Pose adjusting device for wafer measurement

Abstract

The invention discloses a position and posture adjusting device for wafer measurement, the device is used for adjusting a jig clamping a target wafer, and the device comprises a first supporting mechanism which comprises a first V-shaped structural member and is used for positioning and supporting a first positioning member so as to determine a reference point of a semi-closed jig; the second supporting mechanism comprises a first guiding piece and a second V-shaped structural piece arranged in the first guiding piece in a sliding mode, and is used for positioning and supporting the second positioning piece, and a first adjusting assembly and a second adjusting assembly which are used for adjusting; and the third supporting mechanism comprises a second guiding piece and a third V-shaped structural piece arranged in the second guiding piece in a sliding mode, and is used for positioning and supporting the third positioning piece, and a third adjusting assembly and a fourth adjusting assembly which are used for adjusting. According to the invention, the pose of the target wafer in the equipment main body can be adjusted, so that the detection efficiency and the detection precision of wafer measurement are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection equipment, in particular to a pose adjusting device for wafer measurement. BACKGROUND

[0002] In the process of measuring the wafer, the wafer needs to be placed in the wafer measurement equipment, and then the related parameters of the wafer are measured through the mirror group in the wafer measurement equipment. After the wafer is placed in the wafer measurement equipment, the placement angle of the wafer is adjusted through the adjusting mechanism in the wafer measurement equipment, so as to provide necessary conditions for accurate measurement of the wafer.

[0003] The current adjusting mechanism usually swings the clamping jig of the wafer by a proper amplitude, that is, swings along the two sides of the axial direction of the wafer, so that the angle of the wafer relative to the outgoing light of the mirror group is changed to be perpendicular to the light. However, due to the initial placement deviation of the wafer, it is impossible to ensure that the V-shaped groove or horizontal groove on the wafer is always aligned with the specific mark. When there is a certain rotational angle difference in the placement of the wafer, the detection efficiency and detection accuracy of the wafer measurement will be obviously reduced. SUMMARY

[0004] In view of the defects in the prior art, the purpose of the present application is to provide a pose adjusting device for wafer measurement, which aims to solve the problem in the prior art that, when measuring the wafer, due to the initial placement deviation of the wafer, it is impossible to ensure that the V-shaped groove or horizontal groove on the wafer is always aligned with the specific mark, and when there is a certain rotational angle difference in the placement of the wafer, the detection efficiency and detection accuracy of the wafer measurement will be obviously reduced.

[0005] In order to achieve the above purpose, the present application adopts the following technical solutions: A pose adjusting device for wafer measurement is arranged in a wafer measurement equipment, the wafer measurement equipment comprises an equipment main body and a mirror group unit arranged in the equipment main body, and the device is used for adjusting a semi-closed jig clamping a target wafer, so as to change the relative position of the target wafer between the equipment main body and the mirror group unit; The device comprises: A first supporting mechanism comprising a first V-shaped structural member, used for positioning and supporting a first positioning member arranged at a first position of an opening of the semi-closed jig, so as to determine the reference point of the semi-closed jig; A second supporting mechanism comprising a first guide member and a second V-shaped structural member slidingly arranged in the first guide member, used for positioning and supporting a second positioning member arranged at a second position of the opening of the semi-closed jig, and a first adjusting assembly and a second adjusting assembly respectively used for adjusting the Y-direction movement and X-direction movement of the second V-shaped structural member relative to the first guide member; A third supporting mechanism includes a second guide and a third V-shaped structure slidingly arranged in the second guide, and is used for positioning and supporting a third positioning element arranged at a third position in the semi-closed jig, and a third adjusting assembly and a fourth adjusting assembly respectively used for adjusting Y-direction movement and Z-direction movement of the third V-shaped structure relative to the second guide.

[0006] According to an aspect of the above technical solution, the jig is a semi-closed jig, and one side of the semi-closed jig is provided with an opening.

[0007] According to an aspect of the above technical solution, the first positioning element and the second positioning element are arranged at a first position and a second position on both sides of the opening of the semi-closed jig.

[0008] According to an aspect of the above technical solution, the first positioning element, the second positioning element and the third positioning element have the same structure, and each include a fixed part used for connecting the semi-closed jig and a positioning part extending outward. The first positioning part in the first positioning element is used for abutting into a first V-shaped groove on a surface of the first V-shaped structure, the second positioning part in the second positioning element is used for abutting into a second V-shaped groove on a surface of the second V-shaped structure, and the third positioning part in the third positioning element is used for abutting into a third V-shaped groove on a surface of the third V-shaped structure.

[0009] According to an aspect of the above technical solution, in the first supporting mechanism, the first V-shaped structure is fixed on the equipment main body, the first V-shaped groove extends along the X direction on a top surface of the first V-shaped structure, and the first positioning part in the first positioning element abuts into the first V-shaped groove.

[0010] According to an aspect of the above technical solution, in the second supporting mechanism, the first guide is slidingly connected to the equipment main body, and the second V-shaped structure is slidingly connected to the first guide.

[0011] According to an aspect of the above technical solution, the first adjusting assembly is used for driving the first guide to move along the Y direction to drive the second V-shaped structure and the second positioning element to move along the Y direction, so that the position of the second positioning element changes to drive the semi-closed jig and the target wafer to swing around the reference point. The second adjusting assembly is used for driving the second V-shaped structure to move along the X direction in the first guide, so that the position of the second positioning element changes to drive the semi-closed jig and the target wafer to swing around the reference point.

[0012] According to an aspect of the above technical solution, the first guide piece is provided with a reset through hole penetrating in the X direction, and an elastic piece is arranged in the reset through hole, one end of the elastic piece is fixed in the reset through hole, and the other end is connected to a flange on the second V-shaped structure piece through the reset through hole, so that the elastic piece is connected between the first guide piece and the second V-shaped structure piece, so that the second V-shaped structure piece always has a tendency to move towards the first guide piece.

[0013] According to an aspect of the above technical solution, in the third supporting mechanism, the second guide piece is slidingly connected to the equipment body, and the third V-shaped piece is slidingly connected to the second guide piece.

[0014] According to an aspect of the above technical solution, the third adjusting assembly is used to drive the second guide piece to move in the Y direction to drive the third V-shaped structure piece and the third positioning piece to move in the Y direction, so that the position of the third positioning piece changes to drive the semi-closed jig and the target wafer to swing around the reference point. The fourth adjusting assembly is used to drive the third V-shaped structure piece to move in the Z direction in the second guide piece, so that the position of the second positioning piece changes to drive the semi-closed jig and the target wafer to swing around the reference point.

[0015] Compared with the prior art, the pose adjusting device for wafer measurement has the following beneficial effects: The present application sets a mirror group unit in the equipment body of the wafer measurement equipment, and a jig for fixing the target wafer in the equipment body. The first V-shaped structure piece in the first supporting mechanism positions and supports the first positioning piece at the first position of the semi-closed jig, so as to form the reference point of wafer pose adjustment. The first guide piece and the second V-shaped structure piece in the second supporting mechanism cooperate to realize Y-direction adjustment and X-direction adjustment of the second positioning piece at the second position of the semi-closed jig under the promotion of the first adjusting assembly and the second adjusting assembly. The second guide piece and the third V-shaped structure piece in the third supporting mechanism cooperate to realize Y-direction adjustment and Z-direction adjustment of the third positioning piece at the third position of the semi-closed jig under the promotion of the third adjusting assembly and the fourth adjusting assembly. Therefore, the position and attitude of the target wafer in the equipment body can be adjusted by the first supporting mechanism, the second supporting mechanism and the third supporting mechanism, the slight rotation angle difference after the wafer is placed can be eliminated, accurate imaging is facilitated, and the detection efficiency and detection precision of wafer measurement can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the references to the following drawings, of which: Figure 1 A perspective view of a pose adjustment device for wafer measurement according to an embodiment of the present application; Figure 2 A sectional view of a pose adjustment device for wafer measurement according to an embodiment of the present application; Figure 3 A structural view of a second support mechanism according to an embodiment of the present application; Figure 4 A structural view of a third support mechanism according to an embodiment of the present application; Explanation of the symbols of the components in the drawings: apparatus main body 10, semi-enclosed jig 20, first position 20a, second position 20b, third position 20c, first positioning member 21, second positioning member 22, third positioning member 23, target wafer 30, first support mechanism 40, first V-shaped structural member 41, second support mechanism 50, first guide member 51, reset through hole 51a, second V-shaped structural member 52, second V-shaped groove 52a, first adjustment assembly 53, second adjustment assembly 54, third support mechanism 60, second guide member 61, third V-shaped structural member 62, third V-shaped groove 62a, third adjustment assembly 63, fourth adjustment assembly 64. DETAILED DESCRIPTION

[0017] In order to make the objects, features and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0019] Embodiment One Please refer to Figures 1-4 The first embodiment of the present application provides a pose adjustment device for wafer measurement, which is arranged in a wafer measurement apparatus. The wafer measurement apparatus includes an apparatus main body 10 and a lens unit (not shown in the figure) arranged in the apparatus main body 10 for imaging detection of a target wafer 30.

[0020] Wherein, when the device is used to detect the target wafer 30, the target wafer 30 needs to be clamped and fixed by the semi-closed clamp 20 preset in the device, and then the position and pose of the semi-closed clamp 20 are adjusted, including the adjustment of multiple degrees of freedom in XYZ directions and the like, so as to change the relative position of the target wafer 30 in the equipment main body 10 and the lens unit through the driving of the semi-closed clamp 20, so that the distance and angle between the target wafer 30 and the lens unit can be finely adjusted, the position and pose of the target wafer 30 in the equipment main body 10 are changed, and thus the imaging accuracy of the lens unit and the overall detection efficiency can be improved.

[0021] Firstly, it is explained that the target wafer 30 is an additional object loaded on the semi-closed clamp 20, and the functions of the device include adjusting the position and pose of the target wafer 30. However, in fact, the position and pose of the semi-closed clamp 20 are adjusted, and the target wafer 30 moves with the semi-closed clamp 20 to realize the adjustment of the position and pose of the target wafer 30. For the convenience of explanation, the effect of adjusting the semi-closed clamp 20 and the target wafer 30 is collectively referred to as adjusting the target wafer 30.

[0022] In this embodiment, the device includes a first supporting mechanism 40 for positioning the reference point of the semi-closed clamp 20 and the target wafer 30 fixed thereon, a second supporting mechanism 50 for adjusting the semi-closed clamp 20 and the target wafer 30 fixed thereon, and a third supporting mechanism 60 for adjusting the semi-closed clamp 20 and the target wafer 30 fixed thereon. Through the first supporting mechanism 40, the second supporting mechanism 50 and the third supporting mechanism 60, the positioning, supporting and adjusting of the target wafer 30 are realized, so that the position and pose of the target wafer 30 in the equipment main body 10 are adjustable.

[0023] Specifically, the semi-closed clamp 20 is provided with an opening on at least one side, forming a C-shaped structure, or a semi-closed ring structure or a ring-like structure. The first position 20a and the second position 20b on both sides of the opening of the semi-closed clamp 20 are respectively provided with the first positioning member 21 and the second positioning member 22, and the third position 20c of the semi-closed clamp 20 away from the first positioning member 21 and the second positioning member 22 is provided with the third positioning member 23.

[0024] In this embodiment, the first positioning member 21, the second positioning member 22 and the third positioning member 23 are respectively matched with the first supporting mechanism 40, the second supporting mechanism 50 and the third supporting mechanism 60, so as to realize the adjustment of the position and pose of the target wafer 30.

[0025] More specifically: In the first supporting mechanism 40, it comprises a first V-shaped structure 41 arranged on the equipment body 10, and a first V-shaped groove (not shown) is arranged on the top surface of the first V-shaped structure 41 for positioning and supporting the first positioning member 21 at the first position 20a of the semi-enclosed jig 20. Specifically, the first V-shaped groove is arranged on the top surface of the first V-shaped structure 41 for positioning and supporting the first positioning member 21.

[0026] In addition, the position of the first V-shaped structure 41 on the equipment body 10 is fixed, and the first positioning member 21 is arranged in the first V-shaped groove. In this embodiment, since the position of the first V-shaped structure 41 is constant, it can be used as a reference point for the position adjustment of the semi-enclosed jig 20 and the target wafer 30. All adjustments of the semi-enclosed jig 20 and the target wafer 30 are based on this reference point.

[0027] In the second supporting mechanism 50, it comprises a first guide member 51 and a second V-shaped structure 52 slidably arranged in the first guide member 51, and the second V-shaped structure 52 is used for positioning and supporting the second positioning member 22 arranged on the semi-enclosed jig 20 at the second position 20b.

[0028] Different from the first supporting mechanism 40, the second supporting mechanism 50 further comprises a first adjusting assembly 53 for adjusting the first guide member 51, and a second adjusting assembly 54 for adjusting the second V-shaped structure 52.

[0029] More specifically, the first guide member 51 is slidably connected to the equipment body 10, and the first adjusting assembly 53 is fixed by an additional supporting block. By rotating the first knob in the first adjusting assembly 53, for example, by using a motor drive, the first guide member 51 moves along the Y direction, thereby driving the second V-shaped structure 52 to move along the Y direction, including the Y+ direction and the Y- direction.

[0030] In addition, the second adjusting assembly 54 directly acts on the second V-shaped structure 52 arranged along the X direction on the first guide member 51. By rotating the second knob in the second adjusting assembly 54, the same can be achieved by using a motor drive, so that the second V-shaped structure 52 moves along the X direction on the first guide member 51, including the X+ direction and the X- direction.

[0031] Through the first adjusting assembly 53 and the second adjusting assembly 54, the second V-shaped structure 52 is driven to move along the Y direction and the X direction, respectively, and finally the second positioning member 22 abutting against the second V-shaped groove 52a of the second V-shaped structure 52 drives the semi-enclosed jig 20 to swing, including the Y direction and the X direction, so that the target wafer 30 swings along the Y direction and the X direction with the reference point as the origin.

[0032] In addition, the first guide member 51 is provided with a reset through hole 51a penetrating along the X direction. The reset through hole 51a is provided with two elastic members (not shown in the figure) symmetrically arranged on both sides of the second V-shaped structure 52. One end of the elastic member is fixed in the reset through hole 51a, i.e., fixedly connected with the second V-shaped structure 52, and the other end penetrates out of the reset through hole 51a towards the side of the second adjusting assembly 54 and is connected to the flange on the second V-shaped structure 52, so that the elastic member is connected between the first guide member 51 and the second V-shaped structure 52, so that the second V-shaped structure 52 always has a tendency to move towards the first guide member 51.

[0033] Since the cooperation between the second V-shaped structure 52 and the second positioning member 22 is only through the open second V-shaped groove 52a, the second adjusting assembly 54 can only move the second positioning member 22 towards one side, which is equivalent to pushing the second positioning member 22 to move along the X direction, for example, the X- direction. When it is needed to move in the opposite direction, i.e., the X+ direction, by reversing the rotation of the second knob in the second adjusting assembly 54, under the elastic force of the elastic member, the second V-shaped structure 52 will move towards the first guide member 51 along the X+ direction, releasing the support to the second positioning member 22, and then the semi-closed jig 20 and the target wafer 30 will also swing.

[0034] Alternatively, the elastic member described above is a plunger, and only one end of the plunger is fixed in the reset through hole 51a of the second V-shaped structure 52, and the other end of the plunger is a free end which penetrates out of the reset through hole 51a and abuts against the flange side surface of the second V-shaped structure 52.

[0035] In the third support mechanism 60, it includes a second guide member 61, and a third V-shaped structure 62 slidingly arranged in the second guide member 61, which is used for positioning and supporting the third positioning member 23 in the third position 20c of the semi-closed jig 20.

[0036] The third support mechanism 60 is basically the same as the second support mechanism 50 described above, and further includes a third adjusting assembly 63 for adjusting the second guide member 61, and a fourth adjusting assembly 64 for adjusting the third V-shaped structure 62.

[0037] The second guide 61 is slidingly connected to the device main body 10, and the third adjusting assembly 63 is fixed in position. Rotation of the third knob of the third adjusting assembly 63 drives the second guide 61 to move the third V-shaped structure 62 in the Y direction, including the Y+ direction and the Y- direction. In addition, the fourth adjusting assembly 64 directly acts on the third V-shaped structure 62 arranged in the Z direction on the second guide 61. Rotation of the fourth knob of the fourth adjusting assembly 64 drives the third V-shaped structure 62 to move in the Z direction on the second guide 61, including the Z+ direction and the Z- direction.

[0038] The third V-shaped structure 62 is driven to move in the Y direction and the Z direction by the third adjusting assembly 63 and the fourth adjusting assembly 64, and finally the third positioning member 23 abutting against the third V-shaped groove 62a of the third V-shaped structure 62 drives the semi-closed jig 20 to swing, including Y direction and Z direction swing, so that the target wafer 30 swings in the Y direction and the Z direction with the reference point as the origin.

[0039] It should be noted that in the present embodiment, the first positioning member 21, the second positioning member 22 and the third positioning member 23 have the same structure, and each include a fixed part for connecting the semi-closed jig 20 and a positioning part extending outward. The first positioning part in the first positioning member 21 is used to abut into the first V-shaped groove on the surface of the first V-shaped structure 41, the second positioning part in the second positioning member 22 is used to abut into the second V-shaped groove 52a on the surface of the second V-shaped structure 52, and the third positioning part in the third positioning member 23 is used to abut into the third V-shaped groove 62a on the surface of the third V-shaped structure 62.

[0040] More specifically, the first fixed part, the second fixed part and the third fixed part can be fixed to the first position 20a, the second position 20b and the third position 20c of the semi-closed jig 20 by means of bolts or the like. The first positioning part, the second positioning part and the third positioning part extending from the first fixed part, the second fixed part and the third fixed part abut into the corresponding V-shaped grooves, so that the corresponding V-shaped structures can be positioned, supported and adjusted.

[0041] The working principle of the wafer pose adjusting device shown in the present embodiment is as follows: After the target wafer 30 is fixed by the semi-closed jig 20, according to the feedback of the imaging result of the lens unit, it is determined whether the pose of the target wafer 30 in the device main body 10 needs to be adjusted. If so, based on the reference point formed by the cooperation of the first support mechanism 40 and the first positioning piece 21, the first V-shaped structure 41 is adjusted by the first adjusting assembly 53 to make the first positioning piece 21 drive the semi-closed jig 20 and the target wafer 30 to swing along the Y direction, and / or the first V-shaped structure 41 is adjusted by the second adjusting assembly 54 to make the first positioning piece 21 drive the semi-closed jig 20 and the target wafer 30 to swing along the X direction, and / or the third V-shaped structure 62 is adjusted by the third adjusting assembly 63 to make the third positioning piece 23 drive the semi-closed jig 20 and the target wafer 30 to swing along the Y direction, and / or the third V-shaped structure 62 is adjusted by the fourth adjusting assembly 64 to make the third positioning piece 23 drive the semi-closed jig 20 and the target wafer 30 to swing along the Z direction, so that the target wafer 30 can be adjusted in the corresponding pose according to the actual situation of wafer imaging.

[0042] Compared with the prior art, the pose adjusting device for wafer measurement shown in the embodiment has the beneficial effects that: The embodiment sets the lens unit in the device main body 10 of the wafer measurement device, and sets the semi-closed jig 20 for fixing the target wafer 30 in the device main body 10. The first positioning piece 21 of the first position 20a of the semi-closed jig 20 is positioned and supported by the first V-shaped structure 41 in the first support mechanism 40, so as to form the reference point of wafer pose adjustment. The Y direction adjustment and X direction adjustment of the second positioning piece 22 of the second position 20b of the semi-closed jig 20 are realized by the cooperation of the first guide 51 and the second V-shaped structure 52 in the second support mechanism 50 under the promotion of the first adjusting assembly 53 and the second adjusting assembly 54, and the Y direction adjustment and Z direction adjustment of the third positioning piece 23 of the third position 20c of the semi-closed jig 20 are realized by the cooperation of the second guide 61 and the third V-shaped structure 62 in the third support mechanism 60 under the promotion of the third adjusting assembly 63 and the fourth adjusting assembly 64, so that the position and attitude of the target wafer 30 in the device main body 10 can be adjusted by the first support mechanism 40, the second support mechanism 50 and the third support mechanism 60, the slight rotation angle difference existing after the wafer is placed can be eliminated, accurate imaging is facilitated, and the detection efficiency and detection precision of wafer measurement can be improved.

[0043] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as the limitation of the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A device for adjusting the position of a wafer during measurement, the device being arranged in a wafer measurement apparatus, the wafer measurement apparatus comprising an apparatus body and a lens unit arranged in the apparatus body, the device being configured to adjust a semi-enclosed jig holding a target wafer so as to change the relative position of the target wafer between the apparatus body and the lens unit, the device comprising: a first support mechanism comprising a first V-shaped structure configured to position and support a first positioning member arranged at a first position on an opening of the semi-enclosed jig so as to determine a reference point of the semi-enclosed jig; a second support mechanism comprising a first guide and a second V-shaped structure slidably arranged in the first guide, the second support mechanism being configured to position and support a second positioning member arranged at a second position on the opening of the semi-enclosed jig, and comprising a first adjusting assembly and a second adjusting assembly configured to adjust the Y-direction movement and the X-direction movement of the second V-shaped structure relative to the first guide, respectively; and a third support mechanism comprising a second guide and a third V-shaped structure slidably arranged in the second guide, the third support mechanism being configured to position and support a third positioning member arranged at a third position in the semi-enclosed jig, and comprising a third adjusting assembly and a fourth adjusting assembly configured to adjust the Y-direction movement and the Z-direction movement of the third V-shaped structure relative to the second guide, respectively. The jig is a semi-enclosed jig having an opening on one side. The first positioning member and the second positioning member are arranged at the first position and the second position on both sides of the opening of the semi-enclosed jig. The first positioning member, the second positioning member and the third positioning member have the same structure, each comprising a fixed portion configured to be connected to the semi-enclosed jig, and a positioning portion extending outwardly. In the first positioning member, the first positioning portion is configured to be arranged in a first V-shaped groove on the surface of the first V-shaped structure; in the second positioning member, the second positioning portion is configured to be arranged in a second V-shaped groove on the surface of the second V-shaped structure; and in the third positioning member, the third positioning portion is configured to be arranged in a third V-shaped groove on the surface of the third V-shaped structure. In the first support mechanism, the first V-shaped structure is fixed to the apparatus body, the first V-shaped groove extends along the X-direction on the top surface of the first V-shaped structure, and the first positioning portion of the first positioning member is arranged in the first V-shaped groove.

2. The pose adjustment device for wafer measurement according to claim 1, wherein, In the second support mechanism, the first guide is slidably connected to the apparatus body, and the second V-shaped structure is slidably connected to the first guide.

3. The pose adjustment device for wafer measurement according to claim 2, wherein, The first adjusting assembly is configured to drive the first guide to move along the Y-direction so as to drive the second V-shaped structure and the second positioning member to move along the Y-direction, thereby changing the position of the second positioning member so as to drive the semi-enclosed jig and the target wafer to swing around the reference point.

4. The pose adjustment device for wafer measurement of claim 3, wherein, The second adjusting assembly is configured to drive the second V-shaped structure to move along the X-direction in the first guide, thereby changing the position of the second positioning member so as to drive the semi-enclosed jig and the target wafer to swing around the reference point. ​ 5. The pose adjustment device for wafer measurement of claim 4, wherein, ​ 6. The pose adjustment device for wafer measurement of claim 4, wherein, ​ 7. The pose adjustment device for wafer measurement of claim 6, wherein, ​ ​ 8.The pose adjustment device for wafer measurement of claim 7, wherein, The reset through hole is provided in the first guide along the X direction, the elastic member is arranged in the reset through hole, one end of the elastic member is fixed in the reset through hole, the other end of the elastic member is connected to the flange on the second V-shaped structural member through the reset through hole, the elastic member is connected between the first guide and the second V-shaped structural member, and the second V-shaped structural member has a movement trend towards the first guide at any time.

9. The pose adjustment apparatus for wafer measurement according to claim 4, wherein, In the third supporting mechanism, the second guide is slidingly connected to the equipment main body, and the third V-shaped member is slidingly connected to the second guide.

10. The pose adjustment device for wafer measurement of claim 9, wherein, The third adjusting assembly is used for driving the second guide to move along the Y direction to drive the third V-shaped structural member and the third positioning member to move along the Y direction, so that the position of the third positioning member is changed to drive the semi-closed jig and the target wafer to swing around the reference point. The fourth adjusting assembly is used for driving the third V-shaped structural member to move along the Z direction in the second guide, so that the position of the second positioning member is changed to drive the semi-closed jig and the target wafer to swing around the reference point.

Images