Radiator for wiring device

Abstract

Provided is a wiring device. A power module includes a housing having a front cover and a rear cover, a first printed circuit board (PCB) disposed within the housing, a first direct current (DC) port, a plurality of power electronics supported by a surface of the first PCB and configured to provide power to the first DC port, and a heat sink in direct contact with at least one of the plurality of power electronics and disposed in an interior of the rear cover.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 451,397, filed March 10, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to the thermal management of wiring devices including direct current (DC) output ports. Summary of the Invention

[0004] One aspect of this disclosure provides a wiring device including a housing having a front cover and a rear cover, a first printed circuit board (PCB) disposed within the housing, a first direct current (DC) port, a plurality of power electronic devices supported by the surface of the first PCB and configured to provide power to the first DC port, and a heat sink in direct contact with at least one of the plurality of power electronic devices and disposed inside the rear cover.

[0005] Another aspect of this disclosure provides an electrical socket comprising: a rectifier configured to supply power at a first direct current (DC) voltage level; a transformer configured to convert power from the first DC voltage level to a second DC voltage level, the transformer being connected to at least one switching device; at least one DC output port configured to receive power at the second DC voltage level from the converter; a microcontroller having an electronic processor configured to control the frequency of operation of the at least one switching device; and a heat sink in direct contact with the transformer.

[0006] Before explaining any embodiment in detail, it should be understood that the embodiment, in its application, is not limited to the details of the arrangement and configuration of the components set forth in the following description or shown in the accompanying drawings. The embodiment can be practiced or carried out in various ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” “including,” or “having,” and variations thereof, means to cover the items listed thereafter and their equivalents, as well as additional items. Unless otherwise stated or limited, the terms “installation,” “connection,” “support,” and “coupling,” and variations thereof, are widely used and cover direct and indirect installation, connection, support, and coupling.

[0007] In addition, it should be understood that embodiments can include hardware, software, and electronic components or modules that, for purposes of discussion, can be illustrated and described as if the majority of the components were implemented solely in hardware. However, one of ordinary skill in the art, based on a reading of this detailed description, would recognize that at least some of the components of the illustrated embodiments can be implemented in software {e.g., stored on non-transitory computer-readable medium) that acts on the electronic components or modules, or implemented wholly in hardware alone or in combination with software. As used herein, the term "non-transitory" merely means that the component or module does not exist as a propagating wave but is tangible, machine-readable medium that resides or exists in a system, e.g., on a storage device, memory, etc. Thus, it should be noted that hardware and software components described herein can be combined in a variety of ways to produce efficiently functioning devices. For example, a "server," "computing device," "controller," "processor," etc. described in the specification can include one or more processing units, one or more computer-readable medium modules, one or more input / output interface(s) and various connections (e.g., a system bus) that connect the components.

[0008] Relative terms, such as, for example, "about," "substantially," "approximately," and the like, are intended to encompass values that are within a reasonable range of the stated value, as understood by one of ordinary skill in the art. Such terms also are intended to encompass amounts that are within a range of manufacturing and assembly tolerances, as well as amounts that are within a range of values that are associated with a particular value, such as, for example, amounts that are within a range of values that are associated with a particular value due to measurement accuracy, etc. Such terms are also intended to disclose a range defined by the absolute values of the two endpoints. For example, the expression "from about 2 to about 4" also discloses the range "from 2 to 4." Relative terms can refer to a positive or negative percentage (e.g., 1%, 5%, 10%, or more) of the indicated value.

[0009] It should be understood that, although certain embodiments are illustrated as including particular components, software, and / or hardware, alternative embodiments can include fewer or different components, software, and / or hardware. In some embodiments, components can be combined or divided. For example, a component can be comprised of two or more separate sub-components. In addition, it should be understood that embodiments can include hardware, software, and electronic components or modules that, for purposes of discussion, can be illustrated and described as if the majority of the components were implemented solely in hardware. However, one of ordinary skill in the art, based on a reading of this detailed description, would recognize that at least some of the components of the illustrated embodiments can be implemented in software {e.g., stored on non-transitory computer-readable medium) that acts on the electronic components or modules, or implemented wholly in hardware alone or in combination with software. As used herein, the term "non-transitory" merely means that the component or module does not exist as a propagating wave but is tangible, machine-readable medium that resides or exists in a system, e.g., on a storage device, memory, etc. Thus, it should be noted that hardware and software components described herein can be combined in a variety of ways to produce efficiently functioning devices. For example, a "server," "computing device," "controller," "processor," etc. described in the specification can include one or more processing units, one or more computer-readable medium modules, one or more input / output interface(s) and various connections (e.g., a system bus) that connect the components.

[0010] Other aspects of the application will become apparent by consideration of the detailed description and accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 A front view of a wiring device or electrical outlet is shown in accordance with some embodiments.

[0012] Figure 2 A side view of an outlet is shown in accordance with some embodiments. Figure 1

[0013] Figure 3 A front view of an outlet is shown in accordance with some embodiments. Figure 1

[0014] Figure 4A A perspective view of a secondary PCB and a third PCB included in an outlet is shown in accordance with some embodiments. Figure 4B Figure 1 A side view of an outlet is shown in accordance with some embodiments.

[0015] Figure 5 Figure 1 A front view of an outlet is shown in accordance with some embodiments.

[0016] Figure 6 A top view of a primary PCB included in an outlet is shown in accordance with some embodiments. Figure 1

[0017] Figure 7 A perspective view of a primary board, power electronics, and a heat sink included in an outlet is shown in accordance with some embodiments. Figure 1

[0018] Figure 8 A rear view of an outlet is shown in accordance with some embodiments. Figure 1

[0019] A rear view of an outlet is shown in accordance with some embodiments. Figure 9 Figure 1 A perspective view of a heat sink included in an outlet is shown in accordance with some embodiments.

[0020] Figure 10 Figure 1 A block diagram of a charging circuit included in an outlet is shown in accordance with some embodiments.

[0021] Figure 11 A block diagram of a charging circuit included in an outlet is shown in accordance with some embodiments. Figure 1

[0022] Figure 12 A block diagram of a charging circuit included in an outlet is shown in accordance with some embodiments. Figure 1

[0023] Figure 13 ​​​​​​​​​​It is included according to some embodiments Figure 1 A block diagram of the charging circuit in the socket.

[0024] Figure 14 It is included according to some embodiments Figure 1 A block diagram of the charging circuit in the socket. Detailed Implementation

[0025] Before explaining any embodiment of this application in detail, it should be understood that the application of this application is not limited to the details of the arrangement and construction of the components set forth in the following description or shown in the following drawings. This application can have other embodiments and can be practiced or carried out in various ways.

[0026] Figure 1 A front view of a wiring device or electrical socket 100 according to some embodiments of the present disclosure is shown. The socket 100 includes a front cover 105 having a socket face 110 having a phase opening or live wire opening 115, a neutral wire opening 120, and a ground opening 125. In some embodiments, the socket face 110 includes more or fewer phase openings, neutral wire openings, and ground openings than in the illustrated embodiment. In some embodiments, the socket face 110 does not include any phase openings, neutral wire openings, and ground openings. In such embodiments, the socket face 110 includes only an opening for receiving a (Universal Serial Bus) USB port.

[0027] like Figure 1As shown, surface 110 further includes a first opening 130 for receiving a first DC charging port or USB port 135. Surface 110 further includes a second opening 140 for receiving a second DC charging port or USB port 145. In some embodiments, such as the illustrated embodiment, the first USB port 135 is a USB Type-C (USB-C®) port, and the second USB port 145 is a USB Type-C (USB-C®) port. In some embodiments, the first USB port 135 and the second USB port 145 are implemented as other types of USB ports. For example, the first USB port 135 and the second USB port 145 can be implemented as any combination of USB-A®, USB-B®, USB-C®, mini USB-A®, mini USB-B®, micro USB-A®, micro USB-B®, and / or other types of USB ports. In some embodiments, jack surface 110 is configured to receive more than two USB ports included in receptacle 100. For example, jack surface can include three, four, five, or more USB ports. In some embodiments, jack surface 110 is configured to receive a single USB port included in receptacle 100. In some embodiments, the USB port is implemented as another type of direct current (DC) charging port. As will be described in more detail below, the first USB port 135 and the second USB port 145 are each configured to deliver 50-60 watts or more of power to a load. For example, the first USB port 135 can deliver 50-60 watts of power to charge a laptop connected to the first USB port 135. Similarly, the second USB port 145 can deliver 50-60 watts of power to charge a laptop connected to the second USB port 145. In some cases, only one of the first USB port 135 and the second USB port 145 can deliver 50-60 watts of power at a time. In some cases, the first USB port 135 and the second USB port 145 can be combined to deliver more than 50-60 watts of power at a time.

[0028] In some embodiments, the socket surface 110 further includes one or more additional openings 150. One or more additional openings 150 accommodate indicators, such as, but not limited to, light-emitting diodes (LEDs) of various colors. In some embodiments, one or more additional openings 150 accommodate a bright LED, for example, as a charging indicator. In some embodiments, one or more additional openings 150 accommodate a bright LED, for example, as a night light. In some embodiments, one or more additional openings 150 accommodate a photoconductor cell, for example, for controlling the night light LED. In some embodiments, one or more additional openings 150 provide access to a set screw for adjusting the photoconductor device or a buzzer, according to this embodiment and other embodiments.

[0029] Figure 2 A side view of a receptacle 100 according to some embodiments of the present disclosure is shown. As shown, the receptacle 100 further includes a rear cover 155 fixed to a front cover 105. In some embodiments, the front cover 105 is removably (or releasably) coupled to the rear cover 155. In some embodiments, the front cover 105 is fixed to the rear cover 155 by a plurality of fasteners (not shown or listed). In some embodiments, the front cover 105 is fixed to the rear cover 155 by a snap-fit ​​connection. The receptacle 100 further includes a plurality of terminals for connecting an electrical conductor and a ground yoke / bridging assembly 160. The plurality of terminals include a phase (live) terminal 165 and a neutral (white) terminal 170. In some embodiments, the phase terminal 165 and the neutral terminal 170 are located on a first side of the rear cover 155 and each includes a screw for securing the terminal conductor. In other embodiments, the phase terminal 165 and the neutral terminal 170 are implemented using a snap-fit ​​connection. The receptacle 100 may further include a grounding terminal electrically connected to a grounding yoke / bridging assembly 160, which includes standard mounting ears 175 projecting from an end of the receptacle 100. The entire housing of the receptacle 100 (including the front cover 105 and the rear cover 155) is sized and shaped to fit within a standard junction box and / or switch box. For example, as Figure 2 As shown, the rear cover 155 includes a first recess 205 and a second recess 210, which reduce the overall size of the socket 100, thereby allowing the socket 100 to be received by an industrial standard junction box and / or an industrial standard switch box (e.g., a single-gang rectangular junction box).

[0030] Figure 3 A front view of the receptacle 100 is shown, with the front cover 105 removed to expose some internal components included in the receptacle 100. As shown, the receptacle 100 includes a secondary printed circuit board (PCB) or sub-board 300 and a third board 305. The secondary board 300 supports a first USB port 135 and a second USB port 145. Additionally, the secondary board 300 provides control and physical support for one or more LED indicators housed within one or more additional openings 150. The third board 305 also supports the second USB port 145 and provides control and physical support for one or more additional components of the receptacle 100. As shown, the secondary board 300 extends in a direction parallel to surface 110, while the third board extends in a direction perpendicular to surface 110. Figures 4A-4B A perspective view of the sub-plate 300 and the third plate 305 is shown.

[0031] In some embodiments, the sub-board 300 and / or the third board 305 may further provide physical support for one or more control electronics configured to control the voltage and / or current output of the first USB port 135 and the second USB port 145. For example, the sub-board 300 and / or the third board 305 may include one or more microchips, microcontrollers, switching devices, and / or logic elements. In some embodiments, the switching devices supported by the sub-board 300 and / or the third board 305 are formed of silicon carbide (SiC). In other embodiments, the switching devices supported by the sub-board 300 and / or the third board 305 are formed of gallium nitride (GaN). In other embodiments, the switching devices supported by the sub-board 300 and / or the third board 305 are formed of other wide-bandgap semiconductors.

[0032] Figure 5 A side view of the socket 100 is shown, with the front cover 105 and rear cover 155 removed to expose some internal components included in the socket 100. As shown, the socket 100 further includes a protection circuit 505 (indicated by a dashed box), a main printed circuit board or motherboard 510, multiple power electronic devices 515 (indicated by a dashed box), and a heat sink 520, etc. The protection circuit 505 (which may be implemented as one or more of a ground fault circuit interrupter (GFCI) and / or an arc fault circuit interrupter (AFCI)) is disposed on the front-facing surface of the motherboard 510 and the front cover 105. Figure 5 Between (not shown). Power electronic devices 515 are disposed within the rear cover 155 (not shown), between the rear-facing surface of the motherboard 510 and the heat sink 520. The power electronic devices (including transformer 525) are used to power the first USB port 135 and / or the second USB port 145. As will be described in more detail below, the motherboard 510 provides control and physical support for one or more components of the protection circuit 505, one or more of the power electronic devices 515, and additional operating components included in the socket 100.

[0033] Figure 6 A top view of the front surface of the motherboard 510 is shown. As shown, the front surface provides support for multiple control electronics, such as microcontroller 605, first switch 610, second switch 615, and input bridge rectifier 620. In the illustrated embodiment, the first switch 610 is included in or integrated within the microcontroller 605. However, in other embodiments, the microcontroller 605 and the first switch 610 are implemented as separate components. In some embodiments, the front surface of the motherboard 510 provides support for one or more additional microcontrollers and / or switches. Furthermore, it should be understood that... Figure 6The control electronics shown are not limited to being placed on the front surface, as in some embodiments, some or all of the control electronics are mounted on the rear surface of the motherboard 510. Similarly, in some embodiments, some or all of the power and control electronics supported by the front surface of the motherboard 510 are mounted on the rear surface of the motherboard 510 or are otherwise supported by the rear surface of the motherboard.

[0034] Microcontroller 605 is an integrated circuit device, such as a microchip microcontroller including an electronic processor and memory. In some embodiments, microcontroller 605 is implemented as a PIC18F microchip microcontroller. However, in other embodiments, microcontroller 605 is implemented as another type of microcontroller. As will be described in more detail below, microcontroller 605 is configured to control various operations of socket 100. For example, microcontroller 605 may be configured to control the delivery of charging power to one or more peripheral devices (e.g., smartphones, tablets, headphones, etc.) connected to a first USB port 135 and / or a second USB port 145. As another example, microcontroller 605 may be configured to control the operation of a first switch 610 and a second switch 615. As another example, microcontroller 605 may be electrically connected to one or more control electronics components (e.g., a second microcontroller, one or more switches, etc.) connected to a sub-board 300 and / or a third board 305 and configured to control the operation of said one or more control electronics components.

[0035] As will be described in more detail below, a first switch 610 and a second switch 615 are included in the charging circuit and are used to control the amount of DC charging power supplied to one or more peripheral devices connected to a first USB port 135 and / or a second USB port 145. For example, the first switch 610 may be used to control the output of a transformer 525, and the second switch 615 may be used to control the output of one or more auxiliary power supplies. As another example, both the first switch 610 and the second switch 615 are used to control the output of the transformer 525. In some embodiments, a microcontroller 605 is configured to control the operation of both the first switch 610 and the second switch 615. In some embodiments, a first microcontroller is configured to control the operation of the first switch 610, and a second microcontroller is configured to control the operation of the second switch 615. In some embodiments, one or more drive circuits (e.g., gate drivers) are used to drive the first switch 610 and the second switch 615 based on signals from the microcontroller.

[0036] In some embodiments, the first switch 610, the second switch 615, and / or any other switching element included in the charging circuit of the socket 100 are implemented as conventional silicon switches, such as conventional silicon metal-oxide-semiconductor field-effect transistors (MOSFETs). However, the frequency and loss characteristics of conventional silicon switches impose practical limitations on the maximum power density of charging circuits (such as switch-mode converters) included in electrical sockets. Furthermore, the highest possible power that can be handled in a confined space (such as the confined space of an electrical box) is at or near the practical limits of current conventional silicon switching devices.

[0037] Therefore, in some embodiments, silicon switching devices included in the power charging circuit are replaced by devices based on wide-bandgap semiconductors (e.g., GaN and / or SiC transistors and / or diodes). That is, in some embodiments, the first switch 610, the second switch 615, and / or any switching elements located within the charging circuit that benefit from reduced switching and conduction losses are implemented as GaN or SiC transistors or diodes. The chemical properties of wide-bandgap materials (such as GaN or SiC) allow for reduced conduction and switching losses and enable higher frequency commutation compared to silicon. Therefore, GaN or SiC switching devices have a significantly higher power density than conventional silicon switching devices. Thus, when GaN and / or SiC switching devices are implemented instead of conventional silicon switching devices, the nominal switching frequency of the power converter can be increased to a desired optimization point between acceptable switching losses (temperature rise) and overall size (no functional energy storage device). Furthermore, this effective increase in power density allows for greater throughput power in existing device architectures such as wiring harnesses and wireless chargers. In such embodiments, the microcontroller 605 is configured to set a high master switching frequency (e.g., 100 kHz and above) for the first switch 610, the second switch 615, and / or other switching elements included in the charging circuit.

[0038] Return to reference Figure 5The power electronic device 515, disposed between the rear surface of the motherboard 510 and the heat sink 520, includes various components (such as a transformer 525, one or more capacitors, one or more inductors, one or more switching devices, and / or one or more circuit interruption devices) for powering the first USB port 135 and the second USB port 145. As shown, at least one of the power electronic devices 515 is coupled to and / or supported by the rear surface of the motherboard 510. In the illustrated embodiment, the transformer 525 is implemented as a discrete wire-wound transformer projecting outward from the rear surface of the motherboard 510. However, in some embodiments, the transformer 525 is implemented as a linear transformer integrated with the motherboard 510. In some embodiments, one or more of the power electronic devices 515 are supported by the front surface of the motherboard 510, the sub-board 300, and / or the third board 305. Figure 7 A perspective view of a plurality of power electronic devices 515 disposed between a motherboard 510 and a heat sink 520 is shown.

[0039] As described above, the first USB port 135 and the second USB port 145 are each configured to deliver 50-60 watts or more of power to a load. For example, the first USB port 135 can deliver 50-60 watts of power to charge a laptop connected to the first USB port 135. Similarly, the second USB port 145 can deliver 50-60 watts of power to charge a laptop connected to the second USB port 145. In some cases, only one of the first USB port 135 and the second USB port 145 can deliver 50-60 watts of power at a time. In some cases, the first USB port 135 and the second USB port 145 can be combined to deliver more than 50-60 watts of power at a time.

[0040] Because the first USB port 135 and / or the second USB port 145 provide a relatively large amount of power (e.g., 50-60 watts or more) to the connected load, a significant amount of heat is dissipated by the multiple power electronic devices 515 (including transformer 525 and / or rectifier 620) that power the first USB port 135 and the second USB port 145 while they are supplying power to the connected load (e.g., a laptop). Therefore, in order to prevent overheating and / or damage to the operating components of the socket 100 while the first USB port and / or the second USB port are supplying power to the connected load, a heat sink 520 is arranged to transfer the heat from the power electronic devices 515 to the outside of the socket 100.

[0041] like Figure 5 and Figure 7As shown, the heat sink 520 is directly connected to at least one of a plurality of power electronic devices 515 to improve heat transfer from the power electronic devices 515 and the motherboard 510 to the outside of the socket. That is, the heat sink 520 is in direct contact with one or more power electronic devices 515 (e.g., a transformer 525). Furthermore, as... Figure 8 As shown in the rear view of the socket 100, a heat sink 520 is disposed inside the rear cover 155 of the socket 100, for example, in contact with the inner surface of the rear cover 155. In this arrangement, the heat sink 520 conducts heat generated by the working parts housed within the socket 100 to the outside of the socket 100 through a plurality of ventilation holes 805 formed in the rear surface of the rear cover 155. By placing the heat sink 520 inside the rear cover 155 of the socket 100 and in direct contact with the power electronic device 515, the heat sink 520 is able to transfer a greater amount of heat from the inside of the socket 100 to the outside of the socket 100 compared to socket designs that do not include a heat sink or include a heat sink disposed on the outside of the socket housing.

[0042] In some cases, the heat sink 520 is attached to the power electronic device 515 using a thermal adhesive material. In other cases, the heat sink 520 is pressed against the power electronic device 515 without using a thermal adhesive. In some cases, the heat sink 520 is mounted in the back cover 155 using a friction fit. The heat sink 520 is formed of a material with high thermal conductivity, such as, but not limited to, steel, aluminum, and / or copper. In some cases, the heat sink 520 is formed of a combination of one or more thermally conductive materials. Figure 9 A rear view of the socket 100 is shown, in which the rear cover 155 has been removed to expose the heatsink 520. Figure 10 A perspective view of the heatsink 520 is shown. Figure 9 and Figure 10 In the illustrated embodiment, the surface of the heat sink 520 is flat. However, in some cases, the surface of the heat sink 520 includes one or more of grooves, notches, recesses, fins, and / or other physical features that improve the ability of the heat sink 520 to dissipate heat from the interior of the socket 100.

[0043] Figure 11 An example block diagram of a charging circuit 1100 included in a socket 100 according to some embodiments is shown. The charging circuit 1100 is used to provide power to one or more loads connected to a first USB port 135 and / or a second USB port 145. The illustrated charging circuit 1100 is implemented using a switch-mode topology. However, it should be understood that in some embodiments, other power conversion topologies are used.

[0044] As shown in the figure, the charging circuit 1100 includes a transformer 525, a microcontroller 605, a first switch 610, a second switch 615, and a rectifier 620, etc. The rectifier 620 converts the alternating current (AC) input power into DC power. The DC power output from the rectifier 620 is filtered by an active compensator 1105 before being delivered to the primary side of the transformer 525. The active compensator 1105 is configured to reduce voltage ripple on the input bus while also eliminating the need for conventional large-capacity storage capacitors. Therefore, the presence of the active compensator 1105 allows for the use of smaller capacitors in the charging circuit 1100, thereby freeing up significant space and increasing the overall power density on the input side of the charging circuit 1100. In some embodiments, the active compensator 1105 is implemented as a standard buck-boost compensator topology; however, it should be understood that in some embodiments, the active compensator is implemented using other topologies. In some embodiments, the charging circuit 1100 further includes a buffer 1110 electrically connected in parallel with the primary side of the transformer 525. In such embodiments, buffer 1110 is configured to suppress voltage transient spikes on the primary side of transformer 525.

[0045] Transformer 525 is configured to directly supply DC power at voltage levels to one or more peripheral devices connected to ports included in output 1115, such as first USB port 135 and second USB port 145. In some embodiments, transformer 525 is configured to output power at a fixed voltage level (e.g., 5V). For example, transformer 525 is configured to output 50-60 watts or more of power at 5V to loads connected to first USB port 135 and / or second USB port 145. In other embodiments, transformer 525 is configured to output power at various voltage levels. For example, transformer 525 may be configured to output power at 2.5V, 3V, 5V, 10V, 15V, 20V, and / or the like. In such embodiments, microcontroller 605 is configured to control the voltage level and / or current amount supplied by transformer 525 to the outputs (e.g., first USB port 135 and second USB port 145) via first switch 610 and / or second switch 615.

[0046] As described above, in some embodiments, transformer 525 is implemented as a flyback converter, for example, including GaN and / or SiC switching devices. In such embodiments, transformer 525 may be implemented as a discrete winding transformer or a planar transformer integrated within motherboard 510. In some embodiments, transformer 525 is implemented as other types of DC-DC converter topologies.

[0047] The charging circuit 1100 further includes a filter circuit 1120 for reducing output voltage ripple. As described above, the first switch 610 and / or the second switch 615 can be implemented as GaN or SiC switching devices. GaN and SiC switching devices exhibit significantly lower switching power losses than conventional silicon switches. Therefore, when switches 610, 615 are implemented as GaN and / or SiC switching devices, switches 610, 615 can operate at higher switching frequencies (e.g., 100 kHz and above) than conventional silicon switching devices without experiencing the typical level of thermal stress experienced by silicon switching devices. Furthermore, since GaN and / or SiC switching devices are capable of operating at such high switching frequencies, the filter circuit 1120 can be implemented using relatively small capacitors without sacrificing performance. Therefore, the cost and size of the filter circuit 1120 are reduced when the first switch 610, the second switch 615, and / or any other switching element included in the charging circuit 1100 are implemented as GaN or SiC switching devices.

[0048] In some embodiments, the output 1115 of the socket 100 is directly powered by a main power source (such as transformer 525). In other embodiments, the output 1115 is powered by a combination of a main power source and one or more auxiliary power sources. Figure 12 A block diagram of a charging circuit 1200 included in a socket 100 is shown, wherein the extension 1115 is powered by a main power supply 1205 and / or one or more auxiliary power supplies or downstream power supplies 1210.

[0049] In some embodiments, the main power supply 1205 is implemented as a transformer 525, which additionally includes any corresponding switching devices (e.g., a first switch 610 and / or a second switch 615) for controlling the transformer 525. In other embodiments, the main power supply 1210 is implemented as a DC-DC power converter of another known type. As shown, the main power supply 1205 is configured to provide power directly to the output 1115 and at least one downstream power supply 1210. In particular, the main power supply 1205 is configured to provide power directly to at least one output port included in the output 1115. For example, in the illustrated embodiment, the main power supply 1205 provides power directly to a first USB port 135 and at least one downstream power supply 1210. However, in other embodiments, the main power supply 1205 is configured to provide power directly to at least one downstream power supply 1210, the first USB port 135 and / or a second USB port 145 and / or additional output ports included in the output 1115.

[0050] The main power supply 1205 includes a first independent control mechanism 1215. In some embodiments, the first independent control mechanism 1215 is implemented as a microcontroller 605 combined with one or more switching devices, such as a first switch 610 and a second switch 615. In other embodiments, the first independent control mechanism 1215 is implemented as another type of microcontroller or logic circuit combined with other switching devices not explicitly described herein. The charging circuit 1200 further includes a total current sensing circuit 1220 configured to sense the combined current output by the main power supply 1205 and one or more downstream power supplies 1210.

[0051] The first independent control mechanism 1215 is configured to limit the current output from the main power supply 1205 to the sum of the maximum rated output current of the main power supply 1205 (e.g., 10A, 200A, etc.) and the combined rated output current of all connected downstream power supplies 1210 (e.g., 5A, 10A, etc.). For example, in operation, the first independent control mechanism 1215 is configured to receive one or more current values ​​sensed by the total current sensing circuit 1220. Based on the received current values, the first independent control mechanism 1215 is configured to regulate the voltage and / or current output from the main power supply 1205. Thus, the first independent control mechanism 1215 included in the main power supply 1205 is operable to regulate the amount of power output from the charging circuit 1200 in part based on the current directly supplied to at least one output port (e.g., the first USB port 135) included in the output 1115 and the current directly supplied to at least one of the downstream power supplies 1210.

[0052] As described above, the main power supply 1205 is configured to directly supply power to at least one downstream power supply 1210. The downstream power supply 1210 is configured to convert the power received from the main power supply 1205 and output the power directly to one of the output ports (e.g., a second USB port 145) included in output 1115. In some embodiments, the downstream power supply 1210 supplies power to the corresponding output port (e.g., the second USB port 145) at a fixed voltage level (e.g., 5V, 10V, etc.). In other embodiments, the downstream power supply 1210 is operable to supply power to the corresponding output port at a varying voltage level (e.g., 1V-10V). In some embodiments, the downstream power supply 1210 is implemented as a flyback transformer. In other embodiments, the downstream power supply 1210 is implemented using other known DC-DC converter topologies (e.g., buck / boost converters, buck converters, or boost converters).

[0053] The downstream power supply 1210 includes a second independent control mechanism 1225 configured to control the amount of power supplied by the downstream power supply 1210 to a corresponding output port (e.g., USB port 145) included in the output 1115. Specifically, the second independent control mechanism 1225 is configured to control the power output from the downstream power supply 1210 based on a current value sensed by a second current sensing circuit 1230. Figure 12 As shown, the second current sensing circuit 1230 is configured to sense the amount of current supplied by the downstream power supply 1210 to a separate output port (e.g., a second USB port 145) included in the output 1115. In some embodiments, the second independent control mechanism 1225 is configured to limit the amount of current output by the downstream power supply 1210 to a value less than or equal to the rated current of the downstream power supply 1210. In other embodiments, the second independent control mechanism 1225 is configured to limit the current output by the downstream power supply 1210 based on the rated current of a peripheral device connected to the output port that receives power from the downstream power supply 1210. Similar to the first independent control mechanism 1215, the second independent control mechanism 1225 may be implemented as a microcontroller, logic circuitry, and / or any other type of control device operable to control switching elements included in the downstream power supply 1210.

[0054] Although the charging circuit 1200 is shown as including only a single downstream power supply 1210, it should be understood that the charging circuit 1200 may include any number (N) of additional downstream power supplies. For example, Figure 13 An embodiment of the charging circuit 1200 is shown, including a first downstream power supply 1210A and a second downstream power supply 1210B. As shown, each downstream power supply 1210A, 1210B is configured to receive power from a main power supply 1205 and output power to corresponding output ports 145A, 145B included in output 1115. Furthermore, the amount of power supplied to each output port included in output 1115 is sensed by a corresponding current sensing circuit and provided to a corresponding independent control mechanism. For example, the amount of power supplied by the first downstream power supply 1210A to output port 145A is sensed by current sensing circuit 1230A. Therefore, the independent control mechanism 1225A included in downstream power supply 1210A is operable to control the output of downstream power supply 1210A based on the current value sensed by current sensing circuit 1230A. Similarly, the amount of power supplied by the second downstream power supply 1210B to output port 145B is sensed by current sensing circuit 1230B. Therefore, the independent control mechanism 1225B included in the downstream power supply 1210B is operable to control the output of the downstream power supply 1210B based on the current value sensed by the current sensing circuit 1230B.

[0055] Figure 14A general embodiment of the charging circuit 1200 is shown. As shown, output 1115 may include a first output port (e.g., USB output port 135) and a plurality of (N) second output ports (e.g., USB output ports 145A-145N). In such an embodiment, the charging circuit 1200 may be configured to include a main power supply 1205 and a plurality of downstream power supplies 1210A-1210N. Each of the downstream power supplies 1210A-1210N receives power from the main power supply 1205 and supplies power to a corresponding one of the second output ports 145A-145N. For example, the first downstream power supply 1210A supplies power directly to the second output port 145A, the second downstream power supply 1210B supplies power directly to the second output port 145B, and the Nth downstream power supply 1210N supplies power directly to the Nth output port 145N. Furthermore, the current supplied to each of the second output ports 145A-145N is sensed by a corresponding current sensing circuit 1230A-1230N. For example, current sensing circuit 1230A senses the amount of current supplied to the second output port 145A by downstream power supply 1210A, current sensing circuit 1230B senses the amount of current supplied to the second output port 145B by downstream power supply 1210B, and current sensing circuit 1230N senses the amount of current supplied to the Nth output port 145N by downstream power supply 1210N. Each downstream power supply 1210A-1210N includes its own independent control mechanism 1225A-1225N, which is configured to control the power output by its respective downstream power supply 1210A-1210N based on its respective current value sensed by current sensing circuit 1230A-1230N. Therefore, Figure 14 The charging circuit 1200 shown is operable to regulate the power output from the main power supply 1205 and downstream power supplies 1210A-1210N to a plurality of peripheral devices connected to the first output port 135 and the second output port 145A-145N.

[0056] In some embodiments, the charging circuit 1200 includes an additional current sensing circuit configured to sense the amount of current supplied by the main power supply 1205 to at least one output port (e.g., USB port 135) included in the output 1115. In other embodiments, a first independent control mechanism 1215 is configured to determine the amount of current directly supplied by the main power supply 1205 to at least one output port by subtracting the sum of current values ​​sensed by current sensing circuits 1230A-1230N from the combined current value sensed by the total current sensing circuit 1220. In some embodiments, the main power supply 1205 is configured to directly supply power to more than one output port and one or more downstream power supplies 1210A-1210N. In some embodiments, one or more downstream power supplies 1210A-1210N are operable to directly supply power to one or more other downstream power supplies 1210A-1210N.

[0057] Therefore, the aspects described herein provide a socket with improved thermal management. Various features and advantages are set forth in the claims.

Claims

1. A wiring device comprising: a housing comprising a front cover and a rear cover; a first printed circuit board (PCB) disposed within the housing; a first direct current (DC) port; a plurality of power electronics supported by a surface of the first PCB and configured to provide power to the first DC port; and a heat sink in direct contact with at least one of the plurality of power electronics and disposed within an interior of the rear cover. a surface of the rear cover comprises a plurality of vent holes; and 2. The wiring device of claim 1, wherein, wherein the heat sink is disposed between the plurality of power electronics and the interior of the surface comprising the plurality of vent holes. the rear cover comprises a first recessed portion and a second recessed portion for insertion of the wiring device into an industry standard switch box.

3. The wiring device of claim 1, wherein, the first DC port provides at least 50 watts of power to a load connected to the first DC port.

4. The wiring device of claim 1, wherein, the heat sink is coupled to at least one of the plurality of power electronics using a thermal adhesive.

5. The wiring device of claim 1, wherein, 6. The wiring device of claim 1, further comprising a secondary PCB electrically connected to the first PCB.

7. The wiring device of claim 6, further comprising a second DC port; and the first DC port and the second DC port are supported by the secondary PCB. wherein the plurality of power electronics comprises a transformer configured to output power at one or more DC voltage levels to the first DC port.

8. The wiring device of claim 1, wherein, the transformer is a planar transformer.

9. The wiring device of claim 8, wherein, 10. The wiring device of claim 8, further comprising: a switch connected to the transformer; and a microcontroller comprising an electronic processor, the microcontroller configured to control delivery of power from the transformer to the first DC port via the switch. at least one of the microcontroller and the switch is supported by the first PCB. the heat sink is made of aluminum.

11. The wiring device of claim 10, wherein, the plurality of power electronics is disposed between the first PCB and the heat sink.

12. The wiring device of claim 1, wherein, 14. The wiring device of claim 1, further comprising a protection circuit supported by a surface of the first PCB.

13. The wiring device of claim 1, wherein, 15. An electrical outlet comprising: a rectifier configured to output power at a first direct current (DC) voltage level; a transformer configured to convert power from the first DC voltage level to a second DC voltage level, the transformer connected to a switching device; a DC output port configured to receive power from the transformer at the second DC voltage level; a microcontroller having an electronic processor, the microcontroller configured to control a frequency at which the switching device operates; and a heat sink in direct contact with the transformer.

16. The electrical outlet of claim 15, further comprising a housing formed by a front cover comprising a receptacle face and a rear cover comprising a plurality of vent holes. the heat sink is arranged between the transformer and an interior surface of the rear cover such that the heat sink transfers heat from the transformer to an exterior of the electrical outlet via the plurality of vent holes. the DC output port outputs at least 50 watts of power to a load connected to the DC output port. ​ 17. The electrical outlet of claim 16, wherein, ​ 18. The electrical outlet of claim 15, wherein, ​ 19. The electrical outlet of claim 15, further comprising a first printed circuit board (PCB) supporting the microcontroller and the transformer; and a second PCB supporting the DC output port.

20. The electrical outlet of claim 19, wherein, the transformer is disposed between the first PCB and the heat sink.

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