Method and apparatus for manufacturing integrated metal code disc

Abstract

The application relates to the technical field of code disc manufacturing, and discloses an integrated metal code disc manufacturing method and device; wherein the method performs grinding and polishing treatment on a plate with a preset specification to obtain a polished plate with a smooth surface; the polished plate is subjected to film plating treatment, and a code disc pattern is manufactured on the surface of the plate after film plating, thereby obtaining a code disc plate with the code disc pattern; and the code disc plate is subjected to structure forming processing, thereby obtaining an encoder structure with the code disc on the surface. The method directly completes grinding and polishing, film plating and code disc pattern manufacturing on the plate in sequence by omitting the attaching process in traditional manufacturing, thereby reducing material and process costs; and the plate is continuously processed throughout the process, concentricity deviation caused by attaching is avoided, code disc precision is improved; meanwhile, the integrated code disc and plate structure enhances the ability to resist harsh environments, reduces damage risks, and meets the reliability requirements of encoder applications.

Description

Technical Field

[0001] This application relates to the field of code disk manufacturing technology, and more specifically, to an integrated method and apparatus for manufacturing metal code disks. Background Technology

[0002] As a key device for measuring angle, position, and speed, the encoder's performance is directly determined by the manufacturing precision and reliability of its core component, the metal code disk. Traditional metal code disk manufacturing requires grinding and polishing thin metal materials, coating, photolithography, CNC machining, or laser cutting, before being attached to a metal tray to form the structural component. This process has significant drawbacks: first, it requires an additional attachment process, increasing production steps and costs; second, the attachment process easily leads to concentricity deviations between the code disk and the tray, reducing the encoder's measurement accuracy; and third, the attached structure has poor stability, easily detaching or being damaged in harsh environments, failing to meet the requirements of high-reliability applications. Summary of the Invention

[0003] The main objective of this application is to provide an integrated metal code disk manufacturing method and apparatus, which aims to solve the technical problems in the traditional integrated metal code disk manufacturing process, such as high cost due to the need for an attachment process, accuracy affected by concentricity deviation, and easy damage in harsh environments, thus failing to meet the requirements for high reliability.

[0004] The first aspect of this application proposes an integrated metal code disk manufacturing method, comprising:

[0005] Grinding and polishing are performed on the pre-specified material to obtain a polished material with a smooth surface;

[0006] The polished material is coated, and a code disk pattern is made on the surface of the coated material to obtain a code disk material with a code disk pattern.

[0007] The code disk material is processed into structural components to obtain an encoder structural component with a code disk on its surface.

[0008] Further, the step of coating the polished material and creating a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern includes:

[0009] The polished material undergoes surface cleaning and activation treatment to remove the oxide layer and micro-contaminants. The surface treatment process enhances adhesion and catalytic activity, forming a pre-treated surface suitable for coating.

[0010] Metal reflective film is deposited and composite film is coated sequentially on the pretreated surface, and the composite film is dried and cured to obtain a plate with a composite film layer.

[0011] A resist is applied to the surface of the composite film layer according to the code disk pattern, a matching mask is covered, photoresist is applied, and exposure and development are performed to form a pattern protective layer.

[0012] The composite film area not covered by the protective layer is etched away to remove the mask, resist, and residual photoresist, resulting in a code disk substrate with a code disk pattern.

[0013] Further, the step of etching away the composite film area not covered by the protective layer to remove the mask, resist, and residual photoresist, thereby obtaining a code disk substrate with a code disk pattern, includes:

[0014] The composite film area not covered by the protective layer is etched, and the remaining edges are then trimmed by auxiliary grinding until the composite film in that area is completely removed.

[0015] Peel off the mask from the surface of the board, collect the state information of the board surface at this time, and etch the remaining points on the surface.

[0016] Based on the collected surface condition information, a specific solution was used to remove the corrosion inhibitor and mask residue from the surface of the board, and residual substances at the boundary of the code disk pattern were inspected and removed at specific points.

[0017] The surface of the substrate is treated with a special decomposition solution to break down the residual photoresist.

[0018] The decomposed board material is ultrasonically cleaned and then subjected to deep processing to remove trace residues on the surface, ultimately yielding a code disk board material with a code disk pattern.

[0019] Further, the step of sequentially depositing a metal reflective film and coating a composite film on the pretreated surface, and then drying and curing the composite film to obtain a board with a composite film layer includes:

[0020] The pretreated board is placed in a vacuum environment to remove gaseous impurities, and then surface cleaning is performed to remove residual contaminants and improve the wettability of the board surface.

[0021] Under vacuum conditions, a pure metal reflective film is vapor-deposited onto the surface of the treated plate to form a metal reflective layer;

[0022] Continue to deposit a metal alloy film on the surface of the metal reflective layer under vacuum conditions to form a composite reflective layer together with the metal reflective layer.

[0023] The composite film material is coated onto the surface of the composite reflective layer, and the thickness of the coating is adjusted to form a preliminary composite film.

[0024] The board with the preliminary composite film is dried by step heating to remove moisture, and then cured at a constant temperature to form a stable composite film layer, thus obtaining a board with a composite film layer.

[0025] Further, the steps of coating a resist on the surface of the composite film layer according to the code disk pattern, covering a matching mask, coating a photoresist, and exposing and developing it to form a pattern protective layer include:

[0026] Clean the surface of the composite film layer, apply the corrosion inhibitor according to the outline of the code disk pattern and adjust the thickness to form a complete corrosion inhibitor pattern, and check the integrity of the pattern.

[0027] The matching mask is positioned above the resist pattern using alignment technology, the positioning points are marked and pressed together to ensure that the mask and the resist pattern are precisely aligned.

[0028] Immerse the substrate with the mask into the photoresist solution along the positioning point, slowly lift it up and heat it to fill the groove with photoresist, and then apply more photoresist to ensure uniform thickness.

[0029] The substrate coated with photoresist is exposed in sections, heated after exposure to promote the reaction, and then developed.

[0030] Remove the photoresist layer from the areas not covered by the photomask and without photoresist, and retain the photoresist layer in the target area to form a pattern protection layer.

[0031] Further, the steps of immersing the substrate with the mask into the photoresist solution along the positioning point, slowly lifting it and heating it to fill the groove with photoresist, and then applying additional photoresist to ensure uniform thickness include:

[0032] Position and fix the mask and the substrate, determine the positioning baseline, ensure that after bonding, immerse the part along the baseline in the photoresist solution, and mark the key coverage area;

[0033] The pulling speed is controlled in stages, and small oscillations are used to allow the unimmersed and immersed parts of the photoresist to connect naturally, and the surface adhesion is recorded.

[0034] Heat treatment is performed based on the surface adhesion to promote photoresist filling of the grooves, followed by heat preservation treatment to ensure complete filling;

[0035] Apply photoresist to the entire surface of the substrate, focusing on repairing joints, grooves, and weak areas to ensure uniform photoresist layer thickness.

[0036] Further, the step of performing structural component forming processing on the code disk material to obtain an encoder structural component with a code disk on its surface includes:

[0037] For the marking structure of the code disk plate, determine the outer boundary, mounting hole position and hollow area, determine the thickness and plane size after processing, and plan the processing benchmark;

[0038] The code disk sheet is stamped according to the marked outer boundary to obtain the preliminary shape of the structural part. Then, the stamped sheet is ground to the planned thickness to form a processing reference surface, and excess edges are cut off at the same time.

[0039] According to the planned hollow area, the plate with the processing reference surface is hollowed out, then the surface cutting marks are processed, and the edges and corners of the structural components are trimmed.

[0040] Using the machining reference surface as a reference, mounting holes and threaded holes are machined on the trimmed structural component to finally obtain an encoder structural component with a code disk on the surface.

[0041] Further, the steps of stamping the code disk sheet according to the marked outer boundary to obtain the preliminary shape of the structural component, then grinding the stamped sheet to the planned thickness to form a processing reference surface, and simultaneously cutting away excess edges, include:

[0042] Mark the baseline on the code disk plate, refine the functional areas, stamping positioning points, planned thickness target values ​​and outer boundaries to form a composite mark;

[0043] The code disk sheet is pre-formed by progressive stamping according to the stamping positioning points in the composite mark, and the three-dimensional features are processed to form the preliminary three-dimensional structure of the structural component, and the current thickness of the functional area is determined.

[0044] Based on the planned thickness target value in the composite mark, the stamped sheet is ground with the stamping positioning point as the reference to achieve the planned thickness, and at the same time, the processing reference surface is formed.

[0045] The outer boundary of the composite mark is calibrated using the machining reference surface. The sheet metal is then cut to remove most of the excess edges and trim complex corners, resulting in a structural blank with a code disk.

[0046] Furthermore, the step of calibrating the outer boundary of the composite mark using the processing reference surface, cutting the sheet metal to remove most of the excess edges and trim complex corners to obtain the structural component blank with the code disk includes:

[0047] Using the machining reference plane as a reference, calibrate the outer boundary of the composite mark, mark the boundary line and the boundary of complex corners, distinguish the straight edge segments and key corner areas, and clarify the functional area range;

[0048] Cut off most of the material from the straight edge segments, cut and process the fine contours, and record the complex corner areas that were not cut.

[0049] Based on the records, perforation was carried out in key corner areas;

[0050] The complex corner area after perforation is cut and processed to smoothly connect it with the straight edge segment;

[0051] The cut edges are reinforced and then the edge surfaces are trimmed to ensure they fit the functional areas, resulting in a structural component blank with a code disk.

[0052] A second aspect of this application also proposes an integrated metal code disk manufacturing device, comprising:

[0053] The grinding and polishing module is used to grind and polish the sheet material of a preset specification to obtain a polished sheet material with a smooth surface.

[0054] The code disk pattern making module is used to coat the polished material and make a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern.

[0055] The structural component forming module is used to process the code disk plate into structural components to obtain an encoder structural component with a code disk on its surface.

[0056] The first aspect of this plan brings the following benefits:

[0057] This application eliminates the traditional bonding process, directly completing grinding, polishing, coating, and code disk pattern fabrication on the substrate sequentially, reducing material and process costs. Furthermore, the entire process is based on the substrate and continuously processed, avoiding concentricity deviations caused by bonding and improving code disk accuracy. At the same time, the integrated code disk and substrate structure enhances resistance to harsh environments and reduces the risk of damage. Ultimately, it meets high reliability requirements and is suitable for encoder applications with strict requirements for accuracy and stability. Attached Figure Description

[0058] Figure 1 This is a flowchart illustrating an embodiment of the manufacturing method of an integrated metal code disk according to this application.

[0059] Figure 2 This is a schematic diagram of the structure of an integrated metal code disk manufacturing device according to an embodiment of this application;

[0060] Figure 3 This is a schematic diagram of the structure of a computer device according to an embodiment of this application;

[0061] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0063] Those skilled in the art will understand that, unless explicitly stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in the specification of this application means the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or groups thereof. It should be understood that when an element is “connected” or “coupled” to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein may include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any modules and all combinations of one or more associated listed items.

[0064] Those skilled in the art will understand that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0065] Reference Figure 1 This application provides an integrated metal code disk manufacturing method, including:

[0066] S1: Grind and polish the board material of the preset specifications to obtain a polished board material with a smooth surface;

[0067] S2: The polished material is coated, and a code disk pattern is made on the surface of the coated material to obtain a code disk material with a code disk pattern.

[0068] S3: The code disk plate is processed into structural components to obtain an encoder structural component with a code disk on its surface.

[0069] In step S1, the material of a preset specification is ground and polished to obtain a smooth polished material, which is the basis for subsequent coating, pattern making, and structural forming. Taking the production of a certain type of encoder metal code disk as an example, a 2mm thick 45# steel plate is selected. First, the internal stress distribution is detected by a stress detector. Local stress concentration is found at the edge. The plate is placed in a 200℃ constant temperature furnace for 2 hours to release the stress. Then, the thickness is corrected to 1.8mm using a precision milling machine, generating a characteristic report including stress and thickness deviation. Subsequently, the surface is scanned with a laser scanner to locate 3 hard spots with excessive hardness. Their positions and hardness values ​​are marked. Differential rough grinding is performed on the hard spot areas using an 800# grit wheel to remove 0.15mm of thickness. The non-hard spot areas are rough ground with a 1000# grit wheel to remove 0.1mm. The entire process is carried out in a constant temperature environment of 25℃ to avoid temperature deformation. After rough grinding, fine grinding parameters are calculated based on the test data. A 1500# grinding wheel is used for fine grinding, controlling the surface peak-to-valley difference to be ≤0.5μm. Finally, the flatness is tested to reach 0.01mm / m, and the salt spray corrosion resistance time is ≥48 hours, resulting in a polished substrate that meets the requirements. This provides a flat substrate for uniform coating and precise photolithography in S2. This embodiment ensures high-precision flatness of the substrate surface through multi-stage processing, releases stress to avoid deformation in subsequent processing, uses differentiated grinding to target hard points and improve efficiency, and maintains stability through constant temperature control. It provides a high-quality substrate for subsequent steps, effectively reducing problems such as uneven coating and pattern distortion, and laying the foundation for the overall accuracy of the code disk.

[0070] In step S2, which involves coating and creating the code disk pattern on the polished substrate obtained in S1, the core step in forming the functional layer of the code disk is to perform coating. Taking the aforementioned polished 45# steel plate as an example, ultrasonic cleaning is first used to remove residual grinding debris and oil stains from the surface, followed by plasma treatment to remove the oxide layer, ensuring a surface cleanliness of 99.9%. Then, it enters a vacuum coating chamber where a 50nm thick pure aluminum reflective film is first deposited, followed by a 20nm thick aluminum-silicon alloy film to form a composite reflective layer, improving reflectivity. After cooling, a composite film made of epoxy resin and photosensitizer is uniformly coated onto the surface of the composite film and cured by hot air drying at 60℃ for 30 minutes. Next, according to the incremental code track pattern parameters of this encoder model, a 10μm thick photoresist resist is applied to the surface of the substrate, and a pre-calibrated chrome mask is applied, ensuring that the positioning deviation between the mask and the edge of the substrate is ≤0.005mm. The substrate is immersed in the photoresist solution and then pulled up at a speed of 5 mm / s. After heating to 80℃, the photoresist fills the fine grooves on the surface. Thin areas are then recoated until the thickness is uniform. Subsequently, the substrate is exposed to ultraviolet light in sections, with the exposure energy controlled at 80 mJ / cm². 2After development, the photoresist in the code track pattern area is retained as a protective layer. Finally, the unprotected composite film area is etched with an acidic etching solution, with the etching depth controlled at 30nm. After stripping the mask, residual photoresist is removed with an organic solvent. Following ultrasonic cleaning and rinsing with deionized water, a code disk substrate with a clear code track pattern is obtained, providing a fully functional semi-finished product for the S3 structure. This embodiment enhances reflectivity through precise coating, combined with high-precision photolithography etching to ensure a clear and regular code track pattern that matches the flat substrate of S1, reducing the risk of pattern distortion and providing a reliable optical signal carrier for the subsequent functional realization of structural components.

[0071] In step S3, the code disk plate with the code disk pattern obtained in S2 is processed into a structural component, making it a directly assembleable encoder structural component. Taking the 45# steel plate code disk plate with incremental code track pattern as an example, the outer boundary of the structural component, three evenly distributed mounting holes, and the central hollow area are first marked using a laser marking machine to ensure that the concentricity deviation between the marking line and the code track pattern is ≤0.01mm. A CNC punch press is used to punch out the preliminary shape according to the markings, with the punching pressure set to 500kN to avoid deformation of the pattern area. Then, a surface grinder is used to grind the plate thickness to the design value of 1.5mm, using the surface where the code track pattern is located as the reference surface to ensure that the parallelism error is ≤0.003mm. Next, a wire cutting machine is used to process the central hollow area, with the cutting speed controlled at 2mm / min to reduce heat-affected zone damage to the code track pattern. The burrs on the cut edges are then trimmed with sandpaper, making the corner transition radius reach 0.2mm. Finally, using the reference plane, three 4mm diameter mounting holes were machined using a CNC drilling machine, with the hole position tolerance controlled within ±0.02mm. M3 threads were then tapped. After completion, the surface was wiped with alcohol to remove machining debris, resulting in an encoder structural component with clear surface markings and precise dimensions. This component can be directly assembled with the motor shaft to achieve angle detection. This embodiment ensures the structural component's dimensional accuracy and marking pattern fit through precise positioning and machining, avoiding damage to the pattern during processing. It achieves integration of the code disk and structural component, resulting in an OMS metal code disk, improving assembly efficiency and overall stability. Here, "OMS" stands for "One Metal Solution," a specific abbreviation defined in the context of metal code disk manufacturing, with the core meaning being "an integrated metal material processing solution." Its English origin is a combination of expressions based on the needs of metal code disk manufacturing: "One" reflects "single substrate and continuous process", "Metal" clearly indicates that the application object is metal sheet, and "Solution" emphasizes the integrated solution of the entire process from grinding and polishing, coating and pattern making to structural forming. It is different from the OMS abbreviation in other fields such as Order Management System and World Health Organization in the abstract, and specifically refers to the integrated technical system of metal code disk manufacturing.

[0072] In one embodiment, the step of grinding and polishing a sheet of material with a preset specification to obtain a polished sheet with a smooth surface includes:

[0073] S10: Perform characteristic testing and pretreatment on the board material, release internal stress and correct thickness, and generate a board material characteristic report;

[0074] S11: Based on the material characteristics report, pre-treat the surface hard spot area, rough grind to remove the surface peak area, and calculate the fine grinding parameters;

[0075] S12: Adjust the process according to the fine grinding parameters, and perform fine grinding and polishing on the surface of the plate to optimize the surface peak-valley difference;

[0076] S13: Inspect the flatness and corrosion resistance of the finely ground and polished board. Based on the test results, optimize the pretreatment and fine grinding parameters to obtain a polished board with a smooth surface.

[0077] In this embodiment, taking a 2mm thick 45# steel plate used to manufacture the metal code disk of a certain type of encoder as an example, the characteristics and preprocessing are first performed: a stress detector is used to scan the plate, and a local stress concentration area (stress value up to 120MPa) is found 5mm from the edge. The plate is placed in a 200℃ constant temperature furnace for 2 hours and the stress drops to below 60MPa after natural cooling. The thickness is measured with a micrometer, and the maximum deviation is found to be 0.15mm. The thickness is uniformly corrected to 1.8mm by a precision milling machine, and a plate characteristic report including stress distribution and thickness deviation is generated. Then, according to the report, the surface hard spots are preprocessed and rough grinding is performed: a laser hardness tester is used to scan and locate 3 hard spots with excessive hardness (hardness up to 280HV, higher than the surrounding 220HV), and their coordinates and hardness values ​​are marked. For hard spot areas, use an 800# grinding wheel for rough grinding to remove 0.15mm of thickness to eliminate hard spot protrusions; for non-hard spot areas, use a 1000# grinding wheel for rough grinding to remove 0.1mm of thickness. The entire process is carried out in a constant temperature environment of 25℃±0.5℃ to avoid deformation caused by temperature changes. At the same time, it is calculated that the amount of material removed by fine grinding needs to be controlled within 0.05mm.

[0078] Then, the process was adjusted according to the fine grinding parameters: a 1500# grinding wheel was selected, the feed speed was set to 30 mm / min, and the grinding pressure was 0.3 MPa. The surface of the board was finely ground and polished. The surface peak-to-valley difference was optimized from 3 μm after rough grinding to ≤0.5 μm by real-time monitoring with a laser profilometer. Finally, the flatness and corrosion resistance were tested: the flatness was measured to be 0.008 mm / m, which meets the requirement of ≤0.01 mm / m; a 48-hour salt spray test was conducted, and the surface showed no rust. The flatness (≤0.01 mm / m) and salt spray corrosion resistance (≥48 hours) of the polished board were tested. If the corrosion resistance did not meet the standard, the process was returned to the hard spot pretreatment stage, and the feed pressure of the rough grinding wheel was increased (e.g., by 10-15%) to eliminate surface micro-cracks. The fine grinding and testing steps were then repeated until a polished board that meets the preset corrosion resistance was obtained. Based on the test results, the stress release effect of the pretreatment and the fine grinding parameters were confirmed to be reasonable, requiring no adjustment. The final product was a polished sheet with a smooth surface, providing a qualified substrate for subsequent coating and pattern making. Feedback optimization parameters were implemented: if the flatness exceeded the standard (>0.01mm / m), the grinding wheel feed speed was reduced by 5mm / min and the grinding wheel grit size was increased to 2000# during the fine grinding stage. Through phased testing and targeted treatment, internal stress was effectively released, hard spots were eliminated, and the flatness and corrosion resistance of the sheet were improved. Dynamic optimization of the fine grinding parameters ensured consistency, laying a high-precision foundation for subsequent processes and reducing the defect rate.

[0079] In one embodiment, the steps of pre-treating the surface hard spot area, coarsely grinding to remove the surface peak area, and calculating the fine grinding parameters based on the material characteristic report include:

[0080] S110: Scan and locate the hard spot areas on the surface of the board, mark the hard spot hardness, thickness deviation, thermal expansion and residual stress information, and generate a comprehensive distribution map of hard spots.

[0081] S111: Input the hard spot comprehensive distribution map data into the parameter prediction model to predict the appropriate grinding parameters, and perform differentiated grinding on the corresponding areas according to the hardness and thickness differences of the hard spots to control the overall thickness of the board.

[0082] S112: The board is coarsely ground in a constant temperature environment. The grinding amount is determined according to the comprehensive distribution map of hard spots, and the amount to be removed by fine grinding is reserved to refine the surface roughness.

[0083] S113: Based on the grinding depth and surface roughness after coarse grinding, calculate the appropriate fine grinding parameters, optimize the parameter prediction model by combining temperature compensation factors, and form data feedback.

[0084] In this embodiment, taking a No. 45 steel plate (1.8mm thick after pretreatment) used to manufacture the metal code disk of a certain type of encoder as an example, the hard spot areas on the surface of the plate are first scanned and located: using a combination of laser 3D scanner and hardness tester, three hard spot areas were found (coordinates (50,30), (120,80), and (180,50)mm respectively). The hardness (280HV, 300HV, 270HV), thickness deviation (+0.12mm, +0.15mm, +0.1mm), and thermal expansion (11.2×10) of the hard spots are marked. -6 The hard spot distribution map, including parameters such as temperature (°C) and residual stress (80MPa, 95MPa, 75MPa), is generated. The distribution map data is then input into the parameter prediction model: the model outputs adapted grinding parameters based on historical data (800# grinding wheel grit size and 20mm / min feed rate in hard spot areas; 1000# grinding wheel grit size and 30mm / min feed rate in non-hard spot areas). Grinding is differentiated according to hardness: 10% grinding pressure is increased in the 300HV hard spot area, removing 0.15mm of thickness; 0.14mm is removed in the 280HV area; 0.12mm is removed in the 270HV area; and 0.1mm is uniformly removed in non-hard spot areas, ensuring the overall thickness after grinding is controlled at 1.65±0.02mm.

[0085] Subsequently, coarse grinding was performed under constant temperature conditions: the plate was placed in a constant temperature grinding chamber at 25℃±0.2℃, and the grinding amount for each area was set according to the hard spot distribution map, with a 0.03mm fine grinding amount reserved in the hard spot areas and a 0.02mm fine grinding amount reserved in the non-hard spot areas. After coarse grinding, the surface roughness was measured with a roughness meter, and the surface roughness was refined from the initial 3.2μm to 1.6μm, meeting the requirements of the coarse grinding stage. Finally, the fine grinding parameters were calculated and the model was optimized: based on the grinding depth (maximum 0.15mm) and surface roughness (1.6μm) after coarse grinding, it was calculated that fine grinding requires a 1500# grinding wheel, a feed speed of 40mm / min, and a pressure of 0.25MPa. Combining the actual temperature fluctuation (±0.2℃) of the constant temperature environment, a temperature compensation coefficient of 1.02 was introduced to correct the parameter prediction model, reducing the prediction error of the grinding parameters for the next batch from 5% to 3%, forming a complete data feedback closed loop, and providing accurate parameter basis for subsequent fine grinding. By using precise hard point positioning and differentiated grinding, over-grinding or under-grinding is avoided. Constant temperature control ensures stability, and dynamic optimization of parameter models improves accuracy, laying a uniform foundation for fine grinding and reducing the risk of errors in subsequent processes.

[0086] In one embodiment, the step of coarsely grinding the board under a constant temperature environment, determining the grinding amount based on the comprehensive distribution map of hard spots, reserving the amount to be removed by fine grinding, and refining the surface roughness includes:

[0087] S1120: Place the plate to be ground in a constant temperature environment, maintain a stable temperature, detect and mark the thickness difference area according to the comprehensive distribution map of hard spots, set the coarse grinding increment for that area, and distinguish the thickness standard area at the same time.

[0088] S1121: Focus on rough grinding in areas with thickness differences according to the set rough grinding increment, and simultaneously perform basic rough grinding in areas with standard thickness to ensure that the grinding amount is appropriate for different areas.

[0089] S1122: Combine the analysis model and empirical algorithm to calculate the grinding efficiency, calculate the amount of material to be removed by fine grinding after coarse grinding based on the grinding efficiency, and record the surface condition information of the board.

[0090] S1123: Based on the recorded surface condition information and the reserved amount of fine grinding removal, a composite grinding method combining specific trajectory grinding and vibration is used to refine the overall surface of the board and control the surface roughness.

[0091] In this embodiment, taking a No. 45 steel plate (1.8mm thick after hard point positioning) used to manufacture the metal code disk of a certain type of encoder as an example, the plate to be ground is first placed in a constant temperature grinding chamber at 25℃±0.1℃. The ambient temperature is monitored in real time using an infrared thermometer to ensure that the fluctuation does not exceed ±0.05℃. Based on the comprehensive distribution map of hard points, three areas with thickness differences (exceeding the standard thickness by 0.12mm, 0.15mm, and 0.1mm respectively) are detected, and the corresponding rough grinding increments are set to 0.12mm, 0.15mm, and 0.1mm. For the remaining standard thickness areas (thickness deviation ≤0.03mm), the basic rough grinding amount is set to 0.08mm. Next, the CNC grinding machine is started to focus on rough grinding of areas with thickness differences: for areas that are 0.15mm thick (hardness 300HV), an 800# grinding wheel is used to grind at a feed speed of 25mm / min, and the grinding depth is recorded every 5 seconds to ensure that the actual increase deviates from the set value by ≤0.01mm; at the same time, the standard area is rough ground with a 1000# grinding wheel at a speed of 35mm / min. Through the linkage control of the dual grinding wheel heads, the grinding amount of different areas is matched to avoid local overthinness.

[0092] Subsequently, combining analytical models and empirical algorithms: the model input parameters such as board hardness and grinding wheel grit size, calculating the grinding efficiency under the current conditions to be 0.02 mm / s. Based on this, the amount of material to be removed after rough grinding was calculated—0.03 mm to be reserved in the differential area and 0.02 mm to be reserved in the standard area. The roughness (2.0 μm in the differential area, 1.8 μm in the standard area) and flatness data of each area were recorded using a surface scanner. Finally, a composite grinding method was used to refine the surface: grinding was performed with a spiral trajectory (0.5 mm pitch), while simultaneously superimposed with 15 kHz high-frequency micro-vibration (5 μm amplitude), so that the abrasive grains acted evenly on the surface. The grinding time in the differential area was extended by 10%, ensuring that the roughness was reduced from 2.0 μm to 1.5 μm; the roughness in the standard area was reduced from 1.8 μm to 1.4 μm, and the overall surface roughness was controlled within the range of 1.4-1.5 μm, providing a uniform pre-treated surface for subsequent fine grinding and polishing, and the reserved fine grinding amount could cover subsequent processing errors. A constant temperature environment ensures grinding stability, differentiated grinding adapts to thickness differences, composite grinding refines roughness, and reserved fine grinding allowance leaves room for subsequent processes, improving the surface uniformity of the board and reducing the processing pressure in the fine grinding stage.

[0093] In one embodiment, the step of coating the polished material and creating a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern includes:

[0094] S20: The polished material undergoes surface cleaning and activation treatment to remove the oxide layer and micro-contaminants. The surface treatment process enhances adhesion and catalytic activity, forming a pre-treated surface suitable for coating.

[0095] S21: Metal reflective film evaporation and composite film coating are performed sequentially on the pretreated surface, and the composite film is dried and cured to obtain a plate with a composite film layer.

[0096] S22: Apply a resist to the surface of the composite film layer according to the code disk pattern, cover it with a matching mask, apply photoresist and expose and develop it to form a pattern protective layer.

[0097] S23: Etch away the composite film area not covered by the protective layer to remove the mask, resist and residual photoresist, and obtain a code disk board with a code disk pattern.

[0098] In this embodiment, taking a polished 45# steel plate (surface peak-to-valley difference ≤ 0.5μm, flatness 0.008mm / m) after S1 treatment as an example, the surface is first cleaned and activated: the polished plate is placed in an ultrasonic cleaning tank and ultrasonically cleaned with 5% nitric acid solution at 40℃ for 10 minutes to remove residual grinding debris and oil stains; then it is transferred to a plasma treatment instrument, argon gas is introduced (flow rate 20sccm), and it is treated at 100W power for 3 minutes to remove the oxide layer and form a nanoscale rough structure on the surface, improving the adhesion of the coating. After treatment, the surface contact angle is ≤15°, and the catalytic activity is increased by 30%, forming a pre-treated surface suitable for coating. Next, metal reflective film evaporation and composite film coating are performed: the pre-treated plate is placed in a vacuum coating chamber (vacuum degree 5×10 -4 First, a 50 nm thick pure aluminum reflective film is deposited at a rate of 0.5 nm / s to ensure a reflectivity of ≥85%. Then, a 20 nm thick aluminum-silicon alloy film (aluminum-silicon ratio 9:1) is deposited to form a composite reflective layer, enhancing corrosion resistance. After cooling to room temperature, a composite film (epoxy resin and silica nanoparticles mixed at a mass ratio of 8:2) is coated onto the surface of the composite reflective layer using a slot coater, with the thickness controlled at 10 μm. Subsequently, it is placed in a 60 °C oven for 40 minutes to cure, obtaining a board with a composite film layer.

[0099] Then, a protective pattern layer is fabricated: Following the incremental code pattern of this encoder model (including A and B phases and the zero-position signal), an 8μm thick resist (phenolic resin) is applied to the surface of the composite film using a precision coating machine. A calibrated chrome photomask is then placed over it, ensuring the positioning deviation between the photomask and the substrate edge is ≤0.003mm. The substrate is immersed in a 20% photoresist solution and vertically lifted at a speed of 3mm / s to uniformly cover the resist surface. After heating at 70℃ for 10 minutes, the surface's fine grooves are filled. Thin areas are recoated until the thickness is consistent (deviation ≤0.5μm). Subsequently, ultraviolet light (wavelength 365nm) is used for regional exposure, with an exposure energy of 75mJ / cm² for the A / B phase regions. 2 Zero region 85mJ / cm 2After development, the photoresist in the code track pattern area is retained to form a precise pattern protective layer. Finally, etching and residue removal are performed: the substrate is immersed in an acidic etching solution (phosphoric acid and nitric acid mixed in a 5:1 volume ratio), and the composite film area not covered by the protective layer is etched at 30°C for 8 minutes, ensuring an etching depth of 30nm (matching the composite film thickness). After removal, the mask is peeled off, the resist is removed with a 10% sodium hydroxide solution, and then ultrasonically cleaned with acetone for 15 minutes to remove residual photoresist. After rinsing with deionized water and drying, a code disk substrate with smooth code track edges (roughness ≤0.1μm) and clear patterns is obtained, providing a fully functional semi-finished product for subsequent S3 structure forming. Surface cleaning and activation ensure strong coating adhesion, the composite film layer improves reflectivity and corrosion resistance, high-precision photolithography etching ensures accurate code track patterns, and the tight connection between each step provides a reliable optical foundation for the realization of the code disk function.

[0100] In one embodiment, the step of sequentially depositing a metal reflective film and coating a composite film on the pretreated surface, and then drying and curing the composite film to obtain a board with a composite film layer includes:

[0101] S210: The pre-treated board is placed in a vacuum environment to remove gaseous impurities, and then residual contaminants are removed through surface cleaning to improve the wettability of the board surface.

[0102] S211: Under vacuum conditions, a pure metal reflective film is vapor-deposited on the surface of the treated plate to form a metal reflective layer;

[0103] S212: Continue to deposit a metal alloy film on the surface of the metal reflective layer under vacuum conditions to form a composite reflective layer together with the metal reflective layer.

[0104] S213: Coating the composite film material onto the surface of the composite reflective layer, and adjusting the thickness of the coating after coating to form a preliminary composite film;

[0105] S214: The board with the preliminary composite film is dried by step heating to remove moisture, and then cured at a constant temperature to form a stable composite film layer, thus obtaining a board with a composite film layer.

[0106] In this embodiment, taking a 45# steel plate polished material (contact angle ≤15°) that has undergone surface cleaning and activation treatment as an example, the pre-treated material is first placed into the vacuum coating chamber. After closing the chamber door, the vacuum pump is started to reduce the vacuum level inside the chamber to 5×10⁻⁶. -5The process involved applying pressure at 1000 Pa for 30 minutes to remove air and adsorbed gaseous impurities. Then, an ion source was activated, and argon gas (15 sccm flow rate) was introduced for glow discharge, bombarding the surface of the substrate with 500 eV energy for 2 minutes to remove residual nanoscale contaminants. Post-treatment, surface wettability was improved, with water droplet spreading speed increasing by 40% compared to before treatment. Next, a pure metal reflective film was deposited under vacuum conditions: using an electron beam evaporation source, 99.99% pure aluminum wire was placed in a crucible and heated to 1200℃ to evaporate the aluminum. A pure aluminum reflective film was deposited on the substrate surface at a rate of 0.3 nm / s, monitored in real-time by a quartz crystal film thickness monitor. Deposition was stopped when the thickness reached 50 nm, forming a uniform metal reflective layer with a visible light reflectivity of 88%. Continue to deposit metal alloy films under the same vacuum environment: change the evaporation source to aluminum-silicon alloy target (90% aluminum, 10% silicon), adjust the evaporation power to 800W, and deposit a 20nm thick alloy film on the surface of the pure aluminum reflective layer at a rate of 0.2nm / s. Together with the lower pure aluminum reflective layer, it forms a composite reflective layer. The test results show that the salt spray resistance of this composite layer is 50% higher than that of the single aluminum film.

[0107] Following this, composite film coating and thickness adjustment were performed: The composite film material (a mixture of epoxy resin and alumina nanoparticles at a mass ratio of 7:3, viscosity 500 cP) was poured into the material tank of a precision coating machine and uniformly coated onto the surface of the composite reflective layer using a micro-gravure coating method, with the initial coating thickness controlled at 12 μm; by scanning and detecting with a laser thickness gauge, areas with excessive thickness (deviation > 1 μm) were slightly adjusted with a scraper, ultimately stabilizing the coating thickness at 10 ± 0.5 μm, forming the preliminary composite film. Finally, drying and curing were carried out: The board with the preliminary composite film was placed in an oven and treated according to a stepped temperature increase program—from room temperature to 40℃ (heating rate 2℃ / min), held for 20 minutes to remove surface moisture; then to 60℃ (rate 1℃ / min), held for 30 minutes to remove deep moisture; finally, to 80℃ (rate 0.5℃ / min), held at a constant temperature for 60 minutes to allow the composite film to fully cross-link. After curing, the composite film layer was tested and found to have a hardness of 3H (pencil hardness) and an adhesion rating of 1 (cross-cut test), resulting in a substrate with a stable composite film layer. This provides a smooth and highly adhesive base for subsequent photolithography pattern fabrication. The vacuum environment ensures the purity of the coating, the composite reflective layer enhances optical performance and corrosion resistance, step-curing prevents film cracking, and precise thickness control ensures consistency, providing a high-quality base for pattern fabrication.

[0108] In one embodiment, the steps of coating a resist on the surface of the composite film layer according to a code disk pattern, covering a matching mask, coating a photoresist, and exposing and developing the film to form a patterned protective layer include:

[0109] S220: Clean the surface of the composite film layer, apply the corrosion inhibitor according to the outline of the code disk pattern and adjust the thickness to form a complete corrosion inhibitor pattern, and check the integrity of the pattern.

[0110] S221: Using alignment technology, the matching mask is positioned above the resist pattern, the positioning points are marked and pressed together to ensure that the mask and the resist pattern are precisely aligned.

[0111] S222: Immerse the substrate with the mask into the photoresist solution along the positioning point, slowly lift it up and heat it to fill the groove with photoresist, and apply more photoresist to ensure uniform thickness.

[0112] S223: The substrate coated with photoresist is exposed in sections, heated after exposure to promote the reaction, and then developed.

[0113] S224: Remove the photoresist layer in areas not covered by the mask and without resist, retaining the photoresist layer in the target area to form a pattern protection layer.

[0114] In this embodiment, a No. 45 steel plate with a stable composite film layer (composite film hardness 3H, adhesion level 1) is used as an example to specifically illustrate the implementation process of this step. First, clean the surface of the composite film layer: wipe the surface with a lint-free cloth soaked in isopropyl alcohol to remove residual curing volatiles, and then pass it through a Class 100 cleanroom air shower for 1 minute. According to the incremental code pattern of this model encoder (A phase and B phase are spaced 1 / 4 cycle apart, zero position width 0.5mm), use a high-precision inkjet coating machine to coat the surface of the composite film layer with a corrosion inhibitor (phenolic resin and curing agent are mixed at a mass ratio of 5:1), with a coating speed of 20mm / s and a thickness set to 5μm. After coating, scan with a laser profilometer, and use a micro scraper to trim any rough edges to ensure that the corrosion inhibitor pattern completely covers the code track area. CCD visual inspection confirms that there are no missing corners or broken lines, and the pattern integrity reaches 100%. Next, the mask is positioned: a chrome-plated quartz mask (with a 99.9% match between the transparent area and the code pattern) is selected. An optical alignment system is used to align the mask with the resist pattern, and calibration is performed through the four corner positioning holes to ensure that the concentricity deviation is ≤0.002mm. After marking the positioning points, a pneumatic pressing device is used to apply 0.05MPa pressure to fix it in place, preventing the mask from shifting during exposure.

[0115] Next, photoresist was applied: the substrate with the mask was vertically immersed in the photoresist solution (positive photoresist, 18% solid content), and slowly pulled up at a speed of 2 mm / s to ensure the photoresist evenly covered the mask and the surface of the resist. It was then placed in an 80℃ oven for 5 minutes to allow the photoresist to fully fill the fine grooves on the surface (depth ≤0.3μm). A laser thickness gauge revealed a thickness deviation of 1.2μm at the edges; a micro-dispensing machine was used to reapply the photoresist until the overall thickness was controlled at 8±0.3μm. Next, exposure and development were performed: the substrate was placed in a step-by-step exposure machine, and the A-phase and B-phase areas were exposed to 365nm ultraviolet light at an energy of 70mJ / cm². 2 The zero-position region, with its finer lines, requires an exposure energy increased to 90 mJ / cm².2 Partial exposure avoids overexposure at the pattern edges. After exposure, heating on a 90℃ hot plate for 30 seconds promotes the photochemical reaction, followed by immersion in a developer solution (2.38% tetramethylammonium hydroxide solution) for 40 seconds. Dissolved photoresist is removed through a spray system. Finally, a pattern protective layer is formed: after development, rinsing with deionized water completely removes the photoresist in areas not covered by the mask and without resist (non-code track areas), while the photoresist layer (covering resist) in the code track areas remains intact. Scanning electron microscopy shows that the edge perpendicularity of the protective layer is ≥85° and the linewidth error is ≤±0.005mm, forming a precise pattern protective layer that provides reliable masking for subsequent etching. The dual protection of resist and photoresist improves pattern accuracy, precise alignment and partial exposure ensure clear details, and thickness control ensures etching consistency, providing stable masking for code track pattern formation and reducing the risk of pattern distortion.

[0116] In one embodiment, the steps of immersing the substrate with the mask into the photoresist solution along the positioning point, slowly lifting it and heating it to fill the groove with photoresist, and then applying additional photoresist to ensure uniform thickness include:

[0117] S2220: Position and fix the mask and the substrate, determine the positioning baseline, ensure that the photoresist solution is immersed along the baseline after bonding, and mark the key coverage area;

[0118] S2221: Control the lifting speed in stages, and combine with small oscillations to allow the unimmersed and immersed parts of the photoresist to connect naturally, and record the surface adhesion.

[0119] S2222: Heat treatment is performed according to the surface adhesion to promote the photoresist filling of the groove, and then heat preservation treatment is performed to ensure complete filling;

[0120] S2223: Apply photoresist to the entire surface of the substrate, focusing on repairing joints, grooves and weak areas to ensure uniform photoresist layer thickness.

[0121] In this embodiment, a 45# steel plate with a chrome-plated quartz mask (with resist coating and mask positioning completed, concentricity deviation ≤0.002mm) is used as an example to illustrate the implementation process of this step. First, the mask and the plate are positioned and fixed: the mask and the plate are rigidly fixed through four corner positioning holes. Two perpendicularly intersecting positioning reference lines (coinciding with the center of the code pattern) are calibrated using a laser interferometer. After ensuring that they are attached, the lower half of the plate (accounting for 60% of the total area) is immersed in the photoresist solution (positive photoresist, solid content 18%) along the reference lines, and the A / B phase boundary area and the zero-position fine line area are marked as key coverage areas (the integrity of the adhesive layer needs to be ensured). Next, the lifting speed is controlled in stages: the lifting speed is matched with the mask positioning – the lifting speed is controlled in stages: a low lifting speed of 5mm / s is used in the mask positioning point area, and a high lifting speed of 10mm / s is used in the non-positioning point area; after reapplying photoresist, a small oscillation is performed at a frequency of 5Hz±1Hz and an amplitude of ±0.5mm±0.1mm for 10-15 seconds, that is, a small oscillation at 5Hz and an amplitude of ±0.5mm to ensure that the photoresist is completely adhered to the photoresist in the cutout area of ​​the mask; the robotic arm is started to lift vertically at an initial speed of 1mm / s. When the upper edge of the plate is about to leave the liquid surface (the remaining 10% of the area has not been removed), the speed is reduced to 0.5mm / s, and a small oscillation of 5Hz (amplitude ±0.5mm) is applied at the same time to allow the photoresist in the unimmersed part and the immersed part to naturally fuse and connect, avoiding the formation of a stepped thickness difference. After lifting, the surface was photographed with a CCD camera. The results showed that the key coverage areas were evenly coated, with only a slight thin area (thickness deviation of 0.8μm) within 1mm of the edge.

[0122] Following this, heating and heat preservation treatments were performed: the substrate was placed in a 60℃ constant temperature oven for 8 minutes, utilizing the fluidity of the photoresist to facilitate its filling of the fine grooves (depth ≤ 0.3μm) on the surface of the composite film. Real-time infrared imaging confirmed that the photoresist filling rate within the grooves was over 98%. The substrate was then kept at 50℃ for 5 minutes to allow the filled photoresist to initially set, ensuring no air bubbles or voids within the grooves. Finally, overall touch-up coating and correction were performed: a micro-flow spray gun (nozzle diameter 0.1mm) was used to apply photoresist to the entire substrate surface, with a spraying pressure of 0.1MPa and a moving speed of 50mm / s. An additional layer of coating was applied to the edge junctions (thin areas), and an oblique spraying (45° angle) was used to ensure sufficient coverage of the groove area at the A / B phase boundary. For weak areas such as zero-position fine lines, targeted touch-up coating was performed using CCD vision guidance. After recoating, a laser thickness gauge scan showed that the overall photoresist layer thickness was 8±0.2μm, with a thickness deviation of ≤0.1μm in key areas. The uniformity was improved by 60% compared to before recoating, providing a consistent photoresist layer foundation for subsequent exposure and development. Staged lifting and oscillation ensured smooth photoresist layer transitions, while heat filling solved the problem of groove coverage. Precise recoating ensured uniform thickness, providing a stable photoresist layer foundation for the pattern accuracy during exposure and development, and reducing local defects.

[0123] In one embodiment, the step of etching away the composite film area not covered by the protective layer to remove the mask, resist, and residual photoresist, thereby obtaining a code disk substrate with a code disk pattern, includes:

[0124] S230: Etch the area of ​​the composite film not covered by the protective layer, and then trim the remaining edges by auxiliary grinding until the composite film in that area is completely removed;

[0125] S231: Peel off the mask from the surface of the board, collect the state information of the board surface at this time, and etch the remaining points on the surface.

[0126] S232: Based on the collected surface condition information, use a specific solution to remove the corrosion inhibitor and mask residue from the surface of the board, and check and remove the residual substances at the boundary of the code disk pattern.

[0127] S233: Treat the surface of the substrate with a special decomposition solution to decompose residual photoresist;

[0128] S234: The decomposed board is ultrasonically cleaned and then deep-processed to remove trace residues on the surface, finally obtaining a code disk board with a code disk pattern.

[0129] In this embodiment, taking a 45# steel plate with a patterned protective layer (protective layer edge perpendicularity ≥85°, line width error ≤±0.005mm) as an example, etching and edge trimming are performed first: the plate is placed in an etching tank, and an acidic etching solution (phosphoric acid: nitric acid: water = 5:1:2) is used to etch the composite film area (non-code track area) not covered by the protective layer at 32°C for 10 minutes. Real-time monitoring ensures that the etching depth reaches 30nm (consistent with the thickness of the composite film layer). After removal, 2000# diamond polishing paste is used for auxiliary polishing, focusing on trimming the residual protrusions (height ≤0.5μm) at the etched edges until the composite film in that area is completely removed under a microscope, exposing the underlying metal reflective layer. Next, the mask is peeled off and residual points are treated: the chrome-plated quartz mask is gently peeled off along the positioning points with tweezers, and the surface condition is photographed with a high-resolution camera, recording and showing 3 residual points with a diameter ≤0.01mm (located in the non-code track area). These residual points were precisely removed using laser etching (5W power, 0.02mm spot diameter) to ensure no composite film residue remained.

[0130] Subsequently, the resist and boundary residues were removed: Based on the surface condition information, the substrate was immersed in a 10% sodium hydroxide solution (40℃) and ultrasonically cleaned for 5 minutes to remove the resist. The solution was circulated and filtered to avoid secondary contamination. After removal, the boundaries of the code disk pattern were examined under a microscope, and two places were found to have resist residue filaments (length ≤0.05mm). These were gently wiped away with an ultrafine cotton swab (diameter 0.1mm) soaked in ethanol to ensure clear boundaries. Next, residual photoresist was treated: The substrate was placed in a special decomposition solution (butyl acetate: acetone = 3:1 mixture) and immersed at 50℃ for 15 minutes to allow the residual photoresist to fully swell and decompose. Ultraviolet spectroscopy confirmed a decomposition rate of over 99%. Finally, deep cleaning was performed: The substrate was transferred to an ultrasonic cleaning tank and ultrasonically cleaned with deionized water (80℃) for 10 minutes (power 300W) to remove the decomposition products attached to the surface; then, plasma deep treatment (argon atmosphere, power 80W, time 2 minutes) was performed to remove nanoscale trace residues. After processing, the edge roughness of the code track pattern is ≤0.05μm, and the surface cleanliness reaches Class 10, resulting in a code disk material with a clear incremental code track pattern. This provides a functional semi-finished product for subsequent S3 structural molding. Step-by-step etching and trimming ensure complete removal of non-code track areas, precise handling of residues ensures clear pattern boundaries, and deep cleaning improves surface cleanliness, providing reliable assurance for the optical performance of the code disk and reducing the risk of signal interference.

[0131] In one embodiment, the step of performing structural component forming processing on the code disk material to obtain an encoder structural component with a code disk on its surface includes:

[0132] S30: Mark the outer boundary, mounting hole position and hollow area of ​​the code disk plate structure, determine the thickness and plane size after processing, and plan the processing benchmark;

[0133] S31: The code disk sheet is stamped according to the marked outer boundary to obtain the preliminary shape of the structural part. Then, the stamped sheet is ground to the planned thickness to form a processing reference surface, and excess edges are cut off at the same time.

[0134] S32: Based on the planned hollow area, hollow out the plate with the processing reference surface, then process the surface cutting marks, and trim the edges and corners of the structural components.

[0135] S33: Using the machining reference surface as a reference, the mounting holes and threaded holes are machined on the trimmed structural parts to finally obtain the encoder structural parts with code disks on the surface.

[0136] In this embodiment, taking a No. 45 steel plate code disk material with a clear incremental code pattern (code edge roughness ≤0.05μm, surface cleanliness Class 10) as an example, the implementation process of step S3 is specifically explained. First, processing marking and reference planning are performed: the code disk material is fixed on the CNC marking machine worktable, and a coordinate system is established with the center of the code pattern as the origin. The outer boundary of the structural component (a circle with a diameter of 50mm), the positions of three evenly distributed mounting holes (20mm from the center, with an included angle of 120° between the hole centers) and the central hollow area (10mm in diameter) are marked by a laser marking machine. At the same time, the thickness after processing is determined to be 1.5mm (the current thickness is 1.65mm, and 0.15mm needs to be ground off), the plane dimension tolerance is controlled within ±0.02mm, and the surface where the code pattern is located is planned as the processing reference surface to ensure that subsequent processing and code position are accurately matched. Next, stamping and surface grinding are performed: The marked sheet metal is placed into a CNC punch press, a custom circular die (50mm in diameter) is selected, the stamping pressure is set to 450kN and the stamping speed to 10mm / s, and the initial circular shape of the structural part is stamped according to the outer boundary. During the stamping process, the pressure sensor is monitored in real time to avoid excessive pressure causing deformation of the marking pattern. After stamping, the sheet metal is fixed on the worktable of a surface grinder, and ground with a 1500# grinding wheel as a reference, with a grinding feed speed of 25mm / min and a grinding depth of 0.03mm / pass, grinding in 5 passes to a planned thickness of 1.5mm. At the same time, a laser cutter is used to remove excess material (width ≤0.5mm) remaining on the stamping edge to ensure a neat shape. The cutting and removal of excess edges includes: after the surface grinding forms a machining reference surface (flatness ≤0.005mm / m), the outer boundary is calibrated with this reference surface; the edge is cut according to the calibrated boundary, and the corners are trimmed to an arc radius of 0.3mm±0.05mm.

[0137] Following this, the blanking process and edge finishing are performed: The sheet metal with the machining reference surface is transferred to a wire EDM machine. Cutting parameters (molybdenum wire diameter 0.18mm, cutting speed 8mm / min, pulse width 20μs) are set according to the planned central blanking area (10mm diameter) for blanking. Water mist cooling is used during the cutting process to prevent high temperatures from affecting the code performance. After blanking, the surface cutting marks are manually polished with 2000# sandpaper, reducing the surface roughness from 1.2μm to 0.8μm. Then, a rounded end mill is used to finish the edges and corners of the structural component, machining the corners into 0.3mm radius arcs to ensure burr-free edges and smooth transitions. Finally, the mounting holes and threaded holes are machined: Using the machining reference surface, the finished structural component is fixed on a CNC drilling machine. A 4mm diameter drill bit is selected, and holes are drilled according to the marked mounting hole positions at a drilling speed of 3000r / min and a feed rate of 0.1mm / r, ensuring the hole position tolerance is ≤±0.02mm. After drilling, an M3 tap was used for tapping at a speed of 500 rpm and a feed rate of 0.5 mm / r, producing three threaded mounting holes. After machining, the surface of the component was wiped with alcohol to remove machining debris. Measurements using a coordinate measuring machine confirmed that the dimensions, hole accuracy, and code track position deviation all met design requirements. The final result was an encoder component with clear code tracks and precise dimensions, which can be directly assembled with the motor shaft to achieve angle detection. Precise marking and datum planning ensure accurate machining positioning; step-by-step stamping and grinding prevent code track deformation; hollowing and finishing improve structural regularity; and hole machining ensures assembly accuracy, achieving integration of the code disk and structural component to meet encoder usage requirements.

[0138] In one embodiment, the steps of stamping the code disk sheet according to the marked outer boundary to obtain the preliminary shape of the structural component, then grinding the stamped sheet to the planned thickness to form a processing reference surface, and simultaneously cutting away excess edges, include:

[0139] S310: Mark the baseline for the code disk plate, refine the functional areas, stamping positioning points, plan the target thickness value and the outer boundary to form a composite mark;

[0140] S311: Perform progressive stamping pre-forming of the code disk sheet according to the stamping positioning points in the composite mark, process three-dimensional features to form the preliminary three-dimensional structure of the structural component, and determine the current thickness of the functional area.

[0141] S312: Based on the planned thickness target value in the composite mark, the stamped sheet metal is ground with the stamping positioning point as the reference to achieve the planned thickness, and at the same time, the processing reference surface is formed.

[0142] S313: Using the machining reference surface to calibrate the outer boundary of the composite mark, cut the sheet metal to remove most of the excess edges and trim complex corners to obtain the structural blank with the code disk.

[0143] In this embodiment, taking a No. 45 steel plate code disc with incremental code pattern (current thickness 1.65mm, code pattern area diameter 40mm) as an example, the composite marking is first performed: a cross baseline (coinciding with the center of the code pattern) is marked on the surface of the plate using a laser marking machine, dividing the surface into a code pattern functional area (within a diameter of 40mm) and a non-functional area (40-50mm ring); three stamping positioning points (25mm from the center, distributed in an equilateral triangle) are marked in the non-functional area, marking the planned thickness target value of 1.5mm and the outer boundary of a diameter of 50mm, forming a composite mark including the baseline, functional area, positioning points and dimensional parameters, ensuring that the concentricity of each marking line with the code pattern is ≤0.01mm. Next, progressive stamping preforming is performed: the sheet metal is fixed on the CNC punch press table, calibrated with three positioning points as references, and progressive stamping is performed using a 48mm diameter preforming die—the first stamping pressure is 300kN, causing the edge of the sheet metal to bend initially; the second stamping pressure is increased to 400kN, forming a stepped three-dimensional feature with a depth of 1mm (the edge of the non-functional area is thickened by 0.2mm), while preserving the flatness of the functional area of ​​the code track. After stamping, the thickness of the functional area is measured to be 1.64-1.66mm, which meets the current requirements for preforming thickness, and no deformation of the code track pattern is observed.

[0144] Next, the reference surface is ground: Based on the target thickness of 1.5mm in the composite markings, the stamped sheet is fixed on a surface grinder. Leveling is performed using three stamping positioning points as references. A 1500# grinding wheel is used to simultaneously grind both functional and non-functional areas. Grinding parameters are set as follows: feed speed 20mm / min, grinding depth per pass 0.05mm, completing a total removal of 0.15mm in three passes. During grinding, a dial indicator is used to monitor the thickness of the functional area in real time, ultimately stabilizing the overall thickness at 1.5±0.002mm. Simultaneously, through grinding wheel trajectory optimization, the surface flatness of the functional area is adjusted to 0.005mm / m, forming a flat processing reference surface (coinciding with the surface where the code pattern is located). Finally, edge cutting and trimming are performed: Using the processing reference surface as a reference, the 50mm outer boundary in the composite markings is calibrated using a vision positioning system. A laser cutting machine (50W power, cutting speed 15mm / s) is started to cut along the boundary, removing excess edges (approximately 2mm wide) outside the non-functional areas. For the complex corners near the three mounting holes, a step-by-step cutting method was adopted: first, straight edges were cut, then rounded corners were added to ensure a corner radius of 0.3mm. After cutting, debris was cleaned with a brush to obtain a structural blank with a code disc pattern. Its dimensional deviation was ≤±0.01mm, and the transition between functional and non-functional areas was smooth, providing a precise foundation for subsequent hollowing processing. Composite marking ensured accurate machining positioning, progressive stamping protected the code track functional area, reference surface grinding ensured uniform thickness, and edge trimming improved structural regularity, laying a high-precision foundation for subsequent processing and reducing functional errors.

[0145] In one embodiment, the step of calibrating the outer boundary of the composite mark using a processing reference plane, cutting the sheet metal to remove most of the excess edges and trim complex corners to obtain a structural component blank with a code disk includes:

[0146] S3130: Using the machining reference surface as a reference, calibrate the outer boundary of the composite mark, mark the boundary line and the boundary of complex corners, distinguish the straight edge segments and key corner areas, and clarify the functional area range;

[0147] S3131: Cut off most of the material from the straight edge segments, cut and process the fine contours, and record the complex corner areas that were not cut.

[0148] S3132: Based on the records, perforation treatment shall be carried out in key corner areas;

[0149] S3133: Cut and process the complex corner area after perforation to make it smoothly connected with the straight edge segment;

[0150] S3134: Strengthen the cut edges and trim the edge surface to ensure they fit the functional area, thus obtaining the structural blank with the code disk.

[0151] In this embodiment, taking a No. 45 steel plate structural component blank (thickness 1.5±0.002mm, machining reference surface flatness 0.005mm / m) after grinding on the reference surface as an example, the boundary is first calibrated and marked in sections: the blank is fixed on the vision positioning worktable, and with the machining reference surface as a reference, a high-precision camera captures the 50mm outer boundary in the composite marking. After software calibration, the boundary line deviation is corrected (≤0.003mm). The straight edge segments (accounting for 70% of the total boundary) and 3 complex corner areas (located outside the mounting holes, corner angle 90°) are marked. A red laser line is used to distinguish the functional area (40mm diameter code track area) and the non-functional area (40-50mm ring band), ensuring that the functional area range is clear and non-overlapping. Next, the straight segments and fine contours are cut: the CNC laser cutting machine is started, and the straight edge segments are cut in continuous cutting mode (power 60W, speed 20mm / s), removing the excess material on the outside (width about 1.8mm), leaving a 0.2mm allowance for subsequent finishing. The pre-contour (4.2mm diameter) of the three mounting holes in the non-functional area was finely cut to ensure that the deviation between the contour line and the mark was ≤0.005mm. At the same time, the coordinates and shape parameters of the three uncut complex corner areas were recorded. Then, drilling was performed in the key corner areas: according to the recorded corner coordinates, a 0.5mm diameter drill bit was used to drill at the vertex of each corner, with a drilling depth of 1.5mm (consistent with the thickness of the blank). The center of the hole was 0.1mm away from the corner vertex, providing a starting point for subsequent corner cutting and avoiding edge cracking due to stress concentration during cutting.

[0152] Next, complex corners were cut and smoothly connected: Starting from the perforation, a pulse cutting mode (40W power, 5kHz pulse frequency) was used to cut along the marked corner boundary. The cutting path was designed with an arc transition (radius 0.3mm) to smoothly connect the corner with the straight segments on both sides, with a tangent deviation of ≤0.002mm at the connection. After cutting, the corner was inspected with an optical microscope to confirm that there were no burrs or deformations. Finally, edge strengthening and finishing were performed: The blank was placed in a sandblasting machine to sandblast the cut edges (50μm abrasive grain diameter, 0.2MPa pressure) to remove the oxide layer and strengthen the edge hardness (increasing it by 15%). Then, the edge surface was manually finished with 2000# sandpaper, reducing the roughness from 1.0μm after cutting to 0.6μm. Final inspection showed that the transition between the straight segments and corners was smooth, and the functional area (code track area) was undamaged, resulting in a structural blank with a complete code disc pattern, providing a qualified substrate for subsequent hollowing and mounting hole processing. Precise calibration ensures accurate boundary positioning, zoned cutting improves edge regularity, perforation prevents corner cracking, and enhanced finishing improves edge performance, ensuring the compatibility of the blank with functional areas and reducing subsequent processing defects.

[0153] In one embodiment, the steps of hollowing out a sheet material with a processing reference surface according to a planned hollowing area, subsequently processing surface cutting marks, and trimming the edges and corners of the structural component include:

[0154] S320: Using the processing reference surface as a reference, mark the planned hollow area shape, key surface treatment areas, edge trimming lines and corner boundaries on the board to clarify the treatment standards for each area;

[0155] S321: Cut and process according to the shape of the marked hollow area to form a hollow structure that meets the boundary requirements;

[0156] S322: Process the overall surface of the board after the hollowing process, focusing on the marked key areas of surface treatment to remove cutting marks;

[0157] S323: Refer to the marked edge trimming lines to trim the edges of the board material so that the edges meet the contour requirements;

[0158] S324: Trim the corners of the board according to the marked corner boundaries to ensure that the corner outline is clear and the transition with the edge is smooth.

[0159] In this embodiment, a structural component blank with a code disk (50mm diameter, machining reference surface flatness 0.005mm / m, code track diameter 40mm) is used as an example to illustrate the implementation process of this step. First, multi-area marking is performed: the blank is fixed on a precision worktable, and the planned central hollow area (a circle with a diameter of 10mm, concentric with the center of the code track) is marked using a laser marking system with the machining reference surface as a reference; the key areas for surface treatment are marked (a 5mm ring around the outer edge of the hollow edge and a 2mm range around the outer edge of the code track), requiring a surface roughness ≤0.8μm; the edge trimming line (an inner line 0.1mm away from the outer boundary) is marked, and the contour tolerance is set to ±0.01mm; three corner boundaries are marked (outside the mounting hole, corner radius 0.3mm), and the transition smoothness standard is defined (tangent deviation ≤0.002mm). Next, the hollow-out cutting process is performed: the slow wire EDM machine is started, using the marked hollow area shape as the path, a 0.15mm diameter molybdenum wire is selected, and the cutting parameters are set (pulse width 15μs, feed speed 5mm / min, working fluid pressure 0.2MPa). During the cutting process, the deviation between the hollow boundary and the marked line is monitored in real time and corrected through a closed-loop control system to ensure that the final hollow structure boundary deviation is ≤0.005mm and the concentricity with the code track center is ≤0.003mm, avoiding affecting the angle detection accuracy during subsequent assembly.

[0160] Next, surface cutting marks are treated: The cut plate undergoes overall surface treatment. First, a 1500# grinding wheel is used for planar grinding (feed speed 15mm / min) to remove common fine cutting marks. Then, for the marked key areas, ultrasonic grinding (frequency 20kHz, amplitude 3μm) is used to treat the burrs and stripes on the cut edges, reducing the surface roughness of this area from 1.5μm after cutting to 0.6μm without damaging the code pattern. Edge trimming is performed with reference to the edge trimming line: The plate is fixed on a CNC edge grinding machine, and a diamond grinding wheel (2000# grit) is used to grind and trim the edges with the marked edge trimming line as a reference. The grinding amount is controlled at 0.1mm to ensure that the deviation of the edge contour from the design value is ≤0.008mm, while maintaining the perpendicularity of the edge to the processing reference surface ≥90°±0.05°. Finally, the corners were refined: Based on the marked corner boundaries, a micro milling cutter (1mm diameter) was used to round the three corners at a milling speed of 10000 r / min and a feed rate of 0.02 mm / r, ensuring that the corner radius was precisely controlled within 0.3 ± 0.005 mm. After refinement, a laser profilometer was used to check and confirm that the corner contour was clear, smoothly transitioned to the edges on both sides, and the tangent connection deviation was ≤ 0.001 mm. This resulted in a semi-finished product with regular edges and smooth corners, providing a stable foundation for subsequent mounting hole machining. Multi-area marking clarifies processing standards, precise hollowing ensures concentricity, key area processing improves surface quality, and edge and corner refinement ensures structural regularity, providing a high-precision base for encoder assembly and reducing signal interference during operation.

[0161] refer to Figure 2 An integrated metal code disk manufacturing device, comprising:

[0162] The grinding and polishing module 100 is used to grind and polish the board material of a preset specification to obtain a polished board material with a smooth surface.

[0163] The code disk pattern making module 200 is used to coat the polished plate and make a code disk pattern on the surface of the plate after coating, so as to obtain a code disk plate with a code disk pattern.

[0164] The structural component forming module 300 is used to process the code disk plate into structural components to obtain an encoder structural component with a code disk on its surface.

[0165] Furthermore, the aforementioned grinding and polishing module 100 includes:

[0166] The sheet material characteristic detection and pretreatment unit is used to perform characteristic detection and pretreatment on the sheet material, release internal stress and correct thickness, and generate a sheet material characteristic report.

[0167] The hard spot pretreatment and coarse grinding unit is used to pretreat the surface hard spot area, coarsely grind away the surface peak area, and calculate the fine grinding parameters according to the material characteristic report.

[0168] The fine grinding and polishing process adjustment unit is used to adjust the process according to the fine grinding parameters to perform fine grinding and polishing on the surface of the board and optimize the surface peak-valley difference;

[0169] The detection feedback optimization unit is used to detect the flatness and corrosion resistance of the finely ground and polished board. Based on the detection results, it optimizes the pretreatment and fine grinding parameters to obtain a polished board with a smooth surface.

[0170] Furthermore, the aforementioned hard spot pretreatment and rough grinding unit includes:

[0171] The hard spot area scanning and positioning unit is used to scan and locate the hard spot area on the surface of the board, mark the hard spot hardness, thickness deviation, thermal expansion and residual stress information, and generate a comprehensive distribution map of hard spots.

[0172] The differential grinding parameter prediction unit is used to input the hard point comprehensive distribution map data into the parameter prediction model, predict the appropriate grinding parameters, perform differential grinding on the corresponding area according to the hard point hardness and thickness difference, and control the overall thickness of the board.

[0173] The constant temperature coarse grinding and parameter reservation unit is used to coarsely grind the board in a constant temperature environment, determine the grinding amount according to the comprehensive distribution map of hard spots, reserve the amount to be removed by fine grinding, and refine the surface roughness.

[0174] The fine grinding parameter calculation and model optimization unit is used to calculate the appropriate fine grinding parameters based on the grinding depth and surface roughness after coarse grinding, and optimize the parameter prediction model by combining temperature compensation factors to form data feedback.

[0175] Furthermore, the aforementioned isothermal rough grinding and parameter reservation unit includes:

[0176] The constant temperature environment setting and area marking unit is used to place the plate to be ground in a constant temperature environment, maintain a stable temperature, detect and mark areas with thickness differences based on the hard spot comprehensive distribution map, set the coarse grinding increment for that area, and distinguish the thickness standard area.

[0177] The differentiated coarse grinding execution unit is used to perform focused coarse grinding on areas with thickness differences according to the set coarse grinding increment, while simultaneously performing basic coarse grinding on areas with standard thickness to ensure that the grinding amount is matched for different areas.

[0178] The fine grinding removal amount calculation unit is used to calculate the grinding efficiency by combining the analysis model and the empirical algorithm, calculate the amount of fine grinding removal that needs to be retained after coarse grinding based on the grinding efficiency, and record the surface condition information of the board.

[0179] The composite grinding and refining unit is used to refine the overall surface of the board material by using a composite grinding method that combines specific trajectory grinding with vibration, based on the recorded surface condition information and the reserved amount of fine grinding removal, thereby controlling the surface roughness.

[0180] Furthermore, the aforementioned code disk pattern creation module 200 includes:

[0181] The board surface cleaning and activation unit is used to clean and activate the surface of the polished board, remove the oxide layer and micro-contaminants, and improve the adhesion and catalytic activity through surface treatment process to form a pre-treated surface suitable for coating.

[0182] The composite film preparation unit is used to sequentially perform metal reflective film evaporation and composite film coating on the pretreated surface, and then perform drying and curing treatment on the composite film to obtain a plate with a composite film layer.

[0183] The pattern protective layer forming unit is used to coat a resist on the surface of the composite film layer according to the code disk pattern, cover a matching mask, coat a photoresist, and expose and develop it to form a pattern protective layer.

[0184] The etching and residue removal unit is used to etch and remove the composite film area not covered by the protective layer, and remove the mask, resist and residual photoresist to obtain a code disk board with a code disk pattern.

[0185] Furthermore, the above-mentioned composite film preparation unit includes:

[0186] The vacuum environment pretreatment unit is used to place the pretreated board in a vacuum environment to remove gaseous impurities, and then remove residual contaminants through surface cleaning treatment to improve the wettability of the board surface.

[0187] The pure metal reflective film evaporation unit is used to deposit a pure metal reflective film on the surface of a treated substrate under vacuum conditions to form a metal reflective layer.

[0188] The metal alloy film evaporation unit is used to continue evaporating a metal alloy film on the surface of the metal reflective layer under vacuum conditions, so as to form a composite reflective layer together with the metal reflective layer.

[0189] The composite film coating and trimming unit is used to coat the composite film material onto the surface of the composite reflective layer and trim the thickness of the coating after coating to form a preliminary composite film.

[0190] The stepped drying and curing unit is used to perform stepped heating and drying on the board with the preliminary composite film to remove moisture, and then perform constant temperature curing to form a stable composite film layer, thus obtaining the board with the composite film layer.

[0191] Furthermore, the above-mentioned pattern protective layer forming unit includes:

[0192] The corrosion inhibitor coating and integrity inspection unit is used to clean the surface of the composite film layer, apply corrosion inhibitor according to the outline of the code disk pattern and adjust the thickness to form a complete corrosion inhibitor pattern, and check the integrity of the pattern.

[0193] The mask precision positioning and pressing unit is used to position the matching mask above the resist pattern using alignment technology, mark the positioning points and press them together to ensure that the mask and the resist pattern are precisely aligned.

[0194] The photoresist coating and thickness optimization unit is used to immerse the substrate with the mask into the photoresist solution along the positioning point, slowly lift it up and heat it to make the photoresist fill the groove, and reapply photoresist to ensure uniform thickness.

[0195] The partitioned exposure and development unit is used to expose the photoresist-coated substrate in partitions, heat it after exposure to promote the reaction, and then perform development processing.

[0196] The pattern protection layer forming unit is used to remove the photoresist layer in areas not covered by the mask and without photoresist, while retaining the photoresist layer in the target area to form a pattern protection layer.

[0197] Furthermore, the aforementioned photoresist coating and thickness optimization unit includes:

[0198] The mask and substrate positioning and area marking unit is used to position and fix the mask and substrate, determine the positioning baseline, ensure that the part along the baseline is immersed in the photoresist solution after bonding, and mark the key coverage area.

[0199] The lifting speed control and adhesion recording unit is used to control the lifting speed in stages, and combined with small oscillations to allow the unimmersed and immersed parts of the photoresist to naturally connect, and record the surface adhesion.

[0200] The photoresist heating and filling unit is used to heat the surface according to its adhesion to promote the photoresist filling of the groove, and then to keep it warm to ensure complete filling.

[0201] The photoresist overall recoating and thickness correction unit is used to apply photoresist to the entire surface of the substrate, focusing on correcting joints, grooves and weak areas to ensure uniform photoresist layer thickness.

[0202] Furthermore, the above-mentioned etching and residue removal unit includes:

[0203] The composite film area etching and edge trimming unit is used to etch the composite film area not covered by the protective layer, and then trim the residual edges by auxiliary grinding until the composite film in the area is completely removed.

[0204] The mask stripping and residual point processing unit is used to strip the mask from the surface of the board, collect the state information of the board surface at this time, and etch the residual points on the surface.

[0205] The corrosion inhibitor and boundary residue removal unit is used to remove corrosion inhibitor and mask residue from the surface of the board using a specific solution based on the collected surface condition information, and to check and remove residual substances at the boundary of the code disk pattern.

[0206] The residual photoresist decomposition unit is used to treat the surface of the substrate with a special decomposition solution to decompose the residual photoresist.

[0207] The deep cleaning and code plate forming unit is used to ultrasonically clean the disassembled board material and then perform deep processing to remove trace residues on the surface, ultimately obtaining a code plate board with a code plate pattern.

[0208] Furthermore, the aforementioned structural component forming module 300 includes:

[0209] The structural component processing marking and reference planning unit is used to mark the outer boundary, mounting hole position and hollow area of ​​the structural component on the code disk plate, determine the thickness and plane size after processing, and plan the processing reference.

[0210] The stamping and reference surface grinding unit is used to stamp the code disk sheet according to the marked outer boundary to obtain the preliminary shape of the structural part, and then grind the stamped sheet to the planned thickness to form the processing reference surface, while cutting away excess edges.

[0211] The cutout processing and edge and corner trimming unit is used to cut out the sheet material with the processing reference surface according to the planned cutout area, then process the surface cutting marks, and trim the edges and corners of the structural components.

[0212] The mounting hole and threaded hole machining unit is used to machine mounting holes and threaded holes on the trimmed structural parts with the machining reference surface as a reference, and finally obtains an encoder structural part with a code disk on the surface.

[0213] Furthermore, the aforementioned stamping and reference surface grinding unit includes:

[0214] The composite marking unit for the code disk plate is used to mark the baseline of the code disk plate, refine the functional areas, stamping positioning points, plan the target thickness value and the outer boundary, and form a composite mark.

[0215] The progressive stamping preforming unit is used to progressively stamp and preform the code disk sheet according to the stamping positioning points in the composite mark, process three-dimensional features to form the preliminary three-dimensional structure of the structural component, and determine the current thickness of the functional area.

[0216] The reference surface grinding and thickness control unit is used to grind the stamped sheet metal according to the planned thickness target value in the composite mark, with the stamping positioning point as the reference, so that it reaches the planned thickness, and at the same time, it is trimmed to form a processing reference surface.

[0217] The outer boundary calibration and blank forming unit is used to calibrate the outer boundary in the composite mark with the processing reference surface, cut the sheet metal, remove most of the excess edges and trim complex corners to obtain the structural blank with the code disk.

[0218] Furthermore, the aforementioned outer boundary calibration and blank forming unit includes:

[0219] The boundary calibration and area division unit is used to calibrate the outer boundary of the composite mark with the machining reference surface as a reference, mark the boundary line and the boundary of complex corner, distinguish the edge straight line segment and the key corner area, and clarify the functional area range.

[0220] The edge straight segment cutting and recording unit is used to cut edge straight segments to remove most of the material, cut and process fine contours, and record uncut complex corner areas.

[0221] The key corner area perforation unit is used to perform perforation processing in key corner areas based on records.

[0222] The complex corner cutting and connecting unit is used to cut and process the complex corner area after perforation, so that it can be smoothly connected with the straight edge segment;

[0223] The edge strengthening and trimming and blank forming unit is used to strengthen the cut edges and trim the edge surface to ensure that it fits the functional area, thus obtaining the structural blank with the code disk.

[0224] Furthermore, the aforementioned hollowing-out processing and edge corner trimming unit includes:

[0225] The hollowing and trimming area marking unit is used to mark the planned hollowing area shape, key surface treatment areas, edge trimming lines and corner boundaries on the board with the processing reference surface as a reference, so as to clarify the treatment standards of each area.

[0226] The hollow structure cutting and processing unit is used to cut and process according to the shape of the marked hollow area to form a hollow structure that meets the boundary requirements;

[0227] The surface trace treatment unit after hollowing is used to treat the overall surface of the board after hollowing, focusing on the marked key areas of surface treatment to remove cutting marks;

[0228] The board edge trimming unit is used to trim the edges of the board according to the marked edge trimming lines, so that the edges meet the contour requirements;

[0229] The board corner trimming unit is used to trim the corners of the board according to the marked corner boundaries, ensuring that the corner outline is clear and the transition with the edge is smooth.

[0230] Reference Figure 3 This application also provides a computer device, which may be a server, and its internal structure may be as follows: Figure 3 As shown. The computer device includes a processor, memory, network interface, and database connected via a bus. The processor is designed to provide computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores operations, computer programs, and a database. The internal memory provides an environment for the operation and execution of the computer programs stored in the non-volatile storage medium. The database stores data such as an integrated metal code disk manufacturing method. The network interface is used to communicate with external terminals via a network connection. When the computer program is executed by the processor, it implements an integrated metal code disk manufacturing method, including the following steps: grinding and polishing a sheet material of a preset specification to obtain a polished sheet material with a smooth surface; coating the polished sheet material and creating a code disk pattern on the surface of the coated sheet material to obtain a code disk sheet material with a code disk pattern; and performing structural forming processing on the code disk sheet material to obtain an encoder structural component with a code disk on its surface.

[0231] One embodiment of this application also provides a computer-readable storage medium storing a computer program thereon. When the computer program is executed by a processor, it implements an integrated metal code disk manufacturing method, including the steps of: grinding and polishing a plate of a preset specification to obtain a polished plate with a flat surface; coating the polished plate and creating a code disk pattern on the surface of the coated plate to obtain a code disk plate with a code disk pattern; and performing structural component forming processing on the code disk plate to obtain an encoder structural component with a code disk on its surface.

[0232] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media provided in this application and used in the embodiments can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual-speed SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0233] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for manufacturing an integrated metal code disk, characterized in that, include: Grinding and polishing are performed on the pre-specified material to obtain a polished material with a smooth surface; The polished material is coated, and a code disk pattern is made on the surface of the coated material to obtain a code disk material with a code disk pattern. The code disk plate is processed into structural components to obtain an encoder structural component with a code disk on its surface. The step of grinding and polishing a pre-specified sheet to obtain a polished sheet with a smooth surface includes: The material undergoes characteristic testing and pretreatment to release internal stress and correct thickness, resulting in a material characteristic report. Based on the aforementioned board material characteristic report, the hard spot areas on the board surface are scanned and located, and the hard spot hardness, thickness deviation, thermal expansion and residual stress information are marked to generate a comprehensive distribution map of hard spots. The hard spot distribution map data is input into the parameter prediction model to predict the appropriate grinding parameters. Differentiated grinding is performed on the corresponding areas according to the hardness and thickness differences of the hard spots to control the overall thickness of the board. The plate to be ground is placed in a constant temperature environment to maintain a stable temperature. Based on the comprehensive distribution map of hard spots, the thickness difference area is detected and marked. The coarse grinding increment for that area is set, while the standard thickness area is distinguished. For areas with thickness differences, perform focused coarse grinding according to the set coarse grinding increment, while simultaneously performing basic coarse grinding on areas with standard thickness to ensure that the grinding amount is appropriate for different areas. The grinding efficiency is calculated by combining the analysis model and empirical algorithm. Based on the grinding efficiency, the amount of material to be removed by fine grinding after coarse grinding is calculated, and the surface condition information of the board is recorded. The amount of material to be removed by fine grinding is calculated by region: 0.03mm is reserved in the differential region and 0.02mm is reserved in the standard region. Based on the recorded surface condition information and the reserved amount of fine grinding removal, a composite grinding method combining specific trajectory grinding and vibration is adopted to refine the overall surface of the board and control the surface roughness. The specific trajectory is a spiral trajectory with a pitch of 0.5 mm for grinding, and the superimposed vibration parameters are 15 kHz high-frequency micro-vibration with an amplitude of 5 μm. The step of coating the polished material and creating a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern includes: The polished material undergoes surface cleaning and activation treatment to remove the oxide layer and micro-contaminants. The surface treatment process enhances adhesion and catalytic activity, forming a pre-treated surface suitable for coating. Metal reflective film is deposited and composite film is coated sequentially on the pretreated surface, and the composite film is dried and cured to obtain a plate with a composite film layer. Clean the surface of the composite film layer, apply the corrosion inhibitor according to the outline of the code disk pattern and adjust the thickness to form a complete corrosion inhibitor pattern, and check the integrity of the pattern. The matching mask is positioned above the resist pattern using alignment technology. The positioning points are marked and pressed together to ensure that the mask and the resist pattern are precisely aligned. The concentricity deviation is ≤0.002mm by calibration through four corner positioning holes. A pneumatic pressing device is used to apply 0.05MPa pressure to fix it. Position and fix the mask and the substrate, determine the positioning baseline, ensure that the part along the baseline is immersed in photoresist solution after bonding, and mark the key coverage area. Among them, the mask and the substrate are rigidly fixed through four corner positioning holes. Two perpendicularly intersecting positioning baselines are calibrated with a laser interferometer to ensure that the concentricity deviation is ≤0.002mm. The lifting speed is controlled in stages, and small oscillations are used to allow the unimmersed and immersed parts of the photoresist to connect naturally. The surface adhesion is recorded. The mask positioning point area is lifted at a low speed of 5 mm / s, and the non-positioning point area is lifted at a high speed of 10 mm / s. The robotic arm is started to lift vertically at an initial speed of 1 mm / s. When the upper edge of the plate is about to leave the liquid surface, the speed is reduced to 0.5 mm / s, and a small oscillation of 5 Hz is applied at the same time. Heat treatment is performed based on the surface adhesion to promote photoresist filling of the grooves, followed by heat preservation treatment to ensure complete filling; The entire surface of the substrate is coated with photoresist, with a focus on correcting joints, grooves, and weak areas to ensure uniform photoresist layer thickness. In particular, an additional coating is applied to the edge joints. The groove area at the junction of A and B phases is sprayed at a 45° angle to ensure full coverage. Weak areas such as zero-position fine lines are precisely coated using CCD vision guidance.

2. The integrated metal code disk manufacturing method according to claim 1, characterized in that, The step of coating the polished material and creating a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern further includes: The composite film area not covered by the protective layer is etched away to remove the mask, resist, and residual photoresist, resulting in a code disk substrate with a code disk pattern.

3. The integrated metal code disk manufacturing method according to claim 2, characterized in that, The step of etching away the composite film area not covered by the protective layer to remove the mask, resist, and residual photoresist, and obtaining a code disk substrate with a code disk pattern, includes: The composite film area not covered by the protective layer is etched, and the remaining edges are then trimmed by auxiliary grinding until the composite film in that area is completely removed. Peel off the mask from the surface of the board, collect the state information of the board surface at this time, and etch the remaining points on the surface. Based on the collected surface condition information, a specific solution was used to remove the corrosion inhibitor and mask residue from the surface of the board, and residual substances at the boundary of the code disk pattern were inspected and removed at specific points. The surface of the substrate is treated with a special decomposition solution to break down the residual photoresist. The decomposed board material is ultrasonically cleaned and then subjected to deep processing to remove trace residues on the surface, ultimately yielding a code disk board material with a code disk pattern.

4. The integrated metal code disk manufacturing method according to claim 2, characterized in that, The steps of sequentially depositing a metal reflective film and coating a composite film on the pretreated surface, and then drying and curing the composite film to obtain a board with a composite film layer include: The pretreated board is placed in a vacuum environment to remove gaseous impurities, and then surface cleaning is performed to remove residual contaminants and improve the wettability of the board surface. Under vacuum conditions, a pure metal reflective film is vapor-deposited onto the surface of the treated plate to form a metal reflective layer; Continue to deposit a metal alloy film on the surface of the metal reflective layer under vacuum conditions to form a composite reflective layer together with the metal reflective layer. The composite film material is coated onto the surface of the composite reflective layer, and the thickness of the coating is adjusted to form a preliminary composite film. The board with the preliminary composite film is dried by step heating to remove moisture, and then cured at a constant temperature to form a stable composite film layer, thus obtaining a board with a composite film layer.

5. The integrated metal code disk manufacturing method according to claim 2, characterized in that, The steps of coating a resist on the surface of the composite film layer according to the code disk pattern, covering it with a matching mask, coating it with photoresist, and exposing and developing it to form a pattern protective layer also include: The substrate coated with photoresist is exposed in sections, heated after exposure to promote the reaction, and then developed. Remove the photoresist layer from the areas not covered by the photomask and without photoresist, and retain the photoresist layer in the target area to form a pattern protection layer.

6. The integrated metal code disk manufacturing method according to claim 1, characterized in that, The step of processing the code disk material into structural components to obtain an encoder structural component with a code disk on its surface includes: For the marking structure of the code disk plate, determine the outer boundary, mounting hole position and hollow area, determine the thickness and plane size after processing, and plan the processing benchmark; The code disk sheet is stamped according to the marked outer boundary to obtain the preliminary shape of the structural part. Then, the stamped sheet is ground to the planned thickness to form a processing reference surface, and excess edges are cut off at the same time. According to the planned hollow area, the plate with the processing reference surface is hollowed out, then the surface cutting marks are processed, and the edges and corners of the structural components are trimmed. Using the machining reference surface as a reference, mounting holes and threaded holes are machined on the trimmed structural component to finally obtain an encoder structural component with a code disk on the surface.

7. The integrated metal code disk manufacturing method according to claim 6, characterized in that, The steps of stamping the code disk sheet according to the marked outer boundary to obtain the preliminary shape of the structural component, then grinding the stamped sheet to the planned thickness to form a processing reference surface, and simultaneously cutting away excess edges include: Mark the baseline on the code disk plate, refine the functional areas, stamping positioning points, planned thickness target values ​​and outer boundaries to form a composite mark; The code disk sheet is pre-formed by progressive stamping according to the stamping positioning points in the composite mark, and the three-dimensional features are processed to form the preliminary three-dimensional structure of the structural component, and the current thickness of the functional area is determined. Based on the planned thickness target value in the composite mark, the stamped sheet is ground with the stamping positioning point as the reference to achieve the planned thickness, and at the same time, the processing reference surface is formed. The outer boundary of the composite mark is calibrated using the machining reference surface. The sheet metal is then cut to remove most of the excess edges and trim complex corners, resulting in a structural blank with a code disk.

8. The integrated metal code disk manufacturing method according to claim 7, characterized in that, The steps of calibrating the outer boundary of the composite mark using the processing reference surface, cutting the sheet metal to remove most of the excess edges and trim complex corners to obtain the structural component blank with the code disk include: Using the machining reference plane as a reference, calibrate the outer boundary of the composite mark, mark the boundary line and the boundary of complex corners, distinguish the straight edge segments and key corner areas, and clarify the functional area range; Cut off most of the material from the straight edge segments, cut and process the fine contours, and record the complex corner areas that were not cut. Based on the records, perforation was carried out in key corner areas; The complex corner area after perforation is cut and processed to smoothly connect it with the straight edge segment; The cut edges are reinforced and then the edge surfaces are trimmed to ensure they fit the functional areas, resulting in a structural component blank with a code disk.

9. An integrated metal code disk manufacturing device, characterized in that, To implement the method according to any one of claims 1-8, comprising: The grinding and polishing module is used to grind and polish the sheet material of a preset specification to obtain a polished sheet material with a smooth surface. The code disk pattern making module is used to coat the polished material and make a code disk pattern on the surface of the coated material to obtain a code disk material with a code disk pattern. The structural component forming module is used to process the code disk plate into structural components to obtain an encoder structural component with a code disk on its surface.

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