Ceramic copper clad substrate automatic splitting system and process thereof

Abstract

The application provides a kind of ceramic copper-clad substrate automatic splitting system and process, it is related to semiconductor packaging technical field, automatic splitting system includes feeding module, feeding module is provided at least one transfer box and cylinder switch, transfer box side wall is provided with cylinder assembly and transfer sensor, controller receives the signal of transfer sensor, drives transfer robot and removes ceramic copper-clad mother board from transfer box;Splitting module includes vacuum platform, vacuum platform is provided with down pressure cylinder above, down pressure cylinder is connected with long side splitting pressure cutter and short side splitting pressure cutter, and long side positioning push cutter and short side positioning push cutter are arranged on both sides of vacuum platform;First splitting platform and second splitting platform are arranged in parallel on automatic splitting module, and DCB transfer robot transfers ceramic copper-clad substrate on DCB docking platform to DCB transfer module.The application realizes automatic feeding and discharging, prevents material damage during taking;Through splitting system, DCB automatic splitting is realized, automatic transmission is realized, and efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a ceramic copper clad substrate automatic splitting system and process thereof. BACKGROUND

[0002] In the existing IGBT power module manufacturing process, the DCB used is usually a ceramic copper clad substrate with a mother board structure of 178*128mm, arraying multiple individual DCBs, the ceramic copper clad substrate is usually made of Al2O3, AlN or other materials, the individual DCB ceramic on the mother board uses a laser half-etching process to ensure uniformity of the individual DCB splitting board size, after the DCB mother board completes the bonding process, the arrayed DCBs need to be split into single DCBs, in the splitting process, manual splitting is still the main method, the manual operation has low splitting efficiency, and the fingers are easy to contact the DCB, causing scratches, contamination and other failures of the DCB copper foil. SUMMARY

[0003] The present application aims to overcome the deficiencies in the prior art, provide a ceramic copper clad substrate automatic splitting system and process thereof, the power module feed supply has higher stability, uses an automatic structure feed supply method, improves the equipment efficiency, avoids manual operation, reduces the risk of material contamination and deformation, the feed supply process is more reasonable, reduces costs and increases efficiency; realizes automatic feeding and discharging of the ceramic copper clad substrate, prevents damage during material taking, realizes automatic splitting of the DCB; automatic transmission improves efficiency, the special splitting transmission platform realizes automatic removal of ceramic debris and DCB splitting; avoids product contamination and scratches, the equipment automatically detects the appearance of the DCB product, and realizes automatic NG material distribution.

[0004] The technical scheme adopted by the present application is:

[0005] A ceramic copper clad substrate automatic splitting system, comprising:

[0006] A feeding module, at least one transfer box and a cylinder switch for controlling the transfer box switch are arranged on the feeding module, a cylinder assembly and a transfer sensor are arranged on one side wall of the transfer box and are electrically connected to each other, a controller drives a transfer robot to take out a ceramic copper clad mother board from the transfer box by receiving a signal of the transfer sensor;

[0007] A splitting module, the splitting module comprises a second support frame, a vacuum platform is arranged on the second support frame, a down pressure cylinder is arranged on the second support frame above the vacuum platform, an output end of the down pressure cylinder is connected to a long side splitting pressure knife and a short side splitting pressure knife, a lifting cylinder and a contact sensor are arranged on the bottom of the vacuum platform and are electrically connected to each other, a long side positioning push knife is arranged on both sides of the vacuum platform along the length direction, and a short side positioning push knife is arranged on one side of the vacuum platform along the width direction;

[0008] The automatic splitting module comprises a first splitting platform and a second splitting platform. The first splitting platform is provided with a first material contact sensor and a first lifting motor at the bottom. A first pushing knife is arranged on one side of the first splitting platform along the length direction. A first splitting pressing knife is arranged at the joint of the first splitting platform and the second splitting platform. A second pushing knife is arranged on one side of the second splitting platform along the width direction. The second splitting platform is provided with a second material contact sensor and a second lifting motor at the bottom. A second splitting pressing knife is arranged on one side of the second splitting platform along the width direction. A DCB connecting platform is arranged on the side of the second splitting platform corresponding to the second splitting pressing knife.

[0009] The DCB transfer module is used for transferring the ceramic copper-clad substrate on the DCB connecting platform to the DCB transfer module by a DCB transfer manipulator.

[0010] Preferably, the ceramic copper-clad substrate automatic splitting system comprises a first support frame, a transfer box and a cylinder switch arranged on the first support frame, and opening and closing leaves arranged on one side of the transfer box. The cylinder assembly comprises a third cylinder and a fourth cylinder. The transfer box is fixed on the first support frame by the upper piston of the third cylinder. The fourth cylinder controls the opening and closing of the opening and closing leaves. A transfer suction cup is arranged on one side of the transfer robot. The transfer suction cup is connected with a vacuum pump. The transfer robot is connected with a third motor.

[0011] Preferably, the ceramic copper-clad substrate automatic splitting system comprises a hollow square body and an L-shaped support table connected to one side of the top of the hollow square body. A support table is arranged in the hollow square body. A vacuum platform is arranged on the support table. An inclined guide plate is arranged on the outer wall of the lower part of the hollow square body. An opening part is arranged at the position corresponding to the guide plate of the lower part of the hollow square body. The guide plate and the opening part are in communication with each other. A recovery barrel is arranged below the guide plate.

[0012] Preferably, the ceramic copper-clad substrate automatic splitting system comprises a plurality of first vacuum suction holes arranged at intervals on the vacuum platform. The first vacuum suction holes are connected with a vacuum pump through a pipeline. A first manipulator avoiding groove matched with the transfer suction cup is arranged on the vacuum platform.

[0013] Preferably, the ceramic copper-clad substrate automatic splitting system comprises a short-side splitting pressing knife with a height greater than that of a long-side splitting pressing knife. A long-side positioning pushing knife is connected with a fifth motor. A short-side positioning pushing knife is connected with a sixth motor.

[0014] Preferably, the ceramic copper-clad substrate automatic splitting system, wherein the automatic splitting module comprises a third support frame, the first splitting platform and the second splitting platform are arranged in parallel on the third support frame; the first push knife is connected with the first motor, the second push knife is connected with the second motor, the first splitting press knife is connected with the first cylinder, and the second splitting press knife is connected with the second cylinder; a first air outlet is arranged on the side wall of the first push knife in an inclined manner, a second air outlet is arranged on the side wall of the second push knife in an inclined manner, a first vacuum interface and a first compressed air interface are arranged on the side wall of the first splitting platform, a second vacuum interface and a second compressed air interface are arranged on the side wall of the second splitting platform, and the first air outlet, the second air outlet, the first compressed air interface and the second compressed air interface are all connected with an air compressor through pipelines, and the first vacuum interface and the second vacuum interface are connected with a vacuum pump through a pipeline.

[0015] Preferably, the ceramic copper-clad substrate automatic splitting system, wherein a plurality of second vacuum suction holes are arranged on the first splitting platform and the second splitting platform in an interval manner, and the second vacuum suction holes are connected with the vacuum pump through a pipeline; a second mechanical hand avoiding groove matched with the transfer suction disc is further arranged on the first splitting platform; the DCB connecting platform is connected with the vacuum pump and the fourth motor, a third vacuum interface and a third compressed air interface are arranged on the DCB connecting platform, the third vacuum interface is connected with the vacuum pump through a pipeline, and the third compressed air interface is connected with the air compressor through a pipeline.

[0016] Preferably, the ceramic copper-clad substrate automatic splitting system, wherein the DCB transfer module comprises a fourth support frame, a transmission track is arranged on the fourth support frame, a lower inspection camera is arranged on one side of the fourth support frame of the transmission track, an upper inspection camera and a DCB transfer tool are arranged on the DCB transfer mechanical hand, the DCB transfer tool comprises a loading support plate, vacuum suction discs are arranged around the bottom of the loading support plate, a vacuum pipe interface is arranged on the loading support plate, and the vacuum pipe interface is connected with the vacuum pump through a pipeline.

[0017] The application further provides an automatic splitting process applied to the ceramic copper-clad substrate automatic splitting system, and the process comprises the following steps:

[0018] Step S1. The ceramic copper-clad mother board is loaded into the transfer box, the cylinder switch is turned on, the transfer box is fastened through the third cylinder, the opening and closing leaves are opened, the transfer sensor signal is received by the controller, the transfer suction disc of the transfer robot is driven from the bottom to the top of the transfer box, and the ceramic copper-clad mother board is taken out.

[0019] Step S2. The transfer robot of the transfer machine places the ceramic copper-clad mother board on the vacuum platform, detects the ceramic copper-clad mother board on the vacuum platform through the contact sensor, after the detection of the contact sensor is completed, the long-side positioning pusher and the short-side positioning pusher correct the ceramic mother board through three-edge positioning, and at the same time, the vacuum of the vacuum platform is started. Then, the vacuum platform is raised by the lifting cylinder, the short-side splitting pusher and the long-side splitting pusher are lowered by the downward pressing cylinder, the height of the short-side splitting pusher is greater than that of the long-side splitting pusher, the short side of the ceramic copper-clad mother board is split first and then the long side is split, and finally the vacuum platform is lowered, the short-side splitting pusher and the long-side splitting pusher are raised, the vacuum of the vacuum platform and the downward pressing cylinder are turned off, and the process edge splitting of the ceramic copper-clad mother board is completed.

[0020] Step S3. The transfer robot of the transfer machine takes out the ceramic copper-clad mother board whose process edge splitting is completed and places it on the first splitting platform. The ceramic copper-clad mother board is detected by the first material contact sensor, the compressed air of the first air outlet and the first compressed air interface is started, the ceramic copper-clad mother board is suspended in the air in the process of forward movement, the first pusher is driven to move forward by the first motor, and after the ceramic copper-clad mother board reaches the first splitting position, the controller controls the compressed air of the first compressed air interface to be turned off and the vacuum of the first vacuum interface to be started. The ceramic copper-clad mother board is adsorbed by the platform, the second splitting platform has a lower height than the first splitting platform, the first splitting pusher is pressed down by the first cylinder, and the ceramic copper-clad mother board is split along the long side.

[0021] Step S4. After the second lifting motor drives the second splitting platform to reach the set height, the second air outlet and the second compressed air interface start the compressed air, the ceramic copper-clad mother board is suspended in the air in the process of forward movement, the second pusher is driven to move forward by the second motor, and after the second pusher reaches the single DCB splitting position, the controller controls the compressed air of the second compressed air interface to be turned off and the vacuum of the second vacuum interface to be started. The second splitting pusher is pressed down by the second cylinder, the single DCB splitting is completed, the split DCB automatically falls into the DCB connection platform, the DCB connection platform adsorbs the DCB, the fourth motor drives the DCB connection platform to move forward, and the DCB connection platform reaches the driving stop position.

[0022] Step S5. The controller drives the DCB transfer manipulator to move, the DCB position in the DCB connection platform is recognized by the upper inspection camera arranged on the DCB transfer tooling, the DCB transfer tooling is moved to directly above the DCB connection platform, the DCB is adsorbed by the DCB transfer tooling and moved to above the lower inspection camera, the quality of the back of the DCB is detected by the lower inspection camera, the qualified DCB is placed in the empty DCB storage box by the manipulator, and the unqualified product is placed on the NG product discharge table.

[0023] Preferably, the automatic splitting process, wherein the vacuum threshold of the vacuum platform in step S2 is 50-100 Pa; the vacuum threshold of the first vacuum interface in step S3 is 50-100 Pa, the second splitting platform is 1-2 mm lower than the first splitting platform in height; the vacuum threshold of the second vacuum interface in step S4 is 50-100 Pa.

[0024] Advantages of the present application:

[0025] The ceramic copper-clad substrate automatic splitting system and process of the present application realize automatic feeding and discharging, prevent damage during material taking; realize DCB automatic splitting through the splitting system, automatic conveying, improve efficiency, realize automatic removal of ceramic debris and DCB splitting by setting the automatic splitting module; avoid product pollution and scratches, the equipment automatically detects the appearance of the DCB product, realizes automatic NG material separation. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a structure schematic diagram of the ceramic copper-clad substrate automatic splitting system of the present application.

[0027] Figure 2 It is a structure schematic diagram of the manual splitting jig.

[0028] Figure 3 It is a structure schematic diagram of the ceramic copper-clad substrate automatic splitting device of the present application.

[0029] Figure 4 It is a structure schematic diagram of the feeding module of the present application.

[0030] Figure 5 It is a structure schematic diagram of the splitting module of the present application.

[0031] Figure 6 It is a structure schematic diagram of the ceramic copper-clad substrate in the splitting module of the present application.

[0032] Figure 7 It is a structure schematic diagram of the ceramic copper-clad substrate in the splitting module of the present application. Figure 6 It is a partial schematic diagram of A.

[0033] Figure 8 It is a sectional view of the splitting module of the present application.

[0034] Figure 9 It is a perspective view of the splitting module of the present application.

[0035] Figure 10 It is a structure schematic diagram of the automatic splitting module of the present application.

[0036] Figure 11 It is a structure schematic diagram of the automatic splitting module of the present application. Figure 10 It is a partial view of the first splitting platform and the second splitting platform.

[0037] Figure 12 The structure diagram of the DCB transfer module of the present application.

[0038] Figure 13 The structure diagram of the DCB transfer tool of the present application arranged on the DCB transfer robot.

[0039] Figure 14 The circuit connection diagram of the automatic ceramic copper clad substrate splitting device of the present application.

[0040] BRIEF DESCRIPTION OF DRAWINGS

[0041] 1, loading module; 2, splitting module; 3, transfer robot; 4, automatic splitting module; 5, DCB transfer module; 6, splitting jig body; 7, long side splitting area; 8, short side splitting area; 9, DCB splitting area; 10, DCB transfer robot; 11, first support frame; 12, air cylinder switch; 13, transfer box; 14, ceramic copper clad mother board; 15, opening and closing leaf; 16, fourth air cylinder; 20, first robot avoiding groove; 21, second support frame; 22, vacuum platform; 23, downward pressing air cylinder, 24, long side splitting pressing knife; 25, short side splitting pressing knife, 26, lifting air cylinder; 27, long side positioning pushing knife, 28, short side positioning pushing knife; 29, first vacuum adsorption hole; 31, transfer suction cup; 32, third motor; 33, upper inspection camera; 34, DCB transfer tool; 35, shipping support plate; 36, vacuum suction cup; 37, vacuum pipe interface; 41, third support frame; 42, first splitting platform; 43, second splitting platform; 44, first pushing knife; 45, first splitting pressing knife; 46, second pushing knife; 47, second splitting pressing knife; 48, DCB connection platform; 49, second robot avoiding groove; 50, fourth motor; 51, fourth support frame; 52, transmission track; 53, lower inspection camera; 54, parking area; 55, DCB throwing transmission track; 56, DCB storage box; 57, stacking platform; 141, short side process edge; 142, short process edge splitting etching groove; 143, long side process edge; 144, long process edge splitting etching groove, 145, DCB; 146, DCB splitting groove; 211, hollow square; 212, L-shaped support table; 213, support table; 214, guide plate; 215, recovery bucket; 441, first air outlet; 461, second air outlet; 421, first vacuum interface; 422, first compressed air interface; 431, second vacuum interface; 432, second compressed air interface; 481, third vacuum interface; 482, third compressed air interface; 521, upper transmission track; 522, lower transmission track. DETAILED DESCRIPTION

[0042] The present application will be further described in conjunction with specific embodiments.

[0043] As Figure 1 , the ceramic copper-clad mother board 14 includes a copper-clad mother board body, short edge process edges 141 are arranged on both sides of the copper-clad mother board body along the width direction, short edge process edge split etching grooves 142 are arranged between the short edge process edges 141 and the copper-clad mother board body, long edge process edges 143 are arranged on both sides of the copper-clad mother board body between the short edge process edges 141, long edge process edge split etching grooves 144 are arranged between the long edge process edges 143 and the copper-clad mother board body, a plurality of DCBs 145 are arranged in the middle of the ceramic copper-clad mother board 14, DCB split grooves 146 are arranged between adjacent DCBs 145, and the size of the ceramic copper-clad mother board 14 is 178*128mm. The ceramic copper-clad mother board 14 is double-sidedly bonded with 0.3mm-thick oxygen-free copper by using a 0.3mm-thick pure ceramic sheet, and then after etching the circuit diagram on the front copper-clad plate, the process edges of the half-split mother board and the plurality of DCBs are etched by using a laser etching device.

[0044] The existing manual splitting jig is as shown in Figure 2 , the splitting jig includes a splitting jig body 6, a long edge splitting area 7, a short edge splitting area 8 and a DCB splitting area 9 are arranged on the splitting jig body 6, a long edge splitting groove is arranged on the long edge splitting area 7, a short edge splitting groove is arranged on the short edge splitting area 8, the ceramic copper-clad mother board 14 substrate process edge is manually inserted into the short edge splitting groove and the long edge splitting groove to split, and then the ceramic copper-clad mother board 14 is placed into the DCB splitting area 9 to manually split the independent DCB.

[0045] Embodiment 1

[0046] As Figures 3-14 , an automatic splitting system for a ceramic copper-clad substrate, wherein it comprises:

[0047] The feeding module 1 comprises a first support frame 11, at least one transfer box 13 and a cylinder switch 12 for controlling the switch of the transfer box 13 are arranged on the first support frame 11, a cylinder assembly and a transfer sensor that are electrically connected to each other are arranged on one side wall of the transfer box 13, a transfer robot 3 is arranged on one side of the transfer box 13, and a controller drives the transfer robot 3 to take out the ceramic copper-clad mother board 14 from the transfer box 13 by receiving the signal of the transfer sensor;

[0048] The splitting module 2 comprises a second support frame 21, a vacuum platform 22 is arranged on the second support frame 21, a downward pressing cylinder 23 is arranged on the second support frame 21 above the vacuum platform 22, the output end of the downward pressing cylinder 23 is connected to a long edge splitting pressing knife 24 and a short edge splitting pressing knife 25, a lifting cylinder 26 and a contact sensor that are electrically connected to each other are arranged at the bottom of the vacuum platform 22, a long edge positioning pushing knife 27 is arranged on both sides of the vacuum platform 22 along the length direction, and a short edge positioning pushing knife 28 is arranged on one side of the vacuum platform 22 along the width direction;

[0049] The automatic splitting module 4 comprises a third support frame 41, a first splitting platform 42 and a second splitting platform 43 are arranged in parallel on the third support frame 41, a first material contact sensor and a first lifting motor are arranged at the bottom of the first splitting platform 42, a first pushing knife 44 is arranged at one side of the first splitting platform 42 along the length direction, the first pushing knife 44 is connected with a first motor, a first splitting pressing knife 45 is arranged at the joint of the first splitting platform 42 and the second splitting platform 43, a second pushing knife 46 is arranged at one side of the second splitting platform 43 along the width direction, the second pushing knife 46 is connected with a second motor, a second material contact sensor and a second lifting motor are arranged at the bottom of the second splitting platform 43, a second splitting pressing knife 47 is arranged at one side of the second splitting platform 43 along the width direction, the first splitting pressing knife 45 is connected with a first air cylinder, the second splitting pressing knife 47 is connected with a second air cylinder, and a DCB connecting platform 48 is arranged at one side of the second splitting platform 43 corresponding to the second splitting pressing knife 47.

[0050] The DCB transfer module 5, the DCB transfer manipulator 10 transfers the ceramic copper clad plate of the DCB connecting platform 48 to the DCB transfer module 5.

[0051] The transfer box 13 is arranged with an opening and closing leaf 15, the cylinder assembly comprises a third cylinder and a fourth cylinder, the transfer box 13 is fixed on the first support frame 11 through the upper piston of the third cylinder, the fourth cylinder 16 controls the opening and closing of the opening and closing leaf 15, one side of the transfer robot 3 is arranged with a transfer suction disc 31, the transfer suction disc 31 is connected with a vacuum pump through a first pipeline, one side of the first pipeline is arranged with a first electromagnetic valve, and the transfer robot 3 is connected with a third motor 32.

[0052] The second support frame 21 comprises a hollow square body 211 and an L-shaped support table 212 connected to one side of the top of the hollow square body 211, a support table 213 is arranged in the hollow square body 211, a vacuum platform 22 is arranged on the support table 213, an inclined guide plate 214 is arranged on the outer wall of the lower part of the hollow square body 211, an opening part is arranged at the position corresponding to the guide plate 214 of the lower part of the hollow square body 211, the guide plate 214 and the opening part are in communication with each other, and a recovery barrel 215 is arranged below the guide plate 214.

[0053] A plurality of first vacuum adsorption holes 29 are arranged at intervals on the vacuum platform 22, the first vacuum adsorption holes 29 are connected with a vacuum pump through a second pipeline, and a second electromagnetic valve is arranged on one side of the second pipeline; the vacuum platform 22 is also arranged with a first manipulator avoiding groove 20 matched with the transfer suction disc 31.

[0054] The height of the short side splitting pressing knife 25 is greater than the height of the long side splitting pressing knife 24, Figure 7The height difference of the short side split pressure knife 25 and the long side split pressure knife 24 is L; the long side positioning push knife 27 is connected with the fifth motor, and the short side positioning push knife 28 is connected with the sixth motor.

[0055] The first push knife 44 is provided with a first air outlet 441 on the side wall, the second push knife 46 is provided with a second air outlet 461 on the side wall, the first split platform 42 is provided with a first vacuum interface 421 and a first compressed air interface 422 on the side wall, the second split platform 43 is provided with a second vacuum interface 431 and a second compressed air interface 432 on the side wall, the first air outlet 441, the second air outlet 461, the first compressed air interface 422 and the second compressed air interface 432 are connected with an air compressor, and the first vacuum interface 421 and the second vacuum interface 431 are connected with a vacuum pump.

[0056] The first air outlet 441, the second air outlet 461, the first compressed air interface 422 and the second compressed air interface 432 are respectively connected with the air compressor through a third pipeline, a fourth pipeline, a fifth pipeline and a sixth pipeline, and the third pipeline, the fourth pipeline, the fifth pipeline and the sixth pipeline are provided with a third electromagnetic valve, a fourth electromagnetic valve, a fifth electromagnetic valve and a sixth electromagnetic valve on one side; the first vacuum interface 421 and the second vacuum interface 431 are connected with the vacuum pump through a seventh pipeline and an eighth pipeline, and the seventh pipeline and the eighth pipeline are provided with a seventh electromagnetic valve and an eighth electromagnetic valve on one side.

[0057] A plurality of second vacuum adsorption holes are arranged on the first split platform 42 and the second split platform 43 at intervals, and the second vacuum adsorption holes are connected with the vacuum pump through a ninth pipeline, and the ninth pipeline is provided with a ninth electromagnetic valve on one side; the first split platform 42 is further provided with a second mechanical hand avoiding groove 49 matched with the transfer chuck 31; the DCB connecting platform 48 is connected with the vacuum pump and a fourth motor 50, the DCB connecting platform 48 is provided with a third vacuum interface 481 and a third compressed air interface 482, the third vacuum interface 481 is connected with the vacuum pump through a tenth pipeline, and the tenth pipeline is provided with a tenth electromagnetic valve on one side; the third compressed air interface 482 is connected with the air compressor through an eleventh pipeline, and the eleventh pipeline is provided with an eleventh electromagnetic valve on one side.

[0058] The DCB transfer module 5 comprises a fourth support frame 51, a transmission track 52 is arranged on one side of the fourth support frame 51, a lower inspection camera 53 is arranged on the fourth support frame 51 on one side of the transmission track 52, an upper inspection camera 33 and a DCB transfer tool 34 are arranged on the DCB transfer manipulator 10, the DCB transfer tool comprises a loading support plate 35, a vacuum chuck 36 is arranged around the bottom of the loading support plate 35, a vacuum pipe interface 37 is arranged on the loading support plate 35, the vacuum pipe interface 37 is connected to a vacuum pump through a twelfth pipeline, a twelfth electromagnetic valve is arranged on one side of the twelfth pipeline, the first electromagnetic valve, the second electromagnetic valve, the third electromagnetic valve, the fourth electromagnetic valve, the fifth electromagnetic valve, the sixth electromagnetic valve, the seventh electromagnetic valve, the eighth electromagnetic valve, the ninth electromagnetic valve, the tenth electromagnetic valve, the eleventh electromagnetic valve and the twelfth electromagnetic valve are electrically connected with the controller, and the first motor, the second motor, the third motor, the fourth motor, the fifth motor and the sixth motor are electrically connected with the controller.

[0059] The transmission track 52 comprises an upper transmission track 521 and a lower transmission track 522, the upper transmission track 521 is connected to a stack loading drive motor, and the lower transmission track 522 is connected to a stack unloading drive motor, and the stack loading drive motor and the stack unloading drive motor are connected to the controller.

[0060] The DCB transfer module 5 further comprises a rack, a motor-driven conveying line is arranged on the upper and lower ends of the rack, an empty DCB storage box is transmitted to a storage stack platform 57 through the upper transmission track 521, a sliding material moving frame is arranged above the lower transmission track 522, the sliding material moving frame is connected to a sliding material moving frame motor, the stack platform 57 is connected to a stack platform lifting motor, when the uppermost storage box of the stack platform 57 is full, the stack platform 57 will be lowered in height through the stack platform lifting motor, and the full storage box on the uppermost layer will be taken out and placed on the lower transmission track 522 through the sliding material moving frame, thereby realizing automatic stack unloading.

[0061] The specific structure and working process of the DCB transfer module 5 for automatic stack unloading through the transmission track have been disclosed in the patent application No. 202211097001.3, and the specific structure and working process will not be repeated here.

[0062] Figure 10 A parking area 54 provided with a DCB connection platform, a DCB material throwing transmission track 55, a DCB storage box 56 and a stack platform 57 are arranged on the transmission track 52.

[0063] The ceramic copper-clad motherboards 14 are loaded through the transfer boxes 13, each box can load 20 substrates, the transfer boxes are provided with opening and closing leaves 15, the controller detects the transfer sensor signal, and the transfer chuck of the transfer robot 3 is vacuum adsorbed from the bottom to the top to take out the ceramic copper-clad motherboards 14 from the transfer boxes 13.

[0064] The transfer robot 3 takes the material from the transfer box 13, and places the ceramic copper-clad mother board 14 on the vacuum platform 22 through the transfer suction cup. The vacuum platform 22 is provided with a first mechanical arm avoiding slot 20, which can avoid the transfer suction cup to place the ceramic copper-clad mother board 14 on the vacuum platform 22 without obstacles. The vacuum platform 22 is also provided with a first vacuum suction hole 29. The vacuum platform 22 is provided with a long-side positioning push knife 27 and a short-side positioning push knife 28 on three sides. After the ceramic copper-clad mother board 14 is placed, the long-side positioning push knife 27 and the short-side positioning push knife 28 position the ceramic copper-clad mother board 14, and then the vacuum platform 22 is opened to vacuum, so as to adsorb the ceramic copper-clad mother board 14 on the vacuum platform 22. After adsorption, the vacuum platform 22 rises to the upper side of the positioning push knife, and the next splitting process is performed.

[0065] The vacuum platform 22 rises to the upper side of the positioning push knife to prevent collision with the long-side splitting press knife 24 and the short-side splitting press knife 25. At the same time, the long-side splitting press knife 24 and the short-side splitting press knife 25 above the vacuum platform 22 are lowered, the short-side process edge is split first, and then the long-side process edge is split. After the splitting action is completed, the vacuum of the vacuum platform 22 is closed, and the transfer robot 3 takes away the ceramic copper-clad mother board 14 without the process edge.

[0066] The first splitting platform 42 is provided with a second mechanical arm avoiding slot 49. The transfer suction cup places the ceramic copper-clad mother board 14 product with the process edge split on the first splitting platform 42. The first splitting platform 42 is provided with a first material contact sensor. The first push knife 44 is provided with a first air outlet 441. The first splitting platform 42 is provided with a first compressed air interface 422 to ensure that the ceramic copper-clad mother board 14 is pushed on the first splitting platform 42 to open the compressed air to form a cyclone, preventing the ceramic copper-clad mother board 14 from being scratched during translation. When the first push knife 44 moves forward, the controller controls the fifth electromagnetic valve to make the air outlet of the first splitting platform 42 have an air outlet pressure of 1-2 MPa, so that a cyclone is formed between the ceramic copper-clad mother board 14 and the first splitting platform 42 to suspend the ceramic copper-clad mother board 14. When the first push knife 44 moves forward, the first push knife 44 is provided with a downward first air outlet 441 to ensure that the ceramic copper-clad mother board 14 is pressed under the air pressure during forward movement. The air outlet pressure is 0.5-1.5 MPa to maintain the stability of the forward movement of the ceramic copper-clad mother board 14.

[0067] After the first push knife 44 moves forward to push the ceramic copper-clad mother board 14 to the first splitting position, the first splitting platform 42 is opened in vacuum, so that the ceramic copper-clad mother board 14 is tightly attached to the first splitting platform 42, the first splitting pressure knife 45 is pressed downward to split the ceramic copper-clad mother board 14 along the long side of the DCB, the second splitting platform 43 is lowered with the split long side DCB, the second platform is lowered to the height of the second push knife 46, the second splitting platform 43 and the second push knife 46 are opened to compress air, the second push knife 46 moves forward to the DCB splitting position, then the second splitting platform 43 is opened in vacuum to adsorb the DCB, the second splitting pressure knife 47 is pressed downward to split the DCB, the split DCB is loaded into the DCB connecting platform 48, and the DCB connecting platform 48 is transmitted to the parking area 54 of the DCB connecting platform.

[0068] The DCB transfer manipulator 10 positions the DCB position and splitting edge damage inspection of the DCB connecting platform 48 through the upper inspection camera 33, and checks the product scratches on the back of the DCB after grabbing the DCB through the lower inspection camera; re-inspect the pollution and splitting edge damage, and the products with abnormalities will be placed on the NG platform, and the good products will be placed in the DCB storage box. The DCB storage box is automatically stacked and transmitted to the equipment discharge port, and then taken out by the operator.

[0069] The specific structure of the transfer box has been disclosed in the patent with the patent application number 202420508192.6 and the patent name of transfer box and production system.

[0070] Embodiment 2

[0071] As Figures 3-14 An automatic ceramic copper-clad substrate splitting process, comprising the following steps:

[0072] Step S1. The ceramic copper-clad mother board 14 is loaded into the transfer box 13, and the air cylinder switch 12 is opened. The third air cylinder controls the fastening of the transfer box 13, and the opening and closing leaf 15 is opened. The controller drives the transfer suction cup of the transfer robot 3 from the bottom to the top of the transfer box 13 to take out the ceramic copper-clad mother board 14 by receiving the transfer sensor signal.

[0073] Step S2. The transfer robot 3 places the ceramic copper-clad mother board 14 on the vacuum platform 22, detects the ceramic copper-clad mother board 14 on the vacuum platform 22 through the contact sensor, after the detection of the contact sensor is completed, the long edge positioning push knife 27 and the short edge positioning push knife 28 correct the ceramic mother board through three edge positioning, and at the same time, the vacuum of the vacuum platform 22 is turned on, the vacuum threshold of the vacuum platform 22 is 50-100 Pa, then the vacuum platform 22 is controlled to rise by the lifting cylinder 26, the short edge splitting push knife 25 and the long edge splitting push knife 24 are controlled to descend by the downward pressing cylinder 23, the height of the short edge splitting push knife 25 is greater than the height of the long edge splitting push knife 24, the short edge of the ceramic copper-clad mother board 14 is split first and then the long edge is split, finally the vacuum platform 22 is lowered, the short edge splitting push knife 25 and the long edge splitting push knife 24 are raised, the vacuum of the vacuum platform 22 and the downward pressing cylinder 23 are turned off, and the process edge splitting of the ceramic copper-clad mother board 14 is completed;

[0074] Step S3. The transfer robot 3 places the ceramic copper-clad mother board 14 on the first splitting platform 42, detects the ceramic copper-clad mother board 14 through the first material contact sensor, turns on the first air outlet 441 and the compressed air of the first compressed air interface 422, forms a cyclone convection in the process of moving forward, and makes the ceramic copper-clad mother board 14 suspended in the air above the first splitting platform 42, drives the first push knife to move forward through the first motor, controls the compressed air of the first compressed air interface 422 to be turned off and the vacuum of the first vacuum interface 421 to be turned on after the ceramic copper-clad mother board 14 reaches the first splitting position, the vacuum threshold of the first vacuum interface 421 is 50-100 Pa, the ceramic copper-clad mother board 14 is adsorbed by the platform, the second splitting platform 43 is 1-2 mm lower than the first splitting platform 42 in height, drives the first splitting push knife 45 to press down through the first cylinder, and splits the ceramic copper-clad mother board 14 along the long edge;

[0075] Step S4. After the second lifting motor drives the second splitting platform 43 to reach the set height, the second air outlet 461 and the second compressed air interface 432 are opened to form a cyclone convection in the process of moving forward, and make the ceramic copper-clad mother board 14 suspended in the air above the second splitting platform 43, drive the second push knife 46 to move forward through the second motor, control the compressed air of the second compressed air interface 432 to be turned off and the vacuum of the second vacuum interface 431 to be turned on after the second push knife 46 reaches the single DCB splitting position, the vacuum threshold of the second vacuum interface 431 is 50-100 Pa, drive the second splitting push knife 47 to press down through the second cylinder, complete the single DCB splitting, and the split DCB automatically falls into the DCB connection platform 48, the DCB connection platform 48 adsorbs the DCB, drives the DCB connection platform 48 to move forward through the fourth motor, and the DCB connection platform 48 reaches the driving stop position.

[0076] Step S5. The controller drives the DCB transfer robot 10 to move, the DCB position in the DCB docking platform 48 is recognized by the set upper inspection camera 33, the DCB transfer tool moves to the upper of the DCB docking platform 48, the DCB transfer tool adsorbs the DCB and moves to the upper of the lower inspection camera 53, the lower inspection camera 53 detects the quality of the back of the DCB, the qualified DCB is placed into the empty DCB storage box by the DCB transfer robot 10, and the unqualified product is placed on the NG product discharge table.

[0077] Figure 14 The schematic diagram of the circuit connection for the automatic splitting of the ceramic copper clad substrate is shown in the figure, and the controller can be a PLC controller.

[0078] The control principle of the application is as follows:

[0079] A1. The controller detects the transfer sensor signal, the controller drives the transfer robot to the bottom of the DCB box, the controller drives the first electromagnetic valve to open, and the negative pressure value of the first electromagnetic valve is detected, and the DCB mother board is taken out from the DCB box by the vacuum chuck,

[0080] A2. The controller drives the third motor 32 of the transfer robot to place the ceramic copper clad mother board 14 above the vacuum platform 22, the controller drives the first electromagnetic valve to close, the vacuum platform 22 is provided with a contact sensor, after the controller receives the contact sensor signal, the controller drives the fifth motor and the sixth motor to open, so that the long side positioning push knife 27 and the short side positioning push knife 28 position the ceramic copper clad mother board 14, after the positioning of the ceramic copper clad mother board 14 is completed, the controller drives the second electromagnetic valve to open, so that the splitting platform opens the vacuum adsorption ceramic copper clad mother board, after the controller collects the vacuum negative pressure value of the vacuum platform, the controller closes the fifth motor and the sixth motor, the next step is that the controller drives the down pressure cylinder 23, and the long side splitting pressure knife 24 and the short side splitting pressure knife 25 split the process edge of the ceramic copper clad mother board 14, then the controller drives the down pressure cylinder to close, and the controller closes the second electromagnetic valve at the same time;

[0081] A3. The controller drives the transfer robot to move to the vacuum platform 22, opens the first electromagnetic valve to take out the ceramic copper clad mother board 14 by vacuum adsorption, detects the negative pressure value of the first electromagnetic valve, and places the ceramic copper clad mother board 14 with completed process edge splitting on the first splitting platform 42, after the transfer robot reaches the feeding position, closes the first vacuum electromagnetic valve, and the controller drives the transfer robot to the waiting position;

[0082] A4. After the controller receives the first material contact sensor signal, the controller drives the third and fifth electromagnetic valves to open, and simultaneously drives the first motor. When the first motor reaches the first stop position, the controller drives the third and fifth electromagnetic valves to close, and simultaneously drives the seventh electromagnetic valve to open. After the controller detects that the seventh electromagnetic valve has a qualified vacuum value, the controller drives the first air cylinder to open. When the first air cylinder reaches the set stroke, the seventh electromagnetic valve and the first air cylinder are closed;

[0083] A5. The controller drives the second lifting motor of the second splitting platform 43 to descend. When the second splitting platform 43 reaches the set height, the controller drives the fourth and sixth electromagnetic valves to open, and simultaneously drives the second motor. When the second motor reaches the set position, the controller drives the fourth and sixth electromagnetic valves to close, and opens the eighth electromagnetic valve. After the controller collects qualified vacuum negative pressure data of the eighth electromagnetic valve, the controller drives the second air cylinder to open. When the second air cylinder reaches the set stroke, the controller drives the second air cylinder to close. The controller drives the tenth electromagnetic valve to open, and simultaneously collects qualified vacuum negative pressure data of the tenth electromagnetic valve. Then the controller drives the fourth motor 50. When the DCB connection platform 48 reaches the set position, the controller drives the tenth electromagnetic valve to close, and simultaneously drives the eleventh electromagnetic valve to open.

[0084] A6. After the DCB connection platform 48 reaches the parking area 54, the controller drives the DCB transfer manipulator 10 to move above the DCB connection platform 48. The upper inspection camera 33 is used to identify the position of the DCB in the connection platform, and after positioning is completed, the controller drives the Z-direction motor of the DCB transfer manipulator to lower the height of the DCB transfer tool 34. When the DCB transfer tool 34 reaches the set height, the controller drives the twelfth electromagnetic valve to open. After the controller collects qualified vacuum negative pressure data of the twelfth electromagnetic valve, the controller drives the Z-direction motor of the DCB transfer manipulator to raise the height of the DCB transfer tool 34 to a safe height. The controller drives the DCB transfer manipulator with the DCB transfer tool to the lower inspection camera 53 for appearance testing. After testing is completed, the controller drives the DCB transfer tool to above the DCB storage box. The controller drives the Z-direction motor of the DCB transfer manipulator to lower the height of the DCB transfer tool 34, and drives the twelfth electromagnetic valve to close.

[0085] A7. The controller drives the stacking and feeding drive motor to convey the empty DCB storage box to the stacking platform 57 at the end of the conveying line. When the uppermost DCB storage box is full, the controller drives the lifting motor of the stacking platform 57 to lower the height of the stacking platform 57. When the set height is reached, the controller drives the sliding material moving frame motor to place a single DCB storage box onto the lower conveying track 522, thereby achieving automatic stacking and feeding.

[0086] Finally, it should be noted that the above detailed description is merely illustrative of the technical solutions of the present application and is not limiting, and although the present application has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application, and all should be covered in the scope of the claims of the present application.

Claims

1. An automatic splitting system for copper-clad ceramic substrates, characterized in that, include: The loading module (1) is provided with at least one transfer box (13) and a cylinder switch (12) for controlling the switch of the transfer box (13). A cylinder assembly and a transfer sensor are electrically connected to each other on one side wall of the transfer box (13). The controller drives the transfer robot (3) to take out the ceramic copper-clad motherboard (14) from the transfer box (13) by receiving the signal from the transfer sensor. The splitting module (2) includes a second support frame (21), a vacuum platform (22) is provided on the second support frame (21), a pressing cylinder (23) is provided on the second support frame (21) above the vacuum platform (22), the output end of the pressing cylinder (23) is connected to the long side splitting pressing knife (24) and the short side splitting pressing knife (25), the bottom of the vacuum platform (22) is provided with a lifting cylinder (26) and a contact sensor that are electrically connected to each other, the vacuum platform (22) is provided with long side positioning push knives (27) on both sides along the length direction, and the vacuum platform (22) is provided with short side positioning push knives (28) on one side along the width direction; An automatic splitting module (4) includes a first splitting platform (42) and a second splitting platform (43). The bottom of the first splitting platform (42) is provided with a first material contact sensor and a first lifting motor. A first pusher (44) is provided on one side of the first splitting platform (42) along the length direction. A first splitting pressure knife (45) is provided at the junction of the first splitting platform (42) and the second splitting platform (43). A second pusher (46) is provided on one side of the second splitting platform (43) along the width direction. A second material contact sensor and a second lifting motor are provided at the bottom of the second splitting platform (43). A second splitting pressure knife (47) is provided on one side of the second splitting platform (43) along the width direction. A DCB docking platform (48) is provided on one side of the second splitting platform (43) corresponding to the second splitting pressure knife (47). DCB transfer module (5), DCB transfer robot (10) transfers the ceramic copper-clad substrate of DCB docking platform (48) to DCB transfer module (5).

2. The automatic splitting system for copper-clad ceramic substrates according to claim 1, characterized in that, The loading module (1) includes a first support frame (11), on which a transfer box (13) and a cylinder switch (12) are provided. An opening and closing leaf (15) is provided on one side of the transfer box (13). The cylinder assembly includes a third cylinder and a fourth cylinder. The transfer box (13) is fixed on the first support frame (11) by the upper piston of the third cylinder. The fourth cylinder (16) controls the opening and closing of the opening and closing leaf (15). A transfer suction cup (31) is provided on one side of the transfer robot (3). The transfer suction cup (31) is connected to a vacuum pump. The transfer robot (3) is connected to a third motor (32).

3. The automatic splitting system for copper-clad ceramic substrates according to claim 1, characterized in that, The second support frame (21) includes a hollow cube (211) and an L-shaped support platform (212) connected to one side of the top of the hollow cube (211). A support platform (213) is provided inside the hollow cube (211), and a vacuum platform (22) is provided on the support platform (213). An inclined guide plate (214) is provided on the lower outer wall of the hollow cube (211). An opening is provided at the lower part of the hollow cube (211) corresponding to the position of the guide plate (214). The guide plate (214) and the opening are interconnected. A recycling bin (215) is provided below the guide plate (214).

4. The automatic splitting system for copper-clad ceramic substrates according to claim 2, characterized in that, The vacuum platform (22) is provided with a number of first vacuum adsorption holes (29) spaced apart, and the first vacuum adsorption holes (29) are connected to the vacuum pump through pipes; the vacuum platform (22) is also provided with a first robotic arm clearance groove (20) that cooperates with the transfer suction cup (31).

5. The automatic splitting system for copper-clad ceramic substrates according to claim 2, characterized in that, The height of the short-side splitting pressure knife (25) is greater than the height of the long-side splitting pressure knife (24); the long-side positioning push knife (27) is connected to the fifth motor, and the short-side positioning push knife (28) is connected to the sixth motor.

6. The automatic splitting system for copper-clad ceramic substrates according to claim 1, characterized in that, The automatic splitting module (4) includes a third support frame (41), with the first splitting platform (42) and the second splitting platform (43) arranged parallel to each other on the third support frame (41); a first pusher (44) is connected to a first motor, a second pusher (46) is connected to a second motor, a first splitting pressure knife (45) is connected to a first cylinder, and a second splitting pressure knife (47) is connected to a second cylinder; a first air outlet (441) is inclinedly provided on the side wall of the first pusher (44), and a second air outlet (461) is inclinedly provided on the side wall of the second pusher (46). The first splitting platform (42) is provided with a first vacuum interface (421) and a first compressed air interface (422) on its side wall, and the second splitting platform (43) is provided with a second vacuum interface (431) and a second compressed air interface (432) on its side wall. The first air outlet (441), the second air outlet (461), the first compressed air interface (422) and the second compressed air interface (432) are all connected to an air compressor through pipes. The first vacuum interface (421) and the second vacuum interface (431) are connected to a vacuum pump through pipes.

7. The automatic splitting system for copper-clad ceramic substrates according to claim 2, characterized in that, The first splitting platform (42) and the second splitting platform (43) are provided with a number of second vacuum adsorption holes at intervals. The second vacuum adsorption holes are connected to the vacuum pump through pipes. The first splitting platform (42) is also provided with a second robotic arm clearance groove (49) that cooperates with the transfer suction cup (31). The DCB docking platform (48) connects the vacuum pump and the fourth motor (50). The DCB docking platform (48) is provided with a third vacuum interface (481) and a third compressed air interface (482). The third vacuum interface (481) is connected to the vacuum pump through pipes. The third compressed air interface (482) is connected to the air compressor through pipes.

8. The automatic splitting system for copper-clad ceramic substrates according to claim 1, characterized in that, The DCB transfer module (5) includes a fourth support frame (51), a transfer track (52) is provided on the fourth support frame (51), a lower inspection camera (53) is provided on the fourth support frame (51) on one side of the transfer track (52), an upper inspection camera (33) and a DCB transfer fixture (34) are provided on the DCB transfer robot (10), the DCB transfer fixture (34) includes a transport support plate (35), vacuum suction cups (36) are provided around the bottom of the transport support plate (35), a vacuum tube interface (37) is provided on the transport support plate (35), and the vacuum tube interface (37) is connected to a vacuum pump through a pipe.

9. An automatic splitting process applied to the automatic splitting system for ceramic copper-clad substrates according to any one of claims 1-8, characterized in that, Includes the following steps: Step S1. Load the ceramic copper-clad motherboard (14) into the transfer box (13), open the hinge (15), and the controller drives the transfer robot (3) to remove the ceramic copper-clad motherboard (14) from bottom to top from the transfer box (13) by receiving the transfer sensor signal. Step S2. The transfer suction cup (31) of the transfer robot (3) places the ceramic copper-clad motherboard (14) onto the vacuum platform (22). The contact sensor detects the ceramic copper-clad motherboard (14) on the vacuum platform (22). After the contact sensor detection is completed, the long side positioning pusher (27) and the short side positioning pusher (28) perform three-sided positioning correction on the ceramic motherboard. At the same time, the vacuum platform (22) is turned on. Then, the vacuum platform (22) is raised by the lifting cylinder (26) and lowered by the pressing cylinder. (23) Control the short side splitting knife (25) and the long side splitting knife (24) to descend. The height of the short side splitting knife (25) is greater than the height of the long side splitting knife (24). The short side of the ceramic copper-clad motherboard (14) is split first and then the long side is split. Finally, the vacuum platform (22) is lowered and the short side splitting knife (25) and the long side splitting knife (24) are raised. The vacuum of the vacuum platform (22) and the lowering cylinder (23) are closed. The process edge splitting of the ceramic copper-clad motherboard (14) is completed. Step S3. The transfer suction cup (31) of the transfer robot (3) takes out the ceramic copper-clad mother board (14) that has been split by the process edge and places it on the first splitting platform (42). The ceramic copper-clad mother board (14) is detected by the first material contact sensor. The compressed air of the first air outlet (441) and the first compressed air interface (422) is turned on, so that the ceramic copper-clad mother board (14) forms a cyclone convection during the forward movement, so that the ceramic copper-clad mother board (14) is suspended from the first splitting platform (42). The first motor drives the first push knife to move forward. After the first push knife drives the ceramic copper-clad mother board (14) to the first splitting position, the controller controls the compressed air of the first compressed air interface (422) to be turned off, and at the same time drives the vacuum of the first vacuum interface (421) to be turned on. The ceramic copper-clad mother board (14) is adsorbed by the platform. The plane height of the second splitting platform (43) is lower than the plane height of the first splitting platform (42). The first cylinder drives the first splitting pressure knife (45) to press down, so that the ceramic copper-clad mother board (14) is split along the long side. Step S4. After the second lifting motor drives the second splitting platform (43) to reach the set height, the second air outlet (461) and the second compressed air interface (432) open the compressed air, so that the ceramic copper-clad motherboard (14) forms a cyclone convection during the forward movement, so that the ceramic copper-clad motherboard (14) and the second splitting platform (43) are suspended in the air. The second motor drives the second push knife (46) to move forward. After the second push knife (46) reaches the single DCB splitting position, the controller controls the compressed air of the second compressed air interface (432) to be turned off, and at the same time drives the vacuum of the second vacuum interface (431) to be turned on. The second cylinder drives the second splitting pressure knife (47) to press down, completing the splitting of a single DCB. The split DCB automatically falls into the DCB docking platform (48). The DCB docking platform (48) vacuum adsorbs the DCB. The fourth motor drives the DCB docking platform (48) to move forward. The DCB docking platform (48) reaches the drive stop position. Step S5. The controller drives the DCB transfer robot (10) to move. The upper inspection camera (33) set on the DCB transfer robot (10) identifies the position of the DCB in the DCB docking platform (48). The DCB transfer fixture (34) moves to the top of the DCB docking platform (48). The DCB transfer fixture (34) adsorbs the DCB and moves it to the top of the lower inspection camera (53). The lower inspection camera (53) performs quality inspection on the back of the DCB. The qualified DCB is placed in the empty DCB storage box by the robot. The unqualified products are placed on the NG product discharge table.

10. The automatic splitting process according to claim 9, characterized in that, In step S2, the vacuum threshold of the vacuum platform (22) is 50-100 Pa; in step S3, the vacuum threshold of the first vacuum interface (421) is 50-100 Pa, and the plane height of the second splitting platform (43) is 1-2 mm lower than that of the first splitting platform (42); in step S4, the vacuum threshold of the second vacuum interface (431) is 50-100 Pa.

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