Power supply module
By designing a second heatsink portion and a thermally conductive bonding layer that can be installed on the circuit board in the power supply module, the problem that the power supply cannot be used for both air cooling and conductive cooling at the same time is solved, achieving efficient heat dissipation and improved power output.
Patent Information
- Application Number
- CN202511423778.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2025-12-09
AI Technical Summary
Existing power supply heatsink designs cannot be simultaneously adapted to air-cooled and conduction-cooled scenarios, resulting in poor heat dissipation for high-power loss components and increasing design complexity.
Design a power supply module whose heat sink includes a second part that can be inserted into a circuit board, combined with a thermally conductive bonding layer and a thermally conductive pad to achieve a combination of air cooling and conduction cooling. The first and second parts of the heat sink play roles in air cooling and conduction cooling, respectively.
It achieves efficient heat dissipation in both air-cooled and conduction-cooled scenarios, improves the heat dissipation performance of the power supply module, increases the power output value, and expands the application range.
Smart Images
Figure CN121099583A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to a manufacturing technique of a power supply, and in particular, to a power supply module with excellent heat dissipation performance. BACKGROUND
[0002] Currently, the heat design of the heat sink of a power supply is generally only applicable to an air cooling scenario. For a conduction cooling scenario, a heat-conductive pad is generally arranged at the bottom of a printed circuit board assembly (PCBA). However, a power loss element with a large size cannot be assembled at the bottom of the printed circuit board assembly. Therefore, there is currently no heat design scheme of a heat sink that can simultaneously achieve air cooling and conduction cooling.
[0003] However, as the design of the power supply and the thermal environment applied by the power supply become increasingly severe, it is required that the power supply module can be applicable to air cooling and conduction cooling scenarios. In this way, the design complexity of the heat sink of the main power loss element of the power supply is greatly increased. SUMMARY
[0004] Therefore, an object of the present disclosure is to provide a power supply module, wherein the heat sink of the power supply module can be applicable to air cooling and conduction cooling scenarios, so that the power loss element of the power supply module can be effectively cooled, and thus the output power of the power supply module can be improved.
[0005] According to the above object of the present disclosure, a power supply module is provided. The power supply module comprises a circuit board and at least one heat dissipation group. The circuit board comprises a top surface and a bottom surface opposite to each other. Each heat dissipation group comprises a power loss element, a heat sink, and a heat-conductive bonding layer. The power loss element is vertically arranged on the top surface. The power loss element comprises at least two pins arranged in the circuit board. The heat sink is vertically arranged on the top surface and comprises a first portion and a second portion. The second portion is bonded to the bottom surface of the first portion and arranged in the circuit board and protrudes out of the bottom surface. The heat-conductive bonding layer is arranged between the power loss element and the heat sink to bond the power loss element and the heat sink.
[0006] According to an embodiment of the present disclosure, the circuit board has a plurality of first through holes and at least one second through hole. The first through holes extend from the top surface to the bottom surface. The at least two pins are arranged in the at least two first through holes, respectively. The second through hole extends from the top surface to the bottom surface. The second portion of the heat sink is arranged in the second through hole.
[0007] According to an embodiment of the present disclosure, the size and shape of the cross section of the second portion are the same as the size and shape of the cross section of the second through hole.
[0008] According to an embodiment of the present disclosure, each pin protrudes a first length from the bottom surface of the circuit board, and the second portion protrudes a second length from the bottom surface of the circuit board, and the second length is equal to the first length.
[0009] According to an embodiment of the present disclosure, the length of the second portion is 1 / 3 to 1 / 2 of the length of the first portion.
[0010] According to an embodiment of the present disclosure, the first portion of the heat sink includes a vertical portion and a plurality of fins. The vertical portion is connected to the second portion. The plurality of fins are connected to the vertical portion separately from each other. The plurality of fins and the second portion are located on opposite sides of the vertical portion, respectively.
[0011] According to an embodiment of the present disclosure, the heat sink is a black anodized heat sink structure.
[0012] According to an embodiment of the present disclosure, the power supply module further includes a thermal pad attached to the bottom surface of the circuit board.
[0013] According to an embodiment of the present disclosure, the second portion of the heat sink protrudes from the bottom surface of the circuit board and penetrates into the thermal pad, and is covered by the thermal pad.
[0014] According to an embodiment of the present disclosure, the power supply module further includes a cooling plate attached to the thermal pad, so that the thermal pad is sandwiched between the circuit board and the cooling plate.
[0015] According to the above-mentioned embodiment, the second portion of the heat sink penetrates into the circuit board and protrudes from the bottom surface of the circuit board. In this way, in the air cooling scenario, the first portion and the second portion of the heat sink can be cooled by wind blowing on the upper side and the lower side of the circuit board, respectively. On the other hand, in the conduction cooling scenario, since the second portion of the heat sink is directly embedded in the thermal pad, the heat conducted from the first portion of the heat sink to the second portion can be directly conducted away by the thermal pad, and the effect of rapid conduction cooling can be achieved. BRIEF DESCRIPTION OF DRAWINGS
[0016] A better understanding of the present disclosure can be obtained from the following detailed description in conjunction with the following drawings, in which:
[0017] [ Fig. 1 ] is a perspective view showing a heat dissipation assembly of a power supply module according to an embodiment of the present disclosure, which is not yet installed in a circuit board.
[0018] [ Fig. 2 ] is a perspective view showing a heat dissipation assembly of a power supply module according to an embodiment of the present disclosure, which is installed in a circuit board.
[0019] [ Fig. 3 ] is a cross-sectional view showing a heat dissipation assembly of a power supply module according to an embodiment of the present disclosure.
[0020] BRIEF DESCRIPTION OF DRAWINGS
[0021] 10: power supply module
[0022] 100: circuit board
[0023] 110: top surface
[0024] 120: bottom surface
[0025] 130: first through-hole
[0026] 140: second through-hole
[0027] 200: heat dissipation group
[0028] 210: power loss element
[0029] 212: pin
[0030] 220: heat sink
[0031] 222: first portion
[0032] 222': bottom surface
[0033] 222a: vertical portion
[0034] 222b: fin
[0035] 224: second portion
[0036] 230: thermally conductive bonding layer
[0037] 300: heat dissipation group
[0038] 310: power loss element
[0039] 312: pin
[0040] 320: heat sink
[0041] 322: first portion
[0042] 322a: vertical portion
[0043] 322b: fin
[0044] 324: second portion
[0045] 330: thermally conductive bonding layer
[0046] 400: thermally conductive pad
[0047] 500: cooling plate
[0048] L1: first length
[0049] L2: second length
[0050] L3: length
[0051] L4: length DETAILED DESCRIPTION
[0052] Embodiments of the present disclosure are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The embodiments discussed and disclosed are merely for illustrative purposes and are not intended to limit the scope of the present disclosure. All embodiments of the present disclosure disclose various different features, which can be implemented alone or in combination depending on the needs.
[0053] In addition, the terms "first", "second", etc. used herein are not intended to mean a specific order or sequence, but merely to distinguish elements or operations from one another.
[0054] The spatial relationships between elements within the scope of the present disclosure are not limited to the positions shown in the drawings but also apply to positions not shown in the drawings, such as inverted positions. In addition, the terms "connected", "electrically connected", or the like used in the present disclosure are not limited to direct connections or electrical connections between the two elements but can include indirect connections or electrical connections as needed.
[0055] In view of the fact that large power loss elements cannot be disposed on the lower side of the printed circuit board assembly due to space limitations, and thus cannot be effectively cooled by both air cooling and conduction cooling, the present disclosure proposes a power supply module whose heat sink can provide excellent cooling effect in both air cooling and conduction cooling scenarios.
[0056] Reference is made to Figs. 1 to 3 which are respectively a perspective view showing a heat dissipation assembly 200 and 300 of a power supply module 10 of an embodiment of the present disclosure before and after being installed in a circuit board 100, and a cross-sectional view showing the heat dissipation assembly 200 of the power supply module 10 installed in the circuit board 100. The power supply module 10 can mainly include a circuit board 100 and at least one heat dissipation assembly, such as the heat dissipation assemblies 200 and 300.
[0057] The circuit board 100 has a flat plate structure. Heat sinks 200 and 300 can be assembled on the circuit board 100 and are electrically connected to the circuitry disposed on the circuit board 100. In some embodiments, the circuit board 100 is a printed circuit board assembly containing circuitry and a number of electronic components. The circuit board 100 includes a top surface 110 and a bottom surface 120 opposite to each other. In some embodiments, the circuit board 100 has a plurality of first through holes 130 and at least one second through hole 140. The number of second through holes 140 may be the same as the number of heat sinks 200 and 300. Both the first through holes 130 and the second through holes 140 extend from the top surface 110 to the bottom surface 120 of the circuit board 100, penetrating the circuit board 100. Heat sinks 200 and 300 are both disposed on the top surface 110 of the circuit board 100.
[0058] The heat dissipation assembly 200 mainly includes a power dissipation element 210, a heat sink 220, and a thermally conductive bonding layer 230. The power dissipation element 210 can be vertically mounted on the top surface 110 of the circuit board 100. The power dissipation element 210 includes at least two leads 212, which pass through the circuit board 100. Specifically, the circuit board 100 has first through-holes 130 corresponding to these leads 212 in number, location, and size. When assembling the power dissipation element 210 on the top surface 110 of the circuit board 100, the leads 212 of the power dissipation element 210 can be inserted into the corresponding first through-holes 130. Fig. 3 As shown, each pin 212 passes through a corresponding first through-hole 130 and protrudes from the bottom surface 120 of the circuit board 100. For example, each pin 212 may protrude from the bottom surface 120 by a first length L1. The power loss element 210 is assembled on the circuit board 100 through these pins 212 and is electrically connected to the circuit board 100.
[0059] The heat sink 220 is also mounted on the top surface 110 of the circuit board 100. The heat sink 220 mainly comprises a first part 222 and a second part 224, wherein the second part 224 is joined to the bottom surface 222' of the first part 222. The first part 222 and the second part 224 can form an integral structure, or they can be two separate structures joined together by a method such as soldering. The heat sink 220 can be, for example, a black anodized heat dissipation structure to provide excellent heat dissipation.
[0060] like Fig. 3As shown, the second portion 224 of the heat sink 220 passes through the circuit board 100 and protrudes from the bottom surface 120 of the circuit board 100. Specifically, the circuit board 100 has a second through hole 140 that corresponds in position and size to the second portion 224 of the heat sink 220. When the heat sink 220 is assembled on the top surface 110 of the circuit board 100, the second portion 224 of the heat sink 220 can be inserted into the corresponding second through hole 140. For example, the second portion 224 may protrude from the bottom surface 120 of the circuit board 100 by a second length L2. In some embodiments, the second length L2 is equal to the first length L1 of the pin 212 protruding from the bottom surface 120 to avoid increasing the mounting space required for the power supply module 10.
[0061] Since the second part 224 protrudes from the bottom surface 120 of the circuit board 100, the heat of the first part 222 above the top surface 110 of the circuit board 100 can be conducted through the second part 224 to the bottom surface 120 of the circuit board 100.
[0062] In some embodiments, the dimensions and shape of the cross-section of the second portion 224 are the same as those of the corresponding second through hole 140. This allows the second portion 224 to pass through the circuit board 100 with minimal impact on the layout of the circuit board 100. In other embodiments, when there is sufficient layout area in the circuit board 100, the dimensions and shape of the cross-section of the second portion 224 may differ from those of the corresponding second through hole 140, and the cross-sectional dimension of the second through hole 140 may be larger than that of the second portion 224.
[0063] In the heat sink 220, the first portion 222 has a length L3, and the second portion 224 has a length L4. In some embodiments, the length L4 of the second portion 224 is less than the length L3 of the first portion 222. For example, the length L4 of the second portion 224 is 1 / 3 to 1 / 2 of the length L3 of the first portion 222. This allows heat from the first portion 222 to be conducted to the bottom surface 120 of the circuit board 100 by the second portion 224, which passes through the circuit board 100 and protrudes below the bottom surface 120, while reducing the impact on the layout of the circuit board 100. When there is sufficient layout area in the circuit board 100, the length L4 of the second portion 224 can be equal to the length L3 of the first portion 222.
[0064] In some embodiments, the first portion 222 includes a vertical portion 222a and a plurality of fins 222b. When the heat sink 220 is disposed on the top surface 110 of the circuit board 100, the vertical portion 222a may be perpendicular to the top surface 110, for example. In such an embodiment, the vertical portion 222a may be connected to the second portion 224 to form a flat plate structure. The fins 222b are attached to the vertical portion 222a and are separate from each other. Furthermore, the fins 222b and the second portion 224 are located on opposite sides of the vertical portion 222a, namely the upper side and the lower side, respectively. The fins 222b can increase the surface area of the first portion 222, thereby improving the air cooling efficiency of the heat sink 220.
[0065] A thermally conductive bonding layer 230 is situated between the power loss element 210 and the heat sink 220 to bond the power loss element 210 and the heat sink 220. The opposite sides of the thermally conductive bonding layer 230 can be directly bonded to the power loss element 210 and the heat sink 220, respectively. Through the thermally conductive bonding layer 230, the heat generated by the power loss element 210 can be rapidly conducted to the heat sink 220. For example, the material of the thermally conductive bonding layer 230 can be TNC-4 from Laird Technologies, TLB SA1800 and TLBEA1800 from Henkel Adhesive Technologies, or UB-5712(B) manufactured by U-Bond Technology Inc.
[0066] When fabricating the heat sink assembly 200, a thermally conductive bonding layer 230 can be first placed on a predetermined area of the power loss element 210, and then the heat sink 220 can be attached to the thermally conductive bonding layer 230. Next, the pins 212 of the power loss element 210 of the heat sink assembly 200 and the second part 224 of the heat sink 220 can be respectively passed through the corresponding first through hole 130 and second through hole 140 of the circuit board 100. Then, for example, a wave soldering operation can be performed to mount the heat sink assembly 200 onto the circuit board 100.
[0067] Similarly, the heat sink 300 mainly includes a power dissipation element 310, a heat sink 320, and a thermally conductive bonding layer 330. The architecture of the heat sink 300 is largely the same as that of the heat sink 200. The difference between the heat sinks 200 and 300 is that the power dissipation element 210 of the heat sink 200 is different from the power dissipation element 310 of the heat sink 300. For example, the power dissipation element 210 may be a metal-oxide-semiconductor field-effect transistor (MOS FET), while the power dissipation element 310 may be a bridge. Furthermore, the way the heat sink 300 is assembled on the circuit board 100 is the same as that of the heat sink 200, and will not be described again here.
[0068] A power loss element 310 can be mounted upright on the top surface 110 of a circuit board 100. The power loss element 310 includes at least two leads 312 extending through the circuit board 100. The circuit board 100 has first through holes 130 corresponding to these leads 312 in number, position, and size. During assembly, the leads 312 of the power loss element 310 can be inserted into the corresponding first through holes 130 and can protrude from the bottom surface 120 of the circuit board 100. The length of the leads 312 protruding from the bottom surface 120 is the same as that of the leads 212. Through the leads 312, the power loss element 310 can be assembled on the circuit board 100 and electrically connected to the circuit board 100.
[0069] A heat sink 320 is erected on the top surface 110 of the circuit board 100. The heat sink 320 mainly comprises a first portion 322 and a second portion 324 joined to the bottom surface of the first portion 322. The heat sink 320 may be, for example, a black anodized heat dissipation structure. The circuit board 100 has a second through-hole 140 corresponding in position and size to the second portion 324. The second portion 324 passes through the second through-hole 140 and protrudes from the bottom surface 120 of the circuit board 100. The length of the second portion 324 protruding from the bottom surface 120 may be the same as the second length L2 of the second portion 324.
[0070] The dimensions and shape of the cross-section of the second portion 324 may be the same as those of the corresponding second through hole 140. Alternatively, the dimensions of the cross-section of the corresponding second through hole 140 may be larger than those of the second portion 324. Furthermore, the second portion 324 may be shorter than the first portion 322. For example, in terms of length, the second portion 324 may be 1 / 3 to 1 / 2 the length of the first portion 322. However, the second portion 324 may also be the same length as the first portion 322.
[0071] In some embodiments, the first portion 322 includes a vertical portion 322a and a plurality of fins 322b. The vertical portion 322a is joined to the second portion 324 and may be erected, for example, vertically on the top surface 110. The fins 322b are joined separately to the vertical portion 322a and may be located above and below the vertical portion 322a, respectively, with the second portion 324.
[0072] A thermally conductive bonding layer 330 is bonded between the power loss element 310 and the heat sink 320. The opposite sides of the thermally conductive bonding layer 330 can be directly attached to the power loss element 310 and the heat sink 320 respectively, to quickly conduct the heat generated by the power loss element 310 to the heat sink 320. For example, the material of the thermally conductive bonding layer 330 can be TNC-4 provided by Laird Technologies, TLB SA1800 and TLB EA1800 provided by Henkel Adhesives Technology, or UB-5712(B) manufactured by U-Bond Technology Inc.
[0073] like Fig. 3 As shown, in some embodiments, the power supply module 10 further includes a thermal pad 400. The thermal pad 400 is attached to the bottom surface 120 of the circuit board 100. A second portion 224 of the heat sink 220 protruding from the bottom surface 120 of the circuit board 100 can penetrate into and be covered by the thermal pad 400. That is, the portion of the second portion 224 protruding from the bottom surface 120 of the circuit board 100 can be fitted into the thermal pad 400, and the surfaces of this portion are in direct contact with the thermal pad 400. In this way, heat conducted from the first portion 222 to the second portion 224 can be quickly conducted to the thermal pad 400, achieving the effect of effectively conducting and cooling the heat sink 220. For example, the material of the thermal pad 400 can be the Tputty 502 series thermally conductive material provided by Laird Technologies.
[0074] Fig. 3 The above explanation uses heat sink 200 as an example. However, the relative relationship between heat sink 300 and thermal pad 400 is the same as that between heat sink 200, and the heat sink 320 of heat sink 300 can also directly and quickly conduct heat to thermal pad 400 through the second part 324. Therefore, it will not be described in detail here.
[0075] In some embodiments, the power supply module 10 further includes a cooling plate 500. The cooling plate 500 is attached to the thermal pad 400. Therefore, the thermal pad 400 can be sandwiched between the bottom surface 120 of the circuit board 100 and the cooling plate 500. Heat conducted from the second portion 224 of the heat sink 220 and the second portion 324 of the heat sink 320 to the thermal pad 400 can be directly conducted from the thermal pad 400 to the cooling plate 500. This can accelerate the conductive cooling rate of the heat sink assemblies 200 and 300.
[0076] When the power supply module 10 is used in an air-cooled scenario, the thermal pad 400 and cooling plate 500 can be omitted. In this case, the portions 224 of the heat sink 220 and 324 of the heat sink 320 protruding from the bottom surface 120 of the circuit board 100 are exposed to the air, allowing them to be cooled by airflow on the bottom surface 120 of the circuit board 100. In some embodiments, because the portions 224 of the heat sink 220 and 324 of the heat sink 320 protrude from the bottom surface 120 of the circuit board 100, the area of the heat sinks 220 and 320 that can be cooled by air is increased, thus improving the heat dissipation efficiency of the power supply module 10 by more than 10%.
[0077] In the embodiment where the power supply module 10 includes a thermal pad 400 and a cooling plate 500, since the power supply module 10 can simultaneously achieve efficient air cooling and conductive cooling, its heat dissipation efficiency can be improved, thereby increasing its power output. In a thermal test, the power output of the power supply module 10 at an ambient temperature of 50°C increased from 450W to 630W, an increase of 40%; while at an ambient temperature of 65°C, the power output of the power supply module 10 increased from 630W to 700W, an increase of 10%.
[0078] As described above, the second part of the heat sink is embedded in the circuit board and protrudes from the bottom surface of the circuit board. Therefore, in air-cooled scenarios, the first and second parts of the heat sink can be cooled by airflow from the upper and lower sides of the circuit board, respectively. On the other hand, in conductive cooling scenarios, since the second part of the heat sink is directly embedded in the thermal pad, the heat conducted from the first part to the second part can be directly conducted away by the thermal pad, achieving rapid conductive cooling. Therefore, this disclosure, through the design of the heat sink and circuit board, enables the power supply module to be used in both air-cooled and conductive cooling scenarios at low cost, effectively improving the output power of the power supply module and thus expanding its applicability.
[0079] Although this disclosure has been disclosed above with reference to embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the claims.
Claims
1. A power supply module, characterized in that, This power supply module includes: A circuit board comprising a top surface and a bottom surface opposite to each other; and At least one heat dissipation group, wherein each of the at least one heat dissipation group comprises: A power loss element is erected on the top surface, wherein the power loss element includes at least two pins passing through the circuit board; A heat sink is erected on the top surface and includes a first part and a second part, wherein the second part is joined to a bottom surface of the first part and passes through the circuit board and protrudes from the bottom surface. as well as A thermally conductive bonding layer is provided between the power loss element and the heat sink to bond the power loss element and the heat sink.
2. The power supply module as described in claim 1, characterized in that, The circuit board has the following features: A plurality of first through holes extending from the top surface to the bottom surface, wherein at least two pins are respectively disposed in at least two of the plurality of first through holes; and At least one second through hole extends from the top surface to the bottom surface, wherein the second portion of the heat sink is correspondingly disposed in one of the at least one second through hole.
3. The power supply module as described in claim 2, characterized in that, The dimensions and shape of a cross section of the second part are the same as those of the cross section of the at least one second through hole.
4. The power supply module as described in claim 1, characterized in that, Each of the at least two pins protrudes from the bottom surface of the circuit board by a first length, and the second portion protrudes from the bottom surface of the circuit board by a second length, and the second length is equal to the first length.
5. The power supply module as described in claim 1, characterized in that, The length of the second part is 1 / 3 to 1 / 2 of the length of the first part.
6. The power supply module as described in claim 1, characterized in that, The first part of the radiator includes: A vertical portion, which connects to the second portion; and Multiple fins are separately joined to the vertical portion, wherein the multiple fins and the second portion are respectively located on opposite sides of the vertical portion.
7. The power supply module as described in claim 1, characterized in that, The heat sink is a black anodized heat dissipation structure.
8. The power supply module as described in claim 1, characterized in that, The power supply module also includes a thermal pad that is attached to the bottom surface of the circuit board.
9. The power supply module as described in claim 8, characterized in that, The second part protrudes from the bottom surface of the circuit board and penetrates into the thermal pad, and is covered by the thermal pad.
10. The power supply module as described in claim 8, characterized in that, The power supply module also includes a cooling plate attached to the thermal pad, so that the thermal pad is sandwiched between the circuit board and the cooling plate.