber in the vertical direction is larger than the third through hole of the sliding member disposed adjacent to the upper guide plate or the lower guide plate.

Images