Electronic commutation motor

Abstract

The invention provides an electronic commutation motor which comprises a motor and a driver, an output shaft of the motor is located at the front end of the motor, and the driver comprises a main control board and a shell. The main control board is arranged at the end, away from the output shaft, of the motor. The shell covers the main control board. Electrical elements are borne on the side, away from the motor, of the main control board and comprise the first electrical element and the second electrical element, and the height of the first electrical element is smaller than that of the second electrical element in the direction, away from the main control board, of the electrical elements; the shell comprises heat dissipation fins, the heat dissipation fins comprise first heat dissipation fins and second heat dissipation fins, the first heat dissipation fins are located on the first electrical element, and the second heat dissipation fins are located on the second electrical element; in the direction, away from the main control board, of the heat dissipation fins, the size of the first heat dissipation fins is larger than that of the second heat dissipation fins. According to electrical elements with different heights, heat dissipation fins with different sizes are matched, so that the heat dissipation fins on the shell are of a stepped heat dissipation structure, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the field of motor technology, specifically to an electronically commutated motor. Background Technology

[0002] With the rapid development of technology, the integration and intelligence of motor drivers are constantly improving, and the number of electrical components inside them has increased significantly. During the operation of the motor, the electrical components in the driver will generate a lot of heat. If the heat cannot be dissipated in time, the high temperature will affect the switching characteristics of semiconductor devices, leading to a decrease in driving efficiency and even causing control signal distortion. Furthermore, long-term high-temperature operation will accelerate the aging of electrical components, shorten the life of the motor driver, and increase the failure rate.

[0003] However, existing motor drives enhance heat dissipation by installing fans on the heat sink housing, but fan cooling solutions are prone to damage, noise, and vibration, resulting in low heat dissipation efficiency. Furthermore, the size of the fan also restricts the application of the motor in efficient and compact systems. Summary of the Invention

[0004] The purpose of this invention is to provide an electronically commutated motor that achieves fanless active cooling and improves heat dissipation by setting a stepped heat dissipation structure.

[0005] To achieve the above objectives, the present invention provides an electronically commutated motor, comprising: a motor and a driver, wherein the output shaft of the motor is located at the front end of the motor, and the driver includes a main control board and a housing; the main control board is disposed at the end of the motor opposite to the output shaft, and the housing covers the main control board; an electrical component is carried on the side of the main control board opposite to the motor, the electrical component including a first electrical component and a second electrical component, wherein the height of the first electrical component is less than the height of the second electrical component in the direction away from the main control board; the housing includes heat dissipation fins, the heat dissipation fins including a first heat dissipation fin and a second heat dissipation fin, the first heat dissipation fin being located at the first electrical component, and the second heat dissipation fin being located at the second electrical component; in the direction away from the main control board, the size of the first heat dissipation fin is larger than the size of the second heat dissipation fin.

[0006] The technical effects achieved by adopting this solution are as follows: For first and second electrical components of different heights, matching first and second heat sink fins of different sizes creates a stepped heat dissipation structure on the driver housing. This ensures precise matching of heat dissipation capacity to the heat generated by the electrical components, avoiding localized overheating or redundant heat dissipation, achieving fanless active cooling, and improving heat dissipation efficiency. It is particularly suitable for scenarios with stringent requirements for quiet operation, size, and reliability.

[0007] Preferably, the electrical components further include a third electrical component, and in the direction away from the main control board, the height of the second electrical component is less than the height of the third electrical component; the heat dissipation fins further include a third heat dissipation fin, which is located on the third electrical component; in the direction away from the main control board, the size of the second heat dissipation fin is greater than the size of the third heat dissipation fin.

[0008] The technical effects achieved by adopting this solution are as follows: By setting three electrical components of different heights (first, second, and third) and matching them with corresponding sizes of heat dissipation fins, more refined heat dissipation management is achieved. The largest first heat dissipation fin corresponds to the smallest first electrical component, the medium-sized second heat dissipation fin corresponds to the medium-sized second electrical component, and the smallest third heat dissipation fin corresponds to the tallest third electrical component. This stepped design ensures that each electrical component can obtain a heat dissipation area that matches its height and heat generation, while also perfectly utilizing the three-dimensional space inside the housing. Without increasing the overall size of the motor, the heat dissipation efficiency is improved by optimizing the heat dissipation fin layout.

[0009] Preferably, the first electrical component is an insulated gate bipolar transistor module; and / or the second electrical component is a transformer; and / or the third electrical component is a film capacitor.

[0010] The technical effects achieved by adopting this technical solution are as follows: the insulated gate bipolar transistor module, as the main switching device, is equipped with the largest first heat sink fin to ensure efficient dissipation of high-frequency switching losses; the transformer, due to its low-to-medium frequency heating characteristics, uses a medium-sized second heat sink fin; and the film capacitor, as a temperature-sensitive energy storage element, achieves gentle heat dissipation through the smallest third heat sink fin. Therefore, this technical solution achieves more precise and efficient thermal management by specifically matching key heat-generating components with dedicated heat dissipation structures.

[0011] Preferably, the end of the electrical component away from the main control board is provided with a heat dissipation substrate, which conducts the heat generated by the electrical component to the housing.

[0012] The technical effects achieved by adopting this solution are as follows: By setting a heat dissipation substrate between the electrical components and the housing, an efficient heat conduction path is constructed. The heat dissipation substrate is closely attached to the electrical components, and heat is quickly absorbed by the heat dissipation substrate and evenly conducted to the housing. Then, efficient heat dissipation is achieved through stepped heat dissipation fins. This not only solves the noise and vibration problems of traditional fan solutions, but also avoids the local overheating phenomenon commonly found in fanless designs. At the same time, the heat dissipation substrate also has a structural support function, which enhances the mechanical stability of the main control board while improving heat dissipation efficiency. It is particularly suitable for high power density applications that require long-term reliable operation.

[0013] Preferably, the housing has an opening, and the main control board is divided into a first region and a second region; the first region is the cavity inside the housing corresponding to the heat dissipation fins, and the second region is the cavity inside the housing corresponding to the opening.

[0014] The technical effects achieved by adopting this technical solution are as follows: By dividing the main control board into a first area with corresponding heat dissipation fins and a second area with corresponding openings, the first area forms a closed and efficient heat dissipation cavity. The heat dissipation of core heat-generating components such as insulated gate bipolar transistor modules and transformers is centrally managed through the heat dissipation fin structure. At the same time, the second area forms a maintenance channel through the opening design, allowing for quick inspection or replacement of vulnerable parts without disassembling the entire housing.

[0015] Preferably, the electrical components include an insulated-gate bipolar transistor module, a transformer, a metal-oxide-semiconductor field-effect transistor, and a thin-film capacitor, wherein the insulated-gate bipolar transistor module, the transformer, the metal-oxide-semiconductor field-effect transistor, and the thin-film capacitor are located in the first region.

[0016] The technical effect achieved by adopting this technical solution is as follows: By concentrating key heat-generating components such as insulated gate bipolar transistor modules, transformers, metal-oxide-semiconductor field-effect transistors, and thin-film capacitors in a first area with heat dissipation fins, this zoned centralized heat dissipation can optimize the operating temperature gradient of each electrical component within the optimal range.

[0017] Preferably, the electrical components include terminals, relays, common-mode inductors, display interfaces, and DC-DC power supplies, with the terminals, relays, common-mode inductors, display interfaces, and DC-DC power supplies located in the second area.

[0018] The technical effects achieved by adopting this technical solution are as follows: By concentrating electrical components such as terminals, relays, common-mode inductors, display interfaces, and DC-DC converters in a second area with openings, the openings provide convenient access for components that require frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing.

[0019] Preferably, the housing also includes a cover plate that engages with the opening.

[0020] The technical effects achieved by adopting this technical solution are as follows: by setting a snap-on cover at the opening of the housing, the internal electrical components can be effectively protected and dust can be prevented from entering the drive.

[0021] Preferably, the housing includes an end cover and a side panel, with heat dissipation fins and openings disposed on the end cover, and the heat dissipation fins extending from the end cover to the side panel.

[0022] The technical effect achieved by adopting this technical solution is that the heat dissipation fins are extended from the end cover to the side plate, making the heat dissipation fins more widely distributed and further improving the heat dissipation effect.

[0023] Preferably, the heat dissipation substrate is made of heat dissipation material; and / or the thickness of the heat dissipation substrate is 20μm~200μm.

[0024] The technical effects achieved by adopting this technical solution are as follows: the heat dissipation substrate made of a heat dissipation material with high thermal conductivity enables the heat generated by electrical components to be quickly transferred to the heat dissipation fins; the ultra-thin design of the heat dissipation substrate reduces the thickness of the thermal resistance layer, further shortening the thermal response speed. Attached Figure Description

[0025] Figure 1 An exploded view of the structure of the electronically commutated motor provided in the embodiments of this application; Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the shell provided in an embodiment of this application; Figure 4 This is a schematic diagram of the main control board provided in an embodiment of this application; Figure 5 This is a structural schematic diagram of the main control board provided in an embodiment of this application from another perspective; Figure 6 An exploded view of the motor portion provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures: 1. Motor; 11. Output shaft; 12. Motor front end cover; 121. First threaded hole; 13. Motor side panel; 131. Second threaded hole; 14. Motor rear end cover; 141. Third threaded hole; 142. Fourth threaded hole; 15. First screw; 2. Driver; 21. Main control board; 211. First area; 212. Second area; 22. Housing; 221. Heat sink fins; 2211. First heat sink fin; 2212. Second heat sink fin; 2213. Third heat sink fin; 2214. Fourth heat sink fin; 222. Opening; 223. Cover plate; 224. End cap; 225. Side panel; 226. Fifth threaded hole; 227. Second screw; 23. Electrical component; 231. Insulated gate bipolar transistor module; 232. Transformer; 233. Thin film capacitor; 234. Metal-oxide-semiconductor field-effect transistor; 235. Terminal block; 236. Relay; 237. Common mode inductor; 238. Display interface; 239. DC-DC converter; 24. Heat sink; 241. First heat sink; 242. Second heat sink; 243. Third heat sink; 244. Fourth heat sink. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of the present invention more apparent and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] This application provides an electronically commutated motor, see... Figures 1 to 3 As shown, Figure 1 This is an exploded view illustrating the structure of the electronically commutated motor provided in the embodiments of this application. Figure 2 This is a schematic diagram of the electronic commutator motor structure provided in an embodiment of this application. Figure 3 This is a schematic diagram of the housing structure provided in an embodiment of this application. The electronically commutated motor includes a motor 1 and a driver 2. The output shaft 11 of the motor 1 is located at the front end of the motor 1. The driver 2 includes a main control board 21 and a housing 22. The main control board 21 is located at the end of the motor 1 away from the output shaft 11. The housing 22 covers the main control board 21, and the side of the main control board 21 away from the motor 1 carries an electrical component 23. The electrical component 23 includes a first electrical component and a second electrical component. In the direction away from the main control board 21, the height of the first electrical component is less than the height of the second electrical component. The housing 22 includes heat dissipation fins 221, which include a first heat dissipation fin 2211 and a second heat dissipation fin 2212. The first heat dissipation fin 2211 is located at the first electrical component, and the second heat dissipation fin 2212 is located at the second electrical component. In the direction away from the main control board 21, the size of the first heat dissipation fin 2211 is larger than the size of the second heat dissipation fin 2212. For the first and second electrical components of different heights, first heat sink fins 2211 and second heat sink fins 2212 of different sizes are matched, so that the heat sink fins 221 on the housing 22 have a stepped heat dissipation structure. This allows the heat dissipation capacity to be precisely matched with the heat generation of the electrical component 23, avoiding local overheating or heat dissipation redundancy, realizing fanless active cooling and improving the heat dissipation effect. It is particularly suitable for scenarios with strict requirements for quietness, size and reliability.

[0029] Furthermore, the electrical component 23 also includes a third electrical component. In the direction away from the main control board 21, the height of the second electrical component is less than the height of the third electrical component. The heat dissipation fin 221 also includes a third heat dissipation fin 2213, which is located on the third electrical component. In the direction away from the main control board 21, the size of the second heat dissipation fin 2212 is greater than the size of the third heat dissipation fin 2213. By setting three electrical components of different heights—the first, second, and third electrical components—and matching them with corresponding sizes of first heat dissipation fins 2211, second heat dissipation fins 2212, and third heat dissipation fins 2213, more refined heat dissipation management is achieved. The largest first heat dissipation fin 2211 corresponds to the smallest first electrical component, the medium-sized second heat dissipation fin 2212 corresponds to the medium-sized second electrical component, and the smallest third heat dissipation fin 2213 corresponds to the tallest third electrical component. This stepped design ensures that each electrical component can obtain a heat dissipation area that matches its height and heat generation, and also perfectly utilizes the three-dimensional space inside the housing 22. Without increasing the overall volume of the motor 1, the heat dissipation efficiency is improved by optimizing the layout of the heat dissipation fins 221.

[0030] Further, see Figure 4 As shown, Figure 4 The schematic diagram of the main control board provided in this application embodiment shows that the first electrical component is an insulated gate bipolar transistor module 231; and / or the second electrical component is a transformer 232; and / or the third electrical component is a film capacitor 233. The insulated gate bipolar transistor module 231, as the main switching device, is equipped with the largest size first heat sink fin 2211 to ensure efficient dissipation of high-frequency switching losses; the transformer 232, due to its low-to-medium frequency heating characteristics, uses a medium-sized second heat sink fin 2212; and the film capacitor 233, as a temperature-sensitive energy storage element, achieves gentle heat dissipation through the smallest size third heat sink fin 2213. Therefore, this technical solution achieves more precise and efficient thermal management by specifically matching key heat-generating components with dedicated heat dissipation structures.

[0031] Specifically, in the direction away from the main control board 21, the height of the insulated gate bipolar transistor module 231 is less than the height of the transformer 232, the height of the transformer 232 is less than the height of the film capacitor 233, the position of the insulated gate bipolar transistor module 231 corresponds to the first heat sink fin 2211, the position of the transformer 232 corresponds to the second heat sink fin 2212, and the position of the film capacitor 233 corresponds to the third heat sink fin 2213. The first heat sink fin 2211 forms a first heat sink groove, the second heat sink fin 2212 forms a second heat sink groove, and the third heat sink fin 2213 forms a third heat sink groove. The heat dissipation grooves have different depths. The first heat dissipation groove is deeper than the second heat dissipation groove, and the second heat dissipation groove is deeper than the third heat dissipation groove. In other words, the lower the height of the electrical component 23, the deeper its corresponding heat dissipation groove; the higher the height of the electrical component 23, the shallower its corresponding heat dissipation groove. The deeper the heat dissipation groove, the larger the surface area of ​​the heat dissipation fins 221, and the better the heat dissipation effect. That is, according to the different heights of the electrical component 23, heat dissipation fins 221 of different sizes are set so that the electrical component 23 and the heat dissipation fins 221 can come into contact as close as possible, so that the heat generated by the electrical component 23 can be transferred to the heat dissipation fins 221 very quickly.

[0032] It should be noted that, see Figure 5 As shown, Figure 5 This is a structural schematic diagram of the main control board provided in another perspective of the embodiments of this application. The electrical component 23 is not limited to the insulated gate bipolar transistor module 231, the transformer 232 and the thin film capacitor 233. The first electrical component can also be a metal-oxide-semiconductor field-effect transistor 234. The height of the metal-oxide-semiconductor field-effect transistor 234 can be equal to the height of the insulated gate bipolar transistor module 231, and the height of the metal-oxide-semiconductor field-effect transistor 234 can also be less than the height of the insulated gate bipolar transistor module 231.

[0033] In other embodiments, the end of the electrical component 23 facing away from the main control board 21 is provided with a heat dissipation substrate 24, which conducts the heat generated by the electrical component 23 to the housing 22.

[0034] For example, the heat dissipation substrate 24 includes a first heat dissipation substrate 241, a second heat dissipation substrate 242, and a third heat dissipation substrate 243. The first heat dissipation substrate 241 is disposed between the insulated gate bipolar transistor module 231 and the first heat dissipation fin 2211, and abuts against the first heat dissipation fin 2211. The second heat dissipation substrate 242 is disposed between the transformer 232 and the second heat dissipation fin 2212, and abuts against the second heat dissipation fin 2212. The third heat dissipation substrate 243 is disposed between the film capacitor 233 and the third heat dissipation fin 2213, and abuts against the third heat dissipation fin 2213. This allows the heat generated by the insulated gate bipolar transistor module 231 to be conducted to the first heat dissipation fin 2211 through the first heat dissipation substrate 241, the heat generated by the transformer 232 to be conducted to the second heat dissipation fin 2212 through the second heat dissipation substrate 242, and the heat generated by the film capacitor 233 to be conducted to the third heat dissipation fin 2213 through the third heat dissipation substrate 243. By setting a heat dissipation substrate 24 between the electrical component 23 and the housing 22, an efficient heat conduction path is constructed. The heat dissipation substrate 24 is closely attached to the electrical component 23, and heat is quickly absorbed by the heat dissipation substrate 24 and evenly conducted to the housing 22. Then, efficient heat dissipation is achieved through stepped heat dissipation fins 221. This not only solves the noise and vibration problems of traditional fan solutions, but also avoids the local overheating phenomenon common in fanless designs. At the same time, the heat dissipation substrate 24 also has a structural support function, which enhances the mechanical stability of the main control board 21 while improving heat dissipation efficiency. It is particularly suitable for high power density application scenarios that require long-term reliable operation.

[0035] For example, when the electrical component 23 also includes a metal-oxide-semiconductor field-effect transistor 234, the heat dissipation substrate 24 also includes a fourth heat dissipation substrate 244, and the heat dissipation fins 221 also include a fourth heat dissipation fin 2214. The fourth heat dissipation substrate 244 is disposed between the metal-oxide-semiconductor field-effect transistor 234 and the fourth heat dissipation fin 2214, so that the heat generated by the metal-oxide-semiconductor field-effect transistor 234 is conducted to the fourth heat dissipation fin 2214 through the fourth heat dissipation substrate 244 for heat dissipation.

[0036] In some other embodiments, see Figure 5As shown, the housing 22 includes an opening 222, and the main control board 21 is divided into a first region 211 and a second region 212. The first region 211 is the cavity inside the housing 22 corresponding to the heat dissipation fins 221, and the second region 212 is the cavity inside the housing 22 corresponding to the opening 222. By dividing the main control board 21 into the first region 211 corresponding to the heat dissipation fins 221 and the second region 212 corresponding to the opening 222, the first region 211 forms a closed, high-efficiency heat dissipation cavity, and the heat dissipation of core heat-generating components such as IGBTs and transformers 232 is centrally managed through the structure of the heat dissipation fins 221. At the same time, the second region 212 forms a maintenance channel through the opening 222, allowing for quick inspection or replacement of vulnerable parts without disassembling the entire housing 22. Furthermore, the electrical components 23 include an insulated-gate bipolar transistor (IGBT) module 231, a transformer 232, a metal-oxide-semiconductor (MOSFET) field-effect transistor (MOSFET) 234, and a thin-film capacitor 233, all located in the first region 211. By concentrating key electrical components such as the IGBT module 231, transformer 232, thin-film capacitor 233, and MOSFET 234 within the first region 211 equipped with heat sink fins 221, this zoned centralized heat dissipation optimizes the operating temperature gradient of each component within its optimal range.

[0037] Furthermore, electrical components 23 include terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239. These components are located in the second region 212. By centrally arranging auxiliary electrical components 23 such as terminal blocks 235, relays 236, common-mode inductors 237, display interfaces 238, and DC-DC converters 239 within the second region 212 with openings 222, the openings provide convenient physical access for components requiring frequent operation and maintenance, allowing wiring adjustments or component replacements to be completed without disassembling the entire housing 22. The first region 211 and the second region 212 are demarcated by the end face of the insulated-gate bipolar transistor module 231 near the common-mode inductor 237.

[0038] Further, see Figure 1 As shown, the housing 22 also includes a cover plate 223, which is fastened to the opening 222. By providing a fastening cover plate 223 at the opening 222 of the housing 22, the internal electrical components 23 can be effectively protected and dust can be prevented from entering the driver 2.

[0039] Furthermore, the housing 22 also includes an end cover 224 and a side plate 225. The heat dissipation fins 221 and the opening 222 are disposed on the end cover 224, and the side plate 225 is connected to the periphery of the end cover 224. The heat dissipation fins 221 extend from the end cover 224 to the side plate 225, so that the heat dissipation fins 221 are more widely distributed, and the heat dissipation effect is further improved.

[0040] Among them, see Figure 1 and Figure 6 As shown, Figure 6 The exploded view of the motor portion provided in this embodiment shows that the motor 1 includes a front cover 12, a side panel 13, and a rear cover 14. The front cover 12 is located at the end of the motor near the output shaft 11. The rear cover 14 is located between the motor 1 and the driver 2. The side panel 13 is located between the front cover 12 and the rear cover 14. The front cover 12 has a first threaded hole 121, the side panel 13 has a second threaded hole 131, and the rear cover 14 has a third threaded hole 141. A first screw 15 is sequentially inserted into the first threaded hole 121, the second threaded hole 131, and the third threaded hole 141 to securely connect the front cover 12, the side panel 13, and the rear cover 14. The first screw 15 sequentially passing through the threaded holes of the front cover 12, the side panel 13, and the rear cover 14 achieves a tight connection between the three components, improving the rigidity and stability of the overall structure and reducing the risk of vibration or loosening during assembly.

[0041] The motor rear end cover 14 has a fourth threaded hole 142, and the housing 22 has a fifth threaded hole 226. A second screw 227 passes through the fourth threaded hole 142 and the fifth threaded hole 226 to securely connect the motor rear end cover 14 and the housing 22. The second screw 227 directly fastens the motor rear end cover 14 to the housing 22, forming a stable mechanical connection. This further effectively improves the vibration resistance and load-bearing capacity of the electronic commutator motor during operation, reducing component loosening or displacement caused by vibration. The first screw 15 and the second screw 227 ensure a firm and reliable connection for the electronic commutator motor.

[0042] Furthermore, the heat dissipation fins 221 can be straight, U-shaped, or inclined. In order to further increase the surface area of ​​the heat dissipation fins 221, the heat dissipation fins 221 can be designed as a combination of straight, U-shaped and inclined shapes according to actual needs, so that the heat dissipation fins 221 can make full use of the space of the housing 22 and improve the heat dissipation performance.

[0043] Furthermore, the heat dissipation substrate 24 is made of a heat dissipation material; and / or the thickness of the heat dissipation substrate 24 is 20μm~200μm. The heat dissipation substrate 24, made of a highly thermally conductive heat dissipation material, allows the heat generated by the electrical component 23 to be rapidly transferred to the heat dissipation fins 221; the ultra-thin design of the heat dissipation substrate 24 reduces the thickness of the thermal resistance layer, further shortening the thermal response speed. The heat dissipation substrate 24 can be tightly attached to the surface of the electrical component 23 through a welding process or a coating process. The heat dissipation material can be a metal-based material (such as aluminum, copper, and their alloys), a thermally conductive interface material (such as silicone grease, gaskets, phase change materials), a highly thermally conductive non-metallic material (such as graphene, aluminum nitride), a composite material (such as metal-diamond, thermally conductive plastics), or a liquid metal (such as gallium-based alloys), etc.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronically commutated motor, characterized in that, It includes a motor (1) and a driver (2), the output shaft (11) of the motor (1) is located at the front end of the motor (1), and the driver (2) includes a main control board (21) and a housing (22). The main control board (21) is located at one end of the motor (1) away from the output shaft (11), and the housing (22) covers the main control board (21). The main control board (21) carries an electrical component (23) on the side away from the motor (1); the electrical component (23) includes a first electrical component and a second electrical component, and in the direction away from the main control board (21) of the electrical component (23), the height of the first electrical component is less than the height of the second electrical component; The housing (22) includes heat dissipation fins (221), the heat dissipation fins (221) include a first heat dissipation fin (2211) and a second heat dissipation fin (2212), the first heat dissipation fin (2211) is located on the first electrical component, and the second heat dissipation fin (2212) is located on the second electrical component; In the direction away from the main control board (21) of the heat dissipation fins (221), the size of the first heat dissipation fin (2211) is larger than the size of the second heat dissipation fin (2212).

2. The electronically commutated motor according to claim 1, characterized in that, The electrical component (23) further includes a third electrical component, wherein the height of the second electrical component is less than the height of the third electrical component in the direction away from the main control board (21) of the electrical component (23); the heat dissipation fin (221) further includes a third heat dissipation fin (2213), which is located on the third electrical component; in the direction away from the main control board (21) of the heat dissipation fin (221), the size of the second heat dissipation fin (2212) is greater than the size of the third heat dissipation fin (2213).

3. The electronically commutated motor according to claim 2, wherein the first electrical component is an insulated gate bipolar transistor module (231); and / or The second electrical component is a transformer (232); and / or The third electrical component is a thin-film capacitor (233).

4. The electronically commutated motor according to claim 1, characterized in that, The electrical component (23) has a heat dissipation substrate (24) at one end away from the main control board (21), and the heat dissipation substrate (24) conducts the heat generated by the electrical component (23) to the housing (22).

5. The electronically commutated motor according to claim 1, characterized in that, The housing (22) has an opening (222), and the main control board (21) is divided into a first region (211) and a second region (212). The first region (211) is the cavity inside the housing (22) corresponding to the heat dissipation fins (221), and the second region (212) is the cavity inside the housing (22) corresponding to the opening (222).

6. The electronically commutated motor according to claim 5, characterized in that, The electrical component (23) includes an insulated gate bipolar transistor module (231), a transformer (232), a thin film capacitor (233), and a metal-oxide-semiconductor field-effect transistor (234), wherein the insulated gate bipolar transistor module (231), the transformer (232), the thin film capacitor (233), and the metal-oxide-semiconductor field-effect transistor (234) are located in the first region (211).

7. The electronically commutated motor according to claim 5, characterized in that, The electrical components include a terminal block (235), a relay (236), a common-mode inductor (237), a display interface (238), and a DC-DC converter (239), wherein the terminal block (235), the relay (236), the common-mode inductor (237), the display interface (238), and the DC-DC converter (239) are located in the second region (212).

8. The electronically commutated motor according to claim 5, characterized in that, The housing (22) also includes a cover plate (223) that engages with the opening (222).

9. The electronically commutated motor according to claim 5, characterized in that, The housing (22) includes an end cap (224) and a side panel (225). The heat dissipation fins (221) and the opening (222) are disposed on the end cap (224). The heat dissipation fins (221) extend from the end cap (224) to the side panel (225).

10. The electronically commutated motor according to claim 4, characterized in that, The heat dissipation substrate (24) is made of a heat dissipation material; and / or The thickness of the heat dissipation substrate (24) is 20μm ~ 200μm.

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